Smart baby monitor company Nanit raised a $14M Series B round led by Jerusalem Venture Partners (JVP). Other investors that participated include existing investors Upfront Ventures, RRE Ventures, Vulcan Capital and Vaal Investment Partners. The latest investment brings total equity funding of Nanit to $30M.

Nanit announced it will use the funding proceeds to expand its team of computer vision and machine learning engineers and grow its sales in Europe and Canada.

Nanit’s baby monitor helps new parents oversee nursery conditions as it has built-in temperature and humidity sensors. The camera lets parents remotely monitor baby’s crib whereas sound and motion are detected via smart sensors.

The monitor’s insights can be accessed via an accompanying mobile app. Nanit charges $10 per month for its premium package.

The key use cases of Nanit’s baby monitoring technology include sleep insights, behavioral analysis, expert guidance, and nightly video summaries. The company currently sells its smart monitors via its website.

[SAPS] - The Acting Provincial Commissioner of the SAPS in Mpumalanga Major General (Dr) Zeph Mkhwanazi has welcomed the 15 years imprisonment term handed down to Bongani Motha (24) by Middleburg Regional Court on Wednesday, 05 November 2024.

[SAPS] - Polokwane based Hawks Serious Commercial Crime Investigation in collaboration with National Traffic Anti-corruption Unit arrested 11 suspects between the ages of 27 and 57 for alleged fraud at various Provinces during operation "SISFIKILE".

[SAPS] One hundred and seventy one (171) murder suspects, 261 attempted murder suspects and 250 suspected rapists were among 12 593 suspects who were arrested during various operations by police in KwaZulu-Natal in the month of October. During such operations police also managed to recover 345 firearms and 2 998 rounds of ammunition of various calibre of firearms. Among the recovered firearms were 23 rifles and 17 homemade illegal guns.

[allAfrica]

[allAfrica]

[Parliament of South Africa] Parliament, Tuesday, 12 November 2024 - The National Assembly (NA) will hold a plenary session scheduled to start at 10:00. Among the items on the agenda from 10:00 to 13:00 is the statement by the Minister of Water and Sanitation on water security in the country and a debate on 16 Days of Activism for no violence against women and children. The debate will be held under the theme, "Marking 30 years of democratic rights for women and fostering national unity to end gender-based violence".

PCI-SIG DevCon 2024 was a great success for Cadence. We posted the blog, Cadence Demonstrates Complete PCIe 7.0 Solution at PCI-SIG DevCon ‘24 a day before the event to advertise our IP solutions for PCIe 7.0, which resulted in a lot of extra traffic at our booth. All of the attendees were excited to see Cadence demonstrate the robustness of 128GT/s PCIe 7.0 IP's TX and RX capabilities over a real-world, low-latency, non-retimed, linear optics connector. We achieved and maintained a consistent, impressive pre-FEC BER of ~3E-8 (PCIe spec requires 1E-6) for the entire duration of the event, spanning over two full days with no breaks. This provides an ample margin for RS FEC. As seen in the picture below, the receiver Eye PAM4 histograms have good linearity and margin. This is the world’s first stable demonstration of 128 GT/s TX and RX over off-the-shelf optical connectors—by far the main attraction of DevCon this year.

Cadence 128 GT/s TX and RX capability over optics

Block diagram of Cadence PHY for PCIe 7.0 128 GT/s demo setup with linear pluggable optics

As a leader in PCIe, our PCIe controller architect Anish Mathew shared his valuable insights on an important topic: “Impact of UIO ECN on PCIe Controller Design and Performance,” highlighting the strides made by the Cadence design team in achieving this implementation.

Anish Mathew presenting “Impact of UIO ECN on PCIe Controller Design and Performance”

In summary, Cadence had a dominating presence on the demo floor with a record number of PCIe demos:

• PCIe 7.0 over optics
• PCIe 7.0 electrical
• PCIe 6.0 RP/EP interop back-to back
• PCIe 6.0 protocol in FLIT mode with Lecroy Exerciser (at Cadence booth)
• PCIe 6.0 protocol in FLIT mode (at the Lecroy booth)
• PCIe 6.0 JTOL with Anritsu and Tektronix equipment (at Tektronix booth)
• PCIe 6.0 protocol with Viavi Protocol Analyzer (at Viavi booth)
• PCIe 6.0 System Level Interop Demo with Gen5 platform (at SerialTek booth)

The Cadence team and its partners did a great job in coordinating and setting up the demos that worked flawlessly. This was the culmination of many weeks of hard work and dedication. Four different vendors featured our IP for PCIe 6.0. They attracted a lot of attention and drove traffic back to us.

Highlights of Cadence demos for PCIe 7.0 and 6.0

Cadence team at the PCI-SIG Developers Conference 2024

Thanks to everyone who attended the 32nd PCI-SIG DevCon. We really appreciate your interest in Cadence IP, and a big thanks to our partners and customers for all the positive feedback and for creating so much buzz for the Cadence brand.

The demand for higher-performance computing is greater than ever. Cutting-edge applications in artificial intelligence (AI), big data analytics, and databases require high-speed memory systems to handle the ever-increasing volumes and complexities of data. Advancements in cloud computing and machine virtualization are stretching the limits of current capabilities. AI applications hosted in the cloud rely on fast access and reduced latency in memory systems, which is amplified by an increasing number of CPU and GPU cores.

Introducing the DDR5 Multiplexed Rank DIMM (MRDIMM), the next-generation memory module technology designed to meet the needs of high-performance computing (HPC) and AI in cloud applications. By leveraging existing DDR5 DRAM memory devices, MRDIMM modules not only double the DRAM data rate but also maintain the RAS capabilities of the industry-proven RDIMM modules, setting a new precedent for memory module performance.

Let’s compare RDIMM and MRDIMM modules using the same DRAM parts. Today, high-speed production DDR5 RDIMM modules run at 5600Mbps. Those modules use DDR5 DRAM parts, which also run at 5600Mbps. An MRDIMM module using the same DDR5 5600Mbps DRAM parts will run at a blazing 11.2Gbps.

One key metric for best-in-class performance, low bit error rate (BER), and ease of adoption is the eye diagram. The eye diagram illustrates at-speed system margin and accurately represents DDR system quality when captured with a pseudo-random binary sequence (PRBS)-like pattern. The diagram below illustrates Cadence’s 3nm silicon write eye diagram for DDR5 MRDIMM IP running at 12.8Gbps.

Cadence 3nm DDR5 MRDIMM 12.8Gbps test chip write eye diagram, design kit is available today

The eye diagram is captured using a PRBS-like pattern, incorporating a package and system board representative of a typical MRDIMM channel. Using PRBS-like patterns is crucial for capturing accurate eye diagrams. Repetitive clock-like data patterns create deceptively “open eyes” that do not reflect the real system performance. Effects like intersymbol interference, simultaneous switching, reflections, and crosstalk are not accurately reflected in the eye diagrams for parallel interfaces like DDR using non-random data streams. Relying on improperly captured eye diagrams inevitably leads to a significantly worse real system BER than conveyed by that eye diagram.

Doubling the DDR5 RDIMM data rate is challenging. Achieving high performance while optimizing for area and power requires multiple design techniques. Feed-forward equalization (FFE), decision feedback equalization (DFE), continuous-time linear equalization (CTLE), and T-coils are required to reach 12.8Gbps MRDIMM data rates in multi-channel systems. Building a production-worthy 12.8Gbps DDR5 MRDIMM IP requires engineering expertise that comes from many generations of memory interface design and production experience. Cadence has developed this expertise through multiple DDR5/4, LPDDR5X/5, and GDDR6 designs in different technology nodes and foundries. For instance, Cadence’s GDDR6 IP is available in three foundries and ten process nodes, with mass production at speeds exceeding 22Gbps.

For your next project, consider DDR5 12.8Gbps MRDIMM, a technology that not only doubles the bandwidth of DDR5 RDIMM but also promises rapid proliferation into next-generation AI, data center, HPC, and enterprise applications. With its cutting-edge capabilities, the Cadence DDR5 12.8Gbps MRDIMM IP is ready to power the future of computing.

Hi, I'm using genus (Version 21.14-s082_1) to synthesis a VHDL-design with multiple power-domains. After reading the power intent file and calling 'apply_power_intent',  I get the following warning:

Warning : Potential problem while applying power intent of 1801 file. [1801-99]
: Cannot find any instance for scope '/:CHIP_TOP'. Rest of commands in this scope will be skipped (set_scope:../../upf/CHIP_TOP.upf:2).
: Check the power intent. If the scenario is expected, this message can be ignored.

The fist two lines of CHIP_TOP.upf:

upf_version 3.1
set_scope :CHIP_TOP

I simulated the same  UPF and VHDL files with Xeclium and was able to verify all the IEEE1801/UPF aspects I need without any problems. I don't know, why genus is having a problem with the 'scope'.
In genus, after getting the warning, running 'set_db power_domain:CHIP_TOP/BLOCK_A/PD_CORE_D .library_domain PD0V5' returns the following error:

Error : <Start> word is not recognized. [TUI-182] [set_db]
: 'power_domain:CHIP_TOP/BLOCK/PD_CORE_D' is not a recognized object/attribute. Type 'help root:' to get a list of all supported objects and attributes.
: Check if the given <Start> word is a valid object_type, object or attribute.

Running 'commit_power_intent' gives me:

Started inserting low power cells...
====================================
Info : Command 'commit_power_intent' cannot proceed as there are no power domains present. [CPI-507]
: Design with no power domains is 'design:CHIP_TOP'.
Completed inserting low power cells (runtime 0.00).
====================================================

I'm suspecting that the problem lies in 'set_scope' and VHDL. I never had such problems with Verilog. I tried every way to reference the hierarchy in the code and now I'm at my wit's end and I need your help o/
How to set the scope with 'set_scope' in UPD 3.1 to the toplevel in VHDL, so that genus accepts it? Or is the problem caused by something else?

Best,

Iqbal

I am trying to install IC231 on RHEL 8 using installscape, however configuring keeps failing.

I tried to run the configuration file manually as suggested in one of the previous posts and it gives me following errors:

sh batch_configure.sh
/home/rs/cadence/installs/IC231/install/tmp/slconfig.sh: line 165: xterm: command not found
cat: ncvhdl23.03-d103lnx86_101124125631.stat: No such file or directory
rm: cannot remove 'ncvhdl23.03-d103lnx86_101124125631.stat': No such file or directory
/home/rs/cadence/installs/IC231/install/tmp/slconfig.sh: line 165: xterm: command not found
cat: ncvhdl64b23.03-d103lnx86_101124125631.stat: No such file or directory
rm: cannot remove 'ncvhdl64b23.03-d103lnx86_101124125631.stat': No such file or directory
/home/rs/cadence/installs/IC231/install/tmp/slconfig.sh: line 165: xterm: command not found
cat: oaRedist22.61-p003lnx86_101124125631.stat: No such file or directory
rm: cannot remove 'oaRedist22.61-p003lnx86_101124125631.stat': No such file or directory
/home/rs/cadence/installs/IC231/install/tmp/slconfig.sh: line 165: xterm: command not found
cat: amsEnv64b23.10-p043lnx86_101124125631.stat: No such file or directory
rm: cannot remove 'amsEnv64b23.10-p043lnx86_101124125631.stat': No such file or directory
/home/rs/cadence/installs/IC231/install/tmp/slconfig.sh: line 165: xterm: command not found
cat: ihdl64b23.10-p043lnx86_101124125631.stat: No such file or directory
rm: cannot remove 'ihdl64b23.10-p043lnx86_101124125631.stat': No such file or directory

I am not very well versed with Linux at the moment but trying. Could any one suggest something or point to what is missing?

Hello Community,

I have encountered an issue that is a mystery to me and hope somebody could give me a clue about what is happening in Cadence and maybe even a solution?

I am running a test scripted in a SKILL file that sequentially opens two different projects with MC analyses and in between I get an error message box and also multiple logs in CIW with exactly the same text.

Both projects run a simulation with a call like this:

historyName = maeRunSimulation(?session sessionName ?waitUntilDone t)

After this the script closes the current project, opens the next project and executes the same line with maeRunSimulation() for the second project. Then immediately this error message happens, and also is logged repeatedly in the CIW window

The message box looks like this:

The logs I get in CIW:

nil
hiCancelProgressBox(_axlNetlistCreateProgressBar)
nil
hiCancelProgressBox(_axlUILoadForm)
nil
when(dwindow('axlDataViewessWindow1) hiMapWindow(dwindow('axlDataViewessWindow1)))
t
when(dwindow('axlRunSummaryessWindow1) hiMapWindow(dwindow('axlRunSummaryessWindow1)))
t
ERROR (ASSEMBLER-1600): Cannot find an active session named fnxSession0.
You can only modify an ADE Assembler session that is active.
Perhaps the session name was misspelled or has not yet been created.
Verify the session name matches an existing ADE Assembler session.

1>
ERROR (ASSEMBLER-1600): Cannot find an active session named fnxSession0.
You can only modify an ADE Assembler session that is active.
Perhaps the session name was misspelled or has not yet been created.
Verify the session name matches an existing ADE Assembler session.

*WARNING* hiDisplayAppDBox: modal dbox 'adexlMessageDialog' is already displayed!
ERROR (ASSEMBLER-1600): Cannot find an active session named fnxSession0.
You can only modify an ADE Assembler session that is active.
Perhaps the session name was misspelled or has not yet been created.
Verify the session name matches an existing ADE Assembler session.

*WARNING* hiDisplayAppDBox: modal dbox 'adexlMessageDialog' is already displayed!
ERROR (ASSEMBLER-1600): Cannot find an active session named fnxSession0.
You can only modify an ADE Assembler session that is active.
Perhaps the session name was misspelled or has not yet been created.
Verify the session name matches an existing ADE Assembler session.

Hi Team,

I am using the following command in my SKILL script to flatten the hierarchical layouts, it's working fine for all the instances and mosaics but not for techLib via's please help me with the command to use for flattening the techLib via.

dbFlattenInst( inst 2 nil)

dbFlattenInst( inst1 2 t t nil nil t t)

Regards,

MT.

by Sherry Hess In this new blog series, Max Maxfield gets to know Zeke, an amazing 11-year-old with a dream to speak with the astronauts on the International Space Station (ISS). His first step on this journey however began with becoming a HAM r...(read more)

The Cadence AWR Design Environment V22.1 production release is now available for download at Cadence Downloads with design environment, AWR Microwave Office, AWR VSS, AWR Analyst, and other enhancements.(read more)

By David Vye, Senior Product Marketing Manager, AWR, Cadence When designing multi-octave high-power amplifiers, it is a challenge to achieve both broadband gain and power matching using a combination of lumped and distributed techniques. One approach...(read more)

The automotive industry revolutionized the definition of a vehicle in terms of safety, comfort, enhanced autonomy, and internet connectivity. With this trend, the automotive industry rapidly adopted automotive Ethernet such as 10Base-T1, 100Base-T1, and in some cases, 1000Base-T1. 

Faster Speed (than CAN-FD), Scalability, embedded security protocols (like MacSec), cost and energy efficiency, and simple yet redundant network made Ethernet an obvious choice over CAN(FD) and FlexRay.  

Ethernet 10Base-T1 

10BASE-T1S is defined under IEEE with 802.3cg. The S in 10BASE-T1S stands for a short distance. 10BASE-T1S uses a multidrop topology, where each node connects to a single cable. Multidrop topology eliminates the need for switches and, as a result, fewer cables/less cost. The primary goal of 10BASE-T1S is a deterministic transmission on a collision-free multidrop network. 10BASE-T1S cables use a pair of twisted wires. As per IEEE, at least eight nodes can connect to each, but more connections are feasible.    

The Physical Layer Collision Avoidance [PLCA] protocol ensures that it uses the entire 10 Mbps bandwidth. In 10BaseTs, Reconciliation Sublayer provides optional Physical Layer Collision Avoidance (PLCA) capabilities among participating stations. Using PLCA-enabled Physical Layers in CSMA/CD half-duplex shared-medium networks can provide enhanced bandwidth and improved access latency under heavily loaded traffic conditions. The working principle of PLCA is that transmit opportunities on a mixing segment are granted in sequence based on a node ID unique to the local collision domain (set by the management entity). 10BASE-T1S also supports an arbitration scheme that guarantees consistent node access to the media within a predefined time.  

The 10BASE-T1S PHY is intended to cover the low-speed/low-cost applications in the industrial and automotive environment. A large number of pins (16) required by the MII interface is one of the significant cost factors that must be addressed to fulfill this objective. The 10BASE-T1S "Transceiver" solution is suited for embedded systems where the digital portion of the PHY is fully integrated, e.g., into an MCU or an Ethernet switch core, leaving only the analog portion (the transceiver) into a separate IC. 

Ethernet 100Base-T1/1000Base-T1 

100Base-T1 and 1000Base-T1 can be used for audio/video information. With Higher bandwidth capacity, 100Base-T1/ 1000Base-T1 paired with AVB (Audio video bridging) can be used for car infotainment systems. 100Base-T1/1000Base-T1 paired with time-sensitive networking [TSN] protocol can be used to fulfill the automotive industry's mission-critical, time-sensitive, and deterministic latency needs. 

 PTP Over MacSec  

With today's automotive network, all the Electronic Control Units connected require timing accuracy and network synchronization, Precision Time Protocol (PTP), defined in IEEE 1588, provides synchronized clocks throughout a network.  While maintaining the timing accuracy for mission-critical applications, protecting the vehicle network from vulnerable threats is mandatory, and PTP over MacSec provides the consolidated solution.  

With the availability of the Cadence Verification IP for 10/100/1000BaseT1 and TSN, adopters can start working with these specifications immediately, ensuring compliance with the standard and achieving the fastest path to IP and SoC verification closure. The 10/100/1000GBaseT1 and TSN provide a full-stack solution, including support to the PHY, MAC, and TSN layers with a comprehensive coverage model and protocol checkers. Ethernet BaseT1 and TSN VIP covers all features required for complete coverage verification closure. More details are available in the Ethernet Verification IP portfolio. 

Krunal 

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The OrCAD X and Allegro X 24.1 release is now available at Cadence Downloads. This blog post provides links to access the release and describes some major changes and new features.   OrCAD X /Allegro X 24.1 (SPB241) Here is a representative li...(read more)

Cadence is super excited to announce SPB 23.1 release —Your freedom to design boldly!  

These tools help engineers build better PCBs faster with the new 3D engine and optimized interface.  

We have been hard at work to bring you this release and believe that it will help you take control of the PCB design process with the powerful new features in Allegro X APD like: 

• Packaging Support in 3DX Canvas 

• 3DX Wire DRCs 

• Aligning Components by Offset 

• Text Wizard Enhancements 

• Device File Reuse for Existing Components for Netlist and Logic Import 

Watch this space to know all about What’s New in SPB 23.1.  

Regards 

Team PCBTech 

Cadence Design System 

For individuals, small businesses, or teams, START YOUR FREE TRIAL. 

Starting SPB 23.1, Allegro Package Designer Plus (APD+) has been rebranded as Allegro X Advanced Package Designer (Allegro X APD).

The splash screen for Allegro X APD will appear as shown below, instead of showing APD+ 2023:

For the Windows Start menu in 23.1, it will display as Allegro X APD 2023 instead of APD+ 2023, as shown below

23.1 Start menu 

In the Product Choices window for 23.1, you will see Allegro X Advanced Package Designer in the place of Allegro Package Designer +, as shown below: 

23.1 product title

As technology continues to evolve at a rapid pace, the importance of robust and efficient interconnect standards cannot be overstated. Peripheral Component Interconnect Express (PCIe) has been a cornerstone in high-speed data transfer, enabling seamless communication between various hardware components.   

With the advent of PCIe 6.1 ECN, a significant advancement in speed and efficiency, ensuring the accuracy and reliability of its operations is paramount. One critical aspect of this is the verification of shared credit updates. For detailed understanding on Shared Credit, please refer Understanding PCIe 6.0 Shared Flow Control. 

In this blog, we will discuss why this verification is essential and what it entails.  

Introduction 

PCIe 6.1 ECN brings numerous advancements over earlier versions, such as increased bandwidth and faster data transfer speeds.   

A crucial mechanism for efficient data transmission in PCIe 6.0 is the credit-based flow control system. In this system, devices monitor credits, representing the buffer capacity available for incoming data.   

When a device transmits data, it uses credits, which are replenished or adjusted once the data is received and processed. This system ensures that the sender does not overload the receiver.  

Given the critical role of shared credit updates in maintaining the integrity and efficiency of data transfers, verification of these updates is crucial.  Proper management of credit updates is essential to ensure data integrity, as any discrepancies can lead to data loss, corruption, or system crashes.   

Verification also guarantees efficient resource allocation, preventing scenarios where some components are starved of credit while others have an excess, thus avoiding inefficiencies.  Credit inefficiencies pose issues in low power negotiations by preventing devices from entering low power states. Additionally, verification involves checking for proper error handling mechanisms, ensuring that the system can recover gracefully from errors in credit updates and maintain overall stability.   

PCIe 6.1 ECN Flow Control Optimizations Over PCIe 6.0

PCIe 6.1 ECN builds on the FLIT-based architecture introduced in PCIe 6.0, further optimizing flow control mechanisms to handle increased data rates and improved efficiency.  PCIe 6.1 ECN introduced refinements in credit management, making the allocation and advertisement of credits more precise, which helps in reducing bottlenecks and improving data flow efficiency.  Enhancements in flow control protocols ensure better management of buffer spaces and more efficient credit allocation. These enhancements are designed to handle the increased data rates and throughput demands of next-generation applications, ensuring robust and efficient data flow across PCIe devices.  

Below are some major updates: 

1. There have been improvements in error detection and correction mechanisms in PCIe 6.1 ECN to enhance flow control reliability by ensuring that corrupted data packets are detected and handled appropriately without disrupting the flow of valid packets.  
2. The merged credit system, which was a key feature introduced int PCIe 6.0 to simplify and optimize credit management, was further enhanced in PCIe 6.1 ECN to improve performance and efficiency.  
3. PCIe 6.1 ECN introduced better algorithms for allocating and reclaiming merged credits to handle high data rates, introduced more robust error detection and correction mechanism reducing the degradation or system instability. 
4. PCIe 6.1 ECN provided clear guidelines on how to implement the merged credit system correctly, helping developers to implement more reliable systems. For more details, please refer to Specifications section 2.6.1 Flow Control (FC) Rules.

Summary 

In summary, PCIe 6.0 is a complex protocol with many verification challenges. You must understand many new Spec changes and think about the robust verification plan for the new features and backward compatible tests impacted by new features. Cadence’s PCIe 6.0 Verification IP is fully compliant with the latest PCIe Express 6.0 specifications and provides an effective and efficient way to verify the components interfacing with the PCIe 6.0 interface. Cadence VIP for PCIe 6.0 provides exhaustive verification of PCIe-based IP and SoCs, and we are working with early adopter customers to speed up every verification stage.   

More Information

For more info on how Cadence PCIe Verification IP and Triple Check VIP enable users to confidently verify PCIe 6.0, see VIP for PCI Express, VIP for Compute Express Link  and TripleCheck for PCI Express    

See the PCI-SIG website for more details on PCIe in general and the different PCI standards.  

For more information on PCIe 6.0 new features, please visit PCIeLaneMargin, PCIe6.0LaneMargin, and Demonstrating PCIe 6.0 Equalization Procedure.

The Sigrity and Systems Analysis (SIGRITY/SYSANLS) 2024.1 release is now available for download at Cadence Downloads . For the list of CCRs fixed in this release, see the README.txt file in the installation hierarchy. SIGRITY/SYSANLS 2024.1 Here is a list of some of the key updates in the SIGRITY/SYSANLS 2024.1 release: For more details about these and all the other new and enhanced features introduced in this release , refer to the following document: Sigrity Release Overview and Common Tools What's New . Supported Platforms and Operating Systems Platform and Architecture X86_64 (lnx86) Windows (64 bit) Development OS RHEL 8.4 Windows Server 2022 Supported OS RHEL 8.4 and above RHEL 9 SLES 15 (SP3 and above) Windows 10 Windows 11 Windows Server 2019 Windows Server 2022 Systems Analysis 2024.1 Clarity 3D Solver Clarity 3D Layout Structure Optimization Workflow : A new workflow, Clarity 3D Layout Structure Optimization Workflow, has been added to Clarity 3D Layout. This workflow integrates Allegro PCB Designer with Clarity 3D Layout for high-speed structure optimization. Component Geometry Model Editor : The new Clarity 3D Layout editor lets you set up ports, solder bumps/balls/extrusions, and two-terminal and multi-terminal circuits using a single GUI. Coaxial Open Port Option Added to Port Setup Wizard : The Coaxial Open Port option lets you create ports for each target net pin and reference net pin in Clarity 3D Layout. The nearby reference net pins are then used as a reference for each target net pin, reducing the number of ports needed. In addition, the ports of unused reference net pins are shorted to the ground. Parametric Import Option Added : Two new options, Parametric Import and Default Import , have been added to the Tools – Launch Clarity3DWorkbench menu. The Parametric Import option lets you import the design along with its parameters into Clarity 3D Workbench. The Default Import option lets you ignore the parameters when importing the design into Clarity 3D Workbench. Component Library Added to Generate 3D Components : Clarity 3D Workbench now includes a new component library that lets you use predefined 3D component templates or add existing 3D components to create 3D designs and simulation models. AI-Powered Content Search Capability : Clarity 3D Workbench and Clarity 3D Transient Solver now support an AI-powered capability for searching the content and displaying relevant information. Expression Parser to Handle Undefined Parameters : Clarity 3D Workbench and Clarity 3D Transient Solver support writing expressions or equations containing undefined parameters in the Property window to describe a simulation variable. The improved expression parser automatically detects any undefined parameter in an expression and prompts users to specify their values. This capability lets you define a model or a simulation variable as a function instead of specifying static values. For detailed information, refer to Clarity 3D Layout User Guide and Clarity 3D Workbench User Guide on the Cadence Support portal. Clarity 3D Transient Solver Mesh Processing Improved to Simulate Large Use Cases : Clarity 3D Transient Solver leverages a new meshing algorithm that enhances overall mesh processing, specifically for large designs and use cases. The new algorithm dramatically improves the mesh quality, minimum mesh size, number of mesh key points, total mesh number, and memory usage. Advanced Material Processing Engine : The material processing capability has been enhanced to handle thin outer metal, which previously resulted in open and short issues in some designs. In addition, the material processing engine offers improved mode extraction for particular use cases, including waveguide and coaxial designs. Characteristic Impedance Calculation Improved : The solver engine now uses a new analytical calculation method to calculate the characteristic impedance of coaxial designs with improved accuracy. For detailed information, refer to Clarity 3D Transient Solver User Guide on the Cadence Support portal. Celsius Studio Celsius Interchange Model Introduced : Celsius Studio now supports Celsius Interchange Model generation, which is a 3D model derived from detailed physical designs for multi-physics and multi-scale analysis. This Celsius Interchange Model file ( .cim ) serves as a design information carrier across Celsius Studio tools, enabling a variety of simulation and analysis tasks . Celsius 3DIC Thermal Workflow Improvements : The Thermal Simulation workflows in Celsius 3DIC have been significantly enhanced. Key improvements include: Advanced Power Setup with Transient Power Function and Multi Mode options Enhanced GUI for the Mesh Control and Simulation Control tabs Improved meshing capabilities Celsius Interchange Model ( .cim ) generation Material library support for block and connections Import of Heat Transfer Coefficients (HTCs) from a CFD file Bump creation through the Bump Array Wizard Layer Stackup CSV file generation Celsius 3DIC Warpage and Stress Workflow Enhancements : The Warpage and Stress workflow in Celsius 3DIC has undergone significant improvements, such as: Improved multi-stage warpage simulation flow for 3DIC packaging process Enhanced GUI for the Mesh Control , Simulation Control , and Stress Boundary Conditions tabs Support for large deformations and temperature profiles Bump creation through the Bump Array Wizard New constraint types Enhanced meshing capabilities Geometric Nonlinearity Support in Warpage and Stress Analysis : Large deformation analysis is now supported in warpage and stress studies. This study uses the Total Lagrangian approach to model geometric nonlinearities in simulation, which allows accurate prediction of final deformations. Thermal Network Extraction and Simulation : In the solid extraction flow in Celsius 3D Workbench, you can now import area-based power map files to create terminals. For designs with multiple blocks, this capability allows automatic terminal creation, eliminating the need to manually create and set up 2D sheets individually. Additionally, thermal throttling feature is now supported in Celsius Thermal Network. This makes it ideal for preliminary analyses or when a quick estimation is required. It runs significantly faster than 3D models, allowing for quicker iterations and more efficient decision-making. For detailed information, refer to the Celsius 3DIC User Guide , Celsius Layout User Guide and Celsius 3D Workbench User Guide on the Cadence Support portal. Sigrity 2024.1 Layout Workbench Improved Graphical User Interface : A new option, Use Improved User Interface , has been added in the Themes page of the Options dialog box in the Layout Workbench GUI. In the new GUI, the toolbar icons and menu options have been enhanced and rearranged. For detailed information, refer to Layout Workbench User Guide on the Cadence Support portal. Broadband SPICE Python Script Integration with Command Line for Simulation Tasks : Broadband SPICE lets you run Python scripts directly from the command line for performing simulation and analysis. The new -py and *.py options make it easier to integrate Python scripts with the command-line operations. This update streamlines the process of automating and customizing simulations from the command line, which makes your simulation tasks faster and easier. For detailed information, refer to Broadband SPICE User Guide on the Cadence Support portal. Celsius PowerDC Block Power Assignment (BPA) File Format Support : PowerDC now supports the BPA file format. Similar to the Pin Location (PLOC) file, the BPA file is a current assignment file that defines the total current of a power grid cell, which is then equally distributed across the power pins within the cell. This provides better control over the power distribution. Ability to Run Multiple IR Drop Cases Sequentially : You can now select multiple result sinks from the Current-Limited IR Drop flow and run IR Drop analysis for them sequentially. PowerDC automatically runs the simulations in sequence after you select multiple result sinks. This saves time by automating the process. Enhanced Support for Mixed Conversion Devices : PowerDC now supports mixing different conversion devices, such as switching regulators and linear regulators within a single DC-DC/LDO instance. This enhancement offers added flexibility by letting you configure each instance in your design according to your specific needs. For detailed information, refer to PowerDC User Guide on the Cadence Support portal. PowerSI Monte Carlo Method Added : A new option, Monte Carlo Method, has been added in the Optimality dialog box. This option lets you create multiple random samples to depict variations in the input parameters and assess the output. Channel Check Optimization Added : The S-Parameter Assessment workflow in PowerSI now supports Channel Check Optimization . It uses the AI-driven Multidisciplinary Analysis and Optimization (MDAO) technology that lets you optimize your design quickly and efficiently with no accuracy loss. For detailed information, refer to PowerSI User Guide on the Cadence Support portal. SPEEDEM Multi-threaded Matrix Solver Support Added : The Enable Multi-threaded Matrix Solver check box has been added that lets you accelerate the simulation speed for high-performance computing. This check box provides two options, Automatic and Always, to include the -lhpc4 or -lhpc5 parameter, respectively, in the SPEEDEM Simulator (SPDSIM) before running the simulation. For detailed information, refer to the SPEEDEM User Guide on the Cadence Support portal. XtractIM Options to Skip or Calculate Special DC-R Simulation Results : The Skip DC_R of Each Path and Only DC_R of Each Path options have been added to the Setup menu. Skip DC_R of Each Path : This option lets you skip the calculation of the DC-R result during the simulation. Other results, such as SPICE T-model , RL_C of Each Path , Coupling of Each Path , etc., are still calculated. Only DC_R of Each Path : This option lets you calculate the DC-R result only during the simulation. Other results, such as SPICE T-model , RL_C of Each Path , Coupling of Each Path , etc., are not calculated. Color Assignment for Pin Matching : The MCP Auto Connection window includes the Display Color Editor , which lets you assign a color for pin matching. It helps you easily identify the matching pins in the left and right sections of the MCP Auto Connection window . Ability to Save Simulations Individually : The Save each simulation individually check box has been added to the Tools - Options - Edit Options - Simulation (Basic) - General form. Select this check box and run the simulation to generate a simulation results folder containing files and logs with a timestamp for each simulation. Reuse of SPD File Settings : The XtractIM setup check box lets you import an existing package setup to reuse the configurations and settings from one .spd file to another. For detailed information, refer to XtractIM User Guide on the Cadence Support portal. Documentation Enhancements Cloud-Based Help System Upgraded The cloud-based help system, Doc Assistant, has been upgraded to version 24.10, which contains several new features and enhancements over the previous 2.03 version. Sigrity Release Team Please send your questions and feedback to sigrity_rmt@cadence.com .

Hello~

As the following circuit shows, VCC+5V_USB is the 4^th power source, connecting the output of power management of diode.There are 3 5V input in the input port of LTC4417.

It’s normal when VCC+5V_USB prodive power with other circuit. However, if I cup VCC+5V_FIRST,VCC+5V_SECOND,VCC+5V_THIRD, 5V voltage will occurred in the VCC+5V_FIRST,VCC+5V_SECOND,VCC+5V_THIRD.

The LTC4417 PDF

Is this phenomance normal ?

Please kindly give me some advice ! Thanks.

I am looking for LM117 Pspice model. Can someone send me the file. Thank you

Hi ,

  FIrst of all , I hope I have posted my query in the right place . I am expecting software support/suggestions for the below issue.

   I am working on LTE which use USB interface and the Host Controller is USB 2.0 . The BSP is from NXP which supports Cadence USB 3.0 Host controller and with USB 3.0 supported cadence driver.NXP had used the   USB 3.0 host controller for USB type C based device.

  Cadence USB 3.0 based device driver seems to be backward compatible for USB 2.0 host controller .Since basic LTE functionalities seems to be working fine I continued to use the same driver in Linux 4.14.62 

  But I am facing a kernel warning of unhandled interrupt and the crash log points to cdns_irq function as shown below  The crash/kerenel warning is very random and not occuring all the time.

.691533] irq 36: nobody cared (try booting with the "irqpoll" option)

[ 1.698242] CPU: 0 PID: 87 Comm: kworker/0:1 Not tainted 4.9.88 #24

[ 1.704509] Hardware name: Freescale i.MX8QXP MEK (DT)

[ 1.709659] Workqueue: pm pm_runtime_work

[ 1.713675] Call trace:

[ 1.716123] [<ffff0000080897d0>] dump_backtrace+0x0/0x1b0

[ 1.721523] [<ffff000008089994>] show_stack+0x14/0x20

[ 1.726582] [<ffff0000083daff0>] dump_stack+0x94/0xb4

[ 1.731638] [<ffff00000810f064>] __report_bad_irq+0x34/0xf0

[ 1.737212] [<ffff00000810f4ec>] note_interrupt+0x2e4/0x330

[ 1.742790] [<ffff00000810c594>] handle_irq_event_percpu+0x44/0x58

[ 1.748974] [<ffff00000810c5f0>] handle_irq_event+0x48/0x78

[ 1.754553] [<ffff0000081100a8>] handle_fasteoi_irq+0xc0/0x1b0

[ 1.760390] [<ffff00000810b584>] generic_handle_irq+0x24/0x38

[ 1.766141] [<ffff00000810bbe4>] __handle_domain_irq+0x5c/0xb8

[ 1.771979] [<ffff000008081798>] gic_handle_irq+0x70/0x15c

1.807416] 7a40: 00000000000002ba ffff80002645bf00 00000000fa83b2da 0000000001fe116e

[ 1.815252] 7a60: ffff000088bf7c47 ffffffffffffffff 00000000000003f8 ffff0000085c47b8

[ 1.823088] 7a80: 0000000000000010 ffff800026484600 0000000000000001 ffff8000266e9718

[ 1.830925] 7aa0: ffff00000b8b0008 ffff800026784280 ffff00000b8b000c ffff00000b8d8018

[ 1.838760] 7ac0: 0000000000000001 ffff000008b76000 0000000000000000 ffff800026497b20

[ 1.846596] 7ae0: ffff00000810bd24 ffff800026497b20 ffff000008851d18 0000000000000145

[ 1.854433] 7b00: ffff000008b8d6c0 ffff0000081102d8 ffffffffffffffff ffff00000810dda8

[ 1.862268] [<ffff000008082eec>] el1_irq+0xac/0x120

[ 1.867155] [<ffff000008851d18>] _raw_spin_unlock_irqrestore+0x18/0x48

[ 1.873684] [<ffff00000810bd24>] __irq_put_desc_unlock+0x1c/0x48

[ 1.879695] [<ffff00000810de10>] enable_irq+0x48/0x70

[ 1.884756] [<ffff0000085ba8f8>] cdns3_enter_suspend+0x1f0/0x440

[ 1.890764] [<ffff0000085baca0>] cdns3_runtime_suspend+0x48/0x88

[ 1.896776] [<ffff0000084cf398>] pm_generic_runtime_suspend+0x28/0x40

[ 1.903223] [<ffff0000084dc3e8>] genpd_runtime_suspend+0x88/0x1d8

[ 1.909320] [<ffff0000084d0e08>] __rpm_callback+0x70/0x98

[ 1.914724] [<ffff0000084d0e50>] rpm_callback+0x20/0x88

[ 1.919954] [<ffff0000084d1b2c>] rpm_suspend+0xf4/0x4c8

[ 1.925184] [<ffff0000084d20fc>] rpm_idle+0x124/0x168

[ 1.930240] [<ffff0000084d26c0>] pm_runtime_work+0xa0/0xb8

[ 1.935732] [<ffff0000080dc1dc>] process_one_work+0x1dc/0x380

[ 1.941481] [<ffff0000080dc3c8>] worker_thread+0x48/0x4d0

[ 1.946885] [<ffff0000080e2408>] kthread+0xf8/0x100
[ 1.957080] handlers:

[ 1.959350] [<ffff0000085ba668>] cdns3_irq

[ 1.963449] Disabling IRQ #36

 Kindly provide a solution to solve this issue.

Thanks & Regards,

Anjali

Virtuoso Studio IC23.1 ISR7 production release is now available for download.(read more)

Virtuoso Studio IC23.1 ISR8 production release is now available for download.(read more)

This blog explores how Virtuoso Studio Net Tracer can help you perform a design review.

We’ll use the net connectivity option, which allows the user to get a clean highlighted net. You can use the Net Tracer tool to highlight the nets. You can find the Net Tracer command under the connectivity pulldown menu in the layout window.

Trace manager and the ability to display different islands on the same net with other colors, you can identify and connect the unconnected islands as you wish.

The Net Tracer utility traces the nets in the physical view (layout). The trace is a highlighted net, which is a non-selectable object. The Net Tracer utility is available from Virtuoso Layout Suite XL onwards. You can use this utility based on your specific needs and preferences.

For a better understanding of the Net Tracer feature, let’s see one scenario between the circuit designer and layout engineer for a layout design review.

Circuit designer: Can we go through the routed input nets “inm” and “inp”?

Layout engineer: From the below layout view where they are highlighted using the XL connectivity, today I will use Net Tracer utility for the design review.

Circuit designer: I have never heard of this feature. Let's see how it works.

Layout engineer: Sure, now we turn on the Net Tracer toolbar using the below option.

You see the Net Tracer options form here:

As you can see on my screen, I have opened the layout view and engaged the Net Tracer utility.

Net Tracer allows shapes to be traced on a net in two tracing modes, namely, physical and logical, where shapes on the same net are physically or logically connected.

Physical tracing gathers all the shapes physically connected on the same net.

Logical tracing gathers all the shapes assigned to the same net. It highlights the net as in the source design (schematic). It will highlight shapes on the same net, even if they are isolated shapes that are not physically connected.

For this scenario, let us use physical tracing for input nets “inm” and “inp."

Highlighted nets are shown below:

Net “inm”                    Net “inp”                   Nets “inm” and “inp” 

Net Tracer has features like physical and logical tracing, preview, step-by-step mode, ease of tracing a net on a shape out of multiple underlying shapes, and so on.

Let us explore logical tracing for output nets “outm” and “outp”:

Here, you can see how to enable true color and halo before enabling logical tracing to identify the metal route. After enabling the true color halo, enable the logical trace.

Here, I am opening the trace manager to search “outm” and “outp” and click trace. That will trace the particular nets as shown.

Net Tracer has a preview feature, which is helpful in terms of the number of previewed objects. This preview capability hints at how the trace would appear when you create it. This useful feature in Virtuoso Studio highlights both completed and incomplete nets, helping the user better understand the status of the highlighted nets.

Circuit designer: Thanks for the design review. You have done good work. Net Tracer clearly shows both types of tracing, and it was even easy for the circuit designer to understand.

Layout engineer: Let me share the link to the Net Tracer RAK, where other layout engineers can explore many more amazing features of the Net Tracer.

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• If you need help with registration, contact support@cadence.com.

To stay up to date with the latest news and information about Cadence training and webinars, subscribe to the Cadence Training emails.

If you have questions about courses, schedules, online, public, or live onsite training, reach out to us at Cadence Training.

For any questions, general feedback, or future blog topic suggestions, please leave a comment.

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About Knowledge Booster Training Bytes

Knowledge Booster Training Bytes is an online journal that relays information about Cadence Training videos, online courses, and upcoming webinars that are available in the Learning section of the Cadence Learning and Support portal. This blog category brings you direct links to these videos, courses, and other related material on a regular basis.

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On behalf of the Cadence Training team

Virtuoso Studio IC23.1 ISR9 production release is now available for download.(read more)

The SPECTRE 24.1 release is now available for download at Cadence Downloads. For information on supported platforms and other release compatibility information, see the README.txt file in the installation hierarchy.(read more)

Virtuoso Studio IC23.1 ISR10 production release is now available for download.(read more)

Hello Fellow PCB Designers,

We have a 10 layer PCB design that originated in Pads and was converted over to Allegro 17.4, this is an old design but is manufacturable and works perfectly fine.  When I try to generate a Gerber for the Top or Bottom layers

the Gerber comes out fine.  But Most of the middle layers are Etch's and via's for power and grounds, but the Gerber's come mostly blank, there might be some details, but in the Gerber view everything is displayed correctly.

The design does have many close spacings, I have not changed anything in the constrains manager yet, turned off a lot of the DRC's, but thinking there might be something wrong with the constrains.

  I find that the CSet is set to 2_18, not sure yet what this means, also there are many of these definitions, PCS 3,4,5,ect, are the same as CSet 2_18 any suggestions would be great, we are currently looking into this, have seen

that even small change in constraint manager can cause long processing and even Allegro crashing, this is a large project.

Thanks Much, Thanks, Mike Pollock.

1， Some components in the installation package cannot choose to install; even if they do not choose them, they will still be installed; just less shortcut icons, the documents are still released to the installation directory.

2， "Catia Application Frame" repeat the problem?
       “x:CadenceSPB_17.4 oolsin“
       ”x:CadenceSPB_17.4 oolsspatial“
       "Catia Application Frame" shouldn't you use the latest version?

3，Follow-up update patch cleaning the useless files and extra empty folder action !!!

The SPB17.4 installation package is currently the worst installation package I have seen for large-scale software packaging.

As the title suggests I am unable to perform design sync between OrCAD Capture and Allegro. When I add a layout and try to sync to it I am given ERROR(ORCAP-2426): Cannot run Design Sync because of errors. See session log for error details.

Session Log

[ORPCBFLOW] : Invoking ECO dialog.
INFO(ORNET-1176): Netlisting the design
INFO(ORNET-1178): Design Name:
C:USERSDDOYLEDOCUMENTSCADENCEBOARDSREMOTE POWER DEVICECAPTUREREMOTE_POWER_DEVICE.DSN
Netlist Directory:
c:usersddoyledocumentscadenceoards emote power devicelayoutallegro
Configuration File:
C:CadenceSPB_17.4 ools/capture/allegro.cfg
pstswp.exe - pst - d "C:USERSDDOYLEDOCUMENTSCADENCEBOARDSREMOTE POWER DEVICECAPTUREREMOTE_POWER_DEVICE.DSN"- n "c:usersddoyledocumentscadenceoards emote power devicelayoutallegro" - c "C:CadenceSPB_17.4 ools/capture/allegro.cfg" - v 3 - l 31 - s "" - j "PCB Footprint" - hpath "HPathForCollision"
Spawning... pstswp.exe - pst - d "C:USERSDDOYLEDOCUMENTSCADENCEBOARDSREMOTE POWER DEVICECAPTUREREMOTE_POWER_DEVICE.DSN"- n "c:usersddoyledocumentscadenceoards emote power devicelayoutallegro" - c "C:CadenceSPB_17.4 ools/capture/allegro.cfg" - v 3 - l 31 - s "" - j "PCB Footprint" - hpath "HPathForCollision"
{ Using PSTWRITER 17.4.0 d001Dec-14-2021 at 09:00:49 }

INFO(ORCAP-36080): Scanning netlist files ...

Loading... c:usersddoyledocumentscadenceoards emote power devicelayoutallegropstchip.dat

Loading... c:usersddoyledocumentscadenceoards emote power devicelayoutallegropstchip.dat

Loading... c:usersddoyledocumentscadenceoards emote power devicelayoutallegropstxprt.dat

Loading... c:usersddoyledocumentscadenceoards emote power devicelayoutallegropstxnet.dat
packaging the design view...
Exiting... pstswp.exe - pst - d "C:USERSDDOYLEDOCUMENTSCADENCEBOARDSREMOTE POWER DEVICECAPTUREREMOTE_POWER_DEVICE.DSN"- n "c:usersddoyledocumentscadenceoards emote power devicelayoutallegro" - c "C:CadenceSPB_17.4 ools/capture/allegro.cfg" - v 3 - l 31 - s "" - j "PCB Footprint" - hpath "HPathForCollision"
INFO(ORNET-1179): *** Done ***

This issue started to occur after I changed parts that exist on previously created PCBs. I changed the following leading up to this:

1. Added height in Allegro to many of my components using the Setup->Area->Package Height tool.

2. Changed the reference designator category in OrCAD Capture to TP for several components on board.

Any advice here would be most welcome. Thanks!

Allegro part of DPI does not support scaling above 150%

I have managed to convert our old schematic and PCD file to from Layout 16.2 to 17.4

I have exported the footprints and moved them to the correct lib directory. 

I get no DRC errors and I can build a new netlist file. The problem is I can't get the PCB editor to update using the new netlist and get the following error:

I cannot figure out how to fix the Name is too long error. 

(---------------------------------------------------------------------)

(                                                                     )

(    Allegro Netrev Import Logic                                      )

(                                                                     )

(    Drawing          : 70055R2.brd                                   )

(    Software Version : 17.4S023                                      )

(    Date/Time        : Tue Dec 14 18:54:25 2021                      )

(                                                                     )

(---------------------------------------------------------------------)

------ Directives ------------

Ripup etch:                  Yes

Ripup delete first segment:  No

Ripup retain bondwire:       No

Ripup symbols:               IfSame

Missing symbol has error:    No

DRC update:                  Yes

Schematic directory:         'C:/AFS/70055 PCB Test 2'

Design Directory:            'C:/AFS/70055 PCB Test 2'

Old design name:             'C:/AFS/70055 PCB Test 2/70055R2.brd'

New design name:             'C:/AFS/70055 PCB Test 2/70055R2.brd'

CmdLine: netrev -$ -i C:/AFS/70055 PCB Test 2 -x -u -t -y 2 -h -z -q netrev_constraint_report.xml C:/AFS/70055 PCB Test 2/#Taaaaae57776.tmp

------ Preparing to read pst files ------

Starting to read C:/AFS/70055 PCB Test 2/pstchip.dat 

   Finished reading C:/AFS/70055 PCB Test 2/pstchip.dat (00:00:00.02)

Starting to read C:/AFS/70055 PCB Test 2/pstxprt.dat 

   Finished reading C:/AFS/70055 PCB Test 2/pstxprt.dat (00:00:00.00)

Starting to read C:/AFS/70055 PCB Test 2/pstxnet.dat 

   Finished reading C:/AFS/70055 PCB Test 2/pstxnet.dat (00:00:00.00)

------ Oversights/Warnings/Errors ------

#1   ERROR(SPMHNI-176): Device library error detected.

ERROR(SPMHNI-189): Problems with the name of device 'SW DPDT_9_SWITCH_OTTO_ALT_SW DPDT': 'Name is too long.'.

ERROR(SPMHNI-170): Device 'SW DPDT_9_SWITCH_OTTO_ALT_SW DP' has library errors. Unable to transfer to Allegro.

#2   ERROR(SPMHNI-176): Device library error detected.

ERROR(SPMHNI-189): Problems with the name of device 'SW DPDT_10_SWITCH_OTTO_LIGHTS_SW DPDT': 'Name is too long.'.

ERROR(SPMHNI-170): Device 'SW DPDT_10_SWITCH_OTTO_LIGHTS_S' has library errors. Unable to transfer to Allegro.

#3   ERROR(SPMHNI-176): Device library error detected.

ERROR(SPMHNI-189): Problems with the name of device 'SW DPDT_7_SWITCH_OTTO_ALT_SW DPDT': 'Name is too long.'.

ERROR(SPMHNI-170): Device 'SW DPDT_7_SWITCH_OTTO_ALT_SW DP' has library errors. Unable to transfer to Allegro.

#4   ERROR(SPMHNI-176): Device library error detected.

ERROR(SPMHNI-189): Problems with the name of device 'SW DPDT_3_SWITCH_OTTO_MASTER_SW DPDT': 'Name is too long.'.

ERROR(SPMHNI-170): Device 'SW DPDT_3_SWITCH_OTTO_MASTER_SW' has library errors. Unable to transfer to Allegro.

#5   ERROR(SPMHNI-176): Device library error detected.

ERROR(SPMHNI-189): Problems with the name of device 'SW DPDT_6_SWITCH_OTTO_LIGHTS_SW DPDT': 'Name is too long.'.

ERROR(SPMHNI-170): Device 'SW DPDT_6_SWITCH_OTTO_LIGHTS_SW' has library errors. Unable to transfer to Allegro.

#6   ERROR(SPMHNI-176): Device library error detected.

ERROR(SPMHNI-189): Problems with the name of device 'SW DPDT_3_SWITCH_OTTO_MASTER_DPDT': 'Name is too long.'.

ERROR(SPMHNI-170): Device 'SW DPDT_3_SWITCH_OTTO_MASTER_DP' has library errors. Unable to transfer to Allegro.

#7   ERROR(SPMHNI-176): Device library error detected.

ERROR(SPMHNI-189): Problems with the name of device 'CONNECTOR DB15_DSUBVPTM15_CONNECTOR DB15': 'Name is too long.'.

ERROR(SPMHNI-170): Device 'CONNECTOR DB15_DSUBVPTM15_CONNE' has library errors. Unable to transfer to Allegro.

#8   ERROR(SPMHNI-176): Device library error detected.

ERROR(SPMHNI-189): Problems with the name of device 'CONNECTOR DB9_DSUBVPTM9_CONNECTOR DB9': 'Name is too long.'.

ERROR(SPMHNI-170): Device 'CONNECTOR DB9_DSUBVPTM9_CONNECT' has library errors. Unable to transfer to Allegro.

#9   ERROR(SPMHNI-175): Netrev error detected.

ERROR(SPMHDB-195): Error processing 'M6': Text line is outside of the extents..

------ Library Paths ------

MODULEPATH =  . 

           C:/Cadence/SPB_17.4/share/local/pcb/modules 

PSMPATH =  . 

           symbols 

           .. 

           ../symbols 

           C:/Cadence/SPB_17.4/share/local/pcb/symbols 

           C:/Cadence/SPB_17.4/share/pcb/pcb_lib/symbols 

           C:/Cadence/SPB_17.4/share/pcb/allegrolib/symbols 

           C:/Cadence/SPB_17.4/share/pcb/pcb_lib/symbols 

PADPATH =  . 

           symbols 

           .. 

           ../symbols 

           C:/Cadence/SPB_17.4/share/local/pcb/padstacks 

           C:/Cadence/SPB_17.4/share/pcb/pcb_lib/symbols 

           C:/Cadence/SPB_17.4/share/pcb/allegrolib/symbols 

           C:/Cadence/SPB_17.4/share/pcb/pcb_lib/symbols 

------ Summary Statistics ------

#10  Run stopped because errors were detected

netrev run on Dec 14 18:54:25 2021

   DESIGN NAME : '70055R2'

   PACKAGING ON Nov  2 2021 14:32:04

   COMPILE 'logic'

   CHECK_PIN_NAMES OFF

   CROSS_REFERENCE OFF

   FEEDBACK OFF

   INCREMENTAL OFF

   INTERFACE_TYPE PHYSICAL

   MAX_ERRORS 500

   MERGE_MINIMUM 5

   NET_NAME_CHARS '#%&()*+-./:=>?@[]^_`|'

   NET_NAME_LENGTH 24

   OVERSIGHTS ON

   REPLACE_CHECK OFF

   SINGLE_NODE_NETS ON

   SPLIT_MINIMUM 0

   SUPPRESS   20

   WARNINGS ON

 10 errors detected

 No oversight detected

 No warning detected

cpu time      0:00:27

elapsed time  0:00:00

Hello. I am using Cadence 17.4 tools. When I open a package symbol (.dra) or board file (.brd) in Allegro that was created in an older version of the tool I get a message like this one (as expected):

"The design created using release 17.2 will be updated for compatibility with the current software..."

If I create a symbol or board file from scratch in the 17.4 tool then open it later, I get the same message. (always referring to version 17.2 which is the previous version I was using here).

So far this has not caused me any problems, but I would like to understand why it is doing this in case I have something setup incorrectly.

I only have version 17.4 installed. I am not exporting to a downrev version when I save (i.e. not using File->Export->Downrev design…) and in User Preferences->Drawing I don’t have anything selected for database_compatibility_mode. What else might I check?

FYI here is the tool version information that I see after selecting Help->About Symbol:

OrCAD PCB Designer Standard 17.4-2019 S012 [10/26/2020] Windows SPB 64-bit Edition

Thanks -Jason

Hello All,

I'm a novice to this forum and probably this subject has been already discussed here.

My company has purchased OrCAD Capture 17.4 tools that have a new GUI if compared to my earlier used OrCAD Capture 9.2. I have been using Capture 9.2 for ~18 years and its GUI is really convenient. The GUI of 17.4 looks to be a modern one with new icons and really has improved features and new capabilities.

However, my main complain about GUI 17.4 is that the schematic windows cannot be cascaded. Although they can be set floating, this is even more annoying because all toolbars remain in the Capture window and when you select a tool, the Capture window pops over already open schematic window and you need a lot of useless extra clicks to return back to the currently edited schematic page. I always used cascading of schematic windows before because my complex designs includes many pages, not speaking about the library windows that are typically open simulatneously. My view is that the lack of CASCADING in Capture GUI 17.4 is critical and unacceptable for complex projects, and I would very highly appreciate if the Cadence guys will return back the CASCADING capability for schematic pages. In case this will be done, this will make the GUI really great and comfortable to use.

Does anybody have opinion on this issue?

Many thanks,

Pavel

hello,

We have a number of workstations with version 17.2 that work on a floating license server

We want to know if it can be upgraded to version 17.4

If so, should the floating license server be upgraded as well?

In addition, how can you know where the license was purchased from?

Thanks!

Hi,

I found that under the Dark Theme of PCB Environment Editor 17.4,

the window background is not all dark, resulting in unclear text display。

As shown in the figure below：

I decided it was time to update my spectre install (currently a version of Spectre211).  Since 241 was a larger number than 211 I thought it would be a good idea (LOL)

Anyway, the simulator failed to run, and since I didn't have the time to debug why, I reverted to 211.

What's the difference in the two?

I need to include Verilog-A files which live outside the Cadence ecosystem (i.e., they are not in veriloga views but rather are just text files) into a veriloga view. These external modules are not compatible with OA (parametized port widths) so I can't put them into cellviews and hook them together using schematics.

Example: I have a cellview "test" which has a symbol and veriloga view. I have three "externaI" modules mod1 (inside an external file mod1.va),  mod2 (inside an external file mod2.va),  and mod3 (inside an external file mod3.va). I instantiate one instance of each module in "module test". The three modules have some parametized ports which are interconnected by parameterized signals p1 and p2. These two signals are strictly local to the module.

At the bottom of the module I use "`include mod1.va", "`mod2.va", etc.

When I check and save test->veriloga it checks all the included modules as well as the "test" module. However, I get a warning:

Warning from spectre during AHDL compile.
WARNING (VACOMP-1047): The Verilog-A file contains more than one module
definition. ADE can process only one module per Verilog-A file. Put
only one module in each Verilog-A file so that ADE can identify pin
names, directions, and hierarchy within each separate module.

Is this just a SUGGESTION that I can safely ignore, or are my included modules going to be ignored?

Hello

i did a sp-Analysis and now i want to extract the maximum value of the s11 trace and the corresponding frequency.

I already tried ymax() in the calculator but i am suspecting it only works on transient Signals.

The Sigrity and Systems Analysis (SIGRITY/SYSANLS) 2022.1 HF2 release is now available for download at Cadence Downloads. For the list of CCRs fixed in the 2022.1 HF2 release, see the README.txt file in the installation hierarchy.(read more)

Sample clues

17 across: Beckham speciality (4,4)

4 down: Havana speciality (5)

19 across: Infamous 1988 commercial against Michael Dukakis (9,4)

11 down: Precisely (2,3,3)

13 down: City infamously ransacked by the Japanese in 1937 (7)

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Sample clues

11 across: Chandigarh’s is 0172 (3,4)

21 across: He’s a loser, baby (4)

1 down: Garment meant to shape the torso (6)

12 down: It’s slogan: “Life, Liberty and the Pursuit” (8)

18 down: Noise made by badminton players? (6)

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Sample clues

5 across: The US president’s bird (3,5,3)

11 down: Group once known as the Quarrymen (7)

10 across: Cavalry sword (5)

19 across: Masonic ritual (5,6)

1 down: Pioneer of Ostpolitik (6)

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Sample clues

14 across: FDR’s baby (3,4)

1 down: A glitch in the Matrix? (4,2)

4 down: Slanted character (6)

5 down: New Year’s venue in New York (5,6)

16 down: Atmosphere of melancholy (5)

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India Uncut * The IU Blog * Rave Out * Extrowords * Workoutable * Linkastic