Project Description:We are seeking a skilled PCB designer for a project involving the design and layout of a PCB that will incorporate Solid-State Relays (SSRs) for AC and DC voltage control. This board will not include any FPGA components or software; it will strictly focus on SSR relays for machine operations.Project Scope:Design a PCB containing SSRs, intended as part of an ongoing machine project.Collaborate with an internal team working on an existing machine that currently operates with...

OrCAD X is the next-generation integrated PCB design platform. It brings to you a powerful cloud-enabled design solution that includes design and library data management integrated with the proven PCB design and analysis product portfolio of Cad...(read more)

Hi All

I followed tutorial video below for using Design link

https://www.youtube.com/watch?v=f9JmFF8lqA0

and I followed the video with embedded board design file which should be same one on video

I did every set. but  at 2:55 of video, Steve have the tabs of both design names on top of Constraint Manager in video

but my one didn't exist them

which one would be different?

there was some comment on command windows but I think they would not be problem here

regard

Optimizing PCB thermal performance is essential in today’s high-density designs, as it ensures stability, prolongs component life, and prevents potential thermal issues. One of the first steps to achieving this is with strategic component placement. Positioning high-power components—such as regulators, power transistors, or processors—away from heat-sensitive parts can prevent thermal interference, and placing them near the edges of the PCB often helps dissipate heat more effectively. It’s also beneficial to group components by their heat generation, creating dedicated thermal zones that can manage localized heating and reduce impact on other areas of the board.

Using thermal vias is another effective technique. By placing thermal vias under components like BGAs or power ICs, heat can be transferred from the surface to internal layers or ground planes. Increasing the size and number of these vias, or using thicker plating, enhances heat conductivity and helps manage heat more evenly across layers in multilayer boards. Increasing copper thickness on the PCB also has a major impact. Opting for thicker copper layers (e.g., 2 oz or even 3 oz copper) significantly boosts the heat dissipation capabilities of power planes and traces, especially in high-current areas. Large copper planes, such as dedicated ground or power planes, are equally effective in spreading heat efficiently. Adding thermal pads directly beneath heat-generating components improves this heat distribution.

Thermal relief pads help regulate heat flow for through-hole components by controlling heat transfer, which reduces thermal stress during soldering and prevents excessive heat spread to nearby sensitive areas. Performing thermal analysis with software tools like Celsius can be invaluable, as it allows you to simulate and model heat distribution, spot potential thermal issues, and refine your design before finalizing it.

Using heat sinks and thermal pads provides a direct way to draw heat from high-power components. Heat sinks can be attached with thermal adhesives, screws, or clamps, while thermal interface materials (TIMs), such as thermal pads or conductive adhesives, further reduce thermal resistance, enhancing heat-transfer efficiency. Optimizing the PCB layer stackup is also a key factor. Dedicated ground and power layers improve heat conduction across the PCB, enabling heat transfer between layers, particularly in high-density and multilayer PCBs.

In designs with high power requirements, active cooling options like fans, blowers, or heat pipes can be essential, helping to direct airflow across the PCB and further improving heat dissipation. Adding ventilation slots around hot zones and considering passive cooling paths enhance natural airflow, making the design more thermally efficient. By combining several of these techniques, you can create a PCB that handles heat effectively, resulting in a robust, long-lasting, and reliable product.

Let us know if you’ve had any challenges with thermal management in your designs—I’d be glad to discuss further!

Iam new to Package design SIP tool.

I had created the DIE package using SIP. Kindly give the direction how to map the created DIE package in Allegro pcb editor 17.2 ver.

In Allegro design capture CIS tool we had created the schematics file. The DIE which we are using is having 100pins, We had created the DIE in SIP tool. Out of 100 Die pins, only 90 pins is getting connected others are NC pins. We had mapped the Bond fingers only for 90 Die pins in the SIP package. But in the Schematics we had created the DIE logic symbol for 100 pins. Please advice whether we can able to import the DIE package in the allegro tool. In this scenario while importing the 100 pin DIE package in allegro pcb editor will the net connectivity will be shown from the DIE pad to Bond fingers and from Bond fingers to respective components? Please suggest whether we are going in the right path or please advice what we have to proceed with.

Thanks in Advance,

Rajesh

Hello All,

I'm currently using OrCAD PCB Designer Professional w/ PSpice (version 16.6-2015).  In the 'Design Object Find Filter' side bar, all options are grayed out and unselectable.  I did attempt to 'Reset UI to Cadence Default' without any luck.  A colleague has no issues with the identical file on his computer.  Any guidance would be much appreciated.  Thanks!

George