Nice pricing for a premium Hynix kit
Dual rank, RGB and XMP 3.0 - most AMD boards support XMP but double check your specs and BIOS
$1 cheaper at unnamed retailer with insufficient stock, higher surcharge and noted price jacker

F5-6400J3239G32GX2-TZ5RK

PC5-51200 (6400MHz), CL32-39-39-102 @ 1.4V, XMP 3.0, Dual Channel Kit, Matte Black
Limited Lifetime Warranty

1% surcharge for Card, AmEx, & PayPal payments

Blockbuster Education deal now available on the standard store plus cash back eligible
Quality OLED display, Radeon 780M for light gaming and large battery
Lenovo specs do not confirm whether chassis is full aluminium or if this particular variant has the PC-ABS bottom

To get the deal specs/price, tick the following options in the builder:

4 Cell Li-Polymer 76Wh +$10

83DDCTO1WWAU2

AMD Ryzen 7 8845HS (8C / 16T, 3.8 / 5.1GHz, 8MB L2 / 16MB L3), 45W TDP
32GB LPDDR5x-6400MHz (Soldered), dual-channel, not upgradable
Integrated AMD Radeon 780M Graphics
512GB SSD M.2 2242 PCIe 4.0x4 NVMe TLC
16" 2K (2048x1280), OLED, 400nits, Glossy, 100% DCI-P3, 120Hz, TÜV Low Blue Light (Hardware), DisplayHDR True Black 500

Supports up to 4 independent displays (native display and 3 external monitors via HDMI and USB-C)
HDMI supports up to 1920x1080@60Hz
USB-C supports up to 3840x2160@60Hz

2x USB-C (USB 5Gbps / USB 3.2 Gen 1), with USB PD 3.0 and DisplayPort 1.4, 1x USB-A (USB 5Gbps / USB 3.2 Gen 1), Always On, 1x USB-A (USB 5Gbps / USB 3.2 Gen 1), 1x HDMI 1.4b, 1x Headphone / microphone combo jack (3.5mm), 1x microSD card reader
Wi-Fi 6E 11ax 2x2 + BT5.1
1080P FHD IR Hybrid with Dual Microphone
4 Cell Li-Polymer 76Wh battery
65W USB-C Slim (3-pin) AC adapter
Grey, English keyboard
Buttonless Mylar surface multi-touch touchpad
Aluminium (Top), Aluminium or PC-ABS (Bottom) case
356 x 251 x 16.9-17.9 mm
1.79-1.82 kg
Windows 11 Home 64
1 Year Onsite warranty

...

Stumbled upon this well priced AMD Ryzen 7 laptop. Has well rounded specs and an RTX 4060. Feel free to experiment or wait for any stackable coupon codes along with cashback.

Specs:

Processor
AMD Ryzen™ 7 7840HS (24 MB total cache, 8 cores, up to 5.10 GHz Max Boost Clock)

Operating System
Windows 11 Home, English

Video Card
NVIDIA® GeForce RTX™ 4060, 8 GB GDDR6

Display
15.6", FHD 1920x1080, 165Hz, 100% sRGB, 3ms, ComfortView Plus, DDS, NVIDIA G-SYNC

Memory
16GB DDR5, 2x8GB, 4800MT/s; up to 32GB (5600MT/s with AMD CPU)

Storage
512 GB, M.2, PCIe NVMe, SSD

Ports
1 Headset (Headphone and Microphone combo) port
1 RJ45 Ethernet port
3 USB 3.2 Gen 1 Type-A ports
1 HDMI 2.1 port
1 USB-C 3.2 Gen 2 with DisplayPort™
1 Power Input port

Dimensions & Weight
Height (front): 21.28 mm (0.83 in.)
Height (rear): 26.15 mm (1.02 in.)
Height (peak): 26.95 mm (1.06 in.)
Width: 357.26 mm (14.07 in.)
Depth: 274.52 mm (10.80 in.)

Camera
720p at 30 fps HD RGB camera, single integrated microphon

Audio and Speakers
Stereo speakers with Realtek ALC3254, 2 x 2.5 W

Wireless
MediaTek Wi-Fi 6 MT7921, 2x2, 802.11ax, MU-MIMO, Bluetooth® wireless card

Primary Battery
6 Cell, 86 Wh, integrated

Power
330W AC adapter

Read the in depth Review of CORSAIR DOMINATOR PLATINUM RGB First Edition DDR5 DRAM Memory Kit PC Components. Know detailed info about CORSAIR DOMINATOR PLATINUM RGB First Edition DDR5 DRAM Memory Kit configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

The demand for higher-performance computing is greater than ever. Cutting-edge applications in artificial intelligence (AI), big data analytics, and databases require high-speed memory systems to handle the ever-increasing volumes and complexities of data. Advancements in cloud computing and machine virtualization are stretching the limits of current capabilities. AI applications hosted in the cloud rely on fast access and reduced latency in memory systems, which is amplified by an increasing number of CPU and GPU cores.

Introducing the DDR5 Multiplexed Rank DIMM (MRDIMM), the next-generation memory module technology designed to meet the needs of high-performance computing (HPC) and AI in cloud applications. By leveraging existing DDR5 DRAM memory devices, MRDIMM modules not only double the DRAM data rate but also maintain the RAS capabilities of the industry-proven RDIMM modules, setting a new precedent for memory module performance.

Let’s compare RDIMM and MRDIMM modules using the same DRAM parts. Today, high-speed production DDR5 RDIMM modules run at 5600Mbps. Those modules use DDR5 DRAM parts, which also run at 5600Mbps. An MRDIMM module using the same DDR5 5600Mbps DRAM parts will run at a blazing 11.2Gbps.

One key metric for best-in-class performance, low bit error rate (BER), and ease of adoption is the eye diagram. The eye diagram illustrates at-speed system margin and accurately represents DDR system quality when captured with a pseudo-random binary sequence (PRBS)-like pattern. The diagram below illustrates Cadence’s 3nm silicon write eye diagram for DDR5 MRDIMM IP running at 12.8Gbps.

Cadence 3nm DDR5 MRDIMM 12.8Gbps test chip write eye diagram, design kit is available today

The eye diagram is captured using a PRBS-like pattern, incorporating a package and system board representative of a typical MRDIMM channel. Using PRBS-like patterns is crucial for capturing accurate eye diagrams. Repetitive clock-like data patterns create deceptively “open eyes” that do not reflect the real system performance. Effects like intersymbol interference, simultaneous switching, reflections, and crosstalk are not accurately reflected in the eye diagrams for parallel interfaces like DDR using non-random data streams. Relying on improperly captured eye diagrams inevitably leads to a significantly worse real system BER than conveyed by that eye diagram.

Doubling the DDR5 RDIMM data rate is challenging. Achieving high performance while optimizing for area and power requires multiple design techniques. Feed-forward equalization (FFE), decision feedback equalization (DFE), continuous-time linear equalization (CTLE), and T-coils are required to reach 12.8Gbps MRDIMM data rates in multi-channel systems. Building a production-worthy 12.8Gbps DDR5 MRDIMM IP requires engineering expertise that comes from many generations of memory interface design and production experience. Cadence has developed this expertise through multiple DDR5/4, LPDDR5X/5, and GDDR6 designs in different technology nodes and foundries. For instance, Cadence’s GDDR6 IP is available in three foundries and ten process nodes, with mass production at speeds exceeding 22Gbps.

For your next project, consider DDR5 12.8Gbps MRDIMM, a technology that not only doubles the bandwidth of DDR5 RDIMM but also promises rapid proliferation into next-generation AI, data center, HPC, and enterprise applications. With its cutting-edge capabilities, the Cadence DDR5 12.8Gbps MRDIMM IP is ready to power the future of computing.

DDR5 is the latest generation of PCDDR memory that is used in a wide range of application like data centers, Laptops and personal computers, autonomous driving systems, servers, cloud computing, and gaming are now increasingly being used for AI applications with advances in memory bandwidth and density to allow DDR5 DIMMs (Dual Inline Memory Modules) to support densities higher then 256 GB per DIMM card. The highest speed DDR5 SDRAM devices can support data rates of up to 8800 MTps.

DDR5 SO-DIMMs and UDIMMs

One of the most recognized uses of PCDDR is with client devices like laptops and personal computers. These client devices mostly use two types of DDR5 DIMMs called SO-DIMM (Small Outline Dual Inline Memory Module) and UDIMM (Unbuffered Dual Inline Memory Module).

These types of DIMMs have no signal regeneration or buffering (which, for example, the Registering Clock Driver or the RCD does for clocks/command/control signals for a registered DIMMs). A typical 2-Rank UDIMM with x8 DDR5 SDRAM components has 8 or 10 components per rank depending on the system ECC (Error Correction Code) memory being part of the DIMM.

Why DDR5 Clock Buffer and CUDIMM?

Clocks are one of the most important signals for synchronous devices, and DDR5 SDRAMs are no exception. The host is responsible for the fanout to all the DRAM input ports, such as clocks for UDIMMs. Driving of all these DRAM clocks can put quite a bit of load on the host output drivers, thus affecting the signal quality, which can result in unexpected memory errors. This issue gets amplified when operating at the higher clock and data rates where the clock signals transition from one logic value to the next over a very short time. To solve these signal integrity issues with DRAM clocks, JEDEC has come up with a new type of DDR5 DIMM component that is called DDR5 clock buffer. Clock buffers can be used for both DDR5 SO-DIMMs and DDR5 UDIMMs. DDR5 UDIMMs that include a clock buffer component as part of the DIMM card are called DDR5 CUDIMMs (Clock Buffered UDIMMs).

DDR5 Clock Buffer Overview

DDR5 Clock Buffer is a simple logic device that takes in two sets of input clock pins and drives two sets of clock pins as output per channel. The clock buffer device can operate in three types of clock modes: -

• PLL bypass mode: In this mode, the clock buffer just passes on the input clocks to output without any kind of signal buffering. The PLL bypass mode enabled CUDIMM devices behave like traditional UDIMMs without any buffering of the clocks. This is why it’s also referred to as legacy mode. Recommended CUDIMM operating speeds in PLL bypass mode are typically limited to 3000 MHz.

• Single PLL mode: In the single PLL Mode, the clock buffer device will use a Phase Lock Loop (PLL) for the regeneration of the incoming host clock to create a better-quality clock that is sent to the DRAMs. However, since there is only one PLL that is used in this mode, both sub channel output clocks will be driven based on only one set of input clocks with the other set of input clocks remaining unused.

• Dual PLL mode: In this mode, the clock buffer will use two PLLs to independently generate each sub channel output clock based on each set of incoming host clocks. The second set of PLL can be turned on or off on the fly if needed to save power.

Beyond the clock modes, clock buffers provide additional flexibility to the system designers with register-controlled additional signal delays, optional output clock enable/disable per bit feature, drive strength and termination choices, etc. All DDR5 clock buffer device control word registers are accessible via DDR5 DIMM sideband.

Cadence VIPs offers a compressive memory subsystem solution that includes memory models for DDR5 SDRAM, DDR5 RCD, DDR5 DB, DDR5 clock buffer, all types of DDR5 DIMMs, including the DDR5 CUDIMMs, DFI Memory Controller/PHY VIPs, and a system VIP compliant to JEDEC specifications defined for each of those devices along with latest DFI Specification.

More information on Cadence DDR5 DIMM VIP is available at the Cadence VIP Memory Models website.

DDR5 DIMM Architectures The DDR5 generation of Double Data Rate DRAM memories has experienced rapid adoption in recent years. In particular, the JEDEC-defined DDR5 Dual Inline Memory Module (DIMM) cards have become a mainstay for systems looking for high-density, high-bandwidth, off-chip random access memory[1]. Within a short time, the DIMM architecture evolved from an interconnected hierarchy of only SDRAM memory devices (UDIMM[2]) to complex subsystems of interconnected components (RDIMM/LRDIMM/MRDIMM[3]). DIMM Designs and Popular Verification Use Cases The growing complexity of the DIMMs presented a challenge for pre-silicon verification engineers who could no longer simply validate against single DDR5 SDRAM memory models. They needed to consider how their designs would perform against DIMMs connected to each channel and operating at gigahertz clock speeds. To address this verification gap, Cadence developed DDR5 DIMM Memory Models that encapsulated all of the architectural complexities presented by real-world DIMMs based on a robust, easy-to-use, easy-to-debug, and easy-to-reconfigure methodology. This memory-subsystem-in-a-single-instance model has seen explosive adoption among the traditional IP Developer and SOC Integrator customers of Cadence Memory Models. The Cadence DIMM models act as a single unit with all of the relevant DIMM components instantiated and interconnected within, and with all AC/Timing parameters among the various components fully matched out-of-the-box, based on JEDEC specifications as well as datasheets of actual devices in the market. The typical use-case for the DIMM models has been where the DUT is a DDR5 Memory Controller + PHY IP stack, and the validation plan mandated compliance with the JEDEC standards and Memory Device vendor datasheets. Unique Use Case for the DIMM Discrete Component Models Although the Cadence DIMM models have enjoyed tremendous proliferation because of their cohesive implementation and unified user API, the actual DIMM Models are built on top of powerful, flexible discrete component models, each of which was designed to stand on its own as a complete SystemVerilog UVM-based VIP. All of these discrete component models exist in the Cadence VIP Catalog as standalone VIPs, complete with their own protocol compliance checking capabilities and their own configuration mappings comprehensively modeling individual AC/Timing parameters. Because of this deliberate design decision, the Cadence DIMM Discrete Component Models can support a unique use-case scenario. Some users seek to develop IC Designs for the various DIMM components. Such users need verification environments that can model the individual components of a DIMM and allow them the option to replace one or another component with their Component Design IP. They can then validate that their component design is fully compatible with the rest of the components on the DIMM and meets the integrity of the overall DIMM compliance with JEDEC standards or Memory Vendor datasheets. The Cadence Memory VIP portfolio today includes various examples that demonstrate how customers can create DIMM “wrappers” by selecting from among the available DIMM discrete component models and “stitching” them together to build their own custom testbench around their specific Component Design IP. A Solution for Unique Component Scenarios The Cadence DDR5 DIMM Memory Models and DIMM Discrete Component Models can provide users with a flexible approach to validating their specific component designs with a fully populated pre-silicon environment. Augmented Verification Capabilities When the DIMM “wrapper” model is augmented with the Cadence DFI VIP[4] that can simulate an MC+PHY stack and offers a SystemVerilog UVM test API to the verification engineer, the overall testbench transforms into a formidable pre-silicon validation vehicle. The DFI VIP is designed as a combination of an independent DFI MC VIP and a DFI PHY VIP connected to each other via the DFI Standard Interface and capable of operating seamlessly as a single unit. It presents a UVM Sequence API to the user into the DFI MC VIP with the Memory Interface of the PHY VIP connected to the DIMM “wrapper” model. With this testbench in hand, the user can then fully take advantage of the UVM Sequence Library that comes with the DFI VIP to enable deep validation of their Component Design inside the DIMM “wrapper” model. Verification Capabilities Further Enhanced A possible further enhancement comes with the potential addition of an instance of the Cadence DIMM Memory Model in a Passive Monitor mode at the DRAM Memory Interface. The DIMM Passive Monitor consumes the same configuration describing the DIMM “wrapper” in the testbench, and thus can act as a reference model for the DIMM wrapper. If the DIMM Passive Monitor responds successfully to accesses from the DFI VIP, but the DIMM wrapper does not, then it exposes potential bugs in the DUT Components or in the settings of their AC/Timing parameters inside the DIMM wrapper. Debuggability, Interface Visibility, and Protocol Compliance One of the key benefits of the DIMM Discrete Component Models that become manifest, whether in terms of the unique use-case scenario described here, or when working with the wholly unified DDR5 DIMM Memory Models, is the increased debuggability of the protocol functionality. The intentional separation of the discrete components of a DIMM allows the user to have full visibility of the memory traffic at every datapath landmark within a DIMM structure. For example, in modeling an LRDIMM or MRDIMM, the interface between the RCD component and the SDRAM components, the interface between the RCD component and the DB components, and the interface between the SDRAM components and the DB components—all are visible and accessible to the user. The user has full access to dump the values and states of the wire interconnects at these interfaces to the waveform viewer and thus can observe and correlate the activity against any protocol violations flagged in the trace logs by any one or more of the DIMM Discrete Component Models. Access to these interfaces is freely available when using the DIMM Discrete Component Models. On the unified DDR5 DIMM Memory Models, a feature called Debug Ports enables the same level of visibility into the individual interconnects amidst the SDRAM components, RCD components, and DB components. When combined with the Waveform Debugger[5] capability that comes built-in with the VIPs and Memory Models offered by Cadence and used with the Cadence Verisium Debug[6] tool, the enhanced debuggability becomes a powerful platform. With these debug accesses enabled, the user can pull out transaction streams, chip state and bank state streams, mode register streams, and error message streams all right next to their RTL signals in the same Verisium Debug waveform viewer window to debug failures all in one place. The Verisium Debug tool also parses all of the log files to probe and extract messages into a fully integrated Smart Log in a tabbed window fully hyperlinked to the waveform viewer, all at your fingertips. A Solution for Every Scenario Cadence's DDR5 DIMM Memory Models and DIMM Discrete Component Models , partnered with the Cadence DFI VIP, can provide users with a robust and flexible approach to validating their designs thoroughly and effectively in pre-silicon verification environments ahead of tapeout commitments. The solution offers unparalleled latitude in debuggability when the Debug Ports and Waveform Debugger functions of the Memory Models are switched on and boosted with the use of the Cadence Verisium Debug tool. [1] Shyam Sharma, DDR5 DIMM Design and Verification Considerations , 13 Jan 2023. [2] Shyam Sharma, DDR5 UDIMM Evolution to Clock Buffered DIMMs (CUDIMM) , 23 Sep 2024. [3] Kos Gitchev, DDR5 12.8Gbps MRDIMM IP: Powering the Future of AI, HPC, and Data Centers , 26 Aug 2024. [4] Chetan Shingala and Salehabibi Shaikh, How to Verify JEDEC DRAM Memory Controller, PHY, or Memory Device? , 29 Mar 2022. [5] Rahul Jha, Cadence Memory Models - The Gold Standard , 15 Apr 2024. [6] Manisha Pradhan, Accelerate Design Debugging Using Verisium Debug , 11 Jul 2023.

It says these components will enable "the industry's highest DRAM bit density".

Claims they are the world's fastest DDR5 memory kits, offer CL36-36-36-76 timings.

Rumours abound

Micron the memory manufacturing company has officially confirmed that it has begun sampling DDR5 Registered DIMMs using 1znm process technology. DDR5 is the most advanced DRAM till date and the company claims that a DDR5 RAM compared to a DDR4 RAM