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Apple Wants To Shift iPhone Production To India, Vietnam & Completely Ignore China For This Reason

Recently, Apple is accelerating its plans to shift some of its production outside China. The Cupertino headquartered company is asking its suppliers to plan more for assembling the product elsewhere in Asia, particularly India and Vietnam. Apple Shifting Assembly Line Outside Of China Sources involved in this discussion also said that Apple is also looking […]




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Family Members Of Foreign Workers In Canada Now Allowed To Work: Spouses, Working-Age Children Will Get Work Permits!

After its decision to strengthen visa infrastructure in Delhi and Chandigarh, Canada has now announced that family members of temporary international workers will also be allowed to work in the country. Sean Fraser, Canada’s Minister of Immigration, Refugees, and Citizenship, recently informed the media that his agency will be granting work permits to relatives of […]




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Interesting Details Of iPhone 15 Ultra Revealed: Find Out Design, Specs, USPs & More

Apple 14 is barely out of the box and features and rumors of the Apple 15 series are already making rounds of the internet.  The newest reports have revealed that the iPhone 15 Pro Max is to be replaced by the brand-new iPhone 15 Ultra. With the iPhone 15 series, the corporation is also said […]




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How Cadence Is Expanding Innovation for 3D-IC Design

The market is trending towards integrating and stacking multiple chiplets into a single package to meet the growing demands of speed, connectivity, and intelligence.  However, designing and signing off chiplets and packages individually is time-...(read more)




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Navigating Chiplet-Based Automotive Electronics Design with Advanced Tools and Flows

In the rapidly evolving landscape of automotive electronics, traditional monolithic design approaches are giving way to something more flexible and powerful—chiplets. These modular microchips, which are themselves parts of a whole silicon system, offer unparalleled potential for improving system performance, reducing manufacturing costs, and accelerating time-to-market in the automotive sector. However, the transition to working with chiplets in automotive electronics is not without its challenges.

Designers must now grapple with a new set of considerations, such as die-to-die interconnect standards, complex processes, and the integration of diverse IPs. Advanced toolsets and standardized design approaches are required to meet these challenges head-on and elevate the potential of chiplets in automotive innovation. In the following discourse, we will explore in detail the significance of chiplets in the context of automotive electronics, the obstacles designers face when working with this paradigm, and how Cadence comprehensive suite of IPs, tools, and flows is pioneering solutions to streamline the chiplet design process.

Unveiling Chiplets in Automotive Electronics

For automotive electronics, chiplets offer a methodology to modularize complex functionalities, integrate different chiplets into a package, and significantly enhance scalability and manufacturability. By breaking down semiconductor designs into a collection of chiplets, each fulfilling specific functions, automotive manufacturers can mix and match chiplets to rapidly prototype new designs, update existing ones, and specialize for the myriad of use cases found in vehicles today.

The increasing significance of chiplets in automotive electronics comes as a response to several industry-impacting phenomena. The most obvious among these is the physical restriction of Moore's Law, as large die sizes lead to poor yields and escalating production costs. Chiplets with localized process specialization can offer superior functionality at a more digestible cost, maintaining a growth trajectory where monolithic designs cannot. Furthermore, chiplets support the assembly of disparate technologies onto a single subsystem, providing a comprehensive yet adaptive solution to the diverse demands present in modern vehicles, such as central computing units, advanced driver-assistance systems (ADAS), infotainment units, and in-vehicle networks. This chiplet-based approach to functional integration in automotive electronics necessitates intricate design, optimization, and validation strategies across multiple domains.

The Complexity Within Chiplets

Yet, with the promise of chiplets comes a series of intricate design challenges. Chiplets necessitate working across multiple substrates and technologies, rendering the once-familiar 2-dimensional design space into the complex reality of multi-layered, sometimes even three-dimensional domains. The intricacies embedded within this design modality mandate devoting considerable attention to partitioning trade-offs, signal integrity across multiple substrates, thermal behavior of stacked dies, and the emergence of new assembly design kits to complement process design kits (PDKs).

To effectively address these complexities, designers must wield sophisticated tools that facilitate co-design, co-analysis, and the creation of a robust virtual platform for architectural exploration. Standardizations like the Universal Chip Interconnect Express (UCIe) have been influential, providing a die-to-die interconnect foundation for chiplets that is both standardized and automotive-ready. The availability of UCIe PHY and controller IP from Cadence and other leading developers further eases the integration of chiplets in automotive designs.

The Role of Foundries and Packaging in Chiplets

Foundries have also pivoted their services to become a vital part of the chiplet process, providing specialized design kits that cater to the unique requirements of chiplets. In tandem, packaging has morphed from being a mere logistical afterthought to a value-added aspect of chiplets. Organizations now look to packaging to deliver enhanced performance, reduced power consumption, and the integrity required by the diverse range of technologies encompassed in a single chip or package. This shift requires advanced multiscale design and analysis strategies that resonate across a spectrum of design domains.

Tooling Up for Chiplets with Cadence

Cadence exemplifies the rise of comprehensive tooling and workflows to facilitate chiplet-based automotive electronics design. Their integrations address the challenges that chiplet-based SoCs present, ensuring a seamless design process from the initial concept to production. The Cadence suite of tools is tailored to work across design domains, ensuring coherence and efficiency at every step of the chiplet integration process.

For instance, Cadence Virtuoso RF subflows have become critical in navigating radio frequency (RF) challenges within the chiplets, while tools such as the Integrity 3D-IC Platform and the Allegro Advanced Multi-Die Package Design Solution have surfaced to enable comprehensive multi-die package designs. The Integrity Signal Planner extends its capabilities into the chiplet ecosystem, providing a centralized platform where system-wide signal integrity can be proactively managed. Sigrity and Celsius, on the other hand, offer universally applicable solutions that take on the challenges of chiplets in signal integrity and thermal considerations, irrespective of the design domain. Each of these integrated analysis solutions underscores the intricate symphony between technology, design, and packaging essential in unlocking the potential of chiplets for automotive electronics.

Cadence portfolio includes solutions for system analysis, optimization, and signoff to complement these domain-specific tools, ensuring that the challenges of chiplet designs don't halt progress toward innovative automotive electronics. Cadence enables designers to engage in power- and thermal-aware design practices through their toolset, a necessity as automotive systems become increasingly sophisticated and power-efficient.

A Standardized Approach to Success with Chiplets

Cadence’s support for UCIe underscores the criticality of standardized approaches for heterogeneous integration by conforming to UCIe standards, which numerous industry stakeholders back. By co-chairing the UCIe Automotive working group, Cadence ensures that automotive designs have a universal and standardized Die-to-Die (D2D) high-speed interface through which chiplets can intercommunicate, unleashing the true potential of modular design.

Furthermore, Cadence champions the utilization of virtual platforms by providing transaction-level models (TLMs) for their UCIe D2D IP to simulate the interaction between chiplets at a higher level of abstraction. Moreover, individual chiplets can be simulated within a chiplet-based SoC context leveraging virtual platforms. Utilizing UVM or SCE-MI methodologies, TLMs, and virtual platforms serve as first lines of defense in identifying and addressing issues early in the design process before physical silicon even enters the picture.

Navigating With the Right Tools

The road to chiplet-driven automotive electronics is one paved with complexity, but with a commitment to standards, it is a path that promises significant rewards. By leveraging Cadence UCIe Design and Verification IP, tools, and methodologies, automotive designers are empowered to chart a course toward chiplets and help to establish a chiplet ecosystem. With challenges ranging from die-to-die interconnect to standardization, heterogeneous integration, and advanced packaging, the need for a seamless integrated flow and highly automated design approaches has never been more apparent. Companies like Cadence are tackling these challenges, providing the key technology for automotive designers seeking to utilize chiplets for the next-generation E/E architecture of vehicular technology.

In summary, chiplets have the potential to revolutionize the automotive electronics industry, breathing new life into the way vehicles are designed, manufactured, and operated. By understanding the significance of chiplets and addressing the challenges they present, automotive electronics is poised for a paradigm shift—one that combines the art of human ingenuity with the power of modular and scalable microchips to shape a future that is not only efficient but truly intelligent.

Learn more about how Cadence can help to enable automakers and OEMs with various aspects of automotive design.




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Change rout design metal layer effort

Hi,

Is there any way to instruct the tool to reduce the low metals effort and route more on top layers? 




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Tool to create *.lib and *.db files for designs made in Innovus

Hi all, 

I have made a custom cell in Innovus that I will be instantiating into a bigger block, which I will also be using Innovus to do the Place & Route. 

I understand that I can generate a *.lef file and a *.lib file using Innovus. However, I need to also create a *.db file (these format of files are often used in DC Compiler synthesis tool). 

Is there a way to create the *.db file from Innovus? Or, is there a tool that I can use to create this *.db file? 

Thank you for your time. 




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Is there a skill command for "Assign Layout Instance terminals"?

Is there a skill command for "Assign Layout Instance terminals", this form appears when i click on define device correspondence and Bind the devices.

Also,

Problem Statement : i have a schematic with a couple of transistor symbols and and i alos have a corresponding layout view with respective layout transistors but they all are inside a pCell(created by me) i.e layout transistor called inside a custom Pcell. Now i have multiple symbols in schematic view and a single instance(pCell) in layout view. 
Is there a way how i can bind these schematic symbols with layout symbols inside the pCell(custom)? Even if i have to use cph commands i'm fine with it. need help here.

The idea here is to establish XL connectivity between the schematic symbols and corresponding layout transistors(inside the pCell).

Thanks,

Shankar




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μWaveRiders: New Python Library Provides a Higher-Level API in the Cadence AWR Design Environment

A new Python library has been written to facilitate an interface between Python and AWR software using a command structure that adheres more closely to Python coding conventions. This library is labeled "pyawr-utils" and it is installed using the standard Python pip command. Comprehensive documentation for installing and using pyawr-utils is available.(read more)




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μWaveRiders: Setting Up a Successful AWR Design Environment Design - UI and Simulation

When starting a new design, it's important to take the time to consider design recommendations that prevent problems that can arise later in the design cycle. This two-part compilation of guidelines for starting a new design is the result of years of Cadence AWR Design Environment platform Support experience with designs. Pre-design decisions for user interface, simulation, layout, and library configuration lay the groundwork for a successful and efficient AWR design. This blog covers the user interface (UI) and simulation considerations designers should note prior to starting a design.(read more)




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New Training Courses for RF/Microwave Designers Featuring Cadence AWR Software

Cadence AWR Design Environment Software Featured in Multiple Training Course Options: Live and Virtual Starting in October(read more)




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μWaveRiders: Cadence AWR Design Environment V22.1 Software Release Highlights

The Cadence AWR Design Environment V22.1 production release is now available for download at Cadence Downloads with design environment, AWR Microwave Office, AWR VSS, AWR Analyst, and other enhancements.(read more)




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μWaveRiders: Scoring Goals with the Latest AWR Design Environment Optimizer

AWR V22.1 software introduces the Pointer-Hybrid optimization method which uses a combination of optimization methods, switching back and forth between methods to efficiently find the lowest optimization error function cost. The optimization algorithm automatically determines when to switch to a different optimization method, making this a superior method over manual selection of algorithms. This method is particularly robust in regards to finding the global minima without getting stuck in a local minima well.(read more)




ign

μWaveRiders: Setting Up a Successful AWR Design Environment Design - Layout and Component Libraries

When starting a new design, it's important to take the time to consider design recommendations that prevent problems that can arise later in the design cycle. This two-part compilation of guidelines for starting a new design is the result of years of Cadence AWR Design Environment platform Support experience with designs. Pre-design decisions for user interface, simulation, layout, and library configuration lay the groundwork for a successful and efficient AWR design. This blog, part 2, covers the layout and component library considerations designers should note prior to starting a design.(read more)





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Training Webinar: Microwave Office: An Integrated Environment for RF and Microwave Design

A recording of a training webinar on Microwave Office is available. Topics show the design environment, with special emphasis placed on electromagnetic (EM) simulation. Normal 0 false false false EN-US JA X-NONE ...(read more)




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Designing a 30MHz to 1000MHz 10W GaN HEMT Power Amplifier

By David Vye, Senior Product Marketing Manager, AWR, Cadence When designing multi-octave high-power amplifiers, it is a challenge to achieve both broadband gain and power matching using a combination of lumped and distributed techniques. One approach...(read more)




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read from text file with two values and represent that as voltage signals on two different port a and b

i want to read from text file two values  on two ports , i wrote  that  code, and i have that error that shown in the image below . and also the data in text file is shown as screenshot

 


module read_file (a,b);

electrical a,b;
integer in_file_0,data_value, valid, count0,int_value;


analog begin
@(initial_step) begin
in_file_0 = $fopen("/home/hh1667/ee610/my_library/read_file/data2.txt","r");

valid = $fscanf (in_file_0, "%b,%b" ,int_value,count0);
end

V(a) <+ int_value;
V(b) <+ count0;

end

endmodule




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In Simvision, how do I change the waveform font size of the signal names?

Hi Cadence, 

I use simvision 20.09-s007 but my computer screen resolution is very high. As a result, the texts are too small. 

In ~/.simvision/Xdefaults I changed that number to 16, from 12. But the signal names in the waveform traces don't reflect the change. 

Simvision*Font: -adobe-helvetica-medium-r-normal--16-*-*-*-*-*-*-*

Other .font changes seem to reflect on the simvision correctly, except the signal names. 

How do I fix that? I dont mind a single variable to change all the texts fonts to 16. 

Thank you!

PS: I found the answer with another post. I change Preference/Waveform/Display/Signal Height. 




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copy paste circuit from one schematic design to another

Hi, have two designs and would like to copy paste one area of circuit from the old design to the new design, best way/approach and guidance please..




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Regarding the loading of waveform signals in the waveform windown using the tcl command

Hello,

I am trying to load some of the signals of the design saved in the signals.svwf to the waveform windown via the tcl file, I am using the following commands but nothing works, Can you please help 

 -submit waveform loadsignals -using "Waveform 2" FB1.svwf but it gives me the below error

-submit waveform new -reuse -name Waveforms




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how to tell conformal to ignore certain combination of input

hi

How can I tell the LEC tool to ignore a combination of Primary input bus in both Golden and revised.

For example in both Golden and revised there is 

input [3:0] data_in

I want LEC not to check the case that data_in[3:0] == 4'b1000




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Want to use Transmission Gate in my design?

I want to use a transmission gate in my design, but it is not available as a standard cell for Genus RTL synthesis. How can I perform an analysis of area, power, and critical path delay that includes the transmission gate alongside standard cells?

Could you provide guidance or a methodology for integrating custom cells, like the transmission gate, into the synthesis flow for accurate analysis?




ign

which tools support Linting for early stages of Digital Design flow?

I am trying to understand the Linting process. I know that mainly JasperGold is the tool for this purpose. Though I think JasperGold is more suited for later stages of the design. As a RTL Design Engineer, I want to make sure that if another tool has the capability of doing Linting earlier in the flow. for example, does Xcelium, Genus or Confomal support linting. I have seen some contradicting information online regarding this topic, though I can't find anything related to Linting on any of these tools.

Thanks




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Moving Beyond EDA: The Intelligent System Design Strategy

The rising customer expectations, intermingling fields and high performance needs can be satisfied with the system based design. An intelligent Systems Design strategy can offer a quicker route to an optimum design and helps to increase designers' productivity and analyzes efficiency by providing the ability to explore the entire design space. Cadence Intelligent System Strategy enables a system design revolution and reduces project schedules with optimized continuous integration.(read more)




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BoardSurfers: Some Wisdom from Designing for a High-Volume Production OEM

At what stage in the design cycle do you start to think about the PCB material costs? What about the costs to assemble the PCB? Once a design becomes successful, should you then redesign it to achieve a scalable product? Placing components and routi...(read more)




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OrCAD X – The Anytime Anywhere PCB Design Platform

OrCAD X is the next-generation integrated PCB design platform. It brings to you a powerful cloud-enabled design solution that includes design and library data management integrated with the proven PCB design and analysis product portfolio of Cad...(read more)




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DesignCon Best Paper 2024: Addressing Challenges in PDN Design

Explore Impacts of Finite Interconnect Impedance on PDN Characterization

Over the past few decades, many details have been worked out in the power distribution network (PDN) in the frequency and time domains. We have simulation tools that can analyze the physical structure from DC to very high frequencies, including spatial variations of the behavior. We also have frequency- and time-domain test methods to measure the steady-state and transient behavior of the built-up systems.

All of these pieces in our current toolbox have their own assumptions, limitations, and artifacts, and they constantly raise the challenging question that designers need to answer: How to select the design process, simulation, measurement tools, and processes so that we get reasonable answers within a reasonable time frame with a reasonable budget.

Read this award-winning DesignCon 2024 paper titled “Impact of Finite Interconnect Impedance Including Spatial and Domain Comparison of PDN Characterization.” Led by Samtec’s Istvan Novak and written with a team of nine authors from Cadence, Amazon, and Samtec, the paper discusses a series of continually evolving challenges with PDN requirements for cutting-edge designs.

Read the full paper now: “Impact of Finite Interconnect Impedance Including Spatial and Domain Comparison of PDN Characterization.”




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Using Voltus IC Power Integrity to Overcome 3D-IC Design Challenges

Power network design and analysis of 3D-ICs is a major challenge due to the complex nature and large size of the power network. In addition, designers must deal with the complexity of routing power through the interposer, multiple dies, through-silicon vias (TSVs), and through-dielectric vias (TDVs).
Cadence’s Integrity 3D-IC Platform and Voltus IC Power Integrity Solution provide a fully integrated solution for early planning and analysis of 3D-IC power networks, 3D-IC chip-centric power integrity signoff, and hierarchical methods that significantly improve capacity and performance of power integrity (PI) signoff while maintaining a very high level of accuracy at signoff. This blog summarizes the typical design challenges faced by today’s 3D-IC designers, as discussed in our recent webinar, “Addressing 3D-IC Power Integrity Design Challenges.” Please click here to view the full webinar.

Major Trends in Advanced Chip Design

From chips to chiplets, stacked die, 3D-ICs, and more, three major trends are impacting advanced semiconductor packaging design. The first is heterogenous integration, which we define as a disaggregated approach to designing systems on chip (SoCs) from multiple chiplets. This approach is similar to system-in-package (SiP) design, except that instead of integrating multiple bare die  including 3D stacking – on a single substrate, multiple IPs are integrated in the form of chiplets on a single substrate.

The second major trend is around new silicon manufacturing techniques that leverage silicon vias (TSVs) and high-density fanout RDL. These advancements mean that silicon is becoming a more attractive material for packaging, especially when high bandwidth and form factor become key attributes in the end design. This brings new design and verification challenges to most packaging engineers who typically work with organic and ceramic substrate materials.

Finally, on the ecosystem side, all the large semiconductor foundries now offer their own versions of advanced packaging. This brings new ways of supporting design teams with technologies like reference flows and PDKs, concepts that have typically been lacking in the packaging community. Cadence has worked with many of the leading foundries and outsourced semiconductor assembly and test facilities (OSATs) to develop multi-chip(let) packaging reference flows and package assembly design kits. The downside is that, with the time restrictions designers are under today, there isn’t enough time to simulate the details of these flows and PDKs further.

For those who must make the best electro/thermal/physical decisions to achieve the best power/performance/area/cost (PPAC), factors can include accurate die size estimations, thermal feasibility, die-to-die interconnect planning, interposer planning (silicon/organic), front-to-front and front-to-back (F2F/F2B) planning, layer stack and electromigration/ IR drop (EMIR)/TSV planning, IO bandwidth feasibility, and system-level architecture selection.

3D-IC Power Network Design and Analysis

The key to success in 3D-IC design is early power integrity planning and analysis. Cadence’s Integrity 3D-IC platform is a high-capacity 3D-IC platform that enables 3D design planning, implementation, and system analysis in a single, unified cockpit. Cadence’s Voltus IC Power Integrity Solution is a comprehensive full chip electromigration, IR drop, and power analysis solution. With its fully distributed architecture and hierarchical analysis capabilities, Voltus provides very fast analysis and has the capacity to handle the largest designs in the industry. Typically, 3D-IC PDN design and analysis is performed in four phases, as shown in Figure 1.

Phase 1 - Perform early power delivery network (PDN) exploration with each fabric’s PDN cascaded in system PI with early circuit models.

Phase 2 – Plan 3D-IC PDNs in Cadence’s Integrity 3D-IC platform, including micro bumps, TSVs, and through dielectric vias (TDVs), power grid synthesis for dies, and early rail analysis and optimization.

Phase 3 – Perform full chip-centric signoff in Voltus with detailed die, interposer, and package models, including chip die models, while keeping some dies flat.

Phase 4 – Perform full system-level signoff with Cadence’s Sigrity SystemPI using detailed extracted package models from Sigrity XtractIM, board models from Sigrity PowerSI or Clarity 3D Solver, interposer models from XtractIM or Voltus, and chip power models from Voltus.

Figure 1. 3D-IC PDN design and analysis phases

3D-IC Chip-Centric Signoff

The integration of Integrity 3D-IC and Voltus enables chip-centric early analysis and signoff. Figure 2 and Figure 3 highlight the chip centric early PI optimization and signoff flows. In early analysis, the on-chip power networks are synthesized, and the micro bumps and TSVs can be placed and optimized. In the signoff stage, all the detailed design data is used for power analysis, and detailed models are extracted and used for package, interposer, and on-die power networks.


Figure 2. Early chip-centric PI analysis and optimization flow

Figure 3. Chip-centric 3D-IC PI signoff

Hierarchical 3D-IC PI Analysis

To improve the capacity and performance of 3D-IC PI analysis, Voltus enables hierarchical analysis using chiplet models. Chiplet models can be reduced chip models in spice format or more accurate xPGV models which are highly accurate proprietary models generated by Voltus. With xPGV models, the hierarchical PI analysis has almost the same accuracy as flat analysis but offers 10X or higher benefit in runtime and memory requirements.

Conclusion

This blog has highlighted the major design trends enabled by advanced 3D packaging and the design challenges arising from these advancements. The design of power delivery networks is one of these major challenges. We have discussed Cadence solutions to overcome this PI challenge. To learn more, view our recent webinar, "Addressing 3D-IC Power Integrity Design Challenges" and visit the Voltus web page.




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BoardSurfers: Optimizing Designs with PCB Editor-Topology Workbench Flow

When it comes to system integration, PCB designers need to collaborate with the signal analysis or integrity team to run pre-route or post-route analysis and modify constraints, floorplan, or topology based on the results. Allegro PCB Edito...(read more)




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Modern Thermal Analysis Overcomes Complex Design Issues

Melika Roshandell, Cadence product marketing director for the Celsius Thermal Solver, recently published an article in Designing Electronics discussing how the use of modern thermal analysis techniques can help engineers meet the challenges of today’s complex electronic designs, which require ever more functionality and performance to meet consumer demand.

Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These requirements make scaling traditional, flat, 2D-ICs very challenging. With the recent introduction of 3D-ICs into the electronic design industry, IC vendors need to optimize the performance and cost of their devices while also taking advantage of the ability to combine heterogeneous technologies and nodes into a single package. While this greatly advances IC technology, 3D-IC design brings about its own unique challenges and complexities, a major one of which is thermal management.

To overcome thermal management issues, a thermal solution that can handle the complexity of the entire design efficiently and without any simplification is necessary. However, because of the nature of 3D-ICs, the typical point tool approach that dissects the design space into subsections cannot adequately address this need. This approach also creates a longer turnaround time, which can impact critical decision-making to optimize design performance. A more effective solution is to utilize a solver that not only can import the entire package, PCB, and chiplets but also offers high performance to run the entire analysis in a timely manner.

Celsius Thermal Management Solutions

Cadence offers the Celsius Thermal Solver, a unique technology integrated with both IC and package design tools such as the Cadence Innovus Implementation System, Allegro PCB Designer, and Voltus IC Power Integrity Solution. The Celsius Thermal Solver is the first complete electrothermal co-simulation solution for the full hierarchy of electronic systems from ICs to physical enclosures. Based on a production-proven, massively parallel architecture, the Celsius Thermal Solver also provides end-to-end capabilities for both in-design and signoff methodologies and delivers up to 10X faster performance than legacy solutions without sacrificing accuracy.

By combining finite element analysis (FEA) for solid structures with computational fluid dynamics (CFD) for fluids (both liquid and gas, as well as airflow), designers can perform complete system analysis in a single tool. For PCB and IC packaging, engineering teams can combine electrical and thermal analysis and simulate the flow of both current and heat for a more accurate system-level thermal simulation than can be achieved using legacy tools. In addition, both static (steady-state) and dynamic (transient) electrical-thermal co-simulations can be performed based on the actual flow of electrical power in advanced 3D structures, providing visibility into real-world system behavior.

Designers are already co-simulating the Celsius Thermal Solver with Celsius EC Solver (formerly Future Facilities’ 6SigmaET electronics thermal simulation software), which provides state-of-the-art intelligence, automation, and accuracy. The combined workflow that ties Celsius FEA thermal analysis with Celsius EC Solver CFD results in even higher-accuracy models of electronics equipment, allowing engineers to test their designs through thermal simulations and mitigate thermal design risks.

Conclusion

As systems become more densely populated with heat-dissipating electronics, the operating temperatures of those devices impact reliability (device lifetime) and performance. Thermal analysis gives designers an understanding of device operating temperatures related to power dissipation, and that temperature information can be introduced into an electrothermal model to predict the impact on device performance. The robust capabilities in modern thermal management software enable new system analyses and design insights. This empowers electrical design teams to detect and mitigate thermal issues early in the design process—reducing electronic system development iterations and costs and shortening time to market.

To learn more about Cadence thermal analysis products, visit the Celsius Thermal Solver product page and download the Cadence Multiphysics Systems Analysis Product Portfolio.




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Allegro X APD: SPB 23.1 release —Your freedom to design boldly!

Cadence is super excited to announce SPB 23.1 release —Your freedom to design boldly 

These tools help engineers build better PCBs faster with the new 3D engine and optimized interface.  

We have been hard at work to bring you this release and believe that it will help you take control of the PCB design process with the powerful new features in Allegro X APD like: 

  • Packaging Support in 3DX Canvas 

  • 3DX Wire DRCs 

  • Aligning Components by Offset 

  • Text Wizard Enhancements 

  • Device File Reuse for Existing Components for Netlist and Logic Import 

 

Watch this space to know all about What’s New in SPB 23.1.  

 

Regards 

Team PCBTech 

Cadence Design System 

For individuals, small businesses, or teams, START YOUR FREE TRIAL. 

 




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Aligning Components using Offset Mode in Allegro X APD

Starting SPB 23.1, in Allegro X PCB Editor and Allegro X Advanced Package Designer, you can align components by using offset mode. Earlier only spacing mode was available.

Follow these steps to Align Components using Offset Mode:

  1. Set Application Mode to Placement Edit.
  2. Drag the components that need to be aligned and right-click and choose Align Components.
  3. Now, in the Options tab, you will notice Spacing Section with Equal Offset. You can equally and individually offset the components by using the +/- buttons for increment or decrement.




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What is Allegro X Advanced Package Designer and why do I not see Allegro Package Designer Plus (APD+) in 23.1?

Starting SPB 23.1, Allegro Package Designer Plus (APD+) has been rebranded as Allegro X Advanced Package Designer (Allegro X APD).

The splash screen for Allegro X APD will appear as shown below, instead of showing APD+ 2023:

For the Windows Start menu in 23.1, it will display as Allegro X APD 2023 instead of APD+ 2023, as shown below

23.1 Start menu 

In the Product Choices window for 23.1, you will see Allegro X Advanced Package Designer in the place of Allegro Package Designer +, as shown below: 

23.1 product title




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Introducing new 3DX Canvas in Allegro X Advanced Package Designer

Have you heard that starting SPB 23.1, Allegro Package Designer Plus (APD+) will be renamed as Allegro X Advanced Package Designer (Allegro X APD)? 

Allegro X APD offers multiple new features and enhancements on topics like Via Structures, Wirebond, Etchback, Text Wizards, 3D Canvas, and more. 

This post presents the new 3DX Canvas introduced in SPB 23.1. This can be invoked from Allegro X APD (from the menu item View > 3DX Canvas). 

Some of the key benefits of the new canvas: 

  • This canvas addresses the scale and complexity in large modern package designs. It provides highly efficient visual representation and implementation of packages. 
  • The new architecture enables high-performance 3D incremental updates by utilizing GPU for fast rendering. 

  • Real-time 3D incremental updates are supported, which means that the 3D view is in sync with all changes to the database. 

  • The new canvas provides 3D visualization support for packaging objects such as wire bonds, ball, die bump/pillar geometries, die stacks, etch back, and plating bar. 

  • This release also introduces the interactive measurement tool for a 3D view of packages. Once you open 3DX Canvas, press the Alt key and you can select the objects you want to measure. 
  • 3DX Canvas provides new 3D DRC Bond Wire Clearances with Real 3D DRC Checks. True 3D DRC in Constraint Manager has been introduced. If you open Constraint Manager, there will be a new worksheet added. Following DRC checks are supported: 
    Wire to Wire 
    Wire to Finger 
    Wire to Shape 
    Wire to Cline 
    Wire to Component




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Creating Power and Ground rings in Allegro X Package Designer Plus

Power and Ground rings are exposed rings of metal surrounding a die that supply power/ground to the die and create a low-impedance path for the current flow. These rings ensure stable power distribution and reduce noise. Allegro X Package Designer Plus has a utility called Power/Ground Ring Generator which lets you define and place one or more shapes in the form of a ring around a die.

 To run the PWR/GND Generator Wizard, go to Route > Power/Ground Ring Generator or type "pring wizard" in the APD command window to invoke the Wizard.

   

This Wizard lets you define and place one or more shapes in the form of a ring around a die. The Power/Ground Ring Wizard creates up to 12 rings (shapes) at a time. If you require more rings, you can run the Power/Ground Ring Wizard as many times as needed. This command displays a wizard in which you can specify:

  • The number of rings to be generated
  • The creation of the first ring as a die flag (Die flag is the boundary of the die like the power ring.)
    • If you create a die flag and the first ring is the same net as the flag, you can enter a negative distance to overlap the ring and the die flag.
  • Multiple options for placement of the rings with respect to:
    • Origination point
    • Distance from the edge of the die
    • Distance from the nearest die pin on each die side
  • The reference designator of the die with which the rings will be used
  • The distance between rings
  • The width of each ring
  • The corner types on each ring (arc, chamfer, and right-angle)
  • An assigned net name for each ring
  • A label for each ring

The rings are basic in nature. For other shape geometries or split rings, choose Shape > Polygon or Shape > Compose/Decompose Shape from the menu in the design window.

Depending on the options selected, the Power/Ground Ring Wizard UI changes, representing how the rings will be created. Verify the Wizard settings to ensure that the rings are created as intended.

  1. When the Power/Ground Ring Wizard appears, set the number of rings to 2, accept the other defaults, and click Next. You can set Create first ring as die flag to create a basic die flag.

         2. Define Ring 1 and the net associated with it.

              a) Browse and choose Vss in the Net Names dialog box.

            b) Click OK.

            c) Specify the label as VSS.

            d) Click Next.

             The first ring should appear in your design. It is associated with the proper net; in this case, VSS.

  1. For the second ring, choose the net as Vdd and specify the label as VDD.
  2. Click Next.
  3. Click Finish in the Result Verification screen to complete the process.

The completed rings appear as shown below.

Now, when you click on Power and Ground Die Pin and add wirebonds, you will see that the wirebonds are placed directly on the Power and Ground rings.




ign

Package Design Integrity Checks

When things go wrong with your package design flow, it can sometimes be difficult to understand the cause of the issue. This can be something like a die component is wrongly identified as a BGA, a via stack has an alignment issue, or there are duplicate bondwires. These are just a few examples of issues; there can be many more. When interactive messages and log files do not help determine the problem, the Package Design Integrity Check tool becomes very handy. This feature lets you run integrity checks, which ensures that the database is configured correctly. 

To invoke the command from Allegro X Advanced Package Designer, use the Tools > Package Design Integrity menu. 

Or type package integrity at the Command  prompt. 

The Package Design Integrity Checks dialog box includes all categories and checks currently registered for the currently running product. You can enable all these categories and checks or only the one that you want to run. This utility can fix errors automatically (where possible). Errors and warnings are written to the “package_design_check.log” file.  

The utility can also be extended with your own custom rules based on your specific flows and needs. 




ign

How to transfer etch/conductor delays from Allegro Package Designer (APD) to pin delays in Allegro PCB Editor

The packaging group has finished their design in Allegro Package Designer (APD) and I want to use the etch/conductor delay information from the mcm file in the board design in Allegro PCB Designer. Is there a method to do this?

This can be done by exporting the etch/conductor data from APD and importing it as PIN_DELAY information into Allegro PCB Editor.

If you are generating a length report for use in Allegro Pin Delay, you should consider changing the APD units to Mils and uncheck the Time Delay Report.

In Allegro Package Designer:

  1. Select File > Export > Board Level Component.
  2. Select HDL for the Output format and select OK.

       3. Choose a padstack for use when generating the component and select OK.

This will create a file, package_pin_delay.rpt, in the component subdirectory of the current working directory. This file will contain the etch/conductor delay information that can be imported into Allegro.

In Allegro PCB Editor:

  1. Make sure that the device you want to import delays to is placed in your board design and is visible.
  2. Select File > Import > Pin delay.
  3. Browse to the component directory and select package_pin_delay.rpt. The browser defaults to look for *.csv files so you will need to change the Files of type to *.* to select the file.
  4. You may be prompted with an error message stating that the component cannot be found and you should select one. If so, select the appropriate component.
  5. Select Import.
  6. Once the import is completed, select Close.

Note: It is important that all non-trace shapes have a VOLTAGE property so they will not be processed by the the 2D field solver. You should run Reports > Net Delay Report in APD prior to generating the board-level component. This will display the net name of each net as it is processed. If you miss a VOLTAGE property on a net, the net name will show in the report processing window, and you will know which net needs the property.




ign

Using oscillograph waveform file CSV as the Pspice simulation signal source

hi,

     I save the waveform file of the oscilloscope as CSV file format.

     Now, I need to use this waveform file as the source of the low-pass filter .

     I searched and read the PSPICE help documents, and did not find any  methods. 

     How to realize it?

     Are there any reference documents or examples?

     Thanks!

    




ign

How to design enhancement mode eGaN (EPC8002) switch in cadence

Hi,

I need to design EPC8002 eGaN switch in cadence. Can someone provide me step by step guide on hoe to add EPC8002 into my cadence. I am working on BCD180.

Thank you 

Ihsan




ign

How Do You Ensure the Reliability of Your Design in Virtuoso Studio?

Designers have long recognized the need to analyze the reliability of ICs. Two commonly used approaches for performing reliability analysis include calculating the change in device degradation and relying on safe operating checks in circuit simulators. 

With the advent of the ever-increasing use of ICs in mission-critical applications, the need for reliable reliability analysis has become of paramount importance. Over the years, you have been using reliability analysis in Virtuoso ADE Assembler and Virtuoso ADE Explorer to measure and review aging effects, such as device characteristic degradations, model parameter changes, self-heating effects, and so on.

Reliability analysis can be performed using two modes: Spectre native and RelXpert. The reliability analysis analyzes the effect of time on circuit performance drift and predicts the reliability of designs in terms of performance. In ADE Assembler, you can run the reliability simulation for fresh test (when time is zero), stress test (to generate degradation data), and aged test (at specific intervals, such as one year, three years, or 10 years). In the stress test, extreme environmental conditions are used to stress devices before aging analysis.

The following figure shows the reliability simulation flow.

 

 

The Reliability Options form has the following four tabs: 

  • Basic: Enables you to specify analysis type, aging options, start and stop time of reliability simulation, and options related to device masking, degradation ratio, and lifetime calculation. 
  • Modeling: Enables you to choose the modeling type you want to use during reliability simulation. 
  • Degradation: Enables you to specify the options to print device and subcircuit degradation information into a .bt0 file. 
  • Output: Enables you to specify the degradation reports to be generated and methods to filter degradation results in the reports.

While the Basic and the Output tabs are used by design engineers, the Modeling and the Degradation tabs are primarily used by model developers.

 

Reviewing degradation reports in text or XML formats can be a tiresome exercise because degradation data can be large and can contain a large number of instances due to advanced technology nodes and post-layout simulations. For you to work effectively and interactively with these reports, the new reliability report is based on the SQLite database, which adds the benefit of improved performance and capabilities of sorting and filtering reliability data using SQLite operators.

 

As they say, watching this in action might help you more than reading about it, so please take a look at our Training Bytes video channel, which offers many helpful videos on how to run Reliability Analysis in Virtuoso Studio.

All the related videos are linked together in a channel so that you can easily access and watch as many as you like.

Reliability Analysis in Virtuoso Studio

 

Want to Learn More?

For lab instructions and a downloadable design, enroll for the online training courses of your interest on

Reliability Analysis in Virtuoso Studio vIC23.1 (Online)

 Training is also available as "Blended" or "live" class.

Digital Badge Available

You can become Cadence Certified once you complete the course (s) and share your knowledge and certifications on social media channels. Go straight to the course exam at the Learning and Support Portal.

Note: Some of the above links are accessible only to Cadence customers who have a valid login ID for the Cadence Learning and Support Portal.

Do You Have Access to the Cadence Support Portal?

If not, follow the steps below to create your account.

  • On the Cadence Support portal, select Register Now and provide the requested information on the Registration page.
  • You will need an email address and host ID in order to sign up.
  • If you need help with registration, contact support@cadence.com.

To stay up-to-date with the latest news and information about Cadence training and webinars, subscribe to the Cadence Training emails.

If you have questions about courses, schedules, online, public, or live onsite training, reach out to us at Cadence Training.

Related Resources

  Training Bytes (Videos)

Virtuoso ADE Explorer Graphical User Interface

What is the need for Reliability Analysis? (Video)

  Blogs

Come Join Us and Learn from the Cadence Training Offerings

It’s the Digital Era; Why Not Showcase Your Brand Through a Digital Badge!

  Online Course

Reliability Analysis in Virtuoso Studio vIC23.1 (Online)

 

About Knowledge Booster Training Bytes

Knowledge Booster Training Bytes is an online journal that relays information about Cadence Training videos, online courses, and upcoming webinars that are available in the Learning section of the Cadence Learning and Support portal. This blog category brings you direct links to these videos, courses, and other related material on a regular basis.

Niyati Singh

On behalf of the Cadence Training team




ign

Start Your Engines: Optimizing Mixed-Signal Simulation Efficiency

During a mixed-signal simulation, the analog engine usually dominates the simulation time and resources. If you need to run only the analog engine in several windows, or if you would like to to run multiple tests of the same circuit with different stimuli or test pattern, then you need to run the simulation multiple times. View this blog to know more about the the two advanced technologies that Spectre AMS Designer provides to help you improve the efficiency of your mixed-signal designs and to increase the simulation speed.(read more)




ign

Start Your Engines: Create and Insert Connect Modules for Mixed-Signal Verification

Read this blog to know how you can easily create and insert connect modules using Spectre AMS Designer with the Verilog-AMS standard language defined by Accellera. (read more)




ign

Virtuoso Studio IC 23.1: Using Net Tracer for Design Review

This blog explores how Virtuoso Studio Net Tracer can help you perform a design review.

We’ll use the net connectivity option, which allows the user to get a clean highlighted net. You can use the Net Tracer tool to highlight the nets. You can find the Net Tracer command under the connectivity pulldown menu in the layout window.

Trace manager and the ability to display different islands on the same net with other colors, you can identify and connect the unconnected islands as you wish.

The Net Tracer utility traces the nets in the physical view (layout). The trace is a highlighted net, which is a non-selectable object. The Net Tracer utility is available from Virtuoso Layout Suite XL onwards. You can use this utility based on your specific needs and preferences.

For a better understanding of the Net Tracer feature, let’s see one scenario between the circuit designer and layout engineer for a layout design review.

Circuit designer: Can we go through the routed input nets “inm” and “inp”?

Layout engineer: From the below layout view where they are highlighted using the XL connectivity, today I will use Net Tracer utility for the design review.

Circuit designer: I have never heard of this feature. Let's see how it works.

Layout engineer: Sure, now we turn on the Net Tracer toolbar using the below option.

You see the Net Tracer options form here:

As you can see on my screen, I have opened the layout view and engaged the Net Tracer utility.

Net Tracer allows shapes to be traced on a net in two tracing modes, namely, physical and logical, where shapes on the same net are physically or logically connected.

Physical tracing gathers all the shapes physically connected on the same net.

Logical tracing gathers all the shapes assigned to the same net. It highlights the net as in the source design (schematic). It will highlight shapes on the same net, even if they are isolated shapes that are not physically connected.

For this scenario, let us use physical tracing for input nets “inm” and “inp."

Highlighted nets are shown below:

Net “inm”                    Net “inp”                   Nets “inm” and “inp” 

      

Net Tracer has features like physical and logical tracing, preview, step-by-step mode, ease of tracing a net on a shape out of multiple underlying shapes, and so on.

Let us explore logical tracing for output nets “outm” and “outp”:

Here, you can see how to enable true color and halo before enabling logical tracing to identify the metal route. After enabling the true color halo, enable the logical trace.

Here, I am opening the trace manager to search “outm” and “outp” and click trace. That will trace the particular nets as shown.

Net Tracer has a preview feature, which is helpful in terms of the number of previewed objects. This preview capability hints at how the trace would appear when you create it. This useful feature in Virtuoso Studio highlights both completed and incomplete nets, helping the user better understand the status of the highlighted nets.

Circuit designer: Thanks for the design review. You have done good work. Net Tracer clearly shows both types of tracing, and it was even easy for the circuit designer to understand.

Layout engineer: Let me share the link to the Net Tracer RAK, where other layout engineers can explore many more amazing features of the Net Tracer.

Do You Have Access to the Cadence Support Portal?

If not, follow the steps below to create your account.

  • On the Cadence Support portal, select Register Now and provide the requested information on the Registration page.
  • You will need an email address and host ID to sign up.
  • If you need help with registration, contact support@cadence.com.

To stay up to date with the latest news and information about Cadence training and webinars, subscribe to the Cadence Training emails.

If you have questions about courses, schedules, online, public, or live onsite training, reach out to us at Cadence Training.

For any questions, general feedback, or future blog topic suggestions, please leave a comment.

Become Cadence Certified

Cadence Training Services now offers digital badges for this training course. These badges indicate proficiency in a certain technology or skill and give you a way to validate your expertise to managers and potential employers. You can highlight your expertise by adding these digital badges to your email signature or any social media platform, such as Facebook or LinkedIn. To become Cadence Certified, you can find additional information here.

Related Resources

 Videos

Invoking the MarkNet, Net Tracer command and its options

Net Tracer Features

Video: Net Tracer saving and loading saved trace, neighboring shapes of trace

Net Tracer: Physical Tracing – Step mode

Net Tracer: Physical and Logical Tracing

Video: Net Tracer show preview option, from net and display options, shape count in trace

Video: Net Tracer using a constraint group with different display mode settings and  using the Trace Manager GUI

 RAK

Introduction to Net Tracer

 Product manual

Virtuoso Layout Suite XL: Connectivity Driven Editing User Guide IC23.1

About Knowledge Booster Training Bytes

Knowledge Booster Training Bytes is an online journal that relays information about Cadence Training videos, online courses, and upcoming webinars that are available in the Learning section of the Cadence Learning and Support portal. This blog category brings you direct links to these videos, courses, and other related material on a regular basis.

Sandhya.

On behalf of the Cadence Training team




ign

Can I align pin numbers in edit part windows in Orcad Capture?

Hello..

I'm updating part in part editor in orcad capture, and I wonder how to align pin numbers using menu or tcl/tk command.

Please, let me know. Thank you.




ign

17.4 Design Sync Fails without providing errors

As the title suggests I am unable to perform design sync between OrCAD Capture and Allegro. When I add a layout and try to sync to it I am given ERROR(ORCAP-2426): Cannot run Design Sync because of errors. See session log for error details.

Session Log

[ORPCBFLOW] : Invoking ECO dialog.
INFO(ORNET-1176): Netlisting the design
INFO(ORNET-1178): Design Name:
C:USERSDDOYLEDOCUMENTSCADENCEBOARDSREMOTE POWER DEVICECAPTUREREMOTE_POWER_DEVICE.DSN
Netlist Directory:
c:usersddoyledocumentscadenceoards emote power devicelayoutallegro
Configuration File:
C:CadenceSPB_17.4 ools/capture/allegro.cfg
pstswp.exe - pst - d "C:USERSDDOYLEDOCUMENTSCADENCEBOARDSREMOTE POWER DEVICECAPTUREREMOTE_POWER_DEVICE.DSN"- n "c:usersddoyledocumentscadenceoards emote power devicelayoutallegro" - c "C:CadenceSPB_17.4 ools/capture/allegro.cfg" - v 3 - l 31 - s "" - j "PCB Footprint" - hpath "HPathForCollision"
Spawning... pstswp.exe - pst - d "C:USERSDDOYLEDOCUMENTSCADENCEBOARDSREMOTE POWER DEVICECAPTUREREMOTE_POWER_DEVICE.DSN"- n "c:usersddoyledocumentscadenceoards emote power devicelayoutallegro" - c "C:CadenceSPB_17.4 ools/capture/allegro.cfg" - v 3 - l 31 - s "" - j "PCB Footprint" - hpath "HPathForCollision"
{ Using PSTWRITER 17.4.0 d001Dec-14-2021 at 09:00:49 }

INFO(ORCAP-36080): Scanning netlist files ...

Loading... c:usersddoyledocumentscadenceoards emote power devicelayoutallegropstchip.dat

Loading... c:usersddoyledocumentscadenceoards emote power devicelayoutallegropstchip.dat

Loading... c:usersddoyledocumentscadenceoards emote power devicelayoutallegropstxprt.dat

Loading... c:usersddoyledocumentscadenceoards emote power devicelayoutallegropstxnet.dat
packaging the design view...
Exiting... pstswp.exe - pst - d "C:USERSDDOYLEDOCUMENTSCADENCEBOARDSREMOTE POWER DEVICECAPTUREREMOTE_POWER_DEVICE.DSN"- n "c:usersddoyledocumentscadenceoards emote power devicelayoutallegro" - c "C:CadenceSPB_17.4 ools/capture/allegro.cfg" - v 3 - l 31 - s "" - j "PCB Footprint" - hpath "HPathForCollision"
INFO(ORNET-1179): *** Done ***

This issue started to occur after I changed parts that exist on previously created PCBs. I changed the following leading up to this:

1. Added height in Allegro to many of my components using the Setup->Area->Package Height tool.

2. Changed the reference designator category in OrCAD Capture to TP for several components on board.

Any advice here would be most welcome. Thanks!




ign

Allegro PCB Design Link issue

Hi All

I followed tutorial video below for using Design link

https://www.youtube.com/watch?v=f9JmFF8lqA0

and I followed the video with embedded board design file which should be same one on video

I did every set. but  at 2:55 of video, Steve have the tabs of both design names on top of Constraint Manager in video

but my one didn't exist them

which one would be different?

there was some comment on command windows but I think they would not be problem here

regard




ign

Verilog-A: Can I ignore WARNING (VACOMP-1047)

I need to include Verilog-A files which live outside the Cadence ecosystem (i.e., they are not in veriloga views but rather are just text files) into a veriloga view. These external modules are not compatible with OA (parametized port widths) so I can't put them into cellviews and hook them together using schematics.

Example: I have a cellview "test" which has a symbol and veriloga view. I have three "externaI" modules mod1 (inside an external file mod1.va),  mod2 (inside an external file mod2.va),  and mod3 (inside an external file mod3.va). I instantiate one instance of each module in "module test". The three modules have some parametized ports which are interconnected by parameterized signals p1 and p2. These two signals are strictly local to the module.

At the bottom of the module I use "`include mod1.va", "`mod2.va", etc.

When I check and save test->veriloga it checks all the included modules as well as the "test" module. However, I get a warning:

Warning from spectre during AHDL compile.
WARNING (VACOMP-1047): The Verilog-A file contains more than one module
definition. ADE can process only one module per Verilog-A file. Put
only one module in each Verilog-A file so that ADE can identify pin
names, directions, and hierarchy within each separate module.

Is this just a SUGGESTION that I can safely ignore, or are my included modules going to be ignored?




ign

Force virtuoso (Layout XL) to NOT create warning markers in design

Hi

I have a rather strange question - is there a way to tell layout XL to NOT place the error/warning markers on a design when I open a cell?  I do a lot of my layout by using arrays from placed instances and create mosaics that completely ignore the metadata that Layout XL uses with its bindings with schematic (and instances get deleted etc. but I do like using it to generate all my pins etc.) and it's just really annoying when I open a design that I know is LVS clean and since the connectivity metadata is all screwed up (because I did not use it to actually complete the layout) I have a design that's just blinking at me at every gate, source and drain.  I typically delete them at the high level heirarchically but the second I go in and modify something and come back up it places all of them again.  I know that if I flatten all the p cells it goes away but sometimes it's nice to have that piece of metadata but that's about it.  Is there a way to "break" the features of XL like this?  I realize what a weird question this is but it's becoming more of an issue since we moved to IC 23 from IC 6 where there is no longer a layout L that I can use free from these annoyances that can't use any of the connectivity metadata.

Thanks

Chris




ign

UVM debugging: How to save and load signals during an interactive session in Simvision

Hello,

I am aware of command script .svcf file that saves signals and loads them in while opening Simvision.

I am wondering, if there is a way for saving signals while we are in an interactive session and loading them next time when we open Simvision interactively.

Any ideas on how to do this?

Thank you in advance.

Swetha. C