Hi everyone,

I'm designing a digital chip that will be fabricated. I have a HDL top module that includes several submodules inside it. I want to define the position of some of the submodules during the PnR so that later I can specify there positions in the Micrograph photo after the IC fabrication. When I perform the PnR using Innovus, I always got a layout shape where the submodules seems to be flatted. I wonder if there is a way to specify the placement of each submodule in my top module  (maybe in the tcl file) during the PnR so later I can define there positions in the micrograph photo. 

Thanks in Advance!

Hello,

I am trying to load some of the signals of the design saved in the signals.svwf to the waveform windown via the tcl file, I am using the following commands but nothing works, Can you please help 

 -submit waveform loadsignals -using "Waveform 2" FB1.svwf but it gives me the below error

-submit waveform new -reuse -name Waveforms

Artificial intelligence (AI) is everywhere. Machine learning (ML) and its associated inference abilities promise to revolutionize everything from driving your car to making your breakfast. Verification is never truly complete; it is over when you run...(read more)

Achieving optimal power transfer in RF PCBs hinges on meticulously routed traces that meet specific impedance requirements. Impedance matching is essential to ensure that traces have the same impedance to prevent signal reflection and inefficient pow...(read more)

Explore Impacts of Finite Interconnect Impedance on PDN Characterization

Over the past few decades, many details have been worked out in the power distribution network (PDN) in the frequency and time domains. We have simulation tools that can analyze the physical structure from DC to very high frequencies, including spatial variations of the behavior. We also have frequency- and time-domain test methods to measure the steady-state and transient behavior of the built-up systems.

All of these pieces in our current toolbox have their own assumptions, limitations, and artifacts, and they constantly raise the challenging question that designers need to answer: How to select the design process, simulation, measurement tools, and processes so that we get reasonable answers within a reasonable time frame with a reasonable budget.

Read this award-winning DesignCon 2024 paper titled “Impact of Finite Interconnect Impedance Including Spatial and Domain Comparison of PDN Characterization.” Led by Samtec’s Istvan Novak and written with a team of nine authors from Cadence, Amazon, and Samtec, the paper discusses a series of continually evolving challenges with PDN requirements for cutting-edge designs.

Read the full paper now: “Impact of Finite Interconnect Impedance Including Spatial and Domain Comparison of PDN Characterization.”

Power network design and analysis of 3D-ICs is a major challenge due to the complex nature and large size of the power network. In addition, designers must deal with the complexity of routing power through the interposer, multiple dies, through-silicon vias (TSVs), and through-dielectric vias (TDVs).
Cadence’s Integrity 3D-IC Platform and Voltus IC Power Integrity Solution provide a fully integrated solution for early planning and analysis of 3D-IC power networks, 3D-IC chip-centric power integrity signoff, and hierarchical methods that significantly improve capacity and performance of power integrity (PI) signoff while maintaining a very high level of accuracy at signoff. This blog summarizes the typical design challenges faced by today’s 3D-IC designers, as discussed in our recent webinar, “Addressing 3D-IC Power Integrity Design Challenges.” Please click here to view the full webinar.

Major Trends in Advanced Chip Design

From chips to chiplets, stacked die, 3D-ICs, and more, three major trends are impacting advanced semiconductor packaging design. The first is heterogenous integration, which we define as a disaggregated approach to designing systems on chip (SoCs) from multiple chiplets. This approach is similar to system-in-package (SiP) design, except that instead of integrating multiple bare die – including 3D stacking – on a single substrate, multiple IPs are integrated in the form of chiplets on a single substrate.

The second major trend is around new silicon manufacturing techniques that leverage silicon vias (TSVs) and high-density fanout RDL. These advancements mean that silicon is becoming a more attractive material for packaging, especially when high bandwidth and form factor become key attributes in the end design. This brings new design and verification challenges to most packaging engineers who typically work with organic and ceramic substrate materials.

Finally, on the ecosystem side, all the large semiconductor foundries now offer their own versions of advanced packaging. This brings new ways of supporting design teams with technologies like reference flows and PDKs, concepts that have typically been lacking in the packaging community. Cadence has worked with many of the leading foundries and outsourced semiconductor assembly and test facilities (OSATs) to develop multi-chip(let) packaging reference flows and package assembly design kits. The downside is that, with the time restrictions designers are under today, there isn’t enough time to simulate the details of these flows and PDKs further.

For those who must make the best electro/thermal/physical decisions to achieve the best power/performance/area/cost (PPAC), factors can include accurate die size estimations, thermal feasibility, die-to-die interconnect planning, interposer planning (silicon/organic), front-to-front and front-to-back (F2F/F2B) planning, layer stack and electromigration/ IR drop (EMIR)/TSV planning, IO bandwidth feasibility, and system-level architecture selection.

3D-IC Power Network Design and Analysis

The key to success in 3D-IC design is early power integrity planning and analysis. Cadence’s Integrity 3D-IC platform is a high-capacity 3D-IC platform that enables 3D design planning, implementation, and system analysis in a single, unified cockpit. Cadence’s Voltus IC Power Integrity Solution is a comprehensive full chip electromigration, IR drop, and power analysis solution. With its fully distributed architecture and hierarchical analysis capabilities, Voltus provides very fast analysis and has the capacity to handle the largest designs in the industry. Typically, 3D-IC PDN design and analysis is performed in four phases, as shown in Figure 1.

Phase 1 - Perform early power delivery network (PDN) exploration with each fabric’s PDN cascaded in system PI with early circuit models.

Phase 2 – Plan 3D-IC PDNs in Cadence’s Integrity 3D-IC platform, including micro bumps, TSVs, and through dielectric vias (TDVs), power grid synthesis for dies, and early rail analysis and optimization.

Phase 3 – Perform full chip-centric signoff in Voltus with detailed die, interposer, and package models, including chip die models, while keeping some dies flat.

Phase 4 – Perform full system-level signoff with Cadence’s Sigrity SystemPI using detailed extracted package models from Sigrity XtractIM, board models from Sigrity PowerSI or Clarity 3D Solver, interposer models from XtractIM or Voltus, and chip power models from Voltus.

Figure 1. 3D-IC PDN design and analysis phases

3D-IC Chip-Centric Signoff

The integration of Integrity 3D-IC and Voltus enables chip-centric early analysis and signoff. Figure 2 and Figure 3 highlight the chip centric early PI optimization and signoff flows. In early analysis, the on-chip power networks are synthesized, and the micro bumps and TSVs can be placed and optimized. In the signoff stage, all the detailed design data is used for power analysis, and detailed models are extracted and used for package, interposer, and on-die power networks.

Figure 2. Early chip-centric PI analysis and optimization flow

Figure 3. Chip-centric 3D-IC PI signoff

Hierarchical 3D-IC PI Analysis

To improve the capacity and performance of 3D-IC PI analysis, Voltus enables hierarchical analysis using chiplet models. Chiplet models can be reduced chip models in spice format or more accurate xPGV models which are highly accurate proprietary models generated by Voltus. With xPGV models, the hierarchical PI analysis has almost the same accuracy as flat analysis but offers 10X or higher benefit in runtime and memory requirements.

Conclusion

This blog has highlighted the major design trends enabled by advanced 3D packaging and the design challenges arising from these advancements. The design of power delivery networks is one of these major challenges. We have discussed Cadence solutions to overcome this PI challenge. To learn more, view our recent webinar, "Addressing 3D-IC Power Integrity Design Challenges" and visit the Voltus web page.

Starting SPB 23.1, in Allegro X PCB Editor and Allegro X Advanced Package Designer, you can align components by using offset mode. Earlier only spacing mode was available.

Follow these steps to Align Components using Offset Mode:

1. Set Application Mode to Placement Edit.
2. Drag the components that need to be aligned and right-click and choose Align Components.
3. Now, in the Options tab, you will notice Spacing Section with Equal Offset. You can equally and individually offset the components by using the +/- buttons for increment or decrement.

Starting from SPB23.1, a new option, Allow DRCs to surrounding metal, has been added in the Etch-Back form to allow DRCs to the surrounding objects. form to allow DRCs to the surrounding objects.

The Allow DRCs to surrounding metal option lets you see and adjust objects instead of the current behavior, which sacrifices the width of the mask for the trace.

• When this option is turned off, it maintains the EB mask to another object clearance.
• When this option is enabled, it keeps the EB mask to the EM trace edge clearance and shows a DRC if the EB mask to another object spacing is out of rule.

In a package design, designers often need to perform degassing. This is typically done at the end of the design process before sending the design to the manufacturer.

Degassing is a process where you perforate power planes, voltage planes, and filled shapes in your design. Degassing holes let the gas escape from beneath the metal during manufacturing of the substrate. The perforations or holes for degassing are generally small, having a specified size and shape, and are spaced regularly across the surface of the plane. If the degassing process is not done, it may result in the formation of gas bubbles under the metal, which may cause the surface of the metal to become uneven. After you degas the design, it is recommended to perform electrical verification.

Allegro X APD has degassing features that allow users to automate the process and place holes in the entire shape.

In today’s topic, we will talk about how to avoid adding  degassing holes on a particular shape.

Sometimes, a designer may need to avoid adding degassing holes to a particular shape on a layer. All other shapes on the layer can have degassing holes but not this shape. Using the Layer Based Degassing Parameters option, the designer can set the degassing parameters for all shapes on the layer. Now, the designer would like to defer adding degassing holes for this particular shape.

You may wonder if there is an easy way to achieve this. We will now see how this can be done with the tool.

Once the degassing parameters are set, performing Display > Element on any of the shapes on that layer will show the degassing parameters set.

You can apply the Degas_Not_Allowed property to a shape to specify that degassing should not be performed on this shape, even if the degassing requirements are met. Select the shape and add the property as shown below.

Switch to Shape Edit application mode (Setup > Application mode > Shape Edit) and window-select all shapes on the layer. Then, right-click and select Deferred Degassing > All Off.

Now, all shapes on the layer will have degassing holes except for the shape which has the Degas_Not_Allowed property attached to it.

Cadence Protium prototyping platforms rapidly bring up an SoC or system prototype and provide a pre-silicon platform for early software development, SoC verification, system validation, and hardware regressions. In this Training W ebinar, we will explore debugging using Save/Restart on Protium X2 . This feature saves execution time and lets you focus on actual debugging. The system state can be saved before the bug appears and restartS directly from there without spending time in initial execution. We’ll cover key concepts and applications, explore Save/Restart performance metrics, and provide examples to help you understand the concepts. Agenda: The key concepts of debugging using save/restart Capabilities, limitations, and performance metrics Some examples to enable and use save/restart on the Protium X2 system Date and Time Thursday, November 7, 2024 07:00 PST San Jose / 10:00 EST New York / 15:00 GMT London / 16:00 CET Munich / 17:00 IST Jerusalem / 20:30 IST Bangalore / 23:00 CST Beijing REGISTER To register for this webinar, sign in with your Cadence Support account (email ID and password) to log in to the Learning and Support System*. Then select Enrol to register for the session. Once registered, you’ll receive a confirmation email containing all login details. A quick reminder: If you haven’t received a registration confirmation within 1 hour of registering, please check your spam folder and ensure your pop-up blockers are off and cookies are enabled. For issues with registration or other inquiries, reach out to eur_training_webinars@cadence.com . Want to See More Webinars? You can find recordings of all past webinars here Like This Topic? Take this opportunity and register for the free online course related to this webinar topic: Protium Introduction Training The course includes slides with audio and downloadable lab exercises designed to emphasize the topics covered in the lecture. There is also a Digital Badge available for the training. Want to share this and other great Cadence learning opportunities with someone else? Tell them to subscribe . Hungry for Training? Choose the Cadence Training Menu that’s right for you. To view our complete training offerings, visit the Cadence Training website . Related Courses Protium Introduction Training Course | Cadence Palladium Introduction Training Course | Cadence Related Blogs Training Insights – A New Free Online Course on the Protium System for Beginner and Advanced Users Training Insights – Palladium Emulation Course for Beginner and Advanced Users Related Training Bytes Protium Flow Steps for Running Design on Protium System ICE and IXCOM mode comparison ICE compile flow IXCOM compile flow PATH settings for using Protium System Please see the course learning maps for a visual representation of courses and course relationships. Regional course catalogs may be viewed here

Hello~

As the following circuit shows, VCC+5V_USB is the 4^th power source, connecting the output of power management of diode.There are 3 5V input in the input port of LTC4417.

It’s normal when VCC+5V_USB prodive power with other circuit. However, if I cup VCC+5V_FIRST,VCC+5V_SECOND,VCC+5V_THIRD, 5V voltage will occurred in the VCC+5V_FIRST,VCC+5V_SECOND,VCC+5V_THIRD.

The LTC4417 PDF

Is this phenomance normal ?

Please kindly give me some advice ! Thanks.

hi,

     I save the waveform file of the oscilloscope as CSV file format.

     Now, I need to use this waveform file as the source of the low-pass filter .

     I searched and read the PSPICE help documents, and did not find any  methods. 

     How to realize it?

     Are there any reference documents or examples?

     Thanks!

This blog explores how Virtuoso Studio Net Tracer can help you perform a design review.

We’ll use the net connectivity option, which allows the user to get a clean highlighted net. You can use the Net Tracer tool to highlight the nets. You can find the Net Tracer command under the connectivity pulldown menu in the layout window.

Trace manager and the ability to display different islands on the same net with other colors, you can identify and connect the unconnected islands as you wish.

The Net Tracer utility traces the nets in the physical view (layout). The trace is a highlighted net, which is a non-selectable object. The Net Tracer utility is available from Virtuoso Layout Suite XL onwards. You can use this utility based on your specific needs and preferences.

For a better understanding of the Net Tracer feature, let’s see one scenario between the circuit designer and layout engineer for a layout design review.

Circuit designer: Can we go through the routed input nets “inm” and “inp”?

Layout engineer: From the below layout view where they are highlighted using the XL connectivity, today I will use Net Tracer utility for the design review.

Circuit designer: I have never heard of this feature. Let's see how it works.

Layout engineer: Sure, now we turn on the Net Tracer toolbar using the below option.

You see the Net Tracer options form here:

As you can see on my screen, I have opened the layout view and engaged the Net Tracer utility.

Net Tracer allows shapes to be traced on a net in two tracing modes, namely, physical and logical, where shapes on the same net are physically or logically connected.

Physical tracing gathers all the shapes physically connected on the same net.

Logical tracing gathers all the shapes assigned to the same net. It highlights the net as in the source design (schematic). It will highlight shapes on the same net, even if they are isolated shapes that are not physically connected.

For this scenario, let us use physical tracing for input nets “inm” and “inp."

Highlighted nets are shown below:

Net “inm”                    Net “inp”                   Nets “inm” and “inp” 

Net Tracer has features like physical and logical tracing, preview, step-by-step mode, ease of tracing a net on a shape out of multiple underlying shapes, and so on.

Let us explore logical tracing for output nets “outm” and “outp”:

Here, you can see how to enable true color and halo before enabling logical tracing to identify the metal route. After enabling the true color halo, enable the logical trace.

Here, I am opening the trace manager to search “outm” and “outp” and click trace. That will trace the particular nets as shown.

Net Tracer has a preview feature, which is helpful in terms of the number of previewed objects. This preview capability hints at how the trace would appear when you create it. This useful feature in Virtuoso Studio highlights both completed and incomplete nets, helping the user better understand the status of the highlighted nets.

Circuit designer: Thanks for the design review. You have done good work. Net Tracer clearly shows both types of tracing, and it was even easy for the circuit designer to understand.

Layout engineer: Let me share the link to the Net Tracer RAK, where other layout engineers can explore many more amazing features of the Net Tracer.

Do You Have Access to the Cadence Support Portal?

If not, follow the steps below to create your account.

• On the Cadence Support portal, select Register Now and provide the requested information on the Registration page.
• You will need an email address and host ID to sign up.
• If you need help with registration, contact support@cadence.com.

To stay up to date with the latest news and information about Cadence training and webinars, subscribe to the Cadence Training emails.

If you have questions about courses, schedules, online, public, or live onsite training, reach out to us at Cadence Training.

For any questions, general feedback, or future blog topic suggestions, please leave a comment.

Become Cadence Certified

Cadence Training Services now offers digital badges for this training course. These badges indicate proficiency in a certain technology or skill and give you a way to validate your expertise to managers and potential employers. You can highlight your expertise by adding these digital badges to your email signature or any social media platform, such as Facebook or LinkedIn. To become Cadence Certified, you can find additional information here.

Related Resources

About Knowledge Booster Training Bytes

Knowledge Booster Training Bytes is an online journal that relays information about Cadence Training videos, online courses, and upcoming webinars that are available in the Learning section of the Cadence Learning and Support portal. This blog category brings you direct links to these videos, courses, and other related material on a regular basis.

Sandhya.

On behalf of the Cadence Training team

Hi,

I have a monitor plugged to my laptop using a HDMI to USB adapter. When using this adapter, Allegro runs very slowly. It seems that it is not using my video card.

Is this a known issue with a workaround I can try?

Thanks,

Michael

I have tried replicating the setup described in a previous post (here), with the proposed solution.

The MDL measurements return a value of 0 for all exported result but the first.

Using Viva I can actually see the correct value for each contribution.

I am using :
- Spectre 23.1.0.538.isr10
- Viva IC23.1-64b.ISR8.40

What should I do differently?

Thanks!

**** test.measure ****

Measurement Name   :  noi_test
Analysis Type      :  noise
noi_total             =  6.9282e-06
r1_flicker            =  0
r1_thermal            =  0
r1_total              =  0
r2_flicker            =  0
r2_thermal            =  0
r2_total              =  0

IC 23.1-64b.ISR8.40

Hi all, I'm trying to run an stb analysis in a dspf extracted view via Probe terminal. The instance exist in the dspf and I already prepended the X that is placed in the dspf extraction.

Spectre complains with the following error:

Error found by spectre during STB analysis `stb'.
    ERROR (SPECTRE-16408): The probe parameter must be specified to perform stability analysis.

Analysis `stb' was terminated prematurely due to an error.

What is missing here?

Hello,
I'm trying to characterize a full adder that use transmission gate.
Unfortunately, the power calculation are wrong for the cell are always negative.
Is there any method or commands that can can help in power calculation or add the power consumption by the input pins to the power calculation ?
Another question, Is liberate support the characterization or transmission gate cells as standard cells or I should use liberate AMS for these type of cells ?
Thanks in advance,
Tareq 

Hi,

Do anyone know if it's possible in simvision waveform viewer to see a timestamp of where uvm_errors/$errors occurred in a simulation via post-processing? 

Cheers,

Antonio

I'm completely new to Cadence. I've been able to run a very simple simulation with the -gui option. Simvision opens, I add the variables to the waveform viewer, and press run. All is good.

I don't understand the flow when using the -nogui option. It appears that the simulation runs and returns control to the OS. When I launch Simvision, is there a database or file that I can open to display the already-simulated data?

My command is of the form:

xrun -gui -64bit -sv -access +rwc -top tb_top.sv <src files>

I would like to send an update about a vmanager regression status x days after the regression has been run. In the current environment, the vmanager regression is creating a new filepath for logs automatically based on regression name/date, so I can't use a cron job to gather logs, as the log location is not known. 

I tried to use the pre session script to launch a detached shell script that would run after a delay, but when the pre_script runs, it waits until everything is completed before finishing and moving on to starting the regression.

Here is the test pre_script I am using:

#!/bin/sh

echo "pre_script start"

delay_script "FIRST" 1
nohup delay_script "SECOND" 30 & disown
delay_script "THIRD" 1

echo "pre_script end"
exit 0

Here is the test delay_script I am using:

#!/bin/sh

echo "Starting $1"

sleep $2

echo "Ending $1"

Here is the script output when run from terminal. After the "pre_script end", I get control back.

Here is the script output when run from vmanager. There is no "nohup", and the pre_session phase doesn't complete until all the delay scripts complete.

My question is, is there a better way to achieve my goal here? (The goal being to run a script from the vmanager log directory automatically x days after the regression). I think I could use the pre_script to send directory information for an auxiliary cron job to pick up, but I would prefer to not have to have extra cronjobs needed for this.

Hi, 

I am running a regression in order to collect the coverage. However I have an issue. I am setting a signal to 0 when reset is de-asserted  then this signal takes a fixed value when the reset is asserted. 

if(!rst_n) 
init_val= 'b0;

else 

init_val= 31'h34013FF7

the issue is that I got 0%  coverage for the init_value since we only have a rising edge and the signal is not toggling during the simulation. is there an option to collect coverage when there is a rising edge or a falling edge? 

I have been using the rank feature to identify tests that are redundant in our environment, but then I realized I'd also like to be able to see exactly what coverage goes into increasing the delta_cov value for a given test. If I had a test in my rank report that contributed 0.5% of the delta_cov, how could I got about seeing exactly where that 0.5% was coming from? It seems like that might be part of the correlate function, but I couldn't mange to find a way to see what specific coverage was being contributed for a given test.

Hi

I have tried using "add net constraints" command to place one-cold constraints on a tristate enable bus. In the command line we need to specify the "net pathname" on which the constraints are to be enforced.

The bus here is 20-bit. How should the net pathname be specified to make this 20-bit bus signals one_hot or one_cold.

The bus was declared as follows:
ten_bus [19:0]

The command I used was

add net constraints one_hot /ren_bus[19]

What would the above command mean?
Should we not specify all the nets' pathnames on the bus?
Is it sufficient to specify the pathname of one net on the bus?
I could not get much info regarding the functionality of this command. I would be obliged if anyone can throw some light.

Thanks
Prasad.

The silkscreen layer plays a crucial role in the assembly, repair, and testing of a PCB. You can add a variety of information to this layer, such as the location of the components, polarity, component orientation, on-off switches, LEDs, and testpoint...(read more)

A constraint is a user-defined property, or a rule, applied to a physical object, such as a net, pin, or via in a design. There are a number of constraints that can be applied to an object based on its type and behavior. For example, you can define t...(read more)

Hi I noticed that some figures from the old posts in the cadence blogs have been missing.

I think this problem happened before and Andrew Beckett asked the original author to fix the issue:

 Figures missing in the RF Design Blogs article of "Measuring Fmax for MOS Transistors" 

Some of these posts are quite valuable, and would be nice to have access to the figures, which are a very important part of some posts,

Thanks

Leandro

Dear Community,

I have created a PCB layout with multiple high-speed nets, I want to check the SI like how signals are reflected and taken to each other.

I have the OrCAD X Professional, how to check the reflection and crosstalk using the OrCAD X Professional software version 24.1.

I want to create a topology flow to the PCB layout and perform the reflection and crosstalk.

Regards,

Rohit Rohan

Dear Community,

I have created a PCB board and let's say I have found some parts of the PCB board where there are impedance issues, then how to resolve that impedance issue using the OrCAD X Professional.

Regards,

Rohit Rohan

Ajmal Ahmady, Afghanistan's minister of industries and commerce, outlines government efforts to make the country more conducive to business.

President Obrador aims to mobilise billions in public and private investment to create an alternative to the Panama Canal along the Tehuantepec corridor. 

The development of its agribusiness sector is one of Kazakhstan’s key priorities, and a first wave of foreign investors from Europe and Asia is looking at the country as a base to supply major markets in the regions. 

Project numbers drop almost 40% between 2017 and 2018.

The Egyptian capital Cairo led Africa in 2018, attracting 10 foreign business services investment projects, in its strongest performance since 2012. Joshua Crawford reports.

Australia is seeking the world’s best and brightest talent to relocate to one of the safest, most economically stable and innovative countries in the world.

India is one of Australia’s fastest growing tourism markets. Tourism businesses can realise the potential of the Indian market by learning about travellers’ culture and service expectations.

The Government aims to build a “more resilient, more inclusive and more modern” economy. For Austrade’s work, the Government focus on addressing climate change, strengthening ties with strategic partners, diversifying trade and investment, and First Nations people, continues.

Live stream Sinner vs. Fritz in the 2024 ATP Finals online for free from anywhere in the world.

One prominent Apple prognosticator says the company is working on a smart home camera for launch in 2026.

Tourism Research Australia will start collecting data on business events to measure industry performance and help inform decision making.

Austrade invites you to join the 2023 Australian Mission to the ADB Business Opportunities Fair (BOF) in Manila, Philippines from 3 to 5 October 2023. The ADB BOF is a one-stop forum for consultants and contractors from around the world looking to provide goods, works, and services for ADB projects in the Indo-Pacific region. This is a great opportunity to maximise your chances of participating in major international aid projects. • gain first-hand information and insights about opportunities funded by the Asian Development Bank. • hear about key priorities, as well as upcoming business opportunities • network with industry peers and ADB specialists relevant to your sector and countries of interest • establish your credentials with the Asian Development Bank.

Join us for an overview of doing business with the mining industry in Brazil, delivered by Austrade with guest speakers from Cescon Barrieu, one of the leading law firms in Brazil.

Austrade hosted a Landing Pad for 9 First Nations businesses in Singapore. The program included activities, workshops and masterclasses on the essential tools for export success.

2025 EWC/EWCA International Alumni Conference in Singapore 2025 EWC/EWCA International Alumni Conference in Singapore

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.