PCI-SIG DevCon 2024 – 32^nd Anniversary

For more than a decade, Cadence has been well-known in the industry for its strong commitment and support for PCIe technology. We recognize the importance of ensuring a robust PCIe ecosystem and appreciate the leadership PCI-SIG provides. To honor the 32^nd anniversary of the PCI-SIG Developer’s Conference, Cadence is announcing a complete PCIe 7.0 IP solution for HPC/AI markets.

Why Are Standards Like PCIe So Important?

From the simplest building blocks like GPIOs to the most advanced high-speed interfaces, IP subsystems are the lifeblood of the chipmaking ecosystem. A key enabler for IP has been the collaboration between industry and academia in the creation of standards and protocols for interfaces. PCI-SIG drives some of the key definitions and compliance specifications and ensures the interoperability of interface IP.

HPC/AI markets continue to demand high throughput, low latency, and power efficiency. This is fueling technology advancements, ensuring the sustainability of PCIe technology for generations to come. As a close PCI-SIG member, we gain valuable early insights into the evolving specs and the latest compliance standards. PCIe 7.0 specifications and beyond will enable the market to scale, and we look forward to helping our customers build best-in-class cutting-edge SoCs using Cadence IP solutions.

Figure 1. Evolution of PCIe Data Rates (source PCI-SIG)

What’s New This Year at DevCon?

At DevCon ’24, the PCIe 7.0 standard will take center stage, and Cadence is showing off a full suite of IP subsystem solutions for PCIe 7.0 this year.

What Sets Cadence Apart?

At Cadence, we believe in building a full subsystem for our testchips with eight lanes of PHY along with a full 8-lane controller. Adding a controller to our testchip significantly increases the efficiency and granularity in characterization and stress testing and enables us to demonstrate interoperability with real-world systems. We are also able to test the entire protocol stack as an 8-lane solution that encompasses many of the applications our customers use in practice. This approach significantly reduces the risks in our customers’ SoC designs.

Figure 2: Piper - Cadence PHY IP for PCIe 7.0

Figure 3: Industry’s first IP subsystem for PCIe 7.0

Which Market Is This For?

At a time when accelerated computing has gone mainstream, PCIe links are going to take on a role of higher importance in systems. Direct GPU-to-GPU communication is crucial for scaling out complex computational tasks across multiple graphics processing units (GPUs) or accelerators within servers or computing pods. There is a growing recognition within the industry of a need for scalable, open architecture in high-performance computing. As AI and data-intensive applications evolve, the demand for such technologies will likely increase, positioning PCIe 7.0 as a critical component in the next generation of interface IP.

Here's a recent article describing a potential use case for PCIe 7.0.

Figure 4: Example use case for PCIe 7.0

Why Are Optical Links Important?

It takes multiple buildings of data centers to train AI/ML models today. These buildings are increasingly being distributed across geographies, requiring optical fiber networks that are great at handling the increased bandwidth over long distances. However, these optical modules soon hit a power wall where all the budgeted power is used to drive the signal from point A to point B, and there is not enough power left to run the actual CPUs and GPUs. Such scenarios create a need for non-retimed, linear topologies. Linear Pluggable Optics (LPO) links can significantly reduce module power consumption and latency when compared to traditional Digital Signal Processing (DSP) based retimed optical solutions, which is critical for accelerating AI performance. Swapping from DSP-based solutions to LPO results in significant cost savings that help drive down expenditure due to lower power and cooling requirements, but this requires a robust high-performance ASIC to drive the optics rather than retimers/DSP.

To showcase the robustness of Cadence IP, we have demonstrated that our subsystem testchip board for PCIe 7.0 can successfully transmit and receive 128GT/s signals through a non-retimed opto-electrical link configured in an external loopback mode with multiple orders of margin to spare.

Figure 5: Example of ASIC driving linear optics

Compliance Is Key

For PCIe 6.0, the official compliance program has not started yet; this is typical for the SIG where the official compliance follows a few years after the spec is ratified to give enough time for the ecosystem to have initial products ready, and for test and equipment vendors to get their hardware/software up and running. At this time, PCIe Gen6 implementations can only be officially certified up to PCIe 5.0 level (the highest official compliance test suite that the SIG supports). We have taken our PCIe 6.0 IP subsystem solution to the SIG for multiple process nodes, and they are all listed as compliant. You can run this query on the pcisig.com website under the Developers->Integrators list by making the following selections:

Due to space limitations, not all combinations could be tested at the May workshop (e.g., N3 root port) – this will be tested in the next workshop.

Also, the SIG just held an “FYI” compliance event this week to bring together the ecosystem for confidential testing (no results were reported, and data cannot be shared outside without violating the PCI-SIG NDA). We participated in the event with multiple systems and can report that our systems have done quite well. The test ecosystem is not mature yet, and a few more FYI workshops will be conducted before the official compliance for 6.0 is launched. We have collaborated with all the key test vendors for electrical and protocol testing throughout the year. As early as the middle of last year, we were able to provide test cards to all these vendors to demo PCIe 6.0 capabilities in their booths at various events. Many of them recorded these videos, and they can be found online.

• Cadence Subsystem IP for PCIe 6.0: Protocol and Electrical Testing
• Cadence Subsystem IP for CXL Protocol Test Demo
• Cadence Subsystem IP for CXL2.0/3.0 Protocol Test Demo
• Cadence Subsystem IP for PCIe 6.0: Protocol Stack Demo

More at the PCI-SIG Developers Conference

Check us out at the PCI-SIG Developer’s conference on June 12 and 13 to see the following demonstrations:

• Robust performance of Cadence IP for PCIe 7.0 transmitting and receiving 128GT/s signals over non-retimed optics
• Capabilities of Cadence IP for PCIe 7.0 measured using oscilloscope instrumentation detailing its stable electrical performance and margin
• The reliability of Cadence IP for PCIe 6.0 interface using Test Equipment to characterize the PHY receiver quality
• A PCI-SIG-compliant Cadence IP subsystem for PCIe 6.0 optimized for both power and performance

As a leader in PCI Express, Anish Mathew of Cadence will share his valuable insights on an important topic: “Impact of UIO ECN on PCIe Controller Design and Performance,” highlighting the strides made by the Cadence design team in achieving this implementation.

Figure 6: Cadence UIO Implementation Summary

Summary

Cadence showcased PCIe 7.0-ready IP at PCI-SIG Developers Conference 2023 and continues to lead in PCIe IP development, offering complete solutions in advanced nodes for PCIe 7.0 that will be generally available early next year. With a full suite of solutions encompassing PHYs, Controllers, Software, and Verification IP, Cadence is proud to be a member of the PCI-SIG community and is heavily invested in PCIe. Cadence was the first IP provider to bring complete subsystem solutions for PCIe 3.0, 4.0, 5.0, and 6.0 with industry-leading PPA and we are proud to continue this trend with our latest IP subsystem solution for PCIe 7.0, which sets new benchmarks for power, performance, area, and time to market.

PCI-SIG DevCon 2024 was a great success for Cadence. We posted the blog, Cadence Demonstrates Complete PCIe 7.0 Solution at PCI-SIG DevCon ‘24 a day before the event to advertise our IP solutions for PCIe 7.0, which resulted in a lot of extra traffic at our booth. All of the attendees were excited to see Cadence demonstrate the robustness of 128GT/s PCIe 7.0 IP's TX and RX capabilities over a real-world, low-latency, non-retimed, linear optics connector. We achieved and maintained a consistent, impressive pre-FEC BER of ~3E-8 (PCIe spec requires 1E-6) for the entire duration of the event, spanning over two full days with no breaks. This provides an ample margin for RS FEC. As seen in the picture below, the receiver Eye PAM4 histograms have good linearity and margin. This is the world’s first stable demonstration of 128 GT/s TX and RX over off-the-shelf optical connectors—by far the main attraction of DevCon this year.

Cadence 128 GT/s TX and RX capability over optics

Block diagram of Cadence PHY for PCIe 7.0 128 GT/s demo setup with linear pluggable optics

As a leader in PCIe, our PCIe controller architect Anish Mathew shared his valuable insights on an important topic: “Impact of UIO ECN on PCIe Controller Design and Performance,” highlighting the strides made by the Cadence design team in achieving this implementation.

Anish Mathew presenting “Impact of UIO ECN on PCIe Controller Design and Performance”

In summary, Cadence had a dominating presence on the demo floor with a record number of PCIe demos:

• PCIe 7.0 over optics
• PCIe 7.0 electrical
• PCIe 6.0 RP/EP interop back-to back
• PCIe 6.0 protocol in FLIT mode with Lecroy Exerciser (at Cadence booth)
• PCIe 6.0 protocol in FLIT mode (at the Lecroy booth)
• PCIe 6.0 JTOL with Anritsu and Tektronix equipment (at Tektronix booth)
• PCIe 6.0 protocol with Viavi Protocol Analyzer (at Viavi booth)
• PCIe 6.0 System Level Interop Demo with Gen5 platform (at SerialTek booth)

The Cadence team and its partners did a great job in coordinating and setting up the demos that worked flawlessly. This was the culmination of many weeks of hard work and dedication. Four different vendors featured our IP for PCIe 6.0. They attracted a lot of attention and drove traffic back to us.

Highlights of Cadence demos for PCIe 7.0 and 6.0

Cadence team at the PCI-SIG Developers Conference 2024

Thanks to everyone who attended the 32nd PCI-SIG DevCon. We really appreciate your interest in Cadence IP, and a big thanks to our partners and customers for all the positive feedback and for creating so much buzz for the Cadence brand.

The demand for higher-performance computing is greater than ever. Cutting-edge applications in artificial intelligence (AI), big data analytics, and databases require high-speed memory systems to handle the ever-increasing volumes and complexities of data. Advancements in cloud computing and machine virtualization are stretching the limits of current capabilities. AI applications hosted in the cloud rely on fast access and reduced latency in memory systems, which is amplified by an increasing number of CPU and GPU cores.

Introducing the DDR5 Multiplexed Rank DIMM (MRDIMM), the next-generation memory module technology designed to meet the needs of high-performance computing (HPC) and AI in cloud applications. By leveraging existing DDR5 DRAM memory devices, MRDIMM modules not only double the DRAM data rate but also maintain the RAS capabilities of the industry-proven RDIMM modules, setting a new precedent for memory module performance.

Let’s compare RDIMM and MRDIMM modules using the same DRAM parts. Today, high-speed production DDR5 RDIMM modules run at 5600Mbps. Those modules use DDR5 DRAM parts, which also run at 5600Mbps. An MRDIMM module using the same DDR5 5600Mbps DRAM parts will run at a blazing 11.2Gbps.

One key metric for best-in-class performance, low bit error rate (BER), and ease of adoption is the eye diagram. The eye diagram illustrates at-speed system margin and accurately represents DDR system quality when captured with a pseudo-random binary sequence (PRBS)-like pattern. The diagram below illustrates Cadence’s 3nm silicon write eye diagram for DDR5 MRDIMM IP running at 12.8Gbps.

Cadence 3nm DDR5 MRDIMM 12.8Gbps test chip write eye diagram, design kit is available today

The eye diagram is captured using a PRBS-like pattern, incorporating a package and system board representative of a typical MRDIMM channel. Using PRBS-like patterns is crucial for capturing accurate eye diagrams. Repetitive clock-like data patterns create deceptively “open eyes” that do not reflect the real system performance. Effects like intersymbol interference, simultaneous switching, reflections, and crosstalk are not accurately reflected in the eye diagrams for parallel interfaces like DDR using non-random data streams. Relying on improperly captured eye diagrams inevitably leads to a significantly worse real system BER than conveyed by that eye diagram.

Doubling the DDR5 RDIMM data rate is challenging. Achieving high performance while optimizing for area and power requires multiple design techniques. Feed-forward equalization (FFE), decision feedback equalization (DFE), continuous-time linear equalization (CTLE), and T-coils are required to reach 12.8Gbps MRDIMM data rates in multi-channel systems. Building a production-worthy 12.8Gbps DDR5 MRDIMM IP requires engineering expertise that comes from many generations of memory interface design and production experience. Cadence has developed this expertise through multiple DDR5/4, LPDDR5X/5, and GDDR6 designs in different technology nodes and foundries. For instance, Cadence’s GDDR6 IP is available in three foundries and ten process nodes, with mass production at speeds exceeding 22Gbps.

For your next project, consider DDR5 12.8Gbps MRDIMM, a technology that not only doubles the bandwidth of DDR5 RDIMM but also promises rapid proliferation into next-generation AI, data center, HPC, and enterprise applications. With its cutting-edge capabilities, the Cadence DDR5 12.8Gbps MRDIMM IP is ready to power the future of computing.

Hi! 

I am attempting to create a very simple test pcell that contains a single Nmos 4 terminal device (Gate, Source, Drain, Backgate). However, unlike other devices I have used in the past, the backgate terminal of the device I wish to include within the pcell is an inherited connection, and the other 3 are physical terminals. Note that for the pcell master, I do not want any inherited connections, just physical pins. Hence I need to drive this inherited connection with a pin within my pcell. I started implementing the symbol and schematic first, ensuring I could obtain the correct connectivity, extract netlist, etc. I thought I had it hooked up correctly, but alas I am failing to export the CDL. Let me explain my current approach.

Schematic:

Create the 4 physical pins using a combination of dbCreateInst (for the pin isnt), dbMakeNet, dbCreateTerm and dbCreatePin.

Create the device instance using dbCreateInstByMasterName and setting the desired cdf parameters + callbacks.

For the physical terminals of the device, I'm using dbCreateConnByName to make the connection to the appropriate net that was created above.

For the inherited connection, I am creating a netSet property like so: dbCreateProp(newinst deviceTermName "netSet" netName)

Symbol:

Create the 4 physical pins using a combination of dbCreateRect, dbMakeNet, dbCreateTerm, dbCreatePin.

And then create whatever symbol design I wish using the likes of dbCreateRect, dbCreateLine, etc. 

Everything works fine when using a device without an inherited connection, so I'm guessing I'm missing something along this line... Also, if I copy the contents of the pcell schematic to a regular schematic view, do a check and save, the view extracts just fine. So I wonder if the check and save it fixing the connectivity that I may not have. 

Thanks for any possibly engagement or suggestions 🙂

Keelan

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As technology continues to evolve at a rapid pace, the importance of robust and efficient interconnect standards cannot be overstated. Peripheral Component Interconnect Express (PCIe) has been a cornerstone in high-speed data transfer, enabling seamless communication between various hardware components.   

With the advent of PCIe 6.1 ECN, a significant advancement in speed and efficiency, ensuring the accuracy and reliability of its operations is paramount. One critical aspect of this is the verification of shared credit updates. For detailed understanding on Shared Credit, please refer Understanding PCIe 6.0 Shared Flow Control. 

In this blog, we will discuss why this verification is essential and what it entails.  

Introduction 

PCIe 6.1 ECN brings numerous advancements over earlier versions, such as increased bandwidth and faster data transfer speeds.   

A crucial mechanism for efficient data transmission in PCIe 6.0 is the credit-based flow control system. In this system, devices monitor credits, representing the buffer capacity available for incoming data.   

When a device transmits data, it uses credits, which are replenished or adjusted once the data is received and processed. This system ensures that the sender does not overload the receiver.  

Given the critical role of shared credit updates in maintaining the integrity and efficiency of data transfers, verification of these updates is crucial.  Proper management of credit updates is essential to ensure data integrity, as any discrepancies can lead to data loss, corruption, or system crashes.   

Verification also guarantees efficient resource allocation, preventing scenarios where some components are starved of credit while others have an excess, thus avoiding inefficiencies.  Credit inefficiencies pose issues in low power negotiations by preventing devices from entering low power states. Additionally, verification involves checking for proper error handling mechanisms, ensuring that the system can recover gracefully from errors in credit updates and maintain overall stability.   

PCIe 6.1 ECN Flow Control Optimizations Over PCIe 6.0

PCIe 6.1 ECN builds on the FLIT-based architecture introduced in PCIe 6.0, further optimizing flow control mechanisms to handle increased data rates and improved efficiency.  PCIe 6.1 ECN introduced refinements in credit management, making the allocation and advertisement of credits more precise, which helps in reducing bottlenecks and improving data flow efficiency.  Enhancements in flow control protocols ensure better management of buffer spaces and more efficient credit allocation. These enhancements are designed to handle the increased data rates and throughput demands of next-generation applications, ensuring robust and efficient data flow across PCIe devices.  

Below are some major updates: 

1. There have been improvements in error detection and correction mechanisms in PCIe 6.1 ECN to enhance flow control reliability by ensuring that corrupted data packets are detected and handled appropriately without disrupting the flow of valid packets.  
2. The merged credit system, which was a key feature introduced int PCIe 6.0 to simplify and optimize credit management, was further enhanced in PCIe 6.1 ECN to improve performance and efficiency.  
3. PCIe 6.1 ECN introduced better algorithms for allocating and reclaiming merged credits to handle high data rates, introduced more robust error detection and correction mechanism reducing the degradation or system instability. 
4. PCIe 6.1 ECN provided clear guidelines on how to implement the merged credit system correctly, helping developers to implement more reliable systems. For more details, please refer to Specifications section 2.6.1 Flow Control (FC) Rules.

Summary 

In summary, PCIe 6.0 is a complex protocol with many verification challenges. You must understand many new Spec changes and think about the robust verification plan for the new features and backward compatible tests impacted by new features. Cadence’s PCIe 6.0 Verification IP is fully compliant with the latest PCIe Express 6.0 specifications and provides an effective and efficient way to verify the components interfacing with the PCIe 6.0 interface. Cadence VIP for PCIe 6.0 provides exhaustive verification of PCIe-based IP and SoCs, and we are working with early adopter customers to speed up every verification stage.   

More Information

For more info on how Cadence PCIe Verification IP and Triple Check VIP enable users to confidently verify PCIe 6.0, see VIP for PCI Express, VIP for Compute Express Link  and TripleCheck for PCI Express    

See the PCI-SIG website for more details on PCIe in general and the different PCI standards.  

For more information on PCIe 6.0 new features, please visit PCIeLaneMargin, PCIe6.0LaneMargin, and Demonstrating PCIe 6.0 Equalization Procedure.

Cadence PCIe/CXL VIP support for Partial Header Encryption in Integrity and Data Encryption.(read more)

Peripheral Component Interconnect Express (PCIe) is a high-speed interface standard widely used for connecting processors, memory, and peripherals. With the increasing reliance on PCIe to handle sensitive data and critical high-speed data transfer, ensuring data integrity and encryption during verification is the most essential goal. As we know, in the field of verification, randomization is a key technique that drives robust PCIe verification. It introduces unpredictability to simulate real-world conditions and uncover hidden bugs from the design. This blog examines the significance of randomization in PCIe IDE verification, focusing on how it ensures data integrity and encryption reliability, while also highlighting the unique challenges it presents. For more relevant details and understanding on PCIe IDE you can refer to Introducing PCIe's Integrity and Data Encryption Feature . The Importance of Data Integrity and Data Encryption in PCIe Devices Data Integrity : Ensures that the transmitted data arrives unchanged from source to destination. Even minor corruption in data packets can compromise system reliability, making integrity a critical aspect of PCIe verification. Data Encryption : Protects sensitive data from unauthorized access during transmission. Encryption in PCIe follows a standard to secure information while operating at high speeds. Maintaining both data integrity and data encryption at PCIe’s high-speed data transfer rate of 64GT/s in PCIe 6.0 and 128GT/s in PCIe 7.0 is essential for all end point devices. However, validating these mechanisms requires comprehensive testing and verification methodologies, which is where randomization plays a very crucial role. You can refer to Why IDE Security Technology for PCIe and CXL? for more details on this. Randomization in PCIe Verification Randomization refers to the generation of test scenarios with unpredictable inputs and conditions to expose corner cases. In PCIe verification, this technique helps us to ensure that all possible behaviors are tested, including rare or unexpected situations that could cause data corruption or encryption failures that may cause serious hindrances later. So, for PCIe IDE verification, we are considering the randomization that helps us verify behavior more efficiently. Randomization for Data Integrity Verification Here are some approaches of randomized verifications that mimic real-world traffic conditions, uncovering subtle integrity issues that might not surface in normal verification methods. 1. Randomized Packet Injection: This technique randomized data packets and injected into the communication stream between devices. Here we Inject random, malformed, or out-of-sequence packets into the PCIe link and mix valid and invalid IDE-encrypted packets to check the system’s ability to detect and reject unauthorized or invalid packets. Checking if encryption/decryption occurs correctly across packets. On verifying, we check if the system logs proper errors or alerts when encountering invalid packets. It ensures coverage of different data paths and robust protocol check. This technique helps assess the resilience of the IDE feature in PCIe in below terms: (i) Data corruption: Detecting if the system can maintain data integrity. (ii) Encryption failures: Testing the robustness of the encryption under random data injection. (iii) Packet ordering errors: Ensuring reordering does not affect data delivery. 2. Random Errors and Fault Injection: It involves simulating random bit flips, PCRC errors, or protocol violations to help validate the robustness of error detection and correction mechanisms of PCIe. These techniques help assess how well the PCIe IDE implementation: (i) Detects and responds to unexpected errors. (ii) Maintains secure communication under stress. (iii) Follows the PCIe error recovery and reporting mechanisms (AER – Advanced Error Reporting). (iv) Ensures encryption and decryption states stay synchronized across endpoints. 3. Traffic Pattern Randomization: Randomizing the sequence, size, and timing of data packets helps test how the device maintains data integrity under heavy, unpredictable traffic loads. Randomization for Data Encryption Verification Encryption adds complexity to verification, as encrypted data streams are not readable for traditional checks. Randomization becomes essential to test how encryption behaves under different scenarios. Randomization in data encryption verification ensures that vulnerabilities, such as key reuse or predictable patterns, are identified and mitigated. 1. Random Encryption Keys and Payloads: Randomly varying keys and payloads help validate the correctness of encryption without hardcoding assumptions. This ensures that encryption logic behaves correctly across all possible inputs. 2. Randomized Initialization Vectors (IVs): Many encryption protocols require a unique IV for each transaction. Randomized IVs ensure that encryption does not repeat patterns. To understand the IDE Key management flow, we can follow the below diagram that illustrates a detailed example key programming flow using the IDE_KM protocol. Figure 1: IDE_KM Example As Figure 1 shows, the functionality of the IDE_KM protocol involves Start of IDE_KM Session, Device Capability Discovery, Key Request from the Host, Key Programming to PCIe Device, and Key Acknowledgment. First, the Host starts the IDE_KM session by detecting the presence of the PCIe devices; if the device supports the IDE protocol, the system continues with the key programming process. Then a query occurs to discover the device’s encryption capabilities; it ensures whether the device supports dynamic key updates or static keys. Then the host sends a request to the Key Management Entity to obtain a key suitable for the devices. Once the key is obtained, the host programs the key into the IDE Controller on the PCIe endpoint. Both the host and the device now share the same key to encrypt and authenticate traffic. The device acknowledges that it has received and successfully installed the encryption key and the acknowledgment message is sent back to the host. Once both the host and the PCIe endpoint are configured with the key, a secure communication channel is established. From this point, all data transmitted over the PCIe link is encrypted to maintain confidentiality and integrity. IDE_KM plays a crucial role in distributing keys in a secure manner and maintaining encryption and integrity for PCIe transactions. This key programming flow ensures that a secure communication channel is established between the host and the PCIe device. Hence, the Randomized key approach ensures that the encryption does not repeat patterns. 3. Randomization PHE: Partial Header Encryption (PHE) is an additional mechanism added to Integrity and Data Encryption (IDE) in PCIe 6.0. PHE validation using a variety of traffic; incorporating randomization in APIs provided for validating PHE feature can add more robust Encryption to the data. Partial Header Encryption in Integrity and Data Encryption for PCIe has more detailed information on this. Figure 2: High-Level Flow for Partial Header Encryption 4. Randomization on IDE Address Association Register values: IDE Address Association Register 1/2/3 are supposed to be configured considering the memory address range of IDE partner ports. The fields of IDE address registers are split multiple values such as Memory Base Lower, Memory Limit Lower, Memory Base Upper, and Memory Limit Upper. IDE implementation can have multiple register blocks considering addresses with 32 or 64, different registers sizes, 0-255 selective streams, 0-15 address blocks, etc. This Randomization verification can help verify all the corner cases. Please refer to Figure 2. Figure 3: IDE Address Association Register 5. Random Faults During Encryption: Injecting random faults (e.g., dropped packets or timing mismatches) ensures the system can handle disruptions and prevent data leakage. Challenges of IDE Randomization and its Solution Randomization introduces a vast number of scenarios, making it computationally intensive to simulate every possibility. Constrained randomization limits random inputs to valid ranges while still covering edge cases. Again, using coverage-driven verification to ensure critical scenarios are tested without excessive redundancy. Verifying encrypted data with random inputs increases complexity. Encryption masks data, making it hard to verify outputs without compromising security. Here we can implement various IDE checks on the IDE callback to analyze encrypted traffic without decrypting it. Randomization can trigger unexpected failures, which are often difficult to reproduce. By using seed-based randomization, a specific seed generates a repeatable random sequence. This helps in reproducing and analyzing the behavior more precisely. Conclusion Randomization is a powerful technique in PCIe verification, ensuring robust validation of both data integrity and data encryption. It helps us to uncover subtle bugs and edge cases that a non-randomized testing might miss. In Cadence PCIe VIP, we support full-fledged IDE Verification with rigorous randomized verification that ensures data integrity. Robust and reliable encryption mechanisms ensure secure and efficient data communication. However, randomization also brings various challenges, and to overcome them we adopt a combination of constrained randomization, seed-based testing, and coverage-driven verification. As PCIe continues to evolve with higher speeds and focuses on high security demands, our Cadence PCIe VIP ensures it is in line with industry demand and verify high-performance systems that safeguard data in real-world environments with excellence. For more information, you can refer to Verification of Integrity and Data Encryption(IDE) for PCIe Devices and Industry's First Adopted VIP for PCIe 7.0 . More Information: For more info on how Cadence PCIe Verification IP and TripleCheck VIP enables users to confidently verify IDE, see our VIP for PCI Express , VIP for Compute Express Link for and TripleCheck for PCI Express For more information on PCIe in general, and on the various PCI standards, see the PCI-SIG website .

Hi,

I need to design EPC8002 eGaN switch in cadence. Can someone provide me step by step guide on hoe to add EPC8002 into my cadence. I am working on BCD180.

Thank you 

Ihsan

Hi 

I am looking into chamfering the edge of PCB for Board edge connectors. I have performed fillet command earlier but new to chamfering.

Below is the description :

As seen above, the PCB edge are chamfered in thickness as well as at the corners.

Using OrCAD PCB hotfix S023.

Hello Fellow PCB Designers,

We have a 10 layer PCB design that originated in Pads and was converted over to Allegro 17.4, this is an old design but is manufacturable and works perfectly fine.  When I try to generate a Gerber for the Top or Bottom layers

the Gerber comes out fine.  But Most of the middle layers are Etch's and via's for power and grounds, but the Gerber's come mostly blank, there might be some details, but in the Gerber view everything is displayed correctly.

The design does have many close spacings, I have not changed anything in the constrains manager yet, turned off a lot of the DRC's, but thinking there might be something wrong with the constrains.

  I find that the CSet is set to 2_18, not sure yet what this means, also there are many of these definitions, PCS 3,4,5,ect, are the same as CSet 2_18 any suggestions would be great, we are currently looking into this, have seen

that even small change in constraint manager can cause long processing and even Allegro crashing, this is a large project.

Thanks Much, Thanks, Mike Pollock.

Hi,

So I was trying to update the title block of a schematic that I have. The title block that was on there was out of date . I clicked on place --> title block and was able to find the title block that I need. I also have a .OLB file that contains that title block. Then I created a Netlist with the old BRD file as the input file (To keep it as is but modify changes) but when I do that I still do not see / cannot place the title block that I need. Under Place --> format symbols in Allegro , I do see a title block that is coming from the database (But it's the old one). I don't know what to do at this point and would appreciate any tips. I did make sure that the path to where the library is , is defined in the user preferences. 
I also tried copying the title block under the library folder in capture before creating my Netlist and that did not work either.

Thank you all.

How do we purge/remove the duplicated vias in the same location of the PCB editor? These vias are not the one stacked and they are just blind vias running in internal layers 12-14. I find there is an additional copy of the blind via at the same location. Not sure what caused this issue.

I'd like to be able to edit a footprint for a part in my design without needing to find the footprint filepath and directly open that file in PCB Editor. I see that I can view footprints from Capture, and that doing so shows me the footprint path, but I can't find any way to launch the editor. Is there any way to go directly from a part in a Capture schematic or a placed part in a PCB Editor board design to editing that part's footprint?

Hi,

I have a monitor plugged to my laptop using a HDMI to USB adapter. When using this adapter, Allegro runs very slowly. It seems that it is not using my video card.

Is this a known issue with a workaround I can try?

Thanks,

Michael

Hi All

I am looking for the functions which are different about OrCAD Professional and Allegro tier.

is there any resource?

regard

Hi All

I followed tutorial video below for using Design link

https://www.youtube.com/watch?v=f9JmFF8lqA0

and I followed the video with embedded board design file which should be same one on video

I did every set. but  at 2:55 of video, Steve have the tabs of both design names on top of Constraint Manager in video

but my one didn't exist them

which one would be different?

there was some comment on command windows but I think they would not be problem here

regard

Hi,

I found that under the Dark Theme of PCB Environment Editor 17.4,

the window background is not all dark, resulting in unclear text display。

As shown in the figure below：

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Hai Community,

I have a PCB board which has multiple high speed nets and I want to perform the EMI and EMC checking.

Which Cadence tool should I use for checking the EMI and EMC coupling?

Regards,

Rohit Rohan

Optimizing PCB thermal performance is essential in today’s high-density designs, as it ensures stability, prolongs component life, and prevents potential thermal issues. One of the first steps to achieving this is with strategic component placement. Positioning high-power components—such as regulators, power transistors, or processors—away from heat-sensitive parts can prevent thermal interference, and placing them near the edges of the PCB often helps dissipate heat more effectively. It’s also beneficial to group components by their heat generation, creating dedicated thermal zones that can manage localized heating and reduce impact on other areas of the board.

Using thermal vias is another effective technique. By placing thermal vias under components like BGAs or power ICs, heat can be transferred from the surface to internal layers or ground planes. Increasing the size and number of these vias, or using thicker plating, enhances heat conductivity and helps manage heat more evenly across layers in multilayer boards. Increasing copper thickness on the PCB also has a major impact. Opting for thicker copper layers (e.g., 2 oz or even 3 oz copper) significantly boosts the heat dissipation capabilities of power planes and traces, especially in high-current areas. Large copper planes, such as dedicated ground or power planes, are equally effective in spreading heat efficiently. Adding thermal pads directly beneath heat-generating components improves this heat distribution.

Thermal relief pads help regulate heat flow for through-hole components by controlling heat transfer, which reduces thermal stress during soldering and prevents excessive heat spread to nearby sensitive areas. Performing thermal analysis with software tools like Celsius can be invaluable, as it allows you to simulate and model heat distribution, spot potential thermal issues, and refine your design before finalizing it.

Using heat sinks and thermal pads provides a direct way to draw heat from high-power components. Heat sinks can be attached with thermal adhesives, screws, or clamps, while thermal interface materials (TIMs), such as thermal pads or conductive adhesives, further reduce thermal resistance, enhancing heat-transfer efficiency. Optimizing the PCB layer stackup is also a key factor. Dedicated ground and power layers improve heat conduction across the PCB, enabling heat transfer between layers, particularly in high-density and multilayer PCBs.

In designs with high power requirements, active cooling options like fans, blowers, or heat pipes can be essential, helping to direct airflow across the PCB and further improving heat dissipation. Adding ventilation slots around hot zones and considering passive cooling paths enhance natural airflow, making the design more thermally efficient. By combining several of these techniques, you can create a PCB that handles heat effectively, resulting in a robust, long-lasting, and reliable product.

Let us know if you’ve had any challenges with thermal management in your designs—I’d be glad to discuss further!

Has anyone experienced the same situation?

Thanks to Intel, a feature-laden new generation of AI-enhanced PCs hit the market just in time for the holidays.

In Lahore on Sunday, Chaudhry Shafay Hussain, the leader of Pakistan Muslim League-Quaid (PML-Q), asserted that his party has no intentions of merging with any other political group. Hussain clarified, “While seat adjustments may occur in specific constituencies with the Pakistan Muslim League-Nawaz, the PML-Q is committed to maintaining its independent identity.” PML-Q’s commitment to ... Read more

The post PML-Q Affirms Independence and Tractor Symbol for Upcoming Elections appeared first on Pakistan Tribune.

La enseñanza bíblica en profundidad de John MacArthur lleva la verdad transformadora de la Palabra de Dios a millones de personas cada día.

La enseñanza bíblica en profundidad de John MacArthur lleva la verdad transformadora de la Palabra de Dios a millones de personas cada día.

On April 5, the Afghan people will vote in the country's third-ever presidential elections, but corruption and security pose significant obstacles.

With the upcoming Kovačević ruling, let justice be done for Bosnia’s democracy

The Pakistan Cricket Board (PCB) said on Tuesday it has asked the sport’s governing body to explain India’s refusal to send a team to Pakistan for the Champions Trophy next year.

The International Cricket Council (ICC) informed the PCB last week that India would not tour Pakistan for the eight-team tournament, leaving the fate of the event hanging in the balance.

Pakistan had previously rejected the option of a hybrid arrangement that would allow India to play their matches at neutral venues, for example in the United Arab Emirates.

“The PCB has responded to last week’s ICC letter seeking clarifications for the Indian Board’s decision not to travel to Pakistan for next year’s Champions Trophy,” Sami-Ul-Hasan told AFP.

Deteriorating political ties have meant the bitter rivals have not played a bilateral cricket series for over a decade — squaring off only in ICC multi-nation events.

Pakistani media reported on Tuesday that the PCB would be unwilling to accept security reasons for India’s refusal to visit.

New Zealand have toured Pakistan three times in the past two years, with England visiting twice and Australia once in the same period.

Pakistan also visited India for last year’s ODI World Cup and the PCB had expected the gesture to be reciprocated for the Champions Trophy.

The Champions Trophy is slated to be played across three venues — Lahore, Rawalpindi and Karachi — from February 19 to March 9 next year.

But a final schedule due to be announced this week has been postponed over the stand-off — which PCB chairman Mohsin Naqvi termed disappointing.

“Almost every country wants the tournament to be played in Pakistan and it will be disappointing if they don’t come,” Naqvi, who is also the interior minister, said last week.

“I don’t think anyone should make this a political matter. We’ll give every team as many facilities as we can.” Naqvi said Pakistan would consider pulling out of events in India as a response.

“Pakistan has shown great gestures to India in the past, and we’d like to say clearly India shouldn’t expect such friendly gestures from us every time”.

India is due to host the women’s ODI World Cup and Asia Cup next year and will co-host the Twenty20 World Cup with Sri Lanka in 2026.

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Title: Banned PCB Chemicals Still Tied to Autism in U.S. Kids
Category: Health News
Created: 8/23/2016 12:00:00 AM
Last Editorial Review: 8/23/2016 12:00:00 AM

Intrapatient intermetastatic heterogeneity (IIH) has been demonstrated in metastatic castration-resistant prostate cancer (mCRPC) patients and is of the utmost importance for radiopharmaceutical therapy (RPT) eligibility. This study was designed to determine the prevalence of IIH and RPT eligibility in mCRPC patients through a triple-tracer PET imaging strategy. Methods: This was a multisite prospective observational study in which mCRPC patients underwent both ¹⁸F-FDG and ⁶⁸Ga-prostate-specific membrane antigen (PSMA)–617 PET/CT scans. A third scan with ⁶⁸Ga-DOTATATE, a potential biomarker of neuroendocrine differentiation, was performed if an ¹⁸F-FDG–positive/⁶⁸Ga-PSMA–negative lesion was found. Per-tracer lesion positivity was defined as having an uptake at least 50% above that of the liver. IIH prevalence was defined as the percentage of participants having at least 2 lesions with discordant features on multitracer PET. Results: IIH was observed in 81 patients (82.7%), and at least 1 ¹⁸F-FDG–positive/⁶⁸Ga-PSMA–negative lesion was found in 45 patients (45.9%). Of the 37 participants who also underwent ⁶⁸Ga-DOTATATE PET/CT, 6 (16.2%) had at least 1 ⁶⁸Ga-DOTATATE–positive lesion. In total, 12 different combinations of lesion imaging phenotypes were observed. On the basis of our prespecified criteria, 52 (53.1%) participants were determined to be eligible for PSMA RPT, but none for DOTATATE RPT. Patients with IIH had a significantly shorter median overall survival than patients without IIH (9.5 mo vs. not reached; log-rank P = 0.03; hazard ratio, 2.7; 95% CI, 1.1–6.8). Conclusion: Most mCRPC patients showed IIH, which was associated with shorter overall survival. On the basis of a triple-tracer PET approach, multiple phenotypic combinations were found. Correlation of these imaging phenotypes with genomics and treatment response will be relevant for precision medicine.

Anna Marie spends the whole show looking for her holes. Jonathan Stringer is off singing Sakuna Matata. Josh Carpenter has all the sinks. Kelley Ryan cleans her entire house with a broom. And Chris has issues with Wil Wheaton.

The post RPG Cast – Episode 568: “What Popcorn Is Disgaea?” appeared first on RPGamer.

KLEINER Perkins Caufield & Byers has agreed to invest in ephemeral message service Snapchat at a valuation of close to $US10 bn.

Capcom has updated its list of Platinum Titles, games that have sold over one million units as of September 30, 2024. The list includes 122 games with sales over one million units, 64 over two million units, 14 over five million units, and six over 10 million units sold.

Resident Evil 4 remake sold 400,000 units to bring lifetime sales to eight million units, Resident Evil 2 remake sold 300,000 units to bring sales to 14.5 million units, and Resident Evil 3 remake sold 200,000 units to bring lifetime sales to 9.2 million units. 

Resident Evil 7: biohazard sold 300,000 units to bring lifetime sales to 14 million units and Resident Evil Village sold 400,000 units to bring sales to 10.5 million units.

Monster Hunter Rise sold 600,000 units in the quarter to bring lifetime sales to 16 million units. Monster Hunter Rise: Sunbreak sold 400,000 units to bring lifetime sales to 8.8 million units.

Monster Hunter: World sold 400,000 units in the quarter to bring lifetime sales to 20.9 million units, while the Iceborne expansion sold 600,000 units for a total of 14 million units.

Dragon's Dogma 2 sold 300,000 units in the quarter to bring lifetime sales to 3.3 million units. Street Fighter 6 sold 400,000 units in the quarter to bring lifetime sales to 4.1 million units. Devil May Cry 5 sold 300,000 units to bring sales to 8.7 million units. 

Check out the complete list below:

A life-long and avid gamer, William D'Angelo was first introduced to VGChartz in 2007. After years of supporting the site, he was brought on in 2010 as a junior analyst, working his way up to lead analyst in 2012 and taking over the hardware estimates in 2017. He has expanded his involvement in the gaming community by producing content on his own YouTube channel and Twitch channel. You can contact the author on Twitter @TrunksWD.

Full Article - https://www.vgchartz.com/article/463020/capcom-updates-its-best-sellers-list-monster-hunter-world-at-209m-re4-remake-at-8m-more/

tinyBuild has announced Hello Neighbor 3 for PC via Steam.

View a developer log below:

Read details on the game below:

Arriving in Raven Brooks as a stranger with no ties to this place, you find yourself in a forgotten, half-abandoned town where every citizen has relations, desires, and goals. Your actions will ripple through the town, changing the course of events…

• Simulated town - Raven Brooks as a sandbox simulated in real-time. Residents act based on their personalities and circumstances.
• Every decision is the right one - The system-based nature of the game allows for complex ways of achieving your goals.
• Cozy yet eerie adventure - A fading half-abandoned town in early spring, tangled with overgrowth and memories.

A life-long and avid gamer, William D'Angelo was first introduced to VGChartz in 2007. After years of supporting the site, he was brought on in 2010 as a junior analyst, working his way up to lead analyst in 2012 and taking over the hardware estimates in 2017. He has expanded his involvement in the gaming community by producing content on his own YouTube channel and Twitch channel. You can contact the author on Twitter @TrunksWD.

Full Article - https://www.vgchartz.com/article/463030/hello-neighbor-3-announced-for-pc/

Publisher Kasedo Games and developer Beard Envy have announced he roguelite spaceship repair simulation game, Uncle Chop's Rocket Shop, has been delayed to December 5. It will launch for the PlayStation 5, Xbox Series X|S, Nintendo Switch, and PC via Steam and Epic Games Store.

View the release date trailer below:

Read details on the game below:

Come on down to Uncle Chop’s Rocket Shop, for all your roguelite spaceship repair simulation needs! Wake up, clock in, fix ships, make friends and enemies, pay R.E.N.T., upgrade your workshop, ponder the futility of your existence, go to bed and then do it all over again the next day.

On an asteroid-bound service station in an unfrequented space lane, Wilbur carves out a paltry living as a mechanic, repairing as many ships as he can to afford the ever-rising R.E.N.T payments to his corporate overlord, Uncle Chop. Where most of his customers find meaning in pastimes like worshipping deranged space gods, feeding random crap to a sentient black hole, endlessly digging for The Treasure™ or mentally enslaving donut shop workers, Wilbur lives a more humble life, fixing the galaxy’s ills one broken ship module at a time.

Fix Stuff

Using a range of tools, diagnostic devices, parts and workshop appliances, you’ll be correcting faults in the modules of procedurally generated spaceships. From simple refuel jobs to total overhauls, get ready to frantically fumble, slice, loosen, tighten, grab and drop as you try to complete as many jobs as you can within each daily time limit. With a huge variety of ships and modules, your hands are gonna get real dirty real fast, in some real unusual places.

Read Stuff

Flaunt your basic literacy by consulting manual pages for guidance on diagnosing and correcting faults in spaceship modules, as well as operating workshop appliances. And if basic literacy isn’t your bag, then at least you’ve got pretty diagrams to gawp at! All your IKEA furniture-assembly training has led to this moment.

Upgrade Stuff

Using whatever hard-earned pennies Uncle Chop doesn’t take from you, expand your workshop and kit it out with a range of workstations. From industrial devices to esoteric altars, these workstations will allow you to fix bigger and more lucrative ships.

Talk About Stuff

Interact with a diverse range of oddballs as you engage with both anthology-style storytelling and a multiple-ending, overarching narrative. The lore is (*consults notes*) “deep and rich and good,” with different factions you can choose to ingratiate yourself with – each with their own inane agendas.

Discover Stuff

Narrative and random events, hidden puzzles and upgrades, secret lore—we got all that goodness that ensures each day and gameplay run will feel substantially different from the last.

Do All That Stuff Again, But Better

Meeting those escalating R.E.N.T payments ain’t gonna be easy, but chin up, champ – certain station upgrades will persist across gameplay runs, making life a little more tolerable every time around. You’ll also get faster and smarter the more you do the thing, so keep doing the thing!

A life-long and avid gamer, William D'Angelo was first introduced to VGChartz in 2007. After years of supporting the site, he was brought on in 2010 as a junior analyst, working his way up to lead analyst in 2012 and taking over the hardware estimates in 2017. He has expanded his involvement in the gaming community by producing content on his own YouTube channel and Twitch channel. You can contact the author on Twitter @TrunksWD.

Full Article - https://www.vgchartz.com/article/463037/uncle-chops-rocket-shop-releases-december-5-for-ps5-xbox-series-xs-switch-and-pc/

Shift Up in its latest earnings report Q&A stated its goal is to release Stellar Blade for PC sometime in 2025.

"We're aiming for a 2025 release," said the developer when asked about a PC version of Stellar Blade.

"Given recent trends like Steam’s growing presence in the AAA games market and the global success of Black Myth: Wukong, we are expecting the PC version to perform even better than the console version."

The developer revealed sales for the PS5 version of Stellar Blade "have remained steady even as the initial surge has calmed."

Stellar Blade released for the PS5 in April.

Thanks, Gematsu.

A life-long and avid gamer, William D'Angelo was first introduced to VGChartz in 2007. After years of supporting the site, he was brought on in 2010 as a junior analyst, working his way up to lead analyst in 2012 and taking over the hardware estimates in 2017. He has expanded his involvement in the gaming community by producing content on his own YouTube channel and Twitch channel. You can contact the author on Twitter @TrunksWD.

Full Article - https://www.vgchartz.com/article/463049/shift-up-aiming-to-release-stellar-blade-for-pc-in-2025/