The Director-General addressed the members of the UN Security Council (UNSC) on Tuesday in what was FAO’s first appearance before the principal UN body on global peace and security affairs.

Organized [...]

The insect eggshell is a multifunctional structure with several important roles, including generating an entry point for sperm via the micropyle before oviposition, serving as an oviposition substrate attachment surface, and functioning as a protective layer during embryo development. Eggshell proteins play major roles in eggshell tanning and hardening following oviposition and provide molecular cues that define dorsal–ventral axis formation. Precise eggshell formation during ovarian follicle maturation is critical for normal embryo development and the synthesis of a defective eggshell often gives rise to inviable embryos. Therefore, simple and accurate methods for identifying eggshell proteins will facilitate our understanding of the molecular pathways regulating eggshell formation and the mechanisms underlying normal embryo development. This protocol describes how to isolate and enrich eggshells from mature oocytes of Aedes aegypti mosquitoes and how to extract their eggshell proteins for liquid chromatography with tandem mass spectrometry (LC–MS/MS) proteomic analysis. Although this methodology was developed for studying mosquito eggshells, it may be applicable to eggs from a variety of insects. Mosquitoes are ideal model organisms for this study as their ovarian follicle development and eggshell formation are meticulously regulated by blood feeding and their follicles develop synchronously throughout oogenesis in a time-dependent manner.

A federal audit of Canada’s strategy to promote the extraction of critical minerals says the government isn’t giving due consideration to the potential impact of mining on the environment, biodiversity and Indigenous people.

The establishment of neural connectivity is a major part of neural development. The central nervous system (CNS) midline is the most characterized axon guidance choice point, and work in Drosophila has played a pivotal role in understanding the molecular mechanisms responsible. Axons respond to attractive cues such as Netrin via the Frazzled receptor, and repulsive cues such as Slit via Robo receptors. Both signals are expressed at the CNS midline, affect pioneer axons, and have dramatic effects on the axon scaffold as a whole. Here, we focus on previous research analyzing classic mutants in the Slit/Robo pathway, which can readily be detected with a dissecting microscope. We also discuss analyzing these mutants in a teaching lab situation. The combination of sophisticated genetics and reliable axonal markers in Drosophila allows phenotypic analysis to be performed at the single-cell level. The elaborate architecture of neurons is very sensitive to disruption by genetic mutations, allowing the effects of novel mutations to be easily detected and assessed.

The host associations of mosquitoes vary by species, with some species being relative generalists, whereas others specialize, to varying extents, on a particular subset of the available host community. These host associations are driving factors in transmission dynamics of mosquito-vectored pathogens. For this reason, characterizing the host associations of mosquito species is critical for understanding the epidemiology of mosquito-vectored pathogens. Diverse methods have been used to associate mosquito species with their hosts. These typically include collecting mosquitoes that bite a restrained host (bait) or collecting wild blood-engorged mosquitoes and matching their blood meal to reference samples (blood meal analysis). Blood meal analysis refers to a collection of molecular techniques for determining the taxonomic identity of the source of a mosquito blood meal using cytological, serological, or DNA-based characteristics of the blood meal. Blood meal analyses that are based on DNA markers have advantages over cytological and serological methods and are effective for determining species-level identities of hosts from a broad range of potential host taxa. Here, we discuss effective techniques for analyzing blood meals.

Andergauge and National Oilwell are the latest of more than 300 petroleum industry companies to streamline product development and delivery

World's #1 mainstream analysis software adds 100-plus new features that put powerful design validation in easy-to-use packages

COSMOSMotion offers efficiency, quality, and cost benefits that increase value for designers who develop moving assemblies

SolidWorks 2006 x64 Edition and COSMOS 2006 x64 Edition revolutionize handling of very large assemblies

Customers highlight ability to see flow of gasses, liquids, and heat helps designers anticipate and correct flaws early in the design process

Stress, fluid flow, and motion analysis lend credence to company's designs for Boeing, Airbus, and other major aerospace companies

Cutting days and weeks from design cycle gives Syncroness more time to focus on designing lightweight, high performance products

Faced with soaring material costs, LeBARON Foundry streamlined designs, lightening manhole covers and frames by as much as 50 pounds

Software helps engineers choose the most promising designs for slicers and sanitation equipment by comparing and contrasting features and performance in virtual design environment

COSMOS enables engineers to catch and correct errors early in the design process, encouraging innovation and better product design

Both teachers and students have more resources to improve engineering education and prepare students for professional careers

Multiple iPhone units stored for forensic analysis have rebooted themselves, causing concern among law enforcement officials that Apple has a new security feature.

The phones in question had a few things in common, they were all running iOS 18.0, and they had been disconnected from cellular networks for some time. They were sent into a forensics lab on October 3, 2024.

The affected devices even included one that was in Airplane Mode and another that was kept in a Faraday cage, which prevents electrical signals from accessing the device. While it's most likely that the devices began boot-looping or that they ran low on battery, officials believe the restarts were caused by something else entirely.


Continue Reading on AppleInsider | Discuss on our Forums

More than half of the state plans fail to publicly report data on educator equity gaps, the National Council of Teacher Quality found in its analyses.

SINGAPORE, Nov 8 - Asia and even China are shaping up as surprisingly resilient investment markets as Donald Trump returns to the White House, with fund managers optimistic the region can withstand tariffs better than Europe.

Nov 6 - With Donald Trump heading back to the White House, Wall Street is anticipating the potential for lower taxes, deregulation and a U.S. president who is quick to sound off on everything from the stock market to the dollar. Trump made tariffs a

Trump's unlikely to endorse, sources say, because he doubts Rick Scott can win.

There's no question that we're all increasingly, and often exclusively, interacting with brands digitally. Consumers are now online through countless mechanisms – from laptops and mobile apps to AI-enabled voice assistants and sensor-based wearables. Engagement is diversifying in fascinating new ways. And when organizations can't see their customers interacting in [...]

SAS Customer Intelligence 360: Behavioral event tracking, targeting & engagement analysis was published on Customer Intelligence Blog.

Over the last 20+ years, global society has adopted digital devices at scale, and consumer interaction behaviors continually evolve and mature. As analysts, we're uniquely positioned to notice worldwide trends, country-specific nuances and localized market behaviors that can have significant impact on our brand's business goals. This global scope is [...]

SAS Customer Intelligence 360: Enriching analysis with device usage data was published on Customer Intelligence Blog.

Thermal analysis with the Cadence Celsius Thermal Solver integrated within the AWR Microwave Office circuit simulator gives designers an understanding of device operating temperatures related to power dissipation. That temperature information can be introduced into an electrothermal model to predict the impact on RF performance.(read more)

Learn how Xcelium PowerPlayback App enables the massively parallel Xcelium replay of waveforms for glitch-accurate power estimation of multi-billion gate SoC designs.(read more)

Melika Roshandell, Cadence product marketing director for the Celsius Thermal Solver, recently published an article in Designing Electronics discussing how the use of modern thermal analysis techniques can help engineers meet the challenges of today’s complex electronic designs, which require ever more functionality and performance to meet consumer demand.

Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These requirements make scaling traditional, flat, 2D-ICs very challenging. With the recent introduction of 3D-ICs into the electronic design industry, IC vendors need to optimize the performance and cost of their devices while also taking advantage of the ability to combine heterogeneous technologies and nodes into a single package. While this greatly advances IC technology, 3D-IC design brings about its own unique challenges and complexities, a major one of which is thermal management.

To overcome thermal management issues, a thermal solution that can handle the complexity of the entire design efficiently and without any simplification is necessary. However, because of the nature of 3D-ICs, the typical point tool approach that dissects the design space into subsections cannot adequately address this need. This approach also creates a longer turnaround time, which can impact critical decision-making to optimize design performance. A more effective solution is to utilize a solver that not only can import the entire package, PCB, and chiplets but also offers high performance to run the entire analysis in a timely manner.

Celsius Thermal Management Solutions

Cadence offers the Celsius Thermal Solver, a unique technology integrated with both IC and package design tools such as the Cadence Innovus Implementation System, Allegro PCB Designer, and Voltus IC Power Integrity Solution. The Celsius Thermal Solver is the first complete electrothermal co-simulation solution for the full hierarchy of electronic systems from ICs to physical enclosures. Based on a production-proven, massively parallel architecture, the Celsius Thermal Solver also provides end-to-end capabilities for both in-design and signoff methodologies and delivers up to 10X faster performance than legacy solutions without sacrificing accuracy.

By combining finite element analysis (FEA) for solid structures with computational fluid dynamics (CFD) for fluids (both liquid and gas, as well as airflow), designers can perform complete system analysis in a single tool. For PCB and IC packaging, engineering teams can combine electrical and thermal analysis and simulate the flow of both current and heat for a more accurate system-level thermal simulation than can be achieved using legacy tools. In addition, both static (steady-state) and dynamic (transient) electrical-thermal co-simulations can be performed based on the actual flow of electrical power in advanced 3D structures, providing visibility into real-world system behavior.

Designers are already co-simulating the Celsius Thermal Solver with Celsius EC Solver (formerly Future Facilities’ 6SigmaET electronics thermal simulation software), which provides state-of-the-art intelligence, automation, and accuracy. The combined workflow that ties Celsius FEA thermal analysis with Celsius EC Solver CFD results in even higher-accuracy models of electronics equipment, allowing engineers to test their designs through thermal simulations and mitigate thermal design risks.

Conclusion

As systems become more densely populated with heat-dissipating electronics, the operating temperatures of those devices impact reliability (device lifetime) and performance. Thermal analysis gives designers an understanding of device operating temperatures related to power dissipation, and that temperature information can be introduced into an electrothermal model to predict the impact on device performance. The robust capabilities in modern thermal management software enable new system analyses and design insights. This empowers electrical design teams to detect and mitigate thermal issues early in the design process—reducing electronic system development iterations and costs and shortening time to market.

To learn more about Cadence thermal analysis products, visit the Celsius Thermal Solver product page and download the Cadence Multiphysics Systems Analysis Product Portfolio.

Does anyone know how to not include a pbar in a constraint manager analysis? I have some relative delay constraints applied on a group of differential nets. When I analyze the design these all show an error. If I delete the plating bar from the design they are all passing. The plating bar gets generated on the Substrate Geometry / Plating_Bar class. I understand that I could just delete the plating bar to verify the constraint but the issue is when I archive this design I would like it to be clean meaning it is in the final state for manufacturing AND passing all constraints according to design reviews.

Anyone have an idea? 

Thank you!

The Sigrity and Systems Analysis (SIGRITY/SYSANLS) 2024.1 release is now available for download at Cadence Downloads . For the list of CCRs fixed in this release, see the README.txt file in the installation hierarchy. SIGRITY/SYSANLS 2024.1 Here is a list of some of the key updates in the SIGRITY/SYSANLS 2024.1 release: For more details about these and all the other new and enhanced features introduced in this release , refer to the following document: Sigrity Release Overview and Common Tools What's New . Supported Platforms and Operating Systems Platform and Architecture X86_64 (lnx86) Windows (64 bit) Development OS RHEL 8.4 Windows Server 2022 Supported OS RHEL 8.4 and above RHEL 9 SLES 15 (SP3 and above) Windows 10 Windows 11 Windows Server 2019 Windows Server 2022 Systems Analysis 2024.1 Clarity 3D Solver Clarity 3D Layout Structure Optimization Workflow : A new workflow, Clarity 3D Layout Structure Optimization Workflow, has been added to Clarity 3D Layout. This workflow integrates Allegro PCB Designer with Clarity 3D Layout for high-speed structure optimization. Component Geometry Model Editor : The new Clarity 3D Layout editor lets you set up ports, solder bumps/balls/extrusions, and two-terminal and multi-terminal circuits using a single GUI. Coaxial Open Port Option Added to Port Setup Wizard : The Coaxial Open Port option lets you create ports for each target net pin and reference net pin in Clarity 3D Layout. The nearby reference net pins are then used as a reference for each target net pin, reducing the number of ports needed. In addition, the ports of unused reference net pins are shorted to the ground. Parametric Import Option Added : Two new options, Parametric Import and Default Import , have been added to the Tools – Launch Clarity3DWorkbench menu. The Parametric Import option lets you import the design along with its parameters into Clarity 3D Workbench. The Default Import option lets you ignore the parameters when importing the design into Clarity 3D Workbench. Component Library Added to Generate 3D Components : Clarity 3D Workbench now includes a new component library that lets you use predefined 3D component templates or add existing 3D components to create 3D designs and simulation models. AI-Powered Content Search Capability : Clarity 3D Workbench and Clarity 3D Transient Solver now support an AI-powered capability for searching the content and displaying relevant information. Expression Parser to Handle Undefined Parameters : Clarity 3D Workbench and Clarity 3D Transient Solver support writing expressions or equations containing undefined parameters in the Property window to describe a simulation variable. The improved expression parser automatically detects any undefined parameter in an expression and prompts users to specify their values. This capability lets you define a model or a simulation variable as a function instead of specifying static values. For detailed information, refer to Clarity 3D Layout User Guide and Clarity 3D Workbench User Guide on the Cadence Support portal. Clarity 3D Transient Solver Mesh Processing Improved to Simulate Large Use Cases : Clarity 3D Transient Solver leverages a new meshing algorithm that enhances overall mesh processing, specifically for large designs and use cases. The new algorithm dramatically improves the mesh quality, minimum mesh size, number of mesh key points, total mesh number, and memory usage. Advanced Material Processing Engine : The material processing capability has been enhanced to handle thin outer metal, which previously resulted in open and short issues in some designs. In addition, the material processing engine offers improved mode extraction for particular use cases, including waveguide and coaxial designs. Characteristic Impedance Calculation Improved : The solver engine now uses a new analytical calculation method to calculate the characteristic impedance of coaxial designs with improved accuracy. For detailed information, refer to Clarity 3D Transient Solver User Guide on the Cadence Support portal. Celsius Studio Celsius Interchange Model Introduced : Celsius Studio now supports Celsius Interchange Model generation, which is a 3D model derived from detailed physical designs for multi-physics and multi-scale analysis. This Celsius Interchange Model file ( .cim ) serves as a design information carrier across Celsius Studio tools, enabling a variety of simulation and analysis tasks . Celsius 3DIC Thermal Workflow Improvements : The Thermal Simulation workflows in Celsius 3DIC have been significantly enhanced. Key improvements include: Advanced Power Setup with Transient Power Function and Multi Mode options Enhanced GUI for the Mesh Control and Simulation Control tabs Improved meshing capabilities Celsius Interchange Model ( .cim ) generation Material library support for block and connections Import of Heat Transfer Coefficients (HTCs) from a CFD file Bump creation through the Bump Array Wizard Layer Stackup CSV file generation Celsius 3DIC Warpage and Stress Workflow Enhancements : The Warpage and Stress workflow in Celsius 3DIC has undergone significant improvements, such as: Improved multi-stage warpage simulation flow for 3DIC packaging process Enhanced GUI for the Mesh Control , Simulation Control , and Stress Boundary Conditions tabs Support for large deformations and temperature profiles Bump creation through the Bump Array Wizard New constraint types Enhanced meshing capabilities Geometric Nonlinearity Support in Warpage and Stress Analysis : Large deformation analysis is now supported in warpage and stress studies. This study uses the Total Lagrangian approach to model geometric nonlinearities in simulation, which allows accurate prediction of final deformations. Thermal Network Extraction and Simulation : In the solid extraction flow in Celsius 3D Workbench, you can now import area-based power map files to create terminals. For designs with multiple blocks, this capability allows automatic terminal creation, eliminating the need to manually create and set up 2D sheets individually. Additionally, thermal throttling feature is now supported in Celsius Thermal Network. This makes it ideal for preliminary analyses or when a quick estimation is required. It runs significantly faster than 3D models, allowing for quicker iterations and more efficient decision-making. For detailed information, refer to the Celsius 3DIC User Guide , Celsius Layout User Guide and Celsius 3D Workbench User Guide on the Cadence Support portal. Sigrity 2024.1 Layout Workbench Improved Graphical User Interface : A new option, Use Improved User Interface , has been added in the Themes page of the Options dialog box in the Layout Workbench GUI. In the new GUI, the toolbar icons and menu options have been enhanced and rearranged. For detailed information, refer to Layout Workbench User Guide on the Cadence Support portal. Broadband SPICE Python Script Integration with Command Line for Simulation Tasks : Broadband SPICE lets you run Python scripts directly from the command line for performing simulation and analysis. The new -py and *.py options make it easier to integrate Python scripts with the command-line operations. This update streamlines the process of automating and customizing simulations from the command line, which makes your simulation tasks faster and easier. For detailed information, refer to Broadband SPICE User Guide on the Cadence Support portal. Celsius PowerDC Block Power Assignment (BPA) File Format Support : PowerDC now supports the BPA file format. Similar to the Pin Location (PLOC) file, the BPA file is a current assignment file that defines the total current of a power grid cell, which is then equally distributed across the power pins within the cell. This provides better control over the power distribution. Ability to Run Multiple IR Drop Cases Sequentially : You can now select multiple result sinks from the Current-Limited IR Drop flow and run IR Drop analysis for them sequentially. PowerDC automatically runs the simulations in sequence after you select multiple result sinks. This saves time by automating the process. Enhanced Support for Mixed Conversion Devices : PowerDC now supports mixing different conversion devices, such as switching regulators and linear regulators within a single DC-DC/LDO instance. This enhancement offers added flexibility by letting you configure each instance in your design according to your specific needs. For detailed information, refer to PowerDC User Guide on the Cadence Support portal. PowerSI Monte Carlo Method Added : A new option, Monte Carlo Method, has been added in the Optimality dialog box. This option lets you create multiple random samples to depict variations in the input parameters and assess the output. Channel Check Optimization Added : The S-Parameter Assessment workflow in PowerSI now supports Channel Check Optimization . It uses the AI-driven Multidisciplinary Analysis and Optimization (MDAO) technology that lets you optimize your design quickly and efficiently with no accuracy loss. For detailed information, refer to PowerSI User Guide on the Cadence Support portal. SPEEDEM Multi-threaded Matrix Solver Support Added : The Enable Multi-threaded Matrix Solver check box has been added that lets you accelerate the simulation speed for high-performance computing. This check box provides two options, Automatic and Always, to include the -lhpc4 or -lhpc5 parameter, respectively, in the SPEEDEM Simulator (SPDSIM) before running the simulation. For detailed information, refer to the SPEEDEM User Guide on the Cadence Support portal. XtractIM Options to Skip or Calculate Special DC-R Simulation Results : The Skip DC_R of Each Path and Only DC_R of Each Path options have been added to the Setup menu. Skip DC_R of Each Path : This option lets you skip the calculation of the DC-R result during the simulation. Other results, such as SPICE T-model , RL_C of Each Path , Coupling of Each Path , etc., are still calculated. Only DC_R of Each Path : This option lets you calculate the DC-R result only during the simulation. Other results, such as SPICE T-model , RL_C of Each Path , Coupling of Each Path , etc., are not calculated. Color Assignment for Pin Matching : The MCP Auto Connection window includes the Display Color Editor , which lets you assign a color for pin matching. It helps you easily identify the matching pins in the left and right sections of the MCP Auto Connection window . Ability to Save Simulations Individually : The Save each simulation individually check box has been added to the Tools - Options - Edit Options - Simulation (Basic) - General form. Select this check box and run the simulation to generate a simulation results folder containing files and logs with a timestamp for each simulation. Reuse of SPD File Settings : The XtractIM setup check box lets you import an existing package setup to reuse the configurations and settings from one .spd file to another. For detailed information, refer to XtractIM User Guide on the Cadence Support portal. Documentation Enhancements Cloud-Based Help System Upgraded The cloud-based help system, Doc Assistant, has been upgraded to version 24.10, which contains several new features and enhancements over the previous 2.03 version. Sigrity Release Team Please send your questions and feedback to sigrity_rmt@cadence.com .

IC 23.1-64b.ISR8.40

Hi all, I'm trying to run an stb analysis in a dspf extracted view via Probe terminal. The instance exist in the dspf and I already prepended the X that is placed in the dspf extraction.

Spectre complains with the following error:

Error found by spectre during STB analysis `stb'.
    ERROR (SPECTRE-16408): The probe parameter must be specified to perform stability analysis.

Analysis `stb' was terminated prematurely due to an error.

What is missing here?

Hi,

Current and valid TCAs for Functional Safety are readily available at the FuSa "one-stop shop".

But I have not been able to find any archive repository for access to the obsoleted versions.

I would need to have also v1.4 of Xcelum TCA to investigate exact changes wrt previous projects.

Anyone knows how to find it?

Best regards,  Lars

The Sigrity and Systems Analysis (SIGRITY/SYSANLS) 2022.1 HF2 release is now available for download at Cadence Downloads. For the list of CCRs fixed in the 2022.1 HF2 release, see the README.txt file in the installation hierarchy.(read more)

Microwaves & RF's David Maliniak interviews Sherry Hess of Cadence about recently announced products of Optimality and OnCloud.(read more)

By combining finite element analysis with computational fluid dynamics, designers can perform complete thermal system analysis using a single tool.(read more)

Read through this blog to know more about the new Reliability Report view in Virtuoso ADE Assembler and Virtuoso ADE Explorer.(read more)

This blog describes how to efficiently use Virtuoso Visualization and Analysis XL.(read more)

Which Analysis is Being Performed by Allegro in this Image?

A. Impedance

B. Coupling

C. Crosstalk

D. Return Path

E. Reflection

Simply answer by letter or include any reason to support your answer...

Hai Community,

I have a PCB board which has multiple high speed nets and I want to perform the EMI and EMC checking.

Which Cadence tool should I use for checking the EMI and EMC coupling?

Regards,

Rohit Rohan

How have Latin American exporters been affected by the rapid increase in the PRC's exports to the USA and other large markets? Are PRC and Latin American exports complementary or competitive with each other?

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Genetic analysis of five individuals preserved as plaster casts in the ruins of Pompeii contradicts established beliefs about the people and their relationships

Genetic analysis of five individuals preserved as plaster casts in the ruins of Pompeii contradicts established beliefs about the people and their relationships