stress analysis A study of stress, composition and grain interaction gradients in energy-dispersive X-ray stress analysis on materials with cubic symmetry By journals.iucr.org Published On :: 2024-06-07 The influence of various combinations of residual stress, composition and grain interaction gradients in polycrystalline materials with cubic symmetry on energy-dispersive X-ray stress analysis is theoretically investigated. For the evaluation of the simulated sin2ψ distributions, two different strategies are compared with regard to their suitability for separating the individual gradients. It is shown that the separation of depth gradients of the strain-free lattice parameter a0(z) from residual stress gradients σ(z) is only possible if the data analysis is carried out in section planes parallel to the surface. The impact of a surface layer z* that is characterized by a direction-dependent grain interaction model in contrast to the volume of the material is quantified by comparing a ferritic and an austenitic steel, which feature different elastic anisotropy. It is shown to be of minor influence on the resulting residual stress depth profiles if the data evaluation is restricted to reflections hkl with orientation factors Γhkl close to the model-independent orientation Γ*. Finally, a method is proposed that allows the thickness of the anisotropic surface layer z* to be estimated on the basis of an optimization procedure. Full Article text
stress analysis Stress analysis and mechanical characterization of thin films for microelectronics and MEMS applications By digital.lib.usf.edu Published On :: Sat, 15 Feb 2014 18:52:50 -0400 Full Article
stress analysis 2-D finite element modeling for nanoindentation and fracture stress analysis By digital.lib.usf.edu Published On :: Sat, 15 Feb 2014 19:02:50 -0400 Full Article
stress analysis Residual stress analysis in 3c-sic thin films by substrate curvature method By digital.lib.usf.edu Published On :: Sat, 15 Feb 2014 19:15:04 -0400 Full Article
stress analysis X-ray diffraction applications in thin films and (100) silicon substrate stress analysis By digital.lib.usf.edu Published On :: Sat, 15 Feb 2014 19:15:19 -0400 Full Article