5 items HVAC geothermal contractors need to be doing for business success.

At a recent IGSPHA meeting, tips were shared on how HVAC contractors can become geothermal powerhouses.

As Rochester city leaders set the ambitious goal of reducing greenhouse gas emissions by 50% by 2030 and 100% by 2050, the challenge is now how to follow through.

Decarbonization and electrification, the refrigerant transition, and incentives were big topics among geothermal companies at the AHR Expo. Consumer education and ease of product serviceability were also discussed.

With the geothermal market enjoying an enormous surge in popularity due to financial incentives and its reputation for sustainability, now is the time for contractors to strike while the iron is hot and add geothermal to their offerings.

The bill significantly reduces the cost of a geothermal installation, spurs job creation, and hopes to inspire more contractors to tap into the geothermal market.

A new study by Future Market Insights predicts the market to reach a valuation of $58.37 billion in 2021.

The packaging solutions will be on display at Pack Expo Las Vegas Booth N-10942, September 11-13. 

TRUFAST expanded its TubeSeal self-sealing fasteners with the Thermal-Grip TubeSeal, designed for insulation attachment over air barriers or WRBs; available in various lengths and pre-assembled options for all climates.

Location: Electronic Resource- 

I have only seen a hydrothermal vent once, during Dive 73 aboard the Monterey Bay Aquarium Research Institute’s Doc Ricketts. Unlike many deep-sea biologists, I…

The post A Journey to the Hottest Place on Earth: Hydrothermal Vents and the Resilient Pompeii Worm first appeared on Deep Sea News.

"Researchers at the University of Texas have unveiled a new thermal interface material that could revolutionize cooling, outperforming top liquid metal solutions by up to 72% in heat dissipation," writes Slashdot reader jjslash. "This breakthrough not only improves energy efficiency but also enables higher-density data center setups, cutting cooling costs and energy usage significantly." TechSpot reports: Thanks to a mechanochemically engineered combination of the liquid metal alloy Galinstan and ceramic aluminum nitride, this thermal interface material, or TIM, outperformed the best commercial liquid metal cooling products by a staggering 56-72% in lab tests. It allowed dissipation of up to 2,760 watts of heat from just a 16 square centimeter area. The material pulls this off by bridging the gap between the theoretical heat transfer limits of these materials and what's achieved in real products. Through mechanochemistry, the liquid metal and ceramic ingredients are mixed in an extremely controlled way, creating gradient interfaces that heat can flow across much more easily. Beyond just being better at cooling, the researchers claim that the higher performance reduces the energy needed to run cooling pumps and fans by up to 65%. It also unlocks the ability to cram more heat-generating processors into the same space without overheating issues. [...] As for how you can get your hands on the material: it's yet to make it out of the labs. The UT team has so far only tested it successfully at small scales but is now working on producing larger batches to put through real-world trials with data center partners. The material has been detailed in a paper published in the journal Nature Nanotechnology.

Read more of this story at Slashdot.

Thermal proteome profiling (TPP) allows for the unbiased detection of drug – target protein engagements in vivo. Traditionally, one cell type is used for TPP studies, with the risk of missing important differentially expressed target proteins. The use of whole organisms would circumvent this problem. Zebrafish embryos are amenable to such an approach. Here, we used TPP on whole zebrafish embryo lysate to identify protein targets of napabucasin, a compound that may affect Signal transducer and activator of transcription 3 (Stat3) signaling through an ill-understood mechanism. In zebrafish embryos, napabucasin induced developmental defects consistent with inhibition of Stat3 signaling. TPP profiling showed no distinct shift in Stat3 upon napabucasin treatment, but effects were detected on the oxidoreductase, Pora, which might explain effects on Stat3 signaling. Interestingly, thermal stability of several aldehyde dehydrogenases (Aldhs) was affected. Moreover, napabucasin activated ALDH enzymatic activity in vitro. Aldhs have crucial roles in retinoic acid metabolism and functionally we validated napabucasin-mediated activation of the retinoic acid pathway in zebrafish in vivo. We conclude that TPP profiling in whole zebrafish embryo lysate is feasible and facilitates direct correlation of in vivo effects of small molecule drugs with their protein targets.

3D CAD software helps design engineers serve biggest names in the auto and trucking industries

Thermal analysis with the Cadence Celsius Thermal Solver integrated within the AWR Microwave Office circuit simulator gives designers an understanding of device operating temperatures related to power dissipation. That temperature information can be introduced into an electrothermal model to predict the impact on RF performance.(read more)

Melika Roshandell, Cadence product marketing director for the Celsius Thermal Solver, recently published an article in Designing Electronics discussing how the use of modern thermal analysis techniques can help engineers meet the challenges of today’s complex electronic designs, which require ever more functionality and performance to meet consumer demand.

Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These requirements make scaling traditional, flat, 2D-ICs very challenging. With the recent introduction of 3D-ICs into the electronic design industry, IC vendors need to optimize the performance and cost of their devices while also taking advantage of the ability to combine heterogeneous technologies and nodes into a single package. While this greatly advances IC technology, 3D-IC design brings about its own unique challenges and complexities, a major one of which is thermal management.

To overcome thermal management issues, a thermal solution that can handle the complexity of the entire design efficiently and without any simplification is necessary. However, because of the nature of 3D-ICs, the typical point tool approach that dissects the design space into subsections cannot adequately address this need. This approach also creates a longer turnaround time, which can impact critical decision-making to optimize design performance. A more effective solution is to utilize a solver that not only can import the entire package, PCB, and chiplets but also offers high performance to run the entire analysis in a timely manner.

Celsius Thermal Management Solutions

Cadence offers the Celsius Thermal Solver, a unique technology integrated with both IC and package design tools such as the Cadence Innovus Implementation System, Allegro PCB Designer, and Voltus IC Power Integrity Solution. The Celsius Thermal Solver is the first complete electrothermal co-simulation solution for the full hierarchy of electronic systems from ICs to physical enclosures. Based on a production-proven, massively parallel architecture, the Celsius Thermal Solver also provides end-to-end capabilities for both in-design and signoff methodologies and delivers up to 10X faster performance than legacy solutions without sacrificing accuracy.

By combining finite element analysis (FEA) for solid structures with computational fluid dynamics (CFD) for fluids (both liquid and gas, as well as airflow), designers can perform complete system analysis in a single tool. For PCB and IC packaging, engineering teams can combine electrical and thermal analysis and simulate the flow of both current and heat for a more accurate system-level thermal simulation than can be achieved using legacy tools. In addition, both static (steady-state) and dynamic (transient) electrical-thermal co-simulations can be performed based on the actual flow of electrical power in advanced 3D structures, providing visibility into real-world system behavior.

Designers are already co-simulating the Celsius Thermal Solver with Celsius EC Solver (formerly Future Facilities’ 6SigmaET electronics thermal simulation software), which provides state-of-the-art intelligence, automation, and accuracy. The combined workflow that ties Celsius FEA thermal analysis with Celsius EC Solver CFD results in even higher-accuracy models of electronics equipment, allowing engineers to test their designs through thermal simulations and mitigate thermal design risks.

Conclusion

As systems become more densely populated with heat-dissipating electronics, the operating temperatures of those devices impact reliability (device lifetime) and performance. Thermal analysis gives designers an understanding of device operating temperatures related to power dissipation, and that temperature information can be introduced into an electrothermal model to predict the impact on device performance. The robust capabilities in modern thermal management software enable new system analyses and design insights. This empowers electrical design teams to detect and mitigate thermal issues early in the design process—reducing electronic system development iterations and costs and shortening time to market.

To learn more about Cadence thermal analysis products, visit the Celsius Thermal Solver product page and download the Cadence Multiphysics Systems Analysis Product Portfolio.

Melika Roshandell talks with David Malinak in a Microwaves & RF QuickChat video about the thermal challenges in today’s complex electronic designs and how the Celsius solver uniquely addresses them.(read more)

By combining finite element analysis with computational fluid dynamics, designers can perform complete thermal system analysis using a single tool.(read more)

Any tips or SKIL files to help create a thermal shaped openings for paste masks for a donut shaped pin for mics or stand-offs like below?

Optimizing PCB thermal performance is essential in today’s high-density designs, as it ensures stability, prolongs component life, and prevents potential thermal issues. One of the first steps to achieving this is with strategic component placement. Positioning high-power components—such as regulators, power transistors, or processors—away from heat-sensitive parts can prevent thermal interference, and placing them near the edges of the PCB often helps dissipate heat more effectively. It’s also beneficial to group components by their heat generation, creating dedicated thermal zones that can manage localized heating and reduce impact on other areas of the board.

Using thermal vias is another effective technique. By placing thermal vias under components like BGAs or power ICs, heat can be transferred from the surface to internal layers or ground planes. Increasing the size and number of these vias, or using thicker plating, enhances heat conductivity and helps manage heat more evenly across layers in multilayer boards. Increasing copper thickness on the PCB also has a major impact. Opting for thicker copper layers (e.g., 2 oz or even 3 oz copper) significantly boosts the heat dissipation capabilities of power planes and traces, especially in high-current areas. Large copper planes, such as dedicated ground or power planes, are equally effective in spreading heat efficiently. Adding thermal pads directly beneath heat-generating components improves this heat distribution.

Thermal relief pads help regulate heat flow for through-hole components by controlling heat transfer, which reduces thermal stress during soldering and prevents excessive heat spread to nearby sensitive areas. Performing thermal analysis with software tools like Celsius can be invaluable, as it allows you to simulate and model heat distribution, spot potential thermal issues, and refine your design before finalizing it.

Using heat sinks and thermal pads provides a direct way to draw heat from high-power components. Heat sinks can be attached with thermal adhesives, screws, or clamps, while thermal interface materials (TIMs), such as thermal pads or conductive adhesives, further reduce thermal resistance, enhancing heat-transfer efficiency. Optimizing the PCB layer stackup is also a key factor. Dedicated ground and power layers improve heat conduction across the PCB, enabling heat transfer between layers, particularly in high-density and multilayer PCBs.

In designs with high power requirements, active cooling options like fans, blowers, or heat pipes can be essential, helping to direct airflow across the PCB and further improving heat dissipation. Adding ventilation slots around hot zones and considering passive cooling paths enhance natural airflow, making the design more thermally efficient. By combining several of these techniques, you can create a PCB that handles heat effectively, resulting in a robust, long-lasting, and reliable product.

Let us know if you’ve had any challenges with thermal management in your designs—I’d be glad to discuss further!

The project will support an expansion of Indonesia's geothermal generating capacity to contribute to the sustainability, resiliency, and sufficiency of the electricity system. The project will support PT Geo Dipa Energi (GDE), a state-owned geothermal company, to commission an additional 110 megawatts (MW) of geothermal electricity generating capacity at the Dieng geothermal field in Central Java.

The Indian Institute of Technology (IIT) Madras on Monday announced a collaboration with the Indian Space Research Organisation (ISRO) to establish a Centre of Excellence (CoE) for research in 'Fluid and Thermal Sciences'.