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UNIT CELL PACK

A unit cell pack according to the present disclosure includes a first battery module including battery cartridges that are sequentially stacked, a plurality of batteries wherein two batteries are seated on an upper surface of each of the battery cartridges, electrode connection members respectively positioned on both sides of the battery cartridges, and a battery cover covering the battery cartridges, the plurality of batteries, and the electrode connection members; a second battery module being adjacent to the first battery module and including same constituent elements as the first battery module; a battery housing surrounding the first battery module and the second battery module, and including air inflow window covers and air outflow window covers facing each other; and a fan duct disposed on the air outflow window covers of the battery housing, in which the two batteries on the upper surface of each of the battery cartridges are electrically connected in parallel, the battery cartridges are electrically connected in series through the electrode connection members, a lower surface of each of the battery cartridges defines air guide grooves with respect to each other, and the air guide grooves are aligned with the air inflow window covers and the air outflow window covers on one of the first battery module and the second battery module, forming straight air passages.




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RADIO FREQUENCY LABEL FOR PACKAGING SECURITY

A system, method, and device for improving the functioning of security tags for use with merchandise are provided. A security tag device, to be used in conjunction with a tag monitoring device, may be provided with a product. The product may be conductive or may have metallic packaging. The security tag may include a planar dielectric substrate having a first side and an opposing side. An electronic article surveillance (EAS) circuit may be placed on the first side of the planar dielectric substrate. A ferrite sheet having a first side and an opposing side may be coupled to the opposing side of the planar dielectric substrate. A metal backing sheet may be coupled to the opposing side of the ferrite sheet. The planar dielectric substrate may be centered or offset on the ferrite sheet and the ferrite sheet may be centered or offset on the metal backing sheet.




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Seat support device for a riding animal or a pack animal

A seat support device for a riding animal or a pack animal, a saddle tree, and a saddle with such a saddle tree. The seat support device comprises a right multi-linked lug arrangement with a first link section and at least a second link section and a left multi-linked lug arrangement with a first link section and at least a second link section. A pivoting device with a pivot axis is each formed case between two adjacent link sections, so that two adjacent link sections are pivotable towards one other around a pivot axis substantially within a pivot plane which penetrates the pivot axis substantially perpendicular.




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Semiconductor Device and Method of Forming Ultra High Density Embedded Semiconductor Die Package

A semiconductor device has a plurality of semiconductor die. A first prefabricated insulating film is disposed over the semiconductor die. A conductive layer is formed over the first prefabricated insulating film. An interconnect structure is formed over the semiconductor die and first prefabricated insulating film. The first prefabricated insulating film is laminated over the semiconductor die. The first prefabricated insulating film includes glass cloth, glass fiber, or glass fillers. The semiconductor die is embedded within the first prefabricated insulating film with the first prefabricated insulating film covering first and side surfaces of the semiconductor die. The interconnect structure is formed over a second surface of the semiconductor die opposite the first surface. A portion of the first prefabricated insulating film is removed after disposing the first prefabricated insulating film over the semiconductor die. A second prefabricated insulating film is disposed over the first prefabricated insulating film.




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Packaging Device Having Plural Microstructures Disposed Proximate to Die Mounting Region

An example method includes providing a packaging device includes a substrate having an integrated circuit die mounting region. A plurality of microstructures, each including an outer insulating layer over a conductive material, are disposed proximate a side of the integrated circuit die mounting region. An underfill material is disposed between the substrate and the integrated circuit die, the microstructures preventing spread of the underfill. In another example method, a via can be formed in a substrate and the substrate etched to form a bump or pillar from the via. An insulating material can be formed over the bump or pillar. In another example method, a photoresist deposited over a seed layer and patterned to form openings. A conductive material is plated in the openings, forming a plurality of pillars or bumps. The photoresist and exposed seed layer are removed. The conductive material is oxidized to form an insulating material.




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METHOD OF MARKING A SEMICONDUCTOR PACKAGE

A method of making a semiconductor device can include providing a wafer comprising a plurality of semiconductor die, wherein each semiconductor die comprises an active surface and a backside opposite the active surface. A photosensitive layer can be formed over the wafer and on a backside of each of the plurality of semiconductor die within the wafer with a coating machine. An identifying mark can be formed within the photosensitive layer for each of the plurality of semiconductor die with a digital exposure machine and a developer, wherein a thickness of the identifying mark is less than or equal to 50 percent of a thickness of the photosensitive layer. The photosensitive layer can be cured. The wafer can be singulated into a plurality of semiconductor devices.




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FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

A semiconductor package is provided, including: an insulating base body having a first surface with an opening and a second surface opposite to the first surface; an insulating extending body extending outward from an edge of the first surface of the insulating base body, wherein the insulating extending body is less in thickness than the insulating base body; an electronic element having opposite active and inactive surfaces and disposed in the opening with its inactive surface facing the insulating base body; a dielectric layer formed in the opening of the insulating base body and on the first surface of the insulating base body, the insulating extending body and the active surface of the electronic element; and a circuit layer formed on the dielectric layer and electrically connected to the electronic element. The configuration of the insulating layer of the invention facilitates to enhance the overall structural rigidity of the package.




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MANUFACTURING METHOD OF CHIP PACKAGE AND PACKAGE SUBSTRATE

A manufacturing method of a package substrate is provided. The method includes forming a first circuit layer on a carrier. A passive component is disposed on the first circuit layer and the carrier. A dielectric layer is formed on the carrier to embed the passive component and the first circuit layer in the dielectric layer. A second circuit layer is formed on the dielectric layer. The carrier is removed from the dielectric layer. A manufacturing method of a chip package is also provided.




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METHOD AND STRUCTURE FOR WAFER-LEVEL PACKAGING

A method for wafer-level packaging includes providing a substrate having a conductive metal pad formed on the surface of the substrate; forming a metal core on the top of the conductive metal pad with the metal core protruding from the surface of the substrate; then, forming an under bump metal layer on the top surface and the side surface of the metal core; and finally, forming a bump structure on the top of the under bump metal layer.




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PACKAGING OPTOELECTRONIC COMPONENTS AND CMOS CIRCUITRY USING SILICON-ON-INSULATOR SUBSTRATES FOR PHOTONICS APPLICATIONS

Package structures and methods are provided to integrate optoelectronic and CMOS devices using SOI semiconductor substrates for photonics applications. For example, a package structure includes an integrated circuit (IC) chip, and an optoelectronics device and interposer mounted to the IC chip. The IC chip includes a SOI substrate having a buried oxide layer, an active silicon layer disposed adjacent to the buried oxide layer, and a BEOL structure formed over the active silicon layer. An optical waveguide structure is patterned from the active silicon layer of the IC chip. The optoelectronics device is mounted on the buried oxide layer in alignment with a portion of the optical waveguide structure to enable direct or adiabatic coupling between the optoelectronics device and the optical waveguide structure. The interposer is bonded to the BEOL structure, and includes at least one substrate having conductive vias and wiring to provide electrical connections to the BEOL structure.




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METHODS OF FORMING IMAGE SENSOR INTEGRATED CIRCUIT PACKAGES

A method of forming image sensor packages may include performing a molding process. Mold material may be formed either on a transparent substrate in between image sensor dies, or on a removable panel in between transparent substrates attached to image sensor dies. Redistribution layers may be formed before or after the molding process. Mold material may be formed after forming redistribution layers so that the mold material covers the redistribution layers. In these cases, holes may be formed in the mold material to expose solder pads on the redistribution layers. Alternatively, redistribution layers may be formed after the molding process and the redistribution layers may extend over the mold material. Image sensor dies may be attached to a glass or notched glass substrate with dam structures. The methods of forming image sensor packages may result in hermetic image sensor packages that prevent exterior materials from reaching the image sensor.




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ARRAY SUBSTRATE OF ORGANIC LIGHT-EMITTING DIODES AND METHOD FOR PACKAGING THE SAME

An array substrate of organic light-emitting diodes and a method for fabricating the same are provided to narrow an edge frame of product device of organic light-emitting diodes, to shorten the package process time, and to improve the substrate utilization and the production efficiency. The array substrate of organic light-emitting diodes includes a plurality of display panels disposed in an array of rows and columns, wherein at least two adjacent display panels are connected through a frame adhesive, and there is no cutting headroom between at least one side of the at least two adjacent display panels.




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ELECTROSTATIC FLUID DELIVERY BACKPACK SYSTEM

An electrostatic fluid delivery system is configured to deliver fluid, such as a disinfectant fluid, onto a surface by electrically charging the fluid and forming the fluid into a mist, fog, plume, or spray that can be directed onto a surface, such as a surface to be cleaned. The system atomizes the fluid using a high-pressure air stream and passes the fluid through an electrode inside a nozzle assembly to charge, such as negatively charge, droplets of the atomized fluid. The system uses a unique nozzle design that is configured to optimally atomize the fluid into various sized droplets.




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DISTRIBUTED ON-PACKAGE MILLIMETER-WAVE RADIO

Embodiments described herein generally relate to phased array antenna systems or packages and techniques of making and using the systems and packages. A phased array antenna package may include a distributed phased array antenna comprising (1) a plurality of antenna sub-arrays, which may each include a plurality of antennas, (2) a plurality of Radio Frequency Dies (RFDs), each of the RFDs located proximate and electrically coupled by a trace of a plurality of traces to a corresponding antenna sub-array of the plurality of antenna sub-arrays, and (3) wherein each trace of the plurality of traces configured to electrically couple an antenna of the plurality of antennas to the RFD located proximate the antenna, wherein each trace of the plurality of traces is configured to transmit millimeter wave (mm-wave) radio signals, and wherein the plurality of traces are each of a substantially uniform length.




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Reusable heater in a package

A heater in a housing with an opening. The heater reacts with oxygen to produce heat and upon consumption of the oxygen, the heating reaction stops and can be restarted at a later point in time upon the introduction of additional oxygen and is used in a package for heating pre-moistened substrates such as sanitary wipes, and the like.




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PACKING SYSTEM AND METHOD FOR CHROMATOGRAPHY COLUMNS

The invention relates to a method for providing an aseptic chromatography column, said method comprising the steps of: pre-sterilize an empty chromatography column;pre-sterilize a chromatography medium;introducing the pre-sterilized chromatography medium into the pre-sterilized chromatography column using aseptic equipment, thereby providing an aseptic chromatography column comprising chromatography medium.




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Opening in the Pad for Bonding Integrated Passive Device in InFO Package

A package includes a conductive pad, with a plurality of openings penetrating through the conductive pad. A dielectric layer encircles the conductive pad. The dielectric layer has portions filling the plurality of openings. An Under-Bump Metallurgy (UBM) includes a via portion extending into the dielectric layer to contact the conductive pad. A solder region is overlying and contacting the UBM. An integrated passive device is bonded to the UBM through the solder region.




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ORGANIC LIGHT-EMITTING DISPLAY PANEL, DISPLAY APPARATUS CONTAINING THE SAME, AND RELATED PACKAGING METHOD

The present disclosure provides a method for packaging an organic light-emitting diode (OLED) display panel. The method includes providing a first substrate and a second substrate; forming a first bonding layer in a packaging region of the first substrate; and forming a second bonding layer in a packaging region of the second substrate. The method also includes bonding the first substrate with the second substrate by molecular bonding between the first bonding layer and the second bonding layer.




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Variable Refrigerant Package

A variable refrigerant package air conditioner is shown that is easy to install in new construction with a unique base that causes collected mixture that overflows to drain outside the building. A control system is shown that has motors and compressor that are pulse width modulated so the air conditioner is infinitely variable while maintaining the highest possible power factor. Dehumidification of outside air occurs as it is mixed with inside air. By gradually approaching a temperature set point and even reheating after dehumidification, moisture is removed from the room.




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FLEXIBLE MODULAR HIERARCHICAL ADAPTIVELY CONTROLLED ELECTRONIC-SYSTEM COOLING AND ENERGY HARVESTING FOR IC CHIP PACKAGING, PRINTED CIRCUIT BOARDS, SUBSYSTEMS, CAGES, RACKS, IT ROOMS, AND DATA CENTERS USING QUANTUM AND CLASSICAL THERMOELECTRIC MATERIALS

A system for adaptive cooling and energy harvesting comprising at least one thermoelectric device capable of acting as a thermoelectric cooler and as a thermoelectric generator, a hierarchical multiple-level control system, and electronics controlled by the control system and connected to the thermoelectric device. The electronics selectively configure the thermoelectric device in at least in a thermoelectric cooler operating mode and in a thermoelectric generation operating mode. The thermoelectric device can incorporate quantum-process and quantum-well materials for higher heat transfer and thermoelectric generation efficiencies. The invention provides for thermoelectric devices to additionally operate in temperature sensing mode. The hierarchical control system can comprise a plurality of control system, each of which can operate in isolation and can be interconnected with additional subsystems associated with other hierarchical levels. The hierarchical control system can comprise linear (additive) control, bilinear (additive and multiplicative) control, nonlinear control, and hysteresis.




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Umbrella Weather Pack

The disclosed herein is a personal rain protection device that serves as an umbrella combined and connected with a vest. The umbrella and vest combination can function in all types of rainstorms. The vest aspect is located at the torso of a wearer and extends from the users shoulders. The vest element also includes relatively light weights at the tail end of the vest to protect against succumbing to powerful wind gusts. The present invention, including the umbrella, is not handheld, but rather it is worn along with the vest to which the umbrella is attached to.




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How The Stimulus Package Leaves Out U.S. Citizens With Undocumented Spouses

Stimulus checks are rolling into bank accounts across the country, but many have experienced confusion about when, and if, their portion of the $2 trillion economic relief package is coming.




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Victorian Government announces an arts survival package

Victorian government has announced a $16.8 million survival package to provide immediate support to Victorian creative organisations and individuals to sustain employment, develop new works and provide opportunities for creative community participation.





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ADSR Sounds launches hellofi sound pack incl. Serum presets

ADSR Sounds has announced its latest sound pack hellofi, a collection of samples and Serum synth presets with an upbeat take on lo-fi and indie pop. Take a deep breath and lets the vibes hit you like sunlight through an open window. ADSR’s latest Indie Lo-Fi offering –hellofi, brings together a colourful collection of beats […]

The post ADSR Sounds launches hellofi sound pack incl. Serum presets appeared first on rekkerd.org.




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NOISS COKO Control Pack for Ableton Live 10 FREE at Isotonik Studios

Isotonik Studios is offering the Control Pack of Max for Live devices by NOISS COKO as a free download for the next few days. The Control Pack is a collection of three MaxforLive Devices designed by NOISS COKO, developer of the best selling Modulation Pack & Sempler PRO. Consisting of three MaxforLive Devices, CC Manager, […]

The post NOISS COKO Control Pack for Ableton Live 10 FREE at Isotonik Studios appeared first on rekkerd.org.




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Audentity Records releases Boom Bap Hip Hop 4 sample pack

Audentity Records has introduced its latest sample pack Boom Bap Hip Hop 4, a collection of over 200 loops and one-shots. Boom Bap Hip Hop 4 includes atmospheres, brass, fx, synth, guitar, keys, drums & percussion, strings, bass, and more. Our team spent weeks in the studio to bring you one of our best Boom […]

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ProducerSpot Spring Sale: Get 30% off sample packs

ProducerSpot has announced the launch of its 2020 Spring Sale, offering a 30% discount on all sample packs for a few days only. The sale features hundreds of titles, including some of the latest releases: Hip Hop Essentials by Diginoiz. Uzi Nation by Smemo Sounds. Fast Life by Studio Trap. Osiris Future Chillwave by Certified […]

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Vocal Presets releases Stargaze free Auto-Tune presets pack

Vocal Presets has released Stargaze, a collection of vocal presets for the Auto-Tune 8 and Auto-Tune Pro vocal processor plugins by Antares. Deep, Dark, Twisted… Stargaze is our most aberrant vocal preset yet. Hard smashing limiters combine with soul crushing saturators to turn your vocals into that bold authority you need to command your audiences […]

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Indossa releases Classic Synths free sample pack for OP-Z

Indossa has announced the release of Classic Synths for OP-Z, a collection of samples from some classic ’80s ‘odd-ball’ synths, programmed for the OP-Z multimedia synthesizer and sequencer from Teenage Engineering. The pack also comes with some bonus 808 sounds and drum samples. 80’s Synth Waves programmed for OP-Z! Mount your OP-Z in content mode […]

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Ghosthack releases Ultimate Midtempo Attack sample pack

Ghosthack has announced the release of Ultimate Midtempo Attack, a collection of over 590 sounds for Midtempo productions. Pioneered by producers like REZZ, Gesaffelstein or Aglory, midtempo is quite arguably the hottest new shit out there. Defined through a shredded, thoroughly industrial sound design, dubstep-like bass signatures and tempos around 80-115bpm, in the last years […]

The post Ghosthack releases Ultimate Midtempo Attack sample pack appeared first on rekkerd.org.




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ADSR launches Chop Shop Underground Master Bundle, 10 packs for $20 USD

ADSR Sounds has announced a flash on the Underground Master Bundle, a collection of 10 sound packs from Chop Shop Samples for only $20 USD. Get down and dirty in the studio with over 3,500 samples and loops for Deep Tech, Minimal, Tech House, Techno and House! Featuring Drum loops, vocal loops, bass loops, synth […]

The post ADSR launches Chop Shop Underground Master Bundle, 10 packs for $20 USD appeared first on rekkerd.org.



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Save up to 67% on AngelicVibes sound packs (Trap, Hip Hop, Vocals)

AngelicVibes is offering discounts of up to 67% off on all of its sample packs and synth presets for a limited time. Everything on our website is on sale this week. Take advantage of this before it’s too late. Go shopping and have some fun ???? The sale includes the latest sample packs Street Smart, […]

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Industrial Strength releases Pharmaceutical Movie Clips sample pack

Industrial Strength Samples has launched Pharmaceutical Movie Clips sample pack featuring a collection of vocal samples. The content provided has been sorted thru and does not contain any offensive samples that are directed to any one or any one group of people. It’s comical and pretty hardcore at the same time. Pharmaceutical Movie Clips offers […]

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Audentity Records releases Big Room 2K20 sample pack

Audentity Records has announced the release of Big Room 2K20, a sample pack featuring a collection of energetic melodies, chords and driving basslines. The pack has a great mixture and balance between Progressive House and EDM, it has all the sounds needed for that Future Progressive House feel. Included are presets for Spire, midis and […]

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W.A. Production releases Future House Sting sample pack

W.A. Production has released a new What About series sample pack titled Future House String, a collection of sounds inspired by artists like Tchami, Don Diablo, Mesto, and Brook. Get ready for future house fused with deep house and lined with some deep bass progressive attributes. We’ve given you all the elements that you need […]

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Loopmasters releases Proxima Grime sounds pack for Xfer Serum

Loopmasters has announced its latest Patchworx series soundset Proxima Grime, a collection of 64 presets for the Serum wavetable synth by Xfer Records. This pack by Proxima features a selection of meticulously crafted heavy basses, twisted synths, dark pads, colorful FX and more. Proxima has been involved in music most of his life. His first […]

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Drum Depot Total Drums Bundle delivers 5 GB of drums in limited edition package

Marco Scherer has announced availability of the Total Drums Bundle, a limited edition collection of all 11 Drum Depot series featuring 5 GB of drum sounds. The bundle features 175 drum kits from classic and modern drum machines like TR-808, Erica‘s Techno System, JoMoX AirBase-99, Arturia DrumBrute and others, but also obscure and very rare […]

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Glitchmachines Spiral sample pack on sale for $5 USD, Found Sounds Bundle 78% OFF

Plugin Boutique has launched a sale on the Spiral sample pack featuring 400 designed sound effects inspired by geometry, mathematics and motion. On sale at over 80% off the regular price, the Spiral pack includes 1 GB of content which has been meticulously crafted to compliment modern music, game and multimedia productions in need of […]

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FOCUS: Serum Melodic Techno sound pack by Datacode now available

Datacode Records has announced the release of the new FOCUS: Serum Melodic Techno sound pack, a collection of Serum presets with a focus on Melodic Techno, Progressive House, Techno and Minimal. The pack features 68 brand new Serum presets and 20 Serum patches from FOCUS: Melodic Techno as a bonus. The follow up release to […]

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Cluster Sound releases RX7 free drum pack for Ableton Live

Cluster Sound has announced the release of RX7, a free Ableton Live drum pack based on the vintage RX7 drum machine. The 12-bit drum machine from Yamaha comes equipped with 100 PCM samples. It was used by artists such as Future Sound of London, Massive Attack, Bjork and Nine Inch Nails. Released in 1988 by […]

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Homegrown: Hazy Lo-Fi Melodics sample pack by Prime Loops

Prime Loops has released its new sample pack Homegrown: Hazy Lo-Fi Melodics, a collection of over 190 blissful melodies and lush chord progressions. We’re proud to drop this collection of over 190 simmering, blissful and hazy melodies, perfect for adding that soulful and nostalgic sound to your production, just in time for those Hazy summer […]

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STL Tones releases Mark Lewis Preset Packs for ToneHub, Kemper & Axe Fx

STL Tones has announced the release of Mark Lewis Signature Preset Packs, available in plugin format through STL ToneHub, and also available for hardware units Kemper and Axe-Fx. Mark Lewis has engineered productions and/or mixes for artists such as Trivium, Whitechapel, DevilDriver, The Black Dahlia Murder, Havok, Bury Your Dead, Chimaira, August Burns Red, Unearth, […]

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W.A. Production Savage Bass House Bundle: Save 95% on sound packs, templates & tutorial

W.A. Production has launched a limited time offer on the Savage Bass House Bundle, a collection of sound packs, DAW templates and audio tutorial course at 95% off the regular price. You don’t have to go for broke to make great bass house. Our Savage Bass House Bundle comes complete with all the tools you […]

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GowlerMusic releases free Lo-Fi Guitars sample pack

GowlerMusic has announced its latest free sample pack Lo-Fi Guitars, a collection of unique guitar lines and chord progressions with a lo-fi vibe. If you are looking to add that old-school, hazy vibe to your beats, then look no further. Lo-Fi Guitars features a collection of unique guitar lines and chord progressions. All the samples […]

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Bluezone releases Tank Explosion Sound Effects sample pack

Bluezone Corporation has announced the release of Tank – Explosion Sound Effects, a new sound library including a wide range of loud explosions, distant blasts, military tank firing and reloading, mechanical parts, incoming artillery shells, debris and more. Devastating impact: With an arsenal of 184 audio samples, this intimidating sound library brings sound designers a […]

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Soundiron releases Principessa, Kazoo 2.0 & Cacophony + Free Olympus Choir Elements Preset Pack

Soundiron has released its newest Vintage Keys Series sample library Principessa, a vintage 86-key synthesizer for Native Instruments Kontakt. This library captures the vintage and classic sound of the very rare “Princess” organ. This 2-tiered electric organ has a rich analog synthesizer tone with a creamy low and mid-range and soft rolled-off highs. We’ve captured […]

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Thick Sounds releases Jungle Colossus 2 sample pack at Loopmasters

Thick Sounds has released its new sample pack Jungle Colossus 2, a new collection of loops and samples for Jungle and Drum & Bass, Breakbeat, Dub, Reggae and beyond. Inspired by sounds of Benny Page, Congo Natty, Serial Killaz and Run Tingz to name a few, ‘Jungle Colossus’ is designed for producers who’s looking for […]

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Apollo Sound releases Real Rap Vocal pack for Trap, Hip Hop & EDM

Apollo Sound has released a new sample pack titled Real Rap Vocal, a compact vocal pack for any Trap, Hip-Hop or EDM producer. The pack includes 226 royalty free vocal samples and loops. As a modern producer you can’t produce any track without good vocal shouts, rappin’ vocal hooks or pre-drop pitched vocal phrase. So […]

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FeelYourSound releases The Piano Sessions package with free MIDI melody generators

FeelYourSound has announced the release of The Piano Sessions, a free songwriting package for producers of any genre. It contains over 26 free chord transformation presets for the ChordPotion songwriting plugin. The new presets transform the chords in your DAW into completely new piano melodies. With a few clicks, you can turn any chords into […]

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