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One reason for attending the upcoming Design Automation Conference (DAC 2015) is to learn about challenges other engineers have faced, and hear about their solutions. And the best place to do that is the Cadence Theater, located at the Cadence booth (#3515). The Theater will host continuous half-hour customer and partner presentations from 10:00 am Monday, June 8, to 5:30 pm Wednesday June 4.

As of this writing, 43 presentations are scheduled. This includes 17 customer presentations, 23 partner presentations, and 3 Cadence presentations, The presentations are open to all DAC attendees and no reservations are required.

Cadence customers who will be speaking include engineers from AMD, ams, Allegro Micro, Broadcom, IBM, Netspeed, NVidia, Renesas, Socionet, and STMicroelectronics. Partner presentations will be provided by ARM, Cliosoft, Dini Group, GLOBALFOUNDRIES, Methodics, Methods2Business, National Instruments, Samsung, TowerJazz, TSMC, and X-Fab.

These informal presentations are given in an interactive setting with an opportunity for questions and answers. Audio recordings with slides will be available at the Cadence web site after DAC. To access recordings of the 2014 DAC Theater presentations, click here.

This Cadence DAC Theater presentation drew a large audience at DAC 2015

Here’s a listing of the currently scheduled Cadence DAC Theater presentations. The latest schedule is available at the Cadence DAC 2015 site.

Monday, June 8

Tuesday, June 9

Wednesday, June 10

In a Wednesday session (June 10, 10:00 am) at the theater, the Cadence Academic Network will sponsor three talks on academic/industry collaboration models. Speakers are Dr. Zhou Li, architect, Cadence; Prof. Xin Li, Carnegie-Mellon University; and Prof. Laleh Behjat, University of Calgary.

As shown above, there will be a giveaways for a set of Bose noise-cancelling headphones, an iPad Mini, and a GoPro Hero3 video camera.

See the Cadence Theater schedule for further details. And be sure to view our Multimedia Site for live blogging and photos and videos from DAC. For a complete overview of Cadence activities at DAC, see our DAC microsite.

Richard Goering

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First, the good news. The EDA industry will grow from $6.2 billion in 2015 to $9.0 billion in 2019, according to Gary Smith, chief analyst at Gary Smith EDA. Year-to-year growth rates will range from +4% to +11.2%.

But in his annual presentation on the eve of the Design Automation Conference (DAC 2015), Smith noted that Wall Street is unimpressed. “The people I talk to want long-term steady growth, no sharp up-turns, no sharp downturns,” Smith said. “To the rest of Wall Street, we’re boring.”

Smith spent the rest of his talk noting how EDA can be a lot less boring and, potentially, a whole lot bigger. For starters, what if we add semiconductor IP to EDA revenues? Now we’re looking at $12.2 billion in revenue by 2019, Smith said. (He acknowledged, however, that the IP market itself is going to take a “dip” due to the move towards platform-based IP and away from conventional piecemeal IP).

This still is not enough to get Wall Street’s attention. Another possibility is to bring embedded software development into the EDA industry. This is not a huge market – about $2.6 billion today – but it is an “easy growth market for us,” according to Smith.

Chasing the Big Bucks

But the “big bucks” are in mechanical CAD (MCAD), Smith said. In the past the MCAD market has always been bigger than EDA, but now EDA is catching up. The MCAD market is about $6.6 billion now. Synopsys and Cadence are larger than PTC and Siemens, two of the main players in MCAD.

There may be some good acquisition possibilities coming up for EDA vendors, Smith said – and if we don’t buy MCAD companies, they might buy EDA companies. Consider, for example, that Ansoft bought Apache and Dassault bought Synchronicity. (Note: Siemens PLM Software is a first-time exhibitor at DAC 2015).

What about other domains? Smith said that EDA companies could conceivably move into optical design, applications development software, biomedical design, and chemical design. The last if these is probably the most tenuous; Smith noted that EDA vendors have yet to look into chemical design.

Applications development software is the biggest market on the above list, but that means competing with Microsoft, IBM, and Oracle. “You’re in with the big boys – is that a good idea?” Smith asked.

Perhaps there’s an opening for a “big play” for an MCAD provider. Smith noted that mechanical vendors are focusing on product data management (PDM). This “is really the IT of design,” Smith said. “They have a lot of hope that the IoT [Internet of things] market is going to give them an opportunity to capture the software that goes from the ground to the cloud. Maybe we can let them have PDM and see if we can take the tool market away from them, or acquire it away from them.”

In conclusion, Smith asked, should the EDA industry accelerate its growth? “The mechanical vendors have already shown interest in acquiring EDA vendors,” he said. “We may not have a choice.”

Richard Goering

NOTE: Catch our live blog from DAC 2015, beginning Monday morning, June 8! Click here

There has been so much hype about the “Internet of Things” (IoT) that it is refreshing to hear about a cutting-edge development project that can bring concrete benefits to millions of people. That project is the ongoing development of the Google Smart Contact Lens, and it was detailed in a keynote speech June 8 at the Design Automation Conference (DAC 2015).

The keynote speech was given by Brian Otis (right), a director at Google and a research associate professor at the University of Washington. The “smart lens” that the project envisions is essentially a disposable contact lens that fits on an eye and continuously monitors blood glucose levels. This is valuable information for anyone who has, or may someday have, diabetes.

Since he was speaking to an engineering audience, Otis focused on the challenges behind building such a device, and described some of the strategies taken by Google and its partner, Novartis. The project required new approaches to miniaturization, low-power design, and connectivity, as well as a comfortable and reliable silicon-to-human interface. Otis discussed the “why” as well and showed how the device could potentially save or improve millions of lives.

Millions of Users

First, a bit of background. Google announced the smart lens project in a blog post in January 2014. Since then it has been featured in news outlets including Forbes, Time, and the Wall Street Journal. In March 2015, Time reported that Google has been granted a patent for a smart contact lens.

The smart lens monitors the level of blood glucose by looking at its concentration in tears. The lens includes a wireless system on chip (SoC) and a miniaturized glucose sensor. A tiny pinhole in the lens allows tear fluid to seep into the sensor, and a wireless antenna handles communications to the wireless devices.

“We figure that if we can solve a huge problem, it is probably worth doing,” Otis said. “Diabetes is one example.” He noted 382 million people worldwide have diabetes today, and that 35% of the U.S. population may be pre-diabetic. Today, diabetics must *** their fingers to test blood glucose levels, a procedure that is invasive, painful, and subject to infrequent monitoring.

According to Otis, the smart contact lens represents a “new category of wearable devices that are comfortable, inexpensive, and empowering.” The lens does sensor data logging and uses a portable instrument to measure glucose levels. It is thin, cheap, and disposable, he said.

Moreover, the lens is not just for people already diagnosed with diabetes—it’s for anyone who is pre-diabetic, or may be at risk due to genetic predisposition. “If we are pro-active rather than re-active,” Otis said, “Instead of waiting until a person has full-fledged diabetes, we could make a huge difference in peoples’ lives and lower the costs of treating them.”

Technical Challenges

No one has built anything quite like the smart lens, so researchers at Google and Novartis are treading new ground. Otis identified three key challenges:

• Miniaturization: Everything must be really small—the SoC, the passive components, the power supply. Components must be flexible and cheap, and support thin-film integration.
• Platform: Google has developed a reusable platform that includes tiny, always-on wireless sensors, ultra low-power components, and standards-based interfaces.
• Data: Researchers are looking for the best ways to get the resulting data into a mobile device and onto the cloud.

Comfort is another concern. “This is not intended to be for the most severe cases,” Otis said. “This is intended to be for all of us as a pro-active way of improving our lifestyles.”

The platform provides a bidirectional encrypted wireless link, integrated power management, on-chip memory, standards-based RFID link, flexible sensor interface, high-resolution potentiostat sensor, and decoupling capacitors. Most of these capabilities are provided by the standard CMOS SoC, which is a couple hundred microns on a side and only “tens of microns” thick.

Otis noted that unpackaged ICs are typically 250 microns thick when they come back from the foundry. Thus, post-processing is needed so the IC will fit into a contact lens.

Furthermore, the design requires precision analog circuitry and additional environmental sensors. “Some of this stuff sounds mundane but it is really hard, especially when you find out you can’t throw large decoupling capacitors and bypass capacitors onto a board, and all that has to be re-integrated into the chip,” Otis said.

Sensor Challenges

Getting information from the human body is challenging. The smart lens sensor does a direct chemical measurement on the surface of the eye. The sensor is designed to work with very low glucose concentrations. This is because the concentration of glucose in tears is an order of magnitude lower than it is in blood.

In brief, the sensor has two parallel plates that are coated with an enzyme that converts glucose into hydrogen peroxide, which flows around the electrodes of the sensor. This is actually a fairly standard way of doing glucose monitoring. However, the smart lens sensor has two electrodes compared to the typical three.

In manufacturing, it is essential to keep costs low. Otis outlined a three-step manufacturing process:

• Start with the bottom layer, and mold a contact lens in the way you typically would.
• Add the electronics package on top of that layer.
• Build a second layer that encapsulates the electronics and provides the curvature needed for comfort and vision correction.

Beyond the technical challenges are the “clinical” challenges of working with human beings. The human body “is messy and very variable,” Otis said. This variability affects sensor performance and calibration, RF/electro-magnetic performance, system reliability, and comfort.

The final step is making use of the data. “We need to get the data from the device into a phone, and then display it so users can visualize the data,” Otis said. This provides “actionable feedback” to the person who needs it. Eventually, the data will need to be stored in the cloud.

As he concluded his talk, Otis noted that the platform his group developed may have many applications beyond glucose monitoring. “There is a lot you can do with a bunch of logic and sensing capability,” he said, “and there are hundreds of biomarkers beyond glucose.” Clearly this will be an interesting technology to watch.

Richard Goering

Related Blog Post

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As a leading venture capitalist in the electronics technology, as well as CEO of Cadence, Lip-Bu Tan has unique insights into ongoing changes that will impact EDA providers and users. Tan shared some of those insights in a “fireside chat” with Ed Sperling, editor in chief of Semiconductor Engineering, at the Design Automation Conference (DAC 2015) on June 9.

Topics of this discussion included industry consolidation, the need for more talent and more startups, Internet of Things (IoT) opportunities and challenges, the shift from ICs to full product development, and the challenges of advanced nodes. Following are some excerpts from this conversation, held at the DAC Pavilion theater on the exhibit floor.

Ed Sperling (left) and Lip-Bu Tan (right) discuss trends in semiconductors and EDA

Q: As you look out over the semiconductor and EDA industries these days, what worries you most?

Tan: At the top of my list is all the consolidation that is going on. Secondly, chip design complexity is increasing substantially. Time-to-market pressure is growing and advanced nodes have challenges.

The other thing I worry about is that we need to have more startups. There’s a lot of innovation that needs to happen. And this industry needs more top talent. At Cadence, we have a program to recruit over 10% of new hires every year from college graduates. We need new blood and new ideas.

Q: EDA vendors were acquiring companies for many years, but now the startups are pretty much gone. Where does the next wave of innovation come from?

Tan: I’ve been an EDA CEO for the last seven years and I really enjoy it because so much innovation is needed. System providers have very big challenges and very different needs. You have to find the opportunities and go out and provide the solutions.

The opportunities are not just in basic tools. Massive parallelism is critical, and the power challenge is huge. Time to market is critical, and for the IoT companies, cost is going to be critical. If you want to take on some good engineering challenges, this is the most exciting time.

Q: You live two lives—you’re a CEO but you’re also an investor. Where are the investments going these days and where are we likely to see new startups?

Tan: Clearly everybody is chasing the IoT. There is a lot of opportunity in the cloud, in the data center. Also, I’m a big believer in video, so I back companies that are video related. A big area is automotive. ADAS [Advanced Driver Assistance Systems] is a tremendous opportunity.

These companies can help us understand how the industry is transforming, and then we can provide solutions, either in terms of IP, tools, or the PCB. Then we need to connect from the system level down to semiconductors. I think it’s a different way to design.

Q: What happens as we start moving from companies looking to design a semiconductor to system companies who are doing things from the perspective that we have this purpose for our software?

Tan: We are extending from EDA to what we call system design enablement, and we are becoming more application driven. The application at the system level will drive the silicon design. We need to help companies look at the whole system including the power envelope and signal integrity. You don’t want to be in a position where you design a chip all the way to fabrication and then find the power is too high.

We help the customers with hardware/software co-design and co-verification. We have a design suite and a verification suite that can provide customers with high-level abstractions, as well as verify IP blocks at the system level. Then we can break things down to the component level with system constraints in mind, and drive power-aware, system-aware design.

We are starting to move into vertical markets. For example, medical is a tremendous opportunity.

Q: How does this approach change what you provide to customers?

Tan: Every year I spend time meeting with customers. I think it is very important to understand what they are trying to design, and it is also important to know the customer’s customer requirements. We might say, “Wait a minute, for this design you may want to think about power or the library you’re using.” We help them understand what foundry they should use and what process they should use. They don’t view me as a vendor—they view me as a partner.

We also work very closely with our IP and foundry partners. We work as one team—the ultimate goal is customer success.

Q: Is everybody going to say, FinFETs are beautiful, we’re going to go down to 10nm or 7nm—or is it a smaller number of companies who will continue down that path?

Tan: Some of the analog/mixed-signal companies don’t need to go that far. We love those customers—we have close to 50% of that business. But we also have customers in the graphics or processor area who are really pushing the envelope, and need to be in 16nm, 14nm, or 10nm. We work very closely with those guys to make sure they can go into FinFETs.

We always want to work with the customer to make sure they have a first-time silicon success. If you have to do a re-spin, you miss the opportunity and it’s very costly.

Q: There’s a new market that is starting to explode—IoT. How real is that world to you? Everyone talks about large numbers, but is it showing up in terms of tools?

Tan: Everybody is talking about huge profits, but a lot of the time I think it is just connecting old devices that you have. Billions of units, absolutely yes, but if you look close enough the silicon percentage of that revenue is very tiny. A lot of the profit is on the service side. So you really need to look at the service killer app you are trying to provide.

What’s most important to us in the IoT market is the IP business. That’s why we bought Tensilica—it’s programmable, so you can find the killer app more quickly. The other challenges are time to market, low power, and low cost.

Q: Where is system design enablement going? Does it expand outside the traditional market for EDA?

Tan: It’s not just about tools. IP is now 11% of our revenue. At the PCB level, we acquired a company called Sigrity, and through that we are able to drive system analysis for power, signal integrity, and thermal. And then we look at some of the verticals and provide modeling all the way from the system level to the component level. We make sure that we provide a solution to the end customer, rather than something piecemeal.

Q: What do you think DAC will look like in five years?

Tan: It’s getting smaller. We need to see more startups and innovative IP solutions. I saw a few here this year, and that’s good. We need to encourage small startups.

Q: Where do we get the people to pull this off? I don’t see too many people coming into EDA.

Tan: I talk to a lot of university students, and I tell them that this small industry is a gold mine. A lot of innovation is needed. We need them to come in [to EDA] rather than join Google or Facebook. Those are great companies, but there is a lot of fundamental physical innovation we need.

Richard Goering

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Design and verification standards are critical if we want to get a new generation of Internet of Things (IoT) devices into the market, according to panelists at an Accellera Systems Initiative breakfast at the Design Automation Conference (DAC 2015) June 9. However, IoT devices for different vertical markets pose very different challenges and requirements, making the standards picture extremely complicated.

The panel was titled “Design and Verification Standards in the Era of IoT.” It was moderated by industry editor John Blyler, CEO of JB Systems Media and Technology. Panelists were as follows, shown left to right in the photo below:

• Lu Dai, director of engineering, Qualcomm
• Wael William Diab, senior director for strategy marketing, industry development and standardization, Huawei
• Chris Rowen, CTO, IP Group, Cadence Design Systems, Inc.

In opening remarks, Blyler recalled a conversation from the recent IEEE International Microwave Symposium in which a panelist pointed to the networking and application layers as the key problem areas for RF and wireless standardization. Similarly, in the IoT space, we need to look “higher up” at the systems level and consider both software and hardware development, Blyler said.

Rowen helped set some context for the discussion by noting three important points about IoT:

• IoT is not a product segment. Vertical product segments such as automotive, medical devices, and home automation all have very different characteristics.
• IoT “devices” are components within a hierarchy of systems that includes sensors, applications, user interface, gateway application (such as cell phone), and finally the cloud, where all data is aggregated.
• A bifurcation is taking place in design. We are going from extreme scale SoCs to “extreme fit” SoCs that are specialized, low energy, and very low cost.

Here are some of the questions and answers that were addressed during the panel discussion.

Q: The claim was recently made that given the level of interaction between sensors and gateways, 50X more verification nodes would have to be checked for IoT. What standards need to be enhanced or changed to accomplish that?

Rowen: That’s a huge number of design dimensions, and the way you attack a problem of that scale is by modularization. You define areas that are protected and encapsulated by standards, and you prove that individual elements will be compliant with that interface. We will see that many interesting problems will be in the software layers.

Q: Why is standardization so important for IoT?

Dai: A company that is trying to make a lot of chips has to deal with a variety of standards. If you have to deal with hundreds of standards, it’s a big bottleneck for bringing your products to market. If you have good standardization within the development process of the IC, that helps time to market.

When I first joined Qualcomm a few years ago, there was no internal verification methodology. When we had a new hire, it took months to ramp up on our internal methodology to become effective. Then came UVM [Universal Verification Methodology], and as UVM became standard, we reduced our ramp-up time tremendously. We’ve seen good engineers ramp up within days.

Diab: When we start to look at standards, we have to do a better job of understanding how they’re all going to play with each other. I don’t think one set of standards can solve the IoT problem. Some standards can grow vertically in markets like industrial, and other standards are getting more horizontal. Security is very important and is probably one thing that goes horizontally.

Requirements for verticals may be different, but processing capability, latency, bandwidth, and messaging capability are common [horizontal] concerns. I think a lot of standards organizations this year will work on horizontal slices [of IoT].

Q: IoT interoperability is important. Any suggestions for getting that done and moving forward?

Rowen: The interoperability problem is that many of these [IoT] devices are wireless. Wireless is interesting because it is really hard – it’s not like a USB plug. Wireless lacks the infrastructure that exists today around wired standards. If we do things in a heavily wireless way, there will be major barriers to overcome.

Dai: There are different standards for 4G LTE technology for different [geographical] markets. We have to make a chip that can work for 20 or 30 wireless technologies, and the cost for that is tremendous. The U.S., Europe, and China all have different tweaks. A good standard that works across the globe would reduce the cost a lot.

Q: If we’re talking about the need to define requirements, a good example to look at is power. Certainly you have UPF [Unified Power Format] for the chip, board, and module.

Rowen: There is certainly a big role for standards about power management. But there is also a domain in which we’re woefully under-equipped, and that is the ability to accurately model the different power usage scenarios at the applications level. Too often power devolves into something that runs over thousands of cycles to confirm that you can switch between power management levels successfully. That’s important, but it tells you very little about how much power your system is going to dissipate.

Dai: There are products that claim to be UPF compliant, but my biggest problem with my most recent chip was still with UPF. These tools are not necessarily 100% UPF compliant.

One other concern I have is that I cannot get one simulator to pass my Verilog code and then go to another that will pass. Even though we have a lot of tools, there is no certification process for a language standard.

Q: When we create a standard, does there need to be a companion compliance test?

Rowen: I think compliance is important. Compliance is being able to prove that you followed what you said you would follow. It also plays into functional safety requirements, where you need to prove you adhered to the flow.

Dai: When we [Qualcomm] sell our 4G chips, we have to go through a lot of certifications. It’s often a differentiating factor.

Q: For IoT you need power management and verification that includes analog. Comments?

Rowen: Small, cheap sensor nodes tend to be very analog-rich, lower scale in terms of digital content, and have lots of software. Part of understanding what’s different about standardization is built on understanding what’s different about the design process, and what does it mean to have a software-rich and analog-rich world.

Dai: Analog is important in this era of IoT. Analog needs to come into the standards community.

Richard Goering

Cadence Blog Posts About DAC 2015

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DAC 2015: Google Smart Contact Lens Project Stretches Limits of IC Design

DAC 2015: Lip-Bu Tan, Cadence CEO, Sees Profound Changes in Semiconductors and EDA

DAC 2015: “Level of Compute in Vision Processing Extraordinary” – Chris Rowen

DAC 2015: Can We Build a Virtual Silicon Valley?

DAC 2015: Cadence Vision-Design Presentation Wins Best Paper Honors

Let’s face it – the EDA industry needs new people and new ideas. One of the best places to find both is academia, and a presentation at the Cadence Theater at the recent Design Automation Conference (DAC 2015) described collaboration models that are working today.

The presentation was titled “Industry/Academia Engagement Models – From PhD Contests to R&D Collaborations.” It included these speakers, shown from left to right in the photo below:

• Prof. Xin Li, Electrical and Computer Engineering, Carnegie-Mellon University (CMU)
• Chuck Alpert, Senior Software Architect, Cadence
• Prof. Laleh Behjat, Department of Electrical and Computer Engineering, University of Calgary

Alpert, who was filling in for Zhuo Li, Software Architect at Cadence, was the vice chair of DAC 2015 and will be the general chair of DAC 2016 in Austin, Texas. “My team at Cadence really likes to collaborate with universities,” he said. “We’re a big proponent of education because we really need the best and brightest students in our industry.”

Contests Boost EDA Research

One way that Cadence collaborates with academia is participation in contests. “It’s a great way to formulate problems to academia,” Alpert said. “We can have the universities work on these problems and get some strategic direction.”

For example, Cadence has been involved with the annual CAD contest at the International Conference on Computer-Aided Design (ICCAD) since the contest was launched in 2012. This is the largest worldwide EDA R&D contest, and it is sponsored by the IEEE Council on EDA (CEDA) and the Taiwan Ministry of Education. Its goals are to boost EDA research in advanced real-world problems and to foster industry-academia collaboration.

Contestants can participate in one of more problems in the three areas of system design, logic synthesis and verification, and physical design. The 2015 contest has attracted 112 teams from 12 regions. Cadence contributes one problem per year in the logic synthesis area. Zhuo Li was the 2012 co-chair and the 2013 chair. The awards will be given at ICCAD in November 2015.

Another step that Cadence has taken, Alpert said, is to “hire lots of interns.” His own team has four interns at the moment. One advantage to interning at Cadence, he said, is that students get to see real-world designs and understand how the tools work. “It helps you drive your research in a more practical and useful direction,” he said.

The Cadence Academic Network co-sponsors the ACM SIGDA PhD Forum at DAC, and Xin Li and Zhuo Li are on the organizing committee. This event is a poster session for PhD students to present and discuss their dissertation research with people in the EDA community. This year’s forum was “packed,” Alpert said, and it’s clear that the event needs a bigger room.

Finally, Alpert noted, Cadence researchers write and publish technical papers at DAC and other conferences, and Cadence people serve on the DAC technical program committee. “We try to be involved with the academic community on a regular basis,” Alpert said. “We want the best and the brightest people to go into EDA because there is still so much innovation that’s needed. It’s a really cool place to be.”

Research Collaboration Exposes Failure Rates

Xin Li presented an example of a successful research collaboration between CMU and Cadence. The challenge was to find a better way to estimate potential failure rates in memory. As noted in a previous blog post, PhD student Shupeng Sun met this challenge with a new statistical methodology that won a Best Poster award at the ACM SIGDA PhD Forum at DAC 2014.

The new methodology is called Scaled-Sigma Sampling (SSS). It calculates the failure rate and accounts for variability in the manufacturing process while only requiring a few hundred, or a few thousand, sample circuit blocks. Previously, millions of samples were required for an accurate validation of a new design, and each sample could take minutes or hours to simulate. It could take a few weeks or months to run one validation.

The SSS methodology requires greatly reduced simulation times. It makes it possible, Li noted, to run simulations overnight and see the results in the morning.

Li shared his secret for success in collaborations. “I want to emphasize that before the collaboration, you have to understand the goal. If you don’t have a clear goal, don’t collaborate. Once you define the goal, stick to it and make it happen.”

Contest Provides Learning Experience

Last year Laleh Behjat handed two of her new PhD students a challenge. “I told them there is an ISPD [International Symposium for Physical Design] contest on placement, and I expect you to participate and I expect you to win. Not knowing anything about placement, I don’t think they realized what I was asking them.”

The 2015 contest was called the Blockage-Aware Detailed Routing-Driven Placement Contest. Results were announced at the end of March at ISPD. And the University of Calgary team, despite its lack of placement experience, took second place.

Such contests provide a good learning tool, according to Behjat. Graduate students in EDA, she said, “have to be good programmers. They have to work in teams and be collaborative, be able to innovate, and solve the hardest problems I have seen in engineering and science. And they have to think outside the box.” A contest can bring out all these attributes, she said.

Further, Behjat noted, contest participants had access to benchmarks and to a placement tool. They didn’t have to write tools to find out if their results were good. Industry sponsors, meanwhile, got access to good students and new approaches for solving problems.

“You can see Cadence putting a big amount of time, effort and money to get students here and get them excited about doing contests,” she said. She advised students in the theater audience to “talk to people in the Cadence booth and see if you can have more ideas for collaboration.”

Richard Goering

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EDA investor and former executive Jim Hogan is optimistic about automotive electronics, but he has some concerns as well. At the recent Design Automation Conference (DAC 2015), he delivered a speech titled “The Looming Quality, Reliability, and Safety Crisis in Automotive Electronics...Why is it and what can we do to avoid it?"

Hogan gave the keynote speech for IP Talks!, a series of over 30 half-hour presentations located at the ChipEstimate.com booth. Presenters included ARM, Cadence, eSilicon, Kilopass, Sidense, SilabTech, Sonics, Synopsys, True Circuits, and TSMC. Held in an informal setting, the talks addressed the challenges faced by SoC design teams and showed how the latest developments in semiconductor IP can contribute to design success.

Jim Hogan delivers keynote speech at DAC 2015 IP Talks!

Hogan talked about several phases of automotive electronics. These include assisted driving to avoid collisions, controlled automation of isolated tasks such as parallel parking, and, finally, fully autonomous vehicles, which Hogan expects to see in 15 to 20 years. The top immediate priorities for automotive electronics designers, he said, will be government regulation, fuel economy, advanced safety, and infotainment.

More Code than a Boeing 777

According to Hogan, today’s automobiles use 50-100 microcontrollers per car, resulting in a worldwide automotive semiconductor market of around $40 billion. The global market for advanced automotive electronics is expected to reach $240 billion by 2020. Software is growing faster in the automotive market than it is in smartphones. Hogan quoted a Ford vice president who observed that there are more lines of code in a Ford Fusion car than a Boeing 777 airplane.

One unique challenge for automotive electronics designers is long-term reliability. This is because a typical U.S. car stays on the road for 15 years, Hogan said. Americans are holding onto new vehicles for a record 71.4 months.

Another challenge is regulatory compliance. Aeronautics is highly regulated from manufacturing to air traffic control, and the same will probably be true of automated cars. Hogan speculated that the Department of Transportation will be the regulatory authority for autonomous cars. Today, automotive electronics providers must comply with the ISO26262 automotive functional safety specification.

So where do we go from here? “We’ve got to change our mindset,” Hogan said. “We’ve got to focus on safety and reliability and demand a different kind of engineering discipline.” You can watch Hogan’s entire presentation by clicking on the video icon below, or clicking here. You can also watch other IP Talks! videos from DAC 2015 here.

https://youtu.be/qL4kAEu-PNw

Richard Goering

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Cadence pulled a fast one at DAC 2018, almost like a bait and switch. We advertised a hands-on workshop to learn about Accellera Portable Stimulus Specification (PSS) v1.0. But we made participants compete head to head, for prizes, and their pride! T...(read more)

Vegas, here we come. All of us fun EDA engineers at once. Be prepared, next week’s Design Automation Conference will be busy! The trends I had outlined after last DAC in 2018—system design, cloud, and machine learning—have...(read more)

Complexity is driving the urgency for advanced artificial intelligence systems more than ever—and that means someone has to supply the tools to create those systems. Cadence is up to the task: we’ve been expanding our AI offerings. If you haven’t already seen what Cadence can do for your AI needs, or if you’re not quite up-to-date on this whole AI boom, let this presentation given by K.T. Moore at the Cadence Theater at DAC bring you up to speed.

The technology behind AI isn’t as new as you’d think—the principles that govern how AI learns have been in development since 1959, when Arthur Samuel defined the concept of “machine learning.” At the time, there was nothing even resembling the necessary compute power to put Samuel’s concepts into practice—but now we can. AI designs are huge, and they’re massively parallel—simulating them on older computers and simulators would have taken ages; never mind how long it would take to do some by-hand measure like they had to do in the '60s.

But with advancements in server technology and the parallelization technology in products like Xcelium Parallel Logic Simulator and JasperGold smart technology, plus hardware-based engines like the Palladium and Protium platforms, verifying AI designs is not only possible—it’s easy.  But, read on, its not just about simulation technology.

AI tech is flooding the industry. It’s applicable to almost every vertical—cloud computing can use AI to intelligently manage a user’s required resources, consumer electronics are using it to tailor a user experience based on a whole host of collected data, automotive companies want to use AI to drive cars, healthcare to assist in diagnoses given a set of symptoms and a database of other, similar patients—and that’s saying nothing of the multitude of industrial applications. AI is also useful in the creation of developers’ tools themselves. Part of what’s causing the semiconductor industry boom is just this—an exploding interest in AI chips. And with 5G technology imminent, and with the looming billion-gate plus sizes of the SoCs that implement 5G, AI-assisted developers' tools might need to become the norm, not an outlier.

So: in all of this, where is Cadence?

Cadence is focusing its efforts on two areas, dubbed “machine learning inside” and “machine learning outside.” ML inside in the digital design flow refers to improving PPA, faster engines, and better testing and diagnostics. None of this physically affects how you use a tool, but it makes using that tool a much better experience. ML outside talks about the design flow in general, working toward an automated design flow, as well as productivity improvements across the flow. These things do change how you use a tool, but don’t worry, it’s all for the better.

Additionally, Cadence is working to improve design enablement; that is, hardware and software co-design. Smart Genus and Innovus solutions make designing your SoC easier than ever—using the full flow can result in up to a 21% PPA gain.

If you’re looking specifically for IP to enable AI on your SoC, the Tensilica DNA 100 processor has you covered, too. It’s great for companies designing edge or AI chips, offers great compression rates and efficient power usage, and has 4.7X the performance of other AI SoC IP on similar array sizes.

Cadence has you covered no matter where you’re going in this new world of AI systems—with our AI-enabled tools, IP,  and our strong partner ecosystem, you can be at ease knowing you’ll be supported no matter how complex your needs are.

Everyone keeps talking about “the cloud” this and “the cloud” that these days—but you’re a semiconductor designer. Everyone keeps saying “the cloud” is revolutionizing all aspects of electronics design—but what does it mean for you? Cadence's own Tom Hackett discussed this in a presentation at the Cadence Theater during DAC 2019.

What people refer to as “the cloud” is commonly divided into three categories: Infrastructure as a Service (IaaS), Platform as a Service (PaaS), and software as a Service (SaaS). With IaaS, you bring your own software—i.e. loading your owned or appropriately licensed tools onto cloud hardware that you rent by the minute. This service is available from providers like Google Cloud Platform, Amazon Web Service, and Microsoft Azure. In PaaS (also available from the major cloud providers), you create your own offering using capabilities and a software design environment provided by the cloud vendor that makes subsequent scaling and distribution really easy because the service was “born in the cloud”.  Lastly, there’s SaaS, where the cloud is used to access and manage functionality and data without requiring users to set up or manage any of the underlying infrastructure used to provide it.  SaaS companies like Workday and Salesforce deliver their value in this manner.  The Cadence Cloud portfolio makes use of both IaaS and SaaS, depending on the customers’ interest.  Cadence doesn’t have PaaS offerings because our customers don’t create their own EDA software from building blocks that Cadence provides.

All of these designations are great, but you’re a semiconductor designer. Presumably you use Workday or some similar software, or have in the past when you were an intern, but what about all of your tools? Those aren’t on the cloud.

Wait—actually, they are.

Using EDA tools in the cloud allows you to address complexity and data explosion issues you would have to simply struggle through before. Since you don’t have to worry about having the compute-power on-site, you can use way more power than you could before. You may be wary about this new generation of cloud-based tools, but don’t worry: the old rules of cloud computing no longer apply. Cloud capacity is far larger than it used to be, and it’s more secure. Updates to scheduling software means that resource competition isn’t as big of a deal anymore. Clouds today have nearly unlimited capacity—they’re so large that you don’t ever need to worry about running out of space.

The vast increase in raw compute available to designers through the cloud makes something like automotive functional safety verification, previously an extremely long verification task, doable in a reasonable time frame. With the cloud, it’s easy to scale the amount of compute you’re using to fit your task—whether it’s an automotive functional safety-related design or a small one.

Nowadays, the Cadence Cloud Portfolio brings you the best and brightest in cloud technology. No matter what your use case is, the Cadence Cloud Portfolio has a solution that works for you. You can even access the Palladium Cloud, allowing you to try out the benefits of an accelerator without having to buy one.

Cloud computing is the future of EDA. See the future here.

Emulators are great. They vastly speed up verification to the point where it’s hard to imagine life without them; as designs grow in complexity, simple simulation can’t keep up for the biggest designs. The extra oomph from emulation is almost a necessity for the top percentages of design sizes. However, many users of Palladium aren’t efficiently using their unit’s processing power, and as a result they’re missing out on the full speed-up potential that Palladium can provide.

Altair’s HERO is here for you. With its help, your Palladium unit can be even more amazing for your productivity than before.

HERO (that’s Hardware Emulator Resource Optimizer) adds emulator support to Altair’s Accelerator. You already know and love Altair’s scheduling tools; so why not make them do more for you, so you can be one of those people who are making the most out of their Palladium system?

Emulators are kind of like big computers, but it’s a lot harder to manage leftover resources on an emulator than it is on, say, a CPU. A scheduler like HERO neatly sidesteps this problem by more intelligently using the resources available to ensure that there’s a minimal patchwork of leftover resources to begin with.

HERO supports past generations of Palladium as well, so if you’re still using an older version, you can still take advantage of the upgrades HERO provides. There’s a wide variety of features HERO has that make your emulator easier to use. HERO separates a job into a “select” section and a “run” section: the “select” part makes a last-minute decision on which domains or boards to use, while the “run” part is the actual job. This makes it easier to ensure that your Palladium emulator is being used as efficiently as possible. Jobs are placed using “shapes”, which are a set of job types; these can be selected from a list of pre-defined ones by the user. Shapes can have special constraints if those are needed.

A new reservation system also helps HERO organize Palladium’s processing power better. HERO offers both “hard” reservations and “soft” reservations. A hard reservation locks other users out of reserving any part of the emulator at all, while a soft reservation allows a user to reserve a part of the emulator for a later use. Think of it like this: a soft reservation is like grabbing a ticket from the deli counter, while a hard reservation stops you from ever entering the market.

When using HERO, you can manage your entire verification workload. You’ll find that your utilization of your emulator vastly increases—it’s been reported that some users using only 30% of the capabilities of their Palladium unit(s) saw a massive increase to over 90% once they made the switch to HERO.

If you’re ready to take your Palladium productivity to the next level, Altair has a HERO for you.

To see the full presentation given by Andrea Casotto in the Cadence Theater at DAC 2019, check here.

DAC is right around the corner! On the demo floor at Cadence® Booth #2214, we will demonstrate how to use the Cadence mixed-signal and low-power solution to design, verify, and implement a microcontroller-based mixed-signal design. The demo design architecture is very similar to practical designs of many applications like power management ICs, automotive controllers, and the Internet of Things (IoT). Cadene tools demonstrated in this design include Virtuoso® Schematic Editor, Virtuoso Analog Design Environment, Virtuoso AMS Designer, Virtuoso Schematic Model Generator, Virtuoso Power Intent Assistant, Incisive® Enterprise Simulator with DMS option, Virtuoso Digital Implementation, Virtuoso Layout Suite, Encounter® RTL Compiler, Encounter Test, and Conformal Low Power. An extended version of this demo will also be shown at the ARM® Connected Community Pavilion Booth #921.

For additional highlights on Cadence mixed-signal and low-power solutions, stop by our booth for:

• The popular book, Mixed-signal Methodology Guide, which will be on sale during DAC week!
• A sneak preview of the eBook version of the Mixed-signal Methodology Guide
• Customer presentations at the Cadence DAC Theater
  • 9am, Tuesday, June 4  ARM  Low-Power Verification of A15 Hard Macro Using CLP 
  • 10:30am, Tuesday, June 4  Silicon Labs  Power Mode Verification in Mixed-Signal Chip
  • 12:00pm, Tuesday, June 4  IBM  An Interoperable Flow with Unified OA and QRC Technology Files
  • 9am, Wednesday, June 5  Marvell  Low-Power Verification Using CLP
  • 4pm, Wednesday, June 5  Texas Instruments  An Inter-Operable Flow with Unified OA and QRC Technology Files
• Partner presentations at the Cadence DAC Theater
  • 10am, Monday, June 3  X-Fab  Rapid Adoption of Advanced Cadence Design Flows Using X-FAB's AMS Reference Kit
  • 3:30pm, Monday, June 3  TSMC TSMC Custom Reference Flow for 20nm -  Cadence Track
  • 9:30am,Tuesday, June 4  TowerJazz   Substrate Noise Isolation Extraction/Model Using Cadence Analog Flow
  • 12:30pm, Wednesday, June 5  GLOBALFOUNDRIES  20nm/14nm Analog/Mixed-signal Flow
  • 2:30pm, Wednesday, June 5  ARM  Cortex®-M0 and Cortex-M0+: Tiny, Easy, and Energy-efficient Processors for Mixed-signal Applications
• Technology sessions at suites
  • 10am, Monday, June 3    Low-power Verification of Mixed-signal Designs
  • 2pm, Monday, June 3      Advanced Implementation Techniques for Mixed-signal Designs
  • 2pm, Monday, June 3      LP Simulation: Are You Really Done?
  • 4pm, Monday, June 3      Power Format Update: Latest on CPF and IEEE 1801  
  • 11am, Wednesday, June 5   Mixed-signal Verification
  • 11am, Wednesday, June 5   LP Simulation: Are You Really Done?
  • 4pm, Wednesday, June 5   Successful RTL-to-GDSII Low-Power Design (FULL)
  • 5pm, Wednesday, June 5   Custom/AMS Design at Advanced Nodes

We will also have three presentations at the Si2 booth (#1427):

• 10:30am, Monday, June 3   An Interoperable Implementation Solution for Mixed-signal Design
• 11:30am, Tuesday, June 4   Low-power Verification for Mixed-signal Designs Using CPF
• 10:30am, Wednesday, June 5   System-level Low-power Verification Using Palladium

We have a great program at DAC. Click the link for complete Cadence DAC Theater and Technology Sessions. Look forward to seeing you at DAC!     

With Windows 2000 Microsoft introduced the inheritance of access rights and new Win32-API functions like SetNamedSecurityInfo() which handle the inheritance. SetNamedSecurityInfo() but has a serious bug: it applies inheritable ACEs from a PARENT object to a target object even if it must not do so, indicated by the flags SE_DACL_PROTECTED and/or SE_SACL_PROTECTED in the security descriptor of the target object.

Sell-side reluctance to accept delegation of reporting under the Securities Financing Transaction Regulation (“SFTR”) is causing a headache for buy-side firms.  If buy-side firms are unable to establish delegation arrangements they ...

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Overview On 13 January 2020, HMRC published a summary of responses to the consultation on the implementation of DAC6 – the EU-wide regime which provides for the disclosure of certain cross-border arrangements to tax authorities. The response d...

On 18 February 2020, the Council of the EU added the Cayman Islands, along with Palau, Panama and Seychelles to its list of non-cooperative jurisdictions for tax purposes. These territories join eight other jurisdictions (namely, Fiji, Oman, Samoa,...

As part of the EU’s general clampdown on certain forms of aggressive tax planning, Directive 2011/16/EU (commonly known as DAC6) will soon require taxpayers and intermediaries across the EU to start reporting information in relation to certain...

Hdac Technology AG(Hdac) together with Dream Global Partners (DREAMChain), held a business agreement ceremony on August 16th establishing the foundation of a comprehensive partnership to expand and incorporate blockchain-based real estate enterprises world-wide.The ceremony was held on the 3rd floor of Hdac office building, with Hdac Technology Korea CEO, Michael Yoon, Dream Global Partner’s President, Pietro A. Doran, and Dream Global Partner’s co-founder/Chief Crypto-Economics Officer, Samson ...

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dsPIC33/PIC24 FRM, High-Speed Analog Comparator with Slope Compensation DAC

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Omadacycline is a broad-spectrum aminomethylcycline approved in October 2018 by the U.S. Food and Drug Administration for treating acute bacterial skin and skin structure infections and community-acquired pneumonia as both an oral and intravenous once-daily formulation. In this report, the activities of omadacycline and comparators were tested against 49,000 nonduplicate bacterial isolates collected prospectively during 2016 to 2018 from medical centers in Europe (24,500 isolates, 40 medical centers [19 countries]) and the United States (24,500 isolates, 33 medical centers [23 states and all 9 U.S. census divisions]). Omadacycline was tested by broth microdilution following the methods in Clinical and Laboratory Standards Institute document M07 (Methods for Dilution Antimicrobial Susceptibility Tests for Bacteria That Grow Aerobically; Approved Standard, 11th ed., 2018). Omadacycline (MIC_50/90, 0.12/0.25 mg/liter) inhibited 98.6% of Staphylococcus aureus isolates at ≤0.5 mg/liter, including 96.3% of methicillin-resistant S. aureus isolates and 99.8% of methicillin-susceptible S. aureus isolates. Omadacycline potency was comparable for Streptococcus pneumoniae (MIC_50/90, 0.06/0.12 mg/liter), viridans group streptococci (MIC_50/90, 0.06/0.12 mg/liter), and beta-hemolytic streptococci (MIC_50/90, 0.12/0.25 mg/liter), regardless of species and susceptibility to penicillin, macrolides, or tetracycline. Omadacycline was active against all Enterobacterales tested (MIC_50/90, 1/8 mg/liter; 87.5% of isolates were inhibited at ≤4 mg/liter) except Proteus mirabilis (MIC_50/90, 16/>32 mg/liter) and indole-positive Proteus spp. (MIC_50/90, 8/32 mg/liter) and was most active against Escherichia coli (MIC_50/90, 0.5/2 mg/liter), Klebsiella oxytoca (MIC_50/90, 1/2 mg/liter), and Citrobacter spp. (MIC_50/90, 1/4 mg/liter). Omadacycline inhibited 92.4% of Enterobacter cloacae species complex and 88.5% of Klebsiella pneumoniae isolates at ≤4 mg/liter. Omadacycline was active against Haemophilus influenzae (MIC_50/90, 0.5/1 mg/liter), regardless of β-lactamase status, and against Moraxella catarrhalis (MIC_50/90, ≤0.12/0.25 mg/liter). The potent activity of omadacycline against Gram-positive and -negative bacteria indicates that omadacycline merits further study in serious infections in which multidrug resistance and mixed Gram-positive and Gram-negative bacterial infections may be a concern.

Omadacycline is an aminomethylcycline antibiotic with in vitro activity against pathogens causing community-acquired bacterial pneumonia (CABP). This study investigated the activity of omadacycline against Legionella pneumophila strains isolated between 1995 and 2014 from nosocomial or community-acquired respiratory infections. Omadacycline exhibited extracellular activity similar to comparator antibiotics; intracellular penetrance was found by day 3 of omadacycline exposure. These results support the utility of omadacycline as an effective antibiotic for the treatment of CABP caused by L. pneumophila.

"This government has failed to show any self-criticism whatsoever, when it is glaringly obvious to everybody that big mistakes have been made."

Woop woop! Explicit alert! This get a bit unclean as we try to figure out our Game of the Year picks for 2019. We find out just what you can get done with slave labor. We learn the true martial power of haircuts. And we finally realize Anna Marie shouldn't be allowed to keep animals.

Studies have examined some of the more unusual signs of Covid-19

• Coronavirus – latest updates
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The World Health Organization lists the most common symptoms of Covid-19 as fever, tiredness and a dry cough. Others include a runny nose, sore throat, nasal congestion, pain, diarrhoea and the loss of sense of taste and/or smell. But there are also other more unusual symptoms that patients have presented.

The procedural move gives attorneys for House Democrats until May 18 to respond. They say they're owed access to confidential evidence and other materials. No, argues the Trump administration.

The Atlanta rapper reflected on his career.

The world's largest manufacturer says there's not enough capacity to quickly ramp up production to those levels.

Yokogawa Electric Corporation (TOKYO: 6841) announces the release of artificial intelligence (AI)-enabled versions of the GX series panel-mount type paperless recorders, GP series portable paperless recorders, and GA10 data logging software, which are components of the highly operable and expandable SMARTDAC+data acquisition and control system. This new AI functionality includes the future pen, a function developed by Yokogawa that enables the drawing of predicted waveforms. Yokogawa is also releasing a new CPU module for the e-RT3 Plus edge computing platform that is environmentally robust and Python compatible. The GX/GP and e-RT3 release is set for April 8, and the GA10 software will be released on May 13. The SMARTDAC+ system is a product in the OpreX Data Acquisition family, and the e-RT3 Plus is part of the OpreX Control Devices family.

We continue here Brookings’s ongoing video interview series with Islamist leaders and activists, as part of our Rethinking Political Islam initiative. We asked each participant to discuss the state of his or her movement and reflect on lessons learned from the crises of the Arab Spring era, including the rise of ISIS, the Syrian civil […]

Alphabet's X moonshot factory spins out a ground source heat pump company.

yök commissions upcycled stools by ex homess people and Curro Claret