The Congress will begin a month-long 'Delhi Nyay Yatra' from Rajghat on Friday to corner the Aam Aadmi Party government on various issues affecting the city.

A Delhi government report has attributed nearly 24 per cent of the total about 89,000 deaths registered in the national capital in 2023 to infectious and parasitic diseases like cholera, diarrhoea, tuberculosis and hepatitis B, among others.

A Bengaluru couple found themselves in legal trouble after they posted videos of their balcony garden on Facebook. The posts included images of plants later identified as ganja.

Power discoms have provided electricity connections to 6,791 of the 10,802 applicants living in Delhi's unauthorised colonies following Lieutenant Governor V K Saxena's intervention, the Raj Niwas said on Tuesday.

Bangladesh is pinning its hopes on one of the nation's most acclaimed intellectuals to bring stability to a country scarred by coups and political upheaval.

Backed by Iran and hated by Israel, Hezbollah chief Hassan Nasrallah is Lebanon's most powerful man. He enjoys cult status among his Shiite supporters and holds sway over the country's institutions.

Japan's next prime minister, Shigeru Ishiba, says he reads three books a day and would rather do that than mingle with the ruling party colleagues who picked him as their new leader today

Kamala Devi Harris was born on October 20, 1964, in Oakland, California, to immigrant parents.

1. Nasa Alert: Massive 'God of Chaos' asteroid Apophis nears earth in closest pass yet  CNBCTV18
2. NASA alert! 'God of Chaos' asteroid approaching Earth on November 13 sparks worldwide concern  The Times of India
3. Giant Meteorite To Hit Earth On November 13? What We Know  News18
4. 'Astonishingly close': A colossal space rock could wreak havoc on Earth in 2029  Business Today
5. Giant 'God of Darkness' Asteroid May Not Escape Earth Unscathed  ScienceAlert

1. Ricky Ponting hits back at Gautam Gambhir, calls him 'prickly character'  The Times of India
2. Ricky Ponting Fires Back At Gautam Gambhir After India Coach's Press Conference Remarks  NDTV Sports
3. A fired-up Virat Kohli is Australia's worry after Ricky Ponting's 'bad move'  The Times of India
4. Gambhir a prickly character, never took dig at Kohli: Ponting  The Hindu
5. Border-Gavaskar Trophy: Why Gautam Gambhir comes across as abrasive at times  The Indian Express

1. Pakistan Government's Firm Stance On Champions Trophy, Report Says PCB Told To...  NDTV Sports
2. ICC in a catch-22 situation amid PCB's steadfast stance on hosting Champions Trophy  Cricbuzz
3. Champions Trophy: PCB wants an explanation in writing from India for refusal to travel  ESPNcricinfo
4. 'Duniya bewakoof hai': Basit Ali gives unique solution to India-Pakistan Champions Trophy stand-off  The Times of India
5. Champions Trophy : Rizwan's welcome message for KL Rahul and Suryakumar  India Today

1. Vicky Kaushal looks unrecognisable as Parashurama in Mahavatar first look. Check first poster, release date  Hindustan Times
2. Mahavatar First Poster: Vicky Kaushal Takes On The Role Of "The Eternal Warrior Of Dharma"- Parashurama  NDTV Movies
3. Vicky Kaushal drops powerful FIRST LOOK as Lord Parashurama for ‘Mahavatar’  TOI Etimes
4. entertainment News Live Today November 13, 2024: Vicky Kaushal looks unrecognisable as Parashurama in Mahavatar first look. Check first poster, release date  Hindustan Times
5. Vicky Kaushal to play Chiranjeevi Parashurama in Amar Kaushik’s Mahavatar  India Today

1. Delhi: India's capital chokes as air pollution turns 'severe'  BBC.com
2. Several flights diverted due to low visibility conditions at Delhi airport  The Times of India
3. Delhi's toxic air: Why you should not take your cough lightly  India Today
4. Delhi air pollution: Visibility near-zero amid thick smog; CPCB says AQI 'very poor', IQAir shows 'hazardous' | Details  Hindustan Times
5. Delhi's IGI airport sees flight diversions as season's first dense fog hits national capital  Moneycontrol

The upcoming Moto G Power 5G (2025) recently made a pit stop at the FCC where the charging speed and battery size of the phone was revealed.

The post The Moto G Power 5G (2025) was spotted at the FCC appeared first on Phandroid.

The ASUS ROG Phone 9 has recently been spotted on Geekbench where it appears to be powered by the new Qualcomm chipset.

The post ASUS ROG Phone 9 spotted on Geekbench with Qualcomm’s latest chipset appeared first on Phandroid.

A guidance has been issued to the wealthier students with a list of actions they need to follow to create an inclusive environment.

The post has sparked a heated debate about Bengaluru's rising rental prices and the need for a cap on deposits.

This new Corporate Social Responsibility (CSR) Practices in India Report 2020 is a must read

Report on Corporate Social Responsibility (CSR) in Indian BFSI sector.

[SAPS] Office of the Provincial Commissioner KwaZulu-Natal

[SAPS] - Five suspects are appearing in the Kariega Magistrate's Court today, after they were arrested and found in possession of cycads with an estimated value of R1 Million on Friday 08 November 2024.

[SAnews.gov.za] Twenty-three people in Gauteng have died as a result of food borne-related poisoning after consuming food from spaza shops.

[allAfrica]

[The Conversation Africa] Despite the flaws in the latest novel by South African writer Nthikeng Mohlele, there is something alluring about Revolutionaries' House. It is Mohlele's most political novel, and the parallels drawn between love and politics - and their pitfalls - are intriguing.

[DA] It is a national embarrassment that the inability of the City of Johannesburg to supply water to its residents, business and public sector offices, has now led to the shutdown of operations at the Constitutional Court, on Constitution Hill in Braamfontein.

The demand for higher-performance computing is greater than ever. Cutting-edge applications in artificial intelligence (AI), big data analytics, and databases require high-speed memory systems to handle the ever-increasing volumes and complexities of data. Advancements in cloud computing and machine virtualization are stretching the limits of current capabilities. AI applications hosted in the cloud rely on fast access and reduced latency in memory systems, which is amplified by an increasing number of CPU and GPU cores.

Introducing the DDR5 Multiplexed Rank DIMM (MRDIMM), the next-generation memory module technology designed to meet the needs of high-performance computing (HPC) and AI in cloud applications. By leveraging existing DDR5 DRAM memory devices, MRDIMM modules not only double the DRAM data rate but also maintain the RAS capabilities of the industry-proven RDIMM modules, setting a new precedent for memory module performance.

Let’s compare RDIMM and MRDIMM modules using the same DRAM parts. Today, high-speed production DDR5 RDIMM modules run at 5600Mbps. Those modules use DDR5 DRAM parts, which also run at 5600Mbps. An MRDIMM module using the same DDR5 5600Mbps DRAM parts will run at a blazing 11.2Gbps.

One key metric for best-in-class performance, low bit error rate (BER), and ease of adoption is the eye diagram. The eye diagram illustrates at-speed system margin and accurately represents DDR system quality when captured with a pseudo-random binary sequence (PRBS)-like pattern. The diagram below illustrates Cadence’s 3nm silicon write eye diagram for DDR5 MRDIMM IP running at 12.8Gbps.

Cadence 3nm DDR5 MRDIMM 12.8Gbps test chip write eye diagram, design kit is available today

The eye diagram is captured using a PRBS-like pattern, incorporating a package and system board representative of a typical MRDIMM channel. Using PRBS-like patterns is crucial for capturing accurate eye diagrams. Repetitive clock-like data patterns create deceptively “open eyes” that do not reflect the real system performance. Effects like intersymbol interference, simultaneous switching, reflections, and crosstalk are not accurately reflected in the eye diagrams for parallel interfaces like DDR using non-random data streams. Relying on improperly captured eye diagrams inevitably leads to a significantly worse real system BER than conveyed by that eye diagram.

Doubling the DDR5 RDIMM data rate is challenging. Achieving high performance while optimizing for area and power requires multiple design techniques. Feed-forward equalization (FFE), decision feedback equalization (DFE), continuous-time linear equalization (CTLE), and T-coils are required to reach 12.8Gbps MRDIMM data rates in multi-channel systems. Building a production-worthy 12.8Gbps DDR5 MRDIMM IP requires engineering expertise that comes from many generations of memory interface design and production experience. Cadence has developed this expertise through multiple DDR5/4, LPDDR5X/5, and GDDR6 designs in different technology nodes and foundries. For instance, Cadence’s GDDR6 IP is available in three foundries and ten process nodes, with mass production at speeds exceeding 22Gbps.

For your next project, consider DDR5 12.8Gbps MRDIMM, a technology that not only doubles the bandwidth of DDR5 RDIMM but also promises rapid proliferation into next-generation AI, data center, HPC, and enterprise applications. With its cutting-edge capabilities, the Cadence DDR5 12.8Gbps MRDIMM IP is ready to power the future of computing.

LEF allows the same port with multiple shape definitions. Does anybody know if innovus can create multiple duplicate shapes associated with the same port? Assume they are connected outside the block with perfect timing synchronization. Thank you!

I am working with innovus on a huge design. I found some cells are placed far away from both timing start points and timing end points. I suspect some other timing paths may be near-critical that results in this sub-optimal cell placement; or innovus has to place the cell far away due to congestion of placement or routing.

Is there a way to see why innovus places/moves the cell during place_opt_design or ccopt_design?

Also, is there a way to highlight all timing start points or timing end points that go through a cell? There may be thousands of timing paths through this cell. I tried using report_timing and timing debugger but it is very painful to click the highlight box and highlight the timing paths one by one.

Thank you for your help!

We are currently setting up the Tempus flow and have ran into some mismatched data regarding ECO and timing reports. I generated a timing report before running ECO and saw six total setup violations. When running opt_signoff -setup, the initial setup summary that was printed in the shell only showed one violation. I can see that violation from the initial setup summary in my pre-ECO timing report and it is not the worst path. Upon further investigation, I forced the tool to try to fix setup on one of the other five violations from the timing report using the opt_signoff_select_setup_endpoints attribute and the tool said that the endpoint had positive slack and would be ignored.

Has anyone experienced something like this before?

Hi everyone. 

I'm very a new cadence user. I'm not good at using it and quite lost in finding a way to get the results. With the topic, I would like to ask you for some suggestions to improve my cadence skills.

I have some digital decision logic. Some are combinational logic, some are sequential logic that I would like to import or generate random input combination to the inputs of my decision logic to get the maximum, minimum, and average delay power dissipation and area when feeding the different input combination.

My logic has 8-bit, 16-bit, and 32-bit input. The imported data tends to be decimal numbers.

I would like to ask you:

- which tool(s) are the most appropriate to import and feed the different combination to my decision logic?

- which tool is the most appropriate to synthesis with different number of input? - I have used Genus Synthesis Solution so far. However with my skill right now I can only let Genus synthesize my Verilog code one setup at a time. I'm not sure if I there is anyway I can feed a lot of input at a time and get those results (min, max, average of delay, power dissipation and area)

- which language or scripts I should pick up to use and achieve these results?

-where can I find information to solve my problem? which information shall I look for?

Thank you so much for your time!!

Best Regards

Hi,

My query is regarding importing of layout.

After importing, we see that the imported transistor instances and vias are all referring to the library in which they are imported, instead of referring to the technology library.

Please let me know how we can refer them to the technology library.

Will surely provide more details if my query is unclear.

Thanks,

Mallikarjun.

Hi All,

I'm using a code (abConvertPolygonToPath.ils) that I found in other posts to convert a rect object to a path object inside a pcell code, but when I try to run a DRC, the layout export fails due to a warning message, here is the log message

*WARNING* (DB-270001): Pcell evaluation for 18A_asaavedr/lay_mesh_BM0_BM4_3p6_3p6/layout has the following error(s):

*WARNING* (DB-270002): ("eval" 0 t nil ("*Error* eval: undefined function" abConvertPolygonToPath))

ERROR (XOASIS-231): Pcell evaluation failed for '18A_asaavedr/lay_mesh_BM0_BM4_3p6_3p6/layout' because the Pcell SKILL code contains either a syntax error or an unsupported XOasis function. Check the standard output or the Virtuoso log file for more information. Cadence recommends correcting the Pcell SKILL code to resolve the issue. However, to ignore these errors and continue the translation, you may use the 'ignorePcellEvalFail' option.

INFO (XOASIS-282): Translation Failed. '1' error(s) and '3' warning(s) found.

And when compile the code I get the following message:

*WARNING* defgeneric function already defined - abConvertPolygonToPath

I will aprreciate any help in how to waive this error, or fix it.

Thank you

Thermal analysis with the Cadence Celsius Thermal Solver integrated within the AWR Microwave Office circuit simulator gives designers an understanding of device operating temperatures related to power dissipation. That temperature information can be introduced into an electrothermal model to predict the impact on RF performance.(read more)

When starting a new design, it's important to take the time to consider design recommendations that prevent problems that can arise later in the design cycle. This two-part compilation of guidelines for starting a new design is the result of years of Cadence AWR Design Environment platform Support experience with designs. Pre-design decisions for user interface, simulation, layout, and library configuration lay the groundwork for a successful and efficient AWR design. This blog, part 2, covers the layout and component library considerations designers should note prior to starting a design.(read more)

By David Vye, Senior Product Marketing Manager, AWR, Cadence When designing multi-octave high-power amplifiers, it is a challenge to achieve both broadband gain and power matching using a combination of lumped and distributed techniques. One approach...(read more)

Are you ready to revolutionize your RF design experience? Look no further! Cadence AWR software is your gateway to mastering the intricacies of Radio Frequency (RF) circuit design, and now, you can explore its power with our exclusive Free Academic T...(read more)

i want to read from text file two values  on two ports , i wrote  that  code, and i have that error that shown in the image below . and also the data in text file is shown as screenshot

module read_file (a,b);

electrical a,b;
integer in_file_0,data_value, valid, count0,int_value;

analog begin
@(initial_step) begin
in_file_0 = $fopen("/home/hh1667/ee610/my_library/read_file/data2.txt","r");

valid = $fscanf (in_file_0, "%b,%b" ,int_value,count0);
end

V(a) <+ int_value;
V(b) <+ count0;

end

endmodule

Hi everyone, 

Is there any method to generate "Sheet" column for a pin report like table below? The column "Name.Pin" & "Signal" can be generated easily, but I have no idea to generate the column of "Sheet Name".

The software using here are Allegro Design Entry HDL, OrCAD Capture and Allegro PCB Editor. Can these 3 software generate "Sheet Name" data?

Thank you. 

Hi ,

 I am using conformal v23.2 for LEC checking b/w netlist vs Netlist. I am getting 8 not mapped points(z) in revised but when i check in mapping manager it showing 0 Not mapped points and showing this 8 not mapped points in extra unmapped section z(f) snps_scan_out_6 .How to resolve this issue Pls help

regards,

I am trying to understand the Linting process. I know that mainly JasperGold is the tool for this purpose. Though I think JasperGold is more suited for later stages of the design. As a RTL Design Engineer, I want to make sure that if another tool has the capability of doing Linting earlier in the flow. for example, does Xcelium, Genus or Confomal support linting. I have seen some contradicting information online regarding this topic, though I can't find anything related to Linting on any of these tools.

Thanks

Learn how Xcelium PowerPlayback App enables the massively parallel Xcelium replay of waveforms for glitch-accurate power estimation of multi-billion gate SoC designs.(read more)

Community engagement is a dynamic concept that does not adhere to a singular, universal approach. Its various forms, methods, and objectives can vary significantly depending on the specific context, goals, and desired outcomes. Whether you seek assis...(read more)

Power network design and analysis of 3D-ICs is a major challenge due to the complex nature and large size of the power network. In addition, designers must deal with the complexity of routing power through the interposer, multiple dies, through-silicon vias (TSVs), and through-dielectric vias (TDVs).
Cadence’s Integrity 3D-IC Platform and Voltus IC Power Integrity Solution provide a fully integrated solution for early planning and analysis of 3D-IC power networks, 3D-IC chip-centric power integrity signoff, and hierarchical methods that significantly improve capacity and performance of power integrity (PI) signoff while maintaining a very high level of accuracy at signoff. This blog summarizes the typical design challenges faced by today’s 3D-IC designers, as discussed in our recent webinar, “Addressing 3D-IC Power Integrity Design Challenges.” Please click here to view the full webinar.

Major Trends in Advanced Chip Design

From chips to chiplets, stacked die, 3D-ICs, and more, three major trends are impacting advanced semiconductor packaging design. The first is heterogenous integration, which we define as a disaggregated approach to designing systems on chip (SoCs) from multiple chiplets. This approach is similar to system-in-package (SiP) design, except that instead of integrating multiple bare die – including 3D stacking – on a single substrate, multiple IPs are integrated in the form of chiplets on a single substrate.

The second major trend is around new silicon manufacturing techniques that leverage silicon vias (TSVs) and high-density fanout RDL. These advancements mean that silicon is becoming a more attractive material for packaging, especially when high bandwidth and form factor become key attributes in the end design. This brings new design and verification challenges to most packaging engineers who typically work with organic and ceramic substrate materials.

Finally, on the ecosystem side, all the large semiconductor foundries now offer their own versions of advanced packaging. This brings new ways of supporting design teams with technologies like reference flows and PDKs, concepts that have typically been lacking in the packaging community. Cadence has worked with many of the leading foundries and outsourced semiconductor assembly and test facilities (OSATs) to develop multi-chip(let) packaging reference flows and package assembly design kits. The downside is that, with the time restrictions designers are under today, there isn’t enough time to simulate the details of these flows and PDKs further.

For those who must make the best electro/thermal/physical decisions to achieve the best power/performance/area/cost (PPAC), factors can include accurate die size estimations, thermal feasibility, die-to-die interconnect planning, interposer planning (silicon/organic), front-to-front and front-to-back (F2F/F2B) planning, layer stack and electromigration/ IR drop (EMIR)/TSV planning, IO bandwidth feasibility, and system-level architecture selection.

3D-IC Power Network Design and Analysis

The key to success in 3D-IC design is early power integrity planning and analysis. Cadence’s Integrity 3D-IC platform is a high-capacity 3D-IC platform that enables 3D design planning, implementation, and system analysis in a single, unified cockpit. Cadence’s Voltus IC Power Integrity Solution is a comprehensive full chip electromigration, IR drop, and power analysis solution. With its fully distributed architecture and hierarchical analysis capabilities, Voltus provides very fast analysis and has the capacity to handle the largest designs in the industry. Typically, 3D-IC PDN design and analysis is performed in four phases, as shown in Figure 1.

Phase 1 - Perform early power delivery network (PDN) exploration with each fabric’s PDN cascaded in system PI with early circuit models.

Phase 2 – Plan 3D-IC PDNs in Cadence’s Integrity 3D-IC platform, including micro bumps, TSVs, and through dielectric vias (TDVs), power grid synthesis for dies, and early rail analysis and optimization.

Phase 3 – Perform full chip-centric signoff in Voltus with detailed die, interposer, and package models, including chip die models, while keeping some dies flat.

Phase 4 – Perform full system-level signoff with Cadence’s Sigrity SystemPI using detailed extracted package models from Sigrity XtractIM, board models from Sigrity PowerSI or Clarity 3D Solver, interposer models from XtractIM or Voltus, and chip power models from Voltus.

Figure 1. 3D-IC PDN design and analysis phases

3D-IC Chip-Centric Signoff

The integration of Integrity 3D-IC and Voltus enables chip-centric early analysis and signoff. Figure 2 and Figure 3 highlight the chip centric early PI optimization and signoff flows. In early analysis, the on-chip power networks are synthesized, and the micro bumps and TSVs can be placed and optimized. In the signoff stage, all the detailed design data is used for power analysis, and detailed models are extracted and used for package, interposer, and on-die power networks.

Figure 2. Early chip-centric PI analysis and optimization flow

Figure 3. Chip-centric 3D-IC PI signoff

Hierarchical 3D-IC PI Analysis

To improve the capacity and performance of 3D-IC PI analysis, Voltus enables hierarchical analysis using chiplet models. Chiplet models can be reduced chip models in spice format or more accurate xPGV models which are highly accurate proprietary models generated by Voltus. With xPGV models, the hierarchical PI analysis has almost the same accuracy as flat analysis but offers 10X or higher benefit in runtime and memory requirements.

Conclusion

This blog has highlighted the major design trends enabled by advanced 3D packaging and the design challenges arising from these advancements. The design of power delivery networks is one of these major challenges. We have discussed Cadence solutions to overcome this PI challenge. To learn more, view our recent webinar, "Addressing 3D-IC Power Integrity Design Challenges" and visit the Voltus web page.

When it comes to system integration, PCB designers need to collaborate with the signal analysis or integrity team to run pre-route or post-route analysis and modify constraints, floorplan, or topology based on the results. Allegro PCB Edito...(read more)

Does anyone know whether it is possible to have multiple contact points for a bond wire on a large die pad? Note: This is different from adding multiple wires which I will also be doing. I need to add multiple bond connections to the same large die pad for redundancy connections to each pad for each wire. I have a large die pad which I need to have 5 wires with each wire having 3 bond connections to the same die pad.