1 Brunei Dollar = 2.5991 United Arab Emirates Dirham

With more and more SoCs employing sophisticated interconnect IP to link multiple processor cores, caches, memories, and dozens of other IP functions, the designs are enabling a new generation of low-power servers and high-performance mobile devices. The complexity of the interconnects and their advanced configurability contributes to already formidable design and verification challenges which lead to the following questions:

While your interconnect subsystem might have a correct functionality, are you starving your IP functions of the bandwidth they need? Are requests from latency-critical initiators processed on time? How can you ensure that all applications will receive the desired bandwidth in steady-state and corner use-cases?

To answer these questions, Cadence recommends the Performance Verification Methodology to ensure that the system performance meets requirements at the different levels:

1. Performance characterization: The first level of verification aims to verify the path-to-path traffic measuring the performance envelope. It targets integration bugs like clock frequency, buffer sizes, and bridge configuration. It requires to analyze the latency and bandwidth of design’s critical paths.
2. Steady state workloads: The second level of verification aims to verify the master-by-master defined loads using traffic profiles. It identifies the impact on bandwidth when running multi-master traffic with various Quality-of-Service (QoS) settings. It analyzes the DDR sub-system’s efficiency, measures bandwidth and checks whether masters’ QoS requirements are met.
3. Application specific use cases: The last level of verification simulates the use-cases and reaches the application performance corner cases. It analyzes the master-requested bandwidth as well as the DDR sub-system’s efficiency and bandwidth.

Cadence has developed a set of tools to assist customers in performance validation of their SoCs. Cadence Interconnect Workbench simplifies the setup and measurement of performance and verification testbenches and makes debugging of complex system behaviors a snap. The solution works with Cadence Verification IPs and executes on the Cadence Xcelium® Enterprise Simulator or Cadence Palladium® Accellerator/Emulator, with coverage results collected and analyzed in the Cadence vManager  Metric-Driven Signoff Platform.

To verify the performance of the Steady State Workloads, Arm has just released a new AMBA Adaptive Traffic Profile (ATP) specification which describes AMBA abstract traffic attributes and defines the behavior of the different traffic profiles in the system.

With the availability of Cadence Interconnect Workbench and AMBA VIP support of ATP, early adopters of the AMBA ATP specification can begin working immediately, ensuring compliance with the standard, and achieving the fastest path to SoC performance verification closure.

For more information on the AMBA Adaptive Traffic Profile, you can visit Dimitry's blog on AMBA Adaptive Traffic Profiles: Addressing The Challenge. 

More information on Cadence Interconnect Workbench solution is available at Cadence Interconnect Solution webpage.

Thierry

Test chips are becoming more widespread and more complex at advanced process nodes as design teams utilize early silicon to diagnose problems prior to production. But this approach also is spurring questions about whether this approach is viable at 7nm and 5nm, due to the rising cost of prototyping advanced technology, such as mask tooling and wafer costs.

Semiconductor designers have long been making test chips to validate test structures, memory bit cells, larger memory blocks, and precision analog circuits like current mirrors, PLLs, temperature sensors, and high-speed I/Os. This has been done at 90nm, 65nm, 40nm, 32nm, 28nm, etc., so having test chips at 16nm, 7nm, or finer geometries should not be a surprise. Still, as costs rise, there is debate about whether those chips are over-used given advancements in tooling, or whether they should be utilized even more, with more advanced diagnostics built into them.

Modern EDA tools are very good. You can simulate and validate almost anything with certain degree of accuracy and correctness. The key to having good and accurate tools and accurate results (for simulation) is the quality of the foundry data provided. The key to having good designs (layouts) is that the DRC deck must be of high quality and accurate and must catch all the things you are not supposed to do in the layout. Most of the challenges in advanced node is in the FEOL where semiconductor physics and lithography play outsize roles. Issues that were not an issue at more mature nodes can manifest themselves as big problems at 7nm or 5nm. Process variation across the wafer and variation across a large die also present problems that were of no consequence in more mature nodes.

The real questions to be asked are as follows:

What is the role of test chips in SoC designs?

1. Do all hard IP require test chips for validation?
2. Are test chips more important at advanced nodes compared to more mature nodes?
3. Is the importance of test chip validation relative to the type of IP protocols?
4. What are the risks if I do not validate in silicon?

In complex SoC designs, there are many high-performance protocols such as LPDDR4/4x PHY, PCIe4 PHY, USB3.0 PHY, 56G/112G SerDes, etc. Each one of these IP are very complex in and by itself. If there is any chance of failure that is not detected prior to SoC (tapeout) integration, the cost of retrofit is huge. This is why the common practice is to validate each one of these complex IP in silicon before committing to use such IP in chip integration. The test chips are used to validate that the IP are properly designed and meet the functional specifications of the protocols. They are also used to validate if sufficient margins are designed into the IP to mitigate variances due to process tolerances. All high-performance hard IP go through this test chip/silicon validation process. Oftentimes, marginality is detected at this stage. In advanced nodes, it is also important to have the test chips built under different process corners. This is intended to simulate process variations in production wafers so as to maximize yields. Advanced protocols such as 112G, GDDR6, HBM2, and PCIe4 are incredibly complex and sensitive to process variations. It is almost impossible to design these circuits and try to guarantee their performance without going through the test chip route.

Besides validating performance of the IP protocols, test silicon is also used to validate robustness of ESD structures, sensitivity to latch up, and performance degradation over wide temperature ranges. All these items are more critical in advanced nodes than more mature modes. Test chips are vehicles to guarantee design integrity in bite-size chunks. It is better to deal with any potential issues in smaller blocks than to try to fix them in the final integrated SoC.

Test chips will continue to play a vital role in helping IP and SoC teams lower the risk of their designs, and assuring optimal quality and performance in the foreseeable future. They are not going away!

To read more, please visit https://semiengineering.com/test-chips-play-larger-role-at-advanced-nodes/

This new film is the latest remake of Devdas, but what is equally interesting is the fact that it is in conversation with films made in the West. Unlike Bhansali’s more spectacular version of the older story, Anurag Kashyap’s Dev.D is a genuine rewriting of Sarat Chandra’s novel. Kashyap doesn’t flinch from depicting the individual’s downward spiral, but he also gives women their own strength. He has set out to right a wrong—or, at least, tell a more realistic, even redemptive, story. If these characters have lost some of the affective depth of the original creations, they have also gained the hard edges of modern lives.

We don’t always feel the pain of Kashyap’s characters, but we are able to more readily recognize them. Take Chandramukhi, or Chanda, who is a school-girl humiliated by the MMS sex-scandal. Her father, protective and patriarchal, says that he has seen the tape and thinks she knew what she was doing. “How could you watch it?” the girl asks angrily. And then, “Did you get off on it?” When was the last time a father was asked such a question on the Hindi screen? With its frankness toward sex and masturbation, Dev.D takes a huge step toward honesty. In fact, more than the obvious tributes to Danny Boyle’s Trainspotting, or the over-extended psychedelic adventure on screen, in fact, as much as the moody style of film-making, the candour of such questions make Dev.D a film that is truly a part of world cinema.

Rave Out © 2007 IndiaUncut.com. All rights reserved.
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In the book “The World of _____” by Bennett Alan Weinberg and Bonnie K Bealer, there is a photograph of a label from a jar of pharmaceutical-grade crystals. It reads:

“WARNING: MAY BE HARMFUL IF INHALED OR SWALLOWED. HAS CAUSED MUTAGENIC AND REPRODUCTIVE EFFECTS IN LABORATORY ANIMALS. INHALATION CAUSES RAPID HEART RATE, EXCITEMENT, DIZZINESS, PAIN, COLLAPSE, HYPOTENSION, FEVER, SHORTNESS OF BREATH. MAY CAUSE HEADACHE, INSOMNIA, VOMITING, STOMACH PAIN, COLLAPSE AND CONVULSIONS.”

Fill in the blank.

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This is the 15th installment of The Rationalist, my column for the Times of India.

It’s election season, and promises are raining down on voters like rose petals on naïve newlyweds. Earlier this week, the Congress party announced a minimum income guarantee for the poor. This Friday, the Modi government released a budget full of sops. As the days go by, the promises will get bolder, and you might feel important that so much attention is being given to you. Well, the joke is on you.

Every election, HL Mencken once said, is “an advance auction sale of stolen goods.” A bunch of competing mafias fight to rule over you for the next five years. You decide who wins, on the basis of who can bribe you better with your own money. This is an absurd situation, which I tried to express in a limerick I wrote for this page a couple of years ago:

POLITICS: A neta who loves currency notes/ Told me what his line of work denotes./ ‘It is kind of funny./ We steal people’s money/And use some of it to buy their votes.’

We’re the dupes here, and we pay far more to keep this circus going than this circus costs. It would be okay if the parties, once they came to power, provided good governance. But voters have given up on that, and now only want patronage and handouts. That leads to one of the biggest problems in Indian politics: We are stuck in an equilibrium where all good politics is bad economics, and vice versa.

For example, the minimum guarantee for the poor is good politics, because the optics are great. It’s basically Garibi Hatao: that slogan made Indira Gandhi a political juggernaut in the 1970s, at the same time that she unleashed a series of economic policies that kept millions of people in garibi for decades longer than they should have been.

This time, the Congress has released no details, and keeping it vague makes sense because I find it hard to see how it can make economic sense. Depending on how they define ‘poor’, how much income they offer and what the cost is, the plan will either be ineffective or unworkable.

The Modi government’s interim budget announced a handout for poor farmers that seemed rather pointless. Given our agricultural distress, offering a poor farmer 500 bucks a month seems almost like mockery.

Such condescending handouts solve nothing. The poor want jobs and opportunities. Those come with growth, which requires structural reforms. Structural reforms don’t sound sexy as election promises. Handouts do.

A classic example is farm loan waivers. We have reached a stage in our politics where every party has to promise them to assuage farmers, who are a strong vote bank everywhere. You can’t blame farmers for wanting them – they are a necessary anaesthetic. But no government has yet made a serious attempt at tackling the root causes of our agricultural crisis.

Why is it that Good Politics in India is always Bad Economics? Let me put forth some possible reasons. One, voters tend to think in zero-sum ways, as if the pie is fixed, and the only way to bring people out of poverty is to redistribute. The truth is that trade is a positive-sum game, and nations can only be lifted out of poverty when the whole pie grows. But this is unintuitive.

Two, Indian politics revolves around identity and patronage. The spoils of power are limited – that is indeed a zero-sum game – so you’re likely to vote for whoever can look after the interests of your in-group rather than care about the economy as a whole.

Three, voters tend to stay uninformed for good reasons, because of what Public Choice economists call Rational Ignorance. A single vote is unlikely to make a difference in an election, so why put in the effort to understand the nuances of economics and governance? Just ask, what is in it for me, and go with whatever seems to be the best answer.

Four, Politicians have a short-term horizon, geared towards winning the next election. A good policy that may take years to play out is unattractive. A policy that will win them votes in the short term is preferable.

Sadly, no Indian party has shown a willingness to aim for the long term. The Congress has produced new Gandhis, but not new ideas. And while the BJP did make some solid promises in 2014, they did not walk that talk, and have proved to be, as Arun Shourie once called them, UPA + Cow. Even the Congress is adopting the cow, in fact, so maybe the BJP will add Temple to that mix?

Benjamin Franklin once said, “Democracy is two wolves and a lamb voting on what to have for lunch.” This election season, my friends, the people of India are on the menu. You have been deveined and deboned, marinated with rhetoric, seasoned with narrative – now enter the oven and vote.

© 2007 IndiaUncut.com. All rights reserved.
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This is the 23rd installment of The Rationalist, my column for the Times of India.

I had a strange dream last night. I dreamt that the government had passed a law that made using laptops illegal. I would have to write this column by hand. I would also have to leave my home in Mumbai to deliver it in person to my editor in Delhi. I woke up trembling and angry – and realised how Indian farmers feel every single day of their lives.

My column today is a tale of two satyagrahas. Both involve farmers, technology and the freedom of choice. One of them began this month – but first, let us go back to the turn of the millennium.

As the 1990s came to an end, cotton farmers across India were in distress. Pests known as bollworms were ravaging crops across the country. Farmers had to use increasing amounts of pesticide to keep them at bay. The costs of the pesticide and the amount of labour involved made it unviable – and often, the crops would fail anyway.

Then, technology came to the rescue. The farmers heard of Bt Cotton, a genetically modified type of cotton that kept these pests away, and was being used around the world. But they were illegal in India, even though no bad effects had ever been recorded. Well, who cares about ‘illegal’ when it is a matter of life and death?

Farmers in Gujarat got hold of Bt Cotton seeds from the black market and planted them. You’ll never guess what happened next. As 2002 began, all cotton crops in Gujarat failed – except the 10,000 hectares that had Bt Cotton. The government did not care about the failed crops. They cared about the ‘illegal’ ones. They ordered all the Bt Cotton crops to be destroyed.

It was time for a satyagraha – and not just in Gujarat. The late Sharad Joshi, leader of the Shetkari Sanghatana in Maharashtra, took around 10,000 farmers to Gujarat to stand with their fellows there. They sat in the fields of Bt Cotton and basically said, ‘Over our dead bodies.’ ¬Joshi’s point was simple: all other citizens of India have access to the latest technology from all over. They are all empowered with choice. Why should farmers be held back?

The satyagraha was successful. The ban on Bt Cotton was lifted.

There are three things I would like to point out here. One, the lifting of the ban transformed cotton farming in India. Over 90% of Indian farmers now use Bt Cotton. India has become the world’s largest producer of cotton, moving ahead of China. According to agriculture expert Ashok Gulati, India has gained US$ 67 billion in the years since from higher exports and import savings because of Bt Cotton. Most importantly, cotton farmers’ incomes have doubled.

Two, GMO crops have become standard across the world. Around 190 million hectares of GMO crops have been planted worldwide, and GMO foods are accepted in 67 countries. The humanitarian benefits have been massive: Golden Rice, a variety of rice packed with minerals and vitamins, has prevented blindness in countless new-born kids since it was introduced in the Philippines.

Three, despite the fear-mongering of some NGOs, whose existence depends on alarmism, the science behind GMO is settled. No harmful side effects have been noted in all these years, and millions of lives impacted positively. A couple of years ago, over 100 Nobel Laureates signed a petition asserting that GMO foods were safe, and blasting anti-science NGOs that stood in the way of progress. There is scientific consensus on this.

The science may be settled, but the politics is not. The government still bans some types of GMO seeds, such as Bt Brinjal, which was developed by an Indian company called Mahyco, and used successfully in Bangladesh. More crucially, a variety called HT Bt Cotton, which fights weeds, is also banned. Weeding takes up to 15% of a farmer’s time, and often makes farming unviable. Farmers across the world use this variant – 60% of global cotton crops are HT Bt. Indian farmers are so desperate for it that they choose to break the law and buy expensive seeds from the black market – but the government is cracking down. A farmer in Haryana had his crop destroyed by the government in May.

On June 10 this year, a farmer named Lalit Bahale in the Akola District of Maharashtra kicked off a satyagraha by planting banned seeds of HT Bt Cotton and Bt Brinjal. He was soon joined by thousands of farmers. Far from our urban eyes, a heroic fight has begun. Our farmers, already victimised and oppressed by a predatory government in countless ways, are fighting for their right to take charge of their lives.

As this brave struggle unfolds, I am left with a troubling question: All those satyagrahas of the past by our great freedom fighters, what were they for, if all they got us was independence and not freedom?

© 2007 IndiaUncut.com. All rights reserved.
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First, the good news. The EDA industry will grow from $6.2 billion in 2015 to $9.0 billion in 2019, according to Gary Smith, chief analyst at Gary Smith EDA. Year-to-year growth rates will range from +4% to +11.2%.

But in his annual presentation on the eve of the Design Automation Conference (DAC 2015), Smith noted that Wall Street is unimpressed. “The people I talk to want long-term steady growth, no sharp up-turns, no sharp downturns,” Smith said. “To the rest of Wall Street, we’re boring.”

Smith spent the rest of his talk noting how EDA can be a lot less boring and, potentially, a whole lot bigger. For starters, what if we add semiconductor IP to EDA revenues? Now we’re looking at $12.2 billion in revenue by 2019, Smith said. (He acknowledged, however, that the IP market itself is going to take a “dip” due to the move towards platform-based IP and away from conventional piecemeal IP).

This still is not enough to get Wall Street’s attention. Another possibility is to bring embedded software development into the EDA industry. This is not a huge market – about $2.6 billion today – but it is an “easy growth market for us,” according to Smith.

Chasing the Big Bucks

But the “big bucks” are in mechanical CAD (MCAD), Smith said. In the past the MCAD market has always been bigger than EDA, but now EDA is catching up. The MCAD market is about $6.6 billion now. Synopsys and Cadence are larger than PTC and Siemens, two of the main players in MCAD.

There may be some good acquisition possibilities coming up for EDA vendors, Smith said – and if we don’t buy MCAD companies, they might buy EDA companies. Consider, for example, that Ansoft bought Apache and Dassault bought Synchronicity. (Note: Siemens PLM Software is a first-time exhibitor at DAC 2015).

What about other domains? Smith said that EDA companies could conceivably move into optical design, applications development software, biomedical design, and chemical design. The last if these is probably the most tenuous; Smith noted that EDA vendors have yet to look into chemical design.

Applications development software is the biggest market on the above list, but that means competing with Microsoft, IBM, and Oracle. “You’re in with the big boys – is that a good idea?” Smith asked.

Perhaps there’s an opening for a “big play” for an MCAD provider. Smith noted that mechanical vendors are focusing on product data management (PDM). This “is really the IT of design,” Smith said. “They have a lot of hope that the IoT [Internet of things] market is going to give them an opportunity to capture the software that goes from the ground to the cloud. Maybe we can let them have PDM and see if we can take the tool market away from them, or acquire it away from them.”

In conclusion, Smith asked, should the EDA industry accelerate its growth? “The mechanical vendors have already shown interest in acquiring EDA vendors,” he said. “We may not have a choice.”

Richard Goering

NOTE: Catch our live blog from DAC 2015, beginning Monday morning, June 8! Click here

As a leading venture capitalist in the electronics technology, as well as CEO of Cadence, Lip-Bu Tan has unique insights into ongoing changes that will impact EDA providers and users. Tan shared some of those insights in a “fireside chat” with Ed Sperling, editor in chief of Semiconductor Engineering, at the Design Automation Conference (DAC 2015) on June 9.

Topics of this discussion included industry consolidation, the need for more talent and more startups, Internet of Things (IoT) opportunities and challenges, the shift from ICs to full product development, and the challenges of advanced nodes. Following are some excerpts from this conversation, held at the DAC Pavilion theater on the exhibit floor.

Ed Sperling (left) and Lip-Bu Tan (right) discuss trends in semiconductors and EDA

Q: As you look out over the semiconductor and EDA industries these days, what worries you most?

Tan: At the top of my list is all the consolidation that is going on. Secondly, chip design complexity is increasing substantially. Time-to-market pressure is growing and advanced nodes have challenges.

The other thing I worry about is that we need to have more startups. There’s a lot of innovation that needs to happen. And this industry needs more top talent. At Cadence, we have a program to recruit over 10% of new hires every year from college graduates. We need new blood and new ideas.

Q: EDA vendors were acquiring companies for many years, but now the startups are pretty much gone. Where does the next wave of innovation come from?

Tan: I’ve been an EDA CEO for the last seven years and I really enjoy it because so much innovation is needed. System providers have very big challenges and very different needs. You have to find the opportunities and go out and provide the solutions.

The opportunities are not just in basic tools. Massive parallelism is critical, and the power challenge is huge. Time to market is critical, and for the IoT companies, cost is going to be critical. If you want to take on some good engineering challenges, this is the most exciting time.

Q: You live two lives—you’re a CEO but you’re also an investor. Where are the investments going these days and where are we likely to see new startups?

Tan: Clearly everybody is chasing the IoT. There is a lot of opportunity in the cloud, in the data center. Also, I’m a big believer in video, so I back companies that are video related. A big area is automotive. ADAS [Advanced Driver Assistance Systems] is a tremendous opportunity.

These companies can help us understand how the industry is transforming, and then we can provide solutions, either in terms of IP, tools, or the PCB. Then we need to connect from the system level down to semiconductors. I think it’s a different way to design.

Q: What happens as we start moving from companies looking to design a semiconductor to system companies who are doing things from the perspective that we have this purpose for our software?

Tan: We are extending from EDA to what we call system design enablement, and we are becoming more application driven. The application at the system level will drive the silicon design. We need to help companies look at the whole system including the power envelope and signal integrity. You don’t want to be in a position where you design a chip all the way to fabrication and then find the power is too high.

We help the customers with hardware/software co-design and co-verification. We have a design suite and a verification suite that can provide customers with high-level abstractions, as well as verify IP blocks at the system level. Then we can break things down to the component level with system constraints in mind, and drive power-aware, system-aware design.

We are starting to move into vertical markets. For example, medical is a tremendous opportunity.

Q: How does this approach change what you provide to customers?

Tan: Every year I spend time meeting with customers. I think it is very important to understand what they are trying to design, and it is also important to know the customer’s customer requirements. We might say, “Wait a minute, for this design you may want to think about power or the library you’re using.” We help them understand what foundry they should use and what process they should use. They don’t view me as a vendor—they view me as a partner.

We also work very closely with our IP and foundry partners. We work as one team—the ultimate goal is customer success.

Q: Is everybody going to say, FinFETs are beautiful, we’re going to go down to 10nm or 7nm—or is it a smaller number of companies who will continue down that path?

Tan: Some of the analog/mixed-signal companies don’t need to go that far. We love those customers—we have close to 50% of that business. But we also have customers in the graphics or processor area who are really pushing the envelope, and need to be in 16nm, 14nm, or 10nm. We work very closely with those guys to make sure they can go into FinFETs.

We always want to work with the customer to make sure they have a first-time silicon success. If you have to do a re-spin, you miss the opportunity and it’s very costly.

Q: There’s a new market that is starting to explode—IoT. How real is that world to you? Everyone talks about large numbers, but is it showing up in terms of tools?

Tan: Everybody is talking about huge profits, but a lot of the time I think it is just connecting old devices that you have. Billions of units, absolutely yes, but if you look close enough the silicon percentage of that revenue is very tiny. A lot of the profit is on the service side. So you really need to look at the service killer app you are trying to provide.

What’s most important to us in the IoT market is the IP business. That’s why we bought Tensilica—it’s programmable, so you can find the killer app more quickly. The other challenges are time to market, low power, and low cost.

Q: Where is system design enablement going? Does it expand outside the traditional market for EDA?

Tan: It’s not just about tools. IP is now 11% of our revenue. At the PCB level, we acquired a company called Sigrity, and through that we are able to drive system analysis for power, signal integrity, and thermal. And then we look at some of the verticals and provide modeling all the way from the system level to the component level. We make sure that we provide a solution to the end customer, rather than something piecemeal.

Q: What do you think DAC will look like in five years?

Tan: It’s getting smaller. We need to see more startups and innovative IP solutions. I saw a few here this year, and that’s good. We need to encourage small startups.

Q: Where do we get the people to pull this off? I don’t see too many people coming into EDA.

Tan: I talk to a lot of university students, and I tell them that this small industry is a gold mine. A lot of innovation is needed. We need them to come in [to EDA] rather than join Google or Facebook. Those are great companies, but there is a lot of fundamental physical innovation we need.

Richard Goering

Related Blog Posts

- Gary Smith at DAC 2015: How EDA Can Expand Into New Directions

- DAC 2015: Google Smart Contact Lens Project Stretches Limits of IC Design

- Q&A with Nimish Modi: Going Beyond Traditional EDA

Design and verification standards are critical if we want to get a new generation of Internet of Things (IoT) devices into the market, according to panelists at an Accellera Systems Initiative breakfast at the Design Automation Conference (DAC 2015) June 9. However, IoT devices for different vertical markets pose very different challenges and requirements, making the standards picture extremely complicated.

The panel was titled “Design and Verification Standards in the Era of IoT.” It was moderated by industry editor John Blyler, CEO of JB Systems Media and Technology. Panelists were as follows, shown left to right in the photo below:

• Lu Dai, director of engineering, Qualcomm
• Wael William Diab, senior director for strategy marketing, industry development and standardization, Huawei
• Chris Rowen, CTO, IP Group, Cadence Design Systems, Inc.

In opening remarks, Blyler recalled a conversation from the recent IEEE International Microwave Symposium in which a panelist pointed to the networking and application layers as the key problem areas for RF and wireless standardization. Similarly, in the IoT space, we need to look “higher up” at the systems level and consider both software and hardware development, Blyler said.

Rowen helped set some context for the discussion by noting three important points about IoT:

• IoT is not a product segment. Vertical product segments such as automotive, medical devices, and home automation all have very different characteristics.
• IoT “devices” are components within a hierarchy of systems that includes sensors, applications, user interface, gateway application (such as cell phone), and finally the cloud, where all data is aggregated.
• A bifurcation is taking place in design. We are going from extreme scale SoCs to “extreme fit” SoCs that are specialized, low energy, and very low cost.

Here are some of the questions and answers that were addressed during the panel discussion.

Q: The claim was recently made that given the level of interaction between sensors and gateways, 50X more verification nodes would have to be checked for IoT. What standards need to be enhanced or changed to accomplish that?

Rowen: That’s a huge number of design dimensions, and the way you attack a problem of that scale is by modularization. You define areas that are protected and encapsulated by standards, and you prove that individual elements will be compliant with that interface. We will see that many interesting problems will be in the software layers.

Q: Why is standardization so important for IoT?

Dai: A company that is trying to make a lot of chips has to deal with a variety of standards. If you have to deal with hundreds of standards, it’s a big bottleneck for bringing your products to market. If you have good standardization within the development process of the IC, that helps time to market.

When I first joined Qualcomm a few years ago, there was no internal verification methodology. When we had a new hire, it took months to ramp up on our internal methodology to become effective. Then came UVM [Universal Verification Methodology], and as UVM became standard, we reduced our ramp-up time tremendously. We’ve seen good engineers ramp up within days.

Diab: When we start to look at standards, we have to do a better job of understanding how they’re all going to play with each other. I don’t think one set of standards can solve the IoT problem. Some standards can grow vertically in markets like industrial, and other standards are getting more horizontal. Security is very important and is probably one thing that goes horizontally.

Requirements for verticals may be different, but processing capability, latency, bandwidth, and messaging capability are common [horizontal] concerns. I think a lot of standards organizations this year will work on horizontal slices [of IoT].

Q: IoT interoperability is important. Any suggestions for getting that done and moving forward?

Rowen: The interoperability problem is that many of these [IoT] devices are wireless. Wireless is interesting because it is really hard – it’s not like a USB plug. Wireless lacks the infrastructure that exists today around wired standards. If we do things in a heavily wireless way, there will be major barriers to overcome.

Dai: There are different standards for 4G LTE technology for different [geographical] markets. We have to make a chip that can work for 20 or 30 wireless technologies, and the cost for that is tremendous. The U.S., Europe, and China all have different tweaks. A good standard that works across the globe would reduce the cost a lot.

Q: If we’re talking about the need to define requirements, a good example to look at is power. Certainly you have UPF [Unified Power Format] for the chip, board, and module.

Rowen: There is certainly a big role for standards about power management. But there is also a domain in which we’re woefully under-equipped, and that is the ability to accurately model the different power usage scenarios at the applications level. Too often power devolves into something that runs over thousands of cycles to confirm that you can switch between power management levels successfully. That’s important, but it tells you very little about how much power your system is going to dissipate.

Dai: There are products that claim to be UPF compliant, but my biggest problem with my most recent chip was still with UPF. These tools are not necessarily 100% UPF compliant.

One other concern I have is that I cannot get one simulator to pass my Verilog code and then go to another that will pass. Even though we have a lot of tools, there is no certification process for a language standard.

Q: When we create a standard, does there need to be a companion compliance test?

Rowen: I think compliance is important. Compliance is being able to prove that you followed what you said you would follow. It also plays into functional safety requirements, where you need to prove you adhered to the flow.

Dai: When we [Qualcomm] sell our 4G chips, we have to go through a lot of certifications. It’s often a differentiating factor.

Q: For IoT you need power management and verification that includes analog. Comments?

Rowen: Small, cheap sensor nodes tend to be very analog-rich, lower scale in terms of digital content, and have lots of software. Part of understanding what’s different about standardization is built on understanding what’s different about the design process, and what does it mean to have a software-rich and analog-rich world.

Dai: Analog is important in this era of IoT. Analog needs to come into the standards community.

Richard Goering

Cadence Blog Posts About DAC 2015

Gary Smith at DAC 2015: How EDA Can Expand Into New Directions

DAC 2015: Google Smart Contact Lens Project Stretches Limits of IC Design

DAC 2015: Lip-Bu Tan, Cadence CEO, Sees Profound Changes in Semiconductors and EDA

DAC 2015: “Level of Compute in Vision Processing Extraordinary” – Chris Rowen

DAC 2015: Can We Build a Virtual Silicon Valley?

DAC 2015: Cadence Vision-Design Presentation Wins Best Paper Honors

Let’s face it – the EDA industry needs new people and new ideas. One of the best places to find both is academia, and a presentation at the Cadence Theater at the recent Design Automation Conference (DAC 2015) described collaboration models that are working today.

The presentation was titled “Industry/Academia Engagement Models – From PhD Contests to R&D Collaborations.” It included these speakers, shown from left to right in the photo below:

• Prof. Xin Li, Electrical and Computer Engineering, Carnegie-Mellon University (CMU)
• Chuck Alpert, Senior Software Architect, Cadence
• Prof. Laleh Behjat, Department of Electrical and Computer Engineering, University of Calgary

Alpert, who was filling in for Zhuo Li, Software Architect at Cadence, was the vice chair of DAC 2015 and will be the general chair of DAC 2016 in Austin, Texas. “My team at Cadence really likes to collaborate with universities,” he said. “We’re a big proponent of education because we really need the best and brightest students in our industry.”

Contests Boost EDA Research

One way that Cadence collaborates with academia is participation in contests. “It’s a great way to formulate problems to academia,” Alpert said. “We can have the universities work on these problems and get some strategic direction.”

For example, Cadence has been involved with the annual CAD contest at the International Conference on Computer-Aided Design (ICCAD) since the contest was launched in 2012. This is the largest worldwide EDA R&D contest, and it is sponsored by the IEEE Council on EDA (CEDA) and the Taiwan Ministry of Education. Its goals are to boost EDA research in advanced real-world problems and to foster industry-academia collaboration.

Contestants can participate in one of more problems in the three areas of system design, logic synthesis and verification, and physical design. The 2015 contest has attracted 112 teams from 12 regions. Cadence contributes one problem per year in the logic synthesis area. Zhuo Li was the 2012 co-chair and the 2013 chair. The awards will be given at ICCAD in November 2015.

Another step that Cadence has taken, Alpert said, is to “hire lots of interns.” His own team has four interns at the moment. One advantage to interning at Cadence, he said, is that students get to see real-world designs and understand how the tools work. “It helps you drive your research in a more practical and useful direction,” he said.

The Cadence Academic Network co-sponsors the ACM SIGDA PhD Forum at DAC, and Xin Li and Zhuo Li are on the organizing committee. This event is a poster session for PhD students to present and discuss their dissertation research with people in the EDA community. This year’s forum was “packed,” Alpert said, and it’s clear that the event needs a bigger room.

Finally, Alpert noted, Cadence researchers write and publish technical papers at DAC and other conferences, and Cadence people serve on the DAC technical program committee. “We try to be involved with the academic community on a regular basis,” Alpert said. “We want the best and the brightest people to go into EDA because there is still so much innovation that’s needed. It’s a really cool place to be.”

Research Collaboration Exposes Failure Rates

Xin Li presented an example of a successful research collaboration between CMU and Cadence. The challenge was to find a better way to estimate potential failure rates in memory. As noted in a previous blog post, PhD student Shupeng Sun met this challenge with a new statistical methodology that won a Best Poster award at the ACM SIGDA PhD Forum at DAC 2014.

The new methodology is called Scaled-Sigma Sampling (SSS). It calculates the failure rate and accounts for variability in the manufacturing process while only requiring a few hundred, or a few thousand, sample circuit blocks. Previously, millions of samples were required for an accurate validation of a new design, and each sample could take minutes or hours to simulate. It could take a few weeks or months to run one validation.

The SSS methodology requires greatly reduced simulation times. It makes it possible, Li noted, to run simulations overnight and see the results in the morning.

Li shared his secret for success in collaborations. “I want to emphasize that before the collaboration, you have to understand the goal. If you don’t have a clear goal, don’t collaborate. Once you define the goal, stick to it and make it happen.”

Contest Provides Learning Experience

Last year Laleh Behjat handed two of her new PhD students a challenge. “I told them there is an ISPD [International Symposium for Physical Design] contest on placement, and I expect you to participate and I expect you to win. Not knowing anything about placement, I don’t think they realized what I was asking them.”

The 2015 contest was called the Blockage-Aware Detailed Routing-Driven Placement Contest. Results were announced at the end of March at ISPD. And the University of Calgary team, despite its lack of placement experience, took second place.

Such contests provide a good learning tool, according to Behjat. Graduate students in EDA, she said, “have to be good programmers. They have to work in teams and be collaborative, be able to innovate, and solve the hardest problems I have seen in engineering and science. And they have to think outside the box.” A contest can bring out all these attributes, she said.

Further, Behjat noted, contest participants had access to benchmarks and to a placement tool. They didn’t have to write tools to find out if their results were good. Industry sponsors, meanwhile, got access to good students and new approaches for solving problems.

“You can see Cadence putting a big amount of time, effort and money to get students here and get them excited about doing contests,” she said. She advised students in the theater audience to “talk to people in the Cadence booth and see if you can have more ideas for collaboration.”

Richard Goering

Related Blog Posts

EDA Plus Academia: A Perfect Game, Set and Match

Cadence Aims to Strengthen Academic Partnerships

BSIM-CMG FinFET Model – How Academia and Industry Empowered the Next Transistor

In 1985, as a relatively new editor at Computer Design magazine, I was asked to go forth and cover a new business called CAE (computer-aided engineering). I knew nothing about it, but I had been writing about design for test, so there seemed to be somewhat of a connection. Little did I know that “CAE” would turn into “EDA” and that I’d write about it for the next 30 years, for Computer Design, EE Times, Cadence, and a few others.

Now that I’m about to retire, I’m looking back over those 30 years. What a ride it has been! By the numbers I covered 31 Design Automation Conferences (DACs), hundreds of new products, dozens of acquisitions and startups, dozens of lawsuits, and some blind alleys that didn’t work out (like “silicon compilation”). Chip design went from gate arrays and PLDs with a few thousand gates to processors and SoCs with billions of transistors.

In 1985 there were three big CAE vendors – Daisy Systems, Mentor Graphics, and Valid Logic. All sold bundled packages that included workstations and CAE software; in fact, Daisy and Valid designed and manufactured their own workstations. In the early 1980s a workstation with schematic capture and gate-level logic simulation might have set you back $120,000. In 1985 OrCAD, now part of Cadence, came out with a $500 schematic capture package running on IBM PCs.

Cadence and Synopsys emerged in the late 1980s, and by the 1990s the EDA industry was pretty much a software-only business (apart from specialized machines like simulation accelerators). Since the early 1990s the “big three” EDA vendors have been Cadence, Synopsys, and Mentor, giving the industry stability but allowing for competition and innovation.

Here, in my view, are some of the highlights that occurred during the past 30 years of EDA.

EDA is a Highlight

The biggest highlight in EDA is the existence of a commercial EDA industry! Marching hand in hand with the fabless semiconductor revolution, commercial EDA made it possible for hundreds of companies to design semiconductors, as opposed to a small handful that could afford large internal CAD operations and fabs. With hundreds of semiconductor companies as opposed to a half-dozen, there’s a lot more creativity, and you get the level of sophistication and intelligence that you see in your smartphone, video camera, tablet, gaming console, and car today.

CAE + CAD = EDA. This is not just a terminology issue. By the mid-1980s it became clear that front-end design (CAE) and physical design (CAD) belonged together. The big CAE vendors got involved in IC and PCB CAD, and presented increasingly integrated solutions. People got tired of writing “CAE/CAD” and “EDA” was born.

The move from gate-level design to RTL. This move happened around 1990, and in my view this is EDA’s primary technology success story during the past 30 years. Moving up in abstraction made the design and verification of much larger chips possible. Going from gate-level schematics to a hardware description language (HDL) revolutionized logic design and verification. Which would you rather do – draw all the gates that form an adder, or write a few lines of code and let a synthesis tool find an adder in your chosen technology?

Two developments made this shift in design possible. One was the emergence of commercial RTL synthesis (or “logic synthesis”) tools from Synopsys and other companies, which happened around 1990. Another was the availability of Verilog, developed by Gateway Design Automation and purchased by Cadence in 1989, as a standard RTL HDL. Although most EDA vendors at the time were pushing VHDL, designers wanted Verilog and that’s what most still use (with SystemVerilog coming on strong in the verification space).

IC functional verification underwent huge changes in the late 1990s and early 2000s, largely due to new technology developed by Verisity, which was acquired by Cadence in 2005. Before Verisity, verification engineers were writing and running directed tests in an ad-hoc manner. Verisity introduced or improved technologies such as pseudo-random test generation, coverage metrics, reusable verification IP, and semi-automated verification planning. The Verisity “e” language became a widely used hardware verification language (HVL).

The biggest way that EDA has expanded its focus has been through semiconductor IP. Today Synopsys and Cadence are leading providers in this area. Thanks to the availability of design and verification IP, many SoC designs today reuse as much as 80% of previous content. This makes it much, much faster to design the remaining portion. While IP began with fairly simple elements, today commercially available IP can include whole subsystems along with the software that runs on them. With IP, EDA vendors are providing not only design tools but design content.

Finally, the EDA industry has done an amazing job of keeping up with SoC complexity and with advanced process nodes. Thanks to intense and early collaboration between foundries, IP, and EDA providers, tools and IP have been ready for process nodes going down to 10nm.

Where Does ESL Fit?

In some ways, electronic system level (ESL) design is both a lowlight and a highlight. It’s a lowlight because people have been talking about it for 30 years and the acceptance and adoption have come very slowly. ESL is a highlight because it’s finally starting to happen, and its impact on design and verification flows could be dramatic. Still, ESL is vaguely defined and can be used to describe almost anything that happens at a higher abstraction level than RTL.

High-level synthesis (HLS) is an ESL technology that is seeing increasing use in production environments. Current HLS tools are not restricted to datapaths, and they produce RTL code that gives better quality of results than hand-written RTL. Another ESL methodology that’s catching on is virtual prototyping, which lets software developers write software pre-silicon using SystemC models. Both HLS and virtual prototyping are made possible by the standardization of SystemC and transaction-level modeling (TLM). However, it’s still not easy to use the same SystemC code for HLS and virtual prototyping.

And Now, Some Lowlights

Every new industry has some twists and turns, and EDA is no exception. For example, the EDA industry in the 1980s and 1990s sparked a lot of lawsuits. At EE Times my colleagues and I wrote a number of articles about EDA legal disputes, mostly about intellectual property, trade secrets, or patent issues. Over the past decade, fortunately, there have been far fewer EDA lawsuits than we had before the turn of the century.

Another issue that was troublesome in the 1980s and 1990s was so-called “standards wars.” These would occur as EDA vendors picked one side or the other in a standards dispute. For example, power intent formats were a point of conflict in the early 2000s, but the Common Power Format (CPF) and the Unified Power Format (UPF) are on the road to convergence today with the IEEE 1801 effort. As mentioned previously, Verilog and VHDL were competing for adoption in the early 1990s. For the most part, Verilog won, showing that the designer community makes the final decision about which standards will be used.

How on earth did there get to be something like 30 DFM (design for manufacturability) companies 10-12 years ago? To my knowledge, none of these companies are around today. A few were acquired, but most simply faded away. A lot of investors lost money. Today, VCs and angel investors are funding very few EDA or IP startups. There are fewer EDA startups than there used to be, and that’s too bad, because that’s where a lot of the innovation comes from.

Here’s another current lowlight -- not enough bright engineering or computer science students are joining EDA companies. They’re going to Google, Apple, Facebook, and the like. EDA is perceived as a mature industry that is still technically very difficult. We need to bring some excitement back into EDA.

Where Is EDA Headed?

Now we come to what you might call “headlights” and look at what’s coming. My list includes:

• System Design Enablement. This term has been coined by Cadence to describe a focus on whole systems or end products including chips, packages, boards, embedded software, and mechanical components. There are far more systems companies than semiconductor companies, leaving a large untapped market that’s looking for solutions.
• New frontiers for EDA. At a 2015 Design Automation Conference speech, analyst Gary Smith suggested that EDA can move into markets such as embedded software, mechanical CAD, biomedical, optics, and more.
• Vertical markets. EDA has until now been “horizontal,” providing the same solution for all market segments. Going forward, markets like consumer, automotive, and industrial will have differing needs and will need optimized tools and IP.
• Internet of Things. This is a current buzzword, but the impact on EDA remains uncertain. Many IoT devices will be heavily analog, use mature process nodes, and be dirt cheap. Lip-Bu Tan, Cadence CEO, recently pointed out that the silicon percentage of IoT revenue will be small and that a lot of the profits will be on the service side.

Moving On

For the past six years I’ve been writing the Industry Insights blog at Cadence.com. All things change, and with this post comes a farewell – I am retiring in late June and will be pursuing a variety of interests other than EDA. I’ll be watching, though, to see what happens next in this small but vital industry. Thanks for reading!

Richard Goering

Are they basically the same thing? I am trying to get as much experience with Allegro since a lot of jobs I am looking at right now are asking for Cadence Allegro experience (I wish they asked for Altium experience...). I currently have access to PCB Editor, but I don't want to commit to learning Editor if Allegro is completely different. Also walmart one, are the Cadence Allegro courses worth it? I won't be paying for it and if it's worth it, I figure I might as well use the opportunity to say I know how to use two complex CAD tools.

According to the book Electronic Design Automation For Integrated Circuits Handbook there are mutiple algorithms available. Quote from book: "One of the first complete ATPG algorithms is the D-algorithm [9]. Subsequently, other algorithms were proposed, including PODEM [14], FAN [15], and SOCRATES [10]."

I was wondering which algorithms are used in Cadence Modus.

Hi,

When I import the top level Verilog file generated by Genus into Virtuoso, the power pins are left unconnected. I tried different configurations in "Global Net Options" tab. However, nothing changed. 

The cell is imported with three views, namely functional, schematic, and symbol. In www krogerfeedback com functional view everything looks OK, that is the top level Verilog file. In schematic, I can see the digital cells but VDD and VSS pins of the blocks are not connected. In the symbol view there are no pins for VDD and VSS. 

On top, we are trying to implement a digital block into Virtuoso. The technology is TSMC 65nm. On Genus and Innovus, everything goes straight and layout is generated successfully.

Thanks.

Hi,

I am doing layout for a mixed-signal circuit in Innovus. I want to create a digital donut style of layout (i.e. put analog circuit in the middle, and circle analog part with digital circuits).

To do that, I need to place some pins inside the edge to connect to analog circuit (as shown in my attachment), but the problems is that I cannot place pins inside the edge by using "pin editor" within Innovus. Any suggestions to place pins inside?

Thank you so much for your time and effort.

Hi,

Is it possible to use a SystemVerilog package which is compiled into a library and then use it in a VHDL-2008 design file? Is such mixed-language flow supported?

I'm considering the latest versions of Incisive / Xcelium available today (Oct 2019).

Thank you,

Michal

The following is valid SystemVerilog:

module mmio
#(parameter PORTS=2,
parameter ADDR_WIDTH=30)
(input logic[ADDR_WIDTH-1:0] addr[PORTS],
output logic ben[PORTS], // Bus enable
output logic men[PORTS]); // Memory enable

always_comb begin
for(int i = 0; i < PORTS; i++) begin
ben[i] = addr[i] >= 'h20080004 && addr[i] < 'h200c0000;
men[i] = ~ben[i];
end
end

endmodule : mmio

And if you instantiate it:

mmio #(1, 30) MMIO(.addr('{scalar_addr}),
.ben('{ben}),
.men('{men}));

Genus returns an error: "Could not synthesize non-constant range values. [CDFG-231] [elaborate]" Is this just not possible in Genus or could it be caused by something else?

Happy New Year! Have you tried the new Transmission Line Library (rfTlineLib) yet? In case you missed it, rfTlineLib was introduced in IC 6.1.6 ISR1 plus MMSIM 12.1.1 -or- MMSIM13.1. You may wonder....Why should I use the new rfTlineLib ? Well...(read more)

Hi Folks, A question that I've often received from designers, "Is there a method to determine the amount of memory required before I submit a job? I use distributed processing and need to provide an estimate before submitting jobs." The answer...(read more)

Did you check out the new Pnoise and Hbnoise Choosing Analyses forms in the MMSIM 15.1 and IC6.1.7 /ICADV12.2 releases? These forms have been significantly improved and simplified. The Direct Plot Form has also been enhanced and is much easy to use....(read more)

Inside the scope of isCallable there is code which I don't want to be executed.

The procedure named in isCallable to-day is callable.

I want to make that procedure so it cannot be called.  How do I do that?

I can't change the isCallable line or the scope.  I want to change its behavior by making sure that the procedure does not exist (obviously this would be done before the code is executed).

I have a SKILL script that executes the callback of a menu item, and depends on first redefining an environment variable. 

When a user interrupts the script with ctrl-C, the script cannot finish to set the environment variable back to its default value.

How can I write the script in a way that handles a user interrupt to reset the changed environment variable after the interrupt?

Hi,

I am running simulation in ADEXL and need a custom function for VIVA to apply same procedure to all signals saved in output. For instance, I have clock nets and I want to get all of them and look at the duty-cycle, edge rate etc.

It is a little more involved than about part since I have some regex and setof to filter before processing but if I can get all signals for current history, I can postprocess them later.

In ocean, I am just doing outputs() and getting all saved signals but I was able to do this in VIVA calculator due to the difficulties in getting current history, test name and opening result directory

thanks

yayla

Version Info:

ICADV12.3 64b 500.21

spectre -W =>

Tool 'cadenceMMSIM' Current project version '16.10.479'
sub-version  16.1.0.479.isr9

When I place a pcell and do not change the W parameter (default is used) the value is not saved in the OA cell property.

When I change the default value of the super master now, the old pcell will get the new default value automatically because there is nothing saved inside the OA cell for this parameter.

Do you have any Idea, that how we can save the default values in the OA cell properties so that this value doesn't get updated if the default values are updated in the new PDKs

Hi,

I am trying add multiple choices to my radio field in cdf parameters. when i see the select the instance and try editing the Instance properties I can not view them in a single window. Instead i get a vertical sliding bar. Is there a way to display them in multiple rows?

-Haareeth

It’s been quite a long 5-year journey building and deploying Performance Analysis, Verification, and Debug capabilities for Arm-based SoCs. We worked with some of the smartest engineers on the planet. First with the engineers at Arm, with whom we...(read more)

Here we conclude the blog series and highlight the results of Mediatek 's use of Cadence Perspec™ System Verifier for their SoC level verification. In case you missed it, Part 1 of the blog is here , and Part 2 of the blog is here . One of their key...(read more)

Learn about the challenges and solutions for integrating and verification PCIe(r) Gen4 into an Arm-Based Server SoC. Listen to this relatively short webinar by Arm and Cadence, as they describe the collaboration and results, including methodology and...(read more)

Hi, I want to add values to components in my SiP design such as 1nF or 15nH. There is already in existence a COMP_VALUE property reserved for this as shown during BOM generation. This property is not visible under the Edit/Properties dialog for component or symbol find filters. We have already created user properties called COMP_MFG and COMP_MFG_PN that it editable at a component level. When we try to add COMP_VALUE it is reported as a reserved name in Cadence but this name is not listed in the properties dialog. Is there a way to turn on the visibility and editablility of this or other hidden reserved Cadence property names? How can I assign a string value to the COMP_VALUE property?

Thanks

Hi all,

I have a question regarding the manufacture : how to check a cluster of same net vias spacing, with have no shape or cline covered

Have you ever manufactured a printed circuit board (PCB) without analyzing all the routed signal traces? Most designers will say “yes, all the time.” Trace widths and spacing are set by constraints,...

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In this week’s Whiteboard Wednesdays video, Dave Apte discusses how to create the lowest power design possible by using architectural exploration and Cadence’s Stratus HLS solution....

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I recently attended a webinar presented by Wally Rhines about his new book, Predicting Semiconductor Business Trends After Moore's Law . Wally was the CEO of Mentor, as you probably know. Now he...

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Cadence has a new white paper out on Computational Software . I've written on these topics in Breakfast Bytes, most recently in the posts: Computational Software System Analysis: Computational...

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We have talked about aspects of the in-design symbol edit application mode in the past. This is the environment specific to the Allegro® Package Designer Plus layout tools allowing you to work...

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Have you ever manufactured a printed circuit board (PCB) without analyzing all the routed signal traces? Most designers will say “yes, all the time.” Trace widths and spacing are set by constraints, and many designers simply don’t h...(read more)

All engineers can enhance their mixed-signal low-power structural verification productivity by learning while doing with a PIEA RAK (Power Intent Export Assistant Rapid Adoption Kit). They can verify the mixed-signal chip by a generating macromodel for their analog block automatically, and run it through Conformal Low Power (CLP) to perform a low power structural check.  

The power structure integrity of a mixed-signal, low-power block is verified via Conformal Low Power integrated into the Virtuoso Schematic Editor Power Intent Export Assistant (VSE-PIEA). Here is the flow.

Applying the flow iteratively from lower to higher levels can verify the power structure.

Cadence customers can learn more in a Rapid Adoption Kit (RAK) titled IC 6.1.5 Virtuoso Schematic Editor XL PIEA, Conformal Low Power: Mixed-Signal Low Power Structural Verification.

• To read the overview presentation, click on following link: PIEA Overview
• To download this PIEA RAK click on following link: PIEA RAK Download

The RAK includes Rapid Adoption Kit with demo design (instructions are provided on how to setup the user environment). It Introduces the Power Intent Export Assistant (PIEA) feature that has been implemented in the Virtuoso IC615 release.  The power intent extracted is then verified by calling Conformal Low Power (CLP) inside the Virtuoso environment.

• Last Update: 11/15/2012.
• Validated with IC 6.1.5 and CLP 11.1

The RAK uses a sample test case to go through PIEA + CLP flow as follows:

• Setup for PIEA
• Perform power intent extraction
• CPF Import: It is recommended to Import macro CPF, as oppose to designing CPF for sub-blocks. If you choose to import design CPF files please make sure the design CPF file has power domain information for all the top level boundary ports
• Generate macro CPF and design CPF
• Perform low power verification by running CLP

It is also recommended to go through older RAKs as prerequisites.

• Conformal Low Power, RTL Compiler and Incisive: Low Power Verification for Beginners
• Conformal Low Power: CPF Macro Models
• Conformal Low Power and RTL Compiler: Low Power Verification for Advanced Users

To access all these RAKs, visit our RAK Home Page to access Synthesis, Test and Verification flow

Note: To access above docs, use your Cadence credentials to logon to the Cadence Online Support (COS) web site. Cadence Online Support website https://support.cadence.com/ is your 24/7 partner for getting help and resolving issues related to Cadence software. If you are signed up for e-mail notifications, you can receive new solutions, Application Notes (Technical Papers), Videos, Manuals, and more.

You can send us your feedback by adding a comment below or using the feedback box on Cadence Online Support.

Sumeet Aggarwal

DAC is right around the corner! On the demo floor at Cadence® Booth #2214, we will demonstrate how to use the Cadence mixed-signal and low-power solution to design, verify, and implement a microcontroller-based mixed-signal design. The demo design architecture is very similar to practical designs of many applications like power management ICs, automotive controllers, and the Internet of Things (IoT). Cadene tools demonstrated in this design include Virtuoso® Schematic Editor, Virtuoso Analog Design Environment, Virtuoso AMS Designer, Virtuoso Schematic Model Generator, Virtuoso Power Intent Assistant, Incisive® Enterprise Simulator with DMS option, Virtuoso Digital Implementation, Virtuoso Layout Suite, Encounter® RTL Compiler, Encounter Test, and Conformal Low Power. An extended version of this demo will also be shown at the ARM® Connected Community Pavilion Booth #921.

For additional highlights on Cadence mixed-signal and low-power solutions, stop by our booth for:

• The popular book, Mixed-signal Methodology Guide, which will be on sale during DAC week!
• A sneak preview of the eBook version of the Mixed-signal Methodology Guide
• Customer presentations at the Cadence DAC Theater
  • 9am, Tuesday, June 4  ARM  Low-Power Verification of A15 Hard Macro Using CLP 
  • 10:30am, Tuesday, June 4  Silicon Labs  Power Mode Verification in Mixed-Signal Chip
  • 12:00pm, Tuesday, June 4  IBM  An Interoperable Flow with Unified OA and QRC Technology Files
  • 9am, Wednesday, June 5  Marvell  Low-Power Verification Using CLP
  • 4pm, Wednesday, June 5  Texas Instruments  An Inter-Operable Flow with Unified OA and QRC Technology Files
• Partner presentations at the Cadence DAC Theater
  • 10am, Monday, June 3  X-Fab  Rapid Adoption of Advanced Cadence Design Flows Using X-FAB's AMS Reference Kit
  • 3:30pm, Monday, June 3  TSMC TSMC Custom Reference Flow for 20nm -  Cadence Track
  • 9:30am,Tuesday, June 4  TowerJazz   Substrate Noise Isolation Extraction/Model Using Cadence Analog Flow
  • 12:30pm, Wednesday, June 5  GLOBALFOUNDRIES  20nm/14nm Analog/Mixed-signal Flow
  • 2:30pm, Wednesday, June 5  ARM  Cortex®-M0 and Cortex-M0+: Tiny, Easy, and Energy-efficient Processors for Mixed-signal Applications
• Technology sessions at suites
  • 10am, Monday, June 3    Low-power Verification of Mixed-signal Designs
  • 2pm, Monday, June 3      Advanced Implementation Techniques for Mixed-signal Designs
  • 2pm, Monday, June 3      LP Simulation: Are You Really Done?
  • 4pm, Monday, June 3      Power Format Update: Latest on CPF and IEEE 1801  
  • 11am, Wednesday, June 5   Mixed-signal Verification
  • 11am, Wednesday, June 5   LP Simulation: Are You Really Done?
  • 4pm, Wednesday, June 5   Successful RTL-to-GDSII Low-Power Design (FULL)
  • 5pm, Wednesday, June 5   Custom/AMS Design at Advanced Nodes

We will also have three presentations at the Si2 booth (#1427):

• 10:30am, Monday, June 3   An Interoperable Implementation Solution for Mixed-signal Design
• 11:30am, Tuesday, June 4   Low-power Verification for Mixed-signal Designs Using CPF
• 10:30am, Wednesday, June 5   System-level Low-power Verification Using Palladium

We have a great program at DAC. Click the link for complete Cadence DAC Theater and Technology Sessions. Look forward to seeing you at DAC!     

Hi,
I am new to the circuit design and troubleshooting. My project is to design a trans-impedance amplifier using Cadence that can amplify a signal coming from a photodiode. I started out with the regulated cascode configuration as shown in the circuit below. I look at the frequency response using AC simulation and it looks like a high pass (/net 5). The results doesn ot show any gain (transient response), or expected low-pass roll-off in the AC response.

First thing, I looked into the operating regions of the MOSFETs and adjusted the input dc voltage of the Vsin to 0.5 to make sure that the T0, T1 mosfets are in saturation(checked this with the print->dc operating points). Beyond this point, I am not sure on how to proceed and interpret the results to make changes. Any help would be greatly appreciated.

Thanks,

-Rakesh.

Virtuoso Version -- IC6.1.7-64b.500.23

Cadence Spectre Version -- 17.10.515

I have a very simple circuit. Please find attached. It is basically a resistor across a port. I run a S-param simulation and can plot the S-params, but unfortunately not the Z-param or Y-param. 

/resized-image/__size/320x240/__key/communityserver-discussions-components-files/33/Capture_5F00_Sch.JPG

/resized-image/__size/320x240/__key/communityserver-discussions-components-files/33/Capture_5F00_Error.JPG

Can anyone point me in the correct direction to sort out this problem? The zpm does work in another design environment, but not in the new design environment (a new project). The virtuoso and the cadence-spectre versions match in both the project environments. I am at a loss at what to look for. 

hello there, i'm a student studying allegro PCB designer.

There are some commands that i can do with GUI, but i want to know what kind of commands i used so that i can route with commands only(ex) skill).

Is there any file that i can see what kind of commands i used something like log files or command history?

thank you for reading this long boring question.

Hello All,

After selecting a cline (using axlSingleSelectBox), may I know how to obtain the dbid of the 'pin' connected to the end of the cline?

Thanks All

Currently I tried this:

axlDBCreateShape(recPolyPlanes t "BOUNDARY/L02" netName sym1)

I get a atom error on car(sym1)

I can do this "static" using ETCH/L02 with out an issue, but I am trying to avoid doing an axlShapeChangeDynamicType().

Thanks,

Jerry

Hello, i am a student who is studying Allegro tool with SKILL.

I have a question about SKILL axlSegDelayAndZ0. The reference says this function "returns the delay and impedance of a cline segment."

I want to know how many components does this tool consider when calculating timing delay from the length. 

How steep is input signal's rise transition? Is rise transition shape isosceles trapezoid or differential increasing shape?

Also, if it is a multi fan-out, the rise transition time will be different net by net. How can this tool can calculate in this case?

I want to hear answers about these questions.

Thank you for reading this long boring questions, and i will be waiting for answers.

Hi,

I wanted to find the location of a pin in the design using skill program. pin_dbids = axlDBGetDesign()->pins, this gives me all the dbids of the pins that are present in my design. But when im entering that dbid, pad = axlDBGetPad("000001EA8FD8B9F8" "package geometry/assembly_top" "regular") it is throwing an error stating "This dbid is not user defined. Please enter the user defined". So please provide me a snippet so that I can get the exact pin location in the design using skill script.