1. Chennai rain: IMD predicts heavy rainfall for Tamil Nadu. Are schools, colleges closed today?  Hindustan Times
2. Chennai rains today: Heavy downpour expected in many Tamil Nadu districts, IMD issues alert. Schools shut today?  Mint
3. Low pressure weakens, but heavy rain in Tamil Nadu may persist  The New Indian Express
4. Tamil Nadu weather: Schools shut in Chennai, IMD puts 17 districts in state on heavy rainfall alert  Business Today
5. Tamil Nadu rains: Schools, colleges closed in several districts amid heavy rain  The Hindu

Google has seemingly launched the Quick Share app for Windows on ARM PCs, something that was not previously available.

The post Google Quick Share now available for Windows on ARM appeared first on Phandroid.

If you’re in the market for a new Android tablet, check out these early Black Friday deals for the Samsung Galaxy Tab S10 series.

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Samsung has an early Black Friday deal for its accessories and wearables, so don’t miss out if you want some savings!

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The headphones come with a rather lightweight design, Sony's integrated V1 processor and noise-cancelling duties.

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The TicWatch Pro 3 Ultra packs some nifty features, in addition to impressive battery endurance.

The post Save up to 50% with the TicWatch Pro 3 Ultra! appeared first on Phandroid.

[State Department] U.S. Ambassador-at-Large to Monitor and Combat Trafficking in Persons Cindy Dyer will travel to Madagascar November 13-16 and South Africa November 17-21.

[GroundUp] The education department says there's only one SETA official assisting all nine provinces

In the rapidly evolving landscape of automotive electronics, traditional monolithic design approaches are giving way to something more flexible and powerful—chiplets. These modular microchips, which are themselves parts of a whole silicon system, offer unparalleled potential for improving system performance, reducing manufacturing costs, and accelerating time-to-market in the automotive sector. However, the transition to working with chiplets in automotive electronics is not without its challenges.

Designers must now grapple with a new set of considerations, such as die-to-die interconnect standards, complex processes, and the integration of diverse IPs. Advanced toolsets and standardized design approaches are required to meet these challenges head-on and elevate the potential of chiplets in automotive innovation. In the following discourse, we will explore in detail the significance of chiplets in the context of automotive electronics, the obstacles designers face when working with this paradigm, and how Cadence comprehensive suite of IPs, tools, and flows is pioneering solutions to streamline the chiplet design process.

Unveiling Chiplets in Automotive Electronics

For automotive electronics, chiplets offer a methodology to modularize complex functionalities, integrate different chiplets into a package, and significantly enhance scalability and manufacturability. By breaking down semiconductor designs into a collection of chiplets, each fulfilling specific functions, automotive manufacturers can mix and match chiplets to rapidly prototype new designs, update existing ones, and specialize for the myriad of use cases found in vehicles today.

The increasing significance of chiplets in automotive electronics comes as a response to several industry-impacting phenomena. The most obvious among these is the physical restriction of Moore's Law, as large die sizes lead to poor yields and escalating production costs. Chiplets with localized process specialization can offer superior functionality at a more digestible cost, maintaining a growth trajectory where monolithic designs cannot. Furthermore, chiplets support the assembly of disparate technologies onto a single subsystem, providing a comprehensive yet adaptive solution to the diverse demands present in modern vehicles, such as central computing units, advanced driver-assistance systems (ADAS), infotainment units, and in-vehicle networks. This chiplet-based approach to functional integration in automotive electronics necessitates intricate design, optimization, and validation strategies across multiple domains.

The Complexity Within Chiplets

Yet, with the promise of chiplets comes a series of intricate design challenges. Chiplets necessitate working across multiple substrates and technologies, rendering the once-familiar 2-dimensional design space into the complex reality of multi-layered, sometimes even three-dimensional domains. The intricacies embedded within this design modality mandate devoting considerable attention to partitioning trade-offs, signal integrity across multiple substrates, thermal behavior of stacked dies, and the emergence of new assembly design kits to complement process design kits (PDKs).

To effectively address these complexities, designers must wield sophisticated tools that facilitate co-design, co-analysis, and the creation of a robust virtual platform for architectural exploration. Standardizations like the Universal Chip Interconnect Express (UCIe) have been influential, providing a die-to-die interconnect foundation for chiplets that is both standardized and automotive-ready. The availability of UCIe PHY and controller IP from Cadence and other leading developers further eases the integration of chiplets in automotive designs.

The Role of Foundries and Packaging in Chiplets

Foundries have also pivoted their services to become a vital part of the chiplet process, providing specialized design kits that cater to the unique requirements of chiplets. In tandem, packaging has morphed from being a mere logistical afterthought to a value-added aspect of chiplets. Organizations now look to packaging to deliver enhanced performance, reduced power consumption, and the integrity required by the diverse range of technologies encompassed in a single chip or package. This shift requires advanced multiscale design and analysis strategies that resonate across a spectrum of design domains.

Tooling Up for Chiplets with Cadence

Cadence exemplifies the rise of comprehensive tooling and workflows to facilitate chiplet-based automotive electronics design. Their integrations address the challenges that chiplet-based SoCs present, ensuring a seamless design process from the initial concept to production. The Cadence suite of tools is tailored to work across design domains, ensuring coherence and efficiency at every step of the chiplet integration process.

For instance, Cadence Virtuoso RF subflows have become critical in navigating radio frequency (RF) challenges within the chiplets, while tools such as the Integrity 3D-IC Platform and the Allegro Advanced Multi-Die Package Design Solution have surfaced to enable comprehensive multi-die package designs. The Integrity Signal Planner extends its capabilities into the chiplet ecosystem, providing a centralized platform where system-wide signal integrity can be proactively managed. Sigrity and Celsius, on the other hand, offer universally applicable solutions that take on the challenges of chiplets in signal integrity and thermal considerations, irrespective of the design domain. Each of these integrated analysis solutions underscores the intricate symphony between technology, design, and packaging essential in unlocking the potential of chiplets for automotive electronics.

Cadence portfolio includes solutions for system analysis, optimization, and signoff to complement these domain-specific tools, ensuring that the challenges of chiplet designs don't halt progress toward innovative automotive electronics. Cadence enables designers to engage in power- and thermal-aware design practices through their toolset, a necessity as automotive systems become increasingly sophisticated and power-efficient.

A Standardized Approach to Success with Chiplets

Cadence’s support for UCIe underscores the criticality of standardized approaches for heterogeneous integration by conforming to UCIe standards, which numerous industry stakeholders back. By co-chairing the UCIe Automotive working group, Cadence ensures that automotive designs have a universal and standardized Die-to-Die (D2D) high-speed interface through which chiplets can intercommunicate, unleashing the true potential of modular design.

Furthermore, Cadence champions the utilization of virtual platforms by providing transaction-level models (TLMs) for their UCIe D2D IP to simulate the interaction between chiplets at a higher level of abstraction. Moreover, individual chiplets can be simulated within a chiplet-based SoC context leveraging virtual platforms. Utilizing UVM or SCE-MI methodologies, TLMs, and virtual platforms serve as first lines of defense in identifying and addressing issues early in the design process before physical silicon even enters the picture.

Navigating With the Right Tools

The road to chiplet-driven automotive electronics is one paved with complexity, but with a commitment to standards, it is a path that promises significant rewards. By leveraging Cadence UCIe Design and Verification IP, tools, and methodologies, automotive designers are empowered to chart a course toward chiplets and help to establish a chiplet ecosystem. With challenges ranging from die-to-die interconnect to standardization, heterogeneous integration, and advanced packaging, the need for a seamless integrated flow and highly automated design approaches has never been more apparent. Companies like Cadence are tackling these challenges, providing the key technology for automotive designers seeking to utilize chiplets for the next-generation E/E architecture of vehicular technology.

In summary, chiplets have the potential to revolutionize the automotive electronics industry, breathing new life into the way vehicles are designed, manufactured, and operated. By understanding the significance of chiplets and addressing the challenges they present, automotive electronics is poised for a paradigm shift—one that combines the art of human ingenuity with the power of modular and scalable microchips to shape a future that is not only efficient but truly intelligent.

Learn more about how Cadence can help to enable automakers and OEMs with various aspects of automotive design.

Hi everyone. 

I'm very a new cadence user. I'm not good at using it and quite lost in finding a way to get the results. With the topic, I would like to ask you for some suggestions to improve my cadence skills.

I have some digital decision logic. Some are combinational logic, some are sequential logic that I would like to import or generate random input combination to the inputs of my decision logic to get the maximum, minimum, and average delay power dissipation and area when feeding the different input combination.

My logic has 8-bit, 16-bit, and 32-bit input. The imported data tends to be decimal numbers.

I would like to ask you:

- which tool(s) are the most appropriate to import and feed the different combination to my decision logic?

- which tool is the most appropriate to synthesis with different number of input? - I have used Genus Synthesis Solution so far. However with my skill right now I can only let Genus synthesize my Verilog code one setup at a time. I'm not sure if I there is anyway I can feed a lot of input at a time and get those results (min, max, average of delay, power dissipation and area)

- which language or scripts I should pick up to use and achieve these results?

-where can I find information to solve my problem? which information shall I look for?

Thank you so much for your time!!

Best Regards

Hi! I've made some 1-point waveform "markers" that I want to overlay in my plots to aid visualization (with the added advantage, w.r.t. normal Viva markers, that they update location automatically upon refreshing simulation data).

For example, the plot below shows an spectrum along with two of these markers, which I create with the function "singlePointWave", and the Assembler output definitions also as shown below.

The problem is: as currently created and defined, Assembler is unable to plot these elements. I can send their expressions to the calculator and plotting works from there, BUT ONLY after first enabling the "Allow Any Units" in the target Viva subwindow.

Thus, I suspect Assembler is failing to plot my markers because they "lack" other information like axes units and so on. How could I add whatever is missing, so that these markers can plot automatically from Assembler?

Thanks in advance for any help!

Jorge.

P.S. I also don't know why, but nothing works without those "ymax()" in the output definitions--I suspect they are somehow converting the arguments to the right data type expected by singlePointWave(). Ideas how to fix that are also welcome! ^^

procedure( singlePointWave(xVal yVal)
    let( (xVect yVect wave)
        xVect = drCreateVec('double list(xVal));
        yVect = drCreateVec('double list(yVal));
        wave = drCreateWaveform(xVect yVect);
    );
);

I want to create sub tree of sub trees how can i do that?

I want to create another tree for the Sub parameter also.

A new Python library has been written to facilitate an interface between Python and AWR software using a command structure that adheres more closely to Python coding conventions. This library is labeled "pyawr-utils" and it is installed using the standard Python pip command. Comprehensive documentation for installing and using pyawr-utils is available.(read more)

When starting a new design, it's important to take the time to consider design recommendations that prevent problems that can arise later in the design cycle. This two-part compilation of guidelines for starting a new design is the result of years of Cadence AWR Design Environment platform Support experience with designs. Pre-design decisions for user interface, simulation, layout, and library configuration lay the groundwork for a successful and efficient AWR design. This blog covers the user interface (UI) and simulation considerations designers should note prior to starting a design.(read more)

Thermal analysis with the Cadence Celsius Thermal Solver integrated within the AWR Microwave Office circuit simulator gives designers an understanding of device operating temperatures related to power dissipation. That temperature information can be introduced into an electrothermal model to predict the impact on RF performance.(read more)

Cadence AWR Design Environment Software Featured in Multiple Training Course Options: Live and Virtual Starting in October(read more)

The Cadence AWR Design Environment V22.1 production release is now available for download at Cadence Downloads with design environment, AWR Microwave Office, AWR VSS, AWR Analyst, and other enhancements.(read more)

AWR V22.1 software introduces the Pointer-Hybrid optimization method which uses a combination of optimization methods, switching back and forth between methods to efficiently find the lowest optimization error function cost. The optimization algorithm automatically determines when to switch to a different optimization method, making this a superior method over manual selection of algorithms. This method is particularly robust in regards to finding the global minima without getting stuck in a local minima well.(read more)

When starting a new design, it's important to take the time to consider design recommendations that prevent problems that can arise later in the design cycle. This two-part compilation of guidelines for starting a new design is the result of years of Cadence AWR Design Environment platform Support experience with designs. Pre-design decisions for user interface, simulation, layout, and library configuration lay the groundwork for a successful and efficient AWR design. This blog, part 2, covers the layout and component library considerations designers should note prior to starting a design.(read more)

Microwave Office is Cadence’s tool-of-choice for RF and microwave designers designing everything from III-V 5G chips, to RF systems in board and package technologies. These types of designs require close interaction between the schematic and its layout. A new Training Byte demonstrates how the schematic-layout connections is built into Microwave Office.(read more)

Data sets are a powerful and easy-to-use feature in Microwave Office. Data can be effortlessly be swapped in graphs, and circuit schematics.(read more)

A training webinar on Microwave Office will be given June 27, 2023. The emphasis will be on EM simulation.(read more)

A recording of a training webinar on Microwave Office is available. Topics show the design environment, with special emphasis placed on electromagnetic (EM) simulation. Normal 0 false false false EN-US JA X-NONE ...(read more)

New online training course for AXIEM EM Simulator in AWR Microwave Office is available.(read more)

Hi,

I have synthesized a verilog code. When performing the pnr in innovus it is showing the error "Instance g5891__718 (similar for other) of the cell AND2_X6 has no physical library or has wrong dimension  values (<=0). Check your design setup to make sure the physical library is loaded in and attribute specified in library are correct.

When importing synthesized netlist in virtuoso then it says " Module AND2_X6, instantiated in the top module decoder, is not defined. Therefore the top module decoder will be imported as functional."

Please help what's going on here? 

Hi Cadence, 

I use simvision 20.09-s007 but my computer screen resolution is very high. As a result, the texts are too small. 

In ~/.simvision/Xdefaults I changed that number to 16, from 12. But the signal names in the waveform traces don't reflect the change. 

Simvision*Font: -adobe-helvetica-medium-r-normal--16-*-*-*-*-*-*-*

Other .font changes seem to reflect on the simvision correctly, except the signal names. 

How do I fix that? I dont mind a single variable to change all the texts fonts to 16. 

Thank you!

PS: I found the answer with another post. I change Preference/Waveform/Display/Signal Height. 

I'm currently trying to explore the verilog simulation option in cadence.

One thing that comes to my mind that if there exists a way in cadence workflow to dump selected register/wire's waveform during the simulation. 

Are there any additional tools needed apart from xcelium, is there a tutorial or specific training course for this aspect. I glance through Xcelium Simulator Course Version 22.09, but it seems not having related context. 

I know in Synopsys's workflow, it can be realized using verdi & fsdb in the command line as follows:

if (inst.CTRL_STATE==STATE_START_TO_DUMP)

$fsdbDumpvars(0, inst_1.reg_0);

end

Thanks in advance!

Hello,

I am trying to load some of the signals of the design saved in the signals.svwf to the waveform windown via the tcl file, I am using the following commands but nothing works, Can you please help 

 -submit waveform loadsignals -using "Waveform 2" FB1.svwf but it gives me the below error

-submit waveform new -reuse -name Waveforms

The OrCAD X and Allegro X 24.1 release is now available at Cadence Downloads. This blog post provides links to access the release and describes some major changes and new features.   OrCAD X /Allegro X 24.1 (SPB241) Here is a representative li...(read more)

In a package design, designers often need to perform degassing. This is typically done at the end of the design process before sending the design to the manufacturer.

Degassing is a process where you perforate power planes, voltage planes, and filled shapes in your design. Degassing holes let the gas escape from beneath the metal during manufacturing of the substrate. The perforations or holes for degassing are generally small, having a specified size and shape, and are spaced regularly across the surface of the plane. If the degassing process is not done, it may result in the formation of gas bubbles under the metal, which may cause the surface of the metal to become uneven. After you degas the design, it is recommended to perform electrical verification.

Allegro X APD has degassing features that allow users to automate the process and place holes in the entire shape.

In today’s topic, we will talk about how to avoid adding  degassing holes on a particular shape.

Sometimes, a designer may need to avoid adding degassing holes to a particular shape on a layer. All other shapes on the layer can have degassing holes but not this shape. Using the Layer Based Degassing Parameters option, the designer can set the degassing parameters for all shapes on the layer. Now, the designer would like to defer adding degassing holes for this particular shape.

You may wonder if there is an easy way to achieve this. We will now see how this can be done with the tool.

Once the degassing parameters are set, performing Display > Element on any of the shapes on that layer will show the degassing parameters set.

You can apply the Degas_Not_Allowed property to a shape to specify that degassing should not be performed on this shape, even if the degassing requirements are met. Select the shape and add the property as shown below.

Switch to Shape Edit application mode (Setup > Application mode > Shape Edit) and window-select all shapes on the layer. Then, right-click and select Deferred Degassing > All Off.

Now, all shapes on the layer will have degassing holes except for the shape which has the Degas_Not_Allowed property attached to it.

Verisium SimAI App harnesses the power of machine learning technology with the Cadence Xcelium Logic Simulator - the ultimate breakthrough in accelerating verification closure. It builds models from regressions run in the Xcelium simulator, enabling the generation of new regressions with specific targets. The Verisium SimAI app also features cousin bug hunting, a unique capability that uses information from difficult-to-hit failures to expose cousin bugs. With these advanced machine learning techniques, Verisium SimAI offers the potential for a significant boost in productivity, promising an exciting future for our users.

Figure 1: Regression compression and coverage maximization with Verisium SimAI 

What can I do with Verisium SimAI?

You can exercise different use cases with Verisium SimAI as per your requirements. For some users, the goal might be regression compression and improving coverage regain. Coverage maximization and hitting new bins could be another goal. Other users may be interested in exposing hard-to-hit failures, bug hunting for difficult to find issues. Verisium SimAI allows users to take on any of these challenges to achieve the desired results.

Let's go into some more details of these use cases and scenarios where using SimAI can have a big positive impact.

1. Using SimAI for Regression Compression and Coverage Regain

Unlock up to 10X compute savings with SimAI!

Verisium SimAI can be used to compress regressions and regain coverage. This flow involves setting up your regression environment for SimAI, running your random regressions with coverage and randomization data followed by training, and finally, synthesizing and running the SimAI-generated compressed regressions. The synthesized regression may prune tests that do not help meet the goal and add more runs for the most relevant tests, as well as add run-specific constraints. This flow can also be used to target specific areas like areas involving a high code churn or high complexity.

You can check out the details of this flow with illustrative examples in the following Rapid Adoption Kits (RAK) available on the Cadence Learning and Support Portal (Cadence customer credentials needed):

• Using SimAI with vManager (For Regression Compression and Coverage Regain) (RAK) 
• Using SimAI with a Generic Runner (For Regression Compression and Coverage Regain) (RAK)

2. Using SimAI for Coverage Maximization and Targeting coverage holes

Reduce your Functional Coverage Holes by up to 40% using SimAI!

Verisium SimAI can be used for iterative coverage maximization. This is most effective when regressions are largely saturated, and SimAI will explicitly try to hit uncovered bins, which may be hard-to-hit (but not impossible) coverage holes. This is achieved using iterative learning technology where with each iteration, SimAI does some exploration and determines how well it performed. This technique can also be used for bug hunting by using holes as targets of interest.

See more details on the Cadence Learning and Support Portal:

• Using SimAI for Coverage Maximization - vManager flow (RAK) 
• Using SimAI for Coverage Maximization - Generic Runner Flow (RAK)

3. Using SimAI for Bug Hunting

Discover and fix bugs faster using SimAI!

Verisium SimAI has a new bug hunting flow which can be used to target the goal of exposing hard-to-hit failure conditions. This is achieved using an iterative framework and by targeting failures or rare bins. The goal to target failures is best exercised when the overall failure rate is typically low (below 5%). Iterative learning can be used to improve the ability to target specific areas. Use the SimAI bug hunting use case to target rare events, low hit coverage bins, and low hit failure signatures.

See more details on the Cadence Learning and Support Portal:

• Using SimAI for Bug Hunting with vManager (RAK) 
• Using SimAI for Bug Hunting – Generic runner flow (RAK) 

Unlock compute savings, reduce your functional coverage holes, and discover and fix bugs faster with the power of machine learning technology now enabled by Verisium SimAI!

Please keep visiting  https://support.cadence.com/raks to download new RAKs as they become available.

Please note that you will need the Cadence customer credentials to log on to the Cadence Online  Support  https://support.cadence.com/, your 24/7 partner for getting help in resolving issues related to Cadence software or learning Cadence tools and technologies.

Happy Learning!

Cadence Protium prototyping platforms rapidly bring up an SoC or system prototype and provide a pre-silicon platform for early software development, SoC verification, system validation, and hardware regressions. In this Training W ebinar, we will explore debugging using Save/Restart on Protium X2 . This feature saves execution time and lets you focus on actual debugging. The system state can be saved before the bug appears and restartS directly from there without spending time in initial execution. We’ll cover key concepts and applications, explore Save/Restart performance metrics, and provide examples to help you understand the concepts. Agenda: The key concepts of debugging using save/restart Capabilities, limitations, and performance metrics Some examples to enable and use save/restart on the Protium X2 system Date and Time Thursday, November 7, 2024 07:00 PST San Jose / 10:00 EST New York / 15:00 GMT London / 16:00 CET Munich / 17:00 IST Jerusalem / 20:30 IST Bangalore / 23:00 CST Beijing REGISTER To register for this webinar, sign in with your Cadence Support account (email ID and password) to log in to the Learning and Support System*. Then select Enrol to register for the session. Once registered, you’ll receive a confirmation email containing all login details. A quick reminder: If you haven’t received a registration confirmation within 1 hour of registering, please check your spam folder and ensure your pop-up blockers are off and cookies are enabled. For issues with registration or other inquiries, reach out to eur_training_webinars@cadence.com . Want to See More Webinars? You can find recordings of all past webinars here Like This Topic? Take this opportunity and register for the free online course related to this webinar topic: Protium Introduction Training The course includes slides with audio and downloadable lab exercises designed to emphasize the topics covered in the lecture. There is also a Digital Badge available for the training. Want to share this and other great Cadence learning opportunities with someone else? Tell them to subscribe . Hungry for Training? Choose the Cadence Training Menu that’s right for you. To view our complete training offerings, visit the Cadence Training website . Related Courses Protium Introduction Training Course | Cadence Palladium Introduction Training Course | Cadence Related Blogs Training Insights – A New Free Online Course on the Protium System for Beginner and Advanced Users Training Insights – Palladium Emulation Course for Beginner and Advanced Users Related Training Bytes Protium Flow Steps for Running Design on Protium System ICE and IXCOM mode comparison ICE compile flow IXCOM compile flow PATH settings for using Protium System Please see the course learning maps for a visual representation of courses and course relationships. Regional course catalogs may be viewed here

The Sigrity and Systems Analysis (SIGRITY/SYSANLS) 2024.1 release is now available for download at Cadence Downloads . For the list of CCRs fixed in this release, see the README.txt file in the installation hierarchy. SIGRITY/SYSANLS 2024.1 Here is a list of some of the key updates in the SIGRITY/SYSANLS 2024.1 release: For more details about these and all the other new and enhanced features introduced in this release , refer to the following document: Sigrity Release Overview and Common Tools What's New . Supported Platforms and Operating Systems Platform and Architecture X86_64 (lnx86) Windows (64 bit) Development OS RHEL 8.4 Windows Server 2022 Supported OS RHEL 8.4 and above RHEL 9 SLES 15 (SP3 and above) Windows 10 Windows 11 Windows Server 2019 Windows Server 2022 Systems Analysis 2024.1 Clarity 3D Solver Clarity 3D Layout Structure Optimization Workflow : A new workflow, Clarity 3D Layout Structure Optimization Workflow, has been added to Clarity 3D Layout. This workflow integrates Allegro PCB Designer with Clarity 3D Layout for high-speed structure optimization. Component Geometry Model Editor : The new Clarity 3D Layout editor lets you set up ports, solder bumps/balls/extrusions, and two-terminal and multi-terminal circuits using a single GUI. Coaxial Open Port Option Added to Port Setup Wizard : The Coaxial Open Port option lets you create ports for each target net pin and reference net pin in Clarity 3D Layout. The nearby reference net pins are then used as a reference for each target net pin, reducing the number of ports needed. In addition, the ports of unused reference net pins are shorted to the ground. Parametric Import Option Added : Two new options, Parametric Import and Default Import , have been added to the Tools – Launch Clarity3DWorkbench menu. The Parametric Import option lets you import the design along with its parameters into Clarity 3D Workbench. The Default Import option lets you ignore the parameters when importing the design into Clarity 3D Workbench. Component Library Added to Generate 3D Components : Clarity 3D Workbench now includes a new component library that lets you use predefined 3D component templates or add existing 3D components to create 3D designs and simulation models. AI-Powered Content Search Capability : Clarity 3D Workbench and Clarity 3D Transient Solver now support an AI-powered capability for searching the content and displaying relevant information. Expression Parser to Handle Undefined Parameters : Clarity 3D Workbench and Clarity 3D Transient Solver support writing expressions or equations containing undefined parameters in the Property window to describe a simulation variable. The improved expression parser automatically detects any undefined parameter in an expression and prompts users to specify their values. This capability lets you define a model or a simulation variable as a function instead of specifying static values. For detailed information, refer to Clarity 3D Layout User Guide and Clarity 3D Workbench User Guide on the Cadence Support portal. Clarity 3D Transient Solver Mesh Processing Improved to Simulate Large Use Cases : Clarity 3D Transient Solver leverages a new meshing algorithm that enhances overall mesh processing, specifically for large designs and use cases. The new algorithm dramatically improves the mesh quality, minimum mesh size, number of mesh key points, total mesh number, and memory usage. Advanced Material Processing Engine : The material processing capability has been enhanced to handle thin outer metal, which previously resulted in open and short issues in some designs. In addition, the material processing engine offers improved mode extraction for particular use cases, including waveguide and coaxial designs. Characteristic Impedance Calculation Improved : The solver engine now uses a new analytical calculation method to calculate the characteristic impedance of coaxial designs with improved accuracy. For detailed information, refer to Clarity 3D Transient Solver User Guide on the Cadence Support portal. Celsius Studio Celsius Interchange Model Introduced : Celsius Studio now supports Celsius Interchange Model generation, which is a 3D model derived from detailed physical designs for multi-physics and multi-scale analysis. This Celsius Interchange Model file ( .cim ) serves as a design information carrier across Celsius Studio tools, enabling a variety of simulation and analysis tasks . Celsius 3DIC Thermal Workflow Improvements : The Thermal Simulation workflows in Celsius 3DIC have been significantly enhanced. Key improvements include: Advanced Power Setup with Transient Power Function and Multi Mode options Enhanced GUI for the Mesh Control and Simulation Control tabs Improved meshing capabilities Celsius Interchange Model ( .cim ) generation Material library support for block and connections Import of Heat Transfer Coefficients (HTCs) from a CFD file Bump creation through the Bump Array Wizard Layer Stackup CSV file generation Celsius 3DIC Warpage and Stress Workflow Enhancements : The Warpage and Stress workflow in Celsius 3DIC has undergone significant improvements, such as: Improved multi-stage warpage simulation flow for 3DIC packaging process Enhanced GUI for the Mesh Control , Simulation Control , and Stress Boundary Conditions tabs Support for large deformations and temperature profiles Bump creation through the Bump Array Wizard New constraint types Enhanced meshing capabilities Geometric Nonlinearity Support in Warpage and Stress Analysis : Large deformation analysis is now supported in warpage and stress studies. This study uses the Total Lagrangian approach to model geometric nonlinearities in simulation, which allows accurate prediction of final deformations. Thermal Network Extraction and Simulation : In the solid extraction flow in Celsius 3D Workbench, you can now import area-based power map files to create terminals. For designs with multiple blocks, this capability allows automatic terminal creation, eliminating the need to manually create and set up 2D sheets individually. Additionally, thermal throttling feature is now supported in Celsius Thermal Network. This makes it ideal for preliminary analyses or when a quick estimation is required. It runs significantly faster than 3D models, allowing for quicker iterations and more efficient decision-making. For detailed information, refer to the Celsius 3DIC User Guide , Celsius Layout User Guide and Celsius 3D Workbench User Guide on the Cadence Support portal. Sigrity 2024.1 Layout Workbench Improved Graphical User Interface : A new option, Use Improved User Interface , has been added in the Themes page of the Options dialog box in the Layout Workbench GUI. In the new GUI, the toolbar icons and menu options have been enhanced and rearranged. For detailed information, refer to Layout Workbench User Guide on the Cadence Support portal. Broadband SPICE Python Script Integration with Command Line for Simulation Tasks : Broadband SPICE lets you run Python scripts directly from the command line for performing simulation and analysis. The new -py and *.py options make it easier to integrate Python scripts with the command-line operations. This update streamlines the process of automating and customizing simulations from the command line, which makes your simulation tasks faster and easier. For detailed information, refer to Broadband SPICE User Guide on the Cadence Support portal. Celsius PowerDC Block Power Assignment (BPA) File Format Support : PowerDC now supports the BPA file format. Similar to the Pin Location (PLOC) file, the BPA file is a current assignment file that defines the total current of a power grid cell, which is then equally distributed across the power pins within the cell. This provides better control over the power distribution. Ability to Run Multiple IR Drop Cases Sequentially : You can now select multiple result sinks from the Current-Limited IR Drop flow and run IR Drop analysis for them sequentially. PowerDC automatically runs the simulations in sequence after you select multiple result sinks. This saves time by automating the process. Enhanced Support for Mixed Conversion Devices : PowerDC now supports mixing different conversion devices, such as switching regulators and linear regulators within a single DC-DC/LDO instance. This enhancement offers added flexibility by letting you configure each instance in your design according to your specific needs. For detailed information, refer to PowerDC User Guide on the Cadence Support portal. PowerSI Monte Carlo Method Added : A new option, Monte Carlo Method, has been added in the Optimality dialog box. This option lets you create multiple random samples to depict variations in the input parameters and assess the output. Channel Check Optimization Added : The S-Parameter Assessment workflow in PowerSI now supports Channel Check Optimization . It uses the AI-driven Multidisciplinary Analysis and Optimization (MDAO) technology that lets you optimize your design quickly and efficiently with no accuracy loss. For detailed information, refer to PowerSI User Guide on the Cadence Support portal. SPEEDEM Multi-threaded Matrix Solver Support Added : The Enable Multi-threaded Matrix Solver check box has been added that lets you accelerate the simulation speed for high-performance computing. This check box provides two options, Automatic and Always, to include the -lhpc4 or -lhpc5 parameter, respectively, in the SPEEDEM Simulator (SPDSIM) before running the simulation. For detailed information, refer to the SPEEDEM User Guide on the Cadence Support portal. XtractIM Options to Skip or Calculate Special DC-R Simulation Results : The Skip DC_R of Each Path and Only DC_R of Each Path options have been added to the Setup menu. Skip DC_R of Each Path : This option lets you skip the calculation of the DC-R result during the simulation. Other results, such as SPICE T-model , RL_C of Each Path , Coupling of Each Path , etc., are still calculated. Only DC_R of Each Path : This option lets you calculate the DC-R result only during the simulation. Other results, such as SPICE T-model , RL_C of Each Path , Coupling of Each Path , etc., are not calculated. Color Assignment for Pin Matching : The MCP Auto Connection window includes the Display Color Editor , which lets you assign a color for pin matching. It helps you easily identify the matching pins in the left and right sections of the MCP Auto Connection window . Ability to Save Simulations Individually : The Save each simulation individually check box has been added to the Tools - Options - Edit Options - Simulation (Basic) - General form. Select this check box and run the simulation to generate a simulation results folder containing files and logs with a timestamp for each simulation. Reuse of SPD File Settings : The XtractIM setup check box lets you import an existing package setup to reuse the configurations and settings from one .spd file to another. For detailed information, refer to XtractIM User Guide on the Cadence Support portal. Documentation Enhancements Cloud-Based Help System Upgraded The cloud-based help system, Doc Assistant, has been upgraded to version 24.10, which contains several new features and enhancements over the previous 2.03 version. Sigrity Release Team Please send your questions and feedback to sigrity_rmt@cadence.com .

hi,

     I save the waveform file of the oscilloscope as CSV file format.

     Now, I need to use this waveform file as the source of the low-pass filter .

     I searched and read the PSPICE help documents, and did not find any  methods. 

     How to realize it?

     Are there any reference documents or examples?

     Thanks!

When the Arduino Mega2560 is added to the first serial port, the dynamic memory is 2000 bytes, and when the second serial serial is added, the dynamic memory is 4000 bytes. Now I need to add the third Serial serial port. The dynamic memory is 6000 bytes. Due to the many variables in the program itself, the dynamic memory is not enough. Please help me how to save the dynamic memory?

Hello,

I am new in formal verification and I have a concept question about how to verify an I2C Slave block.

I think the response should be valid for any serial interface which needs to receive information for several clocks before making an action.

The the protocol description is the following: 

I have a serial clock (SCL), Serial Data Input (SDI) and Serial Data Output (SDO), all are ports of the I2C Slave block.

The protocol looks like this:

The first byte which is received by the slave consists in 7bits of sensor address and the 8th bit is the command 0/1 Write/Read.

After the first 8 bits, the slave sends an ACK (SDO = 1 for 1 clock) if the sensor address is correct.

Lets consider only this case, where I want to verify that the slave responds with an ACK if the sensor address is correct.

The only solution I found so far was to use the internal buffer from the block which saves the received bits during 8 clocks. The signal is called shift_s.

I also needed to use internal chip state (state_s) and an internal counter (shift_count_s).

Instead of doing an direct check of the SDO(sdo_o) depending on SDI (sdi_d_i), I used the internal shift_s register.

My question is if my approach is the correct one or there is a possibility to write the verification at a blackbox level.

Below you have the 2 properties: first checks connection from SDI to internal buffer, the second checks the connection between internal buffer and output.

property prop_i2c_sdi_store;
  @(posedge sclk_n_i)
  $past(i2c_bl.state_s == `STATE_RECEIVE_I2C_ADDR)
    |-> i2c_bl.shift_s == byte'({ $past(i2c_bl.shift_s), $past(sdi_d_i)});
endproperty
APF_I2C_CHECK_SDI_STORE: assert property(prop_i2c_sdi_store);

property prop_i2c_sensor_addr(sens_addr_sel, sens_addr);
@(posedge sclk_n_i) (i2c_bl.state_s == `STATE_RECEIVE_I2C_ADDR) && (i2c_addr_i == sens_addr_sel) && (i2c_bl.shift_count_s == 7)
  ##1 (i2c_bl.shift_s inside {sens_addr, sens_addr+1}) |-> sdo_o;
endproperty
APF_I2C_CHECK_SENSOR_ADDR0: assert property(prop_i2c_sensor_addr(0, `I2C_SENSOR_ADDRESS_A0));
APF_I2C_CHECK_SENSOR_ADDR1: assert property(prop_i2c_sensor_addr(1, `I2C_SENSOR_ADDRESS_A1));
APF_I2C_CHECK_SENSOR_ADDR2: assert property(prop_i2c_sensor_addr(2, `I2C_SENSOR_ADDRESS_A2));
APF_I2C_CHECK_SENSOR_ADDR3: assert property(prop_i2c_sensor_addr(3, `I2C_SENSOR_ADDRESS_A3));

PS: i2c_addr_i is address selection for the slave (there are 4 configurable sensor addresses, but this is not important for the case).

Thank you!

Hi, all.

When I use vavlog to compile verilog rtl, it will recognize IO width mismatch problem as a fatal error.

How to turn the error into warning?

VCS can use -error=noIOPCWM to ingore the error.

Is vavlog has similar arguments?

This is the 24th installment of The Rationalist, my column for the Times of India.

Back in the last decade, I was a cricket journalist for a few years. Then, around 12 years ago, I quit. I was jaded as hell. Every game seemed like déjà vu, nothing new, just another round on the treadmill. Although I would remember her fondly, I thought me and cricket were done.

And then I fell in love again. Cricket has changed in the last few years in glorious ways. There have been new ways of thinking about the game. There have been new ways of playing the game. Every season, new kinds of drama form, new nuances spring up into sight. This is true even of what had once seemed the dullest form of the game, one-day cricket. We are entering into a brave new world, and the team leading us there is England. No matter what happens in the World Cup final today – a single game involves a huge amount of luck – this England side are extraordinary. They are the bridge between eras, leading us into a Golden Age of Cricket.

I know that sounds hyperbolic, so let me stun you further by saying that I give the IPL credit for this. And now, having woken up you up with such a jolt on this lovely Sunday morning, let me explain.

Twenty20 cricket changed the game in two fundamental ways. Both ended up changing one-day cricket. The first was strategy.

When the first T20 games took place, teams applied an ODI template to innings-building: pinch-hit, build, slog. But this was not an optimal approach. In ODIs, teams have 11 players over 50 overs. In T20s, they have 11 players over 20 overs. The equation between resources and constraints is different. This means that the cost of a wicket goes down, and the cost of a dot ball goes up. Critically, it means that the value of aggression rises. A team need not follow the ODI template. In some instances, attacking for all 20 overs – or as I call it, ‘frontloading’ – may be optimal.

West Indies won the T20 World Cup in 2016 by doing just this, and England played similarly. And some sides began to realise was that they had been underestimating the value of aggression in one-day cricket as well.

The second fundamental way in which T20 cricket changed cricket was in terms of skills. The IPL and other leagues brought big money into the game. This changed incentives for budding cricketers. Relatively few people break into Test or ODI cricket, and play for their countries. A much wider pool can aspire to play T20 cricket – which also provides much more money. So it makes sense to spend the hundreds of hours you are in the nets honing T20 skills rather than Test match skills. Go to any nets practice, and you will find many more kids practising innovative aggressive strokes than playing the forward defensive.

As a result, batsmen today have a wider array of attacking strokes than earlier generations. Because every run counts more in T20 cricket, the standard of fielding has also shot up. And bowlers have also reacted to this by expanding their arsenal of tricks. Everyone has had to lift their game.

In one-day cricket, thus, two things have happened. One, there is better strategic understanding about the value of aggression. Two, batsmen are better equipped to act on the aggressive imperative. The game has continued to evolve.

Bowlers have reacted to this with greater aggression on their part, and this ongoing dialogue has been fascinating. The cricket writer Gideon Haigh once told me on my podcast that the 2015 World Cup featured a battle between T20 batting and Test match bowling.

This England team is the high watermark so far. Their aggression does not come from slogging. They bat with a combination of intent and skills that allows them to coast at 6-an-over, without needing to take too many risks. In normal conditions, thus, they can coast to 300 – any hitting they do beyond that is the bonus that takes them to 350 or 400. It’s a whole new level, illustrated by the fact that at one point a few days ago, they had seven consecutive scores of 300 to their name. Look at their scores over the last few years, in fact, and it is clear that this is the greatest batting side in the history of one-day cricket – by a margin.

There have been stumbles in this World Cup, but in the bigger picture, those are outliers. If England have a bad day in the final and New Zealand play their A-game, England might even lose today. But if Captain Morgan’s men play their A-game, they will coast to victory. New Zealand does not have those gears. No other team in the world does – for now.

But one day, they will all have to learn to play like this.

The India Uncut Blog © 2010 Amit Varma. All rights reserved.
Follow me on Twitter.

Virtuoso Studio IC23.1 ISR7 production release is now available for download.(read more)

Virtuoso Studio IC23.1 ISR8 production release is now available for download.(read more)

Virtuoso Studio IC23.1 ISR9 production release is now available for download.(read more)

The SPECTRE 24.1 release is now available for download at Cadence Downloads. For information on supported platforms and other release compatibility information, see the README.txt file in the installation hierarchy.(read more)

Virtuoso Studio IC23.1 ISR10 production release is now available for download.(read more)

Hello Everybody

Recently, I want to design a high output Power Amplifier at 2.4GHz using TSMC 1P6M CMOS Bulk Process. I use its nmos_rf_25_6t transistor model to determine the approximate mosfet size

I use the most common Common-Source Differential Amplifier topology with neutralizing capacitor to improve its stability and power gain performance

Because I want to output large power, the size of mosfet is very large, the gate width is about 2mm, when I perform harmonic balance analysis, everything is alright, the OP1dB is about 28dBm (0.63Watt)

But When I perform Transient simulation, the magnitude of voltage and current waveform at the saturation point is too small, for voltgae, Vpeaking is about 50mV, for current, Ipeaking is about 5mA

I assume some reasons: the bsim4 model is not complete/ the virtuoso version is wrong (My virtuoso version is IC6.1.7-64b.500.21)/the spectre version is wrong (spectre version is 15.1.0 32bit)/the MMSIM version is wrong/Transient Simulation setting is wrong (the algorithm is select gear2only, but when I select other, like: trap, the results have no difference), the maxstep I set 5ps, minstep I set 2ps to improve simulation speed, I think this step is much smaller than the fundamental period (1/2.4e9≈416ps)

I have no idea how to solve this problem, please help me! Thank you very very much!

Hi,

Do anyone know if it's possible in simvision waveform viewer to see a timestamp of where uvm_errors/$errors occurred in a simulation via post-processing? 

Cheers,

Antonio

I'm trying to use Jasper for checking parameter propagation in a large design. I have a list of top-level parameters, each with a HDL path of a module parameter somewhere lower in the hierarchy that's supposed to receive its value from the top-level module. The FPV app seems like an excellent tool for this, but elaborating the entire design in it is extremely time-consuming and memory-intensive. So, I'm trying to black-box everything but the interesting HDL paths. I thought using `elaborate -top dut_module_name -bbox_i * -no_bbox_i inst_foo -no_bbox_i inst_bar (...)` would work, but it doesn't. Jasper just starts flooding the log with warnings from modules that are definitely not on the whitebox list, and eventually dies due to insufficient memory. When I use -bbox_m * it correctly elaborates the top-level module with all of its sub-modules black-boxed. But then the -no_bbox_i switches have no effect. Could anyone suggest a working solution for this use case?

Hello,

I am aware of command script .svcf file that saves signals and loads them in while opening Simvision.

I am wondering, if there is a way for saving signals while we are in an interactive session and loading them next time when we open Simvision interactively.

Any ideas on how to do this?

Thank you in advance.

Swetha. C

When analyzing multiple sessions simultaneously Verisium Manager crashed and reported below error messages:

# A fatal error has been detected by the Java Runtime Environment:
#
#  SIGSEGV (0xb) at pc=0x00007efc52861b74, pid=14182, tid=18380
#
# JRE version: OpenJDK Runtime Environment Temurin-17.0.3+7 (17.0.3+7) (build 17.0.3+7)
# Java VM: OpenJDK 64-Bit Server VM Temurin-17.0.3+7 (17.0.3+7, mixed mode, sharing, tiered, compressed oops, compressed class ptrs, g1 gc, linux-amd64)
# Problematic frame:
# C  [libucis.so+0x238b74]

......

For more details please refer to the attached log file "hs_err_pid21143.log".

Two approaches were tried to solve this problem but neither has worked.
Method.1:

Setting larger heap size of Java process by "-memlimit" options.For example "vmanager -memlimit 8G".

Method.2:

Enlarging stack memory size limit of the Coverage engine by setting "IMC_NATIVE_STACKSIZE" environment variable to a larger value. For example "setenv IMC_NATIVE_STACKSIZE 1024000"

According to "hs_err_pid*.log" it is almost certain that the memory overflow triggered Java's CrashOnOutOfMemoryError and caused Verisium Manager to crash. There are some arguments about memory management of Java like "Xms, Xmx, ThreadStackSize, Xss5048k etc" and maybe this problem can be fixed by setting these arguments during analysis. However, how exactly does Verisium Manager specify these arguments during analysis? I tried to set them by the form of setting environment variables before analysis but it didn't work in analysis and their values didn't change.

Is there something wrong with my operation or is there a better solution?

Thank you very much.

I'm working on the code coverage. Doing a metrics analysis by default we see overall average grade and overall covered. But when i do a block analysis on an instance i see overall covered grade, code covered grade, block covered grade, statement covered grade, expression covered grade, toggle covered grade.

As I dont know the difference I started to read the IMC user guide and came to know there are 3 things we come across while doing a code coverage local, covered, average

From my understanding

local - child instances metrics doesnt reach the parent level. For example, we have an instance Q and its sub instances like Q.a, Q.b. Block Local grade of Q can be 100% even when its instances Q.a and Q.b a block local grades isnt at 100%.

In the attached image there is formula 

The key difference between average and covered is the weights.

Average : Mathematically taking the above scenario where Q.a, and Q.b has 10 blocks each. Q.a has covered 8 blocks and q.b has covered 2 blocks. Now if we take the normal average it should be total covered/ totatl number = 8+2/10+10 yielding 50%. But when we add weights saying Q.a is 70% and Q.b is 30% the new number would be (8*0.7+2*0.3) / (10*0.7+10*0.3) resulting 62%. Because of the weights we see 12% bump.

Covered: there is no role of weights.

Among these 3 metrics i've changed my default view to this in the image to get more realistic picture when i do analyze metrics. Do you guys agree with the approach?