By celebrating Children's Day as Bal Diwas, India reinforced the cultural and emotional significance of the day, making it a uniquely Indian celebration rooted in national pride and values.

[Premium Times] In September, Tyla made headlines at the MTV Video Music Awards (VMAs) for winning the "Best Afrobeats," but she stirred debate by clarifying that she identified with the Amapiano genre rather than Afrobeats

[Parliament of South Africa] Parliament, Tuesday, 12 November 2024 - The National Assembly (NA) will hold a plenary session scheduled to start at 10:00. Among the items on the agenda from 10:00 to 13:00 is the statement by the Minister of Water and Sanitation on water security in the country and a debate on 16 Days of Activism for no violence against women and children. The debate will be held under the theme, "Marking 30 years of democratic rights for women and fostering national unity to end gender-based violence".

Hi,

Is there any way to instruct the tool to reduce the low metals effort and route more on top layers? 

Hi all,

I have off grid violations on M2 layer. I have tried ecoRoute -fix_drc and deleting violations and rerouting. But the tool is still placing these routes off grid. The on grid option in nanoroute is turned on. Since there is a fat metal closer to these routes, the tool is honouring the drc and not placing the metals on track. How do I ignore drc while routing? Also if there is any other way I can fix it, please let me know 

I have a standard cell library containing LEF, GDS, and spice models but no OA views. I'm unable to import these files into Virtuoso without a LayerMap file. How can I obtain or generate this required LayerMap file?

I'm trying to write a generic piece of code that will return the layermap file location, with file name, for a variety of projects (which could potential have different layermap file naming conventions. The below code is what I've used to date, but this assumes the file name is xxxx.layermap. I can obviously do some string matching to find it, assuming the various files all contain some common characters. I thought I'd ask if there is a simpler way to find it, I know that this information is automatically loaded into the Xstream out gui, so maybe I can use the same approach to find it.

techLibName=techGetTechFile(cv)~>libName

techLibLayerMap=strcat(ddGetObj(techLibName)~>readPath "/" techLibName ".layermap")

Hi everyone. 

I'm very a new cadence user. I'm not good at using it and quite lost in finding a way to get the results. With the topic, I would like to ask you for some suggestions to improve my cadence skills.

I have some digital decision logic. Some are combinational logic, some are sequential logic that I would like to import or generate random input combination to the inputs of my decision logic to get the maximum, minimum, and average delay power dissipation and area when feeding the different input combination.

My logic has 8-bit, 16-bit, and 32-bit input. The imported data tends to be decimal numbers.

I would like to ask you:

- which tool(s) are the most appropriate to import and feed the different combination to my decision logic?

- which tool is the most appropriate to synthesis with different number of input? - I have used Genus Synthesis Solution so far. However with my skill right now I can only let Genus synthesize my Verilog code one setup at a time. I'm not sure if I there is anyway I can feed a lot of input at a time and get those results (min, max, average of delay, power dissipation and area)

- which language or scripts I should pick up to use and achieve these results?

-where can I find information to solve my problem? which information shall I look for?

Thank you so much for your time!!

Best Regards

Hello All,

How do we control the Always on buffering for a power domain called B in Power domain A.

here B-power domain nets going through A , hence tool is inserting Always on buffers.

How do we avoid this specific power domain ?

Thanks,
Bshaik

Is there a skill command for "Assign Layout Instance terminals", this form appears when i click on define device correspondence and Bind the devices.

Also,

Problem Statement : i have a schematic with a couple of transistor symbols and and i alos have a corresponding layout view with respective layout transistors but they all are inside a pCell(created by me) i.e layout transistor called inside a custom Pcell. Now i have multiple symbols in schematic view and a single instance(pCell) in layout view. 
Is there a way how i can bind these schematic symbols with layout symbols inside the pCell(custom)? Even if i have to use cph commands i'm fine with it. need help here.

The idea here is to establish XL connectivity between the schematic symbols and corresponding layout transistors(inside the pCell).

Thanks,

Shankar

Hello Community,

Is there any simple way how i can get the coordinates of all the shapes in a layout view?

Currently i'm flattening the layout, getting all the lpps from CV and using setof to get all the shapes of a layer and looping through them to get the coordinates.

Is there a way to do it without having to flatten the layout view and shapes merged or any other elegant way to do it if we flatten it?

Also, dbWriteSkill doesn't give output how i desired

Thanks,

Shankar

I am attempting to use dbGetNeighbor() function inside the dynamic display HUD so that the distance to the next metal on that layer could be viewed. Think of another line in this dynamic table here... 

My SKILL code is essentially the following:

procedure(getNearestNeighborOnMetal(cv)
let((direction tmpBoundingBox)
direction = internal_function()
tmpBoundingBox = dbCreateRect(geGetEditCellView() "tmp" list(hiGetCommandPoint() hiGetCommandPoint()))
car(dbGetNeighbor(geGetEditCellView() tmpBoundingBox direction))
)
)

this returns the distance to the closest metal based on some tests.

Next, I try to register this function to work in the Dynamic Display / Info Balloon world by executing odcRegisterCustomFunc() for each and every object type (I know, absurd, but trying to debug)

In the dynamic display menu, I toggle the "Custom SKILL Function" check in layoutXL, then hit apply, then OK.

After this I find I am unable to view the changes reflected in any info balloons or in the drawing HUD (above) for this wire. I have tried replacing my function with the sample "customFunc" from the odcRegisterCustomFunc() documentation and was still unable to produce any new output.

Any help diagnosing the use of this feature would be very much appreciated

Hello,

When I draw a Fluid Guard Ring in Virtuoso, the layout is not visible, and instead, "do_something=nil" appears.

When I check the details with Q, it shows the same information as a regular NFGR guard ring, and Ctrl+F also displays the instance name, just like with a regular NFGR. 

Additionally, the Pcells of Fluid Guard Rings from previous projects appear broken. 

The version I’m currently using is not different from the one used in the past. Even when I access the same version as the one used during the project, the Pcells still appear broken.

These two issues are occurring, and I’m not sure what to check. I would greatly appreciate it if you could assist me in resolving this issue.

//

Hi there

I am trying to make cross-probe btw layout and schematic view.

so when I execute the code in schematic using bindkey, the code will raise the layout view (hiRaiseWindow)

and then I want to descend to the same hierarchy as schematic. (geSelectFig, leHiEditInPlace)

But looks like current cellview still stays at schematic view.

I got this error msg, and when I print current cell view name at where I got this msg, it replys schematic.

*Error* geSelectFig: argument #1 should be a database object (type template = "d") - nil

is there any way to change the current cellview to layout view?

I also added this code, but didn't work.

geGetEditCellView(geGetCellViewWindow(cvId)) ;cvId is layout view

I don't want to close the schematic view, just want to move the focus or make geSelectFig works.

Thanks in advance.

When starting a new design, it's important to take the time to consider design recommendations that prevent problems that can arise later in the design cycle. This two-part compilation of guidelines for starting a new design is the result of years of Cadence AWR Design Environment platform Support experience with designs. Pre-design decisions for user interface, simulation, layout, and library configuration lay the groundwork for a successful and efficient AWR design. This blog, part 2, covers the layout and component library considerations designers should note prior to starting a design.(read more)

Microwave Office is Cadence’s tool-of-choice for RF and microwave designers designing everything from III-V 5G chips, to RF systems in board and package technologies. These types of designs require close interaction between the schematic and its layout. A new Training Byte demonstrates how the schematic-layout connections is built into Microwave Office.(read more)

Hello All:

I am looking for help on the following, as I am new to Cadence tools [I have to use Cadence Innovus for Physical Design after Logic Synthesis using Synopsys Design Compiler, using Nangate 45 nm Open Cell Library]: while using Cadence Innovus, I would need to select a few specific nets to be routed through a specific metal layer. How can I do this on Innovus [are there any command(s)]? Also, would writing and sourcing a .tcl script [containing the command(s)] on the Innovus terminal after the Placement Stage of Physical Design be fine for this?

Secondly, is there a way in Innovus to manipulate layout components, such as changing some pin placements, wire directions (say for example, wire direction changed to facing east from west, etc.) or moving specific closely placed cells around (without violating timing constraints of course) using any command(s)/.tcl script? If so, would pin placement changes and constraining some closely placed cells to be moved apart be done after Floorplanning/Powerplanning (that is, prior to Placement) and the wire direction changes be done after Routing? 

While making the necessary changes, could I use the usual Innovus commands to perform Physical Design of the remaining nets/wires/pins/cells, etc., or would anything need modification for the remaining components as well?

I would finally need to dump the entire design containing all of this in a .def file.

I tried looking up but could only find matter on Virtuoso and SKILL scripting, but I'd be using Innovus GUI/terminal with Nangate 45 nm Open Cell Library. I know this is a lot, but I would greatly appreciate your help. Thanks in advance.

Riya

Hi,

I have synthesized a verilog code. When performing the pnr in innovus it is showing the error "Instance g5891__718 (similar for other) of the cell AND2_X6 has no physical library or has wrong dimension  values (<=0). Check your design setup to make sure the physical library is loaded in and attribute specified in library are correct.

When importing synthesized netlist in virtuoso then it says " Module AND2_X6, instantiated in the top module decoder, is not defined. Therefore the top module decoder will be imported as functional."

Please help what's going on here? 

Learn how Xcelium PowerPlayback App enables the massively parallel Xcelium replay of waveforms for glitch-accurate power estimation of multi-billion gate SoC designs.(read more)

To stay ahead in competition in chip design real-time collaborations ensure traceability, speedy innovations at reduced the cost.(read more)

Does anyone know how to not include a pbar in a constraint manager analysis? I have some relative delay constraints applied on a group of differential nets. When I analyze the design these all show an error. If I delete the plating bar from the design they are all passing. The plating bar gets generated on the Substrate Geometry / Plating_Bar class. I understand that I could just delete the plating bar to verify the constraint but the issue is when I archive this design I would like it to be clean meaning it is in the final state for manufacturing AND passing all constraints according to design reviews.

Anyone have an idea? 

Thank you!

By default, a dielectric must separate each pair of conductor layers in the cross-section of a design. In rare cases, this does not represent the real, manufactured substrate.

If your design requires you to have conductor layers that are not separated by a dielectric (such as, for half-etch designs), there is a variable that needs to be set in Allegro X APD. You must set this by enabling the variable icp_allow_adjacent_conductors. This entry, and its location in the User Preferences Editor, are shown in the following image.

The Objects on adjacent conductor layers do not electrically connect together, automatically. A via must be used to establish the inter-layer connections.

When enabling this option, it is recommended to exercise caution because excluding dielectric layers from your cross-section can lead to inaccurate calculations, including the calculations for signal integrity and via heights. It is important that your cross-section accurately reflect the finished product to ensure the most accurate results possible. Any dielectric layers present in the manufactured part need to be in the cross-section for accurate extraction, 3D viewing, and so on.

Let us know your comments on the various designs that would require adjacent conductor layers.

Display Stream Compression (DSC) is a lossless or near-lossless image compression standard developed by the Video Electronics Standards Association (VESA) for reducing the bandwidth required to transmit high-resolution video and images. DSC compresses video streams in real-time, allowing for higher resolutions, refresh rates, and color depths while minimizing the data load on transmission interfaces such as DisplayPort, HDMI, and embedded display interfaces.

Why Is DSC Needed?

In the ever-evolving landscape of display technology, the pursuit of higher resolutions and better visual quality is relentless. As display capabilities advance, so do the challenges of managing the immense amounts of data required to drive these high-performance screens. This is where DSC steps in. DSC is designed to address the challenges of transmitting ultra-high-definition content without sacrificing quality or performance. As displays grow in resolution and capability, the amount of data they need to transmit increases exponentially. DSC addresses these issues by compressing video streams in real-time, significantly reducing the bandwidth needed while preserving image quality.
 

DSC Use in End-to-end System

DSC Key Features

• Encoding tools:
  • Modified Median-Adaptive Prediction (MMAP)
  • Block Prediction (BP)
  • Midpoint Prediction (MPP)
  • Indexed color history (ICH)
  • Entropy coding using delta size unit-variable length coding (DSU-VLC)

• The DSC bitstream and decoding process are designed to facilitate the decoding of 3 pixels/clock in practical hardware decoder implementations. Hardware encoder implementations are possible at 1 pixel/clock.
• DSC uses an intra-frame, line-based coding algorithm, which results in very low latency for encoding and decoding.

DSC encoding algorithm
 

• Compression can be done to a fractional bpp. The compressed bits per pixel ranges from 6 to 63.9375.
• For validation/compliance certification of DSC compression and decompression engines, cyclic redundancy checks (CRCs) are used to verify the correctness of the bitstream and the reconstructed image.
• DSC supports more color bit depths, including 8, 10, 12, 14, and 16 bpc.
• DSC supports RGB and YCbCr input format, supporting 4:4:4, 4:2:2, and 4:2:0 sampling.
• Maximum decompressor-supported bits/pixel values are as listed in the Maximum Allowed Bit Rate column in the table below

• DP DSC Source device shall program the bit rate within the range of Minimum Allowed Bit Rate column in the table:

Summary

Display Stream Compression (DSC) is a technology used in DisplayPort to enable higher resolutions and refresh rates while maintaining high image quality. It works by compressing the video data transmitted from the source to the display, effectively reducing the bandwidth required. DSC uses a visually lossless algorithm, meaning that the compression is designed to be imperceptible to the human eye, preserving the fidelity of the image. This technology allows for smoother, more detailed visuals at higher resolutions, such as 4K or 8K, without requiring a significant increase in data bandwidth.

More Information

• Cadence has a very mature Verification IP solution. Verification over many different configurations can be used with DisplayPort 2.1 and DisplayPort 1.4 designs, so you can choose the best version for your specific needs.
• The DisplayPort VIP provides a full-stack solution for Sink and Source devices with a comprehensive coverage model, protocol checkers, and an extensive test suite.
• More details are available on the DisplayPort Verification IP product page, Simulation VIP pages.
• If you have any queries, feel free to contact us at talk_to_vip_expert@cadence.com

This is the 22nd installment of The Rationalist, my column for the Times of India.

Trade wars are on the rise, and it’s enough to get any nationalist all het up and excited. Earlier this week, Narendra Modi’s government announced that it would start imposing tariffs on 28 US products starting today. This is a response to similar treatment towards us from the US.

There is one thing I would invite you to consider: Trump and Modi are not engaged in a war with each other. Instead, they are waging war on their own people.

Let’s unpack that a bit. Part of the reason Trump came to power is that he provided simple and wrong answers for people’s problems. He responded to the growing jobs crisis in middle America with two explanations: one, foreigners are coming and taking your jobs; two, your jobs are being shipped overseas.

Both explanations are wrong but intuitive, and they worked for Trump. (He is stupid enough that he probably did not create these narratives for votes but actually believes them.) The first of those leads to the demonising of immigrants. The second leads to a demonising of trade. Trump has acted on his rhetoric after becoming president, and a modern US version of our old ‘Indira is India’ slogan might well be, “Trump is Tariff. Tariff is Trump.”

Contrary to the fulminations of the economically illiterate, all tariffs are bad, without exception. Let me illustrate this with an example. Say there is a fictional product called Brump. A local Brump costs Rs 100. Foreign manufacturers appear and offer better Brumps at a cheaper price, say Rs 90. Consumers shift to foreign Brumps.

Manufacturers of local Brumps get angry, and form an interest group. They lobby the government – or bribe it with campaign contributions – to impose a tariff on import of Brumps. The government puts a 20-rupee tariff. The foreign Brumps now cost Rs 110, and people start buying local Brumps again. This is a good thing, right? Local businesses have been helped, and local jobs have been saved.

But this is only the seen effect. The unseen effect of this tariff is that millions of Brump buyers would have saved Rs 10-per-Brump if there were no tariffs. This money would have gone out into the economy, been part of new demand, generated more jobs. Everyone would have been better off, and the overall standard of living would have been higher.

That brings to me to an essential truth about tariffs. Every tariff is a tax on your own people. And every intervention in markets amounts to a distribution of wealth from the people at large to specific interest groups. (In other words, from the poor to the rich.) The costs of this are dispersed and invisible – what is Rs 10 to any of us? – and the benefits are large and worth fighting for: Local manufacturers of Brumps can make crores extra. Much modern politics amounts to manufacturers of Brumps buying politicians to redistribute money from us to them.

There are second-order effects of protectionism as well. When the US imposes tariffs on other countries, those countries may respond by imposing tariffs back. Raw materials for many goods made locally are imported, and as these become expensive, so do those goods. That quintessential American product, the iPhone, uses parts from 43 countries. As local products rise in price because of expensive foreign parts, prices rise, demand goes down, jobs are lost, and everyone is worse off.

Trump keeps talking about how he wants to ‘win’ at trade, but trade is not a zero-sum game. The most misunderstood term in our times is probably ‘trade-deficit’. A country has a trade deficit when it imports more than what it exports, and Trump thinks of that as a bad thing. It is not. I run a trade deficit with my domestic help and my local grocery store. I buy more from them than they do from me. That is fine, because we all benefit. It is a win-win game.

Similarly, trade between countries is really trade between the people of both countries – and people trade with each other because they are both better off. To interfere in that process is to reduce the value created in their lives. It is immoral. To modify a slogan often identified with libertarians like me, ‘Tariffs are Theft.’

These trade wars, thus, carry a touch of the absurd. Any leader who imposes tariffs is imposing a tax on his own people. Just see the chain of events: Trump taxes the American people. In retaliation, Modi taxes the Indian people. Trump raises taxes. Modi raises taxes. Nationalists in both countries cheer. Interests groups in both countries laugh their way to the bank.

What kind of idiocy is this? How long will this lose-lose game continue?

The India Uncut Blog © 2010 Amit Varma. All rights reserved.
Follow me on Twitter.

Hello Fellow PCB Designers,

We have a 10 layer PCB design that originated in Pads and was converted over to Allegro 17.4, this is an old design but is manufacturable and works perfectly fine.  When I try to generate a Gerber for the Top or Bottom layers

the Gerber comes out fine.  But Most of the middle layers are Etch's and via's for power and grounds, but the Gerber's come mostly blank, there might be some details, but in the Gerber view everything is displayed correctly.

The design does have many close spacings, I have not changed anything in the constrains manager yet, turned off a lot of the DRC's, but thinking there might be something wrong with the constrains.

  I find that the CSet is set to 2_18, not sure yet what this means, also there are many of these definitions, PCS 3,4,5,ect, are the same as CSet 2_18 any suggestions would be great, we are currently looking into this, have seen

that even small change in constraint manager can cause long processing and even Allegro crashing, this is a large project.

Thanks Much, Thanks, Mike Pollock.

I have managed to convert our old schematic and PCD file to from Layout 16.2 to 17.4

I have exported the footprints and moved them to the correct lib directory. 

I get no DRC errors and I can build a new netlist file. The problem is I can't get the PCB editor to update using the new netlist and get the following error:

I cannot figure out how to fix the Name is too long error. 

(---------------------------------------------------------------------)

(                                                                     )

(    Allegro Netrev Import Logic                                      )

(                                                                     )

(    Drawing          : 70055R2.brd                                   )

(    Software Version : 17.4S023                                      )

(    Date/Time        : Tue Dec 14 18:54:25 2021                      )

(                                                                     )

(---------------------------------------------------------------------)

------ Directives ------------

Ripup etch:                  Yes

Ripup delete first segment:  No

Ripup retain bondwire:       No

Ripup symbols:               IfSame

Missing symbol has error:    No

DRC update:                  Yes

Schematic directory:         'C:/AFS/70055 PCB Test 2'

Design Directory:            'C:/AFS/70055 PCB Test 2'

Old design name:             'C:/AFS/70055 PCB Test 2/70055R2.brd'

New design name:             'C:/AFS/70055 PCB Test 2/70055R2.brd'

CmdLine: netrev -$ -i C:/AFS/70055 PCB Test 2 -x -u -t -y 2 -h -z -q netrev_constraint_report.xml C:/AFS/70055 PCB Test 2/#Taaaaae57776.tmp

------ Preparing to read pst files ------

Starting to read C:/AFS/70055 PCB Test 2/pstchip.dat 

   Finished reading C:/AFS/70055 PCB Test 2/pstchip.dat (00:00:00.02)

Starting to read C:/AFS/70055 PCB Test 2/pstxprt.dat 

   Finished reading C:/AFS/70055 PCB Test 2/pstxprt.dat (00:00:00.00)

Starting to read C:/AFS/70055 PCB Test 2/pstxnet.dat 

   Finished reading C:/AFS/70055 PCB Test 2/pstxnet.dat (00:00:00.00)

------ Oversights/Warnings/Errors ------

#1   ERROR(SPMHNI-176): Device library error detected.

ERROR(SPMHNI-189): Problems with the name of device 'SW DPDT_9_SWITCH_OTTO_ALT_SW DPDT': 'Name is too long.'.

ERROR(SPMHNI-170): Device 'SW DPDT_9_SWITCH_OTTO_ALT_SW DP' has library errors. Unable to transfer to Allegro.

#2   ERROR(SPMHNI-176): Device library error detected.

ERROR(SPMHNI-189): Problems with the name of device 'SW DPDT_10_SWITCH_OTTO_LIGHTS_SW DPDT': 'Name is too long.'.

ERROR(SPMHNI-170): Device 'SW DPDT_10_SWITCH_OTTO_LIGHTS_S' has library errors. Unable to transfer to Allegro.

#3   ERROR(SPMHNI-176): Device library error detected.

ERROR(SPMHNI-189): Problems with the name of device 'SW DPDT_7_SWITCH_OTTO_ALT_SW DPDT': 'Name is too long.'.

ERROR(SPMHNI-170): Device 'SW DPDT_7_SWITCH_OTTO_ALT_SW DP' has library errors. Unable to transfer to Allegro.

#4   ERROR(SPMHNI-176): Device library error detected.

ERROR(SPMHNI-189): Problems with the name of device 'SW DPDT_3_SWITCH_OTTO_MASTER_SW DPDT': 'Name is too long.'.

ERROR(SPMHNI-170): Device 'SW DPDT_3_SWITCH_OTTO_MASTER_SW' has library errors. Unable to transfer to Allegro.

#5   ERROR(SPMHNI-176): Device library error detected.

ERROR(SPMHNI-189): Problems with the name of device 'SW DPDT_6_SWITCH_OTTO_LIGHTS_SW DPDT': 'Name is too long.'.

ERROR(SPMHNI-170): Device 'SW DPDT_6_SWITCH_OTTO_LIGHTS_SW' has library errors. Unable to transfer to Allegro.

#6   ERROR(SPMHNI-176): Device library error detected.

ERROR(SPMHNI-189): Problems with the name of device 'SW DPDT_3_SWITCH_OTTO_MASTER_DPDT': 'Name is too long.'.

ERROR(SPMHNI-170): Device 'SW DPDT_3_SWITCH_OTTO_MASTER_DP' has library errors. Unable to transfer to Allegro.

#7   ERROR(SPMHNI-176): Device library error detected.

ERROR(SPMHNI-189): Problems with the name of device 'CONNECTOR DB15_DSUBVPTM15_CONNECTOR DB15': 'Name is too long.'.

ERROR(SPMHNI-170): Device 'CONNECTOR DB15_DSUBVPTM15_CONNE' has library errors. Unable to transfer to Allegro.

#8   ERROR(SPMHNI-176): Device library error detected.

ERROR(SPMHNI-189): Problems with the name of device 'CONNECTOR DB9_DSUBVPTM9_CONNECTOR DB9': 'Name is too long.'.

ERROR(SPMHNI-170): Device 'CONNECTOR DB9_DSUBVPTM9_CONNECT' has library errors. Unable to transfer to Allegro.

#9   ERROR(SPMHNI-175): Netrev error detected.

ERROR(SPMHDB-195): Error processing 'M6': Text line is outside of the extents..

------ Library Paths ------

MODULEPATH =  . 

           C:/Cadence/SPB_17.4/share/local/pcb/modules 

PSMPATH =  . 

           symbols 

           .. 

           ../symbols 

           C:/Cadence/SPB_17.4/share/local/pcb/symbols 

           C:/Cadence/SPB_17.4/share/pcb/pcb_lib/symbols 

           C:/Cadence/SPB_17.4/share/pcb/allegrolib/symbols 

           C:/Cadence/SPB_17.4/share/pcb/pcb_lib/symbols 

PADPATH =  . 

           symbols 

           .. 

           ../symbols 

           C:/Cadence/SPB_17.4/share/local/pcb/padstacks 

           C:/Cadence/SPB_17.4/share/pcb/pcb_lib/symbols 

           C:/Cadence/SPB_17.4/share/pcb/allegrolib/symbols 

           C:/Cadence/SPB_17.4/share/pcb/pcb_lib/symbols 

------ Summary Statistics ------

#10  Run stopped because errors were detected

netrev run on Dec 14 18:54:25 2021

   DESIGN NAME : '70055R2'

   PACKAGING ON Nov  2 2021 14:32:04

   COMPILE 'logic'

   CHECK_PIN_NAMES OFF

   CROSS_REFERENCE OFF

   FEEDBACK OFF

   INCREMENTAL OFF

   INTERFACE_TYPE PHYSICAL

   MAX_ERRORS 500

   MERGE_MINIMUM 5

   NET_NAME_CHARS '#%&()*+-./:=>?@[]^_`|'

   NET_NAME_LENGTH 24

   OVERSIGHTS ON

   REPLACE_CHECK OFF

   SINGLE_NODE_NETS ON

   SPLIT_MINIMUM 0

   SUPPRESS   20

   WARNINGS ON

 10 errors detected

 No oversight detected

 No warning detected

cpu time      0:00:27

elapsed time  0:00:00

Hello. I am using Cadence 17.4 tools. When I open a package symbol (.dra) or board file (.brd) in Allegro that was created in an older version of the tool I get a message like this one (as expected):

"The design created using release 17.2 will be updated for compatibility with the current software..."

If I create a symbol or board file from scratch in the 17.4 tool then open it later, I get the same message. (always referring to version 17.2 which is the previous version I was using here).

So far this has not caused me any problems, but I would like to understand why it is doing this in case I have something setup incorrectly.

I only have version 17.4 installed. I am not exporting to a downrev version when I save (i.e. not using File->Export->Downrev design…) and in User Preferences->Drawing I don’t have anything selected for database_compatibility_mode. What else might I check?

FYI here is the tool version information that I see after selecting Help->About Symbol:

OrCAD PCB Designer Standard 17.4-2019 S012 [10/26/2020] Windows SPB 64-bit Edition

Thanks -Jason

Hi

In the environment I'm currently working, axes are shown for schematic, symbol, and layout views.For schematics and symbols, I'd prefer a dim gray, such that the axes are just visible but not dominant. For the layout, I'd prefer a brighter color. Is there a way to realize this? So far when I change the color of the 'axis' layer in the display resource editor, the axes in all three views get changed together:

Thanks very much for your input!

Hi,

I have a LEF file with simple definitions of pad design which uses M8, M9, and AP layers. However, I failed to import the design with CIW > Import > LEF... as I encountered "ERROR: (OALEFDEF-90019): Ignoring the line 30 in the layer map file ... as it contains a syntax error. Each entry in the layer map file must have two values, LEFLayerName and OALayerNumber separated by a blank space." All lines in the file report the same OALEFDEF-90019 error.

The tech.layermap file looks like this:


# techLayer       techPurpose     stream# dataType

ref drawing 0 0
DNW drawing 1 0
PW drawing 2 0

Hi

I have a rather strange question - is there a way to tell layout XL to NOT place the error/warning markers on a design when I open a cell?  I do a lot of my layout by using arrays from placed instances and create mosaics that completely ignore the metadata that Layout XL uses with its bindings with schematic (and instances get deleted etc. but I do like using it to generate all my pins etc.) and it's just really annoying when I open a design that I know is LVS clean and since the connectivity metadata is all screwed up (because I did not use it to actually complete the layout) I have a design that's just blinking at me at every gate, source and drain.  I typically delete them at the high level heirarchically but the second I go in and modify something and come back up it places all of them again.  I know that if I flatten all the p cells it goes away but sometimes it's nice to have that piece of metadata but that's about it.  Is there a way to "break" the features of XL like this?  I realize what a weird question this is but it's becoming more of an issue since we moved to IC 23 from IC 6 where there is no longer a layout L that I can use free from these annoyances that can't use any of the connectivity metadata.

Thanks

Chris

> reg [63:0] rMem [0:255] signal

it can be confirmed by rMem [0:255] in Simvision

Is it possible to generate a new rMem1 signal and rMem2 signal by splitting it into 32 bits width through right-click> Create on rMem?

If you have seen any images or demonstrations of the 17.4-2019 release, the GUI may look ...(read more)

Hello,

I have a sensitive trace on layer 2 and I would like to prevent any routing along or across it on adjacent layers (L1 and L3).

My idea was to use a route keepout shape on L1 and L3, however that also removed the ground pour on those layers and I would like to keep the ground pour.

Can I get around this somehow or should I use something else than route keepout?

Regards,

Filip

I want to make an opening in the solder mask right above a trace that is acting like a guard ring. Do I really need to go and buy the Allegro Productivity Toolbox add-on for using the Cross-Copy tool for a basic operation like that??

/F

Hai Community,

I have a PCB board which has multiple high speed nets and I want to perform the EMI and EMC checking.

Which Cadence tool should I use for checking the EMI and EMC coupling?

Regards,

Rohit Rohan

The Cadence Cerebrus Intelligent Chip Explorer is a revolutionary, machine learning-driven, automated approach to chip design flow optimization. Block engineers specify the design goals, and Cadence Cerebrus will intelligently optimize the Cadence digital full flow to meet the power, performance, and area (PPA) goals in a completely automated way. Use Cerebrus Apps to optimize some aspects of the design as well.

Running a full RTL to GDSII flow, Cadence Cerebrus has a lot of possibilities and combinations of different tool settings to explore.

Using the knowledge from previous runs, combined with on-the-fly analysis within the flow, Cadence Cerebrus can assess many settings combinations and fine-tune the flow accordingly in a very efficient manner.

As technology advances, projects become bigger and way more complex than before. The ability of a single engineer to run simultaneously a large number of blocks in a traditional way is limited. Cadence Cerebrus allows a single engineer to work more efficiently and implement more blocks, while maintaining the same or even better PPA, using compute power.

Being such a revolutionary tool, integrating Cerebrus into your existing flow is surprisingly simple as it can wrap around any existing flow scripts.

Please join me in this course, to learn about the features and basics of Cadence Cerebrus Intelligent Chip Explorer.

We’ll walk through the tool setting stage, explain what is a primitive and how it effects our run, talk about the cost function and the run goals.

We’ll understand the concept of scenarios, learn how to analyze the results of the different runs, and compare them.

In addition, we’ll talk about basic debug rules and methods to analyze failures.

Sounds Interesting?

Please join our “live” one-day Cadence Cerebrus Intelligent Chip Explorer Training @Cadence Feldkirchen planned for October 9th, 2024!

For more details and registration, please contact Training Germany.

If you would like to have an instructor-led training session in another region please contact your local training department.

Become Cadence Certified

Cadence Training Services offers a digital badge for this training course. This badge indicates proficiency in a certain technology or skill and gives you a way to validate your expertise to managers and potential employers. You can highlight your expertise by adding this digital badge to your email signature or any social media platform, such as Facebook or LinkedIn.

Related Training

Innovus Block Implementation with Stylus Common UI

Related Training Bytes

Cerebrus Primitives (Video) 

How to Reuse Cerebrus (Video) 

Cerebrus - Verifying Distribution Script (Video)

How to distribute Cerebrus Scenarios (Video) 

Cerebrus Web Interface Monitor and Control (Video) 

How to Setup Cerebrus for a Successful Run (Video) 

Flow Wrapping: The Cadence Cerebrus Intelligent Chip Explorer Must Have (Webinar) (Video) 

Cerebrus Cost Functions (Video) 

Related Blogs

Training Insights: Cadence Cerebrus Webinar Recording Now Available!

Keep Up with the Revolution—Cadence Cerebrus Training

New to Equivalence Checking? Restart from the Basic Concepts

Training Insights - Free Online Courses on Cadence Learning and Support Portal

Training Insights – Important Facts You Should know About Our Cadence Learning and Support Portal

Warsaw already offers a skilled workforce and has improved its infrastructure – now it must focus on climate change and reducing congestion, mayor Rafał Trzaskowski tells fDi.

Stevens Mokgalapa talks about foreign investment opportunities and challenges in South Africa’s administrative capital, and the balancing act of development and environmental needs in the developing world.

Financial incentives from two different cities persuaded US grocery chain The Fresh Market to stay headquartered in its home state of North Carolina.

US News report ranks investable countries, with surprise results at the top.

A Porsche Taycan 4 and revised GTS model join the 2025 lineup The Porsche Taycan is now available in 13 different versions When they arrive in 2025 the Taycan 4 will cost $105,295 while the GTS will cost $149,895 The 2025 Porsche Taycan received an engineering-focused refresh that improved range and efficiency, the benefits of which are now being...

The updated 2025 Porsche Taycan family boasts 13 members A new Taycan 4 and revised Taycan GTS have been revealed The Taycan GTS benefits from a 100-hp boost over the outgoing model Porsche in February unveiled a mid-cycle refresh for its Taycan, which has been introduced for the 2025 model year in the U.S. However, not every model in the Taycan...

Lucid Motors is pitching its Air electric sedan as a potential police cruiser. On Sunday the automaker posted photos of an Air decked out in police equipment on X (formerly Twitter). Lucid said the car had recently participated in California Highway Patrol testing, but did not provide any other details. We've reached out to Lucid with questions...

Mazda CX-50 Hybrid gets its 38-mpg powertrain from Toyota Styling and packaging is mostly unchanged, price is $2,550 to $3,400 more than non-hybrid Lacks much of the engaging, responsive driving experience that's distinguished Mazda Among mainstream, gasoline-fueled vehicles, with only a few exceptions, our advice to most shoppers is simple: If...

Antwerp’s vice-mayor, Claude Marinower, talks about the city's history as a diverse business location, and its plans to promote traditional industries alongside innovative concepts.

Lisbon’s mayor discusses the city’s tech strengths and its solutions to business challenges, such as affordable housing.

Moldova's wine industry has gained some international recognition but the country remains largely untroubled by tourists, a combination that is enticing some foreign investors.

Connections is a New York Times word game that's all about finding the "common threads between words." How to solve the puzzle.