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Google Pixel 4a Review

Read the in depth Review of Google Pixel 4a Mobile Phones. Know detailed info about Google Pixel 4a configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.




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Acer Aspire 7 Gaming Review

Read the in depth Review of Acer Aspire 7 Gaming Laptops. Know detailed info about Acer Aspire 7 Gaming configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.




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Google Pixel Buds A-Series Review

Read the in depth Review of Google Pixel Buds A-Series Audio Video. Know detailed info about Google Pixel Buds A-Series configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.




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Google Pixel 6a Review

Read the in depth Review of Google Pixel 6a Mobile Phones. Know detailed info about Google Pixel 6a configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.




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Google Pixel 7 Pro Review

Read the in depth Review of Google Pixel 7 Pro Mobile Phones. Know detailed info about Google Pixel 7 Pro configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.




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Google Pixel Buds Pro Review

Read the in depth Review of Google Pixel Buds Pro Audio Video. Know detailed info about Google Pixel Buds Pro configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.




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Google Pixel 7 5G Review

Read the in depth Review of Google Pixel 7 5G Mobile Phones. Know detailed info about Google Pixel 7 5G configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.




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FUJIFILM FinePix Real 3D W1 - world's first 3D camera - price Rs. 39,999 Review

Read the in depth Review of FUJIFILM FinePix Real 3D W1 - world's first 3D camera - price Rs. 39,999 Digital Cameras. Know detailed info about FUJIFILM FinePix Real 3D W1 - world's first 3D camera - price Rs. 39,999 configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.




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Google Pixel 7A Review

Read the in depth Review of Google Pixel 7A Mobile Phones. Know detailed info about Google Pixel 7A configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.




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SKOAR! College Gaming Cllub | Pillai HOC College of Engg | #conquerwithcourage #mountaindew




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Man's Body Found In 7 Pieces In A Plastic Bag Near Mumbai's Gorai Beach

A body of a man has been found in a plastic bag in seven pieces on Mumbai's Gorai beach, the police said today.




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Imane Khelif: Boxer In Gender Row And Now Olympic Champion

Born in a poor village, Algerian boxer Imane Khelif has overcome numerous obstacles throughout her life to win a controversial Paris Olympics gold on Friday.




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"We Talked About...": Sundar Pichai Recalls Last Meeting With Ratan Tata

Ratan Tata, born on December 28, 1937, is the Chairman of Ratan Tata Trust, two of the largest private-sector-promoted philanthropic trusts in India.





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Inflation in nearly half of major states outgrows India's Oct CPI; price pressure steepest in Chhattisgarh - Moneycontrol

  1. Inflation in nearly half of major states outgrows India's Oct CPI; price pressure steepest in Chhattisgarh  Moneycontrol
  2. Retail inflation surges to a 14-month high of 6.2% in October  The Times of India
  3. If we exclude vegetable prices, CPI inflation remains in RBI's range: UBI research  The Economic Times
  4. Rising food prices are likely to push back beginning of rate cutting cycle  The Indian Express
  5. India confident of reaching USD 100 billion trade volume with Russia ahead of 2030 timeline: S Jaishankar  Telegraph India








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Photographer Captures Breathtaking Close-Up Shot Of A Whale's Eye. See Pics

Positioned near the side of her head, the eye provides an expansive field of vision, while a thick layer of protective blubber shields it from harm and maintains warmth.




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Intel to spin-off and sell Wind River Software to TPG

Wind River, an IoT and industrial operating system owned by Intel will be acquired by TPG, global alternative asset firm. Terms of the deal were not disclosed. Intel had bought Wind River Systems for $884 million in 2009

Wind River operates in several markets, including aerospace and defense, automotive, industrial, medical and networking technologies. Its core products in these markets are operating systems, software infrastructure platforms, device management, and simulation software. The IoT practice of Wind River provides consulting services for customers building IoT applications.

In a statement for Wind River, Nehal Raj, Partner and Head of Technology investing at TPG said “We see a tremendous market opportunity in industrial software driven by the convergence of the Internet of Things (IoT), intelligent devices and edge computing. As a market leader with a strong product portfolio, Wind River is well positioned to benefit from these trends. We are excited about the prospects for Wind River as an independent company, and plan to build on its strong foundation with investments in both organic and inorganic growth.”

Wind River’s main IoT product is Helix Device Cloud, a cloud-offering capable of managing deployed IoT devices and industrial equipment across a machine’s lifecycle. Helix can connect and manage devices remotely.

Helix platform’s key uses cases are gateway management, proactive maintenance, security updates, and device provisioning.




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COP29 Expected Finalise Financing Model for Developing Economies

[SAnews.gov.za] With the United Nations Framework Convention on Climate Change (COP29) taking place this week, South Africa expects the COP29 Presidency to enhance efforts to finalise the New Collective Quantified Goal on Finance (NCQG), which is a matter of great importance for developing economies.




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A South African Politician Ends Up Homeless in Nthikeng Mohlele's Spicy New Novel - but Is It Any Good?

[The Conversation Africa] Despite the flaws in the latest novel by South African writer Nthikeng Mohlele, there is something alluring about Revolutionaries' House. It is Mohlele's most political novel, and the parallels drawn between love and politics - and their pitfalls - are intriguing.




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The Future of Driving: How Advanced DSP is Shaping Car Infotainment Systems

As vehicles transition into interconnected ecosystems, artificial intelligence and advanced technologies become increasingly crucial. Infotainment systems have evolved beyond mere music players to become central hubs for connectivity, entertainment, and navigation. With global demand for comfort, convenience, and safety rising, the automotive infotainment market is experiencing significant growth. Valued at USD14.99 billion in 2023, it is projected to grow at a compound annual growth rate (CAGR) of 9.9% from 2024 to 2030.

To keep pace with this evolution, infotainment systems must accommodate a range of workloads, including audio, voice, AI, and vision technologies. This requires a flexible, scalable Digital Signal Processor (DSP) solution that acts as an offload engine for the main application processor. Integrating a single DSP for varied functions offers a cost-effective solution for high-performance, low-power processing, which aligns well with the needs of Electric Vehicles (EVs).

If you missed the detailed presentation by Casey Ng, Product Marketing Director at Cadence at CadenceLIVE 2024, register at the CadenceLIVE On-Demand site to access it and other insightful presentations. Stay ahead of the curve and explore the future of innovative electronics with us.

Cadence Infotainment Solution: Leading the Charge

Cadence Tensilica HiFi DSPs play a crucial role in enhancing audio capabilities in vehicle infotainment systems. They support applications like voice recognition, hands-free calling, and deliver immersive audio experiences. This technology is also paramount for features such as active noise control, which reduces road and cabin noise, and acoustic event detection for identifying unusual sounds like broken glass. One notable innovation is the "audio bubble," enabling personalized audio zones within the vehicle, ensuring passengers enjoy distinct audio settings.

Cadence HiFi DSP technology enriches the driving experience for electric vehicles by mimicking traditional engine sounds, while its advanced audio processing ensures optimal performance across various digital radio standards. It significantly contributes to noise reduction, hence improving the cabin experience. Integrating a Double Precision Floating Point Unit (FPU) stands out, as it upgrades audio performance and Signal-to-Noise Ratio (SNR) through efficient 64-bit processing, allowing control over numerous speakers without hitches.

These advancements distinguish the DSP as an essential tool in evolving infotainment systems, offering unmatched performance and adaptability. Tensilica HiFi processors, crucial to advanced infotainment SoCs, serve as efficient offload processors, augmenting real-time execution and energy efficiency. Cadence’s ecosystem, with over 200 codecs and software partnerships, propels the evolution of innovative infotainment systems. Introducing the HiFi 5s DSP marks a new era in connected car experiences, setting the stage for groundbreaking advancements.

Exploring Tomorrow with HiFi 5s DSP Technology

The HiFi 5s represents the apex of audio and AI digital signal processing performance. Built on the Xtensa LX8 platform, it introduces capabilities like auto-vectorization, which allows standard C code to be automatically optimized for performance. This synergy of hardware and software co-design marks a significant step forward in DSP technology. By leveraging its extended Single Instruction, Multiple Data (SIMD) capabilities alongside features like a double-precision floating-point unit (DP_FPU), the HiFi 5s delivers unparalleled precision and speed improvements in signal and audio processing tasks. Equally notable are its branch prediction and L2 cache enhancements, which optimize system performance by refining the control code execution and recognizing codec efficiency. The application of such enhancements are particularly beneficial in real-world scenarios.

AI-Powered Audio

Cadence's focus on AI integration with the HiFi 5s demonstrates significant improvements in audio clarity through AI-powered solutions.

  • AI models learn from real-world data and adapt dynamically, while classic DSP algorithms rely on fixed rules.
  • AI can be fine-tuned for specific scenarios, whereas classic DSP lacks flexibility.
  • AI handles extreme and marginal noise patterns better, generalizes well across different environments, and is robust against varying noise characteristics.

Cadence's dedication to artificial intelligence marks a pivotal shift in audio processing. Traditional DSP algorithms, bound by rigid rules, are eclipsed by AI's ability to learn dynamically from real-world data. This adaptability equips AI models to tackle challenging noise patterns and offer unmatched clarity even in noisy environments, making them ideal for automotive and consumer audio applications.

Realtime AI-Optimized Speech Enhancements by OmniSpeech and ai|coustics

OmniSpeech

Our partner, OmniSpeech, has advanced AI-based audio processing that enhances the performance of audio software, specifically for omnidirectional and dipole microphones. Impressively, their technology operates with less than 32MHz and requires only 418kB of memory.

Test results show that background noise is significantly reduced when AI employs a single omnidirectional microphone, outperforming non-AI solutions. Additionally, when using a dipole microphone with AI, there is a 3.5X improvement in the weighted Signal-to-Noise Ratio (SNR) and more than a 28% increase in the Global Mean Opinion Score (GMOS) across various background noise.

ai|coustics

ai|coustics, a Cadence partner specializing in advanced audio technologies, utilizes real-time AI-optimized speech enhancement algorithms. They leverage an extensive speech-quality dataset containing thousands of hours and 100 languages to transform low-quality audio into studio-grade audio. Their process includes:

  • De-reverb, which eliminates room resonances, echoes, and reflections
  • Removing artifacts from downsampling and codec compression
  • Dynamic and adaptive background noise removal
  • Reviving audio materials with analog and digital distortions
  • Providing support for all languages, accents, and a variety of speakers

Applications include:

  • Automotive: Enhances clarity of navigation commands and communication for driver safety
  • Consumer audio: Improves voice clarity for better dialogue understanding in TV programs. Optimizes speech intelligibility in communication for both uplink and downlink audio streams
  • Smart IoT: Boosts voice command detection and response quality

Performance Enhancements

The advancements in branch prediction and L2 cache integration have significantly boosted performance metrics across various systems. With HiFi 5s, branch prediction increases codec efficiency by an average of 5%, reaching up to 16% in optimal conditions. L2 cache improvements have drastically enhanced system-level performance, evidenced by a 2.3X boost in EVS decoder efficiency. Adding MACs and imaging ISA in imaging use cases has led to substantial advancements. When comparing HiFi 5s to HiFi 5, imaging ISA performance improvements range with >60% average performance improvements.

The Crescendo of the Future

As Cadence continues to blaze trails in DSP technology, the HiFi 5s emerges as the quintessential solution for consumer and automotive audio use cases. With a robust framework for auto-vectorization, an unmatched double-precision FPU, AI-driven audio solutions, and comprehensive system enhancements, Cadence is orchestrating the next era of audio processing, where every note is clearer, every sound richer, and every experience more engaging. It is not just the future of audio—it's the future of how we experience the world around us.

 Discover how Cadence Automotive Solutions can transform your business today!




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How to define the pin locations for 2-dimensional input?

I have a 2-dimensional input in my design - input [2:0] data_in [15:0]. After synthesis with genus, I got a netlist where the inputs are like data[15], data[14],...,data[0]. And furthermore it has definitions like input [2:0] data[15], .... So how can I define the pin locations of each of the bits for this input? Can I define data[15]'s inner bits like data[15][0]? Is it possible to define this with def files?




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μWaveRiders: New Python Library Provides a Higher-Level API in the Cadence AWR Design Environment

A new Python library has been written to facilitate an interface between Python and AWR software using a command structure that adheres more closely to Python coding conventions. This library is labeled "pyawr-utils" and it is installed using the standard Python pip command. Comprehensive documentation for installing and using pyawr-utils is available.(read more)




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Constraining some nets to route through a specific metal layer, and changing some pin/cell placements and wire directions in Cadence Innovus.

Hello All:

I am looking for help on the following, as I am new to Cadence tools [I have to use Cadence Innovus for Physical Design after Logic Synthesis using Synopsys Design Compiler, using Nangate 45 nm Open Cell Library]: while using Cadence Innovus, I would need to select a few specific nets to be routed through a specific metal layer. How can I do this on Innovus [are there any command(s)]? Also, would writing and sourcing a .tcl script [containing the command(s)] on the Innovus terminal after the Placement Stage of Physical Design be fine for this?

Secondly, is there a way in Innovus to manipulate layout components, such as changing some pin placements, wire directions (say for example, wire direction changed to facing east from west, etc.) or moving specific closely placed cells around (without violating timing constraints of course) using any command(s)/.tcl script? If so, would pin placement changes and constraining some closely placed cells to be moved apart be done after Floorplanning/Powerplanning (that is, prior to Placement) and the wire direction changes be done after Routing? 

While making the necessary changes, could I use the usual Innovus commands to perform Physical Design of the remaining nets/wires/pins/cells, etc., or would anything need modification for the remaining components as well?

I would finally need to dump the entire design containing all of this in a .def file.

I tried looking up but could only find matter on Virtuoso and SKILL scripting, but I'd be using Innovus GUI/terminal with Nangate 45 nm Open Cell Library. I know this is a lot, but I would greatly appreciate your help. Thanks in advance.

Riya




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Detailed waveform dumping for selected waveform

I'm currently trying to explore the verilog simulation option in cadence.

One thing that comes to my mind that if there exists a way in cadence workflow to dump selected register/wire's waveform during the simulation. 

Are there any additional tools needed apart from xcelium, is there a tutorial or specific training course for this aspect. I glance through Xcelium Simulator Course Version 22.09, but it seems not having related context. 

I know in Synopsys's workflow, it can be realized using verdi & fsdb in the command line as follows:

if (inst.CTRL_STATE==STATE_START_TO_DUMP)

$fsdbDumpvars(0, inst_1.reg_0);

end

Thanks in advance!




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How to generate "Sheet Name" column in a pin report?

Hi everyone, 

Is there any method to generate "Sheet" column for a pin report like table below? The column "Name.Pin" & "Signal" can be generated easily, but I have no idea to generate the column of "Sheet Name".

The software using here are Allegro Design Entry HDL, OrCAD Capture and Allegro PCB Editor. Can these 3 software generate "Sheet Name" data?

Name.Pin Signal Sheet Name
C1_1.1 N301321 SITE1_1
C1_1.2 GND_ANA_1 SITE1_1
C1_2.1 N180243 SITE2_1
C1_2.2 GND_ANA_2 SITE2_1

Thank you. 




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Multiple touch points for bond wires on a die pin

Does anyone know whether it is possible to have multiple contact points for a bond wire on a large die pad? Note: This is different from adding multiple wires which I will also be doing. I need to add multiple bond connections to the same large die pad for redundancy connections to each pad for each wire. I have a large die pad which I need to have 5 wires with each wire having 3 bond connections to the same die pad.




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How to add wirebond profile to a die pin?

Starting SPB 23.1, a new pin property, WIREBOND_PROFILE_NAME is introduced. This property can be used to define a wirebond profile to a die pin. When adding a wirebond, the pin will use the profile defined in the WIREBOND_PROFILE_NAME property associated to the die pin.

Assign the WIREBOND_PROFILE_NAME property to the die pin using Edit > Properties and set the desired wirebond profile name in the Value field.

The following image displays the WIREBOND_PROFILE_NAME property assigned to the pin and wire profile of the Wire Bond for that pin.




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How to transfer etch/conductor delays from Allegro Package Designer (APD) to pin delays in Allegro PCB Editor

The packaging group has finished their design in Allegro Package Designer (APD) and I want to use the etch/conductor delay information from the mcm file in the board design in Allegro PCB Designer. Is there a method to do this?

This can be done by exporting the etch/conductor data from APD and importing it as PIN_DELAY information into Allegro PCB Editor.

If you are generating a length report for use in Allegro Pin Delay, you should consider changing the APD units to Mils and uncheck the Time Delay Report.

In Allegro Package Designer:

  1. Select File > Export > Board Level Component.
  2. Select HDL for the Output format and select OK.

       3. Choose a padstack for use when generating the component and select OK.

This will create a file, package_pin_delay.rpt, in the component subdirectory of the current working directory. This file will contain the etch/conductor delay information that can be imported into Allegro.

In Allegro PCB Editor:

  1. Make sure that the device you want to import delays to is placed in your board design and is visible.
  2. Select File > Import > Pin delay.
  3. Browse to the component directory and select package_pin_delay.rpt. The browser defaults to look for *.csv files so you will need to change the Files of type to *.* to select the file.
  4. You may be prompted with an error message stating that the component cannot be found and you should select one. If so, select the appropriate component.
  5. Select Import.
  6. Once the import is completed, select Close.

Note: It is important that all non-trace shapes have a VOLTAGE property so they will not be processed by the the 2D field solver. You should run Reports > Net Delay Report in APD prior to generating the board-level component. This will display the net name of each net as it is processed. If you miss a VOLTAGE property on a net, the net name will show in the report processing window, and you will know which net needs the property.




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A Brief on Message Bus Interface in PIPE

PHY Interface for the PCI Express (PCIe), SATA, USB, DisplayPort, and USB4 Architectures (PIPE) enables the development of the Physical Layer (PHY) and Media Access Layer (MAC) design separately, providing a standard communication interface between these two components in the system.

In recent years, the PIPE interface specification has incorporated many enhancements to support new features and advancements happening in the supported protocols. As the supported features increase, so does the count of signals on PIPE interface. To address the issue of increasing signal count, the message bus interface was introduced in PIPE 4.4 and utilized for PCIe lane margining at the receiver and elastic buffer depth control.

In PIPE 5.0, all the legacy PIPE signals without critical timing requirements were mapped into message bus registers so that their associated functionality could be accessed via the message bus interface instead of implementing dedicated signals. It was decided that any new feature added in the new version of PIPE specification will be available only via message bus accesses unless they have critical timing requirements that need dedicated signals.

Message Bus Interface

The message bus interface provides a way to initiate and participate in non-latency-sensitive PIPE operations using a small number of wires. It also enables future PIPE operations to be added without adding additional wires. The use of this interface requires the device to be in a power state with PCLK running.

Control and status bits used for PIPE operations are mapped into 8-bit registers that are hosted in 12-bit address spaces in the PHY and the MAC. The registers are accessed using read-and-write commands driven over the signals M2P_MessageBus[7:0] and P2M_MessageBus[7:0]. These signals are synchronous with the PCLK and are reset with Reset#.

Message Bus Interface Commands

The 4-bit commands are used for accessing the PIPE registers across the message bus. A transaction consists of a command and any associated address and data.

All the following are time multiplexed over the bus from MAC and PHY:

  1. Commands (write_uncommitted, write_committed, read, read completion, write_ack)
  2. 12-bit address used for all types and read and writes
  3. 8-bit data, either read or written

There can be cases where multiple PIPE interface signals can change on the same PCLK. To address such cases, the concept of write_uncommitted and write_committed is introduced.

The uncommitted write should be saved into a write buffer, and its associated data values are updated into the relevant PIPE register at a future time when a write_committed is received, taking effect during the same PCLK cycle. Once a write_committed is sent, no new writes, whether committed or uncommitted, and any read command may be sent until a write_ack is received. Also, it is allowed to send NOP commands between write uncommitted and write committed. 

A simple timing demonstration of message bus:

Message Address Space

MAC and PHY each implement unique 12-bit address spaces. These address spaces will host registers associated with the PIPE operations. MAC accesses PHY registers using M2P_MessageBus[7:0], and PHY accesses the MAC registers using the M2P_MessageBus[7:0].

The MAC and PHY access specific bits in the registers to: initiate operations, Initiate handshakes, and Indicate status.

Each 12-bit address space is divided into four main regions: the receiver address region, the transmitter address region, the common address region, and the vendor-specific address region.

Each register field has an attribute description of either level or 1-cycle assertion. When a level field is written, the value written is maintained by the hardware until the next write to that field or until a reset occurs. When a 1-cycle field is written to assert the value high, the hardware maintains the assertion for only a single cycle and then automatically resets the value to zero on the next cycle.

Cadence has a mature Verification IP solution for the verification of various aspects and topologies of PIPE PHY design. For more details, you may refer to the Simulation VIP for PIPE PHY | Cadence page, or you may send an email to support@cadence.com.




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Cadence Fem.AI Summit: A Journey of Inspiration

This year, the Cadence Giving Foundation (CGF) launched Fem.AI to achieve a more inclusive tech sector, and the inaugural Fem.AI Summit that took place on October 1 was a luminary in a world where technology is evolving at an unprecedented pace. The summit not only excelled in its mission to enlighten, empower, and mobilize stakeholders across various industries on the issue of gender disparity in high tech and AI, but was a celebration of innovation, diversity, and empowerment. As we reflect on the moments that made the summit unforgettable, it's clear that the event was more than just a meeting of minds—it was a movement for change! Shaping Tomorrow Together Cadence’s president and CEO, Anirudh Devgan, stated, “Women’s talent and perspectives are crucial to shaping the future of AI.” Devgan’s words epitomized the driving force behind the first-ever Fem.AI Summit which brought together innovators, educators, business leadership, and investors across industries to create an ecosystem that ensures women can fully participate in the AI revolution and burgeoning AI economy. The energy of pioneers ready to collectively disrupt the status quo filled the air, and as the day-long summit began, it became clear that we were part of something truly groundbreaking. The event's lineup of speakers held discussions that went beyond the technical aspects of AI, emphasizing the vital importance of diversity in technology. Such insights were lent by leading voices from MIT, Stanford, and UC Berkeley, who set the stage for inspiring discussions with speakers like Dr. Joy Buolamwini, Founder of the Algorithmic Justice League, and Reshma Saujani, Founder and CEO of Moms First and Girls Who Code. Included in this lineup of leading figures was Dr. Chelsea Clinton, Vice Chair of the Clinton Foundation, who left us with her hopes for the future of women in AI: “I’m hoping because of company-wide commitments like what we’re experiencing here today thanks to Cadence, that the people who will be part of designing [future technologies] will have a different group of people around the proverbial table or the computer screens doing that… and that women will be more integral into the conceptualization and then the actualization of AI-driven enterprises.” The hopes and visions for women in AI cannot manifest in a vacuum, they must be achieved with the support of individuals and systems from education all the way to the upper echelons of leadership. It is with this understanding, that Fem.AI is committed to investing in women at every stage of their STEM journey. Breaking Barriers It is with this ideal that we were honored to hear from women breaking through barriers of gender, race, and class in achieving pinnacles of success in areas of science and technology. Dr. Sarah H. Chen, Postdoctoral Researcher at Stanford and Thriving Stars Scholar at MIT, Niki Karanikola, Machine Learning Engineer and Break Through Tech AI Scholar at MIT, and Katya Echazarreta, NASA’s first Mexican Astronaut, showcased the resilience and determination that drive progress within and beyond our industry. Through their stories of persevering despite all odds, we were reminded that supporting students in STEM can create generational change with impacts beyond the realms of AI and technology. The final speaker at the Cadence Fem.AI Summit, the trailblazing Brandi Chastain, Founder of Bay FC, World Cup Champion, and Olympic Gold Medalist, left us with a powerful reminder that when faced with this opportunity: “Our purpose needs to be intentional” especially in building the future of technology and AI where “diversity is not something to be afraid of, but something to be embraced.” Echoing this sentiment, summit attendees left the event reminded of the crucial role we collectively play in ensuring women are part of this tech revolution. Moving Forward While the summit may have concluded, its impact will continue through individuals, companies, and communities aspiring to achieve an equitable tech sector. This is just the start, and we must take collective action now. We hope that you will join Cadence to ensure that we clear the path and catalyze women's role in the AI revolution! Meet Our Partners Our partners are making Fem.AI’s vision a reality through their important work advancing women in technology, including fostering STEM excellence in higher education, launching STEM careers, and achieving gender diversity in leadership. Learn more about the important work of each of our partners by visiting their pages: Break Through Tech Last Mile Education Fund Fast Forward Generation VC Include Global Semiconductor Alliance Join the Fem.AI Alliance Joining the Fem.AI Alliance signals that your company or institution is committed to evolving the AI workforce. By increasing the representation of women in AI, we aim to broaden the talent pool and the perspective so that AI represents us all. Through the Fem.AI Alliance, companies and institutions can share best practices, guidance, and inspiration. Since its launch, companies like the Equinix Foundation, NetApp, NVIDIA, Unity Technologies, and Workday have joined the Alliance in their commitment to Fem.AI’s work and mission. Visit Fem.AI to get involved today or contact Fem.AI@cadence.com .




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Using oscillograph waveform file CSV as the Pspice simulation signal source

hi,

     I save the waveform file of the oscilloscope as CSV file format.

     Now, I need to use this waveform file as the source of the low-pass filter .

     I searched and read the PSPICE help documents, and did not find any  methods. 

     How to realize it?

     Are there any reference documents or examples?

     Thanks!

    




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Path mapping for C Firmware source files when debugging

Hi,

i am compiling firmware under Windows transfer the binaries and the sources to Linux to simulate/debug there. The problem is that the paths in the DWARF debug info of the .elf file are the absolute Windows paths as set by the compiler so they are useless under Linux. Is it possible to configure mappings of these paths to the Linux paths when simulating/debugging like with e.g. GDB (https://sourceware.org/gdb/current/onlinedocs/gdb/Source-Path.html#index-set-substitute_002dpath)?

thx,

Peter




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LM117 Spice Model

I am looking for LM117 Pspice model. Can someone send me the file. Thank you




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Matlab cannot open Pspice, to prompt orCEFSimpleUI.exe that it has stopped working!

Cadence_SPB_17.4-2019 + Matlab R2019a

请参考本文档中的步骤进行操作

1,打开BJT_AMP.opj

2,设置Matlab路径

3,打开BJT_AMP_SLPS.slx

4,打开后,设置PSpiceBlock,出现或CEFSimpleUI.exe停止工作

5,添加模块

6,相同

7,打开pspsim.slx

8,相同

9,打开C: Cadence Cadence_SPB_17.4-2019 tools bin

orCEFSimpleUI.exe和orCEFSimple.exe

 

10,相同

我想问一下如何解决,非常感谢!




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QSPI Direct Access bare metal SW driver

Hello,

I'm reading the Design specification for IP6514E.

We will use the DAC mode.

It would seem to be very simple but I don't see any code sequence, i.e.

  1.Write 03(Basic Read) to this register

  2, Write start adress to this register

  3. Write "execute" to this register

  4. Read the data from this register

Thanks,

Stefan




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Xtensa compiler issue

Hi 

I have a Xtensa compiler issue that the compilation for switch case would be optimized in some patterns and leads to unexpected result. I cross-checked the assembly code and found that such compiler optimization seems to be similar to the tree-switch-conversion feature in GCC compiler

Unfortunately I don't find any similar compiler option(like -fno-tree-switch-conversion) in Xtensa compiler(XCC) to enable/disable such feature and such feature seems like enabled in XCC by default even if I'm using -O0 for the least optimization.

I'm wondering if there's any possible solution to permanently disable such feature in XCC?

PS: The release version of XCC compiler I'm using is RD-2012.5

Thanks!




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Can I align pin numbers in edit part windows in Orcad Capture?

Hello..

I'm updating part in part editor in orcad capture, and I wonder how to align pin numbers using menu or tcl/tk command.

Please, let me know. Thank you.




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The default location of orCAD Capture library Pin Number is incorrect

The default position of the pin number is incorrect.




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Allegro part of DPI does not support scaling above 150%

Allegro part of DPI does not support scaling above 150%




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How to use PSpice library in Virtuoso/Spectre?

I want to use PSpice model (download from TI) in Virtuoso , but it can not work. Please help me to check the error message, Thanks

ADE-> Setup-> simulation files->Pspice  Files  /TPS628502-Q1_TRANS.LIB

Parse error before token ']' in expression '[[STEADY_STATE]*0.6]'. If '[[STEADY_STATE]*0.6]'  is a spice expression, quotes are required for the expression.

ERROR(SFE-46): An instance of 'TPS628502-Q1_TRANS'  can have at most 8 terminals (but has 9).

*****************************************************************************
.SUBCKT TPS628502-Q1_TRANS COMP_FSET EN FB GND PG SW SYNC_MODE VIN
+ PARAMS: STEADY_STATE=0
V_U9_V45 U9_N16725824 0 5
E_U9_ABM22 U9_N16725392 0 VALUE { V(FREQ)*1e-12 }
X_U9_U161 U9_N16849713 U9_N16846056 one_shot PARAMS: T=20




pi

UVM Adapter for Pipelined protocols like AHB, AXI etc

Hello,

I have been running this `uvm_reg_hw_reset_seq` sequence for the AHB protocol. My UVM Adapter looks like:


Issue: When I use basic reg.write, my write access are working well, as that is managed by the driver i.e. once adapter gives the packet to the driver, the driver supplies the address and the control signals to the DUT on the first clock cycle and then the write data on the next clock cycle. But when I am performing the read operation, somehow the UVM adapter is reading the data at the same clock cycle where read address + Controls are supplied and this is triggering read failure messages from the `uvm_reg_hw_reset_seq` sequence. What should I modify in the driver/sequencer/adapter so that the UVM adapter can read the data on the next cycle instead of the same clock cycle.

Just FYI: The waveforms of the read operation are correct, it is just the Adapter and the `uvm_reg_hw_reset_seq`. The AHB Driver + AHB Monitor is fully proven and verified to be working correctly.




pi

SI/PI Simulation and Measurement Correlation Forum

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pi

Colpitts Oscillator output power simulation

Hello everybody,

As you can find in the attached image, I am trying to simulate a Colpitts oscillator. However, using pss analysis it shows a high output power. 

My question is where is the problem of my structure or simulation setup?

Best,




pi

Knowledge Booster Training Bytes - Virtuoso Pin-To-Trunk Routing

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pi

Smd pin to smd pin spacing

Hello,

Trying to figure out why this situation does not generate a DRC error.

A resistor was accidently placed so the pad was on top of another pad. See picture:

I have checked the CM and both Spacing Constraint Set and Same Net Spacing Constraint Set have Smd pin to Smd pin set to 0.1 mm.

I'm using Allegro PCB designer 22.1.

If someone has an idea why this does not give a DRC i would appreciate it. Thanks.

Regards,

Filip




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