With the NFL offseason going virtual, how will teams adapt and what changes can we expect heading into the summer? We answer all of your questions.

Ryan Farley drew on an emotional moment with his dying father to write a memorable scene in the Netflix show -- and express frustration with the Lions.

Brett Favre on Friday disputed a Mississippi state auditor's report that said the Hall of Fame quarterback received $1.1 million in welfare money for multiple speaking engagements that he didn't actually attend.

Former Auburn defensive tackle Derrick Brown became the first player chosen in the NFL draft's first round to agree on a deal. The Panthers will sign him to a four-year, fully guaranteed contract worth $23.62 million.

D.K. Metcalf says the best advice he received as a rookie was to sit down last at team meetings, as it set the tone for his approach to everything.

The top overall pick in this year's draft said he hasn't signed his contract with the team as he's in a holding period because of the coronavirus pandemic.

NCAA Division II, Emporia State University served as the 2^ndmeet of the Outdoor Track and Field season for the Indians.  Highlights from the meet include:

Ian Stand, a sophomore from Bay Point, California returned to the discus ring and completed a toss of 36.52 meters, an improvement from his first meet.  Stand, also earned a seventh place finish in the shot put with a distance of 10.76 meters. 

With more and more SoCs employing sophisticated interconnect IP to link multiple processor cores, caches, memories, and dozens of other IP functions, the designs are enabling a new generation of low-power servers and high-performance mobile devices. The complexity of the interconnects and their advanced configurability contributes to already formidable design and verification challenges which lead to the following questions:

While your interconnect subsystem might have a correct functionality, are you starving your IP functions of the bandwidth they need? Are requests from latency-critical initiators processed on time? How can you ensure that all applications will receive the desired bandwidth in steady-state and corner use-cases?

To answer these questions, Cadence recommends the Performance Verification Methodology to ensure that the system performance meets requirements at the different levels:

1. Performance characterization: The first level of verification aims to verify the path-to-path traffic measuring the performance envelope. It targets integration bugs like clock frequency, buffer sizes, and bridge configuration. It requires to analyze the latency and bandwidth of design’s critical paths.
2. Steady state workloads: The second level of verification aims to verify the master-by-master defined loads using traffic profiles. It identifies the impact on bandwidth when running multi-master traffic with various Quality-of-Service (QoS) settings. It analyzes the DDR sub-system’s efficiency, measures bandwidth and checks whether masters’ QoS requirements are met.
3. Application specific use cases: The last level of verification simulates the use-cases and reaches the application performance corner cases. It analyzes the master-requested bandwidth as well as the DDR sub-system’s efficiency and bandwidth.

Cadence has developed a set of tools to assist customers in performance validation of their SoCs. Cadence Interconnect Workbench simplifies the setup and measurement of performance and verification testbenches and makes debugging of complex system behaviors a snap. The solution works with Cadence Verification IPs and executes on the Cadence Xcelium® Enterprise Simulator or Cadence Palladium® Accellerator/Emulator, with coverage results collected and analyzed in the Cadence vManager  Metric-Driven Signoff Platform.

To verify the performance of the Steady State Workloads, Arm has just released a new AMBA Adaptive Traffic Profile (ATP) specification which describes AMBA abstract traffic attributes and defines the behavior of the different traffic profiles in the system.

With the availability of Cadence Interconnect Workbench and AMBA VIP support of ATP, early adopters of the AMBA ATP specification can begin working immediately, ensuring compliance with the standard, and achieving the fastest path to SoC performance verification closure.

For more information on the AMBA Adaptive Traffic Profile, you can visit Dimitry's blog on AMBA Adaptive Traffic Profiles: Addressing The Challenge. 

More information on Cadence Interconnect Workbench solution is available at Cadence Interconnect Solution webpage.

Thierry

I’m coming to the party late—last weekend, for the first but not the last time, I watched Manish Acharya’s comedy, Loins of Punjab Presents. Behan____, what a film! 

I will not rehearse the synopsis or plot, partly because of the lateness of the hour, but also because it is available here. Instead, let me note quickly that the comedy keeps ticking, and the attention to detail in all matters, from the plot to the casting, makes this film a pleasure to watch.

Let me use one scene to make a point about where the film is coming from. Ishitta Sharma, playing a demure, Gujju girl called Preeti Patel, is one of the competitors in the Desi Idol competition in New Jersey. We have watched her sing beautifully, and we have watched her stay silent, eyes downcast, as her family-members make fools of themselves. But there’s a moment later in the film, when an older, wily competitor, played with classy ease by Shabana Azmi, tries to manipulate her. And suddenly, in the blink of an eye, Preeti Patel turns upon the Shabana character. It’s as if she always had a dagger hiding in her hand.

When I saw that, I thought that there was a similar strength in the movie I was watching. It’s all laughs but it has a quicksilver intelligence within. It is a declaration of independence by the desi diaspora—and what is great is that it celebrates this freedom by mocking, and loving, almost everything in sight.

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Sample clues

5 across: The US president’s bird (3,5,3)

11 down: Group once known as the Quarrymen (7)

10 across: Cavalry sword (5)

19 across: Masonic ritual (5,6)

1 down: Pioneer of Ostpolitik (6)

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Sample clues

14 across: FDR’s baby (3,4)

1 down: A glitch in the Matrix? (4,2)

4 down: Slanted character (6)

5 down: New Year’s venue in New York (5,6)

16 down: Atmosphere of melancholy (5)

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Sample clues

6 across: Alejandro González Iñárritu’s breakthrough film (6,6)

19 across: Soft leather shoe (8)

7 down: Randroids, for example (12)

12 down: First American World Chess Champion (7)

17 down: Circle of influence (5)

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Sample clues

5 across: Robbie Robertson song about Richard Manuel (6,5)

2 down: F5 on a keyboard (7)

10 across: Lionel Richie hit (5)

3 down: ALTAIR, for example (5)

16 down: The problem with Florida 2000 (5)

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Sample clues

9 across: Van Morrison classic from Moondance (7)

6 down: Order beginning with ‘A’ (12)

6 across: Fatal weakness (8,4)

19 across: Rolling Stones classic (12)

4 down: Massacre tool (8)

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In the book “The World of _____” by Bennett Alan Weinberg and Bonnie K Bealer, there is a photograph of a label from a jar of pharmaceutical-grade crystals. It reads:

“WARNING: MAY BE HARMFUL IF INHALED OR SWALLOWED. HAS CAUSED MUTAGENIC AND REPRODUCTIVE EFFECTS IN LABORATORY ANIMALS. INHALATION CAUSES RAPID HEART RATE, EXCITEMENT, DIZZINESS, PAIN, COLLAPSE, HYPOTENSION, FEVER, SHORTNESS OF BREATH. MAY CAUSE HEADACHE, INSOMNIA, VOMITING, STOMACH PAIN, COLLAPSE AND CONVULSIONS.”

Fill in the blank.

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Formal verification is a complex technology that has traditionally required experts or specialized teams who stood apart from the IC design and verification flow. Taking a different approach, a new release of the Cadence JasperGold formal verification platform (June 8, 2015) provides formal techniques that complement simulation, emulation, and debugging in the form of “Apps” or under-the-hood solutions that any design or verification engineer can use.

JasperGold was the initial (in fact only) product of Jasper Design Automation, acquired by Cadence in 2014. Jasper pioneered the formal Apps concept several years ago. While the company had previously sold JasperGold as a one-size-fits-all solution, Jasper began selling semi-automated JasperGold Apps that solved specific problems using formal analysis technology.

The new release is the next generation of JasperGold and will be available later this month. It includes three major improvements over previous Cadence and Jasper formal analysis offerings:

• A unified Cadence Incisive and JasperGold formal verification platform delivers up to 15X performance gain over previous solutions.
• JasperGold is integrated into the Cadence System Development Suite, where it provides formal-assisted simulation, emulation, and coverage. As a result, System Development Suite users can find bugs three months earlier than existing verification methods.
• JasperGold’s formal analysis engines are integrated with the recently announced Indago debug platform, automating root cause analysis and on-the-fly, what-if exploration.

Best of Both Formal Verification Worlds

Taking advantage of technologies from both Cadence and Jasper, the new JasperGold represents a “best of both worlds” solution, according to Pete Hardee, product management director at Cadence. This solution combines technologies from the Cadence Incisive Enterprise Verifier and Incisive Formal Verifier with JasperGold formal analysis engines.

For example, to ease migration from Incisive formal tools, Cadence has integrated an Incisive common front end into the JasperGold apps platform. Jasper formal engines can run within the Incisive run-time environment. Cadence has also brought some selected Incisive formal engines into JasperGold.

As shown to the right, the JasperGold platform supports both the existing JasperGold front-end parser and the Incisive front-end parser. Hardee observed that this dual parser arrangement simplifies migration from Incisive formal tools to JasperGold, and provides a common compilation environment for people who want to use JasperGold with Incisive simulation. Further, the common run-time environment enables formal-assisted simulation.

The combination of JasperGold engines and Incisive engines supports two use models for formal analysis: formal proofs and bug hunting. In the first case, formal engines try all combinations of inputs without a testbench. The test is driven by formal properties written in languages such as SVA (SystemVerilog assertions) or PSL (Property Specification Language). Completion of a property is exhaustive proof that something can or cannot happen. This provides a “much stronger result” than simulation, Hardee said.

He also noted that formal analysis doesn’t necessarily require that all properties are completed. “You can get a lot of value even if proofs don’t complete,” he said. “Proofs that run deep enough to find bugs are just fine.”

Bug hunting involves random searches, and JasperGold bug hunting engines are very fast. However, these engines don’t necessarily use the most optimal path to get to a bug. So, Cadence engineers brought a constraint solver from Incisive and integrated it into JasperGold. “It looks at the constraints in the environment and gives you a better starting point,” Hardee said. “It takes more up-front time, but once you’ve done that the bug hunting engines can actually take a shorter path and find a bug a lot quicker.”

Another new JasperGold capability from the Incisive Formal Verifier is called “search pointing.” This uses simulation to penetrate deeply into the state space, and then kicks off a random formal search from a given point that you’ve reached in simulation. This technique makes it possible to find bugs that are very deep in the design.

It is probably clear by now that a number of different formal “engines” may be required to solve a given verification problem. Traditionally, a formal tool (or user) will farm a problem out to many engines and see which one works best. To put more intelligence into that process, Cadence launched the Trident “multi-cooperating engine” a couple of years ago. That has now been brought into JasperGold, where it helps “orchestrate” the engines according to what will work best for the design. This is a big part of the reason for the 15X speedup noted earlier in this post.

Integration with System Development Suite

The Cadence System Development Suite is an integrated set of hardware/software development and verification engines, including virtual prototyping, Incisive simulation, emulation, and FPGA-based prototyping. As shown below, JasperGold technology is integrated into the System Development Suite in several places, including formal-assisted debug, formal-assisted verification closure, formal-assisted simulation, formal-assisted emulation, and the Incisive vManager verification planning tool.

Formal-assisted emulation sounds like it should be easy, especially since Cadence has both accelerated verification IP (VIP) and assertion-based VIP. However, there’s a complication. Accelerated VIP represents less verification content than simulation VIP, because you have to remove many checkers to get VIP to compile on a Palladium emulator. That’s because the Palladium requires synthesizable code.

What you can do, however, is use assertion-based VIP in “snoop mode” as shown below. Assertion-based VIP coded in synthesizable SystemVerilog can replace the missing checkers in accelerated VIP. In this diagram, everything in the green box is running in the emulator and is thus completely accelerated.

Another example of formal-assisted emulation has to do with deep traces. As Hardee noted, emulation will produce very long traces, and it can be very difficult to find a point of interest in the trace and determine what caused an error. With formal-assisted emulation, users can find interesting events within the traces and create properties that mark them, so a debugger can find these events and trace back to the root cause.

Formal-assisted verification closure is available with the new JasperGold release. This is possible because you can use the vManager product to determine which tasks were completed by formal engines. It’s important information for verification managers who are not used to formal tools, Hardee noted.

Another aspect of formal-assisted verification closure is the JasperGold Unreachability Analysis (UNR) App, which can save simulation users weeks of time and effort. This App takes in the simulation coverage database and RTL, and automatically generates properties to explore coverage holes and determine if holes are reachable or unreachable. The App then generates an unreachable coverage point database. If the unreachable code does something useful, there’s a bug in the design or the testbench; if not, you don’t have to worry about it. The diagram below shows how it works.

Formal-Assisted Debugging

The third major component of the JasperGold announcement is the integration of formal analysis into the Indago debugging platform. As shown below, this platform has several apps, including the Indago Debug Analyzer. Two formal debug capabilities from the Jasper Visualize environment have been added to the the Indago Debug Analyzer:

• Highlight Relevant Logic: This highlights the “cone of influence,” or the logic that is involved in reaching a given point
• Why: This button highlights the immediate causes for a given event, and allows users to trace backwards in time

More formal capabilities will come with the Indago Advanced Debug Analyzer app, scheduled for release towards the end of 2015. This includes Quiet Trace, a Jasper capability that reduces trace activity to transactions relevant to an event. Also, a what-if analysis allows on-the-fly trace editing and recalculation to explore effects and sensitivities, without having to re-compile and re-execute the simulation.

Finally, Cadence has a Superlint flow that is now fully integrated with the JasperGold Visualize debugger. This two-tiered flow includes a basic lint capability as well as automated formal analysis based on the JasperGold Structural Property Synthesis app. “This could be a very good entry point for designers to start using formal,” Hardee said.

“Formal is taking off,” Hardee concluded. “People are no longer talking about return on investment for formal—they have established that. Now they’re supporting a proliferation of formal in their companies such that a wider set of people experience the benefit from that proven return on investment.”

Further information is available at the JasperGold Formal Verification Platform (Apps) page.

Richard Goering

Related Blog Posts

- JUG Keynote—How Jasper Formal Verification Technology Fits into the Cadence Flow

- Why Cadence Bought Jasper—A New Era in Formal Analysis

- Q&A: An R&D Perspective on Formal Verification—Past, Present and Future

First, the good news. The EDA industry will grow from $6.2 billion in 2015 to $9.0 billion in 2019, according to Gary Smith, chief analyst at Gary Smith EDA. Year-to-year growth rates will range from +4% to +11.2%.

But in his annual presentation on the eve of the Design Automation Conference (DAC 2015), Smith noted that Wall Street is unimpressed. “The people I talk to want long-term steady growth, no sharp up-turns, no sharp downturns,” Smith said. “To the rest of Wall Street, we’re boring.”

Smith spent the rest of his talk noting how EDA can be a lot less boring and, potentially, a whole lot bigger. For starters, what if we add semiconductor IP to EDA revenues? Now we’re looking at $12.2 billion in revenue by 2019, Smith said. (He acknowledged, however, that the IP market itself is going to take a “dip” due to the move towards platform-based IP and away from conventional piecemeal IP).

This still is not enough to get Wall Street’s attention. Another possibility is to bring embedded software development into the EDA industry. This is not a huge market – about $2.6 billion today – but it is an “easy growth market for us,” according to Smith.

Chasing the Big Bucks

But the “big bucks” are in mechanical CAD (MCAD), Smith said. In the past the MCAD market has always been bigger than EDA, but now EDA is catching up. The MCAD market is about $6.6 billion now. Synopsys and Cadence are larger than PTC and Siemens, two of the main players in MCAD.

There may be some good acquisition possibilities coming up for EDA vendors, Smith said – and if we don’t buy MCAD companies, they might buy EDA companies. Consider, for example, that Ansoft bought Apache and Dassault bought Synchronicity. (Note: Siemens PLM Software is a first-time exhibitor at DAC 2015).

What about other domains? Smith said that EDA companies could conceivably move into optical design, applications development software, biomedical design, and chemical design. The last if these is probably the most tenuous; Smith noted that EDA vendors have yet to look into chemical design.

Applications development software is the biggest market on the above list, but that means competing with Microsoft, IBM, and Oracle. “You’re in with the big boys – is that a good idea?” Smith asked.

Perhaps there’s an opening for a “big play” for an MCAD provider. Smith noted that mechanical vendors are focusing on product data management (PDM). This “is really the IT of design,” Smith said. “They have a lot of hope that the IoT [Internet of things] market is going to give them an opportunity to capture the software that goes from the ground to the cloud. Maybe we can let them have PDM and see if we can take the tool market away from them, or acquire it away from them.”

In conclusion, Smith asked, should the EDA industry accelerate its growth? “The mechanical vendors have already shown interest in acquiring EDA vendors,” he said. “We may not have a choice.”

Richard Goering

NOTE: Catch our live blog from DAC 2015, beginning Monday morning, June 8! Click here

Let’s face it – the EDA industry needs new people and new ideas. One of the best places to find both is academia, and a presentation at the Cadence Theater at the recent Design Automation Conference (DAC 2015) described collaboration models that are working today.

The presentation was titled “Industry/Academia Engagement Models – From PhD Contests to R&D Collaborations.” It included these speakers, shown from left to right in the photo below:

• Prof. Xin Li, Electrical and Computer Engineering, Carnegie-Mellon University (CMU)
• Chuck Alpert, Senior Software Architect, Cadence
• Prof. Laleh Behjat, Department of Electrical and Computer Engineering, University of Calgary

Alpert, who was filling in for Zhuo Li, Software Architect at Cadence, was the vice chair of DAC 2015 and will be the general chair of DAC 2016 in Austin, Texas. “My team at Cadence really likes to collaborate with universities,” he said. “We’re a big proponent of education because we really need the best and brightest students in our industry.”

Contests Boost EDA Research

One way that Cadence collaborates with academia is participation in contests. “It’s a great way to formulate problems to academia,” Alpert said. “We can have the universities work on these problems and get some strategic direction.”

For example, Cadence has been involved with the annual CAD contest at the International Conference on Computer-Aided Design (ICCAD) since the contest was launched in 2012. This is the largest worldwide EDA R&D contest, and it is sponsored by the IEEE Council on EDA (CEDA) and the Taiwan Ministry of Education. Its goals are to boost EDA research in advanced real-world problems and to foster industry-academia collaboration.

Contestants can participate in one of more problems in the three areas of system design, logic synthesis and verification, and physical design. The 2015 contest has attracted 112 teams from 12 regions. Cadence contributes one problem per year in the logic synthesis area. Zhuo Li was the 2012 co-chair and the 2013 chair. The awards will be given at ICCAD in November 2015.

Another step that Cadence has taken, Alpert said, is to “hire lots of interns.” His own team has four interns at the moment. One advantage to interning at Cadence, he said, is that students get to see real-world designs and understand how the tools work. “It helps you drive your research in a more practical and useful direction,” he said.

The Cadence Academic Network co-sponsors the ACM SIGDA PhD Forum at DAC, and Xin Li and Zhuo Li are on the organizing committee. This event is a poster session for PhD students to present and discuss their dissertation research with people in the EDA community. This year’s forum was “packed,” Alpert said, and it’s clear that the event needs a bigger room.

Finally, Alpert noted, Cadence researchers write and publish technical papers at DAC and other conferences, and Cadence people serve on the DAC technical program committee. “We try to be involved with the academic community on a regular basis,” Alpert said. “We want the best and the brightest people to go into EDA because there is still so much innovation that’s needed. It’s a really cool place to be.”

Research Collaboration Exposes Failure Rates

Xin Li presented an example of a successful research collaboration between CMU and Cadence. The challenge was to find a better way to estimate potential failure rates in memory. As noted in a previous blog post, PhD student Shupeng Sun met this challenge with a new statistical methodology that won a Best Poster award at the ACM SIGDA PhD Forum at DAC 2014.

The new methodology is called Scaled-Sigma Sampling (SSS). It calculates the failure rate and accounts for variability in the manufacturing process while only requiring a few hundred, or a few thousand, sample circuit blocks. Previously, millions of samples were required for an accurate validation of a new design, and each sample could take minutes or hours to simulate. It could take a few weeks or months to run one validation.

The SSS methodology requires greatly reduced simulation times. It makes it possible, Li noted, to run simulations overnight and see the results in the morning.

Li shared his secret for success in collaborations. “I want to emphasize that before the collaboration, you have to understand the goal. If you don’t have a clear goal, don’t collaborate. Once you define the goal, stick to it and make it happen.”

Contest Provides Learning Experience

Last year Laleh Behjat handed two of her new PhD students a challenge. “I told them there is an ISPD [International Symposium for Physical Design] contest on placement, and I expect you to participate and I expect you to win. Not knowing anything about placement, I don’t think they realized what I was asking them.”

The 2015 contest was called the Blockage-Aware Detailed Routing-Driven Placement Contest. Results were announced at the end of March at ISPD. And the University of Calgary team, despite its lack of placement experience, took second place.

Such contests provide a good learning tool, according to Behjat. Graduate students in EDA, she said, “have to be good programmers. They have to work in teams and be collaborative, be able to innovate, and solve the hardest problems I have seen in engineering and science. And they have to think outside the box.” A contest can bring out all these attributes, she said.

Further, Behjat noted, contest participants had access to benchmarks and to a placement tool. They didn’t have to write tools to find out if their results were good. Industry sponsors, meanwhile, got access to good students and new approaches for solving problems.

“You can see Cadence putting a big amount of time, effort and money to get students here and get them excited about doing contests,” she said. She advised students in the theater audience to “talk to people in the Cadence booth and see if you can have more ideas for collaboration.”

Richard Goering

Related Blog Posts

EDA Plus Academia: A Perfect Game, Set and Match

Cadence Aims to Strengthen Academic Partnerships

BSIM-CMG FinFET Model – How Academia and Industry Empowered the Next Transistor

In 1985, as a relatively new editor at Computer Design magazine, I was asked to go forth and cover a new business called CAE (computer-aided engineering). I knew nothing about it, but I had been writing about design for test, so there seemed to be somewhat of a connection. Little did I know that “CAE” would turn into “EDA” and that I’d write about it for the next 30 years, for Computer Design, EE Times, Cadence, and a few others.

Now that I’m about to retire, I’m looking back over those 30 years. What a ride it has been! By the numbers I covered 31 Design Automation Conferences (DACs), hundreds of new products, dozens of acquisitions and startups, dozens of lawsuits, and some blind alleys that didn’t work out (like “silicon compilation”). Chip design went from gate arrays and PLDs with a few thousand gates to processors and SoCs with billions of transistors.

In 1985 there were three big CAE vendors – Daisy Systems, Mentor Graphics, and Valid Logic. All sold bundled packages that included workstations and CAE software; in fact, Daisy and Valid designed and manufactured their own workstations. In the early 1980s a workstation with schematic capture and gate-level logic simulation might have set you back $120,000. In 1985 OrCAD, now part of Cadence, came out with a $500 schematic capture package running on IBM PCs.

Cadence and Synopsys emerged in the late 1980s, and by the 1990s the EDA industry was pretty much a software-only business (apart from specialized machines like simulation accelerators). Since the early 1990s the “big three” EDA vendors have been Cadence, Synopsys, and Mentor, giving the industry stability but allowing for competition and innovation.

Here, in my view, are some of the highlights that occurred during the past 30 years of EDA.

EDA is a Highlight

The biggest highlight in EDA is the existence of a commercial EDA industry! Marching hand in hand with the fabless semiconductor revolution, commercial EDA made it possible for hundreds of companies to design semiconductors, as opposed to a small handful that could afford large internal CAD operations and fabs. With hundreds of semiconductor companies as opposed to a half-dozen, there’s a lot more creativity, and you get the level of sophistication and intelligence that you see in your smartphone, video camera, tablet, gaming console, and car today.

CAE + CAD = EDA. This is not just a terminology issue. By the mid-1980s it became clear that front-end design (CAE) and physical design (CAD) belonged together. The big CAE vendors got involved in IC and PCB CAD, and presented increasingly integrated solutions. People got tired of writing “CAE/CAD” and “EDA” was born.

The move from gate-level design to RTL. This move happened around 1990, and in my view this is EDA’s primary technology success story during the past 30 years. Moving up in abstraction made the design and verification of much larger chips possible. Going from gate-level schematics to a hardware description language (HDL) revolutionized logic design and verification. Which would you rather do – draw all the gates that form an adder, or write a few lines of code and let a synthesis tool find an adder in your chosen technology?

Two developments made this shift in design possible. One was the emergence of commercial RTL synthesis (or “logic synthesis”) tools from Synopsys and other companies, which happened around 1990. Another was the availability of Verilog, developed by Gateway Design Automation and purchased by Cadence in 1989, as a standard RTL HDL. Although most EDA vendors at the time were pushing VHDL, designers wanted Verilog and that’s what most still use (with SystemVerilog coming on strong in the verification space).

IC functional verification underwent huge changes in the late 1990s and early 2000s, largely due to new technology developed by Verisity, which was acquired by Cadence in 2005. Before Verisity, verification engineers were writing and running directed tests in an ad-hoc manner. Verisity introduced or improved technologies such as pseudo-random test generation, coverage metrics, reusable verification IP, and semi-automated verification planning. The Verisity “e” language became a widely used hardware verification language (HVL).

The biggest way that EDA has expanded its focus has been through semiconductor IP. Today Synopsys and Cadence are leading providers in this area. Thanks to the availability of design and verification IP, many SoC designs today reuse as much as 80% of previous content. This makes it much, much faster to design the remaining portion. While IP began with fairly simple elements, today commercially available IP can include whole subsystems along with the software that runs on them. With IP, EDA vendors are providing not only design tools but design content.

Finally, the EDA industry has done an amazing job of keeping up with SoC complexity and with advanced process nodes. Thanks to intense and early collaboration between foundries, IP, and EDA providers, tools and IP have been ready for process nodes going down to 10nm.

Where Does ESL Fit?

In some ways, electronic system level (ESL) design is both a lowlight and a highlight. It’s a lowlight because people have been talking about it for 30 years and the acceptance and adoption have come very slowly. ESL is a highlight because it’s finally starting to happen, and its impact on design and verification flows could be dramatic. Still, ESL is vaguely defined and can be used to describe almost anything that happens at a higher abstraction level than RTL.

High-level synthesis (HLS) is an ESL technology that is seeing increasing use in production environments. Current HLS tools are not restricted to datapaths, and they produce RTL code that gives better quality of results than hand-written RTL. Another ESL methodology that’s catching on is virtual prototyping, which lets software developers write software pre-silicon using SystemC models. Both HLS and virtual prototyping are made possible by the standardization of SystemC and transaction-level modeling (TLM). However, it’s still not easy to use the same SystemC code for HLS and virtual prototyping.

And Now, Some Lowlights

Every new industry has some twists and turns, and EDA is no exception. For example, the EDA industry in the 1980s and 1990s sparked a lot of lawsuits. At EE Times my colleagues and I wrote a number of articles about EDA legal disputes, mostly about intellectual property, trade secrets, or patent issues. Over the past decade, fortunately, there have been far fewer EDA lawsuits than we had before the turn of the century.

Another issue that was troublesome in the 1980s and 1990s was so-called “standards wars.” These would occur as EDA vendors picked one side or the other in a standards dispute. For example, power intent formats were a point of conflict in the early 2000s, but the Common Power Format (CPF) and the Unified Power Format (UPF) are on the road to convergence today with the IEEE 1801 effort. As mentioned previously, Verilog and VHDL were competing for adoption in the early 1990s. For the most part, Verilog won, showing that the designer community makes the final decision about which standards will be used.

How on earth did there get to be something like 30 DFM (design for manufacturability) companies 10-12 years ago? To my knowledge, none of these companies are around today. A few were acquired, but most simply faded away. A lot of investors lost money. Today, VCs and angel investors are funding very few EDA or IP startups. There are fewer EDA startups than there used to be, and that’s too bad, because that’s where a lot of the innovation comes from.

Here’s another current lowlight -- not enough bright engineering or computer science students are joining EDA companies. They’re going to Google, Apple, Facebook, and the like. EDA is perceived as a mature industry that is still technically very difficult. We need to bring some excitement back into EDA.

Where Is EDA Headed?

Now we come to what you might call “headlights” and look at what’s coming. My list includes:

• System Design Enablement. This term has been coined by Cadence to describe a focus on whole systems or end products including chips, packages, boards, embedded software, and mechanical components. There are far more systems companies than semiconductor companies, leaving a large untapped market that’s looking for solutions.
• New frontiers for EDA. At a 2015 Design Automation Conference speech, analyst Gary Smith suggested that EDA can move into markets such as embedded software, mechanical CAD, biomedical, optics, and more.
• Vertical markets. EDA has until now been “horizontal,” providing the same solution for all market segments. Going forward, markets like consumer, automotive, and industrial will have differing needs and will need optimized tools and IP.
• Internet of Things. This is a current buzzword, but the impact on EDA remains uncertain. Many IoT devices will be heavily analog, use mature process nodes, and be dirt cheap. Lip-Bu Tan, Cadence CEO, recently pointed out that the silicon percentage of IoT revenue will be small and that a lot of the profits will be on the service side.

Moving On

For the past six years I’ve been writing the Industry Insights blog at Cadence.com. All things change, and with this post comes a farewell – I am retiring in late June and will be pursuing a variety of interests other than EDA. I’ll be watching, though, to see what happens next in this small but vital industry. Thanks for reading!

Richard Goering

Hi,

I'm a newbie and I'm working on a mixed-signal chip in Innovus. I've got a few analog LEF files that I've imported into my floorplan as macros.

My chip has got two power domains - VCC and VBAT.

One of the macro in the VBAT domain uses VBAT and GND as power rails myloweslife.com.

On doing Special-Route, I've got a lot of minute power rails for the standard cells, as expected.

But, the VBAT power rails are not getting extended till the outer power rings. Only the GND rails are correctly getting extended till the outer power rings.

A screen shot is attached for reference.

Thanks for any help

Hi,

  I wanted to open a discussion on the stylus flowtool.  My purpose is to see if there are users out there who are having success with the tool.  To have some discussions around issues that I am running into and to get a user point of view on the problems I am trying to solve.

  Let's start the conversation with : Is there anyone out there trying to use flowtool?  Do you have a centralized flow, or each user has their own?

Thanks, and I look forward to the conversations...

--Craig Crump

Hi,

I'm a newbie and I'm working on a mixed-signal chip in Innovus. I've got a few analog LEF files that I've imported into my floorplan as macros.

My chip has got two power domains - VCC and VBAT.

One of the macro in the VBAT domain uses VBAT and GND as power rails KrogerFeedback.com.

On doing Special-Route, I've got a lot of minute power rails for the standard cells, as expected.

But, the VBAT power rails are not getting extended till the outer power rings. Only the GND rails are correctly getting extended till the outer power rings.

A screen shot is attached for reference.

Thanks for any help

Respected sir,

How can i design and simulate cmos inverter using digital flow and also ineed to do prelayout ans post layout for the same cmos inverter..can i use cadence encounter for this experiments

Hi,

I was wondering if it is possible to save the coordinates of each stripe and row of the power grid 

and if it is possible to find out the effective resistance between two given points using Voltus

My goal is to built a resistance model of the power grid

Thanks

I have a set of pads for use in a design and I was wondering which attributes should I put on each pin.

Let's say it has the following pins:

   - inh_vdd, inh_vss, CORE, PAD where the first two are for the pad rings, the CORE pin is to use in the die and the PAD pin is the bonding pad.

I guess CORE would need:

   CLASS CORE

   USE POWER  (or GROUND if this happened to be a ground pad)

What about the inh_vdd and inh_vss? Theyu would not have the CLASS CORE, but would I use USE POWER/GROUND on them too?

   USE POWER (or GROUND)

   SHAPE ABUTMENT

And the bonding pad? Should I put it in the LEF? Or would that cause confusion to innovus or Voltus? And what attributed would it use? USE POWER/GROUND only?

Do I need anything in the LEF to indicate that the pin CORE and the pin PAD are essentially the same thing, just different places on the same power pad?

I recently received a student version or OrCad, which I was able to download and install without trouble. However, I do not know how to setup my license.

I received the license file in an email. The instructions within the file were to include my hostname and the absolute path. I do not know what the path should point to so I left it empty. 

I was able to setup the licence server using the license file without any issues. However, setting up the licence configuration utility gives the following messages:

A user environment variable name CDC_LIC_FILE is found. The CDC_LIC_FILE settings you make will be overwritten by this user level variable. Furthermore, I get the error:

ERROR: Unable to update the CDS_LIC_FILE license path environment variable. 

This is preventing me from using any of the software.

What are the steps to installing the license and how could I resolve this error?

Thank you

Hi,

When I import the top level Verilog file generated by Genus into Virtuoso, the power pins are left unconnected. I tried different configurations in "Global Net Options" tab. However, nothing changed. 

The cell is imported with three views, namely functional, schematic, and symbol. In www krogerfeedback com functional view everything looks OK, that is the top level Verilog file. In schematic, I can see the digital cells but VDD and VSS pins of the blocks are not connected. In the symbol view there are no pins for VDD and VSS. 

On top, we are trying to implement a digital block into Virtuoso. The technology is TSMC 65nm. On Genus and Innovus, everything goes straight and layout is generated successfully.

Thanks.

HI, I have been using the Innovus GUI commands for several things and wonder if those command can be written to a log or cmd file so I can use it in my flow script? Is there such options that we can set?

Thanks

Hi,

I am doing layout for a mixed-signal circuit in Innovus. I want to create a digital donut style of layout (i.e. put analog circuit in the middle, and circle analog part with digital circuits).

To do that, I need to place some pins inside the edge to connect to analog circuit (as shown in my attachment), but the problems is that I cannot place pins inside the edge by using "pin editor" within Innovus. Any suggestions to place pins inside?

Thank you so much for your time and effort.

Hello, i have a logic output from a D-flipflop which generates a reset signal with variable pulse width. I want to stretch this LOW pulse width with an extra 100ns added to the original pulse width digitally, is there any way to do that?

Dear all,

I am using Conformal Constraint Designer (Version 17.1) to analyse a SystemVerilog based design.

While performing default HDL checks it finds  some violations (issues) in RTL and complains (warnings, etc) about RTL checks and others.

My questions:

Is there any directive which I can add to RTL (system Verilog) so that particular line of code or signal is ignored or not checked for HDL or RTL checks.

I can set ignore rules in rule manager (gui) but it does not seems effective if code line number changes or new signals are introduced.

What is the best way to customize default_hdl_rules ?

I will be grateful for your guidance.

Thanks for your time.

As title,

How to dump waveform, fsdb in SimVision? 
(Simulation Analysis Environment  SimVision(64) 18.09-s001)
Please help.

Thanks.

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Hi,

I have a test session object that I am getting like this:

maeTstSession=maeGetTestSession(test ?session session)

Is it possible to get the test name from this object? I am asking because this object passed to several levels of functions and I don't want to pass an additional argument with the test name

Inside the scope of isCallable there is code which I don't want to be executed.

The procedure named in isCallable to-day is callable.

I want to make that procedure so it cannot be called.  How do I do that?

I can't change the isCallable line or the scope.  I want to change its behavior by making sure that the procedure does not exist (obviously this would be done before the code is executed).

I have a top cell & need to revise all the instances' cellview & export top cell as a new GDS file.

So I write a SKILL code to do so and I find out it will be a little bit slow by using the dbSave to save the cellview of each instance.

Code as below:

let( (topCV subCV )
topCV = dbOpenCellViewByType(newLibName topCellName "layout" "maskLayout" "a")
foreach(inst topCV->instances
subCV = dbOpenCellViewByType(newLibName inst->cellName "layout" "maskLayout" "a")
;;;revise code content
;;;...
;;;revise code content
dbSave(subCV)
dbClose(subCV)
)
dbSave(topCV)
dbClose(topCV)
system(strcat( "strmout -library " newLibName " -topCell " topCellName " -view layout -strmFile " resultFolder "/" topCellName ".gds -techLib " srcLibName " -enableColoring -logFile " topCellName "_strmOut.log" ) )
)

Even if the cell content is not revised, the run time of dbSave will be 2 minutes when there are ~ 1000 instances in topcell. The exported GDS file size is ~2MB.

And the dbSave becomes the bottle neck of the code runtime...

Is there any better way to do such a thing? 

HI All,

I am new to skill. My requirement is

open layout 

get m0 layer cordinates in a layout

dump info into a text file

For example 2 input Nand, A,B output , vcc , vssx and internal net (n2) will be the m0 layers. I need info like in a text file.

n2 co ordinate

vssx (co ordinate)

a (co ordinate)

b (co ordinate ) .

I found similar code in cadence form . Can you help me on this

 procedure(printPts()
let(    (type
    (cnt 0)
    (objList geGetSelSet()))

foreach(obj objList
    ++cnt
    type = obj~>objType
    case(type
        ("inst"
            printf("%s %L at %L " type obj~>xy))
        ("rect"
            printf("%s on layer %L at %L " type obj~>lpp obj~>bBox))
        ("polygon"
            printf("%s on layer %L at %L " type obj~>lpp obj~>points))
        ("path"
            printf("%s on layer %L at %L " type obj~>lpp obj~>points))
        ("pathSeg"
            printf("%s on layer %L at %L " type obj~>lpp list(obj~>beginPt obj~>endPt)))
        ("label"
            printf("%s on layer %L at %L " type obj~>lpp obj~>xy))
        (t    printf("%s not defined " type))
    )
)
printf("%n objects selected " cnt)
); end of let
); end of printPts

Hi,

I am trying add multiple choices to my radio field in cdf parameters. when i see the select the instance and try editing the Instance properties I can not view them in a single window. Instead i get a vertical sliding bar. Is there a way to display them in multiple rows?

-Haareeth

Hi there,

I'm running a transient simulation, and I want to get all instances with model implementation hisim_hv because after that I want to process the data and to adjust some parameters for this kind of devices before dumping the values.

What is the easiest/fastest way to get those instances in skill/ocean?

What I did until now: 

- save the final OP of the simulation and then in skill

openResults()
selectResults('tranOp)
report(?type "hisim_hv" ?param "vgs")

Output seems to be promising, and looks like I can redirect it to a file and after that I have to parse the file.

Is there other simple way? I mean to not save data to file and to parse it.

Eventually having an instance name, is it possible to get the model implementation (hsim_hv, bsim4, etc..)? 

Best Regards,

Marcel

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Hi all,

I have a question regarding the manufacture : how to check a cluster of same net vias spacing, with have no shape or cline covered

In this week’s Whiteboard Wednesdays video, Dave Apte discusses how to create the lowest power design possible by using architectural exploration and Cadence’s Stratus HLS solution....

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