In 1985, as a relatively new editor at Computer Design magazine, I was asked to go forth and cover a new business called CAE (computer-aided engineering). I knew nothing about it, but I had been writing about design for test, so there seemed to be somewhat of a connection. Little did I know that “CAE” would turn into “EDA” and that I’d write about it for the next 30 years, for Computer Design, EE Times, Cadence, and a few others.

Now that I’m about to retire, I’m looking back over those 30 years. What a ride it has been! By the numbers I covered 31 Design Automation Conferences (DACs), hundreds of new products, dozens of acquisitions and startups, dozens of lawsuits, and some blind alleys that didn’t work out (like “silicon compilation”). Chip design went from gate arrays and PLDs with a few thousand gates to processors and SoCs with billions of transistors.

In 1985 there were three big CAE vendors – Daisy Systems, Mentor Graphics, and Valid Logic. All sold bundled packages that included workstations and CAE software; in fact, Daisy and Valid designed and manufactured their own workstations. In the early 1980s a workstation with schematic capture and gate-level logic simulation might have set you back $120,000. In 1985 OrCAD, now part of Cadence, came out with a $500 schematic capture package running on IBM PCs.

Cadence and Synopsys emerged in the late 1980s, and by the 1990s the EDA industry was pretty much a software-only business (apart from specialized machines like simulation accelerators). Since the early 1990s the “big three” EDA vendors have been Cadence, Synopsys, and Mentor, giving the industry stability but allowing for competition and innovation.

Here, in my view, are some of the highlights that occurred during the past 30 years of EDA.

EDA is a Highlight

The biggest highlight in EDA is the existence of a commercial EDA industry! Marching hand in hand with the fabless semiconductor revolution, commercial EDA made it possible for hundreds of companies to design semiconductors, as opposed to a small handful that could afford large internal CAD operations and fabs. With hundreds of semiconductor companies as opposed to a half-dozen, there’s a lot more creativity, and you get the level of sophistication and intelligence that you see in your smartphone, video camera, tablet, gaming console, and car today.

CAE + CAD = EDA. This is not just a terminology issue. By the mid-1980s it became clear that front-end design (CAE) and physical design (CAD) belonged together. The big CAE vendors got involved in IC and PCB CAD, and presented increasingly integrated solutions. People got tired of writing “CAE/CAD” and “EDA” was born.

The move from gate-level design to RTL. This move happened around 1990, and in my view this is EDA’s primary technology success story during the past 30 years. Moving up in abstraction made the design and verification of much larger chips possible. Going from gate-level schematics to a hardware description language (HDL) revolutionized logic design and verification. Which would you rather do – draw all the gates that form an adder, or write a few lines of code and let a synthesis tool find an adder in your chosen technology?

Two developments made this shift in design possible. One was the emergence of commercial RTL synthesis (or “logic synthesis”) tools from Synopsys and other companies, which happened around 1990. Another was the availability of Verilog, developed by Gateway Design Automation and purchased by Cadence in 1989, as a standard RTL HDL. Although most EDA vendors at the time were pushing VHDL, designers wanted Verilog and that’s what most still use (with SystemVerilog coming on strong in the verification space).

IC functional verification underwent huge changes in the late 1990s and early 2000s, largely due to new technology developed by Verisity, which was acquired by Cadence in 2005. Before Verisity, verification engineers were writing and running directed tests in an ad-hoc manner. Verisity introduced or improved technologies such as pseudo-random test generation, coverage metrics, reusable verification IP, and semi-automated verification planning. The Verisity “e” language became a widely used hardware verification language (HVL).

The biggest way that EDA has expanded its focus has been through semiconductor IP. Today Synopsys and Cadence are leading providers in this area. Thanks to the availability of design and verification IP, many SoC designs today reuse as much as 80% of previous content. This makes it much, much faster to design the remaining portion. While IP began with fairly simple elements, today commercially available IP can include whole subsystems along with the software that runs on them. With IP, EDA vendors are providing not only design tools but design content.

Finally, the EDA industry has done an amazing job of keeping up with SoC complexity and with advanced process nodes. Thanks to intense and early collaboration between foundries, IP, and EDA providers, tools and IP have been ready for process nodes going down to 10nm.

Where Does ESL Fit?

In some ways, electronic system level (ESL) design is both a lowlight and a highlight. It’s a lowlight because people have been talking about it for 30 years and the acceptance and adoption have come very slowly. ESL is a highlight because it’s finally starting to happen, and its impact on design and verification flows could be dramatic. Still, ESL is vaguely defined and can be used to describe almost anything that happens at a higher abstraction level than RTL.

High-level synthesis (HLS) is an ESL technology that is seeing increasing use in production environments. Current HLS tools are not restricted to datapaths, and they produce RTL code that gives better quality of results than hand-written RTL. Another ESL methodology that’s catching on is virtual prototyping, which lets software developers write software pre-silicon using SystemC models. Both HLS and virtual prototyping are made possible by the standardization of SystemC and transaction-level modeling (TLM). However, it’s still not easy to use the same SystemC code for HLS and virtual prototyping.

And Now, Some Lowlights

Every new industry has some twists and turns, and EDA is no exception. For example, the EDA industry in the 1980s and 1990s sparked a lot of lawsuits. At EE Times my colleagues and I wrote a number of articles about EDA legal disputes, mostly about intellectual property, trade secrets, or patent issues. Over the past decade, fortunately, there have been far fewer EDA lawsuits than we had before the turn of the century.

Another issue that was troublesome in the 1980s and 1990s was so-called “standards wars.” These would occur as EDA vendors picked one side or the other in a standards dispute. For example, power intent formats were a point of conflict in the early 2000s, but the Common Power Format (CPF) and the Unified Power Format (UPF) are on the road to convergence today with the IEEE 1801 effort. As mentioned previously, Verilog and VHDL were competing for adoption in the early 1990s. For the most part, Verilog won, showing that the designer community makes the final decision about which standards will be used.

How on earth did there get to be something like 30 DFM (design for manufacturability) companies 10-12 years ago? To my knowledge, none of these companies are around today. A few were acquired, but most simply faded away. A lot of investors lost money. Today, VCs and angel investors are funding very few EDA or IP startups. There are fewer EDA startups than there used to be, and that’s too bad, because that’s where a lot of the innovation comes from.

Here’s another current lowlight -- not enough bright engineering or computer science students are joining EDA companies. They’re going to Google, Apple, Facebook, and the like. EDA is perceived as a mature industry that is still technically very difficult. We need to bring some excitement back into EDA.

Where Is EDA Headed?

Now we come to what you might call “headlights” and look at what’s coming. My list includes:

• System Design Enablement. This term has been coined by Cadence to describe a focus on whole systems or end products including chips, packages, boards, embedded software, and mechanical components. There are far more systems companies than semiconductor companies, leaving a large untapped market that’s looking for solutions.
• New frontiers for EDA. At a 2015 Design Automation Conference speech, analyst Gary Smith suggested that EDA can move into markets such as embedded software, mechanical CAD, biomedical, optics, and more.
• Vertical markets. EDA has until now been “horizontal,” providing the same solution for all market segments. Going forward, markets like consumer, automotive, and industrial will have differing needs and will need optimized tools and IP.
• Internet of Things. This is a current buzzword, but the impact on EDA remains uncertain. Many IoT devices will be heavily analog, use mature process nodes, and be dirt cheap. Lip-Bu Tan, Cadence CEO, recently pointed out that the silicon percentage of IoT revenue will be small and that a lot of the profits will be on the service side.

Moving On

For the past six years I’ve been writing the Industry Insights blog at Cadence.com. All things change, and with this post comes a farewell – I am retiring in late June and will be pursuing a variety of interests other than EDA. I’ll be watching, though, to see what happens next in this small but vital industry. Thanks for reading!

Richard Goering

I have completed physical design of a block in innovus. I want to extract rc of that block using quantus .  It will be very helpful if you give step by step procedure and command to run quantus to extract rc of that block.

Hello, i have a logic output from a D-flipflop which generates a reset signal with variable pulse width. I want to stretch this LOW pulse width with an extra 100ns added to the original pulse width digitally, is there any way to do that?

hi all, 

          what wrong with the error "param_write.log does not exist" when i export parameters in allegro 16.6 pcb board.

          someone can provide suggestions, thanks.

best regards.

Hi Folks, Check out this great new video on YouTube: CDNLive SV 2014: PMC Improves Visibility and Performance with Spectre APS In this video from CDNLive Silicon Valley 2014, Jurgen Hissen, principal engineer, MSCAD, at PMC, discusses an aggressive...(read more)

I have a SKILL script that executes the callback of a menu item, and depends on first redefining an environment variable. 

When a user interrupts the script with ctrl-C, the script cannot finish to set the environment variable back to its default value.

How can I write the script in a way that handles a user interrupt to reset the changed environment variable after the interrupt?

I have a modeless informational dialog box defined at the beginning of a SKILL script, but its contents don't display until the script finishes.

How do you get a modeless dialog box contents to display while a SKILL script is running?

procedure(myproc()

   prog((myvars)

     hiDisplayAppDBox()    ; opens blank dialog box - no dboxText contents show until script completes!

     ....rest of SKILL code in script...launches child processes

   );prog

);proc

Learn about the challenges and solutions for integrating and verification PCIe(r) Gen4 into an Arm-Based Server SoC. Listen to this relatively short webinar by Arm and Cadence, as they describe the collaboration and results, including methodology and...(read more)

Cadence ® Spectre ® AMS Designer is a high-performance mixed-signal simulation system. The ability to use multiple engines, and drive from a variety of platforms enables you to "rev...

[[ Click on the title to access the full blog on the Cadence Community site. ]]

We're happy to have guest blogger Thorsten Dworzak, Principal Consultant at Verilab GmbH, describe how he added Specman/e syntax to Sublime Text 3:

According to the 2018 StackOverflow Developer Survey, the popularity of development environments (IDEs, Text Editors) among software developers shows the following ranking:

1. Visual Studio Code 34.9%
2. Visual Studio 34.3%
3. Notepad++ 34.2%
4. Sublime Text 28.9%
5. Vim 25.8%
6. IntelliJ 24.9%
7. Android Studio 19.3%
8. (DVT) Eclipse 18.9%
9. …

15. Emacs 4.1%

Of these, only Vim, (DVT) Eclipse, and Emacs support editing in e-language (at least, last time I checked). Kate, which comes with KDE and also has a Specman mode, is not on this list.

I started using Sublime Text 3 some time ago. It offers packages that support a number of programming languages.

Though there is an e-language syntax available from Tsvi Mostovicz, it is unfinished work, and there are many syntactic constructs are missing. So, I created a fork of his project and finished it (it will eventually be merged back here).

It is a never-ending task because my code base for testing is limited and e is still undergoing development. The project is available through ST3's Package Control and you can contribute to it via Github.

I am eagerly waiting for your pull requests and/or comments and contributions!

When you design a rigid-flex board, the focus is, of course, on the bend. Your design might be bend to install (stable flexion) - it will be bent only a few times while installing. Or it might be dynamic - it will be bent regularly. It's important to...(read more)

You must deal with many reports in your daily life – for your health, financial accounts, credit, your child’s academic records, and the count goes on. Ever noticed that these reports contain many details, most of which you don’t wa...(read more)

Hello, i saw that MAESTRO is a plotting addon is it a part of ADE EXPLORER?

i cant see the relation between the two.i started to read manual and regarding MAESTRO i only see code.

is there some simple examples?
Thanks.

Hello , i am trying to extract netlist from a circuit  in assembler

I have found the manual shown bellow , however there is no such option in tools in assembler.

how do i view the NETLIST of this circuit?

Thanks.

ASSEMBLER VIEW menu

Hello, i managed to extract my S-param data into vcsv file,however i need a standart S2P file

i have this table displayed, as shown bellow.
is there a way to extract s2p file in cadence virtuoso?
Thanks.

I am trying to understand why axlDBTextBlockCompact(nil) on my test case says it can compact the text blocks down to 38, whereas I find only a total of 26 unique text block references in axlDBGetDesign()->text, axlDBGetDesign()->symbols and axlDBGetDesign()->symdefs. Where else are text blocks used besides these three?

Hi,

I've vhdl block containing fsm . IMC not able to auto extract the state machine coded like this:

There is a intermediate state state_mux  between next_state & state.

Pls. help in guiding IMC how to recognize this FSM coding style? 

Snipped of the fsm code:

----------------------------------------------------------------------------------------------------------------------------------------------

               type state_type is (ST_IDLE, ST_ADDRESS, ST_ACK_ADDRESS, ST_READ, ST_ACK_READ, ST_WRITE, ST_ACK_WRITE, ST_IDLE_BYTE);

               signal state : state_type;

               signal state_mux : state_type;

               signal next_state : state_type;

process(state_mux, start)

         begin

               next_state <= state_mux;

               next_count <= (others => '0');

           case (state_mux) is

                 when ST_IDLE => 

                            if(start = '1') then

                                 next_state <= ST_ADDRESS;

                              end if;

            when ST_ADDRESS =>

   …………….

          when others => null;

         end case;

     end process;

process(scl_clk_n, active_rstn)

               begin

                      if(active_rstn = '0') then

                           state <= ST_IDLE after delay_f;

                  elsif(scl_clk_n'event and scl_clk_n = '1') then

                             state <= next_state after delay_f;

                            end if;

end process;

process(state, start)

               begin

                     state_mux <= state;

               if(start = '1') then

                       state_mux <= ST_IDLE;

                              end if;

               end process;

Thanks

Raghu

xmsim is not exiting the simulation for this error. It is unusual for the simulator to not exit for an error. I have just started using uvm and this is occurring during the randomization step for a sequencer item.

xmsim: *E,RNDCNSTE

I am using -EXIT on the command line.

I am using Xcelium 19.03-s013.

Any insights are appreciated. Thanks.

-Jim

Specman *search* command allows searching in all loaded modules, but only for a string.

Is there a way to search for a regexp or glob?

Alternatively, is there a way to simply get a list of all loaded files somehow? Then I could use either the "shell" command, or real shell together with grep.

Thanks

Sample clues

18 across: Makoto Hagiwara and David Jung both claim to have invented it (7,6)

1 down: French impressionist who rejected that term (5)

3 down: Artificial surface used for playing hockey (9)

7 down: The sequel to Iliad (7)

12 down: Adipose tissue (4,3)

Extrowords © 2007 IndiaUncut.com. All rights reserved.
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Sample clues

6 across: Franchise revived by Frank Miller (6)

13 across: What Keanu Reeves and Zayed Khan have in common (5)

18 across: What Frank Sinatra and George Clooney have in common (6,6)

19 across: Dosa mix, for example (6)

2 down: Green, in a non-environmental way (7)

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Sample clues

5 down: Torso covering (6)

7 down: Government by rogues (12)

15 across: eBay speciality (7)

18 across: Demonic (8)

20 across: Common language (6,6)

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Sample clues

17 across: Beckham speciality (4,4)

4 down: Havana speciality (5)

19 across: Infamous 1988 commercial against Michael Dukakis (9,4)

11 down: Precisely (2,3,3)

13 down: City infamously ransacked by the Japanese in 1937 (7)

Extrowords © 2007 IndiaUncut.com. All rights reserved.
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Sample clues

11 across: Chandigarh’s is 0172 (3,4)

21 across: He’s a loser, baby (4)

1 down: Garment meant to shape the torso (6)

12 down: It’s slogan: “Life, Liberty and the Pursuit” (8)

18 down: Noise made by badminton players? (6)

Extrowords © 2007 IndiaUncut.com. All rights reserved.
India Uncut * The IU Blog * Rave Out * Extrowords * Workoutable * Linkastic

Sample clues

5 across: The US president’s bird (3,5,3)

11 down: Group once known as the Quarrymen (7)

10 across: Cavalry sword (5)

19 across: Masonic ritual (5,6)

1 down: Pioneer of Ostpolitik (6)

Extrowords © 2007 IndiaUncut.com. All rights reserved.
India Uncut * The IU Blog * Rave Out * Extrowords * Workoutable * Linkastic

Sample clues

14 across: FDR’s baby (3,4)

1 down: A glitch in the Matrix? (4,2)

4 down: Slanted character (6)

5 down: New Year’s venue in New York (5,6)

16 down: Atmosphere of melancholy (5)

Extrowords © 2007 IndiaUncut.com. All rights reserved.
India Uncut * The IU Blog * Rave Out * Extrowords * Workoutable * Linkastic

Sample clues

6 across: Alejandro González Iñárritu’s breakthrough film (6,6)

19 across: Soft leather shoe (8)

7 down: Randroids, for example (12)

12 down: First American World Chess Champion (7)

17 down: Circle of influence (5)

Extrowords © 2007 IndiaUncut.com. All rights reserved.
India Uncut * The IU Blog * Rave Out * Extrowords * Workoutable * Linkastic

Sample clues

5 across: Robbie Robertson song about Richard Manuel (6,5)

2 down: F5 on a keyboard (7)

10 across: Lionel Richie hit (5)

3 down: ALTAIR, for example (5)

16 down: The problem with Florida 2000 (5)

Extrowords © 2007 IndiaUncut.com. All rights reserved.
India Uncut * The IU Blog * Rave Out * Extrowords * Workoutable * Linkastic

Sample clues

9 across: Van Morrison classic from Moondance (7)

6 down: Order beginning with ‘A’ (12)

6 across: Fatal weakness (8,4)

19 across: Rolling Stones classic (12)

4 down: Massacre tool (8)

Extrowords © 2007 IndiaUncut.com. All rights reserved.
India Uncut * The IU Blog * Rave Out * Extrowords * Workoutable * Linkastic

Hi,

I have a new customer that uses Allegro Design entry HDL for the schematic and have a few questions.

1. How do you get pin/gate swaps into the symbols in the schematic ?

2. How do you transfer them to the pcb editor ?

3. How do you back annotate the swaps from the pcb editor to the schematic ?

4. How do you stop the export/Import physical from updating the constraints in the pcb file ? 

Hi everybody,

The attached package is a tiny code example with a demo for an upcoming Team Specman blog post about writing macros.

Hilmar

Exporting a waveform into a vcsv file returns the error:

The wsSaveTraceCommand command generated an exception basic_string::_S_construct null not valid.

Only the first row of the vcsv file is created (";Version, 1, 0"). This was the first time I've exported waveforms generated with Assembler. I had no issue before with the combination of ADE L, Parametric sweep and ViVA XL. My project uses ICADV 12.3. I have not found any related forum entry or documentation. How could I export the waveforms in vcsv? Exporting the values into a table and then exporting into a csv works, but my post-processing script was written for vcsv format.

Hi all,

I am using ADE assembler.

I ran transient simulation and swept the input frequency (Fin) of the circuit. And I use Spectrum Measurement to return a value of the fundamental tone magnitude (Sig_fund) for each sweep point. 

Previously, I use "plot across design points" to plot both "Fin" and "Sig_fund", and then use "Y vs Y" to get a waveform of Sig_fund vs Fin. Measure the 1dB Bandwidth with markers. 

Can I realized above measurement with an expression in "output setup" ? And how?

I know to set the "Eval type" to "sweep" to process the data across sweep points. But here, it has to return an interpolated value from "Fin" with a criteria "(value(calcVal("Sig_fund"  0) - 1)". I am not sure whether it can be done in ADE assembler.

Thanks and regards,

Yutao

i had encountered error message like this before. 

but in liberate, i did not find the entry to input section info. 

Hi all,

Is there any tutorial which explains the process of plotting the ISF function for a certain oscillator ?

Thank you.

Hello,

I am using Virtuoso 6.1.7.

I am performing the parasitic extraction of a MOM cap array of 32 caps. I use Quantus QRC and I enable field solver. I select “QRCFS” for field solver type and “High” for field solver accuracy. The unit MOM cap is horizontally and vertically symmetric. The array looks like the sketch below and there are no other structures except the unit caps:

Rationally speaking, the capacitance values of the unit caps should be symmetric with respect to a vertical symmetry axis that is between cap16 and cap17 (shown with dashed red line). For example,

the capacitance of cap1 should be equal to the capacitance of cap32

the capacitance of cap2 should be equal to the capacitance of cap31

etc. as there are no other structures around the caps that might create some asymmetry.

Nevertheless, what I observe is the following after the parasitic extraction:

As it can be seen, the result is not symmetric contrary to what is expected. I should also add that I do not observe this when I perform parasitic extraction with no filed solver.

Why do I get this result? Is it an artifact resulting from the field solver tool (my conclusion was yes but still it must be verified)? If not, how can something like this happen?

Many thanks in advance.

Best regards,

Can

Let’s review a key characteristic feature of Cadence Liberate AMS Mixed-Signal Characterization that offers to you ease of use along with many other benefits like automation of standard Liberty model creation and improvement of up to 20X throughput.(read more)

Joules RTL Power Solution provides a cockpit for RTL designers to explore and optimize the power efficiency of their designs. But this capability is now not just limited to RTL designers!! Yes, you as a synthesis designer too can use the power analysis capabilities of Joules from within Genus Synthesis Solution!!

But:

• How to do it?
• Is there any specific switch required?
• What is the flow/script when Joules is used from within Genus?
• Are all the Joules commands supported?

To answer to all these questions is just a click away in the form of video on “Genus-Joules Integration”; refer it on https://support.cadence.com (Cadence login required).

Video Title: Genus-Joules Integration (Video)

Direct Link: https://support.cadence.com/apex/ArticleAttachmentPortal?id=a1O0V0000091CnXUAU&pageName=ArticleContent

Related Resources

Enhance the Genus Synthesis experience with videos: Genus Synthesis Solution: Video Library

Enhance the Joules experience with videos: Joules RTL Power Solution: Video Library

For any questions, general feedback, or future blog topic suggestions, please leave a comment. 

Several tools can generate power reports based on libraries & stimulus. The issue is what's NEXT?

• Is there any scope to improve power consumption of my design?
• What is the best-case power?
• Pin-point hot spots in my design?
• How to recover wasted power?

And here is the solution in form of Joules RTL Power Exploration. Joules’ framework for power exploration and power implementation/recovery is stimulus based, where analysis is done by Joules and is explored/implemented by user.

Power Exploration capabilities include:

• Efficiency metrics
• Pin point RTL location
• Cross probe to stim
• Centralize all power data

 Do you want to explore more? What is the flow? What commands can be used?

There is a ONE-STOP solution to all these queries in the form of videos on Joules Power Exploration features on https://support.cadence.com (Cadence login required).

Video Links:

How to Analyze Ideal Power Using Joules RTL Power Solution GUI? (Video)

What is Ideal Power Analysis Flow in Joules RTL Power Solution? (Video)

How to Apply Observability Don’t Care (ODC) Technique in Joules? (Video)

How to Debug Wasted Power Using Ideal Power Analyzer Window in Joules GUI? (Video)

Related Resources

Enhance the Joules experience with videos: Joules RTL Power Solution: Video Library

For any questions, general feedback, or future blog topic suggestions, please leave a comment. 

Key Findings: Many more design teams will be reaching the mixed-signal methodology tipping point in 2015. That means you need to have a (verification) plan, and measure and execute against it.

As 2014 draws to a close, it is time to look ahead to the coming years and make a plan. While the macro view of the chip design world shows that is has been a mixed-signal world for a long time, it is has been primarily the digital teams that have rapidly evolved design and verification practices over the past decade. Well, I claim that is about to change. 2015 will be a watershed year for many more design teams because of the following factors:

• 85% of designs are mixed signal, and it is going to stay that way (there is no turning back)
• Advanced node drives new techniques, but they will be applied on all nodes
• Equilibrium of mixed-signal designs being challenged, complexity raises risk level
• Tipping point signs are evident and pervasive, things are going to change
• The convergence of “big A” and “big D” demands true mixed-signal practices

Reason 1: Mixed-signal is dominant

To begin the examination of what is going to change and why, let’s start with what is not changing. IBS reports that mixed signal accounts for over 85% of chip design starts in 2014, and that percentage will rise, and hold steady at 85% in the coming years. It is a mixed-signal world and there is no turning back!

Figure 1. IBS: Mixed-signal design starts as percent of total

The foundational nature of mixed-signal designs in the semiconductor industry is well established. The reason it is exciting is that a stable foundation provides a platform for driving change. (It’s hard to drive on crumbling infrastructure.  If you’re from California, you know what I mean, between the potholes on the highways and the earthquakes and everything.)

Reason 2: Innovation in many directions, mostly mixed-signal applications

While the challenges being felt at the advanced nodes, such as double patterning and adoption of FinFET devices, have slowed some from following onto to nodes past 28nm, innovation has just turned in different directions. Applications for Internet of Things, automotive, and medical all have strong mixed-signal elements in their semiconductor content value proposition. What is critical to recognize is that many of the design techniques that were initially driven by advanced-node programs have merit across the spectrum of active semiconductor process technologies. For example, digitally controlled, calibrated, and compensated analog IP, along with power-reducing mutli-supply domains, power shut-off, and state retention are being applied in many programs on “legacy” nodes.

Another graph from IBS shows that the design starts at 45nm and below will continue to grow at a healthy pace.  The data also shows that nodes from 65nm and larger will continue to comprise a strong majority of the overall starts. 

Figure 2.  IBS: Design starts per process node

TSMC made a comprehensive announcement in September related to “wearables” and the Internet of Things. From their press release:

TSMC’s ultra-low power process lineup expands from the existing 0.18-micron extremely low leakage (0.18eLL) and 90-nanometer ultra low leakage (90uLL) nodes, and 16-nanometer FinFET technology, to new offerings of 55-nanometer ultra-low power (55ULP), 40ULP and 28ULP, which support processing speeds of up to 1.2GHz. The wide spectrum of ultra-low power processes from 0.18-micron to 16-nanometer FinFET is ideally suited for a variety of smart and power-efficient applications in the IoT and wearable device markets. Radio frequency and embedded Flash memory capabilities are also available in 0.18um to 40nm ultra-low power technologies, enabling system level integration for smaller form factors as well as facilitating wireless connections among IoT products.

Compared with their previous low-power generations, TSMC’s ultra-low power processes can further reduce operating voltages by 20% to 30% to lower both active power and standby power consumption and enable significant increases in battery life—by 2X to 10X—when much smaller batteries are demanded in IoT/wearable applications.

The focus on power is quite evident and this means that all of the power management and reduction techniques used in advanced node designs will be coming to legacy nodes soon.

Integration and miniaturization are being pursued from the system-level in, as well as from the process side. Techniques for power reduction and system energy efficiency are central to innovations under way.  For mixed-signal program teams, this means there is an added dimension of complexity in the verification task. If this dimension is not methodologically addressed, the level of risk adds a new dimension as well.

Reason 3: Trends are pushing the limits of established design practices

Risk is the bane of every engineer, but without risk there is no progress. And, sometimes the amount of risk is not something that can be controlled. Figure 3 shows some of the forces at work that cause design teams to undertake more risk than they would ideally like. With price and form factor as primary value elements in many growing markets, integration of analog front-end (AFE) with digital processing is becoming commonplace.  

Figure 3.  Trends pushing mixed-signal out of equilibrium

The move to the sweet spot of manufacturing at 28nm enables more integration, while providing excellent power and performance parameters with the best cost per transistor. Variation becomes great and harder to control. For analog design, this means more digital assistance for calibration and compensation. For greatest flexibility and resiliency, many will opt for embedding a microcontroller to perform the analog control functions in software. Finally, the first wave of leaders have already crossed the methodology bridge into true mixed-signal design and verification; those who do not follow are destined to fall farther behind.

Reason 4: The tipping point accelerants are catching fire

The factors cited in Reason 3 all have a technical grounding that serves to create pain in the chip-development process. The more factors that are present, the harder it is to ignore the pain and get the treatment relief  afforded by adopting known best practices for truly mixed-signal design (versus divide and conquer along analog and digital lines design).

In the past design performance was measured in MHz with simple static timing and power analysis. Design flows were conveniently partitioned, literally and figuratively, along analog and digital boundaries. Today, however, there are gigahertz digital signals that interact at the package and board level in analog-like ways. New, dynamic power analysis methods enabled by advanced library characterization must be melded into new design flows. These flows comprehend the growing amount of feedback between analog and digital functions that are becoming so interlocked as to be inseparable. This interlock necessitates design flows that include metrics-driven and software-driven testbenches, cross fabric analysis, electrically aware design, and database interoperability across analog and digital design environments.

Figure 4.  Tipping point indicators

Energy efficiency is a universal driver at this point.  Be it cost of ownership in the data center or battery life in a cell phone or wearable device, using less power creates more value in end products. However, layering multiple energy management and optimization techniques on top of complex mixed-signal designs adds yet more complexity demanding adoption of “modern” mixed-signal design practices.

Reason 5: Convergence of analog and digital design

Divide and conquer is always a powerful tool for complexity management.  However, as the number of interactions across the divide increase, the sub-optimality of those frontiers becomes more evident. Convergence is the name of the game.  Just as analog and digital elements of chips are converging, so will the industry practices associated with dealing with the converged world.

Figure 5. Convergence drivers

Truly mixed-signal design is a discipline that unites the analog and digital domains. That means that there is a common/shared data set (versus forcing a single cockpit or user model on everyone). 

In verification the modern saying is “start with the end in mind”. That means creating a formal approach to the plan of what will be test, how it will be tested, and metrics for success of the tests. Organizing the mechanics of testbench development using the Unified Verification Methodology (UVM) has proven benefits. The mixed-signal elements of SoC verification are not exempted from those benefits.

Competition is growing more fierce in the world for semiconductor design teams. Not being equipped with the best-known practices creates a competitive deficit that is hard to overcome with just hard work. As the landscape of IC content drives to a more energy-efficient mixed-signal nature, the mounting risk posed by old methodologies may cause causalities in the coming year. Better to move forward with haste and create a position of strength from which differentiation and excellence in execution can be forged.

Summary

2015 is going to be a banner year for mixed-signal design and verification methodologies. Those that have forged ahead are in a position of execution advantage. Those that have not will be scrambling to catch up, but with the benefits of following a path that has been proven by many market leaders.

Introduction to AMSD Flex mode and its benefits.(read more)

This blog talks about how to enable the AMS Designer flex mode.(read more)

Cadence_SPB_17.4-2019 + Matlab R2019a

请参考本文档中的步骤进行操作

1，打开BJT_AMP.opj

2，设置Matlab路径

3，打开BJT_AMP_SLPS.slx

4，打开后，设置PSpiceBlock，出现或CEFSimpleUI.exe停止工作

5，添加模块

6，相同

7，打开pspsim.slx

8，相同

9，打开C： Cadence Cadence_SPB_17.4-2019 tools bin

orCEFSimpleUI.exe和orCEFSimple.exe

10，相同

我想问一下如何解决，非常感谢！

If you have one of those Die layouts, which doesn’t have bumps, but rather uses pad shapes and labels to identify I/O locations, then you might be feeling a bit left out of all of this jazz and tango. Hence, today, I am writing to tell you that, fear not, we have a solution for your Die as well.(read more)

Hello everyone, today I’d like to talk to you about the recent enhancements to Die export in the Virtuoso RF Solution, most of which were released in ICADVM 18.1 ISR10. What’s the background for these enhancements? Exporting an abstract of a Die, which basically represents the outer boundary of the Die with I/O locations, as an intermediate file to exchange information between various Cadence tools (i.e., the Innovus, Virtuoso, and Allegro platforms) is not a new feature. This capability existed even prior to the Virtuoso RF Solution. However, the entire functionality was rewritten from scratch when we first started developing the Virtuoso RF Solution because the previous feature was deemed archaic, its performance and capacity needed to be enhanced, and use model needed to be modernized. This effort has been made in various phases, with the last round being completed and released in ICADVM18.1 ISR10.(read more)

دسویں جماعت کے صرف شمال مشرقی دہلی کے طلبہ کے امتحانات ہوں گے جو کہ دہلی میں خراب حالات کی وجہ سے شامل نہیں ہوسکے تھے ۔

સરકારે રેલવેને વહેલી તકે પોઇન્ટ ટૂ પોઇન્ટ એટલે કે નોનસ્ટોપ ટ્રેન દોડાવવા માટે એક યોજના બનાવીને આપવા માટે કહ્યું છે

આમ તો હજુ 80 પેપર્સની પરીક્ષાઓ હજુ બાકી છે પણ વર્તમાન સ્થિતિ જોતા સીબીએસઈએ ફક્ત 29 વિષયોની પરીક્ષા કરાવવાનો નિર્ણય કર્યો છે

માર્ચ મહિનામાં જન્મેલા લોકોમાં કેવી કેવી ખાસિયતો હોય છે અને તેમના લકી નંબર કયા છે તે પણ જોઇએ.