1 Papua New Guinean Kina = 1135.88 Colombian Peso

1 Papua New Guinean Kina = 2.0622 Chinese Yuan Renminbi

1 Papua New Guinean Kina = 240.7325 Chilean Peso

1 Papua New Guinean Kina = 0.2831 Swiss Franc

1 Papua New Guinean Kina = 0.4086 Canadian Dollar

1 Papua New Guinean Kina = 3.5402 Botswana Pula

1 Papua New Guinean Kina = 1.6711 Brazilian Real

1 Papua New Guinean Kina = 2.0102 Bolivian Boliviano

1 Papua New Guinean Kina = 0.412 Brunei Dollar

1 Papua New Guinean Kina = 0.1102 Bahraini Dinar

1 Papua New Guinean Kina = 0.5263 Bulgarian Lev

1 Papua New Guinean Kina = 24.777 Bangladeshi Taka

1 Papua New Guinean Kina = 0.4461 Australian Dollar

1 Papua New Guinean Kina = 19.3777 Argentine Peso

1 Papua New Guinean Kina = 0.5233 Netherlands Antillean Guilder

1 Papua New Guinean Kina = 1.0708 United Arab Emirates Dirham

1 Brunei Dollar = 21.1263 New Taiwan Dollar

1 Brunei Dollar = 2.4273 Papua New Guinean Kina

1 Brunei Dollar = 1.1528 New Zealand Dollar

1 Brunei Dollar = 2.4813 Israeli New Sheqel

I’m coming to the party late—last weekend, for the first but not the last time, I watched Manish Acharya’s comedy, Loins of Punjab Presents. Behan____, what a film! 

I will not rehearse the synopsis or plot, partly because of the lateness of the hour, but also because it is available here. Instead, let me note quickly that the comedy keeps ticking, and the attention to detail in all matters, from the plot to the casting, makes this film a pleasure to watch.

Let me use one scene to make a point about where the film is coming from. Ishitta Sharma, playing a demure, Gujju girl called Preeti Patel, is one of the competitors in the Desi Idol competition in New Jersey. We have watched her sing beautifully, and we have watched her stay silent, eyes downcast, as her family-members make fools of themselves. But there’s a moment later in the film, when an older, wily competitor, played with classy ease by Shabana Azmi, tries to manipulate her. And suddenly, in the blink of an eye, Preeti Patel turns upon the Shabana character. It’s as if she always had a dagger hiding in her hand.

When I saw that, I thought that there was a similar strength in the movie I was watching. It’s all laughs but it has a quicksilver intelligence within. It is a declaration of independence by the desi diaspora—and what is great is that it celebrates this freedom by mocking, and loving, almost everything in sight.

Rave Out © 2007 IndiaUncut.com. All rights reserved.
India Uncut * The IU Blog * Rave Out * Extrowords * Workoutable * Linkastic

Literate Indians should be familiar with Ashis Nandy’s remark: “Cricket is an Indian game accidentally discovered by the English.“ A Trinidadian Indian by the name of Chuck Ramkissoon, in Joseph O’Neill’s superbly inflected novel “Netherland”, is also fond of making bold pronouncements on the behalf of the game he wants to introduce to the U.S. “I’m saying that people, all people, Americans, whoever, are at their most civilized when they’re playing cricket. What’s the first thing that happens when Pakistan and India make peace? They play a cricket match…”

It’s now my turn to be bold: “Netherland” is more of an Indian novel than the recent, much feted, Indian fiction. This is not only because O’Neill’s novel feeds our national obsession with the game. Nor even its exquisite description of what transpires on the playing field: “…. where the white-clad ring of infielders, swanning figures on the vast oval, again and again converge in unison toward the batsman and again and again scatter back to their starting points, a repetition of pulmonary rhythm, as if the field breathed through its luminous visitors.” No. My pronouncement is based on the fact that the Indian characters in the book are highly individualized and yet fully global in their identity. “Netherland” is not a sociological-historical epic thesis, nor is it a shallow, cynical report on injustice in the hinterland. Rich in observation, reporting as much on the interior life as on the life outside, it is a captivating literary achievement. A masterpiece.

Rave Out © 2007 IndiaUncut.com. All rights reserved.
India Uncut * The IU Blog * Rave Out * Extrowords * Workoutable * Linkastic

This is the 24th installment of The Rationalist, my column for the Times of India.

Back in the last decade, I was a cricket journalist for a few years. Then, around 12 years ago, I quit. I was jaded as hell. Every game seemed like déjà vu, nothing new, just another round on the treadmill. Although I would remember her fondly, I thought me and cricket were done.

And then I fell in love again. Cricket has changed in the last few years in glorious ways. There have been new ways of thinking about the game. There have been new ways of playing the game. Every season, new kinds of drama form, new nuances spring up into sight. This is true even of what had once seemed the dullest form of the game, one-day cricket. We are entering into a brave new world, and the team leading us there is England. No matter what happens in the World Cup final today – a single game involves a huge amount of luck – this England side are extraordinary. They are the bridge between eras, leading us into a Golden Age of Cricket.

I know that sounds hyperbolic, so let me stun you further by saying that I give the IPL credit for this. And now, having woken up you up with such a jolt on this lovely Sunday morning, let me explain.

Twenty20 cricket changed the game in two fundamental ways. Both ended up changing one-day cricket. The first was strategy.

When the first T20 games took place, teams applied an ODI template to innings-building: pinch-hit, build, slog. But this was not an optimal approach. In ODIs, teams have 11 players over 50 overs. In T20s, they have 11 players over 20 overs. The equation between resources and constraints is different. This means that the cost of a wicket goes down, and the cost of a dot ball goes up. Critically, it means that the value of aggression rises. A team need not follow the ODI template. In some instances, attacking for all 20 overs – or as I call it, ‘frontloading’ – may be optimal.

West Indies won the T20 World Cup in 2016 by doing just this, and England played similarly. And some sides began to realise was that they had been underestimating the value of aggression in one-day cricket as well.

The second fundamental way in which T20 cricket changed cricket was in terms of skills. The IPL and other leagues brought big money into the game. This changed incentives for budding cricketers. Relatively few people break into Test or ODI cricket, and play for their countries. A much wider pool can aspire to play T20 cricket – which also provides much more money. So it makes sense to spend the hundreds of hours you are in the nets honing T20 skills rather than Test match skills. Go to any nets practice, and you will find many more kids practising innovative aggressive strokes than playing the forward defensive.

As a result, batsmen today have a wider array of attacking strokes than earlier generations. Because every run counts more in T20 cricket, the standard of fielding has also shot up. And bowlers have also reacted to this by expanding their arsenal of tricks. Everyone has had to lift their game.

In one-day cricket, thus, two things have happened. One, there is better strategic understanding about the value of aggression. Two, batsmen are better equipped to act on the aggressive imperative. The game has continued to evolve.

Bowlers have reacted to this with greater aggression on their part, and this ongoing dialogue has been fascinating. The cricket writer Gideon Haigh once told me on my podcast that the 2015 World Cup featured a battle between T20 batting and Test match bowling.

This England team is the high watermark so far. Their aggression does not come from slogging. They bat with a combination of intent and skills that allows them to coast at 6-an-over, without needing to take too many risks. In normal conditions, thus, they can coast to 300 – any hitting they do beyond that is the bonus that takes them to 350 or 400. It’s a whole new level, illustrated by the fact that at one point a few days ago, they had seven consecutive scores of 300 to their name. Look at their scores over the last few years, in fact, and it is clear that this is the greatest batting side in the history of one-day cricket – by a margin.

There have been stumbles in this World Cup, but in the bigger picture, those are outliers. If England have a bad day in the final and New Zealand play their A-game, England might even lose today. But if Captain Morgan’s men play their A-game, they will coast to victory. New Zealand does not have those gears. No other team in the world does – for now.

But one day, they will all have to learn to play like this.

© 2007 IndiaUncut.com. All rights reserved.
India Uncut * The IU Blog * Rave Out * Extrowords * Workoutable * Linkastic

First, the good news. The EDA industry will grow from $6.2 billion in 2015 to $9.0 billion in 2019, according to Gary Smith, chief analyst at Gary Smith EDA. Year-to-year growth rates will range from +4% to +11.2%.

But in his annual presentation on the eve of the Design Automation Conference (DAC 2015), Smith noted that Wall Street is unimpressed. “The people I talk to want long-term steady growth, no sharp up-turns, no sharp downturns,” Smith said. “To the rest of Wall Street, we’re boring.”

Smith spent the rest of his talk noting how EDA can be a lot less boring and, potentially, a whole lot bigger. For starters, what if we add semiconductor IP to EDA revenues? Now we’re looking at $12.2 billion in revenue by 2019, Smith said. (He acknowledged, however, that the IP market itself is going to take a “dip” due to the move towards platform-based IP and away from conventional piecemeal IP).

This still is not enough to get Wall Street’s attention. Another possibility is to bring embedded software development into the EDA industry. This is not a huge market – about $2.6 billion today – but it is an “easy growth market for us,” according to Smith.

Chasing the Big Bucks

But the “big bucks” are in mechanical CAD (MCAD), Smith said. In the past the MCAD market has always been bigger than EDA, but now EDA is catching up. The MCAD market is about $6.6 billion now. Synopsys and Cadence are larger than PTC and Siemens, two of the main players in MCAD.

There may be some good acquisition possibilities coming up for EDA vendors, Smith said – and if we don’t buy MCAD companies, they might buy EDA companies. Consider, for example, that Ansoft bought Apache and Dassault bought Synchronicity. (Note: Siemens PLM Software is a first-time exhibitor at DAC 2015).

What about other domains? Smith said that EDA companies could conceivably move into optical design, applications development software, biomedical design, and chemical design. The last if these is probably the most tenuous; Smith noted that EDA vendors have yet to look into chemical design.

Applications development software is the biggest market on the above list, but that means competing with Microsoft, IBM, and Oracle. “You’re in with the big boys – is that a good idea?” Smith asked.

Perhaps there’s an opening for a “big play” for an MCAD provider. Smith noted that mechanical vendors are focusing on product data management (PDM). This “is really the IT of design,” Smith said. “They have a lot of hope that the IoT [Internet of things] market is going to give them an opportunity to capture the software that goes from the ground to the cloud. Maybe we can let them have PDM and see if we can take the tool market away from them, or acquire it away from them.”

In conclusion, Smith asked, should the EDA industry accelerate its growth? “The mechanical vendors have already shown interest in acquiring EDA vendors,” he said. “We may not have a choice.”

Richard Goering

NOTE: Catch our live blog from DAC 2015, beginning Monday morning, June 8! Click here

It's been a while since you've heard from me...it has been a busy year for sure. One of the reasons I've been so quiet is that I was part of a team working diligently on our latest best kept secret: The MMSIM 12.1.1/MMSIM 13.1 Documentation has...(read more)

Happy New Year! Have you tried the new Transmission Line Library (rfTlineLib) yet? In case you missed it, rfTlineLib was introduced in IC 6.1.6 ISR1 plus MMSIM 12.1.1 -or- MMSIM13.1. You may wonder....Why should I use the new rfTlineLib ? Well...(read more)

Hi Folks, A question that I've often received from designers, "Is there a method to determine the amount of memory required before I submit a job? I use distributed processing and need to provide an estimate before submitting jobs." The answer...(read more)

Hi All, Here's another great new feature that I've found very helpful... Broadband SPICE is a new tool for S-parameter simulation in Spectre RF. In the MMSIM13.1.1 ( MMSIM13.1 USR1) release (now available on http://downloads.cadence.com), a...(read more)

Hi Folks, Check out this great new video on YouTube: CDNLive SV 2014: PMC Improves Visibility and Performance with Spectre APS In this video from CDNLive Silicon Valley 2014, Jurgen Hissen, principal engineer, MSCAD, at PMC, discusses an aggressive...(read more)

Cadence has a new white paper out on Computational Software . I've written on these topics in Breakfast Bytes, most recently in the posts: Computational Software System Analysis: Computational...

[[ Click on the title to access the full blog on the Cadence Community site. ]]

All engineers can enhance their mixed-signal low-power structural verification productivity by learning while doing with a PIEA RAK (Power Intent Export Assistant Rapid Adoption Kit). They can verify the mixed-signal chip by a generating macromodel for their analog block automatically, and run it through Conformal Low Power (CLP) to perform a low power structural check.  

The power structure integrity of a mixed-signal, low-power block is verified via Conformal Low Power integrated into the Virtuoso Schematic Editor Power Intent Export Assistant (VSE-PIEA). Here is the flow.

Applying the flow iteratively from lower to higher levels can verify the power structure.

Cadence customers can learn more in a Rapid Adoption Kit (RAK) titled IC 6.1.5 Virtuoso Schematic Editor XL PIEA, Conformal Low Power: Mixed-Signal Low Power Structural Verification.

• To read the overview presentation, click on following link: PIEA Overview
• To download this PIEA RAK click on following link: PIEA RAK Download

The RAK includes Rapid Adoption Kit with demo design (instructions are provided on how to setup the user environment). It Introduces the Power Intent Export Assistant (PIEA) feature that has been implemented in the Virtuoso IC615 release.  The power intent extracted is then verified by calling Conformal Low Power (CLP) inside the Virtuoso environment.

• Last Update: 11/15/2012.
• Validated with IC 6.1.5 and CLP 11.1

The RAK uses a sample test case to go through PIEA + CLP flow as follows:

• Setup for PIEA
• Perform power intent extraction
• CPF Import: It is recommended to Import macro CPF, as oppose to designing CPF for sub-blocks. If you choose to import design CPF files please make sure the design CPF file has power domain information for all the top level boundary ports
• Generate macro CPF and design CPF
• Perform low power verification by running CLP

It is also recommended to go through older RAKs as prerequisites.

• Conformal Low Power, RTL Compiler and Incisive: Low Power Verification for Beginners
• Conformal Low Power: CPF Macro Models
• Conformal Low Power and RTL Compiler: Low Power Verification for Advanced Users

To access all these RAKs, visit our RAK Home Page to access Synthesis, Test and Verification flow

Note: To access above docs, use your Cadence credentials to logon to the Cadence Online Support (COS) web site. Cadence Online Support website https://support.cadence.com/ is your 24/7 partner for getting help and resolving issues related to Cadence software. If you are signed up for e-mail notifications, you can receive new solutions, Application Notes (Technical Papers), Videos, Manuals, and more.

You can send us your feedback by adding a comment below or using the feedback box on Cadence Online Support.

Sumeet Aggarwal

On May 7, 2013 Cadence announced a 30% productivity gain in the June 2013 Incisive Enterprise Simulator 13.1 release.  Advanced debug visualization, faster turn-around time, and the extension of eight years of low-power verification innovation to IEEE 1801/UPF are the key capabilities in the release.

When we talk about low-power verification its easy to equate it with simulation.  For certain, simulation is the heart of a low-power verification solution. Simulation enables engineers to run their design in the context of power intent.  The challenge is that a simulation-only approach is inadequate. For example, if engineers could achieve SoC quality by verifying the individual function of each power control module (PCM), then simulation could be enough.  For a single power domain, simulation can be enough. 

However, when the SoC has multiple power domains -- and we have seen SoCs with hundreds of them -- engineers have to check the PCMs and all of the arcs between the power modes.  These SoCs often synchronize some of the domain switching to reduce overall complexity, creating the potential for signal skew errors on the control signals for the connected domains.  Managing these complexities requires verification methodologies including advanced debug, verification planning, assertion-based verification, Universal Verification Methodology - Low Power (UVM-LP), and more (see Figure 1).

Figure 1:  Comprehensive Low-Power Verification 

But even advanced verification methodologies on top of simulation aren't enough.  For example, the state machine that defines the legal and illegal power mode transitions is often written in software. The speed and capacity of the Palladium emulation platform is ideal to verify in this context, and it is integrated with simulation sharing debug, UVM acceleration, and static checks for low-power. And, it reports verification progress into a holistic plan for the SoC.  Another example is the ability to compare the design in the implementation flow with the design running in simulation to make sure that what we verify is what we intend to build.

Taken together, verification across multiple engines provides the comprehensive low-power verification needed for today's advanced node SoCs.  That's the heart of this low-power verification announcement. 

Another point you may have noticed is the extension of the Common Power Format (CPF) based power-aware support in the Incisive Enterprise Simulator to IEEE 1801.  We chose to bring IEEE 1801 to simulation first because users like you sometimes need to mix vendors for regression flows.  Over time, Cadence will extend the low-power capabilities throughout its product suite to IEEE 1801.

If you are using CPF today, you already have the best low-power solution. The evidence is clear:  the upcoming IEEE 1801-2013 update includes many of the CPF features contributed to 1801/UPF to enable methodology convergence.  Since you already have those features in the CPF flow, any migration before you have a mature IEEE 1801-2013 tool flow would reduce the functionality you have today.

If you are using Unified Power Format (UPF) 1.0 today, you want to start planning your move toward the IEEE 1801-2013 standard.  A good first step would be to move to the IEEE 1801-2009 standard.  It fills holes in the earlier UPF 1.0 definition.  While it does lack key features in -2013, it is an improvement that will make the migration to -2013 easier. The Incisive 13.1 release will run both UPF 1.0 and IEEE 1801-2009 power intent today.

Over the next few weeks you'll see more technical blogs about the low-power capabilities coming in the Incisive 13.1 release.  You can also join us on June 19 for a webinar that will introduce those capabilities using the reference design supplied with the Incisive Enterprise Simulator release.

=Adam "The Jouler" Sherer

(Yes, "Sherilog" is still here.  :-) )

The IEEE has announced the publication of the new 1801-2013 standard, also known as UPF 2.1, and immediate availability for free download through the IEEE 1801-2013 Get Program. Even though the standard is new to the whole world, for the people of the IEEE working group this standard is finally done and is in the past now.

There is a Chinese saying "好事多磨" which means "good things take time to happen." I forgot the exact time when I first joined the working group for the new standard -- about two and half years ago -- but I do remember long hours of meetings and many "lively" debates and discussions. Since the "hard time" has passed us, I would like to share some fun facts about the working group and the standard.

• The 1801 working group is the largest entity based ballot group in IEEE-SA history.
• The new standard was initially planned for 2012, but was delayed purely due to the large amount of work required.
• At one point, the group was debating on whether the new standard should be called UPF 2.1 or 3.0. It may sound weird now but we spent quite some time discussing this. Eventually we settled on 2.1 as it was the original plan.
• The 1801-2013 document has 358 pages which is 53% thicker than previous version (the sheer amount of changes in the new standard indicate that this is more than just a normal incremental update of the previous version as suggested by naming it 2.1)
• Around 300 real issues were reported over the previous version and a majority of them were fixed in the new release.
• This is the first release with constructs and semantics coming from Common Power Format (CPF), a sign of convergence of the two industry leading power formats.
• There are about 100 working group meetings in my Outlook calendar since 2011, with meeting times ranging from 2 hours to 8 hours.
• We extensively used Google Drive (which was called Google Docs when the working group started), a great tool for productivity. I cannot imagine how any standard could have been done before Google existed!

Personally, I had an enjoyable journey, especially from having the privilege to work with many industry experts who are all passionate about low power. I do have one more thing to share though. My older daughter went from middle school to high school during the period of the development of the new standard. Since most of the meetings took place in the early morning California time, she had to endure the pain of listening to all these discussions on power domain, power switches, etc. on her way to school.

I asked her if she learned anything. She told me that other than being able to recognize the voices of Erich, John and Joe on the line, she also learned that she would never want to become an electrical or computer engineer! She was so happy that the meetings stopped a couple of months ago. But what I did not tell her is that the meetings will resume after DAC! Well, I am sure this will be a big motivation for her to get her own driving license in the summer.

If you want to get some quick technical insights into the new standard, check out my recent EE Times article IEEE 1801-2013: A bold step towards power format convergence.

Qi Wang

We have many legacy board designs which have non-standard films. I'm writing SKILL code to automatically align a board's film records with our internal standard.

While I'm sure there will be multiple questions, here are the first two I've run into:

1. It seems the polyCutLayer parameter of axlFilmCreate() doesn't work. You can easily see this for yourself. Try typing "axlFilmCreate("test" ?polyCutLayer nil)" on the command window in Allegro. I'm returned "nil", indicating the film could not be created, and I see "*WARNING* (axlFilmCreate): Invalid option type: ?polyCutLayer" in the command window. Just to try a different parameter and see that it works, try "axlFilmCreate("test" ?negative t)". I'm returned a "t" and the film is created. Page 139 of 17.4-2019 algroskill.pdf shows this parameter and I can see it listed if I inspect an existing from from the DB, so what gives? Is the polyCutLayer parameter broken when creating films?

2. In conjunction with the above, if I loop through all current films and use axlDeleteObject() to remove them all, and then try to create new films but give an argument to the polyCutLayer parameter, films containing copper layers seem to be automatically created. There are four films (my test board has four layers) with the ETCH/, PIN/, and VIA CLASS/ subclasses. I am able to manually delete all films and see absolutely no films at all. Is there something weird going on here or is this to be expected for some reason?

I'm running Allegro 17.4s002.

Hi guys,

eDave,

I need to call (replay) a skill to combine some skills to ONE UI for more convenience and using as more easier.

Please help me to find the command to execute this.(code for example as more good)

HT,

This is the 24th installment of The Rationalist, my column for the Times of India.

Back in the last decade, I was a cricket journalist for a few years. Then, around 12 years ago, I quit. I was jaded as hell. Every game seemed like déjà vu, nothing new, just another round on the treadmill. Although I would remember her fondly, I thought me and cricket were done.

And then I fell in love again. Cricket has changed in the last few years in glorious ways. There have been new ways of thinking about the game. There have been new ways of playing the game. Every season, new kinds of drama form, new nuances spring up into sight. This is true even of what had once seemed the dullest form of the game, one-day cricket. We are entering into a brave new world, and the team leading us there is England. No matter what happens in the World Cup final today – a single game involves a huge amount of luck – this England side are extraordinary. They are the bridge between eras, leading us into a Golden Age of Cricket.

I know that sounds hyperbolic, so let me stun you further by saying that I give the IPL credit for this. And now, having woken up you up with such a jolt on this lovely Sunday morning, let me explain.

Twenty20 cricket changed the game in two fundamental ways. Both ended up changing one-day cricket. The first was strategy.

When the first T20 games took place, teams applied an ODI template to innings-building: pinch-hit, build, slog. But this was not an optimal approach. In ODIs, teams have 11 players over 50 overs. In T20s, they have 11 players over 20 overs. The equation between resources and constraints is different. This means that the cost of a wicket goes down, and the cost of a dot ball goes up. Critically, it means that the value of aggression rises. A team need not follow the ODI template. In some instances, attacking for all 20 overs – or as I call it, ‘frontloading’ – may be optimal.

West Indies won the T20 World Cup in 2016 by doing just this, and England played similarly. And some sides began to realise was that they had been underestimating the value of aggression in one-day cricket as well.

The second fundamental way in which T20 cricket changed cricket was in terms of skills. The IPL and other leagues brought big money into the game. This changed incentives for budding cricketers. Relatively few people break into Test or ODI cricket, and play for their countries. A much wider pool can aspire to play T20 cricket – which also provides much more money. So it makes sense to spend the hundreds of hours you are in the nets honing T20 skills rather than Test match skills. Go to any nets practice, and you will find many more kids practising innovative aggressive strokes than playing the forward defensive.

As a result, batsmen today have a wider array of attacking strokes than earlier generations. Because every run counts more in T20 cricket, the standard of fielding has also shot up. And bowlers have also reacted to this by expanding their arsenal of tricks. Everyone has had to lift their game.

In one-day cricket, thus, two things have happened. One, there is better strategic understanding about the value of aggression. Two, batsmen are better equipped to act on the aggressive imperative. The game has continued to evolve.

Bowlers have reacted to this with greater aggression on their part, and this ongoing dialogue has been fascinating. The cricket writer Gideon Haigh once told me on my podcast that the 2015 World Cup featured a battle between T20 batting and Test match bowling.

This England team is the high watermark so far. Their aggression does not come from slogging. They bat with a combination of intent and skills that allows them to coast at 6-an-over, without needing to take too many risks. In normal conditions, thus, they can coast to 300 – any hitting they do beyond that is the bonus that takes them to 350 or 400. It’s a whole new level, illustrated by the fact that at one point a few days ago, they had seven consecutive scores of 300 to their name. Look at their scores over the last few years, in fact, and it is clear that this is the greatest batting side in the history of one-day cricket – by a margin.

There have been stumbles in this World Cup, but in the bigger picture, those are outliers. If England have a bad day in the final and New Zealand play their A-game, England might even lose today. But if Captain Morgan’s men play their A-game, they will coast to victory. New Zealand does not have those gears. No other team in the world does – for now.

But one day, they will all have to learn to play like this.

The India Uncut Blog © 2010 Amit Varma. All rights reserved.
Follow me on Twitter.

If you design wire bond packages, you’re familiar with the need for the bond fingers and rings on the package substrate layers to be exposed through the solder mask layer. If they aren’t, it becomes… rather difficult… to bon...(read more)

I've redesigned a custom TO220FLAT Package

First I created a TO220shape.ssm  with PCB Editor. Then I created a surface mount T220build.pad in Padstack Editor using TO220shape.ssm. Then I created a TO220FLAT.psm in PCB Editor. I placed 3 Connect pins and 9 Mechanical pins for the TO220 TAB, using standard through-hole pads for better current handling.

Adding those Mechanical pins created many DRC errors caused by the proximity of those pads attached to the TO220shape.

Thru Pin to SMD Pin Spacing (-200.0 0.0) 5 MIL OVERLAP DEFAULT NET SPACING CONSTRAINTS Mechanical Pin "Pad50sq30d" Pin "T220build, 2"

I corrected the situation (so I though) by Waiving those DRC errors, thinking that they could not cause any problem and because that’s what I want, i.e.: 9 through-holes under the TO220 device. The idea being that when this device is mounted flat on the PCB it could carry lots of current via 9 pads that could make a good high current conductor to inner layers.

I then saved the Package and updated all related footprint schematic parts  in Capture. Created a new Netlist. Then I imported the new logic into PCB Editor to reflect that change. When the File > Import > Logic is finished I get no feedback error! (which, for me is a substantial achievement in itself)

Now, in the Design Window I see all those DRC errors popping up again, despite the fact that I waived those DRCs back in the Padstack edition. If I run a Design Rule Check (DRC) Report I will see all those DRC listed again. Now, I understand that I can go ahead and waive all those DRCs (100 in total) but I’m thinking there is got to be a better way of doing this.

Please, any advise is welcome. Thanks

Greeting to all:

I am new in this tool, only 2 weeks. Trying to create a new Via with smaller size drill hole from exiting 13 mils size to 10 mils size. I got the message as imaged below. Any advise what to do?  Thanks in advance.

When in Constraint Manager, Physical Domain, one can create a new Physical Constraint Class defining specific attributes for a custom rule set. One can then assing this new rule set to a set of nets. To do that it is instructed to create a new Net Class with menu Objects > Create > Net Class. Also on that same menu is available Net Group. Both options create a group that appear in the Constraint Manager Objects Name Column. I have triied both  options and cant really see the difference. 

The Question: What is the difference between creating a Net Class and a Net Group ?  What are the implications ?

Thanks for your help.

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