Display Stream Compression (DSC) is a lossless or near-lossless image compression standard developed by the Video Electronics Standards Association (VESA) for reducing the bandwidth required to transmit high-resolution video and images. DSC compresses video streams in real-time, allowing for higher resolutions, refresh rates, and color depths while minimizing the data load on transmission interfaces such as DisplayPort, HDMI, and embedded display interfaces.

Why Is DSC Needed?

In the ever-evolving landscape of display technology, the pursuit of higher resolutions and better visual quality is relentless. As display capabilities advance, so do the challenges of managing the immense amounts of data required to drive these high-performance screens. This is where DSC steps in. DSC is designed to address the challenges of transmitting ultra-high-definition content without sacrificing quality or performance. As displays grow in resolution and capability, the amount of data they need to transmit increases exponentially. DSC addresses these issues by compressing video streams in real-time, significantly reducing the bandwidth needed while preserving image quality.
 

DSC Use in End-to-end System

DSC Key Features

• Encoding tools:
  • Modified Median-Adaptive Prediction (MMAP)
  • Block Prediction (BP)
  • Midpoint Prediction (MPP)
  • Indexed color history (ICH)
  • Entropy coding using delta size unit-variable length coding (DSU-VLC)

• The DSC bitstream and decoding process are designed to facilitate the decoding of 3 pixels/clock in practical hardware decoder implementations. Hardware encoder implementations are possible at 1 pixel/clock.
• DSC uses an intra-frame, line-based coding algorithm, which results in very low latency for encoding and decoding.

DSC encoding algorithm
 

• Compression can be done to a fractional bpp. The compressed bits per pixel ranges from 6 to 63.9375.
• For validation/compliance certification of DSC compression and decompression engines, cyclic redundancy checks (CRCs) are used to verify the correctness of the bitstream and the reconstructed image.
• DSC supports more color bit depths, including 8, 10, 12, 14, and 16 bpc.
• DSC supports RGB and YCbCr input format, supporting 4:4:4, 4:2:2, and 4:2:0 sampling.
• Maximum decompressor-supported bits/pixel values are as listed in the Maximum Allowed Bit Rate column in the table below

• DP DSC Source device shall program the bit rate within the range of Minimum Allowed Bit Rate column in the table:

Summary

Display Stream Compression (DSC) is a technology used in DisplayPort to enable higher resolutions and refresh rates while maintaining high image quality. It works by compressing the video data transmitted from the source to the display, effectively reducing the bandwidth required. DSC uses a visually lossless algorithm, meaning that the compression is designed to be imperceptible to the human eye, preserving the fidelity of the image. This technology allows for smoother, more detailed visuals at higher resolutions, such as 4K or 8K, without requiring a significant increase in data bandwidth.

More Information

• Cadence has a very mature Verification IP solution. Verification over many different configurations can be used with DisplayPort 2.1 and DisplayPort 1.4 designs, so you can choose the best version for your specific needs.
• The DisplayPort VIP provides a full-stack solution for Sink and Source devices with a comprehensive coverage model, protocol checkers, and an extensive test suite.
• More details are available on the DisplayPort Verification IP product page, Simulation VIP pages.
• If you have any queries, feel free to contact us at talk_to_vip_expert@cadence.com

The Cadence Palladium Emulation Platform is a hardware system that implements the design, accelerating its execution and verification. Itoffers the highest performance and fastest bring-up times for pre-silicon validation of billion-gate designs, using a custom processor built by Cadence.

This Palladium Introduction course is based on the Palladium 23.03 ISR4 version and covers the following modules:

• Introduction
• Palladium flow
• Running a design on the Palladium system

This course starts with an “Introduction” module that explains Palladium and other verification platforms to show its place in the big picture. It also compares Palladium with Protium and simulation and discusses its usage and limitations.

The “Palladium Flow” module includes two stages at a high level, which are Compile and Run. Then, it covers these stages in detail. First, it covers the ICE compile flow and IXCOM compile flow steps in detail. Then it explains Run, which is common for both ICE and IXCOM modes.

The third module, “Running Design on the Palladium System,” covers all the items required for running your design on the Palladium system, including:

• Software stack requirements
• Basic concepts required to understand the flow
• Compute machine requirements

In addition, this course contains labs for both the ICE and IXCOM flows with detailed steps to exercise the features provided by the Palladium system. The lab explains a practical example of multiple counters and exercising their signals for force, monitor, and deposit features, along with frequency calculation using a real-time clock. The course is available on the Cadence support page:

There is also a Digital Badge available. You will find the Badge exam opportunity when you enroll in the Online training or after you have taken the training as "live" training.

For questions and inquiries, or issues with registration, reach out to us at Cadence Training. Want to stay up to date on webinars and courses? Subscribe to Cadence Training emails. To view our complete training offerings, visit the Cadence Training website.

Related Training Bytes

• Palladium: What Are Verification Platforms
• Palladium: What Is Processor Based Emulation
• Palladium: Comparing Emulation (Z2) and Prototyping (X2)
• Palladium: What Are ICE and IXCOM Compile Flow
• Palladium: How to Process a Design to Run on Palladium
• Palladium: XCOM Compile Flow (TB+RTL to Palladium Database)
• Palladium: ICE Compile Flow (RTL to Palladium Database)
• Palladium: Legacy ICE Compile Flow
• Palladium: Cadence Software Releases for Palladium and Protium Flow
• Palladium: Setting of PATHs for Using Palladium
• Palladium: Z2 Hardware Structure (Blade and Boards)
• Palladium: What Is Sourceless and Loadless nets
• Palladium: Design Clocks
• Palladium: Step Count and Step Clock
• Palladium: Steps for Running the Design on Palladium Z2

Related Courses

• Verilog Language and Application Training
• SystemVerilog for Design and Verification
• Xcelium Simulator

Related Blogs

• Training Insights – A New Free Online Course on the Protium System for Beginner and Advanced Users
• It’s the Digital Era; Why Not Showcase Your Brand Through a Digital Badge!
• Training Insights - Free Online Courses on Cadence Learning and Support Portal

The demand for higher compute performance, energy efficiency, and faster time-to-market drove the conversations at this year's Open Compute Project (OCP) Global Summit in San Jose, California. It was the scene of showcasing groundbreaking innovations, expert-led sessions, and networking opportunities to drive the future of data center technology. For those who didn't get to attend or stop by our booth, here's a recap of Cadence's comprehensive solutions that enable next-generation compute technology, AI data center design, analysis, and optimization. Optimized Data Center Design and Operations As the data center community increasingly faces demands for enhanced efficiency, thermal management, sustainability, and performance optimization, data center operators, IT managers, and executives are looking for solutions to these challenges. At the Cadence booth, attendees explored the Cadence Reality Digital Twin Platform and Celsius EC Solver. These technologies are pivotal in achieving high-performance standards for AI data centers, providing advanced digital twin modeling capabilities that redefine next-generation data center design and operation. The Celsius EC Solver demonstration showed how it solves challenging thermal and electronics cooling management problems with precision and speed. CadenceCONNECT: Take the Heat Out of Your AI Data Center Cadence hosted a networking reception on October 16 titled "Take the Heat Out of Your AI Data Center." In today's AI era, managing the heat generated by high-density computing environments is more critical than ever. This reception offered insights into current and emerging data center technologies, digital twin cooling strategies that deliver energy-saving operations, and a chance to engage with industry leaders, Cadence experts, and peers to explore the latest cooling, AI, and GPU acceleration advancements. Here's a recap: Researcher, author, and entrepreneur Dr. Jon Koomey highlighted the inefficiency of data centers in his talk "The Rise of Zombie Data Centers," noting that 20-30% of their capacity is stranded and unused. He advocated for organizational changes and technological solutions like digital twins to reduce wasted energy and improve computational effectiveness as AI deployments increase. In "A New Millennium in Multiphysics System Analysis," Cadence Corporate VP Ben Gu explained the company's significant strides in multiphysics system analysis, evolving from chip simulation to a broader application of computational software for simulating various physical systems, including entire data centers. He noted that the latest Cadence venture, a digital twin platform for data center optimization, opened the opportunity to use simulation technology to optimize the efficiency of data centers. Senior Software Engineering Group Director Albert Zeng highlighted the Cadence Reality DC suite's ability to transform data center operations through simulation, emphasizing its multi-phase engine for optimal thermal performance and the integration of AI capabilities for enhanced design and management. A panel discussion titled "Turning AI Factory Blueprints into Reality at the Speed of Light" featured industry experts from NVIDIA, Norman Wright Precision Environmental and Power, NV5, Switch Data Centers, and Cadence, who explored the evolving requirements and multidimensional challenges of AI factories, emphasizing the need for collaboration across the supply chain to achieve high-performing and sustainable data centers. Watch the highlights. Transforming Designs from Chips to Data Centers The OCP Global Summit 2024 has reaffirmed its status as a pivotal event for data center professionals seeking to stay at the forefront of technological advancements. Cadence's contributions, from groundbreaking digital twin technologies to innovative cooling strategies, have shed light on the path forward for efficient, sustainable data centers. For data center professionals, IT managers, and engineers, the insights gained at this summit are invaluable in navigating the challenges and opportunities presented by the burgeoning AI era. Partnering with Arm Arm Total Design Cadence is a member of the Arm Total Design program. At an invitation-only special Arm event, Cadence's VP of Research and Development, Lokesh Korlipara, delivered a presentation focusing on data center challenges and design solutions with Arm Neoverse Compute Subsystem (CSS). The session highlighted: Efficient integration of Arm Neoverse CSS into system on chips (SoCs) with pre-integrated connectivity IP Performance analysis and verification of the Neoverse CSS integration into the SoC through Cadence's System VIP verification suite and automated testbench creation, enhancing both quality and productivity Jumpstarting designs through Cadence's collaboration with Arm for 3D-IC system planning, chiplets, and interposers Design Services readiness and global scale to support and/or deliver the most demanding Arm Neoverse CSS-based SoC design projects Cadence Supports Arm CSS in Arm Booth During the event, Cadence conducted a demo in the Arm booth that showcased the Cadence System VIP verification suite. The demo highlighted automated testbench creation and performance analysis for integrating the Arm CSS into SoCs while enhancing verification quality and productivity. Summary Cadence offers data center solutions for designing everything from the compute and networking chips to the board, racks, data centers, and campuses. Stay connected with Cadence and other industry leaders to continue exploring the innovations set to redefine the future of data centers. Learn More Cadence Joins Arm Total Design Cadence Arm-Based Solutions Cadence Reality Digital Twin Platform

Hi,

I need to design EPC8002 eGaN switch in cadence. Can someone provide me step by step guide on hoe to add EPC8002 into my cadence. I am working on BCD180.

Thank you 

Ihsan

hello,

We have a number of workstations with version 17.2 that work on a floating license server

We want to know if it can be upgraded to version 17.4

If so, should the floating license server be upgraded as well?

In addition, how can you know where the license was purchased from?

Thanks!

Hi,
I want to parameterized width and length of a NMOS, but it ignore it and I face this error:
*WARNING* Value input must be a number - setting back to previous value.

Does anybody know how I can fix this issue?
Thanks

If you have seen any images or demonstrations of the 17.4-2019 release, the GUI may look ...(read more)

Dear all,

Hi!

I'm trying to do a Harmonic Balance (HB) Large-Signal S-Parameter (LSSP) simulation to figure out the input impedance of a nonlinear circuit.

Through this simulation, what I want to know is the large-signal S11 only (not S12, S21 and S22).

So, I have simulated with only single port (PORT0) at input, but LSSP simulation is terminated and output log shows following text.

" Analysis `hb' was terminated prematurely due to an error "

The LSSP simulation does not proceed without second port.

Should I use floating second port (which is not necessary for my circuit) to succeed the LSSP simulation?

Does the LSSP simulation really need two ports?

Below figure is my HB LSSP simulation setup.

Additionally, Periodic S-Parameter (PSP) simulation using HB is succeeded with only single port.

What is the difference between PSP and LSSP simulations?

Dear Community,

I have created a PCB board and let's say I have found some parts of the PCB board where there are impedance issues, then how to resolve that impedance issue using the OrCAD X Professional.

Regards,

Rohit Rohan

Optimizing PCB thermal performance is essential in today’s high-density designs, as it ensures stability, prolongs component life, and prevents potential thermal issues. One of the first steps to achieving this is with strategic component placement. Positioning high-power components—such as regulators, power transistors, or processors—away from heat-sensitive parts can prevent thermal interference, and placing them near the edges of the PCB often helps dissipate heat more effectively. It’s also beneficial to group components by their heat generation, creating dedicated thermal zones that can manage localized heating and reduce impact on other areas of the board.

Using thermal vias is another effective technique. By placing thermal vias under components like BGAs or power ICs, heat can be transferred from the surface to internal layers or ground planes. Increasing the size and number of these vias, or using thicker plating, enhances heat conductivity and helps manage heat more evenly across layers in multilayer boards. Increasing copper thickness on the PCB also has a major impact. Opting for thicker copper layers (e.g., 2 oz or even 3 oz copper) significantly boosts the heat dissipation capabilities of power planes and traces, especially in high-current areas. Large copper planes, such as dedicated ground or power planes, are equally effective in spreading heat efficiently. Adding thermal pads directly beneath heat-generating components improves this heat distribution.

Thermal relief pads help regulate heat flow for through-hole components by controlling heat transfer, which reduces thermal stress during soldering and prevents excessive heat spread to nearby sensitive areas. Performing thermal analysis with software tools like Celsius can be invaluable, as it allows you to simulate and model heat distribution, spot potential thermal issues, and refine your design before finalizing it.

Using heat sinks and thermal pads provides a direct way to draw heat from high-power components. Heat sinks can be attached with thermal adhesives, screws, or clamps, while thermal interface materials (TIMs), such as thermal pads or conductive adhesives, further reduce thermal resistance, enhancing heat-transfer efficiency. Optimizing the PCB layer stackup is also a key factor. Dedicated ground and power layers improve heat conduction across the PCB, enabling heat transfer between layers, particularly in high-density and multilayer PCBs.

In designs with high power requirements, active cooling options like fans, blowers, or heat pipes can be essential, helping to direct airflow across the PCB and further improving heat dissipation. Adding ventilation slots around hot zones and considering passive cooling paths enhance natural airflow, making the design more thermally efficient. By combining several of these techniques, you can create a PCB that handles heat effectively, resulting in a robust, long-lasting, and reliable product.

Let us know if you’ve had any challenges with thermal management in your designs—I’d be glad to discuss further!

Research by fDi Intelligence reveals which countries receive more than their ‘expected share’ of FDI. 

Serbia’s minister of finance, Siniša Mali, explains why the country is one of Europe's economic stars, and how its FDI levels have risen on the back of this.

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Despite its thriving automotive sector, Gothenburg is vulnerable to global economic pressures. However, local authorities are confident that their strategies will see the city ride out the uncertainties related to Brexit and the US-China trade wars.

Investors in France will face greater scrutiny under extended legislation.

Santander head on the tightrope banks must walk in providing finance to support green transition, without shunning coal-reliant poorer nations.

JPMorgan has pledged to push clients towards aligning with the Paris Agreement

Over the past three years, the UK has led Europe for financial services FDI, with the US as top investor. Emma McCoy reports.

Paul Mescal, Denzel Washington, and Pedro Pascal face off in Ridley Scott's "Gladiator II." Review.

The best two headphones deals ahead of Black Friday are the Bose QuietComfort Ultra earbuds on sale for $229 and the Sony WH-1000XM5 headphones for $102.99 off.

Thanks to Intel, a feature-laden new generation of AI-enhanced PCs hit the market just in time for the holidays.

Among the artists using AI to enhance and accelerate their creative endeavors is Sabour Amirazodi, a creator and tech marketing and workflow specialist at NVIDIA.

A new AI-powered, imaging-based technology that creates accurate three-dimensional models of tumors, veins and other soft tissue offers a promising new method to help surgeons operate on, and better treat, breast cancers. The technology, from Illinois-based startup SimBioSys, converts routine black-and-white MRI images into spatially accurate, volumetric images of a patient’s breasts. It then illuminates Read Article

Robotics developers can greatly accelerate their work on AI-enabled robots, including humanoids, using new AI and simulation tools and workflows that NVIDIA revealed this week at the Conference for Robot Learning (CoRL) in Munich, Germany. The lineup includes the general availability of the NVIDIA Isaac Lab robot learning framework; six new humanoid robot learning workflows Read Article

This GFN Thursday, the GeForce NOW Priority membership is getting enhancements and a fresh name to go along with it. The new Performance membership offers more GeForce-powered premium gaming — at no change in the monthly membership cost. Gamers having a hard time deciding between the Performance and Ultimate memberships can take them both for Read Article

THE Ministry of Commerce yesterday added two United States companies to the Unreliable Entity List over their involvement in arms sales to China’s Taiwan region. In a statement, the ministry said it

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.