Hello All,

I'm currently using OrCAD PCB Designer Professional w/ PSpice (version 16.6-2015).  In the 'Design Object Find Filter' side bar, all options are grayed out and unselectable.  I did attempt to 'Reset UI to Cadence Default' without any luck.  A colleague has no issues with the identical file on his computer.  Any guidance would be much appreciated.  Thanks!

George

Hi,

I have a new customer that uses Allegro Design entry HDL for the schematic and have a few questions.

1. How do you get pin/gate swaps into the symbols in the schematic ?

2. How do you transfer them to the pcb editor ?

3. How do you back annotate the swaps from the pcb editor to the schematic ?

4. How do you stop the export/Import physical from updating the constraints in the pcb file ? 

Hi all 

Good day.

Can anyone tell me whether it is possible to view the signals once it is modified from its previous values without closing the simvision window. If possible kindly let me know the command for it(Linux).

 Is it possible to view the schematic for the code written?? Kindly instruct me.

 Thanks all.

S K S 

Try looking at www.solidwoodkitchen.co.uk. They have some amazing designs and prices.

Kitchen Design Manchester

Hello,

I find a strange issue when using design variable -> right-click -> copy from cellview in assembler. Cadence version is IC618-64b. 500.9

In fact, I set the value of variable (e.g., AAA = 100), then after I right-click -> copy from cellview, AAA's is updated to other value. In my opinion "copy from cellview" should only update the missing variable to the list, but not change any variable value. 

Is there any mechanism could change variable value when using "copy from cellview"?

Thanks

Let’s review a key characteristic feature of Cadence Liberate AMS Mixed-Signal Characterization that offers to you ease of use along with many other benefits like automation of standard Liberty model creation and improvement of up to 20X throughput.(read more)

Optimizing power can be a very convoluted and crucial process. To make design chips meet throughput goals along with optimal power consumption, you need to plan right from the beginning! (read more)

Key Findings:  Nearly 100% of SoCs are mixed-signal to some extent.  Every one of these could benefit from the use of a metrics-driven unified verification methodology for mixed-signal (MD-UVM-MS), but the modeling step is the biggest hurdle to overcome.  Without the magical models, the process breaks down for lack of performance, or holes in the chip verification.

In the last installment of The Low Road, we were at the mixed-signal verification party. While no one talked about it, we all saw it: The party was raging and everyone was having a great time, but they were all dancing around that big elephant right in the middle of the room. For mixed-signal verification, that elephant is named Modeling.

To get to a fully verified SoC, the analog portions of the design have to run orders of magnitude faster than the speediest SPICE engine available. That means an abstraction of the behavior must be created. It puts a lot of people off when you tell them they have to do something extra to get done with something sooner. Guess what, it couldn’t be more true. If you want to keep dancing around like the elephant isn’t there, then enjoy your day. If you want to see about clearing the pachyderm from the dance floor, you’ll want to read on a little more….

Figure 1: The elephant in the room: who’s going to create the model?

 Whose job is it?

Modeling analog/mixed-signal behavior for use in SoC verification seems like the ultimate hot potato.  The analog team that creates the IP blocks says it doesn't have the expertise in digital verification to create a high-performance model. The digital designers say they don’t understand anything but ones and zeroes. The verification team, usually digitally-centric by background, are stuck in the middle (and have historically said “I just use the collateral from the design teams to do my job; I don’t create it”).

If there is an SoC verification team, then ensuring that the entire chip is verified ultimately rests upon their shoulders, whether or not they get all of the models they need from the various design teams for the project. That means that if a chip does not work because of a modeling error, it ought to point back to the verification team. If not, is it just a “systemic error” not accounted for in the methodology? That seems like a bad answer.

That all makes the most valuable guy in the room the engineer, whose knowledge spans the three worlds of analog, digital, and verification. There are a growing number of “mixed-signal verification engineers” found on SoC verification teams. Having a specialist appears to be the best approach to getting the job done, and done right.

So, my vote is for the verification team to step up and incorporate the expertise required to do a complete job of SoC verification, analog included. (I know my popularity probably did not soar with the attendees of DVCON with that statement, but the job has to get done).

It’s a game of trade-offs

The difference in computations required for continuous time versus discrete time behavior is orders of magnitude (as seen in Figure 2 below). The essential detail versus runtime tradeoff is a key enabler of verification techniques like software-driven testbenches. Abstraction is a lossy process, so care must be taken to fully understand the loss and test those elements in the appropriate domain (continuous time, frequency, etc.).

Figure 2: Modeling is required for performance

AFE for instance

The traditional separation of baseband and analog front-end (AFE) chips has shifted for the past several years. Advances in process technology, analog-to-digital converters, and the desire for cost reduction have driven both a re-architecting and re-partitioning of the long-standing baseband/AFE solution. By moving more digital processing to the AFE, lower cost architectures can be created, as well as reducing those 130 or so PCB traces between the chips.

There is lots of good scholarly work from a few years back on this subject, such as Digital Compensation of Dynamic Acquisition Errors at the Front-End of ADCS and Digital Compensation for Analog Front-Ends: A New Approach to Wireless Transceiver Design.

Figure 3: AFE evolution from first reference (Parastoo)

The digital calibration and compensation can be achieved by the introduction of a programmable solution. This is in fact the most popular approach amongst the mobile crowd today. By using a microcontroller, the software algorithms become adaptable to process-related issues and modifications to protocol standards.

However, for the SoC verification team, their job just got a whole lot harder. To determine if the interplay of the digital control and the analog function is working correctly, the software algorithms must be simulated on the combination of the two. That is, here is a classic case of inseparable mixed-signal verification.

So, what needs to be in the model is the big question. And the answer is, a lot. For this example, the main sources of dynamic error at the front-end of ADCs are critical for the non-linear digital filtering that is highly frequency dependent. The correction scheme must be verified to show that the nonlinearities are cancelled across the entire bandwidth of the ADC. 

This all means lots of simulation. It means that the right level of detail must be retained to ensure the integrity of the verification process. This means that domain experience must be added to the list of expertise of that mixed-signal verification engineer.

Back to the pachyderm

There is a lot more to say on this subject, and lots will be said in future posts. The important starting point is the recognition that the potential flaw in the system needs to be examined. It needs to be examined by a specialist.  Maybe a second opinion from the application domain is needed too.

So, put that cute little elephant on your desk as a reminder that the beast can be tamed.

Steve Carlson

Related stories

- It’s Late, But the Party is Just Getting Started

Key Findings: Many more design teams will be reaching the mixed-signal methodology tipping point in 2015. That means you need to have a (verification) plan, and measure and execute against it.

As 2014 draws to a close, it is time to look ahead to the coming years and make a plan. While the macro view of the chip design world shows that is has been a mixed-signal world for a long time, it is has been primarily the digital teams that have rapidly evolved design and verification practices over the past decade. Well, I claim that is about to change. 2015 will be a watershed year for many more design teams because of the following factors:

• 85% of designs are mixed signal, and it is going to stay that way (there is no turning back)
• Advanced node drives new techniques, but they will be applied on all nodes
• Equilibrium of mixed-signal designs being challenged, complexity raises risk level
• Tipping point signs are evident and pervasive, things are going to change
• The convergence of “big A” and “big D” demands true mixed-signal practices

Reason 1: Mixed-signal is dominant

To begin the examination of what is going to change and why, let’s start with what is not changing. IBS reports that mixed signal accounts for over 85% of chip design starts in 2014, and that percentage will rise, and hold steady at 85% in the coming years. It is a mixed-signal world and there is no turning back!

Figure 1. IBS: Mixed-signal design starts as percent of total

The foundational nature of mixed-signal designs in the semiconductor industry is well established. The reason it is exciting is that a stable foundation provides a platform for driving change. (It’s hard to drive on crumbling infrastructure.  If you’re from California, you know what I mean, between the potholes on the highways and the earthquakes and everything.)

Reason 2: Innovation in many directions, mostly mixed-signal applications

While the challenges being felt at the advanced nodes, such as double patterning and adoption of FinFET devices, have slowed some from following onto to nodes past 28nm, innovation has just turned in different directions. Applications for Internet of Things, automotive, and medical all have strong mixed-signal elements in their semiconductor content value proposition. What is critical to recognize is that many of the design techniques that were initially driven by advanced-node programs have merit across the spectrum of active semiconductor process technologies. For example, digitally controlled, calibrated, and compensated analog IP, along with power-reducing mutli-supply domains, power shut-off, and state retention are being applied in many programs on “legacy” nodes.

Another graph from IBS shows that the design starts at 45nm and below will continue to grow at a healthy pace.  The data also shows that nodes from 65nm and larger will continue to comprise a strong majority of the overall starts. 

Figure 2.  IBS: Design starts per process node

TSMC made a comprehensive announcement in September related to “wearables” and the Internet of Things. From their press release:

TSMC’s ultra-low power process lineup expands from the existing 0.18-micron extremely low leakage (0.18eLL) and 90-nanometer ultra low leakage (90uLL) nodes, and 16-nanometer FinFET technology, to new offerings of 55-nanometer ultra-low power (55ULP), 40ULP and 28ULP, which support processing speeds of up to 1.2GHz. The wide spectrum of ultra-low power processes from 0.18-micron to 16-nanometer FinFET is ideally suited for a variety of smart and power-efficient applications in the IoT and wearable device markets. Radio frequency and embedded Flash memory capabilities are also available in 0.18um to 40nm ultra-low power technologies, enabling system level integration for smaller form factors as well as facilitating wireless connections among IoT products.

Compared with their previous low-power generations, TSMC’s ultra-low power processes can further reduce operating voltages by 20% to 30% to lower both active power and standby power consumption and enable significant increases in battery life—by 2X to 10X—when much smaller batteries are demanded in IoT/wearable applications.

The focus on power is quite evident and this means that all of the power management and reduction techniques used in advanced node designs will be coming to legacy nodes soon.

Integration and miniaturization are being pursued from the system-level in, as well as from the process side. Techniques for power reduction and system energy efficiency are central to innovations under way.  For mixed-signal program teams, this means there is an added dimension of complexity in the verification task. If this dimension is not methodologically addressed, the level of risk adds a new dimension as well.

Reason 3: Trends are pushing the limits of established design practices

Risk is the bane of every engineer, but without risk there is no progress. And, sometimes the amount of risk is not something that can be controlled. Figure 3 shows some of the forces at work that cause design teams to undertake more risk than they would ideally like. With price and form factor as primary value elements in many growing markets, integration of analog front-end (AFE) with digital processing is becoming commonplace.  

Figure 3.  Trends pushing mixed-signal out of equilibrium

The move to the sweet spot of manufacturing at 28nm enables more integration, while providing excellent power and performance parameters with the best cost per transistor. Variation becomes great and harder to control. For analog design, this means more digital assistance for calibration and compensation. For greatest flexibility and resiliency, many will opt for embedding a microcontroller to perform the analog control functions in software. Finally, the first wave of leaders have already crossed the methodology bridge into true mixed-signal design and verification; those who do not follow are destined to fall farther behind.

Reason 4: The tipping point accelerants are catching fire

The factors cited in Reason 3 all have a technical grounding that serves to create pain in the chip-development process. The more factors that are present, the harder it is to ignore the pain and get the treatment relief  afforded by adopting known best practices for truly mixed-signal design (versus divide and conquer along analog and digital lines design).

In the past design performance was measured in MHz with simple static timing and power analysis. Design flows were conveniently partitioned, literally and figuratively, along analog and digital boundaries. Today, however, there are gigahertz digital signals that interact at the package and board level in analog-like ways. New, dynamic power analysis methods enabled by advanced library characterization must be melded into new design flows. These flows comprehend the growing amount of feedback between analog and digital functions that are becoming so interlocked as to be inseparable. This interlock necessitates design flows that include metrics-driven and software-driven testbenches, cross fabric analysis, electrically aware design, and database interoperability across analog and digital design environments.

Figure 4.  Tipping point indicators

Energy efficiency is a universal driver at this point.  Be it cost of ownership in the data center or battery life in a cell phone or wearable device, using less power creates more value in end products. However, layering multiple energy management and optimization techniques on top of complex mixed-signal designs adds yet more complexity demanding adoption of “modern” mixed-signal design practices.

Reason 5: Convergence of analog and digital design

Divide and conquer is always a powerful tool for complexity management.  However, as the number of interactions across the divide increase, the sub-optimality of those frontiers becomes more evident. Convergence is the name of the game.  Just as analog and digital elements of chips are converging, so will the industry practices associated with dealing with the converged world.

Figure 5. Convergence drivers

Truly mixed-signal design is a discipline that unites the analog and digital domains. That means that there is a common/shared data set (versus forcing a single cockpit or user model on everyone). 

In verification the modern saying is “start with the end in mind”. That means creating a formal approach to the plan of what will be test, how it will be tested, and metrics for success of the tests. Organizing the mechanics of testbench development using the Unified Verification Methodology (UVM) has proven benefits. The mixed-signal elements of SoC verification are not exempted from those benefits.

Competition is growing more fierce in the world for semiconductor design teams. Not being equipped with the best-known practices creates a competitive deficit that is hard to overcome with just hard work. As the landscape of IC content drives to a more energy-efficient mixed-signal nature, the mounting risk posed by old methodologies may cause causalities in the coming year. Better to move forward with haste and create a position of strength from which differentiation and excellence in execution can be forged.

Summary

2015 is going to be a banner year for mixed-signal design and verification methodologies. Those that have forged ahead are in a position of execution advantage. Those that have not will be scrambling to catch up, but with the benefits of following a path that has been proven by many market leaders.

Key Findings:  There are a host of issues that arise in mixed-signal verification.  As discussed in earlier blogs, the industry trends indicate that teams need to prepare themselves for a more mixed world.  The good news is that these top five pitfalls are all avoidable.

It’s always interesting to study the human condition.  Watching the world through the lens of mixed-signal verification brings an interesting microcosm into focus.  The top 5 items that I regularly see vexing teams are:

1. When there’s a bug, whose problem is it?
2. Verification team is the lightning rod
3. Three (conflicting) points of view
4. Wait, there’s more… software
5. There’s a whole new language

Reason 1: When there’s a bug, whose problem is it?

It actually turns out to be a good thing when a bug is found during the design process.  Much, much better than when the silicon arrives back from the foundry of course. Whether by sheer luck, or a structured approach to verification, sometimes a bug gets discovered. The trouble in mixed-signal design occurs when that bug is near the boundary of an analog and a digital domain.

Figure 1.   Whose bug is it?

Typically designers are a diligent sort and make sure that their block works as desired. However, when things go wrong during integration, it is usually also project crunch time. So, it has to be the other guy’s bug, right?

A step in the right direction is to have a third party, a mixed-signal verification expert, apply rigorous methods to the mixed-signal verification task.  But, that leads to number 2 on my list.

Reason 2: Verification team is the lightning rod

Having a dedicated verification team with mixed-signal expertise is a great start, but what can typically happen is that team is hampered by the lack of availability of a fast executing model of the analog behavior (best practice today being a SystemVerilog real number model – SV_RNM). That model is critical because it enables orders of magnitude more tests to be run against the design in the same timeframe. 

Without that model, there will be a testing deficit. So, when the bugs come in, it is easy for everyone to point their finger at the verification team.

Figure 2.  It’s the verification team’s fault

Yes, the model creates a new validation task – it’s validation – but the speed-up enabled by the model more than compensates in terms of functional coverage and schedule.

The postscript on this finger-pointing is the institutionalization of SV-RNM. And, of course, the verification team gets its turn.

Figure 3.  Verification team’s revenge

Reason 3: Three (conflicting) points of view

The third common issue arises when the finger-pointing settles down. There is still a delineation of responsibility that is often not easy to achieve when designs of a truly mixed-signal nature are being undertaken.  

Figure 4.  Points of view and roles

Figure 4 outlines some of the delegated responsibility, but notice that everyone is still potentially on the hook to create a model. It is questions of purpose, expertise, bandwidth, and convention that go into the decision about who will “own” each model. It is not uncommon for the modeling task to be a collaborative effort where the expertise on analog behavior comes from the analog team, while the verification team ensures that the model is constructed in such a manner that it will fit seamlessly into the overall chip verification. Less commonly, the digital design team does the modeling simply to enable the verification of their own work.

Reason 4: Wait, there’s more… software

As if verifying the function of a chip was not hard enough, there is a clear trend towards product offerings that include software along with the chip. In the mixed-signal design realm, many times this software has among its functions things like calibration and compensation that provide a flexible way of delivering guards against parameter drift. When the combination of the chip and the software are the product, they need to be verified together. This puts an enormous premium on fast executing SV-RNM.

Figure 5.   There’s software analog and digital

While the added dimension of software to the verification task creates new heights of complexity, it also serves as a very strong driver to get everyone aligned and motivated to adopt best known practices for mixed-signal verification.  This is an opportunity to show superior ability!

Figure 6.  Change in perspective, with the right methodology

Reason 5: There’s a whole new language

Communication is of vital importance in a multi-faceted, multi-team program.  Time zones, cultures, and personalities aside, mixed-signal verification needs to be a collaborative effort.  Terminology can be a big stumbling block in getting to a common understanding. If we take a look at the key areas where significant improvement can usually be made, we can start to see the breadth of knowledge that is required to “get” the entirety of the picture:

• Structure – Verification planning and management
• Methodology – UVM (Unified Verification Methodology – Accellera Standard)
• Measure – MDV (Metrics-driven verification)
• Multi-engine – Software, emulation, FPGA proto, formal, static, VIP
• Modeling – SystemVerilog (discrete time) down to SPICE (continuous time)
• Languages – SystemVerilog, Verilog, Verilog-AMS, VHDL, SPICE, PSL, CPF, UPF

Each of these areas has its own jumble of terminology and acronyms. It never hurts to create a team glossary to start with. Heck, I often get my LDO, IFV, and UDT all mixed up myself.

Summary

Yes, there are a lot of things that make it hard for the humans involved in the process of mixed-signal design and verification, but there is a lot that can be improved once the pain is felt (no pain, no gain is akin to no bugs, no verification methodology change). If we take a look at the key areas from the previous section, we can put a different lens on them and describe the value that they bring:

• Structure – Uniformly organized, auditable, predictable, transparency
• Methodology – Reusable, productive, portable, industry standard
• Measure – Quantified progress, risk/quality management, precise goals
• Multi-engine – Faster execution, improved schedule, enables new quality level
• Modeling – Enabler, flexible, adaptable for diverse applications/design styles
• Languages – Flexible, complete, robust, standard, scalability to best practices

With all of this value firmly in hand, we can turn our thoughts to happier words:

…  stay tuned for more!

 Steve Carlson

Analog and Mixed-signal (AMS) designs are increasingly using active power management to minimize power consumption. Typical mixed-signal design uses several power domains and operate in a dozen or more power modes including multiple functional, standby and test modes. To save power, parts of design not active in a mode are shut down or may operate at reduced supply voltage when high performance is not required. These and other low power techniques are applied on both analog and digital parts of the design. Digital designers capture power intent in standard formats like Common Power Format (CPF), IEEE1801 (aka Unified Power Format or UPF) or Liberty and apply it top-down throughout design, verification and implementation flows. Analog parts are often designed bottom-up in schematic without upfront defined power intent. Verifying that low power intent is implemented correctly in mixed-signal design is very challenging. If not discovered early, errors like wrongly connected power nets, missing level shifters or isolations cells can cause costly rework or even silicon re-spin. 

Mixed-signal designers rely on simulation for functional verification. Although still necessary for electrical and performance verification, running simulation on so many power modes is not an effective verification method to discover low power errors. It would be nice to augment simulation with formal low power verification but a specification of power intent for analog/mixed-signal blocs is missing. So how do we obtain it? Can we “extract” it from already built analog circuit? Fortunately, yes we can, and we will describe an automated way to do so!

Virtuoso Power Manager is new tool released in the Virtuoso IC6.1.8 platform which is capable of managing power intent in an Analog/MS design which is captured in Virtuoso Schematic Editor. In setup phase, the user identifies power and ground nets and registers special devices like level shifters and isolation cells. The user has the option to import power intent into IEEE1801 format, applicable for top level or any of the blocks in design. Virtuoso Power Manager uses this information to traverse the schematic and extract complete power intent for the entire design. In the final stage, Virtuoso Power Manager exports the power intent in IEEE1801 format as an input to the formal verification tool (Cadence Conformal-LP) for static verification of power intent.

Cadence and Infineon have been collaborating on the requirements and validation of the Virtuoso Power Manager tool and Low Power verification solution on real designs. A summary of collaboration results were presented at the DVCon conference in Munich, in October of 2018.  Please look for the paper in the conference proceedings for more details. Alternately, can view our Cadence webinar on Verifying Low-Power Intent in Mixed-Signal Design Using Formal Method for more information.

Do you want to create designs that are correct by construction? Read along this blog to understand how you can achieve this by using Width Spacing Patterns (WSPs) in your designs. WSPs, are track lines that provide guidance for quickly creating wires. Defining WSPs that capture the width-dependent spacing rules, and snapping the pathSegs of a wire to them, ensures that the wires meet width-dependent spacing rules.(read more)

PARIS, France – August 27, 2019 – Dassault Systèmes, the 3DEXPERIENCE Company, world leader in 3D design software, 3D Digital Mock Up and Product Lifecycle Management (PLM) solutions, today announces that it has received its first long-term issuer credit rating. S&P Global Ratings has assigned to Dassault Systèmes a rating of ‘A-‘with a stable outlook and “Strong” business risk profile. The “Strong” business risk profile notably reflects S&P Global Ratings’ view of the Group’s high...

•Customers can seamlessly extend their design to manufacturing ecosystem to the cloud with the integrated 3DEXPERIENCE.WORKS portfolio, enabling new levels of functionality, collaboration, agility and operational efficiency •Latest release of 3D design and engineering portfolio features hundreds of enhancements, new capabilities and workflows to accelerate and improve product development •Over six million SOLIDWORKS users can innovate products faster with better performance and streamlined...

Proof of concept denial of service exploit for the recent OpenSSL signature_algorithms_cert vulnerability.

This whitepaper goes into detail on design and implementation details for performing voice encryption on telephone networks. Written in Spanish.

The IntegerInterleavedRaster.verify() method in Oracle Java versions prior to 7u25 is vulnerable to a signed integer overflow that allows bypassing of "dataOffsets[0]" boundary checks. This exploit code demonstrates remote code execution by popping calc.exe. It was obtained through the Packet Storm Bug Bounty program.

The BytePackedRaster.verify() method in Oracle Java versions prior to 7u25 is vulnerable to a signed integer overflow that allows bypassing of "dataBitOffset" boundary checks. This exploit code demonstrates remote code execution by popping calc.exe. It was obtained through the Packet Storm Bug Bounty program.

An exploitable Permission Assignment vulnerability exists in the ACEManager EmbeddedAceSet_Task.cgi functionality of Sierra Wireless AirLink ES450 FW 4.9.3. A specially crafted HTTP request can cause a arbitrary setting writes, resulting in the unverified changes to any system setting. An attacker can make an authenticated HTTP request, or run the binary as any user, to trigger this vulnerability.

On June 12, Target corporation said it was increasing its renewable energy goals by committing to source 100 percent of its electricity from renewable sources by 2030. The goal applies to all of Target’s domestic operations.

The Clean Power Alliance (CPA) has signed three long-term power purchase agreements, including two new solar projects and one existing small hydro project.

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MORE THAN 170 NEWS OUTLETS from around the world have now signed up for Covering Climate Now, a project co-founded by CJR and The Nation aimed at strengthening the media’s focus on the climate crisis.

This week, Canadian Solar said that it has won three solar power contracts with Alberta’s Ministry of Infrastructure, for a total of 94 megawatts (MWp) of solar power system in southeast Alberta, with an average contracted PPA price of 48.05 Canadian dollars [US 36.27] per MWh. When in operation in 2021, these solar plants will provide 55 percent of the electricity needs for Alberta provincial government.

California-based solar developer Sunpin Solar said that Direct Energy Business, a subsidiary of Centrica PLC, signed a power purchase agreement (PPA) for the full output of the recently completed 96.75-MW DC / 74.8-MW AC ColGreen North Shore Power Plant.

On Friday, New Mexico Gov. Michelle Lujan Grisham signed the state’s groundbreaking Energy Transition Act (ETA) into law, meaning that by 2045, the state should be fully powered by clean, carbon-free electricity.

Idaho Power unveiled a goal Tuesday to provide 100-percent clean energy by 2045 on the heels of an announcement that it will purchase 120-MW of solar energy through a PPA with Jackpot Holdings at a price of less than US $0.022 cents per kWh.

Today, Alabama Municipal Electric Authority (AMEA) and Lightsource BP announced the development of a 100-MW (AC) solar energy project in Montgomery County, Alabama. Lightsource BP will finance, develop, build, own, and operate the solar facility and will deliver energy to AMEA under a 20-year power purchase agreement (PPA). The project, situated 15 miles from AMEA’s headquarters in Montgomery, will supply clean energy to AMEA’s 11 Member utilities located across the state and will generate enough electricity to power more than 20,000 homes.

LONGi Solar this week said that it has invented a new “seamless soldering” technique that could help it produce a more efficient solar module. As a reminder, the more solar cells you can pack into a module, the more efficient it is. And the more efficient your modules, the fewer you need to achieve the wattage you seek in an array. By using less modules, you reduce the overall installed cost of solar.

On June 12, Target corporation said it was increasing its renewable energy goals by committing to source 100 percent of its electricity from renewable sources by 2030. The goal applies to all of Target’s domestic operations.

The Clean Power Alliance (CPA) has signed three long-term power purchase agreements, including two new solar projects and one existing small hydro project.

MORE THAN 170 NEWS OUTLETS from around the world have now signed up for Covering Climate Now, a project co-founded by CJR and The Nation aimed at strengthening the media’s focus on the climate crisis.

Care Technology provides technological solutions to the needs of customers through innovations like energy-efficient LED lighting and transportable heat sources that operate without power racks or induction heaters. We spoke to co-founder Belinda Wong about the production of their sustainable offerings and the benefits of green technology.

Clean energy advocates rejoiced as legislation was passed today in New Jersey that will support the development of a massive amount of renewable energy, specifically community solar, energy storage, offshore wind and energy efficiency. The bill also props up nuclear power in the state with the establishment of zero-emission certificates.