Let’s face it – the EDA industry needs new people and new ideas. One of the best places to find both is academia, and a presentation at the Cadence Theater at the recent Design Automation Conference (DAC 2015) described collaboration models that are working today.

The presentation was titled “Industry/Academia Engagement Models – From PhD Contests to R&D Collaborations.” It included these speakers, shown from left to right in the photo below:

• Prof. Xin Li, Electrical and Computer Engineering, Carnegie-Mellon University (CMU)
• Chuck Alpert, Senior Software Architect, Cadence
• Prof. Laleh Behjat, Department of Electrical and Computer Engineering, University of Calgary

Alpert, who was filling in for Zhuo Li, Software Architect at Cadence, was the vice chair of DAC 2015 and will be the general chair of DAC 2016 in Austin, Texas. “My team at Cadence really likes to collaborate with universities,” he said. “We’re a big proponent of education because we really need the best and brightest students in our industry.”

Contests Boost EDA Research

One way that Cadence collaborates with academia is participation in contests. “It’s a great way to formulate problems to academia,” Alpert said. “We can have the universities work on these problems and get some strategic direction.”

For example, Cadence has been involved with the annual CAD contest at the International Conference on Computer-Aided Design (ICCAD) since the contest was launched in 2012. This is the largest worldwide EDA R&D contest, and it is sponsored by the IEEE Council on EDA (CEDA) and the Taiwan Ministry of Education. Its goals are to boost EDA research in advanced real-world problems and to foster industry-academia collaboration.

Contestants can participate in one of more problems in the three areas of system design, logic synthesis and verification, and physical design. The 2015 contest has attracted 112 teams from 12 regions. Cadence contributes one problem per year in the logic synthesis area. Zhuo Li was the 2012 co-chair and the 2013 chair. The awards will be given at ICCAD in November 2015.

Another step that Cadence has taken, Alpert said, is to “hire lots of interns.” His own team has four interns at the moment. One advantage to interning at Cadence, he said, is that students get to see real-world designs and understand how the tools work. “It helps you drive your research in a more practical and useful direction,” he said.

The Cadence Academic Network co-sponsors the ACM SIGDA PhD Forum at DAC, and Xin Li and Zhuo Li are on the organizing committee. This event is a poster session for PhD students to present and discuss their dissertation research with people in the EDA community. This year’s forum was “packed,” Alpert said, and it’s clear that the event needs a bigger room.

Finally, Alpert noted, Cadence researchers write and publish technical papers at DAC and other conferences, and Cadence people serve on the DAC technical program committee. “We try to be involved with the academic community on a regular basis,” Alpert said. “We want the best and the brightest people to go into EDA because there is still so much innovation that’s needed. It’s a really cool place to be.”

Research Collaboration Exposes Failure Rates

Xin Li presented an example of a successful research collaboration between CMU and Cadence. The challenge was to find a better way to estimate potential failure rates in memory. As noted in a previous blog post, PhD student Shupeng Sun met this challenge with a new statistical methodology that won a Best Poster award at the ACM SIGDA PhD Forum at DAC 2014.

The new methodology is called Scaled-Sigma Sampling (SSS). It calculates the failure rate and accounts for variability in the manufacturing process while only requiring a few hundred, or a few thousand, sample circuit blocks. Previously, millions of samples were required for an accurate validation of a new design, and each sample could take minutes or hours to simulate. It could take a few weeks or months to run one validation.

The SSS methodology requires greatly reduced simulation times. It makes it possible, Li noted, to run simulations overnight and see the results in the morning.

Li shared his secret for success in collaborations. “I want to emphasize that before the collaboration, you have to understand the goal. If you don’t have a clear goal, don’t collaborate. Once you define the goal, stick to it and make it happen.”

Contest Provides Learning Experience

Last year Laleh Behjat handed two of her new PhD students a challenge. “I told them there is an ISPD [International Symposium for Physical Design] contest on placement, and I expect you to participate and I expect you to win. Not knowing anything about placement, I don’t think they realized what I was asking them.”

The 2015 contest was called the Blockage-Aware Detailed Routing-Driven Placement Contest. Results were announced at the end of March at ISPD. And the University of Calgary team, despite its lack of placement experience, took second place.

Such contests provide a good learning tool, according to Behjat. Graduate students in EDA, she said, “have to be good programmers. They have to work in teams and be collaborative, be able to innovate, and solve the hardest problems I have seen in engineering and science. And they have to think outside the box.” A contest can bring out all these attributes, she said.

Further, Behjat noted, contest participants had access to benchmarks and to a placement tool. They didn’t have to write tools to find out if their results were good. Industry sponsors, meanwhile, got access to good students and new approaches for solving problems.

“You can see Cadence putting a big amount of time, effort and money to get students here and get them excited about doing contests,” she said. She advised students in the theater audience to “talk to people in the Cadence booth and see if you can have more ideas for collaboration.”

Richard Goering

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EDA Plus Academia: A Perfect Game, Set and Match

Cadence Aims to Strengthen Academic Partnerships

BSIM-CMG FinFET Model – How Academia and Industry Empowered the Next Transistor

I have a set of pads for use in a design and I was wondering which attributes should I put on each pin.

Let's say it has the following pins:

   - inh_vdd, inh_vss, CORE, PAD where the first two are for the pad rings, the CORE pin is to use in the die and the PAD pin is the bonding pad.

I guess CORE would need:

   CLASS CORE

   USE POWER  (or GROUND if this happened to be a ground pad)

What about the inh_vdd and inh_vss? Theyu would not have the CLASS CORE, but would I use USE POWER/GROUND on them too?

   USE POWER (or GROUND)

   SHAPE ABUTMENT

And the bonding pad? Should I put it in the LEF? Or would that cause confusion to innovus or Voltus? And what attributed would it use? USE POWER/GROUND only?

Do I need anything in the LEF to indicate that the pin CORE and the pin PAD are essentially the same thing, just different places on the same power pad?

Hello,

I created a floorplan view in Virtuoso ( it contains pins and blockages). I am trying to run PnR in Innovus for floorplan created in Virtuoso. I used  set vars(oa_fp)    "Library_name cell_name view_name"   to read view from virtuoso. I am able to see pins in Innovus but not the blockages. Can i know how do i get the blockages created in virtuoso to Innovus.

Regards,
Amuu 

Hello Everyone,

I was finishing the layout via Innovus and ran verifyConnectivity followed by checkRoute.

verifyConnectivity was okay and it showed no errors and no warnings, whereas checkRoute showed there are 3 unrouted nets.

When i ran the checkRoute command again immediately, it showed no unrouted/unconnected nets.

Which of these commands should we trust or is this really unrouted nets issue?

Looking forward for a response, thanks in advance.

Regards,

Vijay

Hi,

There was tool available with INCISIV called imc to view the coverage reports.

The question is: How can we view the code coverage reports generated with XCELIUM? I think imc is not available with XCELIUM?

Thanks in advance.

As title,

How to dump waveform, fsdb in SimVision? 
(Simulation Analysis Environment  SimVision(64) 18.09-s001)
Please help.

Thanks.

Unable to open Source Browser. It goes into an infinite loop of loading, with the hour glass displayed and message "loading snapshot".

The deisgn was compilied with "15.20.s028" and that is the same version of simvision I am using to open the code.

The waveform viewer is uo and so is the Design Browser. I can take signals from Design Broweser and view the waveform viewer,

but the source brower hangs.

What should I be looking at to resolve this situation. Many of us at the company are sufferring from it. Colossal waste of time.

. 

Hi Folks, Check out this great new video on YouTube: CDNLive SV 2014: PMC Improves Visibility and Performance with Spectre APS In this video from CDNLive Silicon Valley 2014, Jurgen Hissen, principal engineer, MSCAD, at PMC, discusses an aggressive...(read more)

Hi,

I am running simulation in ADEXL and need a custom function for VIVA to apply same procedure to all signals saved in output. For instance, I have clock nets and I want to get all of them and look at the duty-cycle, edge rate etc.

It is a little more involved than about part since I have some regex and setof to filter before processing but if I can get all signals for current history, I can postprocess them later.

In ocean, I am just doing outputs() and getting all saved signals but I was able to do this in VIVA calculator due to the difficulties in getting current history, test name and opening result directory

thanks

yayla

Version Info:

ICADV12.3 64b 500.21

spectre -W =>

Tool 'cadenceMMSIM' Current project version '16.10.479'
sub-version  16.1.0.479.isr9

Hi all,

I want to write a script SKILL to create the title & frame for view schematic. My question is whether SKILL supports any function for me to do this.

Best regards,

Huy Hoang

I have a top cell & need to revise all the instances' cellview & export top cell as a new GDS file.

So I write a SKILL code to do so and I find out it will be a little bit slow by using the dbSave to save the cellview of each instance.

Code as below:

let( (topCV subCV )
topCV = dbOpenCellViewByType(newLibName topCellName "layout" "maskLayout" "a")
foreach(inst topCV->instances
subCV = dbOpenCellViewByType(newLibName inst->cellName "layout" "maskLayout" "a")
;;;revise code content
;;;...
;;;revise code content
dbSave(subCV)
dbClose(subCV)
)
dbSave(topCV)
dbClose(topCV)
system(strcat( "strmout -library " newLibName " -topCell " topCellName " -view layout -strmFile " resultFolder "/" topCellName ".gds -techLib " srcLibName " -enableColoring -logFile " topCellName "_strmOut.log" ) )
)

Even if the cell content is not revised, the run time of dbSave will be 2 minutes when there are ~ 1000 instances in topcell. The exported GDS file size is ~2MB.

And the dbSave becomes the bottle neck of the code runtime...

Is there any better way to do such a thing? 

It’s always good to hear what real users think of products. Here is a very detailed review (~4000 words) by an Anonymous user, nick named Ant-Man (from the movie). Overall it’s a very strong endorsement of Perspec, and summarize...(read more)

Vegas, here we come. All of us fun EDA engineers at once. Be prepared, next week’s Design Automation Conference will be busy! The trends I had outlined after last DAC in 2018—system design, cloud, and machine learning—have...(read more)

I'm trying to generate IBIS models for the parts that I'm designing.  I'm designing using CADENCE Virtuoso.  

I'm wondering if there is a tutorial for generating IBIS models in CADENCE Virtuoso.   Please pardon me if my question is broad.      

Hi, I want to add values to components in my SiP design such as 1nF or 15nH. There is already in existence a COMP_VALUE property reserved for this as shown during BOM generation. This property is not visible under the Edit/Properties dialog for component or symbol find filters. We have already created user properties called COMP_MFG and COMP_MFG_PN that it editable at a component level. When we try to add COMP_VALUE it is reported as a reserved name in Cadence but this name is not listed in the properties dialog. Is there a way to turn on the visibility and editablility of this or other hidden reserved Cadence property names? How can I assign a string value to the COMP_VALUE property?

Thanks

Hi all,

I have a question regarding the manufacture : how to check a cluster of same net vias spacing, with have no shape or cline covered

Those who work in the IC Packaging design space have some unique challenges. We bridge between the IC design world (90/45-degree traces with rectangular and octagonal pins) and the PCB domain...

[[ Click on the title to access the full blog on the Cadence Community site. ]]

www.youtube.com/watch Made on my balcony (camera Carey Guo) Monday: EDA101 Video Tuesday: Weekend Update Wednesday: RAMAC Park and the Origin of the Disk Drive Thursday: 1G Mobile: AMPS, TOPS, C-450,...

[[ Click on the title to access the full blog on the Cadence Community site. ]]

ST Microelectronics reported their success with IEEE 1801 / UPF low-power simulation using Incisive Enterprise Simulator at CDNLive India in November 2013. We were able to meet with Mohit Jain just after his presentation and recorded this video that explains the key points in his paper.

With eight years of experience and pioneering technology in native low-power simulation, Mohit was able to apply Incisive Enterprise Simulator to a low-power demonstrator in preparation for use with a production set-top box chip.  Mohit was impressed with the ease in which he was able to reuse his existing IEEE 1801 / UPF code successfully, including the power format files and the macro models coded in his Liberty files. Mohit also discusses how he used the power-aware Cadence SimVision debugger.

The Cadence low-power verification solution for IEEE 1801 / UPF also incorporates the patent-pending Power Supply Network visualization in the SimVision debugger.  You can learn more about that in the Incisive low-power verification Rapid Adoption Kit for IEEE 1801 / UPF here in Cadence Online Support.

Just another happy Cadence low-power verification user!

Regards,

 Adam "The Jouler" Sherer 

Freescale was a successful Incisive® simulation CPF low-power user when they decided to step up their game. In November 2013, at CDNLive India, they presented a paper explaining how they improved their ability to find power-related bugs using a more sophisticated verification flow.  We were able to catch up with Abhinav Nawal just after his presentation to capture this video explaining the key points in his paper.

Abhinav had already established a low-power simulation process using directed tests for a design with power intent captured in CPF. While that is a sound approach, it tends to focus on the states associated with each power control module and at least some of the critical power mode changes.  Since the full system can potentially exercise unforeseen combinations of power states, the directed test approach may be insufficient. Abhinav built a more complete low-power verification approach rooted in a low-power verification plan captured in Cadence® Incisive Enterprise Manager.  He still used Incisive Enterprise Simulator and the SimVision debugger to execute and debug his design, but he also added Incisive Metric Center to analyze coverage from his low-power tests and connect that data back to the low-power verification plan.  As a result, he was able to find many critical system-level corner case issues, which, left undetected, would have been catastrophic for his SoC.  In the paper, Abhinav presents some of the key problems this approach was able to find.

You can achieve results similar to Abhinav. Incisive Enterprise Simulator can generate a low-power verification plan from the power format, power-aware assertions, and it can collect power-aware knowledge.  To get started, you can use the Incisive Low-Power Simulation Rapid Adoption Kit (RAK) for CPF available on Cadence Online Support.

Just another happy Cadence low-power verification user!

Regards,

Adam "The Jouler" Sherer  

Hello, i have a realy mistick thing going with copying libraries in cadence virtuoso,

When i copy straight forwart the whole library it gives me a warning that accsess was denied,but when i go into the library and copy it as a single file, then it goes fine.

another problem is it doesnt show in the massage console  ALL the files which could not be copied.(which is the much bigger problem,becuase i would have to pass threw all the subdirectories to verify if all files are there)

Is there a way to see which files wasnt able to be copied?

Thanks. 

Hello , i am trying to extract netlist from a circuit  in assembler

I have found the manual shown bellow , however there is no such option in tools in assembler.

how do i view the NETLIST of this circuit?

Thanks.

ASSEMBLER VIEW menu

Hello, I have a problem with a certain type of transistor,my hyrarchy has a lot components an sub components and visually inspecting them is very hard.

is there a way like in other cadence layout viewer tools , to enter the name of the component or a NET somewhere and it will focus on it visualy or give the hyrarchy path to it?

Thanks.

Hello, i am trying to produce a gain circles on a simple transistor as shown bellow.

i have defined the range from 1 til 30 dB and i dont get any circle just dots in infinity?

Where did i go wrong?
Thanks.

Hello, i have built a matching network of 13dB gain and  NF as shown bellow step by step.(including all the plots and matlab )

its just not working at all,i am doing it exacly by the thoery

taking a point inside the circle-> converting its gamma to Z_source->converting gamma_s into gamma_L with the formulla bellow as shown in the matlab->converting the gamma_L into Z_L-> building the matching network for conjugate of Z_L and Z_c.Its just not working.

where did i got  wrong?

Thanks.

gamma_s=75.8966*exp(deg2rad(280.88)*i);
z_s=gamma2z(gamma_s,50);
s11=0.99875-0.03202*i
s12=721.33*10^(-6)+8.622*10^(-3)*i
s21=-188.37*10^(-3)+30.611*10^(-3)*i
s22=875.51*10^(-3)-100.72*10^(-3)*i
gamma_L=conj((s22+(s12*s21*gamma_s)/(1-s11*gamma_s)))
z_L=gamma2z(gamma_L,50)

Hello, There is a manual in matlab of matching LNA  shown in the link bellow.

In it as shown in the plot bellow they mention input and output circle plots.

Is there such option of input and output circle in cadence virtuoso?

https://www.mathworks.com/help/rf/examples/designing-matching-networks-part-1-networks-with-an-lna-and-lumped-elements.html

For a project, we depend on capturing warnings. This works fine in Virtuoso but behaves differently in Allegro.

In our observations

Virtuoso:

>>> warn("Hello")

*WARNING* Hello

Allegro:

>>> warn("Hello")

*WARNING* Hello

But when we capture the warning:

Virtuoso:

>>> warn("Hello") getWarn()

"Hello"

Allegro:

>>> warn("Hello") getWarn()

"*WARNING* Hello"

This is a Problem for because we put an empty String in the warn and depend on the fact that no Warning results in an empty String but on Allegro the output always begins with *WARNING*

Is there a way to make the behavior consistent in both versions?

Hi all,

I would like to understand if it is possible from Simvision to get the information regarding the view of a block. In principle using the Schematic Tracer Simvision is able to find the information about the config of that particular model, but I did not found a command for describing the nature of the module (for example if it is schematic or rtl or real model...)

Any functions that I can use for this purpose?

Many thanks

Hi all,

         I want to know how to run a regressive test in cadence and merge all ncsim .trn file of each test case into a single file to view all waveform in simvision. I am using Makefile to invoke the test case.

         eg:-

               test0:

                     irun -uvm -sv -access +rwc $(RTL) $(INTER) $(PKG) $(TOP) $(probe) +UVM_VERBOSITY=UVM_MEDIUM +UVM_TESTNAME=test0

             test1:

                   irun -uvm -sv -access +rwc $(RTL) $(INTER) $(PKG) $(TOP) $(probe) +UVM_VERBOSITY=UVM_MEDIUM +UVM_TESTNAME=test1

          I just to call test0 followed by test1 or parallel both test and view the waveform for both tests case.

        I new to this tool and help me with it

In the Allegro back-end layout products like Allegro Package Designer Plus, it would be reasonable to assume that the most often used command is none other than “show element” (shortcut key F4). This command, runnable at nearly any t...(read more)

Those who work in the IC Packaging design space have some unique challenges. We bridge between the IC design world (90/45-degree traces with rectangular and octagonal pins) and the PCB domain (any-angle routing, filled planes, and a multitude of pad ...(read more)

Here are two screen capture of Before and After Autorouting my board. Padstacks have all been revised and corrected. The Capture Schematic is correct. All Footprints have been verified after Padstack revision. a new NETLIST generation have been done after some corrections made in Capture. I have imported the new Logic. I revised my Layout Cross Section as such: TOP, GND, VCC, BOTTOM. Both VCC and GND shapes have been assigned to their respective logical GND and VCC Nets (verified). Yet, I still have the Autorouter to systematically use extra vias to make GND and VCC connections to the VCC and GND planes. Where a simple utilisation of the part padstack inner layer would have been indicated. What Im I missing ?

I've redesigned a custom TO220FLAT Package

First I created a TO220shape.ssm  with PCB Editor. Then I created a surface mount T220build.pad in Padstack Editor using TO220shape.ssm. Then I created a TO220FLAT.psm in PCB Editor. I placed 3 Connect pins and 9 Mechanical pins for the TO220 TAB, using standard through-hole pads for better current handling.

Adding those Mechanical pins created many DRC errors caused by the proximity of those pads attached to the TO220shape.

Thru Pin to SMD Pin Spacing (-200.0 0.0) 5 MIL OVERLAP DEFAULT NET SPACING CONSTRAINTS Mechanical Pin "Pad50sq30d" Pin "T220build, 2"

I corrected the situation (so I though) by Waiving those DRC errors, thinking that they could not cause any problem and because that’s what I want, i.e.: 9 through-holes under the TO220 device. The idea being that when this device is mounted flat on the PCB it could carry lots of current via 9 pads that could make a good high current conductor to inner layers.

I then saved the Package and updated all related footprint schematic parts  in Capture. Created a new Netlist. Then I imported the new logic into PCB Editor to reflect that change. When the File > Import > Logic is finished I get no feedback error! (which, for me is a substantial achievement in itself)

Now, in the Design Window I see all those DRC errors popping up again, despite the fact that I waived those DRCs back in the Padstack edition. If I run a Design Rule Check (DRC) Report I will see all those DRC listed again. Now, I understand that I can go ahead and waive all those DRCs (100 in total) but I’m thinking there is got to be a better way of doing this.

Please, any advise is welcome. Thanks

Greeting to all:

I am new in this tool, only 2 weeks. Trying to create a new Via with smaller size drill hole from exiting 13 mils size to 10 mils size. I got the message as imaged below. Any advise what to do?  Thanks in advance.

 Hi,

I'm using OVM transaction level tracing in SV. I was wondering if I can have simvision render different types of transactions with different colors e.g. based on a transaction attribute. I know how to do it at signal level using mnemonics but I haven't succeeded doing this at transaction level. Anyone?

 -Joep

In a nutshell, tags allows you to navigate through program code distributed over multiple files effectively. e.g if you see a function call or a struct in e-code and want to "jump" to the definition (which may be in a different file) then you just hit CTRL+] in Vim! Pressing CTRL+t will take you back where you came from. Check out http://vim.wikia.com/wiki/Browsing_programs_with_tags#Using_tags if you want to learn more about how to use tags with Vim.

This utility can generate tags file for your e files. It can either walk through e import order, a directory recursively or all directories on SPECMAN_PATH recursively! The tags file will have tags for struct, unit, types, events, defines, fields, variables, etc.

For help and some examples, just run ctags4e -help.

Hi all 

Good day.

Can anyone tell me whether it is possible to view the signals once it is modified from its previous values without closing the simvision window. If possible kindly let me know the command for it(Linux).

 Is it possible to view the schematic for the code written?? Kindly instruct me.

 Thanks all.

S K S 

Hello,

 I am working in a digital design. The functional, post synthesis and post P&R without IO pads are all working fine, i.e., functionally and with clean timing reports "no setup/hold violations". I just added the IO pads to the same design, I had to change the timing constraints a bit for the synthesis but I have a clean design at SOC Encounter, i.e., clean DRC and clean timing reports "no setup/hold violations". However, when I perform simulation using the exported net-list from SOC Encounter together with SDF exported from the same tool, I got a lot of hold violations. Consequently, the design is not funcitioning.

Why and how I can overcome or trobleshoot this issue?

In waiting for your feedback and comments.

Regards.

Exporting a waveform into a vcsv file returns the error:

The wsSaveTraceCommand command generated an exception basic_string::_S_construct null not valid.

Only the first row of the vcsv file is created (";Version, 1, 0"). This was the first time I've exported waveforms generated with Assembler. I had no issue before with the combination of ADE L, Parametric sweep and ViVA XL. My project uses ICADV 12.3. I have not found any related forum entry or documentation. How could I export the waveforms in vcsv? Exporting the values into a table and then exporting into a csv works, but my post-processing script was written for vcsv format.

Hi all,

Is there any tutorial which explains the process of plotting the ISF function for a certain oscillator ?

Thank you.

Hi ,

     I have designed analog IP in cadence ADE and simulated in spectre. All corner results looks good. when i run monte carlo 1000 runs have high current in 125C two runs. Simulated with same setup in different user, all clean.Need to know what type sampling method used and why its not clean with my setup.

Thanks,

Anbarasu

Hello,

I find a strange issue when using design variable -> right-click -> copy from cellview in assembler. Cadence version is IC618-64b. 500.9

In fact, I set the value of variable (e.g., AAA = 100), then after I right-click -> copy from cellview, AAA's is updated to other value. In my opinion "copy from cellview" should only update the missing variable to the list, but not change any variable value. 

Is there any mechanism could change variable value when using "copy from cellview"?

Thanks

Cadence Liberate Trio Characterization Suite, ARM-based Graviton Processors, and Amazon Web Services (AWS) Cloud have joined forces to cater to the High-Performance Computing, Machine Learning/Artificial Intelligence, and Big Data Analytics sectors. (read more)

Bumps are central to the Virtuoso MultiTech Framework solution. Bumps provide a connection between stacked ICs, interposers, packages, and boards. Bump locations, connectivity, and other attributes are the basis for creating TILPs, which we combine to create system-level layouts.(read more)

Since the release of the Automated Device Placement and Routing solution last year, we have continued to improve and build upon it. In this blog, I’ll talk about the latest addition—the Auto Device Array form—how this is an integral piece of the new Automated Device Placement and Routing solution.(read more)

Here is another blog in the multi-part series that aims at providing in-depth details of electromagnetic analysis in the Virtuoso RF solution. Read to learn about the nuances of port setup for electromagnetic analysis.(read more)

The IC6.1.8 ISR10 and ICADVM18.1 ISR10 production releases are now available for download.(read more)

Do you want to create designs that are correct by construction? Read along this blog to understand how you can achieve this by using Width Spacing Patterns (WSPs) in your designs. WSPs, are track lines that provide guidance for quickly creating wires. Defining WSPs that capture the width-dependent spacing rules, and snapping the pathSegs of a wire to them, ensures that the wires meet width-dependent spacing rules.(read more)

If you have one of those Die layouts, which doesn’t have bumps, but rather uses pad shapes and labels to identify I/O locations, then you might be feeling a bit left out of all of this jazz and tango. Hence, today, I am writing to tell you that, fear not, we have a solution for your Die as well.(read more)

We have all heard the sayings “Less is more” and “Keep it simple”. Electromagnetic simulation is an activity where following that advice has enormous payoffs. In this blog I’ll talk about some of my experiences with how Virtuoso RF Solution’s shape simplification feature has helped my customers get significant performance improvements with minimal impacts on accuracy. (read more)