NEW CASTLE – The Delaware Division of Substance Abuse and Mental Health (DSAMH) announces the launch of the Health Equity Advancement Project, consisting of two funding opportunities that seek to develop strategies for addressing rising opioid overdose deaths among Black and African American communities in Delaware. DSAMH will award eight mini grants as well as […]

NEW CASTLE (July 12, 2023) – The Delaware Department of Health and Social Services (DHSS) announced today enhancements to the CostAware website, designed to help Delawareans understand how their health care dollars are spent by comparing the variation of average costs for different episodes of care and medical services based on actual medical claims in Delaware. […]

NEW CASTLE – The Delaware Department of Health and Social Services (DHSS) announced today enhancements to the CostAware website, designed to help Delawareans understand how their health care dollars are spent by comparing the variation of average costs for different episodes of care and medical services based on actual medical and pharmacy claims in Delaware. […]

The Delaware Emergency Management Agency (DEMA) and Delaware Division of Public Health (DPH) will distribute potassium iodide (KI) tablets to Delaware residents living within a 10-mile radius (also known as the Emergency Planning Zone or EPZ) of the Salem/Hope Creek Nuclear Generating Stations.

The Office of the Marijuana Commissioner (OMC) has released additional sections of the informal draft regulations for review. The sections of draft regulations released today include the sections related to tracking, product health standards, packaging and labeling requirements, and advertising. The Informal Comment Period on the OMC website omc.delaware.gov will close on March 29, 2024. […]

The Office of the Marijuana Commissioner (OMC) has released additional sections of the informal draft regulations for review. The sections of draft regulations released today include the sections related to testing, sampling, waste, disposal, appeals, variances, and fee schedules. The Informal Comment Period on the OMC website omc.delaware.gov will close on March 29, 2024. Once this informal […]

There are 37 sirens in Delaware located within a 10-mile radius of the Salem/Hope Creek Nuclear Generating Stations in New Jersey. The sirens cover an area north from Delaware City, west to Middletown, and south to Woodland Beach. This test is part of an ongoing program that continually monitors the integrity of the siren system. Sirens will be activated for three to five minutes, followed by a test message of the Emergency Alert System (EAS) on local radio stations.

Collaborative workspace to expand operations and programs to Wilmington Wilmington, DE  – NextFab Studio, LLC, d.b.a. NextFab (“NextFab”) will soon expand operations south of Philadelphia and open a makerspace in downtown Wilmington with assistance from a $350,000 Delaware Strategic Fund grant recently approved by the Council on Development Finance. “Known for our willingness to embrace […]

Secretary of Education Mark Holodick is pleased to recognize the following students for their submissions in this year’s Esri’s 2024 ArcGIS webapp competition. Students were challenged to create and share interactive mapping projects using ESRI ArcGIS software. Delaware entrants to this national competition must create a digital Storymap that explores some aspect of life in Delaware.

Wilmington, Del. (July 8, 2024) – The Delaware Division of the Arts’ Mezzanine Gallery presents Vik Hart’s exhibition, “Odd Little Creatures” on view from July 5 through August 30, 2024. Guests are invited to attend a Meet-the-Artist Reception on Friday, July 12 from 5:00-7:00 p.m. Due to the July 4th holiday, Art Loop is moved […]

The Smart Food Program, a first in the nation project, will save food waste and reach families in need by using an AI-driven app to match surplus food to SNAP demands    WILMINGTON, Del. — Delaware will be the first state to pilot an innovative app to help those hardest hit by economic challenges stretch […]

WILMINGTON, Del. – Governor Carney was joined by Senator Darius Brown, other members of the General Assembly, and advocates on Thursday, August 29, to sign Senate Substitute 1 for Senate Bill 254, which creates the Delaware Grocery Initiative and addresses food insecurity in urban and rural food deserts. The bill signing was held at the Kingswood Food Bank Mobile […]

DEPARTMENT OF EDUCATION: Professional Standards Board

DEPARTMENT OF EDUCATION: Professional Standards Board

DEPARTMENT OF EDUCATION: Professional Standards Board

DEPARTMENT OF EDUCATION: Professional Standards Board

The Supreme Court on Tuesday extended the interim protection from arrest granted to Malayalam film actor Siddique in an alleged rape case.

Read the in depth Review of Sapphire PULSE AMD Radeon RX 5600 XT 6G GDDR6 PC Components. Know detailed info about Sapphire PULSE AMD Radeon RX 5600 XT 6G GDDR6 configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

Read the in depth Review of CORSAIR DOMINATOR PLATINUM RGB First Edition DDR5 DRAM Memory Kit PC Components. Know detailed info about CORSAIR DOMINATOR PLATINUM RGB First Edition DDR5 DRAM Memory Kit configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

On February 4, 2019, gloom settled over the iconic Brigade Parade grounds in the heart of Kolkata. Kanhaiya Kumar, then a firebrand Left leader known for his rousing speeches, had cancelled his visit to a rally just before the Lok Sabha election

1. Telangana train accident: Goods train derails near Peddapalli. Check full list of cancelled, diverted trains today | Today News  Mint
2. Goods train derails in Telangana's Peddapalli; 20 trains cancelled, 10 diverted  The Economic Times
3. 11 coaches of goods train derail in Telangana  The Times of India
4. Goods train derailment in Telangana affects rail traffic between Delhi and Chennai  Telangana Today
5. Goods train derails in Telangana's Peddapalli; 30 trains cancelled, several diverted  The Hindu

If you're an iPhone user, then you might want to check the Chrome app for new updates.

The post Google Adds Some Nifty Features for Chrome on iOS Devices appeared first on Phandroid.

The couple, together for nine years, had announced the wedding date in January and were eagerly looking forward to their long-awaited special day.

Arduino’s MKR family of products got two new wireless connectivity boards added to its range of products. These include MKR WiFi 1010 and MKR NB 1500, both aimed at streamlining IoT product/service development.

Arduino’s blog notes that “the Arduino MKR WiFi 1010 is the new version of the MKR1000 with ESP32 module on board made by U-BLOX.”

MKR WiFi 1010: For prototyping of WI-FI based IoT applications

The core difference of MKR WiFi 1010 compared to MKR WiFi 1000 is that the former can be put to use in production-grade IoT apps and it has ESP32-based module manufactured by u-blox. The former enables to add 2.4GHz WiFi and Bluetooth capability to the application. Additionally, it comes with a programmable dual-processor system (an ARM processor and a dual-core Espressif IC).

MKR NB 1500: For on-field monitoring systems and remote-controlled LTE-enabled modules

The Arduino MKR NB 1500 is based on new low-power NB-IoT (narrowband IoT) standard. This makes it appropriate for IoT apps running over cellular/LTE networks.

Key use cases of this board are remote monitoring systems and remote-controlled LTE-enabled modules. It supports AT&T, T-Mobile USA, Telstra, Verizon over the Cat M1/NB1 deployed bands 2, 3, 4, 5, 8, 12, 13, 20 and 28.

Arduino also pitches this board to be used in IoT apps which used to rely on alternative IoT networks such as LoRa and Sigfox. It promises to save power compared to GSM or 3G cellular-based connections.

[DA] Note to editors: Please find attached soundbite by Ian Cameron MP.

The generative AI market is experiencing rapid growth, driven by the increasing parameter size of Large Language Models (LLMs). This growth is pushing the boundaries of performance requirements for training hardware within data centers. For an in-depth look at this, consider the insights provided in "HBM3E: All About Bandwidth". Once trained, these models are deployed across a diverse range of applications. They are transforming sectors such as finance, meteorology, image and voice recognition, healthcare, augmented reality, high-speed trading, and industrial, to name just a few.

The critical process that utilizes these trained models is called AI inference. Inference is the capability of processing real-time data through a trained model to swiftly and effectively generate predictions that yield actionable outcomes. While the AI market has primarily focused on the requirements of training infrastructure, there is an anticipated shift towards prioritizing inference as these models are deployed.

The computational power and memory bandwidth required for inference are significantly lower than those needed for training. Inference engines typically need between 300-700GB/s of memory bandwidth, compared to 1-3TB/s for training. Additionally, the cost of inference needs to be lower, as these systems will be widely deployed not only in data centers but also at the network's edge (e.g., 5G) and in end-user equipment like security cameras, cell phones, and automobiles.

When designing an AI inference engine, there are several memory options to consider, including DDR, LPDDR, GDDR, and HBM. The choice depends on the specific application, bandwidth, and cost requirements. DDR and LPDDR offer good memory density, HBM provides the highest bandwidth but requires 2.5D packaging, and GDDR offers high bandwidth using standard packaging and PCB technology.

The GDDR7 standard, announced by JEDEC in March of this year, features a data rate of up to 192GB/s per device, a chip density of 32Gb, and the latest data integrity features. The high data rate is achieved by using PAM3 (Pulse Amplitude Modulation) with 3 levels (+1, 0, -1) to transmit 3 bits over 2 cycles, whereas the current GDDR6 generation uses NRZ (non-return-to-zero) to transmit 2 bits over 2 cycles.

GDDR7 offers many advantages for AI Inference having the best balance of bandwidth and cost. For example, an AI Inference system requiring 500GB/s memory bandwidth will need only 4 GDDR7 DRAM running at 32Gbp/s (32 data bits x 32Gbp/s per pin = 1024Gb/s per DRAM). The same system would use 13 LPDDR5X PHYs running at 9.6Gbp/s, which is currently the highest data rate available (32 data bits x 9.6Gb/s = 307Gb/s per DRAM).

Cadence stands at the forefront of AI inference hardware support, being the first IP company to roll out GDDR7 PHYs capable of impressive speeds up to 36Gb/s across various process nodes. This milestone builds on Cadence's established leadership in GDDR6 PHY IP, which has been available since 2019. The company caters to a diverse client base spanning AI inference, graphics, automotive, and networking equipment.

While GDDR7 continues to utilize standard PCB board technology, the increased signal speeds seen in GDDR6 (20Gbp/s) and now GDDR7 (36Gb/s) calls for careful attention with the physical design to ensure optimized system performance. In addition to providing the PHY, Cadence also offers comprehensive PCB and package reference design, which are essential in helping customers achieve optimal signal and power integrity (SI/PI) for their systems.

Cadence is dedicated to ensuring customer success beyond just providing hardware. They provide expert support in SI/PI, collaborating closely with customers throughout the design process. This approach ensures that customers can benefit from Cadence's expertise in navigating the complexities of high-speed design and achieving optimal performance in their AI inference systems.

As the AI market continues to advance, Cadence remains at the forefront by offering a comprehensive memory IP portfolio tailored for every segment of this dynamic market. From DDR5 and HBM3E, which cater to the intensive demands of training in servers and high-performance computing (HPC), to LPDDR5X designed for low-end inference at the network edge and in consumer devices, Cadence's offerings cover a wide range of applications.

Looking to the future, Cadence is dedicated to innovating at the forefront of memory system performance, ensuring that the evolving needs of AI training and inference are met with the highest standards of excellence. Whether it's pushing the boundaries with GDDR7 or exploring new technologies, Cadence is dedicated to driving the AI revolution forward, one breakthrough at a time.

Learn more about Cadence GDDR7 PHY

Learn more about Cadence Simulation VIP for GDDR7.

The demand for higher-performance computing is greater than ever. Cutting-edge applications in artificial intelligence (AI), big data analytics, and databases require high-speed memory systems to handle the ever-increasing volumes and complexities of data. Advancements in cloud computing and machine virtualization are stretching the limits of current capabilities. AI applications hosted in the cloud rely on fast access and reduced latency in memory systems, which is amplified by an increasing number of CPU and GPU cores.

Introducing the DDR5 Multiplexed Rank DIMM (MRDIMM), the next-generation memory module technology designed to meet the needs of high-performance computing (HPC) and AI in cloud applications. By leveraging existing DDR5 DRAM memory devices, MRDIMM modules not only double the DRAM data rate but also maintain the RAS capabilities of the industry-proven RDIMM modules, setting a new precedent for memory module performance.

Let’s compare RDIMM and MRDIMM modules using the same DRAM parts. Today, high-speed production DDR5 RDIMM modules run at 5600Mbps. Those modules use DDR5 DRAM parts, which also run at 5600Mbps. An MRDIMM module using the same DDR5 5600Mbps DRAM parts will run at a blazing 11.2Gbps.

One key metric for best-in-class performance, low bit error rate (BER), and ease of adoption is the eye diagram. The eye diagram illustrates at-speed system margin and accurately represents DDR system quality when captured with a pseudo-random binary sequence (PRBS)-like pattern. The diagram below illustrates Cadence’s 3nm silicon write eye diagram for DDR5 MRDIMM IP running at 12.8Gbps.

Cadence 3nm DDR5 MRDIMM 12.8Gbps test chip write eye diagram, design kit is available today

The eye diagram is captured using a PRBS-like pattern, incorporating a package and system board representative of a typical MRDIMM channel. Using PRBS-like patterns is crucial for capturing accurate eye diagrams. Repetitive clock-like data patterns create deceptively “open eyes” that do not reflect the real system performance. Effects like intersymbol interference, simultaneous switching, reflections, and crosstalk are not accurately reflected in the eye diagrams for parallel interfaces like DDR using non-random data streams. Relying on improperly captured eye diagrams inevitably leads to a significantly worse real system BER than conveyed by that eye diagram.

Doubling the DDR5 RDIMM data rate is challenging. Achieving high performance while optimizing for area and power requires multiple design techniques. Feed-forward equalization (FFE), decision feedback equalization (DFE), continuous-time linear equalization (CTLE), and T-coils are required to reach 12.8Gbps MRDIMM data rates in multi-channel systems. Building a production-worthy 12.8Gbps DDR5 MRDIMM IP requires engineering expertise that comes from many generations of memory interface design and production experience. Cadence has developed this expertise through multiple DDR5/4, LPDDR5X/5, and GDDR6 designs in different technology nodes and foundries. For instance, Cadence’s GDDR6 IP is available in three foundries and ten process nodes, with mass production at speeds exceeding 22Gbps.

For your next project, consider DDR5 12.8Gbps MRDIMM, a technology that not only doubles the bandwidth of DDR5 RDIMM but also promises rapid proliferation into next-generation AI, data center, HPC, and enterprise applications. With its cutting-edge capabilities, the Cadence DDR5 12.8Gbps MRDIMM IP is ready to power the future of computing.

I am attempting to use dbGetNeighbor() function inside the dynamic display HUD so that the distance to the next metal on that layer could be viewed. Think of another line in this dynamic table here... 

My SKILL code is essentially the following:

procedure(getNearestNeighborOnMetal(cv)
let((direction tmpBoundingBox)
direction = internal_function()
tmpBoundingBox = dbCreateRect(geGetEditCellView() "tmp" list(hiGetCommandPoint() hiGetCommandPoint()))
car(dbGetNeighbor(geGetEditCellView() tmpBoundingBox direction))
)
)

this returns the distance to the closest metal based on some tests.

Next, I try to register this function to work in the Dynamic Display / Info Balloon world by executing odcRegisterCustomFunc() for each and every object type (I know, absurd, but trying to debug)

In the dynamic display menu, I toggle the "Custom SKILL Function" check in layoutXL, then hit apply, then OK.

After this I find I am unable to view the changes reflected in any info balloons or in the drawing HUD (above) for this wire. I have tried replacing my function with the sample "customFunc" from the odcRegisterCustomFunc() documentation and was still unable to produce any new output.

Any help diagnosing the use of this feature would be very much appreciated

Explore Impacts of Finite Interconnect Impedance on PDN Characterization

Over the past few decades, many details have been worked out in the power distribution network (PDN) in the frequency and time domains. We have simulation tools that can analyze the physical structure from DC to very high frequencies, including spatial variations of the behavior. We also have frequency- and time-domain test methods to measure the steady-state and transient behavior of the built-up systems.

All of these pieces in our current toolbox have their own assumptions, limitations, and artifacts, and they constantly raise the challenging question that designers need to answer: How to select the design process, simulation, measurement tools, and processes so that we get reasonable answers within a reasonable time frame with a reasonable budget.

Read this award-winning DesignCon 2024 paper titled “Impact of Finite Interconnect Impedance Including Spatial and Domain Comparison of PDN Characterization.” Led by Samtec’s Istvan Novak and written with a team of nine authors from Cadence, Amazon, and Samtec, the paper discusses a series of continually evolving challenges with PDN requirements for cutting-edge designs.

Read the full paper now: “Impact of Finite Interconnect Impedance Including Spatial and Domain Comparison of PDN Characterization.”

Starting SPB 23.1, a new pin property, WIREBOND_PROFILE_NAME is introduced. This property can be used to define a wirebond profile to a die pin. When adding a wirebond, the pin will use the profile defined in the WIREBOND_PROFILE_NAME property associated to the die pin.

Assign the WIREBOND_PROFILE_NAME property to the die pin using Edit > Properties and set the desired wirebond profile name in the Value field.

The following image displays the WIREBOND_PROFILE_NAME property assigned to the pin and wire profile of the Wire Bond for that pin.

In a package design, designers often need to perform degassing. This is typically done at the end of the design process before sending the design to the manufacturer.

Degassing is a process where you perforate power planes, voltage planes, and filled shapes in your design. Degassing holes let the gas escape from beneath the metal during manufacturing of the substrate. The perforations or holes for degassing are generally small, having a specified size and shape, and are spaced regularly across the surface of the plane. If the degassing process is not done, it may result in the formation of gas bubbles under the metal, which may cause the surface of the metal to become uneven. After you degas the design, it is recommended to perform electrical verification.

Allegro X APD has degassing features that allow users to automate the process and place holes in the entire shape.

In today’s topic, we will talk about how to avoid adding  degassing holes on a particular shape.

Sometimes, a designer may need to avoid adding degassing holes to a particular shape on a layer. All other shapes on the layer can have degassing holes but not this shape. Using the Layer Based Degassing Parameters option, the designer can set the degassing parameters for all shapes on the layer. Now, the designer would like to defer adding degassing holes for this particular shape.

You may wonder if there is an easy way to achieve this. We will now see how this can be done with the tool.

Once the degassing parameters are set, performing Display > Element on any of the shapes on that layer will show the degassing parameters set.

You can apply the Degas_Not_Allowed property to a shape to specify that degassing should not be performed on this shape, even if the degassing requirements are met. Select the shape and add the property as shown below.

Switch to Shape Edit application mode (Setup > Application mode > Shape Edit) and window-select all shapes on the layer. Then, right-click and select Deferred Degassing > All Off.

Now, all shapes on the layer will have degassing holes except for the shape which has the Degas_Not_Allowed property attached to it.

Hello, SKILL experts. 

I'm studying SKILL language to build some useful function in APD+.

Now, I want to execute 'Import Sub-drawing' function in new form.

But I cannot find how to do execute APD+ embedded function in a field of new form. 

Has anyone experienced this or idea to solve this problem? 

DDR5 is the latest generation of PCDDR memory that is used in a wide range of application like data centers, Laptops and personal computers, autonomous driving systems, servers, cloud computing, and gaming are now increasingly being used for AI applications with advances in memory bandwidth and density to allow DDR5 DIMMs (Dual Inline Memory Modules) to support densities higher then 256 GB per DIMM card. The highest speed DDR5 SDRAM devices can support data rates of up to 8800 MTps.

DDR5 SO-DIMMs and UDIMMs

One of the most recognized uses of PCDDR is with client devices like laptops and personal computers. These client devices mostly use two types of DDR5 DIMMs called SO-DIMM (Small Outline Dual Inline Memory Module) and UDIMM (Unbuffered Dual Inline Memory Module).

These types of DIMMs have no signal regeneration or buffering (which, for example, the Registering Clock Driver or the RCD does for clocks/command/control signals for a registered DIMMs). A typical 2-Rank UDIMM with x8 DDR5 SDRAM components has 8 or 10 components per rank depending on the system ECC (Error Correction Code) memory being part of the DIMM.

Why DDR5 Clock Buffer and CUDIMM?

Clocks are one of the most important signals for synchronous devices, and DDR5 SDRAMs are no exception. The host is responsible for the fanout to all the DRAM input ports, such as clocks for UDIMMs. Driving of all these DRAM clocks can put quite a bit of load on the host output drivers, thus affecting the signal quality, which can result in unexpected memory errors. This issue gets amplified when operating at the higher clock and data rates where the clock signals transition from one logic value to the next over a very short time. To solve these signal integrity issues with DRAM clocks, JEDEC has come up with a new type of DDR5 DIMM component that is called DDR5 clock buffer. Clock buffers can be used for both DDR5 SO-DIMMs and DDR5 UDIMMs. DDR5 UDIMMs that include a clock buffer component as part of the DIMM card are called DDR5 CUDIMMs (Clock Buffered UDIMMs).

DDR5 Clock Buffer Overview

DDR5 Clock Buffer is a simple logic device that takes in two sets of input clock pins and drives two sets of clock pins as output per channel. The clock buffer device can operate in three types of clock modes: -

• PLL bypass mode: In this mode, the clock buffer just passes on the input clocks to output without any kind of signal buffering. The PLL bypass mode enabled CUDIMM devices behave like traditional UDIMMs without any buffering of the clocks. This is why it’s also referred to as legacy mode. Recommended CUDIMM operating speeds in PLL bypass mode are typically limited to 3000 MHz.

• Single PLL mode: In the single PLL Mode, the clock buffer device will use a Phase Lock Loop (PLL) for the regeneration of the incoming host clock to create a better-quality clock that is sent to the DRAMs. However, since there is only one PLL that is used in this mode, both sub channel output clocks will be driven based on only one set of input clocks with the other set of input clocks remaining unused.

• Dual PLL mode: In this mode, the clock buffer will use two PLLs to independently generate each sub channel output clock based on each set of incoming host clocks. The second set of PLL can be turned on or off on the fly if needed to save power.

Beyond the clock modes, clock buffers provide additional flexibility to the system designers with register-controlled additional signal delays, optional output clock enable/disable per bit feature, drive strength and termination choices, etc. All DDR5 clock buffer device control word registers are accessible via DDR5 DIMM sideband.

Cadence VIPs offers a compressive memory subsystem solution that includes memory models for DDR5 SDRAM, DDR5 RCD, DDR5 DB, DDR5 clock buffer, all types of DDR5 DIMMs, including the DDR5 CUDIMMs, DFI Memory Controller/PHY VIPs, and a system VIP compliant to JEDEC specifications defined for each of those devices along with latest DFI Specification.

More information on Cadence DDR5 DIMM VIP is available at the Cadence VIP Memory Models website.

DDR5 DIMM Architectures The DDR5 generation of Double Data Rate DRAM memories has experienced rapid adoption in recent years. In particular, the JEDEC-defined DDR5 Dual Inline Memory Module (DIMM) cards have become a mainstay for systems looking for high-density, high-bandwidth, off-chip random access memory[1]. Within a short time, the DIMM architecture evolved from an interconnected hierarchy of only SDRAM memory devices (UDIMM[2]) to complex subsystems of interconnected components (RDIMM/LRDIMM/MRDIMM[3]). DIMM Designs and Popular Verification Use Cases The growing complexity of the DIMMs presented a challenge for pre-silicon verification engineers who could no longer simply validate against single DDR5 SDRAM memory models. They needed to consider how their designs would perform against DIMMs connected to each channel and operating at gigahertz clock speeds. To address this verification gap, Cadence developed DDR5 DIMM Memory Models that encapsulated all of the architectural complexities presented by real-world DIMMs based on a robust, easy-to-use, easy-to-debug, and easy-to-reconfigure methodology. This memory-subsystem-in-a-single-instance model has seen explosive adoption among the traditional IP Developer and SOC Integrator customers of Cadence Memory Models. The Cadence DIMM models act as a single unit with all of the relevant DIMM components instantiated and interconnected within, and with all AC/Timing parameters among the various components fully matched out-of-the-box, based on JEDEC specifications as well as datasheets of actual devices in the market. The typical use-case for the DIMM models has been where the DUT is a DDR5 Memory Controller + PHY IP stack, and the validation plan mandated compliance with the JEDEC standards and Memory Device vendor datasheets. Unique Use Case for the DIMM Discrete Component Models Although the Cadence DIMM models have enjoyed tremendous proliferation because of their cohesive implementation and unified user API, the actual DIMM Models are built on top of powerful, flexible discrete component models, each of which was designed to stand on its own as a complete SystemVerilog UVM-based VIP. All of these discrete component models exist in the Cadence VIP Catalog as standalone VIPs, complete with their own protocol compliance checking capabilities and their own configuration mappings comprehensively modeling individual AC/Timing parameters. Because of this deliberate design decision, the Cadence DIMM Discrete Component Models can support a unique use-case scenario. Some users seek to develop IC Designs for the various DIMM components. Such users need verification environments that can model the individual components of a DIMM and allow them the option to replace one or another component with their Component Design IP. They can then validate that their component design is fully compatible with the rest of the components on the DIMM and meets the integrity of the overall DIMM compliance with JEDEC standards or Memory Vendor datasheets. The Cadence Memory VIP portfolio today includes various examples that demonstrate how customers can create DIMM “wrappers” by selecting from among the available DIMM discrete component models and “stitching” them together to build their own custom testbench around their specific Component Design IP. A Solution for Unique Component Scenarios The Cadence DDR5 DIMM Memory Models and DIMM Discrete Component Models can provide users with a flexible approach to validating their specific component designs with a fully populated pre-silicon environment. Augmented Verification Capabilities When the DIMM “wrapper” model is augmented with the Cadence DFI VIP[4] that can simulate an MC+PHY stack and offers a SystemVerilog UVM test API to the verification engineer, the overall testbench transforms into a formidable pre-silicon validation vehicle. The DFI VIP is designed as a combination of an independent DFI MC VIP and a DFI PHY VIP connected to each other via the DFI Standard Interface and capable of operating seamlessly as a single unit. It presents a UVM Sequence API to the user into the DFI MC VIP with the Memory Interface of the PHY VIP connected to the DIMM “wrapper” model. With this testbench in hand, the user can then fully take advantage of the UVM Sequence Library that comes with the DFI VIP to enable deep validation of their Component Design inside the DIMM “wrapper” model. Verification Capabilities Further Enhanced A possible further enhancement comes with the potential addition of an instance of the Cadence DIMM Memory Model in a Passive Monitor mode at the DRAM Memory Interface. The DIMM Passive Monitor consumes the same configuration describing the DIMM “wrapper” in the testbench, and thus can act as a reference model for the DIMM wrapper. If the DIMM Passive Monitor responds successfully to accesses from the DFI VIP, but the DIMM wrapper does not, then it exposes potential bugs in the DUT Components or in the settings of their AC/Timing parameters inside the DIMM wrapper. Debuggability, Interface Visibility, and Protocol Compliance One of the key benefits of the DIMM Discrete Component Models that become manifest, whether in terms of the unique use-case scenario described here, or when working with the wholly unified DDR5 DIMM Memory Models, is the increased debuggability of the protocol functionality. The intentional separation of the discrete components of a DIMM allows the user to have full visibility of the memory traffic at every datapath landmark within a DIMM structure. For example, in modeling an LRDIMM or MRDIMM, the interface between the RCD component and the SDRAM components, the interface between the RCD component and the DB components, and the interface between the SDRAM components and the DB components—all are visible and accessible to the user. The user has full access to dump the values and states of the wire interconnects at these interfaces to the waveform viewer and thus can observe and correlate the activity against any protocol violations flagged in the trace logs by any one or more of the DIMM Discrete Component Models. Access to these interfaces is freely available when using the DIMM Discrete Component Models. On the unified DDR5 DIMM Memory Models, a feature called Debug Ports enables the same level of visibility into the individual interconnects amidst the SDRAM components, RCD components, and DB components. When combined with the Waveform Debugger[5] capability that comes built-in with the VIPs and Memory Models offered by Cadence and used with the Cadence Verisium Debug[6] tool, the enhanced debuggability becomes a powerful platform. With these debug accesses enabled, the user can pull out transaction streams, chip state and bank state streams, mode register streams, and error message streams all right next to their RTL signals in the same Verisium Debug waveform viewer window to debug failures all in one place. The Verisium Debug tool also parses all of the log files to probe and extract messages into a fully integrated Smart Log in a tabbed window fully hyperlinked to the waveform viewer, all at your fingertips. A Solution for Every Scenario Cadence's DDR5 DIMM Memory Models and DIMM Discrete Component Models , partnered with the Cadence DFI VIP, can provide users with a robust and flexible approach to validating their designs thoroughly and effectively in pre-silicon verification environments ahead of tapeout commitments. The solution offers unparalleled latitude in debuggability when the Debug Ports and Waveform Debugger functions of the Memory Models are switched on and boosted with the use of the Cadence Verisium Debug tool. [1] Shyam Sharma, DDR5 DIMM Design and Verification Considerations , 13 Jan 2023. [2] Shyam Sharma, DDR5 UDIMM Evolution to Clock Buffered DIMMs (CUDIMM) , 23 Sep 2024. [3] Kos Gitchev, DDR5 12.8Gbps MRDIMM IP: Powering the Future of AI, HPC, and Data Centers , 26 Aug 2024. [4] Chetan Shingala and Salehabibi Shaikh, How to Verify JEDEC DRAM Memory Controller, PHY, or Memory Device? , 29 Mar 2022. [5] Rahul Jha, Cadence Memory Models - The Gold Standard , 15 Apr 2024. [6] Manisha Pradhan, Accelerate Design Debugging Using Verisium Debug , 11 Jul 2023.

This is the 15th installment of The Rationalist, my column for the Times of India.

It’s election season, and promises are raining down on voters like rose petals on naïve newlyweds. Earlier this week, the Congress party announced a minimum income guarantee for the poor. This Friday, the Modi government released a budget full of sops. As the days go by, the promises will get bolder, and you might feel important that so much attention is being given to you. Well, the joke is on you.

Every election, HL Mencken once said, is “an advance auction sale of stolen goods.” A bunch of competing mafias fight to rule over you for the next five years. You decide who wins, on the basis of who can bribe you better with your own money. This is an absurd situation, which I tried to express in a limerick I wrote for this page a couple of years ago:

POLITICS: A neta who loves currency notes/ Told me what his line of work denotes./ ‘It is kind of funny./ We steal people’s money/And use some of it to buy their votes.’

We’re the dupes here, and we pay far more to keep this circus going than this circus costs. It would be okay if the parties, once they came to power, provided good governance. But voters have given up on that, and now only want patronage and handouts. That leads to one of the biggest problems in Indian politics: We are stuck in an equilibrium where all good politics is bad economics, and vice versa.

For example, the minimum guarantee for the poor is good politics, because the optics are great. It’s basically Garibi Hatao: that slogan made Indira Gandhi a political juggernaut in the 1970s, at the same time that she unleashed a series of economic policies that kept millions of people in garibi for decades longer than they should have been.

This time, the Congress has released no details, and keeping it vague makes sense because I find it hard to see how it can make economic sense. Depending on how they define ‘poor’, how much income they offer and what the cost is, the plan will either be ineffective or unworkable.

The Modi government’s interim budget announced a handout for poor farmers that seemed rather pointless. Given our agricultural distress, offering a poor farmer 500 bucks a month seems almost like mockery.

Such condescending handouts solve nothing. The poor want jobs and opportunities. Those come with growth, which requires structural reforms. Structural reforms don’t sound sexy as election promises. Handouts do.

A classic example is farm loan waivers. We have reached a stage in our politics where every party has to promise them to assuage farmers, who are a strong vote bank everywhere. You can’t blame farmers for wanting them – they are a necessary anaesthetic. But no government has yet made a serious attempt at tackling the root causes of our agricultural crisis.

Why is it that Good Politics in India is always Bad Economics? Let me put forth some possible reasons. One, voters tend to think in zero-sum ways, as if the pie is fixed, and the only way to bring people out of poverty is to redistribute. The truth is that trade is a positive-sum game, and nations can only be lifted out of poverty when the whole pie grows. But this is unintuitive.

Two, Indian politics revolves around identity and patronage. The spoils of power are limited – that is indeed a zero-sum game – so you’re likely to vote for whoever can look after the interests of your in-group rather than care about the economy as a whole.

Three, voters tend to stay uninformed for good reasons, because of what Public Choice economists call Rational Ignorance. A single vote is unlikely to make a difference in an election, so why put in the effort to understand the nuances of economics and governance? Just ask, what is in it for me, and go with whatever seems to be the best answer.

Four, Politicians have a short-term horizon, geared towards winning the next election. A good policy that may take years to play out is unattractive. A policy that will win them votes in the short term is preferable.

Sadly, no Indian party has shown a willingness to aim for the long term. The Congress has produced new Gandhis, but not new ideas. And while the BJP did make some solid promises in 2014, they did not walk that talk, and have proved to be, as Arun Shourie once called them, UPA + Cow. Even the Congress is adopting the cow, in fact, so maybe the BJP will add Temple to that mix?

Benjamin Franklin once said, “Democracy is two wolves and a lamb voting on what to have for lunch.” This election season, my friends, the people of India are on the menu. You have been deveined and deboned, marinated with rhetoric, seasoned with narrative – now enter the oven and vote.

The India Uncut Blog © 2010 Amit Varma. All rights reserved.
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Hello Fellow PCB Designers,

We have a 10 layer PCB design that originated in Pads and was converted over to Allegro 17.4, this is an old design but is manufacturable and works perfectly fine.  When I try to generate a Gerber for the Top or Bottom layers

the Gerber comes out fine.  But Most of the middle layers are Etch's and via's for power and grounds, but the Gerber's come mostly blank, there might be some details, but in the Gerber view everything is displayed correctly.

The design does have many close spacings, I have not changed anything in the constrains manager yet, turned off a lot of the DRC's, but thinking there might be something wrong with the constrains.

  I find that the CSet is set to 2_18, not sure yet what this means, also there are many of these definitions, PCS 3,4,5,ect, are the same as CSet 2_18 any suggestions would be great, we are currently looking into this, have seen

that even small change in constraint manager can cause long processing and even Allegro crashing, this is a large project.

Thanks Much, Thanks, Mike Pollock.

Hello,
I'm trying to characterize a full adder that use transmission gate.
Unfortunately, the power calculation are wrong for the cell are always negative.
Is there any method or commands that can can help in power calculation or add the power consumption by the input pins to the power calculation ?
Another question, Is liberate support the characterization or transmission gate cells as standard cells or I should use liberate AMS for these type of cells ?
Thanks in advance,
Tareq 

Hi,

reading Verilog®-A Language Reference I found this description of ddt function I don't understand:

Use the time derivative operator to calculate the time derivative of an argument.

ddt( input [ , abstol | nature ] )

input is a dynamic expression.

abstol is a constant specifying the absolute tolerance that applies to the output of the ddt operator. Set abstol at the largest signal level that you consider negligible.

nature is a nature from which the absolute tolerance is to be derived.

Can anyone explain how abstol and nature are defined? how using them? an example would be really appreciated.

Thanks

Andrea

Hi, I'm using the xcelium simulator to simulate a testbench, in which I first stimulate my design to do something (part "A") and then do a direct follow-up test on the design (part "B").

I need two things from this testbench: the results of the test (part "B", passed/failed) and coverage information, but the coverage information should only include part A and explicitly not part B.

I could do the following: run the testbench with part A and B, get the "passed/failed" result of the test and then follow up another simulator run with another testbench, that only includes part A and get the coverage information from that simulation run.

Is there a way to force xcelium to give me the coverage information of only a part of the simulation? Ideally, I would like to write the verilog code of my testbench to look something like this:

• do A
• dump coverage information
• do B

But maybe there is another way to tell xcelium to consider only part of the testbench for the coverage information. I did have a look at the manual, but was not able to find something useful for this problem. Any ideas?

Hi

I have tried using "add net constraints" command to place one-cold constraints on a tristate enable bus. In the command line we need to specify the "net pathname" on which the constraints are to be enforced.

The bus here is 20-bit. How should the net pathname be specified to make this 20-bit bus signals one_hot or one_cold.

The bus was declared as follows:
ten_bus [19:0]

The command I used was

add net constraints one_hot /ren_bus[19]

What would the above command mean?
Should we not specify all the nets' pathnames on the bus?
Is it sufficient to specify the pathname of one net on the bus?
I could not get much info regarding the functionality of this command. I would be obliged if anyone can throw some light.

Thanks
Prasad.

Hi,
My Virtuoso and Spectre Version: ICADVM20.1-64b.NYISR30.2
I plot an eye diagram using a built in function. I want to see the data-dependent jitter. I want to measure the eye diagram edges at zero crossing (width of that diamond part) shown in the pic by vertical and horizontal markers. I can put a marker and read the numbers there and get what I want. But now I want to run Monte Carlo and I can't do this for all samples. I wish I could write an expression for this. Unfortunately, I see that the function "cross" is not working on the eye diagram. Basically, when I send the eye diagram data to a table, I see that it actually is just the prbs data and not the eye diagram data. Is there a hack that can help me achieve my goal which is: having an expression to measure the edges of the eye diagram at zero crossing?
There is a script that Andrew wrote (https://support.cadence.com/wps/mypoc/cos?uri=deeplinkmin%3AViewSolution%3BsolutionNumber%3D11395772). This is a good script but it puts all edges on top of each other. I want to distinguish the two edges. In the attached pic (two-period eye diagram) you can see what I mean by the two edges (diamond shapes). I want to measure each of the two and take the maximum. Having all the edges on top of each other won't give me what I want. All edges together will lso include DCD. I purely want to measure DDJ. DCD is measured separately. I have very little experience with writing scripts and could not modify Andrew's script.
Your help is much appreciated. Thank you.

While adding an element created from a netlist file in AWR, I am getting the error 'The element type being dropped is not compatible with the window it is being dropped into'. The netlist file in AWR has the following contents:

.subckt BFG520W base collector emitter npn
.model BFG520W NPN(IS=1.016E-15 NF=1.000 BF=220.1 IKF=510E-3 VAF=48.06
+ ISE=2.83E-13 NE=2.035 NR=0.988 BR=100.7 IKR=2.352E-3
+ VAR=1.692 ISC=24.48E-18 NC=1.022 RB=10.00 RE=0.7753
+ RC=2.21 CJC=447.6E-15 MJC=0.07 VJC=0.1892
+ CJE=1.245E-12 TF=8.616E-12 TR=5.437E-12 mfg=NXP)

I have attached screenshots of the element BFG520W2 created due to the above netlist and the error I am getting while adding this element.

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