1 Croatian Kuna = 26.8813 Sri Lanka Rupee

1 Croatian Kuna = 10.8817 Indian Rupee

1 Croatian Kuna = 2129.1646 Indonesian Rupiah

1 Peruvian Nuevo Sol = 5.0509 Seychellois Rupee

1 Peruvian Nuevo Sol = 46.9691 Pakistani Rupee

1 Peruvian Nuevo Sol = 35.5795 Nepalese Rupee

1 Peruvian Nuevo Sol = 11.6828 Mauritian Rupee

1 Peruvian Nuevo Sol = 54.8737 Sri Lanka Rupee

1 Peruvian Nuevo Sol = 22.2225 Indian Rupee

1 Peruvian Nuevo Sol = 4389.4747 Indonesian Rupiah

1 Dominican Peso = 0.3119 Seychellois Rupee

1 Dominican Peso = 2.9006 Pakistani Rupee

1 Dominican Peso = 2.1972 Nepalese Rupee

1 Dominican Peso = 0.7215 Mauritian Rupee

1 Dominican Peso = 3.3887 Sri Lanka Rupee

1 Dominican Peso = 1.3718 Indian Rupee

1 Dominican Peso = 268.4101 Indonesian Rupiah

Haskell Track and Field is finally back …. Approximately four years ago the Haskell Track and Field Program was put on hold.  A couple of years later the distance portion of Track and Field returned.  In 2011-2012, Haskell opened up the Indoor and Outdoor Seasons to include the addition of sprints, mid-distance, and throws.  Yesterday at the Emporia State Twilight Meet the Indians added long jump, triple jump, and a relay team to the track and field mix. 

Christina Belone, Talisa Budder and Matt Woody compete in the 85^th edition of the annual event

1 Papua New Guinean Kina = 5.0047 Seychellois Rupee

1 Papua New Guinean Kina = 46.54 Pakistani Rupee

1 Papua New Guinean Kina = 35.2544 Nepalese Rupee

1 Papua New Guinean Kina = 11.5761 Mauritian Rupee

1 Papua New Guinean Kina = 54.3724 Sri Lanka Rupee

1 Papua New Guinean Kina = 22.0104 Indian Rupee

1 Papua New Guinean Kina = 4306.6366 Indonesian Rupiah

1 Brunei Dollar = 12.1479 Seychellois Rupee

1 Brunei Dollar = 112.9658 Pakistani Rupee

1 Brunei Dollar = 85.5724 Nepalese Rupee

1 Brunei Dollar = 28.0984 Mauritian Rupee

1 Brunei Dollar = 131.9771 Sri Lanka Rupee

1 Brunei Dollar = 53.4254 Indian Rupee

1 Brunei Dollar = 10453.4198 Indonesian Rupiah

PCI-SIG DevCon 2019 APAC tour has come to Tokyo and Taipei this year. The focus is predominantly around the latest updates for PCIe Gen 5 which its version 1.0 specification was just released this year in May.  A series of presentations provided by PCI-SIG on the day 1 with comprehensive information covering all aspects of Gen 5 specification, including protocol, logical, electrical, compliance updates. On the day 2 (only in Taipei), several member companies shared their view on Testing, PCB analysis and Signal integrity. The exhibit is also another spotlight of this event where the member companies showcased their latest PCIe solutions.

Presentation Track (Taipei), Exhibit (Tokyo), Exhibit (Taipei) 

Cadence, as the market leading PCIe IP vendor, participated APAC tour this year with bringing in its latest PCIe IP solution offering (Gen 5/4) to the region as well as showcasing two live demo setups in the exhibit floor. One setup is the PCIe software development kit (SDK) while the other is the Interop/compliance/debug platform. Both come with the Cadence PCIe Gen 4 hardware setup and its corresponding software kit.

The SDK can be used for Device Driver Development, Firmware Development, and for pre-silicon emulation as well. It supports Xtensa and ARM processor with Linux OS and it also equip with Ethernet interface which can be used for remote debugging. It also supports PCIe stress tests for Speed change, link enable/disable, entry/exist for lower power states, …etc. 

Cadence PCIe 4.0 Software Development Kit

The “System Interop/Compliance/Debug platform” was set up to test with multiple endpoint and System platforms. This system come with integrated Cadence software for basic system debug without the need for analyzer to perform the analysis, such as LTSSM History, TS1/TS2 transmitted/received with time stamp, Link training phases, Capturing Packet errors details, Capturing PHY TX/RX internal state machine details, ...etc.

Cadence PCIe System Interop/Compliance/Debug Platform

The year 2019 is certainly a "fruitful year" for the PCIe as more Gen 4 products are now available in the market, Gen 5 v1.0 specification got officially ratified, and PCI-SIG's revealing of Gen 6 specification development. We were glad to be part of this APAC tour with the chance to further introduce Cadence’s complete and comprehensive PCIe IP solution.

See you all next year in APAC again!

More Information

For more information on Cadence's PCIe IP offerings, see our PCI Express page.

For more information on PCIe in general, and on the various PCI standards, see the PCI-SIG website.

Related Posts

• Blog: Did You “Stress Test” Yet? Essential Step to Ensure a Quality PCIe 4.0 Product
• Blog: PCIe Gen4: It’s Official, We’re Compliant
• Blog: PCIe 3.0 Still Shines While PCIe Keeps Evolving
• Blog: The PCIe 4.0 Era Continues at PCI-SIG Developers Conference 2016

A couple of evenings ago, my cousin Debika and I were discussing how we’d react if we were told we had just a few months to live. She said she would try and do everything she liked in that time, and surround herself with her family. I said that I’d be inclined to save people I cared for the pain of watching me die—whatever that took. Ironically and unexpectedly, shortly after this conversation, we found ourselves watching François Ozon’s remarkable film Time to Leave.

The film begins with its protagonist, Romain, discovering that he is terminally ill with cancer, and deciding not to bother with treatment. He does not tell his friends or family of his condition. He is rude to his sister, and drives her to tears. He tells his lover, Sasha, that he does not love him, and drives him to move out of their house. This is a transparent lie, but though we see it, Sasha doesn’t. He confides to his grandmother—marvellously played by Jeanne Moreau—because she is like him, and “will die soon.” But even in this winding up, complications ensue.

Melvil Poupaud plays Romain, and is magnificent – understated, yet effortlessly expressive. But it is Ozon’s storytelling that makes this film memorable. It is spare, focussing only on the essential, and revealing its essence. There is not a frame out of place in this heartbreaking film that ends, like Romain, too soon and in great beauty.

Rave Out © 2007 IndiaUncut.com. All rights reserved.
India Uncut * The IU Blog * Rave Out * Extrowords * Workoutable * Linkastic

I have been using Voltus to do IR drop analysis but I got caught on one signal. It is negative. When I use:

set_pg_nets -net negsupply -voltage -5 -threshold -4.5 -package_net_name NEGSUP -force

Voltus dies with a backtrace. Looking at the beginning of the trace you see it suggests that the problem is it set maximum to -5 and minimum to 0. Is there another way to express a negative voltage supply for IR drop analysis?

I recently received a student version or OrCad, which I was able to download and install without trouble. However, I do not know how to setup my license.

I received the license file in an email. The instructions within the file were to include my hostname and the absolute path. I do not know what the path should point to so I left it empty. 

I was able to setup the licence server using the license file without any issues. However, setting up the licence configuration utility gives the following messages:

A user environment variable name CDC_LIC_FILE is found. The CDC_LIC_FILE settings you make will be overwritten by this user level variable. Furthermore, I get the error:

ERROR: Unable to update the CDS_LIC_FILE license path environment variable. 

This is preventing me from using any of the software.

What are the steps to installing the license and how could I resolve this error?

Thank you

Large-signal S-parameters (LSSPs) are an extension of small-signal S-parameters and are defined as the ratio of reflected (or transmitted) waves to incident waves. (read more)

I have a SKILL script that executes the callback of a menu item, and depends on first redefining an environment variable. 

When a user interrupts the script with ctrl-C, the script cannot finish to set the environment variable back to its default value.

How can I write the script in a way that handles a user interrupt to reset the changed environment variable after the interrupt?

Is there any way I can find duplicated shapes?

I would like to find two or more shapes are identical and they are placed in the same location.

On May 7, 2013 Cadence announced a 30% productivity gain in the June 2013 Incisive Enterprise Simulator 13.1 release.  Advanced debug visualization, faster turn-around time, and the extension of eight years of low-power verification innovation to IEEE 1801/UPF are the key capabilities in the release.

When we talk about low-power verification its easy to equate it with simulation.  For certain, simulation is the heart of a low-power verification solution. Simulation enables engineers to run their design in the context of power intent.  The challenge is that a simulation-only approach is inadequate. For example, if engineers could achieve SoC quality by verifying the individual function of each power control module (PCM), then simulation could be enough.  For a single power domain, simulation can be enough. 

However, when the SoC has multiple power domains -- and we have seen SoCs with hundreds of them -- engineers have to check the PCMs and all of the arcs between the power modes.  These SoCs often synchronize some of the domain switching to reduce overall complexity, creating the potential for signal skew errors on the control signals for the connected domains.  Managing these complexities requires verification methodologies including advanced debug, verification planning, assertion-based verification, Universal Verification Methodology - Low Power (UVM-LP), and more (see Figure 1).

Figure 1:  Comprehensive Low-Power Verification 

But even advanced verification methodologies on top of simulation aren't enough.  For example, the state machine that defines the legal and illegal power mode transitions is often written in software. The speed and capacity of the Palladium emulation platform is ideal to verify in this context, and it is integrated with simulation sharing debug, UVM acceleration, and static checks for low-power. And, it reports verification progress into a holistic plan for the SoC.  Another example is the ability to compare the design in the implementation flow with the design running in simulation to make sure that what we verify is what we intend to build.

Taken together, verification across multiple engines provides the comprehensive low-power verification needed for today's advanced node SoCs.  That's the heart of this low-power verification announcement. 

Another point you may have noticed is the extension of the Common Power Format (CPF) based power-aware support in the Incisive Enterprise Simulator to IEEE 1801.  We chose to bring IEEE 1801 to simulation first because users like you sometimes need to mix vendors for regression flows.  Over time, Cadence will extend the low-power capabilities throughout its product suite to IEEE 1801.

If you are using CPF today, you already have the best low-power solution. The evidence is clear:  the upcoming IEEE 1801-2013 update includes many of the CPF features contributed to 1801/UPF to enable methodology convergence.  Since you already have those features in the CPF flow, any migration before you have a mature IEEE 1801-2013 tool flow would reduce the functionality you have today.

If you are using Unified Power Format (UPF) 1.0 today, you want to start planning your move toward the IEEE 1801-2013 standard.  A good first step would be to move to the IEEE 1801-2009 standard.  It fills holes in the earlier UPF 1.0 definition.  While it does lack key features in -2013, it is an improvement that will make the migration to -2013 easier. The Incisive 13.1 release will run both UPF 1.0 and IEEE 1801-2009 power intent today.

Over the next few weeks you'll see more technical blogs about the low-power capabilities coming in the Incisive 13.1 release.  You can also join us on June 19 for a webinar that will introduce those capabilities using the reference design supplied with the Incisive Enterprise Simulator release.

=Adam "The Jouler" Sherer

(Yes, "Sherilog" is still here.  :-) )

The IEEE has announced the publication of the new 1801-2013 standard, also known as UPF 2.1, and immediate availability for free download through the IEEE 1801-2013 Get Program. Even though the standard is new to the whole world, for the people of the IEEE working group this standard is finally done and is in the past now.

There is a Chinese saying "好事多磨" which means "good things take time to happen." I forgot the exact time when I first joined the working group for the new standard -- about two and half years ago -- but I do remember long hours of meetings and many "lively" debates and discussions. Since the "hard time" has passed us, I would like to share some fun facts about the working group and the standard.

• The 1801 working group is the largest entity based ballot group in IEEE-SA history.
• The new standard was initially planned for 2012, but was delayed purely due to the large amount of work required.
• At one point, the group was debating on whether the new standard should be called UPF 2.1 or 3.0. It may sound weird now but we spent quite some time discussing this. Eventually we settled on 2.1 as it was the original plan.
• The 1801-2013 document has 358 pages which is 53% thicker than previous version (the sheer amount of changes in the new standard indicate that this is more than just a normal incremental update of the previous version as suggested by naming it 2.1)
• Around 300 real issues were reported over the previous version and a majority of them were fixed in the new release.
• This is the first release with constructs and semantics coming from Common Power Format (CPF), a sign of convergence of the two industry leading power formats.
• There are about 100 working group meetings in my Outlook calendar since 2011, with meeting times ranging from 2 hours to 8 hours.
• We extensively used Google Drive (which was called Google Docs when the working group started), a great tool for productivity. I cannot imagine how any standard could have been done before Google existed!

Personally, I had an enjoyable journey, especially from having the privilege to work with many industry experts who are all passionate about low power. I do have one more thing to share though. My older daughter went from middle school to high school during the period of the development of the new standard. Since most of the meetings took place in the early morning California time, she had to endure the pain of listening to all these discussions on power domain, power switches, etc. on her way to school.

I asked her if she learned anything. She told me that other than being able to recognize the voices of Erich, John and Joe on the line, she also learned that she would never want to become an electrical or computer engineer! She was so happy that the meetings stopped a couple of months ago. But what I did not tell her is that the meetings will resume after DAC! Well, I am sure this will be a big motivation for her to get her own driving license in the summer.

If you want to get some quick technical insights into the new standard, check out my recent EE Times article IEEE 1801-2013: A bold step towards power format convergence.

Qi Wang

There is no better way other than a self-help training kit -- (rapid adoption kit, or RAK) -- to demonstrate the Incisive Enterprise Simulator's IEEE 1801 / UPF low-power features and its usage. The features include:

• Unique SimVision debugging 
• Patent-pending power supply network visualization and debugging
• Tcl extensions for LP debugging
• Support for Liberty file power description
• Standby mode support
• Support for Verilog, VHDL, and mixed language
• Automatic understanding of complex feedthroughs
• Replay of initial blocks
• ‘x' corruption for integers and enumerated types
• Automatic understanding of loop variables
• Automatic support for analog interconnections

Mickey Rodriguez, AVS Staff Solutions Engineer has developed a low power UPF-based RAK, which is now available on Cadence Online Support for you to download.

• This rapid adoption kit illustrates Incisive Enterprise Simulator (IES) support for the IEEE 1801 power intent standard. 

Patent-Pending Power Supply Network Browser. (Only available with the LP option to IES)

• In addition to an overview of IES features, SimVision and Tcl debug features, a lab is provided to give the user an opportunity to try these out.

The complete RAK and associated overview presentation can be downloaded from our SoC and Functional Verification RAK page:

We are covering the following technologies through our RAKs at this moment:

Synthesis, Test and Verification flow
Encounter Digital Implementation (EDI) System and Sign-off Flow
Virtuoso Custom IC and Sign-off Flow
Silicon-Package-Board Design
Verification IP
SOC and IP level Functional Verification
System level verification and validation with Palladium XP

Please visit https://support.cadence.com/raks to download your copy of RAK.

We will continue to provide self-help content on Cadence Online Support, your 24/7 partner for learning more about Cadence tools, technologies, and methodologies as well as getting help in resolving issues related to Cadence software. If you are signed up for e-mail notifications, you're likely to notice new solutions, application notes (technical papers), videos, manuals, etc.

Note: To access the above documents, click a link and use your Cadence credentials to log on to the Cadence Online Support https://support.cadence.com/ website.

Happy Learning!

Sumeet Aggarwal and Adam Sherer

If you weren't able to attend the 2013 DVCon, you missed out on a great IEEE 1801/UPF tutorial delivered by members of the IEEE committee. Accellera had the event recorded and that recording is now posted on the Accellera.org website. Regardless of your work so far with low power design and verification, you need to watch this video.

Power management is becoming ubiquitous in our world. The popular aspect is that reduced power is good for the evironment and that is true. But for those teams that have been building chips around the 40nm node and below, there is another truth. Power management is required simply to get working silicon in many cases. As the industry expands the number of designs with power management and forges deeper into advanced nodes, we steadily identify improvements to the power format descriptions. The most recent set of imporvements to the IEEE 1801 standard are now available in the 2013 version of that standard.

To help bring the standard to life, five representatives from the IEEE joined to deliver a tutorial at DVCon in 2013. Qi Wang (Cadence), Erich Marschner (Mentor), Jeffrey Lee (Synopsys), John Biggs (ARM), and Sushma Honnavarra-Prasad (Broadcom) each contributed to the tutorial. It started with a review of the UPF basics that led to the IEEE 1801 standard delivered by the EDA companies. The IEEE 1801 users then presented tutorial content on how to apply the standard. The session then concluded with a look forward to the IEEE 1801-2013 (UPF 2.1) standard. The standard was released two months after the DVCon tutorial and is available through the Accellera Get program.

So after the bowl games are over and you'vre returned through the woods and back over the river from Grandma's, grab a cup of hot cocoa and learn more about the power standards you may well be using in 2014.

Regards,

Adam "The Jouler" Sherer

ST Microelectronics reported their success with IEEE 1801 / UPF low-power simulation using Incisive Enterprise Simulator at CDNLive India in November 2013. We were able to meet with Mohit Jain just after his presentation and recorded this video that explains the key points in his paper.

With eight years of experience and pioneering technology in native low-power simulation, Mohit was able to apply Incisive Enterprise Simulator to a low-power demonstrator in preparation for use with a production set-top box chip.  Mohit was impressed with the ease in which he was able to reuse his existing IEEE 1801 / UPF code successfully, including the power format files and the macro models coded in his Liberty files. Mohit also discusses how he used the power-aware Cadence SimVision debugger.

The Cadence low-power verification solution for IEEE 1801 / UPF also incorporates the patent-pending Power Supply Network visualization in the SimVision debugger.  You can learn more about that in the Incisive low-power verification Rapid Adoption Kit for IEEE 1801 / UPF here in Cadence Online Support.

Just another happy Cadence low-power verification user!

Regards,

 Adam "The Jouler" Sherer 

Freescale was a successful Incisive® simulation CPF low-power user when they decided to step up their game. In November 2013, at CDNLive India, they presented a paper explaining how they improved their ability to find power-related bugs using a more sophisticated verification flow.  We were able to catch up with Abhinav Nawal just after his presentation to capture this video explaining the key points in his paper.

Abhinav had already established a low-power simulation process using directed tests for a design with power intent captured in CPF. While that is a sound approach, it tends to focus on the states associated with each power control module and at least some of the critical power mode changes.  Since the full system can potentially exercise unforeseen combinations of power states, the directed test approach may be insufficient. Abhinav built a more complete low-power verification approach rooted in a low-power verification plan captured in Cadence® Incisive Enterprise Manager.  He still used Incisive Enterprise Simulator and the SimVision debugger to execute and debug his design, but he also added Incisive Metric Center to analyze coverage from his low-power tests and connect that data back to the low-power verification plan.  As a result, he was able to find many critical system-level corner case issues, which, left undetected, would have been catastrophic for his SoC.  In the paper, Abhinav presents some of the key problems this approach was able to find.

You can achieve results similar to Abhinav. Incisive Enterprise Simulator can generate a low-power verification plan from the power format, power-aware assertions, and it can collect power-aware knowledge.  To get started, you can use the Incisive Low-Power Simulation Rapid Adoption Kit (RAK) for CPF available on Cadence Online Support.

Just another happy Cadence low-power verification user!

Regards,

Adam "The Jouler" Sherer  

We have many legacy board designs which have non-standard films. I'm writing SKILL code to automatically align a board's film records with our internal standard.

While I'm sure there will be multiple questions, here are the first two I've run into:

1. It seems the polyCutLayer parameter of axlFilmCreate() doesn't work. You can easily see this for yourself. Try typing "axlFilmCreate("test" ?polyCutLayer nil)" on the command window in Allegro. I'm returned "nil", indicating the film could not be created, and I see "*WARNING* (axlFilmCreate): Invalid option type: ?polyCutLayer" in the command window. Just to try a different parameter and see that it works, try "axlFilmCreate("test" ?negative t)". I'm returned a "t" and the film is created. Page 139 of 17.4-2019 algroskill.pdf shows this parameter and I can see it listed if I inspect an existing from from the DB, so what gives? Is the polyCutLayer parameter broken when creating films?

2. In conjunction with the above, if I loop through all current films and use axlDeleteObject() to remove them all, and then try to create new films but give an argument to the polyCutLayer parameter, films containing copper layers seem to be automatically created. There are four films (my test board has four layers) with the ETCH/, PIN/, and VIA CLASS/ subclasses. I am able to manually delete all films and see absolutely no films at all. Is there something weird going on here or is this to be expected for some reason?

I'm running Allegro 17.4s002.

I've redesigned a custom TO220FLAT Package

First I created a TO220shape.ssm  with PCB Editor. Then I created a surface mount T220build.pad in Padstack Editor using TO220shape.ssm. Then I created a TO220FLAT.psm in PCB Editor. I placed 3 Connect pins and 9 Mechanical pins for the TO220 TAB, using standard through-hole pads for better current handling.

Adding those Mechanical pins created many DRC errors caused by the proximity of those pads attached to the TO220shape.

Thru Pin to SMD Pin Spacing (-200.0 0.0) 5 MIL OVERLAP DEFAULT NET SPACING CONSTRAINTS Mechanical Pin "Pad50sq30d" Pin "T220build, 2"

I corrected the situation (so I though) by Waiving those DRC errors, thinking that they could not cause any problem and because that’s what I want, i.e.: 9 through-holes under the TO220 device. The idea being that when this device is mounted flat on the PCB it could carry lots of current via 9 pads that could make a good high current conductor to inner layers.

I then saved the Package and updated all related footprint schematic parts  in Capture. Created a new Netlist. Then I imported the new logic into PCB Editor to reflect that change. When the File > Import > Logic is finished I get no feedback error! (which, for me is a substantial achievement in itself)

Now, in the Design Window I see all those DRC errors popping up again, despite the fact that I waived those DRCs back in the Padstack edition. If I run a Design Rule Check (DRC) Report I will see all those DRC listed again. Now, I understand that I can go ahead and waive all those DRCs (100 in total) but I’m thinking there is got to be a better way of doing this.

Please, any advise is welcome. Thanks