Thomas Zunie, a junior from Zuni, NM takes first in the Men's 5000 meter run in a time of 17:21.41.  Zunie's finish in the 5000 garnered him a First Team All-Conference.  Zunie also earned a third place in the 1500 meter run with a time of 4:33.77.   

Billy Mills (Track & Field) 1953-57
Mills grew up on the Pine Ridge Indian Reservation for the Oglala Lakota Tribe in Pine Ridge, S.D. Growing up Mills participated in boxing and running but did not hone his skills on the track until he came to Lawrence, Kan., and Haskell Institute. Following his time at Haskell, the South Dakota native went onto star at the University of Kansas, where he was a three-time All-American and a Big 8 champion. Aside from his collegiate prowess, Mills did exceptionally well on the international stage, winning Gold in the 10,000 meters during the 1964 Olympics in Tokyo, where he became only the second Native American to capture Gold. The heralded Olympian continued to run after his Tokyo experience, breaking U.S. records in two events (10,000 meters and three mile run), as well as a world record in the six mile. Mills currently lives in Sacramento, Calif., where he is a spokesperson for ‘Running Strong for American Indian Youth' organization. He is also a member of numerous Hall of Fames throughout the nation, including the U.S. Olympic Hall of Fame as well as the National Distance Running Hall of Fame.

Last week the weather disrupted the Indians as they opened the Outdoor Season at Pittsburg State University.  Thunderstorms and lightning prevented numerous races and events from running on schedule.  For many, the meet yesterday was their opportunity to finally compete.

Haskell will play host to the 2014 Midlands Collegiate Athletic Conference Outdoor Track and Field Championships on April 25th and 26th. 

Baldwin City, Kansas - The Haskell Indian Nations University men's track and field teams competed at the Baker Relays on Saturday.

Ottawa, Kansas - The Haskell Indian Nations University Men's track and field teams competed at the Ottawa Braves Invitational on Saturday.

Liberty, MO - The Haskell Indian Nations University Men's track and field teams competed at the Darrel Gourley Open on Saturday.

The Men's Track & Field team finished their season at Baker Invite on April 29th. Here are some of the athlete's best finishes throughout the season. The Seniors behind the Track & Field program are Isaac Johnson and Stephen Esmond (SR). 

1 Papua New Guinean Kina = 5.3495 South African Rand

1 Papua New Guinean Kina = 355.5874 South Korean Won

1 Brunei Dollar = 12.9848 South African Rand

1 Brunei Dollar = 863.1108 South Korean Won

USB4 can simultaneously tunnel USB3, PCIe and DisplayPort native protocol traffic through a hierarchy of USB4 routers. The key to tunneling of these protocols is routing table programmed at each ingress adapter. An entry of a routing table maps an incoming HopID, called Input/Ingress HopID to a corresponding pair of Output/Egress Adapter and Egress/Output HopID.

The responsibility of programming routing tables lies with the Connection Manager. Connection Manager, having the complete view of the hierarchy of the routers, programs the routing tables at all relevant adapter ports. Accordingly, the USB3, PCIe and DisplayPort protocol tunneled packets are routed, and reach their respective intended destinations.

The diagrammatic representation below is an example of tunneling of USB3 protocol traffic from USB4 Host Router to USB4 Peripheral Device Router through a USB4 Hub Router. The path from USB3 Host to USB3 Device is depicted by routing tables indicated at A -> B -> C -> D, and the one from USB3 Device to USB3 Host by routing tables indicated at E -> F -> G -> H . Note that the Input HopID from and Output HopID to all three protocol adapters for USB3, PCIe and DisplayPort Aux traffic, are fixed as 8, and for DisplayPort Main Link traffic are fixed as 9.

Once the native protocol traffic come into the transport layer of a USB4 router, the transport layer of it does not know to which native protocol a tunneled packet belongs to. The only way a transport layer tunneled packet is routed through the hierarchy of the routers is using the HopID values and the information programmed in the routing tables.

The figure below shows an example of tunneling of all the three USB3, PCIe and DisplayPort protocol traffic together. The transport layer tunneled packets of each of these native protocols are transported simultaneously through the routers hierarchy.

 Cadence has a mature Verification IP solution for the verification of USB3, PCIe and DisplayPort tunneling. This solution also employs the industry proven VIPs of each of these native protocols for native USB3, PCIe and DisplayPort traffic.

Verifying lane adapter state machine in a router design is quite an involved task and needs verification from several aspects including that for its link training functionality.

The diagram below shows two lane adapters connected to each other and each going through the link training process. Each training sub-state transition is contingent on conditions for both transmission and reception of relevant ordered sets needed for a transition. Until conditions for both are satisfied an adapter cannot transition to the next training sub-state.

As deduced from the lane adapter state machine section of USB4 specification, the reception condition for the next training sub-state transition is less strict than that of the transmission condition. For ex., for LOCK1 to LOCK2 transition, the reception condition requires only two SLOS symbols in a row being detected, while the transmission condition requires at least four complete SLOS1 ordered sets to be sent.

From the above conditions in the specification, it is a possibility that a lane adapter A may detect the two SLOS or TS ordered sets, being sent by the lane adapter B on the other end, in the very beginning as soon as it starts transmitting its own SLOS or TS ordered sets. On the other hand, it is also a possibility that these SLOS or TS ordered sets are not yet detected by lane adapter A even when it has met the condition of sending minimum number of SLOS or TS ordered sets.

In such a case, lane adapter A, even though it has satisfied the transmission condition cannot transition to the next sub-state because the reception condition is not yet met. Hence lane adapter A must first wait for the required number of ordered sets to be detected by it before it can go to the next sub-state. But this wait cannot be endless as there are timeouts defined in the specification, after which the training process may be re-attempted.

This interlocked way of operation also ensures that state machine of a lane adapter does not go out of sync with that of the other lane adapter. Such type of scenarios can occur whenever lane adapter state machine transitions to the training state from other states.

Cadence has a mature Verification IP solution for the verification of various aspects of the logical layer of a USB4 router design, with verification capabilities provided to do a comprehensive verification of it.

Hi,

I'm a newbie and I'm working on a mixed-signal chip in Innovus. I've got a few analog LEF files that I've imported into my floorplan as macros.

My chip has got two power domains - VCC and VBAT.

One of the macro in the VBAT domain uses VBAT and GND as power rails myloweslife.com.

On doing Special-Route, I've got a lot of minute power rails for the standard cells, as expected.

But, the VBAT power rails are not getting extended till the outer power rings. Only the GND rails are correctly getting extended till the outer power rings.

A screen shot is attached for reference.

Thanks for any help

Hello, my name is Hsukang. I want to use Liberate to create a .lib file for the following circuit. This is a scan FF with two separate outputs.   The question is that no matter how I described its function, the synthesis tool said its a manformed scan FF.  Has anyone ever encountered anything like this？How should I describe the function correctly？I found that almost standard flip-flop cells are with only one output Q or have Qn at the same time. Does Liberate support scan flip-flop cells with two separate outputs ？

Thanks.

Hi,

I'm a newbie and I'm working on a mixed-signal chip in Innovus. I've got a few analog LEF files that I've imported into my floorplan as macros.

My chip has got two power domains - VCC and VBAT.

One of the macro in the VBAT domain uses VBAT and GND as power rails KrogerFeedback.com.

On doing Special-Route, I've got a lot of minute power rails for the standard cells, as expected.

But, the VBAT power rails are not getting extended till the outer power rings. Only the GND rails are correctly getting extended till the outer power rings.

A screen shot is attached for reference.

Thanks for any help

Hello everyone,

I am Vinay and I am currently developing some digital circuits for my chip design for my master's thesis at University at Buffalo.

I am fairly very new to Verilog and I don't seem to follow some of the things others find very easy.

Following are the things that I want to do to which I have no clue:

1. Develop certain arithmetic functionality in Verilog

2. Generate netlist for the verilog code

3. Feed the netlist file to Cadence encounter to be able to generate Digital Circuits' layout for my chip

I can use Cadence Virtuoso and Encounter for this but I don't know the exact procedure to get this done.

Could someone please describe the detailed process for doing the things mentioned above.

Thank you.

Hi! 

In my design, there is an one hold violation on scan path, test data is corrupted during scan cycles (when i run verilog simulation of test vectors). I created constraint 'falsepath' to 'TI' input of violated flop and load it into Modus, but this does not have effect.

Can enyone explain to me, does 'falsepath' constraint affects scan path (from Q to TI/SI input, i.e. during SCAN procedure) or this constraint is only for functional mode (ie affects TEST cycle only - to 'D' input)?

I hope resolve this problem this by using some modus design constraints or any other method.

Hello Everyone,

I was finishing the layout via Innovus and ran verifyConnectivity followed by checkRoute.

verifyConnectivity was okay and it showed no errors and no warnings, whereas checkRoute showed there are 3 unrouted nets.

When i ran the checkRoute command again immediately, it showed no unrouted/unconnected nets.

Which of these commands should we trust or is this really unrouted nets issue?

Looking forward for a response, thanks in advance.

Regards,

Vijay

hello sir this is Ganesh  from NIT Hamirpur pursuing MTech in VLSI. I have doubt regarding SDF i'm using genus tool for synthesis & after synthesis when i'm generating SDF it is giving delays by default for maximum values but i want all the delays like minimum:Typical:Maximum how can i do this. Is there any provision to set PVT values manually for SDF generation so that i can get all the delay values.

How to get minimum: typical: maximum values in SDF I am using Genus synthesis tool there default setting is for max value. But I want all the values please guide me.

Which things we have to mention in SDC for combinational design? How to create virtual clock? 

Hi Folks, Check out this great new video on YouTube: CDNLive SV 2014: PMC Improves Visibility and Performance with Spectre APS In this video from CDNLive Silicon Valley 2014, Jurgen Hissen, principal engineer, MSCAD, at PMC, discusses an aggressive...(read more)

I can get the bound stdcells using bndGetBoundObjects, but not get what each individual stdcell corresponds in layout.

Is there a way to get the layout bound stdcells of an array schematic symbol if the layout stdcell name do or do not match the symbol naming?

Once the schematic array stdcells are bound to the layout stdcells, how to get the correct terminal term~>name and net~>name?

Example of a schematic symbol and layout stdcell:

Schematic

INV<0:2>    instTerms~>terms~>name = ("vss" "vdd" "A" "Y")

                   instTerms~>net~>name = ("<*3>vss" "<*3>vdd" "in<0:2>" "nand2A,nand3B,nor2B")

Layout ( I know it is bad practice, but it happens )

stdcell1 instTerms~>terms~>name = ("vss" "vdd" "A" "Y")

             instTerms~>net~>name = ("vss" "vdd" "in<0>" "nand2A")

I23        instTerms~>terms~>name = ("vss" "vdd" "A" "Y")

             instTerms~>net~>name = ("vss" "vdd" "in<1>" "nand3B")

INV(2) instTerms~>terms~>name = ("vss" "vdd" "A" "Y")

             instTerms~>net~>name = ("vss" "vdd" "in<2>" "nor2B")

Paul

Hi Team,

Problem Statement:In hierarchical layout, I want to get BBOX of particular layer without actually flattening the layout.

Description:The layer can be at any hierarchical depth i.e both from PCELL or shapes but at top level if they are overlapping then I want the merged BBOX.

Now, I am able to get BBOX of all the shapes present at different hierarchy.But i finding issue in merging BBOX.

Please can help me on the same issue as I require efficient way to merge the BBOX because list containing the BBOX is huge.

Thanks in advance.

Regrads,

Prasanna

I have a SKILL script that executes the callback of a menu item, and depends on first redefining an environment variable. 

When a user interrupts the script with ctrl-C, the script cannot finish to set the environment variable back to its default value.

How can I write the script in a way that handles a user interrupt to reset the changed environment variable after the interrupt?

Hi,

I am running simulation in ADEXL and need a custom function for VIVA to apply same procedure to all signals saved in output. For instance, I have clock nets and I want to get all of them and look at the duty-cycle, edge rate etc.

It is a little more involved than about part since I have some regex and setof to filter before processing but if I can get all signals for current history, I can postprocess them later.

In ocean, I am just doing outputs() and getting all saved signals but I was able to do this in VIVA calculator due to the difficulties in getting current history, test name and opening result directory

thanks

yayla

Version Info:

ICADV12.3 64b 500.21

spectre -W =>

Tool 'cadenceMMSIM' Current project version '16.10.479'
sub-version  16.1.0.479.isr9

HI All,

I am new to skill. My requirement is

open layout 

get m0 layer cordinates in a layout

dump info into a text file

For example 2 input Nand, A,B output , vcc , vssx and internal net (n2) will be the m0 layers. I need info like in a text file.

n2 co ordinate

vssx (co ordinate)

a (co ordinate)

b (co ordinate ) .

I found similar code in cadence form . Can you help me on this

 procedure(printPts()
let(    (type
    (cnt 0)
    (objList geGetSelSet()))

foreach(obj objList
    ++cnt
    type = obj~>objType
    case(type
        ("inst"
            printf("%s %L at %L " type obj~>xy))
        ("rect"
            printf("%s on layer %L at %L " type obj~>lpp obj~>bBox))
        ("polygon"
            printf("%s on layer %L at %L " type obj~>lpp obj~>points))
        ("path"
            printf("%s on layer %L at %L " type obj~>lpp obj~>points))
        ("pathSeg"
            printf("%s on layer %L at %L " type obj~>lpp list(obj~>beginPt obj~>endPt)))
        ("label"
            printf("%s on layer %L at %L " type obj~>lpp obj~>xy))
        (t    printf("%s not defined " type))
    )
)
printf("%n objects selected " cnt)
); end of let
); end of printPts

I use "Degassing" function in APD. It provides the options "Even Layers" and "Odd Layers". 

My first question is that is there any additional setting to choose the specific layer? 

The second question is that  is there any way to select a range to place degassing hoe? I don't want to place holes at the whole layer.

Thanks!  

Have you ever manufactured a printed circuit board (PCB) without analyzing all the routed signal traces? Most designers will say “yes, all the time.” Trace widths and spacing are set by constraints,...

[[ Click on the title to access the full blog on the Cadence Community site. ]]

Today, we are living in the era where whatever we think of as an idea is not far from being implemented…thanks to machine learning (ML) and artificial intelligence (AI) entering into the...

[[ Click on the title to access the full blog on the Cadence Community site. ]]

What is a Power Distribution Network (PDN) after all but resistance, inductance, and capacitance in the PCB and components? And, of course, it is there to deliver the right current and voltage to each component on your PCB. But is that all? Are there oth...(read more)

Have you ever manufactured a printed circuit board (PCB) without analyzing all the routed signal traces? Most designers will say “yes, all the time.” Trace widths and spacing are set by constraints, and many designers simply don’t h...(read more)

Hi,

i am designing a broadband (100 MHz -6 GHz BW) receiver chain for  radar/rcs measurement tester. i will put Low noise amplifier after antenna input followed by mixed(10 MHz IF BW and digitizer.

I am facing problem regarding LAN. bandwidth of LAN is  approx 6 GHz(100 MHz-6GHz), gain 25-35 dB, with NF less than 2. I am uncertain about noise floor at the output of LNA.  I dont know exact SNR at the input of LNA but it shall be good.System operation will be on stepped CW waveform so receiver input signal will sweep over the BW and some step size.

so LNA output r noise floor will be? i assume, we can neglect thr role of input noise because it will be lesser than internal noise of LNA.

will it be LNA internal noise (Thermal noise due to BW) only ?

will it be LNA internal noise (Thermal noise due to BW)  + LAN Gain ? -78+25 =-53 dB? internal noise shall be lesser because NF is less than 3 . 

i have practically observed that that output noise floor is much lesser then even thermal noise( over LNA BW). i have gone through some tutorial where  formula says( internal noise+input noise)+gain. in  my case input noise shall be much less than theoretical internal noise. 

Thanks

Hello, There is a manual in matlab of matching LNA  shown in the link bellow.

In it as shown in the plot bellow they mention input and output circle plots.

Is there such option of input and output circle in cadence virtuoso?

https://www.mathworks.com/help/rf/examples/designing-matching-networks-part-1-networks-with-an-lna-and-lumped-elements.html

Hello, i am a student who is studying Allegro tool with SKILL.

I have a question about SKILL axlSegDelayAndZ0. The reference says this function "returns the delay and impedance of a cline segment."

I want to know how many components does this tool consider when calculating timing delay from the length. 

How steep is input signal's rise transition? Is rise transition shape isosceles trapezoid or differential increasing shape?

Also, if it is a multi fan-out, the rise transition time will be different net by net. How can this tool can calculate in this case?

I want to hear answers about these questions.

Thank you for reading this long boring questions, and i will be waiting for answers.

I am importing sessions which are run by other people to analyse and I would like to remove them from my vManager Regressions tab as they become obsolete. As I am not the original person who run the sims, I cannot "delete" sessions. What are my options? Thanks.

Here are two screen capture of Before and After Autorouting my board. Padstacks have all been revised and corrected. The Capture Schematic is correct. All Footprints have been verified after Padstack revision. a new NETLIST generation have been done after some corrections made in Capture. I have imported the new Logic. I revised my Layout Cross Section as such: TOP, GND, VCC, BOTTOM. Both VCC and GND shapes have been assigned to their respective logical GND and VCC Nets (verified). Yet, I still have the Autorouter to systematically use extra vias to make GND and VCC connections to the VCC and GND planes. Where a simple utilisation of the part padstack inner layer would have been indicated. What Im I missing ?

Hi, I am in the middle of a design and had no problem going back and forth between schematics and layout. Now I am getting the error message below. I am using Cadence 17.2.

ERROR: Layout database has probably been reverted to an earlier version than that, which was used in the latest flow or the schematic database was synchronized with another board.

The basecopy file generated by the last back-to-front flow not found.

ERROR: Layout database has probably been reverted to an earlier version than that, which was used in the latest flow or the schematic database was synchronized with another board.

The basecopy file generated by the last back-to-front flow not found.

Error: CMFBC-1: The schematic and the layout constraints were not synchronized as the changes done since the last sync up could not be reconciled. Syncing the current version of the schematic or layout databases with a previous version would result in this issue. The  constraint difference report is displayed.

Continuing with "changes-only" processing may result in incorrect constraint updates.

Thanks for your input

Claudia

Hello All,

I'm currently using OrCAD PCB Designer Professional w/ PSpice (version 16.6-2015).  In the 'Design Object Find Filter' side bar, all options are grayed out and unselectable.  I did attempt to 'Reset UI to Cadence Default' without any luck.  A colleague has no issues with the identical file on his computer.  Any guidance would be much appreciated.  Thanks!

George

Hi,

I have a new customer that uses Allegro Design entry HDL for the schematic and have a few questions.

1. How do you get pin/gate swaps into the symbols in the schematic ?

2. How do you transfer them to the pcb editor ?

3. How do you back annotate the swaps from the pcb editor to the schematic ?

4. How do you stop the export/Import physical from updating the constraints in the pcb file ? 

 hi,

i am doing a project on synchronous fifo design using verilog. below written is my coding. after simulation the waveform is showing error regarding its not giving value of rdata_valid and is showing a red line in waveform and due to it address is also not being taken.i have attached the waveform also. the logic for write logic is also not accepting the address(no change occurs while changing value of read_ptr). i have attached my file with it so plz refer to it.

plz help me out in this. your guidance and solns will help me in completing my project work.

thank you

lov sareen

Hi, 

I want my layout verified by Quantus QRC. But, I can't find the tool bar on the option list ( as show in the picture)

I have tried to install EXT182 and configured it with iscape already, and also make some path settings on .bashrc, .cshrc. But, when I re-source .cshrc and run virtuoso again, I just can't find the toolbar. 

If you have some methods, please let me know.

Thanks a lot!

Appreciated

My virtuoso version is: ICADV12.3

Hi,

I tried to open my layout by Library Manager, but the Virtuoso CIW window sometimes pops up the follow WARNING messages( as picture depicts). Thus, layout can't open.

Sometimes, I try to reconfigure ICADV12.3 by the iscape and restart my VM and then it incredibly works! But, often not!

So, If anyone knows what it is going on. Please let me know! Thanks!

Appreciated so much   

Key Findings: Many more design teams will be reaching the mixed-signal methodology tipping point in 2015. That means you need to have a (verification) plan, and measure and execute against it.

As 2014 draws to a close, it is time to look ahead to the coming years and make a plan. While the macro view of the chip design world shows that is has been a mixed-signal world for a long time, it is has been primarily the digital teams that have rapidly evolved design and verification practices over the past decade. Well, I claim that is about to change. 2015 will be a watershed year for many more design teams because of the following factors:

• 85% of designs are mixed signal, and it is going to stay that way (there is no turning back)
• Advanced node drives new techniques, but they will be applied on all nodes
• Equilibrium of mixed-signal designs being challenged, complexity raises risk level
• Tipping point signs are evident and pervasive, things are going to change
• The convergence of “big A” and “big D” demands true mixed-signal practices

Reason 1: Mixed-signal is dominant

To begin the examination of what is going to change and why, let’s start with what is not changing. IBS reports that mixed signal accounts for over 85% of chip design starts in 2014, and that percentage will rise, and hold steady at 85% in the coming years. It is a mixed-signal world and there is no turning back!

Figure 1. IBS: Mixed-signal design starts as percent of total

The foundational nature of mixed-signal designs in the semiconductor industry is well established. The reason it is exciting is that a stable foundation provides a platform for driving change. (It’s hard to drive on crumbling infrastructure.  If you’re from California, you know what I mean, between the potholes on the highways and the earthquakes and everything.)

Reason 2: Innovation in many directions, mostly mixed-signal applications

While the challenges being felt at the advanced nodes, such as double patterning and adoption of FinFET devices, have slowed some from following onto to nodes past 28nm, innovation has just turned in different directions. Applications for Internet of Things, automotive, and medical all have strong mixed-signal elements in their semiconductor content value proposition. What is critical to recognize is that many of the design techniques that were initially driven by advanced-node programs have merit across the spectrum of active semiconductor process technologies. For example, digitally controlled, calibrated, and compensated analog IP, along with power-reducing mutli-supply domains, power shut-off, and state retention are being applied in many programs on “legacy” nodes.

Another graph from IBS shows that the design starts at 45nm and below will continue to grow at a healthy pace.  The data also shows that nodes from 65nm and larger will continue to comprise a strong majority of the overall starts. 

Figure 2.  IBS: Design starts per process node

TSMC made a comprehensive announcement in September related to “wearables” and the Internet of Things. From their press release:

TSMC’s ultra-low power process lineup expands from the existing 0.18-micron extremely low leakage (0.18eLL) and 90-nanometer ultra low leakage (90uLL) nodes, and 16-nanometer FinFET technology, to new offerings of 55-nanometer ultra-low power (55ULP), 40ULP and 28ULP, which support processing speeds of up to 1.2GHz. The wide spectrum of ultra-low power processes from 0.18-micron to 16-nanometer FinFET is ideally suited for a variety of smart and power-efficient applications in the IoT and wearable device markets. Radio frequency and embedded Flash memory capabilities are also available in 0.18um to 40nm ultra-low power technologies, enabling system level integration for smaller form factors as well as facilitating wireless connections among IoT products.

Compared with their previous low-power generations, TSMC’s ultra-low power processes can further reduce operating voltages by 20% to 30% to lower both active power and standby power consumption and enable significant increases in battery life—by 2X to 10X—when much smaller batteries are demanded in IoT/wearable applications.

The focus on power is quite evident and this means that all of the power management and reduction techniques used in advanced node designs will be coming to legacy nodes soon.

Integration and miniaturization are being pursued from the system-level in, as well as from the process side. Techniques for power reduction and system energy efficiency are central to innovations under way.  For mixed-signal program teams, this means there is an added dimension of complexity in the verification task. If this dimension is not methodologically addressed, the level of risk adds a new dimension as well.

Reason 3: Trends are pushing the limits of established design practices

Risk is the bane of every engineer, but without risk there is no progress. And, sometimes the amount of risk is not something that can be controlled. Figure 3 shows some of the forces at work that cause design teams to undertake more risk than they would ideally like. With price and form factor as primary value elements in many growing markets, integration of analog front-end (AFE) with digital processing is becoming commonplace.  

Figure 3.  Trends pushing mixed-signal out of equilibrium

The move to the sweet spot of manufacturing at 28nm enables more integration, while providing excellent power and performance parameters with the best cost per transistor. Variation becomes great and harder to control. For analog design, this means more digital assistance for calibration and compensation. For greatest flexibility and resiliency, many will opt for embedding a microcontroller to perform the analog control functions in software. Finally, the first wave of leaders have already crossed the methodology bridge into true mixed-signal design and verification; those who do not follow are destined to fall farther behind.

Reason 4: The tipping point accelerants are catching fire

The factors cited in Reason 3 all have a technical grounding that serves to create pain in the chip-development process. The more factors that are present, the harder it is to ignore the pain and get the treatment relief  afforded by adopting known best practices for truly mixed-signal design (versus divide and conquer along analog and digital lines design).

In the past design performance was measured in MHz with simple static timing and power analysis. Design flows were conveniently partitioned, literally and figuratively, along analog and digital boundaries. Today, however, there are gigahertz digital signals that interact at the package and board level in analog-like ways. New, dynamic power analysis methods enabled by advanced library characterization must be melded into new design flows. These flows comprehend the growing amount of feedback between analog and digital functions that are becoming so interlocked as to be inseparable. This interlock necessitates design flows that include metrics-driven and software-driven testbenches, cross fabric analysis, electrically aware design, and database interoperability across analog and digital design environments.

Figure 4.  Tipping point indicators

Energy efficiency is a universal driver at this point.  Be it cost of ownership in the data center or battery life in a cell phone or wearable device, using less power creates more value in end products. However, layering multiple energy management and optimization techniques on top of complex mixed-signal designs adds yet more complexity demanding adoption of “modern” mixed-signal design practices.

Reason 5: Convergence of analog and digital design

Divide and conquer is always a powerful tool for complexity management.  However, as the number of interactions across the divide increase, the sub-optimality of those frontiers becomes more evident. Convergence is the name of the game.  Just as analog and digital elements of chips are converging, so will the industry practices associated with dealing with the converged world.

Figure 5. Convergence drivers

Truly mixed-signal design is a discipline that unites the analog and digital domains. That means that there is a common/shared data set (versus forcing a single cockpit or user model on everyone). 

In verification the modern saying is “start with the end in mind”. That means creating a formal approach to the plan of what will be test, how it will be tested, and metrics for success of the tests. Organizing the mechanics of testbench development using the Unified Verification Methodology (UVM) has proven benefits. The mixed-signal elements of SoC verification are not exempted from those benefits.

Competition is growing more fierce in the world for semiconductor design teams. Not being equipped with the best-known practices creates a competitive deficit that is hard to overcome with just hard work. As the landscape of IC content drives to a more energy-efficient mixed-signal nature, the mounting risk posed by old methodologies may cause causalities in the coming year. Better to move forward with haste and create a position of strength from which differentiation and excellence in execution can be forged.

Summary

2015 is going to be a banner year for mixed-signal design and verification methodologies. Those that have forged ahead are in a position of execution advantage. Those that have not will be scrambling to catch up, but with the benefits of following a path that has been proven by many market leaders.

Since the release of the Automated Device Placement and Routing solution last year, we have continued to improve and build upon it. In this blog, I’ll talk about the latest addition—the Auto Device Array form—how this is an integral piece of the new Automated Device Placement and Routing solution.(read more)

Do you want to create designs that are correct by construction? Read along this blog to understand how you can achieve this by using Width Spacing Patterns (WSPs) in your designs. WSPs, are track lines that provide guidance for quickly creating wires. Defining WSPs that capture the width-dependent spacing rules, and snapping the pathSegs of a wire to them, ensures that the wires meet width-dependent spacing rules.(read more)

If you have one of those Die layouts, which doesn’t have bumps, but rather uses pad shapes and labels to identify I/O locations, then you might be feeling a bit left out of all of this jazz and tango. Hence, today, I am writing to tell you that, fear not, we have a solution for your Die as well.(read more)