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Engineers Use CAD To Adapt Standard Parts, Assemblies To Fit In Custom Body Design from 1950s

Education Week takes a close look at the obstacles and opportunities for American Indian children in finding success in school and beyond.

The Delaware Department of Agriculture (DDA) received reports over the weekend from several Delawareans who received unsolicited packages of seeds in shipments from China. Based on information provided by constituents, the packages were sent by mail and may have Chinese writing on them. Anyone who has received such a package is asked to report the shipment to the Smuggling Interdiction and Trade Compliance Program (SITC) by calling the Smuggling Hotline at 1-800-877-3835. Recipients are asked to leave everything inside the package to help investigators trace the origin. No one should ever plant seeds they did not order because they could be an invasive species.

Here Mudassar Khan has explained

Six pieces of legislation improve safety on Delaware’s roadways DOVER, Del. – Governor John Carney on Friday joined the Delaware Department of Transportation (DelDOT), the Delaware Department of Safety and Homeland Security (DSHS), members of the General Assembly, and advocates to sign a package of legislation designed to improve safety on Delaware’s roadways.   Today’s legislative package […]

WILMINGTON, Del. – Governor Carney joined Senator Stephanie Hansen, other members of the General Assembly and advocates on Thursday, September 5, to sign a package of bills that further Delaware’s efforts to protect the environment and support clean energy. Legislation included Senate Bill 265, House Bill 9, House Substitute 2 for House Bill 13, Senate Bill 237 and House […]

New IC packaging workflows in Cadence Allegro X layout tools allow you to follow a guided path from starting a design through final manufacturing. The path is there to ensure that you don’t miss steps and perform actions in the optimal order. W...(read more)

Starting SPB 23.1, Allegro Package Designer Plus (APD+) has been rebranded as Allegro X Advanced Package Designer (Allegro X APD).

The splash screen for Allegro X APD will appear as shown below, instead of showing APD+ 2023:

For the Windows Start menu in 23.1, it will display as Allegro X APD 2023 instead of APD+ 2023, as shown below

23.1 Start menu 

In the Product Choices window for 23.1, you will see Allegro X Advanced Package Designer in the place of Allegro Package Designer +, as shown below: 

23.1 product title

Have you heard that starting SPB 23.1, Allegro Package Designer Plus (APD+) will be renamed as Allegro X Advanced Package Designer (Allegro X APD)? 

Allegro X APD offers multiple new features and enhancements on topics like Via Structures, Wirebond, Etchback, Text Wizards, 3D Canvas, and more. 

This post presents the new 3DX Canvas introduced in SPB 23.1. This can be invoked from Allegro X APD (from the menu item View > 3DX Canvas). 

Some of the key benefits of the new canvas: 

• This canvas addresses the scale and complexity in large modern package designs. It provides highly efficient visual representation and implementation of packages. 
  
• The new architecture enables high-performance 3D incremental updates by utilizing GPU for fast rendering. 
  
  
• Real-time 3D incremental updates are supported, which means that the 3D view is in sync with all changes to the database. 
  
  
• The new canvas provides 3D visualization support for packaging objects such as wire bonds, ball, die bump/pillar geometries, die stacks, etch back, and plating bar. 
  
  
• This release also introduces the interactive measurement tool for a 3D view of packages. Once you open 3DX Canvas, press the Alt key and you can select the objects you want to measure. 
  
• 3DX Canvas provides new 3D DRC Bond Wire Clearances with Real 3D DRC Checks. True 3D DRC in Constraint Manager has been introduced. If you open Constraint Manager, there will be a new worksheet added. Following DRC checks are supported: 

  Wire to Wire 
  Wire to Finger 
  Wire to Shape 
  Wire to Cline 
  Wire to Component

Power and Ground rings are exposed rings of metal surrounding a die that supply power/ground to the die and create a low-impedance path for the current flow. These rings ensure stable power distribution and reduce noise. Allegro X Package Designer Plus has a utility called Power/Ground Ring Generator which lets you define and place one or more shapes in the form of a ring around a die.

 To run the PWR/GND Generator Wizard, go to Route > Power/Ground Ring Generator or type "pring wizard" in the APD command window to invoke the Wizard.

This Wizard lets you define and place one or more shapes in the form of a ring around a die. The Power/Ground Ring Wizard creates up to 12 rings (shapes) at a time. If you require more rings, you can run the Power/Ground Ring Wizard as many times as needed. This command displays a wizard in which you can specify:

• The number of rings to be generated
• The creation of the first ring as a die flag (Die flag is the boundary of the die like the power ring.)
  • If you create a die flag and the first ring is the same net as the flag, you can enter a negative distance to overlap the ring and the die flag.
• Multiple options for placement of the rings with respect to:
  • Origination point
  • Distance from the edge of the die
  • Distance from the nearest die pin on each die side
• The reference designator of the die with which the rings will be used
• The distance between rings
• The width of each ring
• The corner types on each ring (arc, chamfer, and right-angle)
• An assigned net name for each ring
• A label for each ring

The rings are basic in nature. For other shape geometries or split rings, choose Shape > Polygon or Shape > Compose/Decompose Shape from the menu in the design window.

Depending on the options selected, the Power/Ground Ring Wizard UI changes, representing how the rings will be created. Verify the Wizard settings to ensure that the rings are created as intended.

1. When the Power/Ground Ring Wizard appears, set the number of rings to 2, accept the other defaults, and click Next. You can set Create first ring as die flag to create a basic die flag.

         2. Define Ring 1 and the net associated with it.

              a) Browse and choose Vss in the Net Names dialog box.

            b) Click OK.

            c) Specify the label as VSS.

            d) Click Next.

             The first ring should appear in your design. It is associated with the proper net; in this case, VSS.

2. For the second ring, choose the net as Vdd and specify the label as VDD.
3. Click Next.
4. Click Finish in the Result Verification screen to complete the process.

The completed rings appear as shown below.

Now, when you click on Power and Ground Die Pin and add wirebonds, you will see that the wirebonds are placed directly on the Power and Ground rings.

When things go wrong with your package design flow, it can sometimes be difficult to understand the cause of the issue. This can be something like a die component is wrongly identified as a BGA, a via stack has an alignment issue, or there are duplicate bondwires. These are just a few examples of issues; there can be many more. When interactive messages and log files do not help determine the problem, the Package Design Integrity Check tool becomes very handy. This feature lets you run integrity checks, which ensures that the database is configured correctly. 

To invoke the command from Allegro X Advanced Package Designer, use the Tools > Package Design Integrity menu. 

Or type package integrity at the Command  prompt. 

The Package Design Integrity Checks dialog box includes all categories and checks currently registered for the currently running product. You can enable all these categories and checks or only the one that you want to run. This utility can fix errors automatically (where possible). Errors and warnings are written to the “package_design_check.log” file.  

The utility can also be extended with your own custom rules based on your specific flows and needs. 

1， Some components in the installation package cannot choose to install; even if they do not choose them, they will still be installed; just less shortcut icons, the documents are still released to the installation directory.

2， "Catia Application Frame" repeat the problem?
       “x:CadenceSPB_17.4 oolsin“
       ”x:CadenceSPB_17.4 oolsspatial“
       "Catia Application Frame" shouldn't you use the latest version?

3，Follow-up update patch cleaning the useless files and extra empty folder action !!!

The SPB17.4 installation package is currently the worst installation package I have seen for large-scale software packaging.

Attached is the latest revision of the venerable Specman-Matlab package (Lead Application Engineer Jangook Lee is the latest to have refreshed it for a customer in Asia to support 64 bit mode.  Look for a guest blog post from him on this package shortly.)

There is a README file inside the package that gives a detailed overview, shows how to run a demo and/or validate it’s installed correctly, and explains the general test flow.  The test file included in the package called "test_get_cmp_mdim.e" shows all the capabilities of the package, including:

* Using Specman to initialize and tear down the Matlab engine in batch mode

* Issuing Matlab commands from e-code, using the Specman command prompt to load .m files, initializing variables, and other operational tasks.

* Transfering data to and from the Matlab engine to Specman / an e language test bench

* Comparing data of previously retrieved Matlab arrays

* Accessing Matlab arrays from e-code without converting them to e list data structure

* Convert Matlab arrays into e-lists

Happy coding!

Team Specman

I am using OrCAD PCB Designer Standard version 17.4-2019. I want to force update the Package_Height_Max property on the place bound top shape. The footprint library that we've created has that property set in the dra file, but I'd like to override that from capture so I can be certain that the height is correct.

This is coming from a place where we have created a very large footprint library over that past ++ years. Everyone who creates a new footprint is supposed to make sure that we add Package_Height_Max to the footprint, but of course footprints get reused for various parts, not all of which will have the same package height. What I want to do is export a list of package heights from our part database and then import the package heights into Capture and override the package height in the footprint.

I have found a post here  Using Height Property from Orcad Capture which says its not possible, but it also says its from 15 years ago, so maybe things have changed?

More than a decade’s worth of stagnant health packages lead to the build-up of PhilHealth’s idle funds, according to the government corporation’s chief. 

Mercury Packing Party for Troops

A EUR130bn (USD148bn) fiscal stimulus package with numerous tax measures, intended to help revive the German economy following the COVID-19 pandemic, was approved by the Federal Cabinet on June 12, 2020.

Both houses of the German parliament have now approved the EUR130bn (USD146bn) COVID-19 economic stimulus plan, which includes numerous tax relief measures.

The EU will postpone the entry into force of its VAT e-commerce package and will defer certain filing deadlines under the Directive on Administrative Cooperation due to the coronavirus pandemic.

Highlights: Adopting WHO salt limits in packaged foods could prevent 3,00,000 deaths and 2.4 million cases of h

Bigg Boss 12 doesn't boast of a remarkable line-up but there are a few eye-catching inclusions that should keep the show in the news for the next few months, feels Sukanya Verma.

Additionally, about 1.7 million new cardiovascular disease cases and 7,00,000 new chronic kidney disease cases could be prevented compared to current practices, the study said

Farmers associated with as many as 16 farmer outfits from the States Punjab, Haryana, Himachal Pradesh, Rajasthan, Uttar Pradesh, and Uttarakhand would be participating

Farmers are afraid to go to the fields because of sporadic firing by armed miscreants from higher grounds 

Of the total package, ₹1097 crore will be drawn from the State Disaster Response Fund (SDRF), while the remaining amount will be drawn from the state budget

It was back in 1999 that RSS feeds originated as a way of getting an overview of new articles and blog posts. They are still around today and can still be useful if you want to tailor and streamline your reading content.

RSS feeds can be used to bundle news from any number of websites within a program, browser extension or app. The only requirement is that the pages must support the.rss or.xml file extensions.

The advantage of RSS feeds and readers is that not only are they often free of charge, they also reduce your data use, as only a section of the article is loaded, Neuhetzki says.

In addition, the user does not have to provide personal information such as an email address or register in order to use a feed.

It was back in 1999 that RSS feeds originated as a way of getting an overview of new articles and blog posts. They are still around today and can still be useful if you want to tailor and streamline your reading content.

RSS feeds can be used to bundle news from any number of websites within a program, browser extension or app. The only requirement is that the pages must support the.rss or.xml file extensions.

For example, if you just want to read headlines on the go, there are smartphone apps such as Feedly, Newsblur, Inoreader, and Feeder.

These applications have modernised the classic RSS service and offer, for example, the synchronisation of the RSS feed between smartphones, desktop computers and laptops.

The modern type of RSS feed reader also offers other advantages. Providers like Feedly also make suggestions about possible feeds based on keywords or interests, Neuhetzki says.

What are the issues that have thwarted the telecom company’s expansion and growth? 

Suggestions have been sought to increase the number of geriatric care packages under the health insurance scheme

The ANSR report anticipates over 25 new GCCs in the sector to emerge in the next 2-3 years, further solidifying India’s position as a global hub

Watch A Short Film Festival on September 5

During meeting with Sitharaman, Balagopal seeks withdrawal of retrospective cuts in State’s borrowing ceiling, nod for extra borrowing of ₹6,000 crore against cost for NH land acquisition

From 2024-25 to 2026-27, board proposes to spend ₹410.94 crore in Malappuram, ₹217.96 crore in Idukki and ₹394.15 crore in Kasaragod under Dyuthi 2.0. KSEB has proposed a capital outlay of ₹13,576.37 crore for the distribution sector for the period up to 2026-27

This is the highest pay package offered during the final placement of this session at the institute and is ₹65 lakh more than the previous time

In addition to IT firms, the service sector, marketing, finance, and banking industries have emerged as leading recruiters this year

The Urbanista Los Angeles over-ears just need some light to keep them going

ITI was the lowest bidder for the ₹1,537-crore Project 15 spread across Arunachal Pradesh, Nagaland and Manipur

An immediate substantive stimulus is required from the Government in the form of support to the poor and support to industry especially the MSMEs, the Confederation of Indian Industries (CII) has said. "With economic activities being restricted for over 50 days