An amplifying structure includes a main amplifier configured to amplify a first signal; and a peak amplifier configured to amplify a second signal, each of the main amplifier and the peak amplifier including, respectively, a hybrid power device, the hybrid power device including, a first power transistor die configured to amplify signals of a first frequency, and a second power transistor die configured to amplify signals of a second frequency different than the first frequency.

A light emitting device package is disclosed. The light emitting device package includes a package body, at least one light emitting diode disposed on the package body, a molding layer surrounding the light emitting diode, and a phosphor layer provided on the package body, wherein the phosphor layer extends upward from surface of the package body.

A light-emitting device package is provided including: a package substrate and a light-emitting device mounted on the package substrate. The package substrate includes first and second conductive regions each having a portion overlapping the light-emitting device. An electrode separator extends across the package substrate while penetrating the package substrate between the first and second conductive regions to electrically separate the first and second conductive regions from each other. A stress release portion surrounds at least a portion of each of the first and second conductive regions at an edge part of the package substrate. The stress release portion has different widths on both sides of the electrode separator interposed therebetween.

A silicon-based thermal energy transfer apparatus that aids dissipation of thermal energy from a heat-generating device, such as an edge-emitting laser diode, is provided. In one aspect, the apparatus comprises a silicon-based base portion having a first primary surface and a silicon-based support structure. The silicon-based support structure includes a mounting end and a distal end opposite the mounting end with the mounting end received by the base portion such that the support structure extends from the first primary surface of the base portion. The support structure includes a recess defined therein to receive the edge-emitting laser diode. The support structure further includes a slit connecting the distal end and the recess to expose at least a portion of a light-emitting edge of the edge-emitting laser diode when the edge-emitting laser diode is received in the support structure.

A binary exploding target package, a process of forming an exploding target from the contents of the binary exploding target package, and the exploding target formed therefrom. The binary exploding target package includes a first, target container and a second container. An oxidizer composition is contained within one of the containers and a catalyst composition is contained within the other container. An exploding target is formed by mixing the oxidizer and catalyst compositions, and introducing the mixture into the target container to form an exploding target just prior to using the exploding target as a target for a shooting exercise.

A charger package apparatus for use with electronic cigarette components, which include truncated components and elongated components that have an electrical coupling connected to a rechargeable power source. The apparatus includes a compact box enclosure with an access opening, and with plural compartments formed indies, which receive electronic cigarette components, and where are least one of the compartment is an elongated compartment. The box also includes a battery compartment with a battery contact for engaging a replaceable battery, and a charge circuit coupled to receive power from the battery contact. A charge contact assembly is coupled to the charge circuit and aligned with the elongated compartment to engage the electrical coupling of an elongated component, which can then transfer power to its rechargeable power source. Also, a lid is selectively engaged with the access opening to close the box.

A unit for transferring and up-ending at least one sealed package containing a pourable food product and having a first axis, comprising: at least one push member which cooperates with package to feed it along a first path from an in-feed station to an out-feed station; the path extending about a second axis; the unit further comprising a guide cooperating with a first side of package along first path to up-end it from an in-feed position, in which it is positioned with first axis oriented in a first direction, to an out-feed position, in which it is positioned with first axis oriented in a second direction crosswise to first direction; and an anti-rotating mechanism cooperating with package along path to prevent package from rotating about first axis; an anti-rotating mechanism comprising a pressure element rotatable about second axis and adapted to cooperate, in use, with package.

A debris passage for a cooling box of a work vehicle. Airflow is provided into the cooling box from the exterior environment. A plurality of heat exchangers transfer heat into the airflow. The debris passage is defined between opposing heat exchangers to permit debris to pass from the airflow to the exterior of the cooling box. In one embodiment, the debris passage is underneath an air mover and is substantially vertical.

A semiconductor device has a plurality of semiconductor die. A first prefabricated insulating film is disposed over the semiconductor die. A conductive layer is formed over the first prefabricated insulating film. An interconnect structure is formed over the semiconductor die and first prefabricated insulating film. The first prefabricated insulating film is laminated over the semiconductor die. The first prefabricated insulating film includes glass cloth, glass fiber, or glass fillers. The semiconductor die is embedded within the first prefabricated insulating film with the first prefabricated insulating film covering first and side surfaces of the semiconductor die. The interconnect structure is formed over a second surface of the semiconductor die opposite the first surface. A portion of the first prefabricated insulating film is removed after disposing the first prefabricated insulating film over the semiconductor die. A second prefabricated insulating film is disposed over the first prefabricated insulating film.

A method of making a semiconductor device can include providing a wafer comprising a plurality of semiconductor die, wherein each semiconductor die comprises an active surface and a backside opposite the active surface. A photosensitive layer can be formed over the wafer and on a backside of each of the plurality of semiconductor die within the wafer with a coating machine. An identifying mark can be formed within the photosensitive layer for each of the plurality of semiconductor die with a digital exposure machine and a developer, wherein a thickness of the identifying mark is less than or equal to 50 percent of a thickness of the photosensitive layer. The photosensitive layer can be cured. The wafer can be singulated into a plurality of semiconductor devices.

A semiconductor package is provided, including: an insulating base body having a first surface with an opening and a second surface opposite to the first surface; an insulating extending body extending outward from an edge of the first surface of the insulating base body, wherein the insulating extending body is less in thickness than the insulating base body; an electronic element having opposite active and inactive surfaces and disposed in the opening with its inactive surface facing the insulating base body; a dielectric layer formed in the opening of the insulating base body and on the first surface of the insulating base body, the insulating extending body and the active surface of the electronic element; and a circuit layer formed on the dielectric layer and electrically connected to the electronic element. The configuration of the insulating layer of the invention facilitates to enhance the overall structural rigidity of the package.

A manufacturing method of a package substrate is provided. The method includes forming a first circuit layer on a carrier. A passive component is disposed on the first circuit layer and the carrier. A dielectric layer is formed on the carrier to embed the passive component and the first circuit layer in the dielectric layer. A second circuit layer is formed on the dielectric layer. The carrier is removed from the dielectric layer. A manufacturing method of a chip package is also provided.

A method of forming image sensor packages may include performing a molding process. Mold material may be formed either on a transparent substrate in between image sensor dies, or on a removable panel in between transparent substrates attached to image sensor dies. Redistribution layers may be formed before or after the molding process. Mold material may be formed after forming redistribution layers so that the mold material covers the redistribution layers. In these cases, holes may be formed in the mold material to expose solder pads on the redistribution layers. Alternatively, redistribution layers may be formed after the molding process and the redistribution layers may extend over the mold material. Image sensor dies may be attached to a glass or notched glass substrate with dam structures. The methods of forming image sensor packages may result in hermetic image sensor packages that prevent exterior materials from reaching the image sensor.

Embodiments described herein generally relate to phased array antenna systems or packages and techniques of making and using the systems and packages. A phased array antenna package may include a distributed phased array antenna comprising (1) a plurality of antenna sub-arrays, which may each include a plurality of antennas, (2) a plurality of Radio Frequency Dies (RFDs), each of the RFDs located proximate and electrically coupled by a trace of a plurality of traces to a corresponding antenna sub-array of the plurality of antenna sub-arrays, and (3) wherein each trace of the plurality of traces configured to electrically couple an antenna of the plurality of antennas to the RFD located proximate the antenna, wherein each trace of the plurality of traces is configured to transmit millimeter wave (mm-wave) radio signals, and wherein the plurality of traces are each of a substantially uniform length.

A heater in a housing with an opening. The heater reacts with oxygen to produce heat and upon consumption of the oxygen, the heating reaction stops and can be restarted at a later point in time upon the introduction of additional oxygen and is used in a package for heating pre-moistened substrates such as sanitary wipes, and the like.

A package includes a conductive pad, with a plurality of openings penetrating through the conductive pad. A dielectric layer encircles the conductive pad. The dielectric layer has portions filling the plurality of openings. An Under-Bump Metallurgy (UBM) includes a via portion extending into the dielectric layer to contact the conductive pad. A solder region is overlying and contacting the UBM. An integrated passive device is bonded to the UBM through the solder region.

A variable refrigerant package air conditioner is shown that is easy to install in new construction with a unique base that causes collected mixture that overflows to drain outside the building. A control system is shown that has motors and compressor that are pulse width modulated so the air conditioner is infinitely variable while maintaining the highest possible power factor. Dehumidification of outside air occurs as it is mixed with inside air. By gradually approaching a temperature set point and even reheating after dehumidification, moisture is removed from the room.

Stimulus checks are rolling into bank accounts across the country, but many have experienced confusion about when, and if, their portion of the $2 trillion economic relief package is coming.

Victorian government has announced a $16.8 million survival package to provide immediate support to Victorian creative organisations and individuals to sustain employment, develop new works and provide opportunities for creative community participation.

Marco Scherer has announced availability of the Total Drums Bundle, a limited edition collection of all 11 Drum Depot series featuring 5 GB of drum sounds. The bundle features 175 drum kits from classic and modern drum machines like TR-808, Erica‘s Techno System, JoMoX AirBase-99, Arturia DrumBrute and others, but also obscure and very rare […]

The post Drum Depot Total Drums Bundle delivers 5 GB of drums in limited edition package appeared first on rekkerd.org.

FeelYourSound has announced the release of The Piano Sessions, a free songwriting package for producers of any genre. It contains over 26 free chord transformation presets for the ChordPotion songwriting plugin. The new presets transform the chords in your DAW into completely new piano melodies. With a few clicks, you can turn any chords into […]

The post FeelYourSound releases The Piano Sessions package with free MIDI melody generators appeared first on rekkerd.org.

With this partnership, MTR products such as masalas, spices, Ready-To-Eat meals and breakfast mixes will be accessible through MTR stores and kirana tabs on Swiggy.

Detectives do not believe the women involved are nurses, and posted photos of the suspects and a vehicle in hopes someone could identify them.

Joan Webb has already been approved for a government-subsidised home-care package. At 93 years of age, she's now facing an 18-month wait. She's not alone.

Police have charged an Albany man who allegedly attempted to import hundreds of thousands of dollars worth of methylamphetamine from Mexico.

Agricultural lobby group WA Farmers has urged the Federal Government not to forget struggling growers in parts of Western Australia, in talks over a drought assistance package.

Farmers in some of the driest parts of Western Australia are concerned they will miss out on funds from the Federal Government's drought assistance package because they will not meet the criteria.

The Australian Government will launch hundreds of flights to deliver fresh produce to key international markets as part of a big-spending boost for exports.

The Tasmanian Government unveils a $3 million package to support around 26,000 temporary visa holders stuck in the state because of the coronavirus pandemic.

Zoo owners in Victoria have welcomed the Federal Government's assistance package, but some fear they will not be eligible for the emergency funding.

Murray River water destined for Adelaide will be reallocated to farmers upstream so they can grow feed for their livestock, as part of a federal drought stimulus package announced today.

The Government's latest drought relief package includes more funding for councils and cheap loans for farmers and agribusiness, as well as a deal with the SA Government to secure 100 gigalitres of water.

An assistance package which includes the first two picks in the 2019 player draft will be handed to the struggling Gold Coast Suns to help the club "deliver upon their football strategy".

Hopes are raised in drought-stricken towns that the Federal Government is on the cusp of delivering a stimulus package, with local mayors urging a generous spend.

The ABC understands drought-stricken towns will be the target of federal stimulus potentially worth hundreds of millions of dollars under a program designed to support regional communities enduring hardship.

The Federal Government is unlikely to adopt the National Farmers' Federation call for exit packages for drought-ravaged farmers. But even if it did, history suggests they're unlikely to have much impact.

Rosa Daniel wants you to come to Rome to pick up a high priority package.

Laguna Beach Singer/guitarist Awarded Recording Time With Orange County Production House

He's looking out for "essential workers" outside healthcare.

Abbe Awosanya says she won’t be deleting the video.

Minority-owned businesses are being shut out.

Abbe Awosanya says she won’t be deleting the video.

IBM and SAP SE have teamed up to provide a co-innovated solution for the retail and consumer packaged goods industries to help both increase profitability and improve the consumer experience.

IBM Poland and WINUEL SA (subsidiary of Sygnity Group), today announced the first Polish Smart Metering software package to enable intelligent electricity use in more than 15 million households in Poland. The solution was developed jointly with the IBM Software Laboratory in Krakow.

So you now have a YourNetBiz Opportunity. You have invested your money and you have setup your website. Now what? Well the good news is you are in the right place my friend. This article will explain how you can focus your efforts and market the right way.

It has been awhile since I last posted I hope I have not kept you all waiting.... Well. To be honest this last week or so has been very busy and filled with a lot of ups and downs. The main thing to report is that my dad came to visit He came the

The Government is to provide a State guaranteed refund credit note for package holidays booked through Irish travel agents and tour operators in effort to help the industry during Covid-19 crisis.

The Fiat 500X offers a much sportier driving experience than the Fiat 500 thanks to an all-new 1.3-liter turbocharged engine.