Green Shipping lets businesses and individuals measure and offset the CO2 emissions of packages when using UPS, FedEx or the U.S. Postal Service.

The shipping industry embraces fuel efficiency with hybrid delivery fleets.

Learn what is green in the stimulus package.

A burst of glitter and stinky spray surprise thieves who steal packages from porches.

At Imperial Landscaping, we understand that the outdoor appearance of your business or home is as important as your interior. We have a team of lawn care specialists that will consult with you to determine your exact needs.

Soft Play rental company, Mobile Soft Play, is now offering discounted packages for your next fun party or playdate.

The update from Shorr's 2017 Package Theft Report shows a 7% decrease in respondents who experienced package theft.

Mr Killian McNabb of TyreGo.ie announces their most recent deal they have on offer in regard to their tyre changer and wheel balancer package.

Mexico is fast becoming one of the world's top vacation destinations

Washington, DC Website Support and Digital Agency Offering Reduced-rate Support Packages to Nonprofits in Need of Assistance for Website Maintenance or Digital Marketing Support.

President Trump recently signed a new coronavirus relief bill into law that will help replenish the depleted Paycheck Protection Program (PPP), among other initiatives. Below are the details of the relief package.
Details of the New Bill
The new relief… Read More

The post New $484 Billion Stimulus Package Replenishes PPP and Offers Relief for Hospitals and Businesses appeared first on Anders CPAs.

Lockdown distress: Karnataka govt announces Rs 1,610 cr package

Cabinet okeys Rs 5,500 crore package for sugar industry

Yet another relief package for sugar companies before elections

The chamber said that in keeping up with most economies of the world to institute stimulus measures with 10 percent of the Gross Domestic Product (GDP), the Indian economy would need a transfusion of over $200 billion with an ability to go up to $300 billion, over the next 12-18 months.

The meeting also decided to explore possibilities of setting up an industrial complex in Maharashtra to rehabilitate returnees, Pallykandi said.

YAMANAIR CREATIVE, has launched an “Emergency Creative Relief Package” (ECRP) for the industry. The package allows radio sellers to custom order, via a simple web portal, any type … more

Temperatures in microelectronic integrated circuit packages and components may be measured in situ using carbon nanotube networks. An array of carbon nanotubes strung between upstanding structures may be used to measure local temperature. Because of the carbon nanotubes, a highly accurate temperature measurement may be achieved. In some cases, the carbon nanotubes and the upstanding structures may be secured to a substrate that is subsequently attached to a microelectronic package.

Set of compositions for preparing system-in-package type semiconductor device. The composition set consists of underfill composition for preparing underfill part and encapsulation resin composition for preparing resin encapsulation part. 1) A cured product of the underfill composition has a glass transition temperature, Tg, ≧100° C. and is the same with or differs from a Tg of a cured product of the encapsulation resin composition by ≦20° C. 2) Total linear expansion coefficient of the cured product of the underfill composition at a temperature not higher than (Tg−30)° C. and a linear expansion coefficient of the cured product of the encapsulation resin composition at a temperature not higher than (Tg−30)° C. is ≦42 ppm/° C. 3) A ratio of the linear expansion coefficient of the cured product of the encapsulation resin composition to the linear expansion coefficient of the cured product of the underfill composition ranges from 0.3 to 1.0.

An apparatus for fabricating a semiconductor package may include a mold and a molding plate. The mold may define a mold cavity with the mold being configured to receive a circuit board in the mold cavity, and the circuit board may include a semiconductor chip mounted thereon. A molding plate may be moveable in the mold cavity with the molding plate being configured to adjust a volume of the mold cavity. Related methods are also discussed.

A business form is provided which is particularly useful in shipping products where certain preprinted information can be provided and then individualized information is printed before the form is applied to a substrate. The form includes a face ply which has a pattern of adhesive applied to at least a portion of the inner face, and a release liner which includes a pattern of adhesive which exposes a portion of the release liner to direct adhesive contact to the face ply without intervening release coating to permanently adhere a part of the release liner to the face ply. The release liner has a surrounding protective border provided with release coating on the release face thereof and which is removed prior to application to the substrate, and a slip which remains with the form as applied to the substrate. The face ply includes lines of perforation defining a central portion. At least a part of the central portion is directly adhered by the adhesive to the slip without intervening release coating between the adhesive and the slip or the central portion. Individualized indicia, such as an address, may be printed on a label area of the top face of the central portion, while other individualized indicia, such as the content of a package, may be printed on the back face of the slip. Masking indicia is preferably provided on one of the inner face of the top ply or the release face of the release liner to inhibit viewing of the content indicia until the slip is removed from the package.

An update platform is described that collectively handles driver and firmware updates for hardware resources of a computing device based on dependencies associated with the updates. The update platform may instantiate representations of each individual hardware resource as abstractions through which detection, analysis, acquisition, deployment, installation, and tracking of updates is managed. Using the representations, the update platform discovers available updates, matches configuration packages for the updates to appropriate resources, and initiates installation of the configuration packages. The update platform is further configured to recognize dependencies associated with the configuration packages. When dependencies are detected, corresponding configuration packages are marked to reflect the dependencies and activation is suspended until the dependencies are satisfied. Upon satisfaction of the dependencies, the dependencies are cleared and the configuration packages are activated. Configuration packages that are not associated with dependencies may be installed and activated “normally” at any time.

A package for two liquid personal care compositions, including an applicator, a first reservoir, and a second reservoir. The applicator is non-removably connected at and extends away from the first cavity. The first and second reservoirs each hold a quantity of a liquid composition therein. The first reservoir includes an open end sized for independent insertion and removal of the applicator therethrough. The first reservoir is removable and protectively encases the applicator. The second reservoir includes a closed end an opposing open end, through which a liquid composition can be dispensed.

A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.

An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.

A method of preparing soybean mixed powder comprising a soybean powder having properties wherein formation of agglomerate is small when the powder is added to water and then heated with stirring to dissolve the powder.

The stack package includes a first semiconductor package and a second semiconductor package. The first semiconductor package includes a first substrate having a first modulus and at least one semiconductor chip mounted on the first substrate. The second semiconductor package stacked on the first semiconductor package and includes a second substrate having a second modulus and at least one semiconductor chip mounted on the second substrate. The second modulus is less than the first modulus. Even in the event that the first semiconductor package is under severe warpage due to a temperature change, the flexible second substrate, which includes e.g., polyimide or poly ethylene terephthalate, of the second semiconductor package may be less sensitive to the temperature change, thereby improving reliability of the stack package.

A land grid array (LGA) package including a substrate having a plurality of lands formed on a first surface of the substrate, a semiconductor chip mounted on a second surface of the substrate, a connection portion connecting the semiconductor chip and the substrate, and a support layer formed on part of a surface of a first land.

An apparatus including a die including a dielectric material on a device side, an insulating layer surrounding a die area and embedding a thickness dimension of the die; and a carrier including a plurality of layers of conductive material disposed on the device side of the die, a first one of the layers of conductive materials being formed on the insulating layer and patterned into traces at least a portion of which are connected to respective contact points on the die. A method including disposing a die on a sacrificial substrate with a device side of the die opposite the sacrificial substrate; disposing a mold on the sacrificial substrate around; introducing an insulating material into a chase of the mold; removing the mold; forming a carrier on the insulating material adjacent a device side of a die; and separating the die and the carrier from the sacrificial substrate.

Disclosed herein is a single mask package apparatus on a device comprising a first substrate having a land disposed on a first surface, a stud disposed on the land and a protective layer disposed over the first surface of the first substrate and around the stud. The protective layer may optionally have a thickness of at least 3 μm. A PPI may be disposed over the protective layer and in electrical contact with the stud, with a first portion of the PPI extending laterally from the stud. An interconnect may be disposed on and in electrical contact with the first portion of the PPI, and a second substrate mounted on the interconnect. A molding compound may be disposed over the PPI and around the interconnect. The stud may be a substantially solid material having a cylindrical cross section and may optionally be wirebonded to the land.

A multi-chip package is provided. The multi-chip package includes a plurality of chips including at least one bad chip and at least one good chip that are stacked and a plurality of through electrodes each penetrating the chips. A logic circuit included in the at least one bad chip is isolated from each of the plurality of through electrodes.

Systems, manufactures, methods and/or techniques for a merged fiducial for chip packages are described. According to some embodiments, an integrated circuit package may include a package substrate having a first side and a second side, a plurality of conductive traces coupled to the first side and a plurality of balls disposed on the second side. The balls may be adapted to electrically connect the laminate package to a circuit board. The integrated circuit package may include a plurality of ball pads disposed on the second side, the ball pads being adapted to electrically connect the plurality of balls to the plurality of conductive traces. One or more of the ball pads may be uniquely shaped when compared to the rest of the plurality of ball pads, optionally, to serve as a fiducial to designate an A1 pin or ball of the laminate package.

A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby.

Embodiments of a method for fabricating stacked microelectronic packages are provided, as are embodiments of a stacked microelectronic package. In one embodiment, the method includes arranging microelectronic device panels in a panel stack. Each microelectronic device panel includes a plurality of microelectronic devices and a plurality of package edge conductors extending therefrom. Trenches are formed in the panel stack exposing the plurality of package edge conductors. An electrically-conductive material is deposited into the trenches and contacts the plurality of package edge conductors exposed therethrough. The panel stack is then separated into partially-completed stacked microelectronic packages. For at least one of the partially-completed stacked microelectronic packages, selected portions of the electrically-conductive material are removed to define a plurality of patterned sidewall conductors interconnecting the microelectronic devices included within the stacked microelectronic package.

There are provided a single package television tuning apparatus and a television receiver including the apparatus. The apparatus includes: a printed circuit board; a switching part installed on the printed circuit board and selecting one of a first radio frequency signal and a second radio frequency signal inputted; a tuner part installed on the printed circuit board and down-converting one of the first radio frequency signal and the second radio frequency signal, the one selected by the switching part; first and second input connectors receiving the first radio frequency signal and the second radio frequency signal; and a chassis supporting the first and second input connectors, covering the printed circuit board, the switching part, and the tuner part, and electrically connected to grounds of the switching part and the tuner part.

Aspects of a method and system for configuring a transformer embedded in a multi-layer integrated circuit package are provided. In this regard, a windings ratio of a transformer embedded in a multi-layer IC package bonded to an IC may be configured, via logic, circuitry, and/or code in the IC, based on signal levels at one or more terminals of the transformer. The transformer may comprise a plurality of inductive loops fabricated in transmission line media. The integrated circuit may be flip-chip bonded to the multi-layer package. The IC may comprise a signal strength indicator enabled to measure signal levels input to or output by the transformer. The windings ratio may be configured via one or more switches in the IC and/or in the multi-layer package. The IC and/or the multi-layer package may comprise ferromagnetic material which may improve magnetic coupling of the transformer.

A power package is provided comprising a packaged transistor and a driving unit connected to the transistor and adapted to drive the transistor. A control terminal of the transistor is connected to a middle terminal pin of the housing of the transistor and outer terminal pins of the housing are connected to the driving unit and to a voltage level, respectively, wherein the connections are crossing free.

An easy-open and reclosable package includes a pouch including a discrete laminate including a base strip, a panel section, and a die cut defining a die cut segment; a first and second anchor seal; the base strip including a sealing segment, backing segment, and intermediate layer including a pressure sensitive adhesive; and a product disposed in the pouch. The die cut segment is so arranged that when the package is opened, the sealing segment is partially removed from the base strip, the pressure sensitive adhesive is partially exposed, and the package can thereafter be reclosed by adhering any of the first side panel, second side panel, and panel section to the pressure sensitive adhesive. Methods of making the package, and a pouch, are also disclosed.

In the case of a package (1) for single-dose films (2) containing active substances, comprising an upper packaging material element (3) and a lower packaging material element (4) which are connected together by a peripheral seal area or respectively sealing seam (5) such that a cavity (6) for holding the film (2) is formed, said cavity being enclosed on all sides, wherein the upper packaging material element (3) and the lower packaging material element (4) each have at least one cut (7, 8) in the region of the seal area or respectively, the sealing seam (5), said cuts being congruent, andat least one cut (7, 8) is crossed by a folding or bending line (10), the folding or bending line (10) is formed in a weakened manner.

The present invention regards a package (1) for food products comprising a flexible container (2) having a first wall (5) and a second wall (6) opposite each other and peripherally sealed along at least the respective side edges (5a, 6a, 5b, 6b), a space (8) inside said walls containing, optionally in sterile conditions, a food product (73), and a gusset element (10) extended between the upper edges (5c, 6c) of said first wall (5) and of said second wall (6), said gusset element (10) defining a pocket (14) turned towards the interior of said flexible container (2), characterized in that it comprises an opening and closing device (3) housed in said pocket (14) and constrained to said flexible container (2), said opening and closing device (3) comprising a pourer body (15) associated with an opening and closing cap (16), and cutting means (42) suitable to perforate said flexible container (2) at the time of the first opening of said packaging (1). The invention also regards a method for packaging a food product, in particular in sterile conditions, in a package of the aforesaid type, a flexible container for a package of the aforesaid type as well as a method for producing such container.

A light emitting device package is provided comprising a light emitting device including at least one light emitting diode and a body including a first lead frame on which the light emitting device is mounted and a second lead frame spaced apart from the first lead frame, wherein at least one of the first and second lead frames is extending to a bending region in a first direction by a predetermined length on the basis of an outer surface of the body and is bent in a second direction intersecting the first direction.

A package includes a first die and a second die underlying the first die and in a same first die stack as the first die. The second die includes a first portion overlapped by the first die, and a second portion not overlapped by the first die. A first Thermal Interface Material (TIM) is over and contacting a top surface of the first die. A heat dissipating lid has a first bottom surface contacting the first TIM. A second TIM is over and contacting the second portion of the second die. A heat dissipating ring is over and contacting the second TIM.

Various embodiments related to a compact device package are disclosed herein. In some arrangements, a flexible substrate can be coupled to a carrier having walls angled relative to one another. The substrate can be shaped to include two bends. First and second integrated device dies can be mounted on opposite sides of the substrate between the two bends in various arrangements.

A microelectronic assembly includes a first component with first conductive elements; a second component with second conductive elements; a bond metal; and an underfill layer. The posts have a height above the respective surface from which the posts project. A bond metal can be disposed between respective pairs of conductive elements, each pair including at least one of the posts and at least one of the first or second conductive elements confronting the at least one post. The bond metal can contact edges of the posts along at least one half the height of the posts. An underfill layer contacts and bonds the first and second surfaces of the first and second components. A residue of the underfill layer may be present at at least one interfacial surfaces between at least some of the posts and the bond metal or may be present within the bond metal.

The invention relates to a thermal conduction element (20) for a package for transporting and/or storing radioactive materials, comprising: an internal part (30) intended to be in contact with a lateral body (14) of the package;an external part (34) intended to form a portion of an external envelope (24) of said package, holding radiological protection means (22);an intermediate part (32) arranged between the internal and external parts,the internal, external and intermediate parts being produced from copper and one of the alloys thereof. According to the invention, the external part (34) is equipped, at each of its two opposite ends, with an area (36) for connection by welding to another thermal conduction element (20), each connection area (36) being produced from steel.

A catheter assembly including an elongate member having a proximal end and a distal end. The distal end has at least one drainage opening. A hydrophilic coating is provided on at least a portion of the elongate end of the catheter. A fluid containing member is provided and is either arranged on the elongate member or within a separate area of the container. The fluid containing member contains sufficient hydrating fluid to hydrate the coating of the catheter. A container contains the elongate member and the fluid containing member and incorporates at least one foil layer to prevent evaporation of the hydrating fluid. A method of using the catheter includes inserting a catheter into a user's body and draining fluid from the user's body.

Tamper-evident package comprises a container, a primary cap, and a secondary cap. The container comprises a sidewall defining a chamber and a rim defining a mouth to the chamber. The primary cap is removably-attachable to the rim of the container to selectively close the mouth of the container. The secondary cap is positioned over the primary cap to prevent removal of the primary cap when positioned thereover. The secondary cap includes a single-use lock, such as a cable tie, to secure the secondary cap in position over the primary cap. The package thus provides evidence that someone has tampered with or attempted to tamper with the container if the single-use lock is removed or damaged. Method of using the tamper-evident package is also disclosed.

A package for a medical device having an elongated shaft and a proximal luer fitting includes a one-piece body formed as a single structure via blow molding. The blow-molded one-piece body includes at least a spiral casing formed therein, the spiral casing defining a spiral lumen configured to receive the elongated shaft of the medical device. Webbing is disposed between adjacent curved portions of the spiral casing. The one-piece body formed via blow-molding may also include a removable reversible loading tube, a luer retainer, a cannula holder, one or more slots for attaching an information card thereto, a fastener for clipping the medical device thereto, and a compartment for holding an oxygen scavenger. Further, the one-piece body formed via blow-molding may include non-circular lumens and may be configured to receive multiple medical devices.