The PCI-SIG finalized the PCIe 4.0 specification with doubling the data to 16GT/s from 8GT/s in PCIe 3.0 in 2017. Products implementing this technology have begun to hit the market in 2019. Earlier this year, AMD announced it X570 chipset would support the PCIe 4.0 interface and Phison also introduced the world’s first PCIe 4.0 SSD.  With the increasing companies are working on PCIe 4.0 related product development, Cadence, as the key and leading PCIe IP solution vendor in the market, has strived for continuous enhancement of its PCIe 4.0 to be the best in the class IP solution. From our initial PCIe 4.0 solution in 4 years ago (revealed in 2015), we have made many advancements and improvements adding features such as Multi-link with any lane assignment, U.2/U.3 connector, and Automotive support. The variety of applications that PCIe4 finds a home in require extensive robustness and reliability testing over and above the compliance tests mandated by the standard body, i.e., PCI-SIG.

PCIe 4.0 TX Eye-Diagram, Loop-back Test (Long-reach) and RX JTOL Margin Test

Cadence IP team has also implemented additional "stress tests" in conjunction to its already comprehensive IP characterization plan, covering electrical, functional, ESD, Latch-up, HTOL, and yield sorting. Take the Receiver Jitter Tolerance Test (JTOL) for instance. JTOL is a key index to test the quality of the receiver of a system. This test use data generator/analyzer to send data to a SerDes receiver which is then looped back through the transmitter back to the instrument. The data received is compared to the data generated and the errors are counted. The data generator introduce jitter into the transmit data pattern to see how well the receiver functions under non-ideal conditions. While PCI-SIG compliance can be obtained on a single lane implementation, real world scenarios require wider implementations under atypical operating conditions. Cadence’s PCIe 4.0 IP was tested against to additional stressed conditions, such as different combination of multi-lanes operations, “temperature drift” conditions, e.g., bring up the chip at room temperature and check the JTOL at high temperature. 

PCIe 4.0 Sub-system Stress Test Setup

Besides complying with electrical parameters and protocol requirements, real world systems have idiosyncrasies of their own. Cadence IP team also built a versatile “System test” setup in house to perform a system level stress test of its PCIe 4.0 sub-system. The Cadence PCIe 4.0 sub-system is connected to a large number of server and desktop motherboards. This set up is tested with 1000s of cycles of repeated stress under varying operating conditions. Stress tests include speed change from 2.5G all the way to 16G and down, link enable/disable, cold boot, warm boot, entering and exiting low power states, and BER test sweeping presets across different channels. Performing this level of stress test verifies that our IP will operate to spec robustly and reliably when presented with the occasional corner cases in the real world.

More Information

For the demonstration of Cadence PCIe4 PHY Receiver Test and Sub-system Stress Test, see the video:

• PCIe 4.0 Sub-system Stress Test
• PCIe 4.0 PHY Receiver JTOL Test

For more information on Cadence's PCIe IP offerings, see our PCI Express page.

For more information on PCIe in general, and on the various PCI standards, see the PCI-SIG website.

Related Posts

• Blog: PCIe Gen4: It’s Official, We’re Compliant
• Blog: PCIe 3.0 Still Shines While PCIe Keeps Evolving
• Blog: The PCIe 4.0 Era Continues at PCI-SIG Developers Conference 2016

PCI-SIG DevCon 2019 APAC tour has come to Tokyo and Taipei this year. The focus is predominantly around the latest updates for PCIe Gen 5 which its version 1.0 specification was just released this year in May.  A series of presentations provided by PCI-SIG on the day 1 with comprehensive information covering all aspects of Gen 5 specification, including protocol, logical, electrical, compliance updates. On the day 2 (only in Taipei), several member companies shared their view on Testing, PCB analysis and Signal integrity. The exhibit is also another spotlight of this event where the member companies showcased their latest PCIe solutions.

Presentation Track (Taipei), Exhibit (Tokyo), Exhibit (Taipei) 

Cadence, as the market leading PCIe IP vendor, participated APAC tour this year with bringing in its latest PCIe IP solution offering (Gen 5/4) to the region as well as showcasing two live demo setups in the exhibit floor. One setup is the PCIe software development kit (SDK) while the other is the Interop/compliance/debug platform. Both come with the Cadence PCIe Gen 4 hardware setup and its corresponding software kit.

The SDK can be used for Device Driver Development, Firmware Development, and for pre-silicon emulation as well. It supports Xtensa and ARM processor with Linux OS and it also equip with Ethernet interface which can be used for remote debugging. It also supports PCIe stress tests for Speed change, link enable/disable, entry/exist for lower power states, …etc. 

Cadence PCIe 4.0 Software Development Kit

The “System Interop/Compliance/Debug platform” was set up to test with multiple endpoint and System platforms. This system come with integrated Cadence software for basic system debug without the need for analyzer to perform the analysis, such as LTSSM History, TS1/TS2 transmitted/received with time stamp, Link training phases, Capturing Packet errors details, Capturing PHY TX/RX internal state machine details, ...etc.

Cadence PCIe System Interop/Compliance/Debug Platform

The year 2019 is certainly a "fruitful year" for the PCIe as more Gen 4 products are now available in the market, Gen 5 v1.0 specification got officially ratified, and PCI-SIG's revealing of Gen 6 specification development. We were glad to be part of this APAC tour with the chance to further introduce Cadence’s complete and comprehensive PCIe IP solution.

See you all next year in APAC again!

More Information

For more information on Cadence's PCIe IP offerings, see our PCI Express page.

For more information on PCIe in general, and on the various PCI standards, see the PCI-SIG website.

Related Posts

• Blog: Did You “Stress Test” Yet? Essential Step to Ensure a Quality PCIe 4.0 Product
• Blog: PCIe Gen4: It’s Official, We’re Compliant
• Blog: PCIe 3.0 Still Shines While PCIe Keeps Evolving
• Blog: The PCIe 4.0 Era Continues at PCI-SIG Developers Conference 2016

USB4 can simultaneously tunnel USB3, PCIe and DisplayPort native protocol traffic through a hierarchy of USB4 routers. The key to tunneling of these protocols is routing table programmed at each ingress adapter. An entry of a routing table maps an incoming HopID, called Input/Ingress HopID to a corresponding pair of Output/Egress Adapter and Egress/Output HopID.

The responsibility of programming routing tables lies with the Connection Manager. Connection Manager, having the complete view of the hierarchy of the routers, programs the routing tables at all relevant adapter ports. Accordingly, the USB3, PCIe and DisplayPort protocol tunneled packets are routed, and reach their respective intended destinations.

The diagrammatic representation below is an example of tunneling of USB3 protocol traffic from USB4 Host Router to USB4 Peripheral Device Router through a USB4 Hub Router. The path from USB3 Host to USB3 Device is depicted by routing tables indicated at A -> B -> C -> D, and the one from USB3 Device to USB3 Host by routing tables indicated at E -> F -> G -> H . Note that the Input HopID from and Output HopID to all three protocol adapters for USB3, PCIe and DisplayPort Aux traffic, are fixed as 8, and for DisplayPort Main Link traffic are fixed as 9.

Once the native protocol traffic come into the transport layer of a USB4 router, the transport layer of it does not know to which native protocol a tunneled packet belongs to. The only way a transport layer tunneled packet is routed through the hierarchy of the routers is using the HopID values and the information programmed in the routing tables.

The figure below shows an example of tunneling of all the three USB3, PCIe and DisplayPort protocol traffic together. The transport layer tunneled packets of each of these native protocols are transported simultaneously through the routers hierarchy.

 Cadence has a mature Verification IP solution for the verification of USB3, PCIe and DisplayPort tunneling. This solution also employs the industry proven VIPs of each of these native protocols for native USB3, PCIe and DisplayPort traffic.

Are they basically the same thing? I am trying to get as much experience with Allegro since a lot of jobs I am looking at right now are asking for Cadence Allegro experience (I wish they asked for Altium experience...). I currently have access to PCB Editor, but I don't want to commit to learning Editor if Allegro is completely different. Also walmart one, are the Cadence Allegro courses worth it? I won't be paying for it and if it's worth it, I figure I might as well use the opportunity to say I know how to use two complex CAD tools.

hi all, 

          what wrong with the error "param_write.log does not exist" when i export parameters in allegro 16.6 pcb board.

          someone can provide suggestions, thanks.

best regards.

Hi,

I am trying to use "sed -e 's " from SKILL code to edit unix file "FileA", to replace 3 words in the 2nd line.

How to run below multiple commands using  ipcBeginProcess, Should I use ipcWait or ipcCloseProcess ?

Using && to combine , will that work as I have to work serially on each command. ?

With below code only the first command gets executed. Please advise.

FileA="/user/tmp/text1.txt"

sprintf(Command1 "sed -e '2s/%s/%s/g' %s > %s" comment1 get(form concat("dComment" RDWn))->value FileA FileA)
cid = ipcBeginProcess(Command1)


sprintf(Command2 "sed -e '2s/%s/%s/g' %s > %s"  Time getCurrentTime() FileA FileA)
cid1 = ipcBeginProcess(Command2)


sprintf(Command3 "sed -e '2s/%s/%s/g' %s > %s"  comment2 get(form concat("Duser" RDWn))->value FileA FileA)
cid2 = ipcBeginProcess(Command3)

Thanks,

Ajay

Learn about the challenges and solutions for integrating and verification PCIe(r) Gen4 into an Arm-Based Server SoC. Listen to this relatively short webinar by Arm and Cadence, as they describe the collaboration and results, including methodology and...(read more)

Iam new to Package design SIP tool.

I had created the DIE package using SIP. Kindly give the direction how to map the created DIE package in Allegro pcb editor 17.2 ver.

In Allegro design capture CIS tool we had created the schematics file. The DIE which we are using is having 100pins, We had created the DIE in SIP tool. Out of 100 Die pins, only 90 pins is getting connected others are NC pins. We had mapped the Bond fingers only for 90 Die pins in the SIP package. But in the Schematics we had created the DIE logic symbol for 100 pins. Please advice whether we can able to import the DIE package in the allegro tool. In this scenario while importing the 100 pin DIE package in allegro pcb editor will the net connectivity will be shown from the DIE pad to Bond fingers and from Bond fingers to respective components? Please suggest whether we are going in the right path or please advice what we have to proceed with.

Thanks in Advance,

Rajesh

Longfellow's metaphorical footprints on the sands of time is more profound and eternal no doubt but a footprint for silicon (a form of sand isn't it?) is as important for PCB designers. So, here we will list the steps to create a fo...(read more)

What is a Power Distribution Network (PDN) after all but resistance, inductance, and capacitance in the PCB and components? And, of course, it is there to deliver the right current and voltage to each component on your PCB. But is that all? Are there oth...(read more)

Other tools allow a sanity check of placement density vs available board space.  There is an older post "Skill code to evaluate all components area (Accumulative Place bound area)"  (9 years ago) that has a couple of examples that no longer work or expired.

This would be useful to provide feedback to schismatic and project managers regarding the component density on the PCB and how it will affect the routing abilities.  Thermal considerations can be evaluated as well 

Has anyone attempted this or still being done externally in spread sheets?

Hi,

I wanted to find the location of a pin in the design using skill program. pin_dbids = axlDBGetDesign()->pins, this gives me all the dbids of the pins that are present in my design. But when im entering that dbid, pad = axlDBGetPad("000001EA8FD8B9F8" "package geometry/assembly_top" "regular") it is throwing an error stating "This dbid is not user defined. Please enter the user defined". So please provide me a snippet so that I can get the exact pin location in the design using skill script.

Hi everyone! I'm working on a small battery powered PCB which will fit inside a small plastic "hockey puck" container. A number of these "pucks" will be sold together with a "charging doc" which will store and charge the pucks when not in use.

I'm trying to work out the best way to charge the battery. I'm thinking of having metal "pads" on the rr.com puck that pass through the puck's plastic shell and then make contact with the PCB on the inside, and having a similar system on the charging dock. I'm thinking of having SMD "contact sprints" mounted to the underside of the PCB and have these mate against metal pins that protrude through the puck, but it's the later of which I'm struggling to find. For a visual, think about "restaurant pagers" and how they charge.

Hello All,

I'm currently using OrCAD PCB Designer Professional w/ PSpice (version 16.6-2015).  In the 'Design Object Find Filter' side bar, all options are grayed out and unselectable.  I did attempt to 'Reset UI to Cadence Default' without any luck.  A colleague has no issues with the identical file on his computer.  Any guidance would be much appreciated.  Thanks!

George

Hi everybody,

I've created a symbol with custom pad shapes. Everything looks correct in the symbol editor.

And the 3d view looks correct (upside down to show placement)

But when I try to place it on the pcb the 2 "T" shaped pads aren't in the correct location.

I have the pad shape centered on the pad...

with no offset on the padstack editor.

Does anybody know how to fix this?

Thank you!

Proftpd (<= pre6) linux ppc remote exploit.

read(0,stack,1028); stack(); shellcode for Linux PPC. readnexecppc-core.s appended.

Exploit for fetchmail on Mac OSX versions 10.4.7 and below on the PPC architecture.

Month Of Apple Bugs - A vulnerability in the handling of the udp:// URL handler for the VLC Media Player allows remote arbitrary code execution. This is just a vanilla format string exploit for OSX on ppc.

ppc engine suffers from a remote file inclusion flaw.

Inout PPC Engine suffers from a cross site request forgery vulnerability.

The HtmlHelp application (hh.exe) in Microsoft windows read a value from a .CHM file to set a length parameter. By setting this to a large value, it is possible to overwrite sections of the heap with attacker supplied values. Affected software includes: Microsoft Windows 98, 98SE, ME, Microsoft Windows NT 4.0, Microsoft Windows 2000 Service Pack 4, Microsoft Windows XP, Microsoft Windows XP Service Pack 1, Microsoft Windows Server 2003.

Libpcap is a portable packet capture library which is used in many packet sniffers, including tcpdump.

launchd on macOS and iOS suffer from a memory corruption issue due to a lack of bounds checking when parsing XPC messages.

MPC Sharj version 3.11.1 suffers from an arbitrary file download vulnerability.

223 bytes small dynamic, null-free popcalc shellcode.

CA BrightStor Discovery Service SERVICEPC Overflow for Win32, win2000, winxp, and win2003 which exploits a vulnerability in the TCP listener on port 45123. Affects all known versions of the BrightStor product. More information available here.

rpc.pcnfsd suffers from a syslog related format string vulnerability. IBM AIX versions 6.1.0 and below, IRIX 6.5 and HP-UX versions 11.11, 11.23 and 11.31 are all affected.

PalmCrack, the password testing tool for the Palm Computing Platform. Designed to help security professionals determine the strength of passwords, PalmCrack is able to check UNIX and NT passwords against a dictionary and decrypt certain Cisco router passwords. PalmCrack runs on PalmOS 2 and PalmOS 3 devices, including the PalmPilot Professional through the PalmVII and the IBM WorkPad series.

The list of the world’s top solar EPC contractors was released in late February by Wiki-Solar.org. The list ranks the solar developers by number of projects and total installed capacity and reflects about the 30 percent of the market. Wiki-Solar.org says the list shows how the less volatile markets have favored domestic power plant builders. In particular, contractors from India and the US are rising up the ranking. Europeans have, with a few notable exceptions, found it harder to hold their position.

According to Martin Lim, COO of Electrify.Asia, a company facilitating peer-to-peer energy trading across the distribution grid, blockchain technology doesn’t take utilities out of the equation, but rather it adds another layer of potential revenue for them and helps reduce the cost of delivering energy to homes and businesses.

The Sustainable Energy Authority of Ireland (SEAI) is funding the Ireland division of U.S.-based Ocean Renewable Power Co. (ORPC) to identify feasible tidal energy sites in the coastal waters of County Donegal. 

Brazilian power regulator Agencia Nacional de Eneria Eletricqa (Aneel) has set wholesale cap prices for an upcoming power auction that includes more than 130 small hydroelectric plants.

Nyadi Hydropower Ltd. and Zhejiang Hydropower Construction & Installation Company Ltd. of China signed an engineering, procurement and construction (EPC) contract on Jan. 16 for the 30-MW Nyadi hydropower project, according to local published reports.  

副标题]行业领导厂商积极回应无卤素问题

Greg Papandrew 谈销售的最佳实践

高密度的集成电路 (IC) 迫使 PCB 设计人员不得不探索全新的设计策略，期望使消费品中的微型电路板或高性产品中的大型电路板具备更多功能。

IPC 技术研讨会主管 Greg Munie 分享 IPC 中西部研讨会暨展览会的要点。

印刷板设计中确定载流能力的标准

有限的预算和全球化趋势使 PCB 项目变得错综复杂。

IBM 集成技术部的资深技术主管 Scott Strand 博士简要介绍了 IPC-9592 标准。

设计者和生产商及时沟通可避免成本高昂的问题。

适用于刚性和多层印刷电路板的嵌入式电阻器材料的规格

IPC 7-32c 委员会的联合主席 Cliff Maddox 概述了 IPC-9252 无载印刷电路板电测试要求。