Attached is the latest revision of the venerable Specman-Matlab package (Lead Application Engineer Jangook Lee is the latest to have refreshed it for a customer in Asia to support 64 bit mode.  Look for a guest blog post from him on this package shortly.)

There is a README file inside the package that gives a detailed overview, shows how to run a demo and/or validate it’s installed correctly, and explains the general test flow.  The test file included in the package called "test_get_cmp_mdim.e" shows all the capabilities of the package, including:

* Using Specman to initialize and tear down the Matlab engine in batch mode

* Issuing Matlab commands from e-code, using the Specman command prompt to load .m files, initializing variables, and other operational tasks.

* Transfering data to and from the Matlab engine to Specman / an e language test bench

* Comparing data of previously retrieved Matlab arrays

* Accessing Matlab arrays from e-code without converting them to e list data structure

* Convert Matlab arrays into e-lists

Happy coding!

Team Specman

Try looking at www.solidwoodkitchen.co.uk. They have some amazing designs and prices.

Kitchen Design Manchester

Attached is the latest emacs mode for e/Specman - version 1.23

Please follow the install instructions in the top section of the actual file
(after unzipping it) to install/load this package with your emacs.

Question for forum:

I’m currently working on a code to automatically add CLP files to DRA files and then add two classes called “APPROVED” and “CLP”. To do this manually you have to open a DRA file, click file import subdrawing and choose the clp file with the same name as dra. (path already set). You then set the clp to position x 0 0. And then click on Set Up > Subclasses > Package geometry and type in “Approved” and “Clp.”

So far we’ve recorded the macros in Allegro for all of these actions. The macros correspond to one specific file name and we want to apply this to numerous files. To do this we created a python program that locates all of the specified CLP and DRA files, and if they have a matching name, runs a for loop that puts each file name into a stored variable that runs a loop for each file. We converted this script into batch and then added a function that we thought would run Allegro macros from batch.

In order to get the script working, we need to have an allegro batch command that will run the script without opening the Allegro start popup, or closing the popup when it appears.  We need to do this to run any script from starting Allegro.

I’ve done another similar program in batch where I made a for loop for each dra file and within the loop there was a batch a2dxf command that converted all dra files to dxf files. Is there a similar batch command for adding clp files to position 0 0 and/ or adding classes? If anyone has done something similar please let me know!

Thank you very much for the help.

Jen

Hello,

I have a question I want to create a cover that consists a sparse values, pre-computed (a list or define) for example l = {1; 4; 7; 9; 2048; 700} I'd like to cover that data a (uint(bits:16)) had those values, Any suggestion on how to achieve this, I'd prefer to stay away from macros, and avoid to write a lot of code

struct inst {

  data :uint(bits:16);
  opcode :uint(bits:16);
  !valid_data : list of uint(bits:16) = {0; 12; 10; 700; 890; 293;};
  event data_e;
  event opcode_e;

  cover data_e is {
     item data using radix = HEX, ranges = {
     //I dont want to write all of this
     range([0], "My range1");
     range([10], "My range2");
     //... many values in between
    range([700], "My rangen");
    };

    item opcode;

   cross data, opcode;
};

post_generate() is also {
    emit data_e;
};
};

Hello,

I am trying to import (in spectre) an spice model of a ceramic capacitor manufactured by Samsung EM. The link that includes the model is here :-

http://weblib.samsungsem.com/mlcc/mlcc-ec.do?partNumber=CL05A156MR6NWR

They proved static spice model and interactive spice model.

I had no problem while including the static model.

However, the interactive model which models voltage and temperature coefficients seems to not be an ordinary spice model. They provide HSPICE, LTSPICE, and PSPICE model files and I failed to include any of them.

Any suggestions ?

Before I ask this, I am aware that I can output an s-parameter file from an SP analysis.

I'm wondering if there is a simple way of creating an s-parameter model of a component.

As an example, if I have an S-parameter model that has 200 ports and 150 of those ports are to be connected to passive components and the remaining 50 ports are to be connected to active components, I can simplify the model by connecting the 150 passive components, running an SP analysis, and generating a 50 port S-parameter file.

The problem is that this is cumbersome. You've got to wire up 50 PORT components and then after generating the s50p file, create a new cellview with an nport component and connect the 50 ports with 50 new pins.

Wiring up all of those port components takes quite a lot of time to do, especially as the "choosing analyses" form adds arrays in reverse (e.g. if you click on an array of PORT components called X<0:2> it will add X<2>, X<1>, X<0> instead of in ascending order) so you have to add all of them to the analyses form manually.

Is any way of taking a schematic and running some magic "generate S-Parameter cellview from schematic cellview"  function that automates the whole process?

Read how the Cadence Liberate Characterization solution effectively enables you to characterize only the failed or new arcs of a standard cell.(read more)

Key Findings:  There are a host of issues that arise in mixed-signal verification.  As discussed in earlier blogs, the industry trends indicate that teams need to prepare themselves for a more mixed world.  The good news is that these top five pitfalls are all avoidable.

It’s always interesting to study the human condition.  Watching the world through the lens of mixed-signal verification brings an interesting microcosm into focus.  The top 5 items that I regularly see vexing teams are:

1. When there’s a bug, whose problem is it?
2. Verification team is the lightning rod
3. Three (conflicting) points of view
4. Wait, there’s more… software
5. There’s a whole new language

Reason 1: When there’s a bug, whose problem is it?

It actually turns out to be a good thing when a bug is found during the design process.  Much, much better than when the silicon arrives back from the foundry of course. Whether by sheer luck, or a structured approach to verification, sometimes a bug gets discovered. The trouble in mixed-signal design occurs when that bug is near the boundary of an analog and a digital domain.

Figure 1.   Whose bug is it?

Typically designers are a diligent sort and make sure that their block works as desired. However, when things go wrong during integration, it is usually also project crunch time. So, it has to be the other guy’s bug, right?

A step in the right direction is to have a third party, a mixed-signal verification expert, apply rigorous methods to the mixed-signal verification task.  But, that leads to number 2 on my list.

Reason 2: Verification team is the lightning rod

Having a dedicated verification team with mixed-signal expertise is a great start, but what can typically happen is that team is hampered by the lack of availability of a fast executing model of the analog behavior (best practice today being a SystemVerilog real number model – SV_RNM). That model is critical because it enables orders of magnitude more tests to be run against the design in the same timeframe. 

Without that model, there will be a testing deficit. So, when the bugs come in, it is easy for everyone to point their finger at the verification team.

Figure 2.  It’s the verification team’s fault

Yes, the model creates a new validation task – it’s validation – but the speed-up enabled by the model more than compensates in terms of functional coverage and schedule.

The postscript on this finger-pointing is the institutionalization of SV-RNM. And, of course, the verification team gets its turn.

Figure 3.  Verification team’s revenge

Reason 3: Three (conflicting) points of view

The third common issue arises when the finger-pointing settles down. There is still a delineation of responsibility that is often not easy to achieve when designs of a truly mixed-signal nature are being undertaken.  

Figure 4.  Points of view and roles

Figure 4 outlines some of the delegated responsibility, but notice that everyone is still potentially on the hook to create a model. It is questions of purpose, expertise, bandwidth, and convention that go into the decision about who will “own” each model. It is not uncommon for the modeling task to be a collaborative effort where the expertise on analog behavior comes from the analog team, while the verification team ensures that the model is constructed in such a manner that it will fit seamlessly into the overall chip verification. Less commonly, the digital design team does the modeling simply to enable the verification of their own work.

Reason 4: Wait, there’s more… software

As if verifying the function of a chip was not hard enough, there is a clear trend towards product offerings that include software along with the chip. In the mixed-signal design realm, many times this software has among its functions things like calibration and compensation that provide a flexible way of delivering guards against parameter drift. When the combination of the chip and the software are the product, they need to be verified together. This puts an enormous premium on fast executing SV-RNM.

Figure 5.   There’s software analog and digital

While the added dimension of software to the verification task creates new heights of complexity, it also serves as a very strong driver to get everyone aligned and motivated to adopt best known practices for mixed-signal verification.  This is an opportunity to show superior ability!

Figure 6.  Change in perspective, with the right methodology

Reason 5: There’s a whole new language

Communication is of vital importance in a multi-faceted, multi-team program.  Time zones, cultures, and personalities aside, mixed-signal verification needs to be a collaborative effort.  Terminology can be a big stumbling block in getting to a common understanding. If we take a look at the key areas where significant improvement can usually be made, we can start to see the breadth of knowledge that is required to “get” the entirety of the picture:

• Structure – Verification planning and management
• Methodology – UVM (Unified Verification Methodology – Accellera Standard)
• Measure – MDV (Metrics-driven verification)
• Multi-engine – Software, emulation, FPGA proto, formal, static, VIP
• Modeling – SystemVerilog (discrete time) down to SPICE (continuous time)
• Languages – SystemVerilog, Verilog, Verilog-AMS, VHDL, SPICE, PSL, CPF, UPF

Each of these areas has its own jumble of terminology and acronyms. It never hurts to create a team glossary to start with. Heck, I often get my LDO, IFV, and UDT all mixed up myself.

Summary

Yes, there are a lot of things that make it hard for the humans involved in the process of mixed-signal design and verification, but there is a lot that can be improved once the pain is felt (no pain, no gain is akin to no bugs, no verification methodology change). If we take a look at the key areas from the previous section, we can put a different lens on them and describe the value that they bring:

• Structure – Uniformly organized, auditable, predictable, transparency
• Methodology – Reusable, productive, portable, industry standard
• Measure – Quantified progress, risk/quality management, precise goals
• Multi-engine – Faster execution, improved schedule, enables new quality level
• Modeling – Enabler, flexible, adaptable for diverse applications/design styles
• Languages – Flexible, complete, robust, standard, scalability to best practices

With all of this value firmly in hand, we can turn our thoughts to happier words:

…  stay tuned for more!

 Steve Carlson

The complexity and size of mixed-signal designs in wireless, power management, automotive, and other fast growing applications requires continued advancements in a mixed-signal verification methodology. An SoC, in these fast growing applications, incorporates a large number of analog and mixed-signal (AMS) blocks/IPs, some acquired from IP providers, some designed, often concurrently. AMS IP must be verified independently, but this is not sufficient to ensure an SoC will function properly and all scenarios of interaction among many different AMS IP blocks at full chip / SoC level must be verified thoroughly. To reduce an overall verification cycle, AMS IP and SoC verification teams must work in parallel from early stages of the design. Easier said than done! We will outline a methodology than can help.

AMS designers verify their IP meets required specifications by running a testbench they develop for standalone / out of-context verification. Typically, an AMS IP as analog-centric, hierarchal design in schematic, composed of blocks represented by transistor, HDL and behavioral description verified in Virtuoso® Analog Design Environment (ADE) using Spectre AMS Designer simulation. An SoC verification team typically uses UVM SystemVerilog testbech at full chip level where the AMS IP is represented with a simple digital or real number model running Xcelium /DMS simulation from the command line.

Ideally, AMS designers should also verify AMS IP function properly in the context of full-chip integration, but reproducing an often complex UVM SystemVerilog testbench and bringing over top-level design description to an analog-centric environment is not a simple task.

Last year, Cadence partnered with Infineon on a project with a goal to automate the reuse of a top-level testbench in AMS verification. The automation enabled AMS verification engineers to automatically configure setup for verification runs by assembling all necessary options and files from the AMS IP Virtuoso GUI and digital SoC top-level command line configurations. The benefits of this method were:

• AMS verification engineers did not need to re-create complex stimuli representing interaction of their IP at the top level
• Top-level verification stays external to the AMS IP verification environment and continues to be managed by the SoC verification team, but can be reused by the AMS IP team without manual overhead
• AMS IP is verified in-context and any inconsistencies are detected earlier in the verification process
• Improved productivity and overall verification time

For more details, please see Infineon’s CDNLlive presentation.

Analog and Mixed-signal (AMS) designs are increasingly using active power management to minimize power consumption. Typical mixed-signal design uses several power domains and operate in a dozen or more power modes including multiple functional, standby and test modes. To save power, parts of design not active in a mode are shut down or may operate at reduced supply voltage when high performance is not required. These and other low power techniques are applied on both analog and digital parts of the design. Digital designers capture power intent in standard formats like Common Power Format (CPF), IEEE1801 (aka Unified Power Format or UPF) or Liberty and apply it top-down throughout design, verification and implementation flows. Analog parts are often designed bottom-up in schematic without upfront defined power intent. Verifying that low power intent is implemented correctly in mixed-signal design is very challenging. If not discovered early, errors like wrongly connected power nets, missing level shifters or isolations cells can cause costly rework or even silicon re-spin. 

Mixed-signal designers rely on simulation for functional verification. Although still necessary for electrical and performance verification, running simulation on so many power modes is not an effective verification method to discover low power errors. It would be nice to augment simulation with formal low power verification but a specification of power intent for analog/mixed-signal blocs is missing. So how do we obtain it? Can we “extract” it from already built analog circuit? Fortunately, yes we can, and we will describe an automated way to do so!

Virtuoso Power Manager is new tool released in the Virtuoso IC6.1.8 platform which is capable of managing power intent in an Analog/MS design which is captured in Virtuoso Schematic Editor. In setup phase, the user identifies power and ground nets and registers special devices like level shifters and isolation cells. The user has the option to import power intent into IEEE1801 format, applicable for top level or any of the blocks in design. Virtuoso Power Manager uses this information to traverse the schematic and extract complete power intent for the entire design. In the final stage, Virtuoso Power Manager exports the power intent in IEEE1801 format as an input to the formal verification tool (Cadence Conformal-LP) for static verification of power intent.

Cadence and Infineon have been collaborating on the requirements and validation of the Virtuoso Power Manager tool and Low Power verification solution on real designs. A summary of collaboration results were presented at the DVCon conference in Munich, in October of 2018.  Please look for the paper in the conference proceedings for more details. Alternately, can view our Cadence webinar on Verifying Low-Power Intent in Mixed-Signal Design Using Formal Method for more information.

Cadence_SPB_17.4-2019 + Matlab R2019a

请参考本文档中的步骤进行操作

1，打开BJT_AMP.opj

2，设置Matlab路径

3，打开BJT_AMP_SLPS.slx

4，打开后，设置PSpiceBlock，出现或CEFSimpleUI.exe停止工作

5，添加模块

6，相同

7，打开pspsim.slx

8，相同

9，打开C： Cadence Cadence_SPB_17.4-2019 tools bin

orCEFSimpleUI.exe和orCEFSimple.exe

10，相同

我想问一下如何解决，非常感谢！

Bumps are central to the Virtuoso MultiTech Framework solution. Bumps provide a connection between stacked ICs, interposers, packages, and boards. Bump locations, connectivity, and other attributes are the basis for creating TILPs, which we combine to create system-level layouts.(read more)

Since the release of the Automated Device Placement and Routing solution last year, we have continued to improve and build upon it. In this blog, I’ll talk about the latest addition—the Auto Device Array form—how this is an integral piece of the new Automated Device Placement and Routing solution.(read more)

Here is another blog in the multi-part series that aims at providing in-depth details of electromagnetic analysis in the Virtuoso RF solution. Read to learn about the nuances of port setup for electromagnetic analysis.(read more)

Do you want to create designs that are correct by construction? Read along this blog to understand how you can achieve this by using Width Spacing Patterns (WSPs) in your designs. WSPs, are track lines that provide guidance for quickly creating wires. Defining WSPs that capture the width-dependent spacing rules, and snapping the pathSegs of a wire to them, ensures that the wires meet width-dependent spacing rules.(read more)

If you have one of those Die layouts, which doesn’t have bumps, but rather uses pad shapes and labels to identify I/O locations, then you might be feeling a bit left out of all of this jazz and tango. Hence, today, I am writing to tell you that, fear not, we have a solution for your Die as well.(read more)

We have all heard the sayings “Less is more” and “Keep it simple”. Electromagnetic simulation is an activity where following that advice has enormous payoffs. In this blog I’ll talk about some of my experiences with how Virtuoso RF Solution’s shape simplification feature has helped my customers get significant performance improvements with minimal impacts on accuracy. (read more)

Hello everyone, today I’d like to talk to you about the recent enhancements to Die export in the Virtuoso RF Solution, most of which were released in ICADVM 18.1 ISR10. What’s the background for these enhancements? Exporting an abstract of a Die, which basically represents the outer boundary of the Die with I/O locations, as an intermediate file to exchange information between various Cadence tools (i.e., the Innovus, Virtuoso, and Allegro platforms) is not a new feature. This capability existed even prior to the Virtuoso RF Solution. However, the entire functionality was rewritten from scratch when we first started developing the Virtuoso RF Solution because the previous feature was deemed archaic, its performance and capacity needed to be enhanced, and use model needed to be modernized. This effort has been made in various phases, with the last round being completed and released in ICADVM18.1 ISR10.(read more)

The way you need blocks of different sizes and styles to build great Lego masterpieces, a complex WSP-based design requires stitching together routing regions with multiple patterns that follow different WSSPDef periods. Let's see how you can achieve this. (read more)

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کورونا وائرس کے پیش نظر مسجد حرام اور مسجد نبوی میں سماجی فاصلہ کے اصول اور صحت سے متعلق جاری کردہ پروٹوکول پرعمل درآمد شروع کرا دیا گیا ہے ۔

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پٹنہ کے مسلم علاقوں جیسے سبزی باغ ، سلطان گنج ، عالم گنج ، لال باغ ، پٹنہ سٹی ، عظیم آباد ، پٹنہ جنکشن ، ہارون نگر، سمن پورا اور پھلواری شریف کی گلیوں میں قرآن پڑھنے کی آوازیں صاف طور سے سنائی دیتی ہیں ۔

رمضان المبارک میں تراویح کی نماز یوں تو دو دو رکعت  کرکے پڑھی جاتی ہے ، مگر اگر کوئی شخص چار رکعت کی نیت ایک ہی ساتھ باندھ  لے تو کیا یہ درست ہے ؟ جانئے کہتے ہیں علما کرام ۔

رمضان المبارک کا مقدس مہینہ سایہ فگن ہے ۔ اس بابرکت مہینہ میں مردوں کے مقابلہ میں خواتین پر کام کاج کا زیادہ بوجھ ہوتا ہے ۔ ایسے میں دیکھئے خواتین کس طرح کی عبادات کرکے زیادہ سے زیادہ ثواب کما سکتی ہیں ۔

رمضان المبارک کا مقدس ماہ سایہ فگن ہے ۔ دنیا بھر کے مسلمان اس بابرکت ماہ میں روزہ رکھ رہے ہیں اورعبادات میں مصروف ہیں ۔ جانئے ماہ رمضان میں دن میں روزہ رکھ کر زیادہ سونا کیسا ہے اور اس بارے میں علما کرام کا کیا کہنا ہے ؟

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પહેલા જે તારો આવવાનો હતો તે પૃથ્વી તરફ આવતા પહેલા જ તૂટી વેરવિખેર થઈ ગયો, હવે તેની જગ્યા પર સ્વાન પુચ્છલ તારાએ લઈ લીધી છે, જે પૃથ્વી પાસેથી મે મહિનામાં જ પસાર થશે

JEE (Main)ની પરીક્ષા 18 જુલાઈથી 23 જુલાઈની વચ્ચે આયોજિત કરાશે, NEETની પરીક્ષા 26 જુલાઈએ લેવાશે

Buddha Purnima પર PM Modiએ કહ્યું, ભારત પોતાની વૈશ્વિક જવાબદારીનું કરી રહ્યું છે પાલન

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જન્મના એક વર્ષ બાદથી જ શરીર પર મસા થવાનું શરૂ થયું, સ્થિતિ વણસી જતાં હવે સ્કિન કેન્સર થવાનો ખતરો