Differentiating good IP from mediocre or bad IP is getting more difficult, in part because it depends upon how and where it is used and in part, because even the best IP may work better in one system than another—even in chips developed by the same vendor.  

So, how do you measure IP quality and why it is so complicated?

The answer depends on who is asking. Most of the time, the definition of IP quality depends on your vantage point.  If you are an R&D manager, IP quality means something. If you are a global supply manager, IP quality means something else. If you are an SoC start-up, your measure of quality is quite different from that of an established fabless company. If you are designing IP in-house, then your considerations are very different than being a commercial IP vendor. If you are designing an automotive SoC, then we are in a totally different category. How about as an IP vendor? How do you articulate IP quality metrics to your customers?

This varies greatly by the type of IP, as well. When it comes to interface (hard) IP and controllers, if you are an R&D manager, your goal is to design IP that meets the IP specifications and PPA (power, performance, and area) targets. You need to validate your design via silicon test chips. This applies to all hard PHYs, which must be mapped to a particular foundry process. For controllers that are in RTL form—we called these soft IP—you have to synthesize them into a particular target library in a particular foundry process in order to realize them in a physical form suitable for SoC integration. Of course, your design will need to go through a series of design validation steps via simulation, design verification and passing the necessary DRC checks, etc. In addition, you want to see the test silicon in various process corners to ensure the IP is robust and will perform well under normal process variations in the production wafers.

For someone in IP procurement, the measure of quality will be based on the maturity of the IP. This involves the number of designs that have been taped out using this IP and the history of bug reports and subsequent fixes. You will be looking for quality of the documentation and the technical deliverables. You will also benchmark the supplier’s standard operating procedures for bug reporting and technical support, as well as meeting delivery performance in prior programs. This is in addition to the technical teams doing their technical diligence.

An in-house team that is likely to design IP for a particular SoC project will be using an established design flow and will have legacy knowledge of last generation’s IP. They may be required to design the IP with some reusability in mind for future programs. However, such reusability requirements will not need to be as stringent and as broad as those of commercial IP vendors because there are likely to be established metrics and procedures in place to follow as part of the design team’s standard operating procedures. Many times, new development based on a prior design that has been proven in use will be started, given this stable starting point. All of these criteria help the team achieve a quality outcome more easily.

Then, if designing for an automotive SoC, additional heavy lifting is required.  Aside from ensuring that the IP meets the specifications of the protocol standards and passes the compliance testing, you also must pay attention to meeting functional safety requirements. This means adherence to ISO 26262 requirements and subsequently achieving ASIL certification. Oftentimes, even for IP, you must perform some AEC-Q100-related tests that are relevant to IP, such as ESD, LU, and HTOL.

To read more, please visit: https://semiengineering.com/why-ip-quality-is-so-difficult-to-determine/

hi all, 

          what wrong with the error "param_write.log does not exist" when i export parameters in allegro 16.6 pcb board.

          someone can provide suggestions, thanks.

best regards.

The following is valid SystemVerilog:

module mmio
#(parameter PORTS=2,
parameter ADDR_WIDTH=30)
(input logic[ADDR_WIDTH-1:0] addr[PORTS],
output logic ben[PORTS], // Bus enable
output logic men[PORTS]); // Memory enable

always_comb begin
for(int i = 0; i < PORTS; i++) begin
ben[i] = addr[i] >= 'h20080004 && addr[i] < 'h200c0000;
men[i] = ~ben[i];
end
end

endmodule : mmio

And if you instantiate it:

mmio #(1, 30) MMIO(.addr('{scalar_addr}),
.ben('{ben}),
.men('{men}));

Genus returns an error: "Could not synthesize non-constant range values. [CDFG-231] [elaborate]" Is this just not possible in Genus or could it be caused by something else?

Hi Folks, A question that I've often received from designers, "Is there a method to determine the amount of memory required before I submit a job? I use distributed processing and need to provide an estimate before submitting jobs." The answer...(read more)

Hi All, Here's another great new feature that I've found very helpful... Broadband SPICE is a new tool for S-parameter simulation in Spectre RF. In the MMSIM13.1.1 ( MMSIM13.1 USR1) release (now available on http://downloads.cadence.com), a...(read more)

Last year, I wrote a blog post entitled Modeling Oscillators with Arbitrary Phase Noise Profiles . We now have an easier way to do this. Starting in MMSIM 13.1 , you can specify the phase noise as an instance parameter in Spectre sources, including...(read more)

Hello Spectre Users, Simulating S-parameters in a time domain (transient, periodic steady state) simulator has been and continues to be a challenge for many analog and RF designers. I'm often asked: What is required in order to achieve accurate...(read more)

Hi All, If you were unable to attend IMS 2017 in June 2017, the IMS MicroApp “7 Habits of Highly Successful S-Parameters” is on our Cadence website. On Cadence Online Support , the in-depth AppNote is here: 20466646 . Best regards, Tawna...(read more)

Large-signal S-parameters (LSSPs) are an extension of small-signal S-parameters and are defined as the ratio of reflected (or transmitted) waves to incident waves. (read more)

Hello,

After deleting cells using the following loop:

foreach(cellId ddGetObj(libName)~>cells
    ddDeleteObj(cellId)
)

the following warnings are printed in the CIW:

*WARNING* (SCH-2162): "... symbol" has been updated since "... schematic" was last saved. Validate that the schematic is correct and run Check and Save to suppress this warning.
*WARNING* (DB-270337): dbGetInstHeaderMaster: Failed to open cellview '...' from library '...' in read-only mode because the cellview does not exist. This cellview was instantiated in cellview '...' of library '...'. Ensure that the cellview exists in the library.

Is it possible to turn them off?

Thank you

Best regards,

Aldo

Is there any way I can find duplicated shapes?

I would like to find two or more shapes are identical and they are placed in the same location.

https://community.cadence.com/cadence_blogs_8/b/breakfast-bytes/posts/cowos-info

I came across cadence old article that discussing about TSMC advance packaging technology such as InFO & CoWoS. However, I couldn’t find information such as what I/O interface standard is required to realize this multi-chip SiP. For example, Intel using their proprietary AIB interface for EMIB solution.

Besides, any idea if inFO also able to supports multi-chip integration for older node process to new node process such as 40-nm to 16-nm?

Hello, i need to test the  parameter Kf under some conditions in subthreshold.i cannot just plot the OP param,becasue i need to derive it under certain conditions.

Spectre(of Cadence) like BSIM(of Berkley) has developed a method for deriving each parameter in their model.

Is there a way to help me with such manual where i can test in cadence virtuoso the Kf parameter shown in the formula bellow?

Thanks.

No, this isn’t a Hollywood movie. We’re talking about pieces of plane shapes with no connections to them, not an idyllic private oasis in the Caribbean (sorry). Removing shape islands is something you’ve always been able to do in th...(read more)

Before I ask this, I am aware that I can output an s-parameter file from an SP analysis.

I'm wondering if there is a simple way of creating an s-parameter model of a component.

As an example, if I have an S-parameter model that has 200 ports and 150 of those ports are to be connected to passive components and the remaining 50 ports are to be connected to active components, I can simplify the model by connecting the 150 passive components, running an SP analysis, and generating a 50 port S-parameter file.

The problem is that this is cumbersome. You've got to wire up 50 PORT components and then after generating the s50p file, create a new cellview with an nport component and connect the 50 ports with 50 new pins.

Wiring up all of those port components takes quite a lot of time to do, especially as the "choosing analyses" form adds arrays in reverse (e.g. if you click on an array of PORT components called X<0:2> it will add X<2>, X<1>, X<0> instead of in ascending order) so you have to add all of them to the analyses form manually.

Is any way of taking a schematic and running some magic "generate S-Parameter cellview from schematic cellview"  function that automates the whole process?

Malmon is a real-time exploit/backdoor detection tool for Linux that audits the integrity of files in a given directory.

Malmon is a real-time exploit/backdoor detection tool for Linux that audits the integrity of files in a given directory.

• The 3DEXPERIENCE Platform combines modeling, simulation, data science, artificial intelligence and collaboration in the virtual world to achieve sustainable innovation in life sciences • Dassault Systèmes, together with Medidata Solutions, will lead the digital transformation of life sciences in the age of personalized medicine and patient-centric experience • Connecting the 3DEXPERIENCE Platform with Medidata’s Clinical Trial platform connects the dots between research, development,...

●Electric air mobility pioneer used the 3DEXPERIENCE platform on the cloud to develop prototype in two years ●“Reinvent the Sky” industry solution experience provides full data security in a single, standards-based environment ●Dassault Systèmes enables companies of all sizes to create new categories of sustainable air mobility systems that will change how the world travels

TP-LINK Cloud Cameras including products NC260 and NC450 suffer from a command injection vulnerability. The issue is located in the httpSetEncryptKeyRpm method (handler for /setEncryptKey.fcgi) of the ipcamera binary, where the user-controlled EncryptKey parameter is used directly as part of a command line to be executed as root without any input sanitization.

Whitepaper called Bypassing Root Detection Mechanism. Written in Persian.

The handling of the virtual registry for desktop bridge applications can allow an application to create arbitrary files as system resulting in privilege escalation. This is because the fix for CVE-2018-0880 (MSRC case 42755) did not cover all similar cases which were reported at the same time in the issue.

Snare for Apache provides a remote distribution facility for Apache Web server logs. It is known to run on most Unix variations, including Linux, Solaris, AIX, Tru64, and Irix. Snare for Apache can be used to send data to either a remote or local SYSLOG server, or the Snare Server for centralized collection, analysis, and archival.

This Metasploit module exploits a buffer overflow in ACDSee FotoSlate 4.0 Build 146 via a specially crafted id parameter in a String element. When viewing a malicious PLP file with the ACDSee FotoSlate product, a remote attacker could overflow a buffer and execute arbitrary code. This exploit has been tested on systems such as Windows XP SP3, Windows Vista, and Windows 7.

Swaparoo - Windows backdoor method for Windows Vista/7/8. This code sneaks a backdoor command shell in place of Sticky Keys prompt or Utilman assistant at login screen.