US-based comedian Austin Nasso is going viral online for his hilarious impersonation of US-President-elect Donald Trump during a fictional visit to India.

Wind River, an IoT and industrial operating system owned by Intel will be acquired by TPG, global alternative asset firm. Terms of the deal were not disclosed. Intel had bought Wind River Systems for $884 million in 2009

Wind River operates in several markets, including aerospace and defense, automotive, industrial, medical and networking technologies. Its core products in these markets are operating systems, software infrastructure platforms, device management, and simulation software. The IoT practice of Wind River provides consulting services for customers building IoT applications.

In a statement for Wind River, Nehal Raj, Partner and Head of Technology investing at TPG said “We see a tremendous market opportunity in industrial software driven by the convergence of the Internet of Things (IoT), intelligent devices and edge computing. As a market leader with a strong product portfolio, Wind River is well positioned to benefit from these trends. We are excited about the prospects for Wind River as an independent company, and plan to build on its strong foundation with investments in both organic and inorganic growth.”

Wind River’s main IoT product is Helix Device Cloud, a cloud-offering capable of managing deployed IoT devices and industrial equipment across a machine’s lifecycle. Helix can connect and manage devices remotely.

Helix platform’s key uses cases are gateway management, proactive maintenance, security updates, and device provisioning.

IFTTT (If This Than That), a web-based software that automates and connects over 600 online services/software raised a $24M Series C led by Salesforce. Other investors include IBM and the Chamberlain Group and Fenox Venture Capital.

The latest round brings IFTTT’s funding to $63M and it will use the funding proceeds to provide integration for enterprise and IoT services and hiring. In IFTTT’s platform, applets are code/script users need to deploy to integrate two or more services (such Google Drive’s integration with Twitter/Facebook).

Investment in IFTTT reveals that Salesforce is consolidating its presence in enterprise IoT space. It also acquired Mulesoft, an integration platform that rivals Microsoft’s BizTalk.

IBM’s investment in IFTTT is also noteworthy as the former is pushing its IBM Watson IoT platform. The following statement also shows its keen interest in IFTTT.

Other recent investments in IoT companies include $30M Series B of Armis and Myriota's $15M for its IoT satellite-based connectivity platform.

For latest IoT funding and product news, please visit our IoT news section.

Vesper, the maker of piezoelectric sensors used in microphone production and winner of CES Innovation Award 2018 raised a $23M Series B round. American Family Ventures led the investment with participation from Accomplice, Amazon Alexa Fund, Baidu, Bose Ventures, Hyperplane, Sands Capital, Shure, Synaptics, ZZ Capital and some undisclosed investors.

Vesper’s innovative sensors can be used in consumer electronics like TV remote controls, smart speakers, smartphones, intelligent sensor nodes, and hearables. The company will use the funding proceeds to scale-up its functions like mass production of its microphones and support expanded research and development, hiring, and establishing international sales offices.

The main product of Vesper is VM1000, a low noise, high range,single-ended analog output piezoelectric MEMS microphone. It consists of a piezoelectric sensor and circuitry to buffer and amplify the output.

The hot-selling product of Vesper is VM1010 with ZeroPower Listening which is the first MEMS microphone that enables voice activation to battery-powered consumer devices.

The unique selling point of Vesper’s products is they are built to operate in rugged environments that have dust and moisture.

"Vesper's ZeroPower Listening capabilities coupled with its ability to withstand water, dust, oil, and particulate contaminants enables users that have never before been possible," said Katelyn Johnson, principal of American Family Ventures. "We are excited about Vesper's quest to transform our connected world, including IoT devices."

Other recent funding news include $24 raised by sensor-based baby sock maker Owlet, IFTTT banks $24M from Salesforce to scale its IoT Enterprise offering, and Intel sells its Wind River Software to TPG.

Smart baby monitor company Nanit raised a $14M Series B round led by Jerusalem Venture Partners (JVP). Other investors that participated include existing investors Upfront Ventures, RRE Ventures, Vulcan Capital and Vaal Investment Partners. The latest investment brings total equity funding of Nanit to $30M.

Nanit announced it will use the funding proceeds to expand its team of computer vision and machine learning engineers and grow its sales in Europe and Canada.

Nanit’s baby monitor helps new parents oversee nursery conditions as it has built-in temperature and humidity sensors. The camera lets parents remotely monitor baby’s crib whereas sound and motion are detected via smart sensors.

The monitor’s insights can be accessed via an accompanying mobile app. Nanit charges $10 per month for its premium package.

The key use cases of Nanit’s baby monitoring technology include sleep insights, behavioral analysis, expert guidance, and nightly video summaries. The company currently sells its smart monitors via its website.

Microsoft announced it has acquired Semantic Machines, a conversational AI startup providing chatbots and AI chat apps founded in 2014 having $20.9 million in funding from investors. The acquisition will help Microsoft catch up with Amazon Alexa, though the latter is more focused on enabling consumer applications of conversational AI.

Microsoft will use Semantic Machine’s acquisition to establish a conversational AI center of excellence in Berkeley to help it innovate in natural language interfaces.

Microsoft has been stepping up its products in conversational AI. It launched the digital assistant Cortana in 2015, as well as social chatbots like XiaoIce. The latest acquisition can help Microsoft beef up its ‘enterprise AI’ offerings.

As the use of NLP (natural language processing) increases in IoT products and services, more startups are getting traction from investors and established players. In June last year, Josh.ai, avoice-controlled home automation software has raised $8M.

Followed by it was SparkCognition that raised $32.5M Series B for its NLP-based threat intelligence platform.

It appears Microsoft’s acquisition of Semantic Machines was motivated by the latter’s strong AI team. The team includes technology entrepreneur Daniel Roth who sold his previous startups Voice Signal Technologies and Shaser BioScience for $300M and $100M respectively. Other team members include Stanford AI Professor Percy Liang, developer of Google Assistant Core AI technology and former Apple chief speech scientist Larry Gillick.

EV Ultimo launches platform to assist brands, buyers, stakeholders in the Electric Vehicles ecosystem

[SAPS] - Polokwane based Hawks Serious Commercial Crime Investigation in collaboration with National Traffic Anti-corruption Unit arrested 11 suspects between the ages of 27 and 57 for alleged fraud at various Provinces during operation "SISFIKILE".

[SAPS] - Five suspects are appearing in the Kariega Magistrate's Court today, after they were arrested and found in possession of cycads with an estimated value of R1 Million on Friday 08 November 2024.

[SAPS] One hundred and seventy one (171) murder suspects, 261 attempted murder suspects and 250 suspected rapists were among 12 593 suspects who were arrested during various operations by police in KwaZulu-Natal in the month of October. During such operations police also managed to recover 345 firearms and 2 998 rounds of ammunition of various calibre of firearms. Among the recovered firearms were 23 rifles and 17 homemade illegal guns.

[The Conversation Africa] South Africa's finance minister, Enoch Godongwana, announced in his October mid-term budget policy statement that cabinet had approved funding for an early retirement programme to reduce the public sector wage bill. R11 billion (about US$627 million) will be allocated over the next two years to pay for the exit costs of 30,000 civil servants while retaining critical skills and promoting the entry of younger talent.

[DA] Note to editors: Please find attached soundbite by Ian Cameron MP.

[SAnews.gov.za] Twenty-three people in Gauteng have died as a result of food borne-related poisoning after consuming food from spaza shops.

[SAnews.gov.za] With the United Nations Framework Convention on Climate Change (COP29) taking place this week, South Africa expects the COP29 Presidency to enhance efforts to finalise the New Collective Quantified Goal on Finance (NCQG), which is a matter of great importance for developing economies.

[Premium Times] In September, Tyla made headlines at the MTV Video Music Awards (VMAs) for winning the "Best Afrobeats," but she stirred debate by clarifying that she identified with the Amapiano genre rather than Afrobeats

[State Department] U.S. Ambassador-at-Large to Monitor and Combat Trafficking in Persons Cindy Dyer will travel to Madagascar November 13-16 and South Africa November 17-21.

[allAfrica]

[COSATU] The Congress of South African Trade Unions (COSATU) is deeply concerned by the Minister for Communications and Digital Technologies, Mr. S. Malatsi's sudden withdrawal of the South African Broadcasting Corporation (SABC) SOC Ltd Bill from Parliament where it was being engaged upon by the National Assembly's Portfolio Committee: Communications and Digital Technologies.

[allAfrica]

[Parliament of South Africa] Parliament, Tuesday, 12 November 2024 - The National Assembly (NA) will hold a plenary session scheduled to start at 10:00. Among the items on the agenda from 10:00 to 13:00 is the statement by the Minister of Water and Sanitation on water security in the country and a debate on 16 Days of Activism for no violence against women and children. The debate will be held under the theme, "Marking 30 years of democratic rights for women and fostering national unity to end gender-based violence".

[The Conversation Africa] Despite the flaws in the latest novel by South African writer Nthikeng Mohlele, there is something alluring about Revolutionaries' House. It is Mohlele's most political novel, and the parallels drawn between love and politics - and their pitfalls - are intriguing.

[spotlight] Highly effective treatments for HIV have existed since the mid-1990s. But while these treatments keep people healthy, we do not yet have a safe and scalable way to completely rid the body of the virus. In this Spotlight special briefing, Elri Voigt takes stock of where we are in the decades-long search for an HIV cure.

[DA] It is a national embarrassment that the inability of the City of Johannesburg to supply water to its residents, business and public sector offices, has now led to the shutdown of operations at the Constitutional Court, on Constitution Hill in Braamfontein.

[GroundUp] The education department says there's only one SETA official assisting all nine provinces

PCI-SIG DevCon 2024 – 32^nd Anniversary

For more than a decade, Cadence has been well-known in the industry for its strong commitment and support for PCIe technology. We recognize the importance of ensuring a robust PCIe ecosystem and appreciate the leadership PCI-SIG provides. To honor the 32^nd anniversary of the PCI-SIG Developer’s Conference, Cadence is announcing a complete PCIe 7.0 IP solution for HPC/AI markets.

Why Are Standards Like PCIe So Important?

From the simplest building blocks like GPIOs to the most advanced high-speed interfaces, IP subsystems are the lifeblood of the chipmaking ecosystem. A key enabler for IP has been the collaboration between industry and academia in the creation of standards and protocols for interfaces. PCI-SIG drives some of the key definitions and compliance specifications and ensures the interoperability of interface IP.

HPC/AI markets continue to demand high throughput, low latency, and power efficiency. This is fueling technology advancements, ensuring the sustainability of PCIe technology for generations to come. As a close PCI-SIG member, we gain valuable early insights into the evolving specs and the latest compliance standards. PCIe 7.0 specifications and beyond will enable the market to scale, and we look forward to helping our customers build best-in-class cutting-edge SoCs using Cadence IP solutions.

Figure 1. Evolution of PCIe Data Rates (source PCI-SIG)

What’s New This Year at DevCon?

At DevCon ’24, the PCIe 7.0 standard will take center stage, and Cadence is showing off a full suite of IP subsystem solutions for PCIe 7.0 this year.

What Sets Cadence Apart?

At Cadence, we believe in building a full subsystem for our testchips with eight lanes of PHY along with a full 8-lane controller. Adding a controller to our testchip significantly increases the efficiency and granularity in characterization and stress testing and enables us to demonstrate interoperability with real-world systems. We are also able to test the entire protocol stack as an 8-lane solution that encompasses many of the applications our customers use in practice. This approach significantly reduces the risks in our customers’ SoC designs.

Figure 2: Piper - Cadence PHY IP for PCIe 7.0

Figure 3: Industry’s first IP subsystem for PCIe 7.0

Which Market Is This For?

At a time when accelerated computing has gone mainstream, PCIe links are going to take on a role of higher importance in systems. Direct GPU-to-GPU communication is crucial for scaling out complex computational tasks across multiple graphics processing units (GPUs) or accelerators within servers or computing pods. There is a growing recognition within the industry of a need for scalable, open architecture in high-performance computing. As AI and data-intensive applications evolve, the demand for such technologies will likely increase, positioning PCIe 7.0 as a critical component in the next generation of interface IP.

Here's a recent article describing a potential use case for PCIe 7.0.

Figure 4: Example use case for PCIe 7.0

Why Are Optical Links Important?

It takes multiple buildings of data centers to train AI/ML models today. These buildings are increasingly being distributed across geographies, requiring optical fiber networks that are great at handling the increased bandwidth over long distances. However, these optical modules soon hit a power wall where all the budgeted power is used to drive the signal from point A to point B, and there is not enough power left to run the actual CPUs and GPUs. Such scenarios create a need for non-retimed, linear topologies. Linear Pluggable Optics (LPO) links can significantly reduce module power consumption and latency when compared to traditional Digital Signal Processing (DSP) based retimed optical solutions, which is critical for accelerating AI performance. Swapping from DSP-based solutions to LPO results in significant cost savings that help drive down expenditure due to lower power and cooling requirements, but this requires a robust high-performance ASIC to drive the optics rather than retimers/DSP.

To showcase the robustness of Cadence IP, we have demonstrated that our subsystem testchip board for PCIe 7.0 can successfully transmit and receive 128GT/s signals through a non-retimed opto-electrical link configured in an external loopback mode with multiple orders of margin to spare.

Figure 5: Example of ASIC driving linear optics

Compliance Is Key

For PCIe 6.0, the official compliance program has not started yet; this is typical for the SIG where the official compliance follows a few years after the spec is ratified to give enough time for the ecosystem to have initial products ready, and for test and equipment vendors to get their hardware/software up and running. At this time, PCIe Gen6 implementations can only be officially certified up to PCIe 5.0 level (the highest official compliance test suite that the SIG supports). We have taken our PCIe 6.0 IP subsystem solution to the SIG for multiple process nodes, and they are all listed as compliant. You can run this query on the pcisig.com website under the Developers->Integrators list by making the following selections:

Due to space limitations, not all combinations could be tested at the May workshop (e.g., N3 root port) – this will be tested in the next workshop.

Also, the SIG just held an “FYI” compliance event this week to bring together the ecosystem for confidential testing (no results were reported, and data cannot be shared outside without violating the PCI-SIG NDA). We participated in the event with multiple systems and can report that our systems have done quite well. The test ecosystem is not mature yet, and a few more FYI workshops will be conducted before the official compliance for 6.0 is launched. We have collaborated with all the key test vendors for electrical and protocol testing throughout the year. As early as the middle of last year, we were able to provide test cards to all these vendors to demo PCIe 6.0 capabilities in their booths at various events. Many of them recorded these videos, and they can be found online.

• Cadence Subsystem IP for PCIe 6.0: Protocol and Electrical Testing
• Cadence Subsystem IP for CXL Protocol Test Demo
• Cadence Subsystem IP for CXL2.0/3.0 Protocol Test Demo
• Cadence Subsystem IP for PCIe 6.0: Protocol Stack Demo

More at the PCI-SIG Developers Conference

Check us out at the PCI-SIG Developer’s conference on June 12 and 13 to see the following demonstrations:

• Robust performance of Cadence IP for PCIe 7.0 transmitting and receiving 128GT/s signals over non-retimed optics
• Capabilities of Cadence IP for PCIe 7.0 measured using oscilloscope instrumentation detailing its stable electrical performance and margin
• The reliability of Cadence IP for PCIe 6.0 interface using Test Equipment to characterize the PHY receiver quality
• A PCI-SIG-compliant Cadence IP subsystem for PCIe 6.0 optimized for both power and performance

As a leader in PCI Express, Anish Mathew of Cadence will share his valuable insights on an important topic: “Impact of UIO ECN on PCIe Controller Design and Performance,” highlighting the strides made by the Cadence design team in achieving this implementation.

Figure 6: Cadence UIO Implementation Summary

Summary

Cadence showcased PCIe 7.0-ready IP at PCI-SIG Developers Conference 2023 and continues to lead in PCIe IP development, offering complete solutions in advanced nodes for PCIe 7.0 that will be generally available early next year. With a full suite of solutions encompassing PHYs, Controllers, Software, and Verification IP, Cadence is proud to be a member of the PCI-SIG community and is heavily invested in PCIe. Cadence was the first IP provider to bring complete subsystem solutions for PCIe 3.0, 4.0, 5.0, and 6.0 with industry-leading PPA and we are proud to continue this trend with our latest IP subsystem solution for PCIe 7.0, which sets new benchmarks for power, performance, area, and time to market.

The market is trending towards integrating and stacking multiple chiplets into a single package to meet the growing demands of speed, connectivity, and intelligence.  However, designing and signing off chiplets and packages individually is time-...(read more)

PCI-SIG DevCon 2024 was a great success for Cadence. We posted the blog, Cadence Demonstrates Complete PCIe 7.0 Solution at PCI-SIG DevCon ‘24 a day before the event to advertise our IP solutions for PCIe 7.0, which resulted in a lot of extra traffic at our booth. All of the attendees were excited to see Cadence demonstrate the robustness of 128GT/s PCIe 7.0 IP's TX and RX capabilities over a real-world, low-latency, non-retimed, linear optics connector. We achieved and maintained a consistent, impressive pre-FEC BER of ~3E-8 (PCIe spec requires 1E-6) for the entire duration of the event, spanning over two full days with no breaks. This provides an ample margin for RS FEC. As seen in the picture below, the receiver Eye PAM4 histograms have good linearity and margin. This is the world’s first stable demonstration of 128 GT/s TX and RX over off-the-shelf optical connectors—by far the main attraction of DevCon this year.

Cadence 128 GT/s TX and RX capability over optics

Block diagram of Cadence PHY for PCIe 7.0 128 GT/s demo setup with linear pluggable optics

As a leader in PCIe, our PCIe controller architect Anish Mathew shared his valuable insights on an important topic: “Impact of UIO ECN on PCIe Controller Design and Performance,” highlighting the strides made by the Cadence design team in achieving this implementation.

Anish Mathew presenting “Impact of UIO ECN on PCIe Controller Design and Performance”

In summary, Cadence had a dominating presence on the demo floor with a record number of PCIe demos:

• PCIe 7.0 over optics
• PCIe 7.0 electrical
• PCIe 6.0 RP/EP interop back-to back
• PCIe 6.0 protocol in FLIT mode with Lecroy Exerciser (at Cadence booth)
• PCIe 6.0 protocol in FLIT mode (at the Lecroy booth)
• PCIe 6.0 JTOL with Anritsu and Tektronix equipment (at Tektronix booth)
• PCIe 6.0 protocol with Viavi Protocol Analyzer (at Viavi booth)
• PCIe 6.0 System Level Interop Demo with Gen5 platform (at SerialTek booth)

The Cadence team and its partners did a great job in coordinating and setting up the demos that worked flawlessly. This was the culmination of many weeks of hard work and dedication. Four different vendors featured our IP for PCIe 6.0. They attracted a lot of attention and drove traffic back to us.

Highlights of Cadence demos for PCIe 7.0 and 6.0

Cadence team at the PCI-SIG Developers Conference 2024

Thanks to everyone who attended the 32nd PCI-SIG DevCon. We really appreciate your interest in Cadence IP, and a big thanks to our partners and customers for all the positive feedback and for creating so much buzz for the Cadence brand.

In the rapidly evolving landscape of automotive electronics, traditional monolithic design approaches are giving way to something more flexible and powerful—chiplets. These modular microchips, which are themselves parts of a whole silicon system, offer unparalleled potential for improving system performance, reducing manufacturing costs, and accelerating time-to-market in the automotive sector. However, the transition to working with chiplets in automotive electronics is not without its challenges.

Designers must now grapple with a new set of considerations, such as die-to-die interconnect standards, complex processes, and the integration of diverse IPs. Advanced toolsets and standardized design approaches are required to meet these challenges head-on and elevate the potential of chiplets in automotive innovation. In the following discourse, we will explore in detail the significance of chiplets in the context of automotive electronics, the obstacles designers face when working with this paradigm, and how Cadence comprehensive suite of IPs, tools, and flows is pioneering solutions to streamline the chiplet design process.

Unveiling Chiplets in Automotive Electronics

For automotive electronics, chiplets offer a methodology to modularize complex functionalities, integrate different chiplets into a package, and significantly enhance scalability and manufacturability. By breaking down semiconductor designs into a collection of chiplets, each fulfilling specific functions, automotive manufacturers can mix and match chiplets to rapidly prototype new designs, update existing ones, and specialize for the myriad of use cases found in vehicles today.

The increasing significance of chiplets in automotive electronics comes as a response to several industry-impacting phenomena. The most obvious among these is the physical restriction of Moore's Law, as large die sizes lead to poor yields and escalating production costs. Chiplets with localized process specialization can offer superior functionality at a more digestible cost, maintaining a growth trajectory where monolithic designs cannot. Furthermore, chiplets support the assembly of disparate technologies onto a single subsystem, providing a comprehensive yet adaptive solution to the diverse demands present in modern vehicles, such as central computing units, advanced driver-assistance systems (ADAS), infotainment units, and in-vehicle networks. This chiplet-based approach to functional integration in automotive electronics necessitates intricate design, optimization, and validation strategies across multiple domains.

The Complexity Within Chiplets

Yet, with the promise of chiplets comes a series of intricate design challenges. Chiplets necessitate working across multiple substrates and technologies, rendering the once-familiar 2-dimensional design space into the complex reality of multi-layered, sometimes even three-dimensional domains. The intricacies embedded within this design modality mandate devoting considerable attention to partitioning trade-offs, signal integrity across multiple substrates, thermal behavior of stacked dies, and the emergence of new assembly design kits to complement process design kits (PDKs).

To effectively address these complexities, designers must wield sophisticated tools that facilitate co-design, co-analysis, and the creation of a robust virtual platform for architectural exploration. Standardizations like the Universal Chip Interconnect Express (UCIe) have been influential, providing a die-to-die interconnect foundation for chiplets that is both standardized and automotive-ready. The availability of UCIe PHY and controller IP from Cadence and other leading developers further eases the integration of chiplets in automotive designs.

The Role of Foundries and Packaging in Chiplets

Foundries have also pivoted their services to become a vital part of the chiplet process, providing specialized design kits that cater to the unique requirements of chiplets. In tandem, packaging has morphed from being a mere logistical afterthought to a value-added aspect of chiplets. Organizations now look to packaging to deliver enhanced performance, reduced power consumption, and the integrity required by the diverse range of technologies encompassed in a single chip or package. This shift requires advanced multiscale design and analysis strategies that resonate across a spectrum of design domains.

Tooling Up for Chiplets with Cadence

Cadence exemplifies the rise of comprehensive tooling and workflows to facilitate chiplet-based automotive electronics design. Their integrations address the challenges that chiplet-based SoCs present, ensuring a seamless design process from the initial concept to production. The Cadence suite of tools is tailored to work across design domains, ensuring coherence and efficiency at every step of the chiplet integration process.

For instance, Cadence Virtuoso RF subflows have become critical in navigating radio frequency (RF) challenges within the chiplets, while tools such as the Integrity 3D-IC Platform and the Allegro Advanced Multi-Die Package Design Solution have surfaced to enable comprehensive multi-die package designs. The Integrity Signal Planner extends its capabilities into the chiplet ecosystem, providing a centralized platform where system-wide signal integrity can be proactively managed. Sigrity and Celsius, on the other hand, offer universally applicable solutions that take on the challenges of chiplets in signal integrity and thermal considerations, irrespective of the design domain. Each of these integrated analysis solutions underscores the intricate symphony between technology, design, and packaging essential in unlocking the potential of chiplets for automotive electronics.

Cadence portfolio includes solutions for system analysis, optimization, and signoff to complement these domain-specific tools, ensuring that the challenges of chiplet designs don't halt progress toward innovative automotive electronics. Cadence enables designers to engage in power- and thermal-aware design practices through their toolset, a necessity as automotive systems become increasingly sophisticated and power-efficient.

A Standardized Approach to Success with Chiplets

Cadence’s support for UCIe underscores the criticality of standardized approaches for heterogeneous integration by conforming to UCIe standards, which numerous industry stakeholders back. By co-chairing the UCIe Automotive working group, Cadence ensures that automotive designs have a universal and standardized Die-to-Die (D2D) high-speed interface through which chiplets can intercommunicate, unleashing the true potential of modular design.

Furthermore, Cadence champions the utilization of virtual platforms by providing transaction-level models (TLMs) for their UCIe D2D IP to simulate the interaction between chiplets at a higher level of abstraction. Moreover, individual chiplets can be simulated within a chiplet-based SoC context leveraging virtual platforms. Utilizing UVM or SCE-MI methodologies, TLMs, and virtual platforms serve as first lines of defense in identifying and addressing issues early in the design process before physical silicon even enters the picture.

Navigating With the Right Tools

The road to chiplet-driven automotive electronics is one paved with complexity, but with a commitment to standards, it is a path that promises significant rewards. By leveraging Cadence UCIe Design and Verification IP, tools, and methodologies, automotive designers are empowered to chart a course toward chiplets and help to establish a chiplet ecosystem. With challenges ranging from die-to-die interconnect to standardization, heterogeneous integration, and advanced packaging, the need for a seamless integrated flow and highly automated design approaches has never been more apparent. Companies like Cadence are tackling these challenges, providing the key technology for automotive designers seeking to utilize chiplets for the next-generation E/E architecture of vehicular technology.

In summary, chiplets have the potential to revolutionize the automotive electronics industry, breathing new life into the way vehicles are designed, manufactured, and operated. By understanding the significance of chiplets and addressing the challenges they present, automotive electronics is poised for a paradigm shift—one that combines the art of human ingenuity with the power of modular and scalable microchips to shape a future that is not only efficient but truly intelligent.

Learn more about how Cadence can help to enable automakers and OEMs with various aspects of automotive design.

We live in a rapidly growing “digitalized world,” with an ever-increasing need for video/music streaming, gaming, AI/machine learning, etc. All of these propel demand on modern SoC design to quickly evolve the SoC by fitting more sophisti...(read more)

The automotive industry is currently on the cusp of a radical evolution, steering towards a future where cars are not just vehicles but sophisticated, software-defined vehicles (SDV). This shift is marked by an increased reliance on automation and a significant increase in the use of sensors to improve safety and reliability. However, the increasing number of sensors has led to higher compute demands and poses challenges in managing a wide variety of data. The traditional method of using separate processors to manage each sensor's data is becoming obsolete. The current trends necessitate a unified processing system that can deal with multimodal sensor data, utilizing traditional Digital Signal Processing (DSP) and AI-driven algorithms. This approach allows for more efficient and reliable sensor fusion, significantly enhancing vehicle perception. Developers often face difficulties adhering to stringent power, performance, area, and cost (PPAC) and timing constraints while designing automotive SoCs.

Cadence, with its groundbreaking products and AI-powered processors, is enabling designers and automotive manufacturers to meet the future sensor fusion demands within the automotive sector. At the recent CadenceLive Silicon Valley 2024, Amol Borkar, product marketing director at Cadence, showcased the company's dedication and forward-thinking solutions in a captivating presentation titled "Addressing Tomorrow’s Sensor Fusion Needs in Automotive Computing with Cadence." This blog aims to encapsulate the pivotal takeaways from the presentation. If you missed the chance to watch this presentation live, please click here to watch it.

Significant Trends in the Automotive Market – Industry Landscape

We are witnessing a revolution in automotive technology. Innovations like occupant and driver monitoring systems (OMS, DMS), 4D radar imaging, LiDAR technology, and 360-degree view are pushing the boundaries of what's possible, leading us into an era of remarkable autonomy levels—ranging from no feet or hands required to eventually no eyes needed on the road.

Sensor Fusion and Increasing Processing Demands—Sensor fusion effectively integrates data from different sensors to help vehicles understand their surroundings better. Its main benefit is in overcoming the limitations of individual sensors. For example, cameras provide detailed visual information but struggle in low-light or lousy weather. On the other hand, radar is excellent at detecting objects in these conditions but lacks the detail that cameras provide. By combining the data from multiple sensors, automotive computing can take advantage of their strengths while compensating for their weaknesses, resulting in a more reliable and robust system overall.

One thing to note is that the increased number of sensors produces various data types, leading to more pre-processing.

On-Device Processing—As the industry moves towards autonomy, there is an increasing need for on-device data processing instead of cloud computing to enable vehicles to make informed decisions. Embracing on-device processing is a significant advancement for facilitating real-time decisions and avoiding round-trip latency.

AI Adoption—AI has become integral to automotive applications, driving safety, efficiency, and user experience advancements. AI models offer superior performance and adaptability, making future-proofing a crucial consideration for automotive manufacturers. AI significantly enhances sensor fusion algorithms, offering scalability and adaptability beyond traditional rule-based approaches. Neural networks enable various fusion techniques, such as early fusion, late fusion, and mid-fusion, to optimize the integration and processing of sensor data.

Future Sensor Fusion Needs

Automotive architectures are continually evolving. With current trends and AI integration into radar and sensor fusion applications, SoCs should be modular, flexible, and programmable to meet market demands.

Heterogeneous Architecture- Today's vehicles are loaded with various sensors, each with a unique processing requirement. Running the application on the most suitable processor is essential to achieve the best PPA. To meet such requirements, modern automotive solutions require a heterogeneous compute approach, integrating domain-specific digital signal processors (DSPs), neural processing units (NPUs), central processing unit (CPU) clusters, graphics processing unit (GPU) clusters, and hardware accelerator blocks. A balanced heterogeneous architecture gives the best PPA solution.

Flexibility and Programmability- The industry has come a long way from using computer vision algorithms such as HOG (Histogram Oriented Gradient) to detect people and objects, HAR classifier to detect faces, etc., to CNN and LSTM-based AI to Transformer models and graphical neural networks (GNN). AI has evolved tremendously over the last ten years and continues to evolve. To keep up with the evolving rate of AI, SoC design must be flexible and programmable for updates if needed in the future.

Addressing the Sensor Fusion Needs with Cadence

Cadence offers a complete suite of hardware and software products to address the increasing compute requirements in automotive. The comprehensive portfolio of Tensilica products built on the robust 32-bit RISC architecture caters to various automotive CPU and AI needs. What makes them particularly appealing is their scalability, flexibility, and configurability, offering many options to meet diverse needs.

The Xtensa family of products offers high-quality, power-efficient CPUs. Tensilica family also includes AI processors like Neo NPUs for the best power, performance, and area (PPA) for AI inference on devices or more extensive applications. Cadence also offers domain-specific products for DSPs such as HIFI DSPs, specialized DSPs and accelerators for radar and vision-based processing, and a general-purpose family of products for floating point applications.

The ConnX family offers a wide range of DSPs, from compact and low-power to high-performance, optimized for radar, lidar, and communications applications in ADAS, autonomous driving, V2X, 5G/LTE/4G, wireless communications, drones, and robotics. Tensilica's ISO26262 certification ensures compliance with automotive safety standards, making it a trusted partner for advanced automotive solutions. The Cadence NeuroWeave Software Development Kit (SDK) provides customers with a uniform, scalable, and configurable ML interface and tooling that significantly improves time to market and better prepares them for a continuously evolving AI market. Cadence Tensilica offers an entire ecosystem of software frameworks and compilers for all programming styles.

Tensilica's comprehensive software stack supports programming for DSPs, NPUs, and accelerators using C++, OpenCL, Halide, and various neural network approaches. Middleware libraries facilitate applications such as SLAM, radar processing, and Eigen libraries, providing robust support for automotive software development.

Conclusion

Cadence’s Tensilica products offer a development toolchain and various IPs tailored for the automotive industry, covering audio, vision, radar, unified DSPs, and NPUs. With ISO certification and a robust partner ecosystem, Tensilica solutions are designed to meet the future needs of automotive computing, ensuring safety, efficiency, and innovation.

Learn More

• Cadence Automotive Solutions
• Cadence Automotive IP
• Sensor Fusion and ADAS in TSMC Automotive Processes
• Revolution on the Road: How Cadence is Driving the Future of Automotive Design!
• Taming Design Complexity in Chiplet-Based Automotive Electronics
• UCIe and Automotive Electronics: Pioneering the Chiplet Revolution

Cadence tapes out 32G UCIe interface IP for high speed, highly efficient chiplet designs and demonstrate high data rate performance in TSMC's 3nm technology(read more)

As vehicles transition into interconnected ecosystems, artificial intelligence and advanced technologies become increasingly crucial. Infotainment systems have evolved beyond mere music players to become central hubs for connectivity, entertainment, and navigation. With global demand for comfort, convenience, and safety rising, the automotive infotainment market is experiencing significant growth. Valued at USD14.99 billion in 2023, it is projected to grow at a compound annual growth rate (CAGR) of 9.9% from 2024 to 2030.

To keep pace with this evolution, infotainment systems must accommodate a range of workloads, including audio, voice, AI, and vision technologies. This requires a flexible, scalable Digital Signal Processor (DSP) solution that acts as an offload engine for the main application processor. Integrating a single DSP for varied functions offers a cost-effective solution for high-performance, low-power processing, which aligns well with the needs of Electric Vehicles (EVs).

If you missed the detailed presentation by Casey Ng, Product Marketing Director at Cadence at CadenceLIVE 2024, register at the CadenceLIVE On-Demand site to access it and other insightful presentations. Stay ahead of the curve and explore the future of innovative electronics with us.

Cadence Infotainment Solution: Leading the Charge

Cadence Tensilica HiFi DSPs play a crucial role in enhancing audio capabilities in vehicle infotainment systems. They support applications like voice recognition, hands-free calling, and deliver immersive audio experiences. This technology is also paramount for features such as active noise control, which reduces road and cabin noise, and acoustic event detection for identifying unusual sounds like broken glass. One notable innovation is the "audio bubble," enabling personalized audio zones within the vehicle, ensuring passengers enjoy distinct audio settings.

Cadence HiFi DSP technology enriches the driving experience for electric vehicles by mimicking traditional engine sounds, while its advanced audio processing ensures optimal performance across various digital radio standards. It significantly contributes to noise reduction, hence improving the cabin experience. Integrating a Double Precision Floating Point Unit (FPU) stands out, as it upgrades audio performance and Signal-to-Noise Ratio (SNR) through efficient 64-bit processing, allowing control over numerous speakers without hitches.

These advancements distinguish the DSP as an essential tool in evolving infotainment systems, offering unmatched performance and adaptability. Tensilica HiFi processors, crucial to advanced infotainment SoCs, serve as efficient offload processors, augmenting real-time execution and energy efficiency. Cadence’s ecosystem, with over 200 codecs and software partnerships, propels the evolution of innovative infotainment systems. Introducing the HiFi 5s DSP marks a new era in connected car experiences, setting the stage for groundbreaking advancements.

Exploring Tomorrow with HiFi 5s DSP Technology

The HiFi 5s represents the apex of audio and AI digital signal processing performance. Built on the Xtensa LX8 platform, it introduces capabilities like auto-vectorization, which allows standard C code to be automatically optimized for performance. This synergy of hardware and software co-design marks a significant step forward in DSP technology. By leveraging its extended Single Instruction, Multiple Data (SIMD) capabilities alongside features like a double-precision floating-point unit (DP_FPU), the HiFi 5s delivers unparalleled precision and speed improvements in signal and audio processing tasks. Equally notable are its branch prediction and L2 cache enhancements, which optimize system performance by refining the control code execution and recognizing codec efficiency. The application of such enhancements are particularly beneficial in real-world scenarios.

AI-Powered Audio

Cadence's focus on AI integration with the HiFi 5s demonstrates significant improvements in audio clarity through AI-powered solutions.

• AI models learn from real-world data and adapt dynamically, while classic DSP algorithms rely on fixed rules.
• AI can be fine-tuned for specific scenarios, whereas classic DSP lacks flexibility.
• AI handles extreme and marginal noise patterns better, generalizes well across different environments, and is robust against varying noise characteristics.

Cadence's dedication to artificial intelligence marks a pivotal shift in audio processing. Traditional DSP algorithms, bound by rigid rules, are eclipsed by AI's ability to learn dynamically from real-world data. This adaptability equips AI models to tackle challenging noise patterns and offer unmatched clarity even in noisy environments, making them ideal for automotive and consumer audio applications.

Realtime AI-Optimized Speech Enhancements by OmniSpeech and ai|coustics

OmniSpeech

Our partner, OmniSpeech, has advanced AI-based audio processing that enhances the performance of audio software, specifically for omnidirectional and dipole microphones. Impressively, their technology operates with less than 32MHz and requires only 418kB of memory.

Test results show that background noise is significantly reduced when AI employs a single omnidirectional microphone, outperforming non-AI solutions. Additionally, when using a dipole microphone with AI, there is a 3.5X improvement in the weighted Signal-to-Noise Ratio (SNR) and more than a 28% increase in the Global Mean Opinion Score (GMOS) across various background noise.

ai|coustics

ai|coustics, a Cadence partner specializing in advanced audio technologies, utilizes real-time AI-optimized speech enhancement algorithms. They leverage an extensive speech-quality dataset containing thousands of hours and 100 languages to transform low-quality audio into studio-grade audio. Their process includes:

• De-reverb, which eliminates room resonances, echoes, and reflections

• Removing artifacts from downsampling and codec compression

• Dynamic and adaptive background noise removal

• Reviving audio materials with analog and digital distortions

• Providing support for all languages, accents, and a variety of speakers

Applications include:

• Automotive: Enhances clarity of navigation commands and communication for driver safety

• Consumer audio: Improves voice clarity for better dialogue understanding in TV programs. Optimizes speech intelligibility in communication for both uplink and downlink audio streams

• Smart IoT: Boosts voice command detection and response quality

Performance Enhancements

The advancements in branch prediction and L2 cache integration have significantly boosted performance metrics across various systems. With HiFi 5s, branch prediction increases codec efficiency by an average of 5%, reaching up to 16% in optimal conditions. L2 cache improvements have drastically enhanced system-level performance, evidenced by a 2.3X boost in EVS decoder efficiency. Adding MACs and imaging ISA in imaging use cases has led to substantial advancements. When comparing HiFi 5s to HiFi 5, imaging ISA performance improvements range with >60% average performance improvements.

The Crescendo of the Future

As Cadence continues to blaze trails in DSP technology, the HiFi 5s emerges as the quintessential solution for consumer and automotive audio use cases. With a robust framework for auto-vectorization, an unmatched double-precision FPU, AI-driven audio solutions, and comprehensive system enhancements, Cadence is orchestrating the next era of audio processing, where every note is clearer, every sound richer, and every experience more engaging. It is not just the future of audio—it's the future of how we experience the world around us.

 Discover how Cadence Automotive Solutions can transform your business today!

Staying ahead of the curve is essential to meeting customer needs. Cadence has consistently demonstrated its commitment to innovation, and its latest IP portfolio available on TSMC's 3nm (N3) process is no exception. Today, rapid advancements in AI/ML, hyperscale computing (HPC), and the automotive industry are driving significant changes in technology. Let's explore the impressive array of IP that Cadence offers on this advanced node.

Memory Solutions: High-Speed and Power-Efficient

Cadence's DDR5 12.8G MRDIMM IP supports the highest speed grade Gen2 MRDIMMs and features a fully hardened PHY optimized to the customer's floorplan. The LPDDR5X IP is silicon-proven at 9.6Gbps and is ideal for power-sensitive applications, offering a fully integrated memory subsystem.

GDDR7: Leading the Way in Graphics Memory

Cadence has achieved a significant milestone with the world's first silicon-proven GDDR7 IP, supporting data rates up to 32Gbps. This IP offers the best price/performance ratio for AI interfaces, making it a game-changer in the graphics memory domain.

PCIe and CXL Solutions: Robust and Reliable

Cadence's PCIe 3.0 IP is a mature and production-proven solution available across a wide range of process nodes from 28nm to 3nm. It offers a versatile multi-link architecture for optimum SoC configurability and flexible use cases. The PCIe 6.0 and CXL 3.x solutions are silicon-proven, power-optimized, and highly robust, with jitter-tolerant capabilities. These IP are the only subsystem proven with eight lanes of controller and PHY in silicon, ensuring interoperability with leading test vendors and OEMs.

UCIe PHY: Setting New Standards

The UCIe PHY IP from Cadence are set to be generally available after successful silicon characterization in both standard and advanced package options on the TSMC N3 (3nm) process. These IP demonstrate significantly better power, performance, and area (PPA) metrics than the specifications, with a bit error rate (BER) better than 1E-27 compared to the spec of 1E-15. The power consumption is also notably lower than the spec limit, ensuring a simpler integration with a best-in-class power profile.

112G PHY IP: Pushing the Boundaries of Performance

Cadence's 112G PHY IP are designed to meet the demands of high-speed data transmission. The 112G-ULR PHY IP, characterized in the 3nm process, showcases exceptional performance with support for insertion loss over 45dB at data rates ranging from 1.25Gbps to 112.5Gbps. This IP is optimized for both power and area, making it a versatile choice for various applications. The 112G-VSR/MR PHY IP also stands out with its excellent power and performance metrics, making it ideal for short-reach applications and optical interconnects. Additionally, the 112G PAM4 PHY solutions cater to hyperscale, AI, HPC, and optics applications, featuring a mature DSP-based SerDes architecture with advanced techniques such as reflection cancellation.

Cadence's IP portfolio on TSMC N3 shows innovation and expertise to solve today's design challenges. From high-speed PHY IP to robust PCIe and CXL solutions and advanced memory IP, Cadence continues to lead the way in semiconductor IP development. These solutions not only meet but exceed industry standards, ensuring that customers can confidently achieve their design goals. Stay tuned for more updates on Cadence's groundbreaking advancements in semiconductor technology.

Learn more about Cadence IP and other silicon solutions.

LEF allows the same port with multiple shape definitions. Does anybody know if innovus can create multiple duplicate shapes associated with the same port? Assume they are connected outside the block with perfect timing synchronization. Thank you!

Hi there, 

we've encountered some strange behavior when trying to run the "check_litho" command from within INNOVUS 22.14. We set the required files and configuration files according to our PDK documentation. The command, without the absolute file paths, is:

check_litho -sign_off -cpu 96 -run_mode fg -create_guides -map_file <map file path> -config <config file path> -techfile <tech file path> -dir <output dir path> -write_stream_options "-mode ALL -merge <list of gds files>" -apply squishHints

We are currently using PEGASUSDFM 23.20 for this command but tested previous PEGASUSDFM and MVS versions as-well. After we issued the previous command, we see INNOVUS launching the PEGASUSDFM/MVS and trying to run the command. After some time, the command crashes with the error "mdb_load_with_extra: failed to pre-open extra input file './preproc/INTERMEDIATE.oas' for read". We have tested a similar setup with INNOVUS 19.10 where we did not have this issues. Did something change with the new INNOVUS version? Does anyone have an idea what we are missing? 

Thanks in advance.

Best regards,

PS

Hi everyone,

I'm designing a digital chip that will be fabricated. I have a HDL top module that includes several submodules inside it. I want to define the position of some of the submodules during the PnR so that later I can specify there positions in the Micrograph photo after the IC fabrication. When I perform the PnR using Innovus, I always got a layout shape where the submodules seems to be flatted. I wonder if there is a way to specify the placement of each submodule in my top module  (maybe in the tcl file) during the PnR so later I can define there positions in the micrograph photo. 

Thanks in Advance!

Hi everyone,

I'm new to using Innovus and I'm encountering an issue while trying to perform the "init_design" command. My goal is to perform the place and route. Here are the commands I'm using:

``
set init_verilog ./test.v
set init_top_cell TEST
set init_pwr_net {VDD VDD_2 VDD_3}
set init_gnd_net {VSS VSSA}
set init_lef_file { /home/laumecha/uw_openroad_free45/pdk/Drexel-ECEC575/Encounter/NangateOpenCellLibrary/Back_End/lef/NangateOpenCellLibrary.lef}
set init_mmmc_file {./viewDefinition.tcl}
init_design
```

However, I receive the following error:

```
#% Begin Load netlist data ... (date=06/04 12:07:50, mem=1478.7M)
*** Begin netlist parsing (mem=1439.0M) ***
Created 0 new cells from 0 timing libraries.
Reading netlist ...
Backslashed names will retain backslash and a trailing blank character.
**ERROR: (IMPVL-209):   In Verilog file './test.v', check line 16 near the text # for the issue: 'syntax error'.  Update the text accordingly.
Type 'man IMPVL-209' for more detail.
Verilog file './test.v' has errors!  See above.

*** Memory Usage v#1 (Current mem = 1439.027M, initial mem = 634.098M) ***
#% End Load netlist data ... (date=06/04 12:07:50, total cpu=0:00:00.0, real=0:00:00.0, peak res=1478.7M, current mem=1478.7M)
**ERROR: (IMPVL-902):   Failed to read netlist ./test.v. See previous error messages for details.  Resolve the issues and reload the design.
```

However, the file works perfectly in Genus.

It seems there is a syntax error in my Verilog file at line 16, but I'm not sure how to resolve it. Any guidance or suggestions would be greatly appreciated.

Thanks in advance!

I am trying to remove the cdn_loop_breaker cells from the netlist. 
When I tried the below 2 things, genus synthesis tool removing the cdn_loop_breaker cells but while connecting the cdn_loop_breaker cell input to its proper connection, its somehow misleading the connections

Things i tried:
1.  remove_cdn_loop_breaker -instances *cdn_loop_breaker*
then i just ran remove_cdn_loop_breaker  comand without the -instances switch
2. remove_cdn_loop_breaker  
     
both of the above things are not providing the proper connections after removing the loop_breaker_cells

can anyone suggest the best possible workaround for this please?