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The Kerala High Court has quashed a criminal case against film director Sreekumar Menon who was accused by a prominent Malayalam actress of abusing and defaming her.

“What’s our plan if we get hit by a big flood?” While this question may be plenty familiar to emergency management professionals, city administrators, legislators, and other leaders in coastal regions that are known for their exposure to potentially disastrous weather events, these days it’s being asked in some unexpected [...]

The post Four technology tips for government leaders preparing for flood disasters appeared first on Government Data Connection.

September honors Recovery Month, emphasizing hope for recovery in behavioral health, especially from substance use disorders (SUD). A key motto of Recovery Month is that Recovery Happens, helping people know that even at rock bottom, things can improve.  We all need that hope at various points in our lives. Often, [...]

The post Data provides hope: Honoring Recovery Month  appeared first on Government Data Connection.

Fight back against sophisticated money launderers with these 3 techniques.

The post 3 techniques to improve AML transaction monitoring strategies appeared first on The Data Roundtable.

The prankster claims that as many as seven schools fell prey to his prank and made the hats.

[SAPS] - Five suspects are appearing in the Kariega Magistrate's Court today, after they were arrested and found in possession of cycads with an estimated value of R1 Million on Friday 08 November 2024.

[SAPS] One hundred and seventy one (171) murder suspects, 261 attempted murder suspects and 250 suspected rapists were among 12 593 suspects who were arrested during various operations by police in KwaZulu-Natal in the month of October. During such operations police also managed to recover 345 firearms and 2 998 rounds of ammunition of various calibre of firearms. Among the recovered firearms were 23 rifles and 17 homemade illegal guns.

The demand for higher-performance computing is greater than ever. Cutting-edge applications in artificial intelligence (AI), big data analytics, and databases require high-speed memory systems to handle the ever-increasing volumes and complexities of data. Advancements in cloud computing and machine virtualization are stretching the limits of current capabilities. AI applications hosted in the cloud rely on fast access and reduced latency in memory systems, which is amplified by an increasing number of CPU and GPU cores.

Introducing the DDR5 Multiplexed Rank DIMM (MRDIMM), the next-generation memory module technology designed to meet the needs of high-performance computing (HPC) and AI in cloud applications. By leveraging existing DDR5 DRAM memory devices, MRDIMM modules not only double the DRAM data rate but also maintain the RAS capabilities of the industry-proven RDIMM modules, setting a new precedent for memory module performance.

Let’s compare RDIMM and MRDIMM modules using the same DRAM parts. Today, high-speed production DDR5 RDIMM modules run at 5600Mbps. Those modules use DDR5 DRAM parts, which also run at 5600Mbps. An MRDIMM module using the same DDR5 5600Mbps DRAM parts will run at a blazing 11.2Gbps.

One key metric for best-in-class performance, low bit error rate (BER), and ease of adoption is the eye diagram. The eye diagram illustrates at-speed system margin and accurately represents DDR system quality when captured with a pseudo-random binary sequence (PRBS)-like pattern. The diagram below illustrates Cadence’s 3nm silicon write eye diagram for DDR5 MRDIMM IP running at 12.8Gbps.

Cadence 3nm DDR5 MRDIMM 12.8Gbps test chip write eye diagram, design kit is available today

The eye diagram is captured using a PRBS-like pattern, incorporating a package and system board representative of a typical MRDIMM channel. Using PRBS-like patterns is crucial for capturing accurate eye diagrams. Repetitive clock-like data patterns create deceptively “open eyes” that do not reflect the real system performance. Effects like intersymbol interference, simultaneous switching, reflections, and crosstalk are not accurately reflected in the eye diagrams for parallel interfaces like DDR using non-random data streams. Relying on improperly captured eye diagrams inevitably leads to a significantly worse real system BER than conveyed by that eye diagram.

Doubling the DDR5 RDIMM data rate is challenging. Achieving high performance while optimizing for area and power requires multiple design techniques. Feed-forward equalization (FFE), decision feedback equalization (DFE), continuous-time linear equalization (CTLE), and T-coils are required to reach 12.8Gbps MRDIMM data rates in multi-channel systems. Building a production-worthy 12.8Gbps DDR5 MRDIMM IP requires engineering expertise that comes from many generations of memory interface design and production experience. Cadence has developed this expertise through multiple DDR5/4, LPDDR5X/5, and GDDR6 designs in different technology nodes and foundries. For instance, Cadence’s GDDR6 IP is available in three foundries and ten process nodes, with mass production at speeds exceeding 22Gbps.

For your next project, consider DDR5 12.8Gbps MRDIMM, a technology that not only doubles the bandwidth of DDR5 RDIMM but also promises rapid proliferation into next-generation AI, data center, HPC, and enterprise applications. With its cutting-edge capabilities, the Cadence DDR5 12.8Gbps MRDIMM IP is ready to power the future of computing.

Hi everyone,

I'm designing a digital chip that will be fabricated. I have a HDL top module that includes several submodules inside it. I want to define the position of some of the submodules during the PnR so that later I can specify there positions in the Micrograph photo after the IC fabrication. When I perform the PnR using Innovus, I always got a layout shape where the submodules seems to be flatted. I wonder if there is a way to specify the placement of each submodule in my top module  (maybe in the tcl file) during the PnR so later I can define there positions in the micrograph photo. 

Thanks in Advance!

Hello All,

How do we control the Always on buffering for a power domain called B in Power domain A.

here B-power domain nets going through A , hence tool is inserting Always on buffers.

How do we avoid this specific power domain ?

Thanks,
Bshaik

I am attempting to use dbGetNeighbor() function inside the dynamic display HUD so that the distance to the next metal on that layer could be viewed. Think of another line in this dynamic table here... 

My SKILL code is essentially the following:

procedure(getNearestNeighborOnMetal(cv)
let((direction tmpBoundingBox)
direction = internal_function()
tmpBoundingBox = dbCreateRect(geGetEditCellView() "tmp" list(hiGetCommandPoint() hiGetCommandPoint()))
car(dbGetNeighbor(geGetEditCellView() tmpBoundingBox direction))
)
)

this returns the distance to the closest metal based on some tests.

Next, I try to register this function to work in the Dynamic Display / Info Balloon world by executing odcRegisterCustomFunc() for each and every object type (I know, absurd, but trying to debug)

In the dynamic display menu, I toggle the "Custom SKILL Function" check in layoutXL, then hit apply, then OK.

After this I find I am unable to view the changes reflected in any info balloons or in the drawing HUD (above) for this wire. I have tried replacing my function with the sample "customFunc" from the odcRegisterCustomFunc() documentation and was still unable to produce any new output.

Any help diagnosing the use of this feature would be very much appreciated

Hello,

When I draw a Fluid Guard Ring in Virtuoso, the layout is not visible, and instead, "do_something=nil" appears.

When I check the details with Q, it shows the same information as a regular NFGR guard ring, and Ctrl+F also displays the instance name, just like with a regular NFGR. 

Additionally, the Pcells of Fluid Guard Rings from previous projects appear broken. 

The version I’m currently using is not different from the one used in the past. Even when I access the same version as the one used during the project, the Pcells still appear broken.

These two issues are occurring, and I’m not sure what to check. I would greatly appreciate it if you could assist me in resolving this issue.

//

Hi,

My query is regarding importing of layout.

After importing, we see that the imported transistor instances and vias are all referring to the library in which they are imported, instead of referring to the technology library.

Please let me know how we can refer them to the technology library.

Will surely provide more details if my query is unclear.

Thanks,

Mallikarjun.

Disappearing toolbar or docked menu

Is there a way for the toolbar or floating menu from disappearing when a cells tab is added to a window?

I have created a skill toolbar and it disappeared when I add another cell or tab to a window.

The only toolbars that stay are the ones I have defined in the Layout.toolbar file.

Do I have to add a trigger to keep the toolbars visible or not disappearing from the window?

Cadence version IC23.1-64b.ISR7.27

Paul

Cadence AWR Design Environment Software Featured in Multiple Training Course Options: Live and Virtual Starting in October(read more)

AWR V22.1 software introduces the Pointer-Hybrid optimization method which uses a combination of optimization methods, switching back and forth between methods to efficiently find the lowest optimization error function cost. The optimization algorithm automatically determines when to switch to a different optimization method, making this a superior method over manual selection of algorithms. This method is particularly robust in regards to finding the global minima without getting stuck in a local minima well.(read more)

Are you ready to revolutionize your RF design experience? Look no further! Cadence AWR software is your gateway to mastering the intricacies of Radio Frequency (RF) circuit design, and now, you can explore its power with our exclusive Free Academic T...(read more)

By default, a dielectric must separate each pair of conductor layers in the cross-section of a design. In rare cases, this does not represent the real, manufactured substrate.

If your design requires you to have conductor layers that are not separated by a dielectric (such as, for half-etch designs), there is a variable that needs to be set in Allegro X APD. You must set this by enabling the variable icp_allow_adjacent_conductors. This entry, and its location in the User Preferences Editor, are shown in the following image.

The Objects on adjacent conductor layers do not electrically connect together, automatically. A via must be used to establish the inter-layer connections.

When enabling this option, it is recommended to exercise caution because excluding dielectric layers from your cross-section can lead to inaccurate calculations, including the calculations for signal integrity and via heights. It is important that your cross-section accurately reflect the finished product to ensure the most accurate results possible. Any dielectric layers present in the manufactured part need to be in the cross-section for accurate extraction, 3D viewing, and so on.

Let us know your comments on the various designs that would require adjacent conductor layers.

Power and Ground rings are exposed rings of metal surrounding a die that supply power/ground to the die and create a low-impedance path for the current flow. These rings ensure stable power distribution and reduce noise. Allegro X Package Designer Plus has a utility called Power/Ground Ring Generator which lets you define and place one or more shapes in the form of a ring around a die.

 To run the PWR/GND Generator Wizard, go to Route > Power/Ground Ring Generator or type "pring wizard" in the APD command window to invoke the Wizard.

This Wizard lets you define and place one or more shapes in the form of a ring around a die. The Power/Ground Ring Wizard creates up to 12 rings (shapes) at a time. If you require more rings, you can run the Power/Ground Ring Wizard as many times as needed. This command displays a wizard in which you can specify:

• The number of rings to be generated
• The creation of the first ring as a die flag (Die flag is the boundary of the die like the power ring.)
  • If you create a die flag and the first ring is the same net as the flag, you can enter a negative distance to overlap the ring and the die flag.
• Multiple options for placement of the rings with respect to:
  • Origination point
  • Distance from the edge of the die
  • Distance from the nearest die pin on each die side
• The reference designator of the die with which the rings will be used
• The distance between rings
• The width of each ring
• The corner types on each ring (arc, chamfer, and right-angle)
• An assigned net name for each ring
• A label for each ring

The rings are basic in nature. For other shape geometries or split rings, choose Shape > Polygon or Shape > Compose/Decompose Shape from the menu in the design window.

Depending on the options selected, the Power/Ground Ring Wizard UI changes, representing how the rings will be created. Verify the Wizard settings to ensure that the rings are created as intended.

1. When the Power/Ground Ring Wizard appears, set the number of rings to 2, accept the other defaults, and click Next. You can set Create first ring as die flag to create a basic die flag.

         2. Define Ring 1 and the net associated with it.

              a) Browse and choose Vss in the Net Names dialog box.

            b) Click OK.

            c) Specify the label as VSS.

            d) Click Next.

             The first ring should appear in your design. It is associated with the proper net; in this case, VSS.

2. For the second ring, choose the net as Vdd and specify the label as VDD.
3. Click Next.
4. Click Finish in the Result Verification screen to complete the process.

The completed rings appear as shown below.

Now, when you click on Power and Ground Die Pin and add wirebonds, you will see that the wirebonds are placed directly on the Power and Ground rings.

Hearing is one of the most essential senses for engaging with the world. It enables us to converse, appreciate music, and remain alert to our surroundings. Hearing loss is a prevalent issue affecting millions of individuals globally and disconnecting them from a world where sound is vital to others and the environment. The World Health Organization (WHO) reports that over 5% of the global population requires hearing rehabilitation, a striking statistic highlighting this issue's pervasive nature. Technology has transformed audiology, evolving from simple ear trumpets to sophisticated modern hearing aids. This advancement began with the invention of the transistor, paving the way for devices that are fully wearable inside or behind the ear. Although hearing aids have been available for many years, historically, access to these critical devices has been insufficient, resulting in numerous individuals lacking the necessary support. However, recent advances in hearing aid technology promise improved acoustic experiences, employing modern techniques like binaural processing and neural networks. These innovations demand sophisticated architecture to balance high memory needs with low power consumption in a user-friendly design. Cadence is at the forefront of this technological evolution, offering tools and IP solutions that enhance the accessibility, efficiency, and impact of hearing aids, paving the way for a more inclusive future. This blog explores how Cadence's advanced DSPs are transforming hearing aid design and making them more accessible, efficient, and impactful. Hearing Aids: A Testament to Human Ingenuity The transition from analo g to digital technology in the late 20th century further transformed hearing aids, offering superior sound quality, customization, and the ability to connect to various electronic devices, thus enhancing the user experience markedly. Today's hearing aids are highly effective, versatile, and nearly invisible, a significant advancement from early attempts to address hearing loss. They also feature advanced noise cancellation and connectivity options, allowing users to integrate seamlessly into the digital world. This progression not only highlights the industry's commitment to improving user experience and accessibility but also offers a glimpse into a future where hearing loss is no longer a barrier. Challenges Despite advancements and sophistication, there are several challenges related to hearing aid design and adoption. Users demand smaller, more discreet devices that don't sacrifice performance. While the shift towards sleeker designs is aesthetically pleasing, it introduces substantial complexities in product design. Designers face the challenges of integrating essential components, such as batteries and peripherals, into increasingly compact spaces. Power consumption remains a critical concern, as these devices must remain operational throughout the day. Leveraging neural networks to enhance the signal-to-noise ratio (SNR) for better quality demands additional memory capacity. Consequently, there is a pressing need for flexible, low-power architectures that incorporate all necessary memory and peripherals without compromising the device’s compact size. Adopting AI for adjusting hearing aid volume to fit an individual's specific auditory requirements is a significant challenge and demands more memory and effort. Besides this, reliability and cost are significant challenges for manufacturers. Cadence's Role in Transforming Hearing Aids In hearing aid development, the capacity to evaluate the energy efficiency of SoCs across different frequencies in real time is crucial. These applications demand cohesive, energy-efficient solutions that can uphold high performance. The Cadence Tensilica HiFi and Fusion F1 DSP family emphasize minimal power usage while providing robust performance, ideally suited for a wide range of audio and voice applications. The Cadence Tensilica HiFi DSP family, a high-performance audio technology with AI acceleration and advanced DSP capability, offers feature-rich audio, speech, and imaging for wearables, automotive, home entertainment, digital assistants, and ASR. The Tensilica HiFi DSP family accelerates innovation with its comprehensive instruction set and supports fixed- and floating-point data types. Simplifying software development, it offers C/C++ programming, an auto-vectorizing compiler, and a rich DSP software library through the Cadence Tensilica Xplorer development environment. With the flexibility to customize and enhance performance through additional instructions and better I/O bandwidth, the Tensilica HiFi and Fusion DSP families offer a robust, low-energy audio solution compatible across an expansive software ecosystem for various applications and devices. Conclusion Technological advancements are driving hearing aid evolution; the future of hearing aids lies in further miniaturization and functionality enhancement. Cadence's ongoing innovations aim to improve signal processing and noise reduction, even in challenging environments. The integration of neural networks promises more apparent sound transmission and greater adaptability. Cadence is working on improving how these devices process signals and reduce noise and has initiated a collaborative venture with distinguished entities like GlobalFoundries (GF), Hoerzentrum Oldenburg gGmbH, and Leibniz University Hannover. This collaboration has borne fruit in the form of the industry's first binaural hearing aid system-on-chip (SoC) prototype, the Smart Hearing Aid Processor ( SmartHeAP ). Learn More Cadence, GlobalFoundries, Hoerzentrum Oldenburg and Leibniz University Hannover Collaborate to Advance Hearing Aid Technology Cadence Extends Battery Life and Improves User Experience for Next-Generation Hearables, Wearables and Always-On Devices Advancing the Future of Hearing Aids with Cadence Bluetooth LE Audio, Hearing Aids, and Mindtree

Celebrated for their unparalleled engineering expertise and pioneering mindset, McLaren stands at the forefront of innovation. Theirs is a story of engineering excellence, a symphony of speed driven by the relentless pursuit of aerodynamic perfection. In 2022, Cadence was named an Official Technology Partner of the McLaren Formula 1 Team. The multi-year partnership between McLaren and Cadence has helped redefine the boundaries of what’s possible in Formula 1 aerodynamics. Shaving off a fraction of a second per lap can make all the difference in a podium finish, and track conditions bring layers of complexity to the design process. That’s where Cadence steps in with Fidelity CFD Software. The Cadence Fidelity CFD software is a comprehensive suite of computational fluid dynamics (CFD) solutions. Access to this solution allows the McLaren F1 team to accelerate their CFD workflow, enabling them to assess designs faster and more precisely. It also allows them to investigate airflows and tackle design projects that require advanced compute power and precision. With Fidelity Flow’s solver capabilities and Python-driven automation, Cadence’s CFD software aids the advancement of aerodynamic simulations that go into McLaren’s F1 cars. With a customized, high-quality, multi-block meshing strategy and optimized workflow, Fidelity CFD makes design exploration more automated, thereby helping establish a strong foundation for McLaren’s future success on the track. Lando Norris, F1 driver for McLaren, said, “As a driver, I saw the impact of every decision made in the design room in every simulation run. The work on aerodynamics directly translates to the confidence I have on track, the grip in every turn, and the speed on every straight. This partnership, this technology, is what will give us the edge. It's not just about battling opponents; it's about mastering the airflow around the car in every driving condition on every track.” If you’re interested in learning more about the importance of CFD in McLaren’s racing success, be sure to attend our upcoming webinar, “CFD and Experimental Aerodynamics in McLaren F1 Engineering.” Christian Schramm, McLaren’s director of advanced projects, and Cadence’s Benjamin Leroy will be the main speakers for the event. Register today to secure your spot! For more insights on the Formula 1 car design process, take a look at the case study, “ McLaren Formula 1 Car Aerodynamics Simulation with Cadence Fidelity CFD Software .” Learn more about how McLaren and Cadence are engineering success . “Designed with Cadence” is a series of videos that showcases creative products and technologies that are accelerating industry innovation using Cadence tools and solutions. For more Designed with Cadence videos, check out the Cadence website and YouTube channel .

Hi 

I am looking into chamfering the edge of PCB for Board edge connectors. I have performed fillet command earlier but new to chamfering.

Below is the description :

As seen above, the PCB edge are chamfered in thickness as well as at the corners.

Using OrCAD PCB hotfix S023.

Hello,

I am aware of command script .svcf file that saves signals and loads them in while opening Simvision.

I am wondering, if there is a way for saving signals while we are in an interactive session and loading them next time when we open Simvision interactively.

Any ideas on how to do this?

Thank you in advance.

Swetha. C

Hello,

First, I had something working that broke in the past few versions that I've been meaning to get working again. There was some setting I recall in the GUI that allowed me to have inputs be placed in the waveform viewer with yellow traces, and output signals with orange traces to match the name colors. How can I set this to happen in the .simvisionrc file?

Second, I would like to add something to my .simvisionrc file to go through foreach signal and depending on key locations based on the signal's Path.Name (mainly the model and design areas) such that if the path contains "mon", then to auto-set the trace and name colors to something such as cyan. I'd like to have loops for various key areas of the design to color-code the signals.

Third, I am interested if there is a possibility of coloring names/traces foregound colors to based on which position they are in the waveform viewer to make banding, ideally such that every three (or whatever) are one color (or a color mutation, adding some gray to signals colorized by the auto-coloring mentioned already, etc) that allows for the signal names/traces to be colorized along with the built-in optional black/gray background banding.

Thanks in advance

Hi,
My Virtuoso and Spectre Version: ICADVM20.1-64b.NYISR30.2
I plot an eye diagram using a built in function. I want to see the data-dependent jitter. I want to measure the eye diagram edges at zero crossing (width of that diamond part) shown in the pic by vertical and horizontal markers. I can put a marker and read the numbers there and get what I want. But now I want to run Monte Carlo and I can't do this for all samples. I wish I could write an expression for this. Unfortunately, I see that the function "cross" is not working on the eye diagram. Basically, when I send the eye diagram data to a table, I see that it actually is just the prbs data and not the eye diagram data. Is there a hack that can help me achieve my goal which is: having an expression to measure the edges of the eye diagram at zero crossing?
There is a script that Andrew wrote (https://support.cadence.com/wps/mypoc/cos?uri=deeplinkmin%3AViewSolution%3BsolutionNumber%3D11395772). This is a good script but it puts all edges on top of each other. I want to distinguish the two edges. In the attached pic (two-period eye diagram) you can see what I mean by the two edges (diamond shapes). I want to measure each of the two and take the maximum. Having all the edges on top of each other won't give me what I want. All edges together will lso include DCD. I purely want to measure DDJ. DCD is measured separately. I have very little experience with writing scripts and could not modify Andrew's script.
Your help is much appreciated. Thank you.

Hi I noticed that some figures from the old posts in the cadence blogs have been missing.

I think this problem happened before and Andrew Beckett asked the original author to fix the issue:

 Figures missing in the RF Design Blogs article of "Measuring Fmax for MOS Transistors" 

Some of these posts are quite valuable, and would be nice to have access to the figures, which are a very important part of some posts,

Thanks

Leandro

The traditional methods of power analysis lag by various shortcomings and challenges:

• Getting an accurate measure of RTL power consumption during design exploration
• Getting consistent power through the design progress from RTL to P&R.
• System-level verification tools are disconnected from the implementation tools that translate RTL to gates and wires.

The Cadence Joules RTL Power Solution closes this gap by delivering time-based RTL power analysis with system-level runtimes, capacity, and high-quality estimates of gates and wires based on production implementation technology. The Cadence Joules RTL Power Solution is an RTL power analysis tool that provides a unified engine to compute gate netlist power and estimate RTL power. The Joules solution delivers 20X faster time-based RTL power analysis and can analyze multi-million instance designs overnight, with impressive accuracy within 15% of signoff power.

Moreover, it integrates seamlessly with numerous Cadence platforms, eliminating compatibility and correlation issues! In addition, the Joules RTL Power Solution GUI (Graphical User Interface) helps you analyze/debug the power estimation/results using several GUI capabilities.

Want to take a tour of this power estimation world? Gear up to attend the training class created just for you to dive deep into the entire flow and explore this exciting power estimation method/flow with hands-on labs in two days!

Training

In the Joules Power Calculator Training course, you will identify solutions and features for RTL power using Cadence Joules RTL Power Solution. You will set up and run the RTL power flow with Joules RTL Power Solution and identify Joules's Graphical User Interface (GUI) capabilities. The training also explores how you can estimate power using vectorless power, stimulus flow, RTL Stim to Gate flow, and replay flow, and also interfaces Joules with Cadence's Palladium Emulation Platform. You will estimate power at the chip level and understand how to navigate the design and data mining using Joules.

The training also covers power exploration features and how to analyze ideal power and ODC-driven sequential clock gating. You will identify low-activity registers at the clock gate. You will also identify techniques to analyze power, generate various reports, and analyze results through Joules GUI. The training covers multiple strategies to debug low stimulus annotation and how you can better correlate RTL power with signoff. You also identify Genus-Joules Integration. In addition, we ensure that your learning journey is smooth with hands-on labs covering various design scenarios.

Lab Videos

To start you on your exciting journey as an RTL power analysis expert, we have created a series of short channel lab videos on our Customer Support site: Lab Demo: Setting Up and Running Basic RTL Power Flow in Joules RTL Power Solution (Video). You can refer to each lab module's instructions in demo format. This will help accelerate your tool ramp-up and help you perform the lab steps more quickly if you are stuck. You might be a beginner in the RTL power analysis world, but we can help you sail through it smoothly.

What's Next?

Grab your badge after finishing the training and flaunt your expertise!

Related Training

• Genus Low-Power Synthesis Flow with IEEE 1801
• Low-Power Synthesis Flow with Genus Stylus Common UI

Related Blogs

• Do You Want to Flaunt Your Expertise? Grab the Digital Badge Today!
• Become Cadence Certified
• Let's Replay the Process of Power Estimation with the Power of 'x'
• Let's Discover the Secret to Enhance Design's PPAC in a Single Cockpit
• What's Inside Joules Graphical User Interface
• Joules – Power Exploration Capabilities

Egypt became the ‘bread basket’ of Africa in 2018, attracting the largest number of foreign investments in food manufacturing. 

Having opened new production facilities in Rwanda and South Africa, Mara Phones is looking to alter Africa's mindset from being a 'consumer' to being a 'manufacturer'. 

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Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.

Check here each week to keep up with the latest from John MacArthur's pulpit at Grace Community Church.