1 New Zealand Dollar = 153.6797 Yemeni Rial

1 New Zealand Dollar = 15.3636 Honduran Lempira

1 New Zealand Dollar = 2.2546 United Arab Emirates Dirham

1 Croatian Kuna = 36.0844 Yemeni Rial

1 Croatian Kuna = 3.6074 Honduran Lempira

1 Croatian Kuna = 0.5294 United Arab Emirates Dirham

1 Peruvian Nuevo Sol = 73.6605 Yemeni Rial

1 Peruvian Nuevo Sol = 7.364 Honduran Lempira

1 Peruvian Nuevo Sol = 1.0806 United Arab Emirates Dirham

The most important part of the men's golf season is traditionally held in the spring when post-season competition can lead to a national championship.  Before the team entered the spring, Head Golf Coach Gary Tanner recognized four players for their past performance at a recent home volleyball match.

1 Dominican Peso = 4.5489 Yemeni Rial

1 Dominican Peso = 0.4548 Honduran Lempira

1 Dominican Peso = 0.0667 United Arab Emirates Dirham

1 Papua New Guinean Kina = 72.9875 Yemeni Rial

1 Papua New Guinean Kina = 7.2967 Honduran Lempira

1 Papua New Guinean Kina = 1.0708 United Arab Emirates Dirham

1 Brunei Dollar = 177.1613 Yemeni Rial

1 Brunei Dollar = 17.7111 Honduran Lempira

1 Brunei Dollar = 2.5991 United Arab Emirates Dirham

Differentiating good IP from mediocre or bad IP is getting more difficult, in part because it depends upon how and where it is used and in part, because even the best IP may work better in one system than another—even in chips developed by the same vendor.  

So, how do you measure IP quality and why it is so complicated?

The answer depends on who is asking. Most of the time, the definition of IP quality depends on your vantage point.  If you are an R&D manager, IP quality means something. If you are a global supply manager, IP quality means something else. If you are an SoC start-up, your measure of quality is quite different from that of an established fabless company. If you are designing IP in-house, then your considerations are very different than being a commercial IP vendor. If you are designing an automotive SoC, then we are in a totally different category. How about as an IP vendor? How do you articulate IP quality metrics to your customers?

This varies greatly by the type of IP, as well. When it comes to interface (hard) IP and controllers, if you are an R&D manager, your goal is to design IP that meets the IP specifications and PPA (power, performance, and area) targets. You need to validate your design via silicon test chips. This applies to all hard PHYs, which must be mapped to a particular foundry process. For controllers that are in RTL form—we called these soft IP—you have to synthesize them into a particular target library in a particular foundry process in order to realize them in a physical form suitable for SoC integration. Of course, your design will need to go through a series of design validation steps via simulation, design verification and passing the necessary DRC checks, etc. In addition, you want to see the test silicon in various process corners to ensure the IP is robust and will perform well under normal process variations in the production wafers.

For someone in IP procurement, the measure of quality will be based on the maturity of the IP. This involves the number of designs that have been taped out using this IP and the history of bug reports and subsequent fixes. You will be looking for quality of the documentation and the technical deliverables. You will also benchmark the supplier’s standard operating procedures for bug reporting and technical support, as well as meeting delivery performance in prior programs. This is in addition to the technical teams doing their technical diligence.

An in-house team that is likely to design IP for a particular SoC project will be using an established design flow and will have legacy knowledge of last generation’s IP. They may be required to design the IP with some reusability in mind for future programs. However, such reusability requirements will not need to be as stringent and as broad as those of commercial IP vendors because there are likely to be established metrics and procedures in place to follow as part of the design team’s standard operating procedures. Many times, new development based on a prior design that has been proven in use will be started, given this stable starting point. All of these criteria help the team achieve a quality outcome more easily.

Then, if designing for an automotive SoC, additional heavy lifting is required.  Aside from ensuring that the IP meets the specifications of the protocol standards and passes the compliance testing, you also must pay attention to meeting functional safety requirements. This means adherence to ISO 26262 requirements and subsequently achieving ASIL certification. Oftentimes, even for IP, you must perform some AEC-Q100-related tests that are relevant to IP, such as ESD, LU, and HTOL.

To read more, please visit: https://semiengineering.com/why-ip-quality-is-so-difficult-to-determine/

In Texas Hold’em Poker, which hand is known as ‘six tits’?

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This is the 16th installment of The Rationalist, my column for the Times of India.

Steven Pinker, in his book Enlightenment Now, relates an old Russian joke about two peasants named Boris and Igor. They are both poor. Boris has a goat. Igor does not. One day, Igor is granted a wish by a visiting fairy. What will he wish for?

“I wish,” he says, “that Boris’s goat should die.”

The joke ends there, revealing as much about human nature as about economics. Consider the three things that happen if the fairy grants the wish. One, Boris becomes poorer. Two, Igor stays poor. Three, inequality reduces. Is any of them a good outcome?

I feel exasperated when I hear intellectuals and columnists talking about economic inequality. It is my contention that India’s problem is poverty – and that poverty and inequality are two very different things that often do not coincide.

To illustrate this, I sometimes ask this question: In which of the following countries would you rather be poor: USA or Bangladesh? The obvious answer is USA, where the poor are much better off than the poor of Bangladesh. And yet, while Bangladesh has greater poverty, the USA has higher inequality.

Indeed, take a look at the countries of the world measured by the Gini Index, which is that standard metric used to measure inequality, and you will find that USA, Hong Kong, Singapore and the United Kingdom all have greater inequality than Bangladesh, Liberia, Pakistan and Sierra Leone, which are much poorer. And yet, while the poor of Bangladesh would love to migrate to unequal USA, I don’t hear of too many people wishing to go in the opposite direction.

Indeed, people vote with their feet when it comes to choosing between poverty and inequality. All of human history is a story of migration from rural areas to cities – which have greater inequality.

If poverty and inequality are so different, why do people conflate the two? A key reason is that we tend to think of the world in zero-sum ways. For someone to win, someone else must lose. If the rich get richer, the poor must be getting poorer, and the presence of poverty must be proof of inequality.

But that’s not how the world works. The pie is not fixed. Economic growth is a positive-sum game and leads to an expansion of the pie, and everybody benefits. In absolute terms, the rich get richer, and so do the poor, often enough to come out of poverty. And so, in any growing economy, as poverty reduces, inequality tends to increase. (This is counter-intuitive, I know, so used are we to zero-sum thinking.) This is exactly what has happened in India since we liberalised parts of our economy in 1991.

Most people who complain about inequality in India are using the wrong word, and are really worried about poverty. Put a millionaire in a room with a billionaire, and no one will complain about the inequality in that room. But put a starving beggar in there, and the situation is morally objectionable. It is the poverty that makes it a problem, not the inequality.

You might think that this is just semantics, but words matter. Poverty and inequality are different phenomena with opposite solutions. You can solve for inequality by making everyone equally poor. Or you could solve for it by redistributing from the rich to the poor, as if the pie was fixed. The problem with this, as any economist will tell you, is that there is a trade-off between redistribution and growth. All redistribution comes at the cost of growing the pie – and only growth can solve the problem of poverty in a country like ours.

It has been estimated that in India, for every one percent rise in GDP, two million people come out of poverty. That is a stunning statistic. When millions of Indians don’t have enough money to eat properly or sleep with a roof over their heads, it is our moral imperative to help them rise out of poverty. The policies that will make this possible – allowing free markets, incentivising investment and job creation, removing state oppression – are likely to lead to greater inequality. So what? It is more urgent to make sure that every Indian has enough to fulfil his basic needs – what the philosopher Harry Frankfurt, in his fine book On Inequality, called the Doctrine of Sufficiency.

The elite in their airconditioned drawing rooms, and those who live in rich countries, can follow the fashions of the West and talk compassionately about inequality. India does not have that luxury.

© 2007 IndiaUncut.com. All rights reserved.
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This is the 21st installment of The Rationalist, my column for the Times of India.

When all political parties agree on something, you know you might have a problem. Giriraj Singh, a minister in Narendra Modi’s new cabinet, tweeted this week that our population control law should become a “movement.” This is something that would find bipartisan support – we are taught from school onwards that India’s population is a big problem, and we need to control it.

This is wrong. Contrary to popular belief, our population is not a problem. It is our greatest strength.

The notion that we should worry about a growing population is an intuitive one. The world has limited resources. People keep increasing. Something’s gotta give.

Robert Malthus made just this point in his 1798 book, An Essay on the Principle of Population. He was worried that our population would grow exponentially while resources would grow arithmetically. As more people entered the workforce, wages would fall and goods would become scarce. Calamity was inevitable.

Malthus’s rationale was so influential that this mode of thinking was soon called ‘Malthusian.’ (It is a pejorative today.) A 20th-century follower of his, Harrison Brown, came up with one of my favourite images on this subject, arguing that a growing population would lead to the earth being “covered completely and to a considerable depth with a writhing mass of human beings, much as a dead cow is covered with a pulsating mass of maggots.”

Another Malthusian, Paul Ehrlich, published a book called The Population Bomb in 1968, which began with the stirring lines, “The battle to feed all of humanity is over. In the 1970s hundreds of millions of people will starve to death in spite of any crash programs embarked upon now.” Ehrlich was, as you’d guess, a big supporter of India’s coercive family planning programs. ““I don’t see,” he wrote, “how India could possibly feed two hundred million more people by 1980.”

None of these fears have come true. A 2007 study by Nicholas Eberstadt called ‘Too Many People?’ found no correlation between population density and poverty. The greater the density of people, the more you’d expect them to fight for resources – and yet, Monaco, which has 40 times the population density of Bangladesh, is doing well for itself. So is Bahrain, which has three times the population density of India.

Not only does population not cause poverty, it makes us more prosperous. The economist Julian Simon pointed out in a 1981 book that through history, whenever there has been a spurt in population, it has coincided with a spurt in productivity. Such as, for example, between Malthus’s time and now. There were around a billion people on earth in 1798, and there are around 7.7 billion today. As you read these words, consider that you are better off than the richest person on the planet then.

Why is this? The answer lies in the title of Simon’s book: The Ultimate Resource. When we speak of resources, we forget that human beings are the finest resource of all. There is no limit to our ingenuity. And we interact with each other in positive-sum ways – every voluntary interactions leaves both people better off, and the amount of value in the world goes up. This is why we want to be part of economic networks that are as large, and as dense, as possible. This is why most people migrate to cities rather than away from them – and why cities are so much richer than towns or villages.

If Malthusians were right, essential commodities like wheat, maize and rice would become relatively scarcer over time, and thus more expensive – but they have actually become much cheaper in real terms. This is thanks to the productivity and creativity of humans, who, in Eberstadt’s words, are “in practice always renewable and in theory entirely inexhaustible.”

The error made by Malthus, Brown and Ehrlich is the same error that our politicians make today, and not just in the context of population: zero-sum thinking. If our population grows and resources stays the same, of course there will be scarcity. But this is never the case. All we need to do to learn this lesson is look at our cities!

This mistaken thinking has had savage humanitarian consequences in India. Think of the unborn millions over the decades because of our brutal family planning policies. How many Tendulkars, Rahmans and Satyajit Rays have we lost? Think of the immoral coercion still carried out on poor people across the country. And finally, think of the condescension of our politicians, asserting that people are India’s problem – but always other people, never themselves.

This arrogance is India’s greatest problem, not our people.

© 2007 IndiaUncut.com. All rights reserved.
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As a leading venture capitalist in the electronics technology, as well as CEO of Cadence, Lip-Bu Tan has unique insights into ongoing changes that will impact EDA providers and users. Tan shared some of those insights in a “fireside chat” with Ed Sperling, editor in chief of Semiconductor Engineering, at the Design Automation Conference (DAC 2015) on June 9.

Topics of this discussion included industry consolidation, the need for more talent and more startups, Internet of Things (IoT) opportunities and challenges, the shift from ICs to full product development, and the challenges of advanced nodes. Following are some excerpts from this conversation, held at the DAC Pavilion theater on the exhibit floor.

Ed Sperling (left) and Lip-Bu Tan (right) discuss trends in semiconductors and EDA

Q: As you look out over the semiconductor and EDA industries these days, what worries you most?

Tan: At the top of my list is all the consolidation that is going on. Secondly, chip design complexity is increasing substantially. Time-to-market pressure is growing and advanced nodes have challenges.

The other thing I worry about is that we need to have more startups. There’s a lot of innovation that needs to happen. And this industry needs more top talent. At Cadence, we have a program to recruit over 10% of new hires every year from college graduates. We need new blood and new ideas.

Q: EDA vendors were acquiring companies for many years, but now the startups are pretty much gone. Where does the next wave of innovation come from?

Tan: I’ve been an EDA CEO for the last seven years and I really enjoy it because so much innovation is needed. System providers have very big challenges and very different needs. You have to find the opportunities and go out and provide the solutions.

The opportunities are not just in basic tools. Massive parallelism is critical, and the power challenge is huge. Time to market is critical, and for the IoT companies, cost is going to be critical. If you want to take on some good engineering challenges, this is the most exciting time.

Q: You live two lives—you’re a CEO but you’re also an investor. Where are the investments going these days and where are we likely to see new startups?

Tan: Clearly everybody is chasing the IoT. There is a lot of opportunity in the cloud, in the data center. Also, I’m a big believer in video, so I back companies that are video related. A big area is automotive. ADAS [Advanced Driver Assistance Systems] is a tremendous opportunity.

These companies can help us understand how the industry is transforming, and then we can provide solutions, either in terms of IP, tools, or the PCB. Then we need to connect from the system level down to semiconductors. I think it’s a different way to design.

Q: What happens as we start moving from companies looking to design a semiconductor to system companies who are doing things from the perspective that we have this purpose for our software?

Tan: We are extending from EDA to what we call system design enablement, and we are becoming more application driven. The application at the system level will drive the silicon design. We need to help companies look at the whole system including the power envelope and signal integrity. You don’t want to be in a position where you design a chip all the way to fabrication and then find the power is too high.

We help the customers with hardware/software co-design and co-verification. We have a design suite and a verification suite that can provide customers with high-level abstractions, as well as verify IP blocks at the system level. Then we can break things down to the component level with system constraints in mind, and drive power-aware, system-aware design.

We are starting to move into vertical markets. For example, medical is a tremendous opportunity.

Q: How does this approach change what you provide to customers?

Tan: Every year I spend time meeting with customers. I think it is very important to understand what they are trying to design, and it is also important to know the customer’s customer requirements. We might say, “Wait a minute, for this design you may want to think about power or the library you’re using.” We help them understand what foundry they should use and what process they should use. They don’t view me as a vendor—they view me as a partner.

We also work very closely with our IP and foundry partners. We work as one team—the ultimate goal is customer success.

Q: Is everybody going to say, FinFETs are beautiful, we’re going to go down to 10nm or 7nm—or is it a smaller number of companies who will continue down that path?

Tan: Some of the analog/mixed-signal companies don’t need to go that far. We love those customers—we have close to 50% of that business. But we also have customers in the graphics or processor area who are really pushing the envelope, and need to be in 16nm, 14nm, or 10nm. We work very closely with those guys to make sure they can go into FinFETs.

We always want to work with the customer to make sure they have a first-time silicon success. If you have to do a re-spin, you miss the opportunity and it’s very costly.

Q: There’s a new market that is starting to explode—IoT. How real is that world to you? Everyone talks about large numbers, but is it showing up in terms of tools?

Tan: Everybody is talking about huge profits, but a lot of the time I think it is just connecting old devices that you have. Billions of units, absolutely yes, but if you look close enough the silicon percentage of that revenue is very tiny. A lot of the profit is on the service side. So you really need to look at the service killer app you are trying to provide.

What’s most important to us in the IoT market is the IP business. That’s why we bought Tensilica—it’s programmable, so you can find the killer app more quickly. The other challenges are time to market, low power, and low cost.

Q: Where is system design enablement going? Does it expand outside the traditional market for EDA?

Tan: It’s not just about tools. IP is now 11% of our revenue. At the PCB level, we acquired a company called Sigrity, and through that we are able to drive system analysis for power, signal integrity, and thermal. And then we look at some of the verticals and provide modeling all the way from the system level to the component level. We make sure that we provide a solution to the end customer, rather than something piecemeal.

Q: What do you think DAC will look like in five years?

Tan: It’s getting smaller. We need to see more startups and innovative IP solutions. I saw a few here this year, and that’s good. We need to encourage small startups.

Q: Where do we get the people to pull this off? I don’t see too many people coming into EDA.

Tan: I talk to a lot of university students, and I tell them that this small industry is a gold mine. A lot of innovation is needed. We need them to come in [to EDA] rather than join Google or Facebook. Those are great companies, but there is a lot of fundamental physical innovation we need.

Richard Goering

Related Blog Posts

- Gary Smith at DAC 2015: How EDA Can Expand Into New Directions

- DAC 2015: Google Smart Contact Lens Project Stretches Limits of IC Design

- Q&A with Nimish Modi: Going Beyond Traditional EDA

Let’s face it – the EDA industry needs new people and new ideas. One of the best places to find both is academia, and a presentation at the Cadence Theater at the recent Design Automation Conference (DAC 2015) described collaboration models that are working today.

The presentation was titled “Industry/Academia Engagement Models – From PhD Contests to R&D Collaborations.” It included these speakers, shown from left to right in the photo below:

• Prof. Xin Li, Electrical and Computer Engineering, Carnegie-Mellon University (CMU)
• Chuck Alpert, Senior Software Architect, Cadence
• Prof. Laleh Behjat, Department of Electrical and Computer Engineering, University of Calgary

Alpert, who was filling in for Zhuo Li, Software Architect at Cadence, was the vice chair of DAC 2015 and will be the general chair of DAC 2016 in Austin, Texas. “My team at Cadence really likes to collaborate with universities,” he said. “We’re a big proponent of education because we really need the best and brightest students in our industry.”

Contests Boost EDA Research

One way that Cadence collaborates with academia is participation in contests. “It’s a great way to formulate problems to academia,” Alpert said. “We can have the universities work on these problems and get some strategic direction.”

For example, Cadence has been involved with the annual CAD contest at the International Conference on Computer-Aided Design (ICCAD) since the contest was launched in 2012. This is the largest worldwide EDA R&D contest, and it is sponsored by the IEEE Council on EDA (CEDA) and the Taiwan Ministry of Education. Its goals are to boost EDA research in advanced real-world problems and to foster industry-academia collaboration.

Contestants can participate in one of more problems in the three areas of system design, logic synthesis and verification, and physical design. The 2015 contest has attracted 112 teams from 12 regions. Cadence contributes one problem per year in the logic synthesis area. Zhuo Li was the 2012 co-chair and the 2013 chair. The awards will be given at ICCAD in November 2015.

Another step that Cadence has taken, Alpert said, is to “hire lots of interns.” His own team has four interns at the moment. One advantage to interning at Cadence, he said, is that students get to see real-world designs and understand how the tools work. “It helps you drive your research in a more practical and useful direction,” he said.

The Cadence Academic Network co-sponsors the ACM SIGDA PhD Forum at DAC, and Xin Li and Zhuo Li are on the organizing committee. This event is a poster session for PhD students to present and discuss their dissertation research with people in the EDA community. This year’s forum was “packed,” Alpert said, and it’s clear that the event needs a bigger room.

Finally, Alpert noted, Cadence researchers write and publish technical papers at DAC and other conferences, and Cadence people serve on the DAC technical program committee. “We try to be involved with the academic community on a regular basis,” Alpert said. “We want the best and the brightest people to go into EDA because there is still so much innovation that’s needed. It’s a really cool place to be.”

Research Collaboration Exposes Failure Rates

Xin Li presented an example of a successful research collaboration between CMU and Cadence. The challenge was to find a better way to estimate potential failure rates in memory. As noted in a previous blog post, PhD student Shupeng Sun met this challenge with a new statistical methodology that won a Best Poster award at the ACM SIGDA PhD Forum at DAC 2014.

The new methodology is called Scaled-Sigma Sampling (SSS). It calculates the failure rate and accounts for variability in the manufacturing process while only requiring a few hundred, or a few thousand, sample circuit blocks. Previously, millions of samples were required for an accurate validation of a new design, and each sample could take minutes or hours to simulate. It could take a few weeks or months to run one validation.

The SSS methodology requires greatly reduced simulation times. It makes it possible, Li noted, to run simulations overnight and see the results in the morning.

Li shared his secret for success in collaborations. “I want to emphasize that before the collaboration, you have to understand the goal. If you don’t have a clear goal, don’t collaborate. Once you define the goal, stick to it and make it happen.”

Contest Provides Learning Experience

Last year Laleh Behjat handed two of her new PhD students a challenge. “I told them there is an ISPD [International Symposium for Physical Design] contest on placement, and I expect you to participate and I expect you to win. Not knowing anything about placement, I don’t think they realized what I was asking them.”

The 2015 contest was called the Blockage-Aware Detailed Routing-Driven Placement Contest. Results were announced at the end of March at ISPD. And the University of Calgary team, despite its lack of placement experience, took second place.

Such contests provide a good learning tool, according to Behjat. Graduate students in EDA, she said, “have to be good programmers. They have to work in teams and be collaborative, be able to innovate, and solve the hardest problems I have seen in engineering and science. And they have to think outside the box.” A contest can bring out all these attributes, she said.

Further, Behjat noted, contest participants had access to benchmarks and to a placement tool. They didn’t have to write tools to find out if their results were good. Industry sponsors, meanwhile, got access to good students and new approaches for solving problems.

“You can see Cadence putting a big amount of time, effort and money to get students here and get them excited about doing contests,” she said. She advised students in the theater audience to “talk to people in the Cadence booth and see if you can have more ideas for collaboration.”

Richard Goering

Related Blog Posts

EDA Plus Academia: A Perfect Game, Set and Match

Cadence Aims to Strengthen Academic Partnerships

BSIM-CMG FinFET Model – How Academia and Industry Empowered the Next Transistor

Hi All,

I have 1 huge project(day X) which has different reference power supply designs.

Now I start a new project and I require 1 specific reference power supply from X.

What is the easist way to do this, other than a copy paste.

Is there a way to create say symbols or something similar, so that multiple different people could use it if they need, in their projects

Thanks for your help and suggestions.

Hi,

Is it possible to use a SystemVerilog package which is compiled into a library and then use it in a VHDL-2008 design file? Is such mixed-language flow supported?

I'm considering the latest versions of Incisive / Xcelium available today (Oct 2019).

Thank you,

Michal

I have been working on a an ASA 17.2 project for the last 6 months.

When I go to Project --> Settings, the settings window does not open. 

The tool indicates that a window is open, as I cannot click on anything else in the project. But it does not show the Settings window.

This has been happening only for the last 2 months. Before that it was working fine.

If I send the project to my colleague, the settings window shows up for him.

Hi Folks, A question that I've often received from designers, "Is there a method to determine the amount of memory required before I submit a job? I use distributed processing and need to provide an estimate before submitting jobs." The answer...(read more)

The other day, I happened to sneak out some time for myself after having sent the kids to play in the neighborhood park. I made myself a hot cup of coffee and settled on the couch hoping to enjoy the silence in the house. But was it really ...(read more)

Hi,

I want to convert ircx file(which is from TSMC,inclued EM Information) to ict or emDataFile for Voltus-fi.

I tried many way, but I can not make it. Can anyone give me some advice?

and I  do not installed QRC.

below is some tools installed my server. 

IC617-64b.500.21 is used.

I can get the bound stdcells using bndGetBoundObjects, but not get what each individual stdcell corresponds in layout.

Is there a way to get the layout bound stdcells of an array schematic symbol if the layout stdcell name do or do not match the symbol naming?

Once the schematic array stdcells are bound to the layout stdcells, how to get the correct terminal term~>name and net~>name?

Example of a schematic symbol and layout stdcell:

Schematic

INV<0:2>    instTerms~>terms~>name = ("vss" "vdd" "A" "Y")

                   instTerms~>net~>name = ("<*3>vss" "<*3>vdd" "in<0:2>" "nand2A,nand3B,nor2B")

Layout ( I know it is bad practice, but it happens )

stdcell1 instTerms~>terms~>name = ("vss" "vdd" "A" "Y")

             instTerms~>net~>name = ("vss" "vdd" "in<0>" "nand2A")

I23        instTerms~>terms~>name = ("vss" "vdd" "A" "Y")

             instTerms~>net~>name = ("vss" "vdd" "in<1>" "nand3B")

INV(2) instTerms~>terms~>name = ("vss" "vdd" "A" "Y")

             instTerms~>net~>name = ("vss" "vdd" "in<2>" "nor2B")

Paul

Hi,

I am running simulation in ADEXL and need a custom function for VIVA to apply same procedure to all signals saved in output. For instance, I have clock nets and I want to get all of them and look at the duty-cycle, edge rate etc.

It is a little more involved than about part since I have some regex and setof to filter before processing but if I can get all signals for current history, I can postprocess them later.

In ocean, I am just doing outputs() and getting all saved signals but I was able to do this in VIVA calculator due to the difficulties in getting current history, test name and opening result directory

thanks

yayla

Version Info:

ICADV12.3 64b 500.21

spectre -W =>

Tool 'cadenceMMSIM' Current project version '16.10.479'
sub-version  16.1.0.479.isr9

I want to select a constraint, and then run a SKILL command that returns a list with the members of that constraint. Is this possible?

Thx,

Hi all,

I want to write a script SKILL to create the title & frame for view schematic. My question is whether SKILL supports any function for me to do this.

Best regards,

Huy Hoang

Here we conclude the blog series and highlight the results of Mediatek 's use of Cadence Perspec™ System Verifier for their SoC level verification. In case you missed it, Part 1 of the blog is here , and Part 2 of the blog is here . One of their key...(read more)

It’s now official: Perspec System Verifier is rated the #1 product in the #1 category of Portable Stimulus, according to the 2017 EDA User Survey published on Deepchip.com. There were 33 user responses in favor of Perspec as the #1 tool, and dr...(read more)

There’s nothing like the heat of a DAC demo to stress new technology and the engineers behind it! Such was the case at DAC 2018 at the new locale of Moscone Center West, San Francisco. Cadence and AMIQ were two of several vendors who announced ...(read more)

Cadence continues to be a leader in SoC verification and has expanded our industry investment in Accellera portable stimulus language standardization. Some customers have expressed reservations that portable stimulus requires the effort of learn...(read more)

I recently attended a webinar presented by Wally Rhines about his new book, Predicting Semiconductor Business Trends After Moore's Law . Wally was the CEO of Mentor, as you probably know. Now he...

[[ Click on the title to access the full blog on the Cadence Community site. ]]

If I talk about my life, it was much simpler when I used to live with my parents. They took good care of whatever I wanted - in fact, they still do. But now, I am living alone, and sometimes I buy...

[[ Click on the title to access the full blog on the Cadence Community site. ]]

Everyone keeps talking about “the cloud” this and “the cloud” that these days—but you’re a semiconductor designer. Everyone keeps saying “the cloud” is revolutionizing all aspects of electronics design—but what does it mean for you? Cadence's own Tom Hackett discussed this in a presentation at the Cadence Theater during DAC 2019.

What people refer to as “the cloud” is commonly divided into three categories: Infrastructure as a Service (IaaS), Platform as a Service (PaaS), and software as a Service (SaaS). With IaaS, you bring your own software—i.e. loading your owned or appropriately licensed tools onto cloud hardware that you rent by the minute. This service is available from providers like Google Cloud Platform, Amazon Web Service, and Microsoft Azure. In PaaS (also available from the major cloud providers), you create your own offering using capabilities and a software design environment provided by the cloud vendor that makes subsequent scaling and distribution really easy because the service was “born in the cloud”.  Lastly, there’s SaaS, where the cloud is used to access and manage functionality and data without requiring users to set up or manage any of the underlying infrastructure used to provide it.  SaaS companies like Workday and Salesforce deliver their value in this manner.  The Cadence Cloud portfolio makes use of both IaaS and SaaS, depending on the customers’ interest.  Cadence doesn’t have PaaS offerings because our customers don’t create their own EDA software from building blocks that Cadence provides.

All of these designations are great, but you’re a semiconductor designer. Presumably you use Workday or some similar software, or have in the past when you were an intern, but what about all of your tools? Those aren’t on the cloud.

Wait—actually, they are.

Using EDA tools in the cloud allows you to address complexity and data explosion issues you would have to simply struggle through before. Since you don’t have to worry about having the compute-power on-site, you can use way more power than you could before. You may be wary about this new generation of cloud-based tools, but don’t worry: the old rules of cloud computing no longer apply. Cloud capacity is far larger than it used to be, and it’s more secure. Updates to scheduling software means that resource competition isn’t as big of a deal anymore. Clouds today have nearly unlimited capacity—they’re so large that you don’t ever need to worry about running out of space.

The vast increase in raw compute available to designers through the cloud makes something like automotive functional safety verification, previously an extremely long verification task, doable in a reasonable time frame. With the cloud, it’s easy to scale the amount of compute you’re using to fit your task—whether it’s an automotive functional safety-related design or a small one.

Nowadays, the Cadence Cloud Portfolio brings you the best and brightest in cloud technology. No matter what your use case is, the Cadence Cloud Portfolio has a solution that works for you. You can even access the Palladium Cloud, allowing you to try out the benefits of an accelerator without having to buy one.

Cloud computing is the future of EDA. See the future here.

With ECAD-MCAD Library Creator, you can easily create footprints for your parts using thousands of ready-to-use templates that are provided with the tool.(read more)

So, what if you can figure out all that can go wrong when your product is being assembled early on? Not guess but know and correct at an early stage – not wait for the fabricator or manufacturer to send you a long report of what needs to change. That’s why Design for Assembly (DFA) rules(read more)

DAC is right around the corner! On the demo floor at Cadence® Booth #2214, we will demonstrate how to use the Cadence mixed-signal and low-power solution to design, verify, and implement a microcontroller-based mixed-signal design. The demo design architecture is very similar to practical designs of many applications like power management ICs, automotive controllers, and the Internet of Things (IoT). Cadene tools demonstrated in this design include Virtuoso® Schematic Editor, Virtuoso Analog Design Environment, Virtuoso AMS Designer, Virtuoso Schematic Model Generator, Virtuoso Power Intent Assistant, Incisive® Enterprise Simulator with DMS option, Virtuoso Digital Implementation, Virtuoso Layout Suite, Encounter® RTL Compiler, Encounter Test, and Conformal Low Power. An extended version of this demo will also be shown at the ARM® Connected Community Pavilion Booth #921.

For additional highlights on Cadence mixed-signal and low-power solutions, stop by our booth for:

• The popular book, Mixed-signal Methodology Guide, which will be on sale during DAC week!
• A sneak preview of the eBook version of the Mixed-signal Methodology Guide
• Customer presentations at the Cadence DAC Theater
  • 9am, Tuesday, June 4  ARM  Low-Power Verification of A15 Hard Macro Using CLP 
  • 10:30am, Tuesday, June 4  Silicon Labs  Power Mode Verification in Mixed-Signal Chip
  • 12:00pm, Tuesday, June 4  IBM  An Interoperable Flow with Unified OA and QRC Technology Files
  • 9am, Wednesday, June 5  Marvell  Low-Power Verification Using CLP
  • 4pm, Wednesday, June 5  Texas Instruments  An Inter-Operable Flow with Unified OA and QRC Technology Files
• Partner presentations at the Cadence DAC Theater
  • 10am, Monday, June 3  X-Fab  Rapid Adoption of Advanced Cadence Design Flows Using X-FAB's AMS Reference Kit
  • 3:30pm, Monday, June 3  TSMC TSMC Custom Reference Flow for 20nm -  Cadence Track
  • 9:30am,Tuesday, June 4  TowerJazz   Substrate Noise Isolation Extraction/Model Using Cadence Analog Flow
  • 12:30pm, Wednesday, June 5  GLOBALFOUNDRIES  20nm/14nm Analog/Mixed-signal Flow
  • 2:30pm, Wednesday, June 5  ARM  Cortex®-M0 and Cortex-M0+: Tiny, Easy, and Energy-efficient Processors for Mixed-signal Applications
• Technology sessions at suites
  • 10am, Monday, June 3    Low-power Verification of Mixed-signal Designs
  • 2pm, Monday, June 3      Advanced Implementation Techniques for Mixed-signal Designs
  • 2pm, Monday, June 3      LP Simulation: Are You Really Done?
  • 4pm, Monday, June 3      Power Format Update: Latest on CPF and IEEE 1801  
  • 11am, Wednesday, June 5   Mixed-signal Verification
  • 11am, Wednesday, June 5   LP Simulation: Are You Really Done?
  • 4pm, Wednesday, June 5   Successful RTL-to-GDSII Low-Power Design (FULL)
  • 5pm, Wednesday, June 5   Custom/AMS Design at Advanced Nodes

We will also have three presentations at the Si2 booth (#1427):

• 10:30am, Monday, June 3   An Interoperable Implementation Solution for Mixed-signal Design
• 11:30am, Tuesday, June 4   Low-power Verification for Mixed-signal Designs Using CPF
• 10:30am, Wednesday, June 5   System-level Low-power Verification Using Palladium

We have a great program at DAC. Click the link for complete Cadence DAC Theater and Technology Sessions. Look forward to seeing you at DAC!     

Hello , i am trying to extract netlist from a circuit  in assembler

I have found the manual shown bellow , however there is no such option in tools in assembler.

how do i view the NETLIST of this circuit?

Thanks.

ASSEMBLER VIEW menu

Hello, I am trying to use two inductors in my LNA as shown bellow to have a S-PARAM response so i will have S11 with lowerst possible values and tweak them for matching network. However when i ran EXPLORER live tuning with SParam as shown bellow i get no change in the response.

I know that Cgs and Cgd with the inductors having a resonance so by Varying L value i should have seen the change in resonance location,

But there is no change.Where did i go wrong?

Thanks. 

Hello, i have built a matching network of 13dB gain and  NF as shown bellow step by step.(including all the plots and matlab )

its just not working at all,i am doing it exacly by the thoery

taking a point inside the circle-> converting its gamma to Z_source->converting gamma_s into gamma_L with the formulla bellow as shown in the matlab->converting the gamma_L into Z_L-> building the matching network for conjugate of Z_L and Z_c.Its just not working.

where did i got  wrong?

Thanks.

gamma_s=75.8966*exp(deg2rad(280.88)*i);
z_s=gamma2z(gamma_s,50);
s11=0.99875-0.03202*i
s12=721.33*10^(-6)+8.622*10^(-3)*i
s21=-188.37*10^(-3)+30.611*10^(-3)*i
s22=875.51*10^(-3)-100.72*10^(-3)*i
gamma_L=conj((s22+(s12*s21*gamma_s)/(1-s11*gamma_s)))
z_L=gamma2z(gamma_L,50)

Other tools allow a sanity check of placement density vs available board space.  There is an older post "Skill code to evaluate all components area (Accumulative Place bound area)"  (9 years ago) that has a couple of examples that no longer work or expired.

This would be useful to provide feedback to schismatic and project managers regarding the component density on the PCB and how it will affect the routing abilities.  Thermal considerations can be evaluated as well 

Has anyone attempted this or still being done externally in spread sheets?