Sanford L. Moskowitz is lauded for his contributions as Author in high-tech innovation and Educator at Saint John's University and the College of St. Benedict

Brian J. Heimer celebrated for over 36 years of professional success

To be clear at the beginning of this article, determining the cross-section of conductors and cables is, for sure, not the most exciting part of electrical design. There are much more challenging and more exciting parts than staring at endless... Read more

The post The art of determining the right cross-section of low voltage conductors appeared first on EEP - Electrical Engineering Portal.

To be clear from the very beginning of this article, there is no standard model for wiring low voltage switchboards and panelboards. However, for the wide variety of installations and ranges of power ratings, there are local work practices, regulations... Read more

The post Dos, don’ts and precautions in wiring cables and conductors inside low-voltage switchboard appeared first on EEP - Electrical Engineering Portal.

Protection of digital ports connected to balanced pairs of conductors

Both Paul McGrath and Michael Rosewall lead English Touring Opera musicians through Barber of Seville and Eugene Onegin for the next two weeks in both University of Warwick and Cheltenham's Everyman Theatre.

Quantum error correction specialist Riverlane today released a fascinating report — The Quantum Error Correction Report 2024 — that’s worth scanning; IBM and 28 collaborators last week released V-score, a […]

The post Quantum Nuggets: Riverlane’s 2024 QEC Study, IBM’s V-score, Twisted Semiconductors appeared first on HPCwire.

‘The modifications will strengthen the semi-conductor scheme and raise capacities within the country’

Archives, Room Use Only - TK5275.F54 1927

Efficient infiltration of a mesoporous titania matrix with conducting organic polymers or small molecules is one key challenge to overcome for hybrid photovoltaic devices. A quantitative analysis of the backfilling efficiency with time-of-flight grazing incidence small-angle neutron scattering (ToF-GISANS) and scanning electron microscopy (SEM) measurements is presented. Differences in the morphology due to the backfilling of mesoporous titania thin films are compared for the macromolecule poly[4,8-bis­(5-(2-ethyl­hexyl)­thio­phen-2-yl)benzo[1,2-b;4,5-b']di­thio­phene-2,6-diyl-alt-(4-(2-ethyl­hexyl)-3-fluoro­thieno[3,4-b]thio­phene-)-2-carboxyl­ate-2-6-diyl)] (PTB7-Th) and the heavy-element containing small molecule 2-pinacol­boronate-3-phenyl­phen­anthro[9,10-b]telluro­phene (PhenTe-BPinPh). Hence, a 1.7 times higher backfilling efficiency of almost 70% is achieved for the small molecule PhenTe-BPinPh compared with the polymer PTB7-Th despite sharing the same volumetric mass density. The precise characterization of structural changes due to backfilling reveals that the volumetric density of backfilled materials plays a minor role in obtaining good backfilling efficiencies and interfaces with large surface contact.

We review some recent results on the phenomenon of surface superconductivity in the framework of Ginzburg-Landau theory for extreme type-II materials. In particular, we focus on the response of the superconductor to a strong longitudinal magnetic field in the regime where superconductivity survives only along the boundary of the wire. We derive the energy and density asymptotics for samples with smooth cross section, up to curvature-dependent terms. Furthermore, we discuss the corrections in presence of corners at the boundary of the sample.

Disclosed is a splicing method of two second-generation ReBCO high temperature superconductor coated conductors (2G ReBCO HTS CCs), in which, with stabilizing layers removed from the two strands of 2G ReBCO HTS CCs through chemical wet etching or plasma dry etching, surfaces of the two high temperature superconducting layers are brought into direct contact with each other and heated in a splicing furnace in a vacuum for micro-melting portions of the surfaces of the high temperature superconducting layers to permit inter-diffusion of ReBCO atoms such that the surfaces of the two superconducting layers can be spliced to each other and oxygenation annealing for recovery of superconductivity which was lost during splicing.

A manufacturing method and device for supporting conductors. Using a non-metallic insulating material extending beyond one or both parallel legs of a staple the thumb and forefinger may grip this extension while the staple is being driven into a supporting structure. This finger grip allows for a small, insulated staple to be held with increased safety to thumb and forefinger during penetration of staple into support.

Embodiments of a method for fabricating stacked microelectronic packages are provided, as are embodiments of a stacked microelectronic package. In one embodiment, the method includes arranging microelectronic device panels in a panel stack. Each microelectronic device panel includes a plurality of microelectronic devices and a plurality of package edge conductors extending therefrom. Trenches are formed in the panel stack exposing the plurality of package edge conductors. An electrically-conductive material is deposited into the trenches and contacts the plurality of package edge conductors exposed therethrough. The panel stack is then separated into partially-completed stacked microelectronic packages. For at least one of the partially-completed stacked microelectronic packages, selected portions of the electrically-conductive material are removed to define a plurality of patterned sidewall conductors interconnecting the microelectronic devices included within the stacked microelectronic package.

An arrangement adapted for letting water pass by electrical conductors and their contact surfaces related to a track of a system adapted for electrically driving a vehicle along a roadway. The vehicle is provided with a current collector which is displaceable up and down and sideways in relation to the direction of transportation, in order to be brought into mechanical and electrical contact with elongated tracks positioned below the roadway and comprising a conductor adapted to be supplied with current and put under voltage. At least two or three tracks are disposed parallel to each other in a common rail structure, with at least two of these tracks being adapted to support and contain individual electrical conductors with contact surfaces put under voltage, and wherein at least one track is disposed closer to the highest point of the roadway and adjacent to a track containing one of said conductors with contact surfaces, which may be put under voltage.

A device for processing a hydrocarbon resource may include a hydrocarbon processing container configured to receive the hydrocarbon resource therein and having a pair of opposing ends with an enlarged width medial portion therebetween. The device may also include a radio frequency (RF) source, and a first spirally wound electrical conductor surrounding the hydrocarbon processing container and coupled to the RF source. The device may further include a second spirally wound electrical conductor carried within the hydrocarbon processing container. The first spirally wound electrical conductor may be configured to generate magnetic fields with the hydrocarbon processing container that are parallel with an axis thereof.

Both Paul McGrath and Michael Rosewall lead English Touring Opera musicians through Barber of Seville and Eugene Onegin for the next two weeks in both University of Warwick and Cheltenham's Everyman Theatre.

(Arizona State University) Cun-Zheng Ning, a professor of electrical engineering in the Ira A. Fulton Schools of Engineering at Arizona State University, and collaborators from Tsinghua University in China discovered a process of physics that enables low-power nanolasers to be produced in 2D semiconductor materials. Understanding the physics behind lasers at nanoscale and how they interact with semiconductors can have major implications for high-speed communication channels for supercomputers and data centers.

As a leading venture capitalist in the electronics technology, as well as CEO of Cadence, Lip-Bu Tan has unique insights into ongoing changes that will impact EDA providers and users. Tan shared some of those insights in a “fireside chat” with Ed Sperling, editor in chief of Semiconductor Engineering, at the Design Automation Conference (DAC 2015) on June 9.

Topics of this discussion included industry consolidation, the need for more talent and more startups, Internet of Things (IoT) opportunities and challenges, the shift from ICs to full product development, and the challenges of advanced nodes. Following are some excerpts from this conversation, held at the DAC Pavilion theater on the exhibit floor.

Ed Sperling (left) and Lip-Bu Tan (right) discuss trends in semiconductors and EDA

Q: As you look out over the semiconductor and EDA industries these days, what worries you most?

Tan: At the top of my list is all the consolidation that is going on. Secondly, chip design complexity is increasing substantially. Time-to-market pressure is growing and advanced nodes have challenges.

The other thing I worry about is that we need to have more startups. There’s a lot of innovation that needs to happen. And this industry needs more top talent. At Cadence, we have a program to recruit over 10% of new hires every year from college graduates. We need new blood and new ideas.

Q: EDA vendors were acquiring companies for many years, but now the startups are pretty much gone. Where does the next wave of innovation come from?

Tan: I’ve been an EDA CEO for the last seven years and I really enjoy it because so much innovation is needed. System providers have very big challenges and very different needs. You have to find the opportunities and go out and provide the solutions.

The opportunities are not just in basic tools. Massive parallelism is critical, and the power challenge is huge. Time to market is critical, and for the IoT companies, cost is going to be critical. If you want to take on some good engineering challenges, this is the most exciting time.

Q: You live two lives—you’re a CEO but you’re also an investor. Where are the investments going these days and where are we likely to see new startups?

Tan: Clearly everybody is chasing the IoT. There is a lot of opportunity in the cloud, in the data center. Also, I’m a big believer in video, so I back companies that are video related. A big area is automotive. ADAS [Advanced Driver Assistance Systems] is a tremendous opportunity.

These companies can help us understand how the industry is transforming, and then we can provide solutions, either in terms of IP, tools, or the PCB. Then we need to connect from the system level down to semiconductors. I think it’s a different way to design.

Q: What happens as we start moving from companies looking to design a semiconductor to system companies who are doing things from the perspective that we have this purpose for our software?

Tan: We are extending from EDA to what we call system design enablement, and we are becoming more application driven. The application at the system level will drive the silicon design. We need to help companies look at the whole system including the power envelope and signal integrity. You don’t want to be in a position where you design a chip all the way to fabrication and then find the power is too high.

We help the customers with hardware/software co-design and co-verification. We have a design suite and a verification suite that can provide customers with high-level abstractions, as well as verify IP blocks at the system level. Then we can break things down to the component level with system constraints in mind, and drive power-aware, system-aware design.

We are starting to move into vertical markets. For example, medical is a tremendous opportunity.

Q: How does this approach change what you provide to customers?

Tan: Every year I spend time meeting with customers. I think it is very important to understand what they are trying to design, and it is also important to know the customer’s customer requirements. We might say, “Wait a minute, for this design you may want to think about power or the library you’re using.” We help them understand what foundry they should use and what process they should use. They don’t view me as a vendor—they view me as a partner.

We also work very closely with our IP and foundry partners. We work as one team—the ultimate goal is customer success.

Q: Is everybody going to say, FinFETs are beautiful, we’re going to go down to 10nm or 7nm—or is it a smaller number of companies who will continue down that path?

Tan: Some of the analog/mixed-signal companies don’t need to go that far. We love those customers—we have close to 50% of that business. But we also have customers in the graphics or processor area who are really pushing the envelope, and need to be in 16nm, 14nm, or 10nm. We work very closely with those guys to make sure they can go into FinFETs.

We always want to work with the customer to make sure they have a first-time silicon success. If you have to do a re-spin, you miss the opportunity and it’s very costly.

Q: There’s a new market that is starting to explode—IoT. How real is that world to you? Everyone talks about large numbers, but is it showing up in terms of tools?

Tan: Everybody is talking about huge profits, but a lot of the time I think it is just connecting old devices that you have. Billions of units, absolutely yes, but if you look close enough the silicon percentage of that revenue is very tiny. A lot of the profit is on the service side. So you really need to look at the service killer app you are trying to provide.

What’s most important to us in the IoT market is the IP business. That’s why we bought Tensilica—it’s programmable, so you can find the killer app more quickly. The other challenges are time to market, low power, and low cost.

Q: Where is system design enablement going? Does it expand outside the traditional market for EDA?

Tan: It’s not just about tools. IP is now 11% of our revenue. At the PCB level, we acquired a company called Sigrity, and through that we are able to drive system analysis for power, signal integrity, and thermal. And then we look at some of the verticals and provide modeling all the way from the system level to the component level. We make sure that we provide a solution to the end customer, rather than something piecemeal.

Q: What do you think DAC will look like in five years?

Tan: It’s getting smaller. We need to see more startups and innovative IP solutions. I saw a few here this year, and that’s good. We need to encourage small startups.

Q: Where do we get the people to pull this off? I don’t see too many people coming into EDA.

Tan: I talk to a lot of university students, and I tell them that this small industry is a gold mine. A lot of innovation is needed. We need them to come in [to EDA] rather than join Google or Facebook. Those are great companies, but there is a lot of fundamental physical innovation we need.

Richard Goering

Related Blog Posts

- Gary Smith at DAC 2015: How EDA Can Expand Into New Directions

- DAC 2015: Google Smart Contact Lens Project Stretches Limits of IC Design

- Q&A with Nimish Modi: Going Beyond Traditional EDA

The U.S. needs a more expansive strategy to maintain its lead in this field, and that means working closely with its allies, especially Japan.

High-temperature superconductors have the potential to revolutionize today's technologies. 'Higgs spectroscopy' could bring about a watershed as it reveals the dynamics of paired electrons in superconductors. Remarkably, the dynamics also reveal typical precursors of superconductivity even above the critical temperature at which the materials investigated attain superconductivity.

Prof. ZHONG Zhicheng's team at the Ningbo Institute of Materials Technology and Engineering has investigated the electronic structure of the recently discovered nickelate superconductors NdNiO₂. They successfully explained the experimental difficulties in synthesizing superconducting nickelates, in cooperation with Prof. Karsten Held at Vienna University of Technology.

Peter Picone, 40, of Methuen, Mass., has been charged with importing counterfeit semiconductors from China for sale in the United States.

The thin, skin-like electronics may usher in a future of earth-friendly gadgets.

Imports of Diode & Semiconductors in China increased to 2075000 USD THO in April from 1973300 USD THO in March of 2020. Imports of Diode & Semiconductors in China averaged 999568.20 USD THO from 1996 until 2020, reaching an all time high of 2799480.44 USD THO in December of 2015 and a record low of 35700 USD THO in February of 1996. This page includes a chart with historical data for China Imports of Diode & Semiconductors.

Imports of Semiconductors in the United States increased to 5743.14 USD Million in March from 4983.18 USD Million in February of 2020. Imports of Semiconductors in the United States averaged 2771.22 USD Million from 1989 until 2020, reaching an all time high of 5743.14 USD Million in March of 2020 and a record low of 963.95 USD Million in October of 1990. This page includes a chart with historical data for the United States Imports of Semiconductors.

New York City subway conductors said that essential workers who still use mass transit are in danger of being infected with coronavirus due to unsanitary conditions inside the cars.

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Conductor and organist Kent Tritle explains all that goes into being a professional conductor. From the concepts of legato, marcato, fortissimo, and more, Kent breaks down what exactly his hand movements mean when leading a group of musicians. Filmed at the Cathedral of St. John the Divine, featuring Kent Tritle, Director of Cathedral Music and Organist, Cathedral of St. John the Divine.

Owens, Frank J

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