Motor manufacturer experiences 50 percent increase in Web site traffic from potential customers in first month using 3D-enabled online catalog

SOLIDWORKS Edition for Windows Vista delivers enhanced user experience plus advanced search, preview, and content distribution

Software will ease design of complex surfaces, speed innovations to market

Enhanced online parts library addresses growing global demand for online design content

Test enables teachers, potential employers to evaluate students' modeling skills as well as their grasp of engineering principles

Gasabo 3D Design, Ltd. to help companies around the world streamline product development, cut costs, reuse design data

SOLIDWORKS Solution Partner develops lifelike, detailed 3D models of human body used in biomedical research, entertainment

Students design real-world projects such as a moveable floor on a floating hospital in South America using SOLIDWORKS 3D CAD and COSMOS design analysis software

Cyclone Clean Air Engine burns cleaner, more efficiently to power cars, ships, etc.

New version of content delivery Web site boosts innovation and productivity

Global workholding product supplier increases sales, reduces development time and costs, and designs better products with 3D CAD software

New 3D CAD software includes streamlined user interface, fluid analysis capabilities, and racing car curriculum for enriched learning experience

Company can design a silo in half an hour and deliver it earlier while helping improve the quality of Mexico's food, plastics, and construction practices

New Version reduces production costs with easily understood images and animations

Interactive 3D manuals increase customer appreciation and satisfaction

Latest Release of Leading 3D Design Solution Enables Faster Model Creation, Optimized Performance, Enhanced Collaboration

Partnership with 3DVision Technologies Reduces Materials and Manufacturing Costs

New Conceptual, Instinctive, Social, Connected Design Application Introduced at SOLIDWORKS World 2014

Latest SOLIDWORKS press releases, news, technical alerts and announcements. These feeds are seen on...

Matthew Caputo, associate teaching professor of engineering at Penn State Shenango, is exploring the fatigue behaviors of nickel-titanium shape memory alloys.

The Berks LaunchBox in partnership with Penn State Berks will host its free 3D Modeling and Printing Workshop for Manufacturing Companies from 3 to 5 p.m. on Tuesday, Nov. 12, in Reading, Pennsylvania.

A team of researchers at Penn State College of Medicine and collaborators from five different institutes has created a 3D atlas of developing mice brains, providing a more dynamic understanding of how the mammalian brain develops. This atlas provides a common reference and anatomical framework to help researchers understand brain development and study neurodevelopmental disorders.

SAS SGPLOT already provides the necessary graphical elements for complex visualization. 3D or high-dimensional data can be easily visualized after being projected appropriately. With SAS' strong support for animation features, SAS users can create complicated 3D or high dimension visualizations quickly.

The post A better 3D scatter plot macro appeared first on Graphically Speaking.

Read the in depth Review of Sony PULSE 3D Wireless Headset Gaming. Know detailed info about Sony PULSE 3D Wireless Headset configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

Read the in depth Review of AMD Ryzen 9 7950X3D Desktop Processor PC Components. Know detailed info about AMD Ryzen 9 7950X3D Desktop Processor configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

Read the in depth Review of FUJIFILM FinePix Real 3D W1 - world's first 3D camera - price Rs. 39,999 Digital Cameras. Know detailed info about FUJIFILM FinePix Real 3D W1 - world's first 3D camera - price Rs. 39,999 configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

The market is trending towards integrating and stacking multiple chiplets into a single package to meet the growing demands of speed, connectivity, and intelligence.  However, designing and signing off chiplets and packages individually is time-...(read more)

Power network design and analysis of 3D-ICs is a major challenge due to the complex nature and large size of the power network. In addition, designers must deal with the complexity of routing power through the interposer, multiple dies, through-silicon vias (TSVs), and through-dielectric vias (TDVs).
Cadence’s Integrity 3D-IC Platform and Voltus IC Power Integrity Solution provide a fully integrated solution for early planning and analysis of 3D-IC power networks, 3D-IC chip-centric power integrity signoff, and hierarchical methods that significantly improve capacity and performance of power integrity (PI) signoff while maintaining a very high level of accuracy at signoff. This blog summarizes the typical design challenges faced by today’s 3D-IC designers, as discussed in our recent webinar, “Addressing 3D-IC Power Integrity Design Challenges.” Please click here to view the full webinar.

Major Trends in Advanced Chip Design

From chips to chiplets, stacked die, 3D-ICs, and more, three major trends are impacting advanced semiconductor packaging design. The first is heterogenous integration, which we define as a disaggregated approach to designing systems on chip (SoCs) from multiple chiplets. This approach is similar to system-in-package (SiP) design, except that instead of integrating multiple bare die – including 3D stacking – on a single substrate, multiple IPs are integrated in the form of chiplets on a single substrate.

The second major trend is around new silicon manufacturing techniques that leverage silicon vias (TSVs) and high-density fanout RDL. These advancements mean that silicon is becoming a more attractive material for packaging, especially when high bandwidth and form factor become key attributes in the end design. This brings new design and verification challenges to most packaging engineers who typically work with organic and ceramic substrate materials.

Finally, on the ecosystem side, all the large semiconductor foundries now offer their own versions of advanced packaging. This brings new ways of supporting design teams with technologies like reference flows and PDKs, concepts that have typically been lacking in the packaging community. Cadence has worked with many of the leading foundries and outsourced semiconductor assembly and test facilities (OSATs) to develop multi-chip(let) packaging reference flows and package assembly design kits. The downside is that, with the time restrictions designers are under today, there isn’t enough time to simulate the details of these flows and PDKs further.

For those who must make the best electro/thermal/physical decisions to achieve the best power/performance/area/cost (PPAC), factors can include accurate die size estimations, thermal feasibility, die-to-die interconnect planning, interposer planning (silicon/organic), front-to-front and front-to-back (F2F/F2B) planning, layer stack and electromigration/ IR drop (EMIR)/TSV planning, IO bandwidth feasibility, and system-level architecture selection.

3D-IC Power Network Design and Analysis

The key to success in 3D-IC design is early power integrity planning and analysis. Cadence’s Integrity 3D-IC platform is a high-capacity 3D-IC platform that enables 3D design planning, implementation, and system analysis in a single, unified cockpit. Cadence’s Voltus IC Power Integrity Solution is a comprehensive full chip electromigration, IR drop, and power analysis solution. With its fully distributed architecture and hierarchical analysis capabilities, Voltus provides very fast analysis and has the capacity to handle the largest designs in the industry. Typically, 3D-IC PDN design and analysis is performed in four phases, as shown in Figure 1.

Phase 1 - Perform early power delivery network (PDN) exploration with each fabric’s PDN cascaded in system PI with early circuit models.

Phase 2 – Plan 3D-IC PDNs in Cadence’s Integrity 3D-IC platform, including micro bumps, TSVs, and through dielectric vias (TDVs), power grid synthesis for dies, and early rail analysis and optimization.

Phase 3 – Perform full chip-centric signoff in Voltus with detailed die, interposer, and package models, including chip die models, while keeping some dies flat.

Phase 4 – Perform full system-level signoff with Cadence’s Sigrity SystemPI using detailed extracted package models from Sigrity XtractIM, board models from Sigrity PowerSI or Clarity 3D Solver, interposer models from XtractIM or Voltus, and chip power models from Voltus.

Figure 1. 3D-IC PDN design and analysis phases

3D-IC Chip-Centric Signoff

The integration of Integrity 3D-IC and Voltus enables chip-centric early analysis and signoff. Figure 2 and Figure 3 highlight the chip centric early PI optimization and signoff flows. In early analysis, the on-chip power networks are synthesized, and the micro bumps and TSVs can be placed and optimized. In the signoff stage, all the detailed design data is used for power analysis, and detailed models are extracted and used for package, interposer, and on-die power networks.

Figure 2. Early chip-centric PI analysis and optimization flow

Figure 3. Chip-centric 3D-IC PI signoff

Hierarchical 3D-IC PI Analysis

To improve the capacity and performance of 3D-IC PI analysis, Voltus enables hierarchical analysis using chiplet models. Chiplet models can be reduced chip models in spice format or more accurate xPGV models which are highly accurate proprietary models generated by Voltus. With xPGV models, the hierarchical PI analysis has almost the same accuracy as flat analysis but offers 10X or higher benefit in runtime and memory requirements.

Conclusion

This blog has highlighted the major design trends enabled by advanced 3D packaging and the design challenges arising from these advancements. The design of power delivery networks is one of these major challenges. We have discussed Cadence solutions to overcome this PI challenge. To learn more, view our recent webinar, "Addressing 3D-IC Power Integrity Design Challenges" and visit the Voltus web page.

Have you heard that starting SPB 23.1, Allegro Package Designer Plus (APD+) will be renamed as Allegro X Advanced Package Designer (Allegro X APD)? 

Allegro X APD offers multiple new features and enhancements on topics like Via Structures, Wirebond, Etchback, Text Wizards, 3D Canvas, and more. 

This post presents the new 3DX Canvas introduced in SPB 23.1. This can be invoked from Allegro X APD (from the menu item View > 3DX Canvas). 

Some of the key benefits of the new canvas: 

• This canvas addresses the scale and complexity in large modern package designs. It provides highly efficient visual representation and implementation of packages. 
  
• The new architecture enables high-performance 3D incremental updates by utilizing GPU for fast rendering. 
  
  
• Real-time 3D incremental updates are supported, which means that the 3D view is in sync with all changes to the database. 
  
  
• The new canvas provides 3D visualization support for packaging objects such as wire bonds, ball, die bump/pillar geometries, die stacks, etch back, and plating bar. 
  
  
• This release also introduces the interactive measurement tool for a 3D view of packages. Once you open 3DX Canvas, press the Alt key and you can select the objects you want to measure. 
  
• 3DX Canvas provides new 3D DRC Bond Wire Clearances with Real 3D DRC Checks. True 3D DRC in Constraint Manager has been introduced. If you open Constraint Manager, there will be a new worksheet added. Following DRC checks are supported: 

  Wire to Wire 
  Wire to Finger 
  Wire to Shape 
  Wire to Cline 
  Wire to Component

Using the EMX solver, X-FAB design engineers can efficiently develop next-generation RF technology for the latest communication standards (including sub-6GHz 5G, mmWave, UWB, etc.), which are enabling technologies for communications and electric vehicle (EV) wireless applications. (read more)

With the latest release (Sigrity and Systems Analysis 2022.1 HF2) of Clarity  3D Solver, support for encrypted component models is now available. With this functionality, vendors that supply 3D components, such as connectors, can now merge their...(read more)

The silkscreen layer plays a crucial role in the assembly, repair, and testing of a PCB. You can add a variety of information to this layer, such as the location of the components, polarity, component orientation, on-off switches, LEDs, and testpoint...(read more)

Hi! I'm using EMX with 2 design kits. In one works fine. With another, I do not see the mesh or current view. The menu item is not shown. This happens only with one DK. With the other one I'm able to run Paraview without any issue. 

Besides, I would like to know if there is any way to see the 3D view without mesh and current. Just a nice 3D view. 

I've also tried to install the latest version (EMX2023_2) but nothing changes. 

Designing 3D-ICs with integrity involves a commitment to ethical practices, reliability, and sustainability throughout the design and manufacturing process. This includes using environmentally friendly materials, ensuring robust and efficient performance, and incorporating thorough testing and verification. By prioritizing transparency, responsibility, and long-term sustainability, designers can create advanced integrated circuits that meet high standards of quality and social responsibility.

Start Learning Now!

Start with our Designing with Integrity 3D-IC online course, which introduces Integrity 3D-IC, the industry's first comprehensive, high-capacity 3D-IC platform that integrates 3D design planning, implementation, and system analysis in a single, unified environment. You will be guided through the following activities involved in designing a silicon interposer with a digital ASIC and HBM2 interface in a 2.5D configuration.

• You will design the interposer from scratch in the new Integrity System Planner and the Integrity 3D-IC implementation environment.
• You will examine the ASIC and interposer designs using some of the new 3D-IC multi-die design features.
• You will route the interposer using some of the new advanced routing capabilities with NanoRoute

—and this in only two days!

WATCH VIDEO

Interested? Get an overview in less than two minutes.

Are you primarily interested in selected snippets instead? Then, take our Training Bytes, which—like the online training course—are available to Cadence customers for free 24/7 in the Cadence Learning and Support portal.

Cadence Training Services now offers free Digital Badges for all popular online training courses. These badges indicate proficiency in a certain technology or skill and give you a way to validate your expertise to managers and potential employers. You can add the digital badge to your email signature or any social media channels, such as Facebook or LinkedIn, to highlight your expertise.

To find out more, see the blog post. It’s the Digital Era; Why Not Showcase Your Brand Through a Digital Badge!

Related Resources

• 3D-IC Introduction (Video)
• 3D-IC Development Process With Challenges. (Video)
• Demo: How to Create the Interposer Contact Pads and Die Connectivity Using the Integrity 3D-IC? (Video)
• Demo: How To Pull The Interposer Design From System Planner Into Integrity 3D-IC Layout? (Video)
• Demo: Routing The Interposer Design Using The Integrity 3D-IC Layout_Part 1 (Video)
• Demo: Routing The Interposer Design Using The Integrity 3D-IC Layout_Part 2 (Video)
• Demo: How To Create C4 Bumps For NC Connections And Generating C4 Dummy Cover Bumps In Integrity 3D-IC? (Video)

Related Blogs

• How Cadence Is Expanding Innovation for 3D-IC Design
• Training Bytes: They May Be Shorter, But the Impact Is Stronger!
• Training Insights — 3D-IC: What Is Silicon Interposer?
• System Analysis Knowledge Bytes: What’s New in the Clarity 3D Solver Course
• System Analysis Knowledge Bytes - Early System-Level Thermal Analysis
• 3D-IC: The Future of Integrated Electronics Is the Future of Electronics Itself

Related Trainings

• OrbitIO System Planner
• Allegro Package Designer Plus

A new AI-powered, imaging-based technology that creates accurate three-dimensional models of tumors, veins and other soft tissue offers a promising new method to help surgeons operate on, and better treat, breast cancers. The technology, from Illinois-based startup SimBioSys, converts routine black-and-white MRI images into spatially accurate, volumetric images of a patient’s breasts. It then illuminates Read Article

1573d laptops owners manual

One day, doctors might be able to 3D print copies of your organs in order to test a variety of drugs, thanks to a new technique that uses light and sound for rapid printing

Understanding the evolution of chromatin conformation among species is fundamental to elucidate the architecture and plasticity of genomes. Nonrandom interactions of linearly distant loci regulate gene function in species-specific patterns, affecting genome function, evolution, and, ultimately, speciation. Yet, data from nonmodel organisms are scarce. To capture the macroevolutionary diversity of vertebrate chromatin conformation, here we generate de novo genome assemblies for two cryptodiran (hidden-neck) turtles via Illumina sequencing, chromosome conformation capture, and RNA-seq: Apalone spinifera (ZZ/ZW, 2n = 66) and Staurotypus triporcatus (XX/XY, 2n = 54). We detected differences in the three-dimensional (3D) chromatin structure in turtles compared to other amniotes beyond the fusion/fission events detected in the linear genomes. Namely, whole-genome comparisons revealed distinct trends of chromosome rearrangements in turtles: (1) a low rate of genome reshuffling in Apalone (Trionychidae) whose karyotype is highly conserved when compared to chicken (likely ancestral for turtles), and (2) a moderate rate of fusions/fissions in Staurotypus (Kinosternidae) and Trachemys scripta (Emydidae). Furthermore, we identified a chromosome folding pattern that enables "centromere–telomere interactions" previously undetected in turtles. The combined turtle pattern of "centromere–telomere interactions" (discovered here) plus "centromere clustering" (previously reported in sauropsids) is novel for amniotes and it counters previous hypotheses about amniote 3D chromatin structure. We hypothesize that the divergent pattern found in turtles originated from an amniote ancestral state defined by a nuclear configuration with extensive associations among microchromosomes that were preserved upon the reshuffling of the linear genome.

BACKGROUND AND PURPOSE:

A cleftlike nonenhancing hypointensity was observed repeatedly in the pituitary gland at the adenohypophysis/neurohypophysis border on contrast-enhanced 3D fat-saturated T1-MPRAGE using clinical 7T MRI. Our primary goal was to assess the prevalence of this finding. The secondary goals were to evaluate the frequency of other incidental pituitary lesions, MRI artifacts, and their effect on pituitary imaging on the contrast-enhanced 3D fat-saturated T1 MPRAGE at 7T.

BACKGROUND AND PURPOSE:

Intracranial vessel wall imaging is technically challenging to implement, given the simultaneous requirements of high spatial resolution, excellent blood and CSF signal suppression, and clinically acceptable gradient times. Herein, we present our preliminary findings on the evaluation of a deep learning–optimized sequence using T1-weighted imaging.

3D Scotland are an innovative, Glasgow-based company who specialise in the design and manufacture of unique chess sets. Their sets have proved extremely popular as Christmas gifts, graduation gifts, fathers’ day gifts and everything in between.

One day, doctors might be able to 3D print copies of your organs in order to test a variety of drugs, thanks to a new technique that uses light and sound for rapid printing

Waiting for each part of a 3D-printed project to finish, taking it out of the printer, and then installing it on location can be tedious for multi-part projects. What if there was a way for your printer to print its creation exactly where you needed it? That’s the promise of MobiPrint, a new 3D printing robot that can move around a room, printing designs directly onto the floor.

MobiPrint, designed by Daniel Campos Zamora at the University of Washington, consists of a modified off-the-shelf 3D printer atop a home vacuum robot. First it autonomously maps its space—be it a room, a hallway, or an entire floor of a house. Users can then choose from a prebuilt library or upload their own design to be printed anywhere in the mapped area. The robot then traverses the room and prints the design.

It’s “a new system that combines robotics and 3D printing that could actually go and print in the real world,” Campos Zamora says. He presented MobiPrint on 15 October at the ACM Symposium on User Interface Software and Technology.

Campos Zamora and his team started with a Roborock S5 vacuum robot and installed firmware that allowed it to communicate with the open source program Valetudo. Valetudo disconnects personal robots from their manufacturer’s cloud, connecting them to a local server instead. Data collected by the robot, such as environmental mapping, movement tracking, and path planning, can all be observed locally, enabling users to see the robot’s LIDAR-created map.

Campos Zamora built a layer of software that connects the robot’s perception of its environment to the 3D printer’s print commands. The printer, a modified Prusa Mini+, can print on carpet, hardwood, and vinyl, with maximum printing dimensions of 180 by 180 by 65 millimeters. The robot has printed pet food bowls, signage, and accessibility markers as sample objects.

MakeabilityLab/YouTube

Currently, MobiPrint can only “park and print.” The robot base cannot move during printing to make large objects, like a mobility ramp. Printing designs larger than the robot is one of Campos Zamora’s goals in the future. To learn more about the team’s vision for MobiPrint, Campos Zamora answered a few questions from IEEE Spectrum.

What was the inspiration for creating your mobile 3D printer?

Daniel Campos Zamora: My lab is focused on building systems with an eye towards accessibility. One of the things that really inspired this project was looking at the tactile surface indicators that help blind and low vision users find their way around a space. And so we were like, what if we made something that could automatically go and deploy these things? Especially in indoor environments, which are generally a little trickier and change more frequently over time.

We had to step back and build this entirely different thing, using the environment as a design element. We asked: how do you integrate the real world environment into the design process, and then what kind of things can you print out in the world? That’s how this printer was born.

What were some surprising moments in your design process?

Campos Zamora: When I was testing the robot on different surfaces, I was not expecting the 3D printed designs to stick extremely well to the carpet. It stuck way too well. Like, you know, just completely bonded down there.

I think there’s also just a lot of joy in seeing this printer move. When I was doing a demonstration of it at this conference last week, it almost seemed like the robot had a personality. A vacuum robot can seem to have a personality, but this printer can actually make objects in my environment, so I feel a different relationship to the machine.

Where do you hope to take MobiPrint in the future?

Campos Zamora: There’s several directions I think we could go. Instead of controlling the robot remotely, we could have it follow someone around and print accessibility markers along a path they walk. Or we could integrate an AI system that recommends objects be printed in different locations. I also want to explore having the robot remove and recycle the objects it prints.

1. Study reveals how 3D environments affect bacterial growth and survival  The Hindu
2. 3D environments influence bacterial growth & survival  The Times of India
3. Shape Matters: New Research Reveals Impact of 3D Environments on Bacterial Growth  Research Matters
4. Study reveals role of 3D environments in influencing bacterial survival and growth  Bangalore Mirror

FPGA-powered hardware will capture CRT glow with "bespoke, purpose-built upscaler"

At Anime NYC this weekend, Aniplex USA shared more details for its upcoming 3D action RPG Alterna Vvelt: Blue Exorcist …

Continue reading "3D Action RPG ‘Alterna Vvelt: Blue Exorcist Another Story’ From Aniplex Gets a New Trailer Ahead of Its Launch on Mobile and PC"

Nvision Biomedical Technologies and Invibio Biomaterial Solutions have announced that the FDA has granted clearance of the first 3D-Printed PEEK Interbody System made from PEEK-OPTIMA.

Robert Musselle, customer engineering manager EMEA at Protolabs shares what you need to consider with 3D printing and plastics prototyping.

Modern innovation typically occurs one step-improvement at a time. Some clients initially question whether their new application of an existing technology is patentable. Usually, the answer is ‘yes.’ Under U.S. law (and most other jurisdictions), an innovation to an existing technology is patentable so long as at least one claim limitation is novel and non-obvious....… Continue Reading

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