1 Dominican Peso = 0.0328 Bulgarian Lev

1 Papua New Guinean Kina = 0.9909 Peruvian Nuevo Sol

1 Papua New Guinean Kina = 0.5263 Bulgarian Lev

1 Brunei Dollar = 2.4051 Peruvian Nuevo Sol

1 Brunei Dollar = 1.2775 Bulgarian Lev

PCIe has been widely adopted in the electronics industry since its first debut in 2003 (PCIe 1.0 standard release) for wide breach of applications, from Data Center Server, Networking, to Mobile, AI/ML, Automotive, IoT, and many others…. It’s a versatile, high-performance, robust, mature interconnect standard with full “backward compatibility” (e.g., a PCIe 3.0 device can still function well in a PCIe 4.0 system) which enables a solid and strong PCIe eco-system in the industry.  While the market, so as the users,  are enjoying the systems, e.g., desktop/laptop, powered (or to be more specific: “bridged”) by PCIe 3.0 since 2010, the industry is pushing hard for the PCIe 4.0 eco-system enablement. Earlier this year, AMD announced it X570 chipset would support the PCIe 4.0 interface and Phison also introduced the world’s first PCIe 4.0 SSD.

On the standard evolution front, the official PCIe 5.0 came out in May 2019, doubling the data rate to 32GT/s from 16GT/s in PCIe 4.0. The PCIe 6.0 standard will be released in 2021 based on the announcement made by PCI-SIG in June’19 with the goal to further double the data rate to 64GT/s with incorporating the PAM4 coding.

PCIe Protocol Evolution

Having said that, is the latest generation of PCIe always desired?  

My answer would be positive. Just like car maker/enthusiast has kept pursuing faster car in the history, there is no doubt that these speed enhancements/upgrades in the electronic world certainly provide a tremendous benefit for especially those applications craving the most throughput, such as Data center, HPC, Networking, Cloud and AI applications.   

But, does every application have to opt for the fastest speed (bandwidth)? My view would be leaning toward “Not really”. Just like we don’t need a 3-second sport car (meaning 0-60mph acceleration < 3s) for daily commute though it would certainly spice some driving fun on the road, but it may not be "the best fit" for most of commuters.

There are applications still well satisfied with PCIe 3.0 (or even older PCIe 2.0) for its best performance and cost balance.  Those applications include, but not limit to, IoT/consumer, Edge AI, SSD (non-enterprise),…etc. They typically need to make trade-off in between the cost, power consumption (especially battery powered), flexibility on changing product features, and time-to-market (TTM). To address such type of market needs, Cadence also offers an PPA (Performance, Power, Area) optimized PCIe 3.0 solution in addition to its high-performance PCIe 4.0 product line.

Cadence PCIe 3.0 PHY Solution (with Multi-Protocol Multi-Link feature)

With leveraging the multi-protocol SerDes implementation, the same Cadence PHY IP support multi-protocol and multi-link operation. Such a multi-protocol enabled PHY gives the SoC developers the optimum flexibility to integrate multiple commonly used interface protocols (e.g., PCIe 3.0 + USB 3.0) with using only a single PHY design.  This would largely save the product development time (faster TTM), reduce the risk of using multiple different PHY instances (for different protocol needs), and with the configurability to enable different product features/protocols.

Some people might say PCIe 3.0 era has gone. I was not quite yet being convinced as I still see its potential to shine a lot of market use cases. What do you think?

More Information

For more information on Cadence's PCIe IP offerings, see our PCI Express page.

For more information on PCIe in general, and on the various PCI standards, see the PCI-SIG website.

Related Posts

• Blog: PCIe Gen4: It’s Official, We’re Compliant
• Blog: The PCIe 4.0 Era Continues at PCI-SIG Developers Conference 2016
• Blog: Cadence PCIe Solutions: Configurable, Compliant, and Low Power

PCI-SIG DevCon 2019 APAC tour has come to Tokyo and Taipei this year. The focus is predominantly around the latest updates for PCIe Gen 5 which its version 1.0 specification was just released this year in May.  A series of presentations provided by PCI-SIG on the day 1 with comprehensive information covering all aspects of Gen 5 specification, including protocol, logical, electrical, compliance updates. On the day 2 (only in Taipei), several member companies shared their view on Testing, PCB analysis and Signal integrity. The exhibit is also another spotlight of this event where the member companies showcased their latest PCIe solutions.

Presentation Track (Taipei), Exhibit (Tokyo), Exhibit (Taipei) 

Cadence, as the market leading PCIe IP vendor, participated APAC tour this year with bringing in its latest PCIe IP solution offering (Gen 5/4) to the region as well as showcasing two live demo setups in the exhibit floor. One setup is the PCIe software development kit (SDK) while the other is the Interop/compliance/debug platform. Both come with the Cadence PCIe Gen 4 hardware setup and its corresponding software kit.

The SDK can be used for Device Driver Development, Firmware Development, and for pre-silicon emulation as well. It supports Xtensa and ARM processor with Linux OS and it also equip with Ethernet interface which can be used for remote debugging. It also supports PCIe stress tests for Speed change, link enable/disable, entry/exist for lower power states, …etc. 

Cadence PCIe 4.0 Software Development Kit

The “System Interop/Compliance/Debug platform” was set up to test with multiple endpoint and System platforms. This system come with integrated Cadence software for basic system debug without the need for analyzer to perform the analysis, such as LTSSM History, TS1/TS2 transmitted/received with time stamp, Link training phases, Capturing Packet errors details, Capturing PHY TX/RX internal state machine details, ...etc.

Cadence PCIe System Interop/Compliance/Debug Platform

The year 2019 is certainly a "fruitful year" for the PCIe as more Gen 4 products are now available in the market, Gen 5 v1.0 specification got officially ratified, and PCI-SIG's revealing of Gen 6 specification development. We were glad to be part of this APAC tour with the chance to further introduce Cadence’s complete and comprehensive PCIe IP solution.

See you all next year in APAC again!

More Information

For more information on Cadence's PCIe IP offerings, see our PCI Express page.

For more information on PCIe in general, and on the various PCI standards, see the PCI-SIG website.

Related Posts

• Blog: Did You “Stress Test” Yet? Essential Step to Ensure a Quality PCIe 4.0 Product
• Blog: PCIe Gen4: It’s Official, We’re Compliant
• Blog: PCIe 3.0 Still Shines While PCIe Keeps Evolving
• Blog: The PCIe 4.0 Era Continues at PCI-SIG Developers Conference 2016

Let’s face it – the EDA industry needs new people and new ideas. One of the best places to find both is academia, and a presentation at the Cadence Theater at the recent Design Automation Conference (DAC 2015) described collaboration models that are working today.

The presentation was titled “Industry/Academia Engagement Models – From PhD Contests to R&D Collaborations.” It included these speakers, shown from left to right in the photo below:

• Prof. Xin Li, Electrical and Computer Engineering, Carnegie-Mellon University (CMU)
• Chuck Alpert, Senior Software Architect, Cadence
• Prof. Laleh Behjat, Department of Electrical and Computer Engineering, University of Calgary

Alpert, who was filling in for Zhuo Li, Software Architect at Cadence, was the vice chair of DAC 2015 and will be the general chair of DAC 2016 in Austin, Texas. “My team at Cadence really likes to collaborate with universities,” he said. “We’re a big proponent of education because we really need the best and brightest students in our industry.”

Contests Boost EDA Research

One way that Cadence collaborates with academia is participation in contests. “It’s a great way to formulate problems to academia,” Alpert said. “We can have the universities work on these problems and get some strategic direction.”

For example, Cadence has been involved with the annual CAD contest at the International Conference on Computer-Aided Design (ICCAD) since the contest was launched in 2012. This is the largest worldwide EDA R&D contest, and it is sponsored by the IEEE Council on EDA (CEDA) and the Taiwan Ministry of Education. Its goals are to boost EDA research in advanced real-world problems and to foster industry-academia collaboration.

Contestants can participate in one of more problems in the three areas of system design, logic synthesis and verification, and physical design. The 2015 contest has attracted 112 teams from 12 regions. Cadence contributes one problem per year in the logic synthesis area. Zhuo Li was the 2012 co-chair and the 2013 chair. The awards will be given at ICCAD in November 2015.

Another step that Cadence has taken, Alpert said, is to “hire lots of interns.” His own team has four interns at the moment. One advantage to interning at Cadence, he said, is that students get to see real-world designs and understand how the tools work. “It helps you drive your research in a more practical and useful direction,” he said.

The Cadence Academic Network co-sponsors the ACM SIGDA PhD Forum at DAC, and Xin Li and Zhuo Li are on the organizing committee. This event is a poster session for PhD students to present and discuss their dissertation research with people in the EDA community. This year’s forum was “packed,” Alpert said, and it’s clear that the event needs a bigger room.

Finally, Alpert noted, Cadence researchers write and publish technical papers at DAC and other conferences, and Cadence people serve on the DAC technical program committee. “We try to be involved with the academic community on a regular basis,” Alpert said. “We want the best and the brightest people to go into EDA because there is still so much innovation that’s needed. It’s a really cool place to be.”

Research Collaboration Exposes Failure Rates

Xin Li presented an example of a successful research collaboration between CMU and Cadence. The challenge was to find a better way to estimate potential failure rates in memory. As noted in a previous blog post, PhD student Shupeng Sun met this challenge with a new statistical methodology that won a Best Poster award at the ACM SIGDA PhD Forum at DAC 2014.

The new methodology is called Scaled-Sigma Sampling (SSS). It calculates the failure rate and accounts for variability in the manufacturing process while only requiring a few hundred, or a few thousand, sample circuit blocks. Previously, millions of samples were required for an accurate validation of a new design, and each sample could take minutes or hours to simulate. It could take a few weeks or months to run one validation.

The SSS methodology requires greatly reduced simulation times. It makes it possible, Li noted, to run simulations overnight and see the results in the morning.

Li shared his secret for success in collaborations. “I want to emphasize that before the collaboration, you have to understand the goal. If you don’t have a clear goal, don’t collaborate. Once you define the goal, stick to it and make it happen.”

Contest Provides Learning Experience

Last year Laleh Behjat handed two of her new PhD students a challenge. “I told them there is an ISPD [International Symposium for Physical Design] contest on placement, and I expect you to participate and I expect you to win. Not knowing anything about placement, I don’t think they realized what I was asking them.”

The 2015 contest was called the Blockage-Aware Detailed Routing-Driven Placement Contest. Results were announced at the end of March at ISPD. And the University of Calgary team, despite its lack of placement experience, took second place.

Such contests provide a good learning tool, according to Behjat. Graduate students in EDA, she said, “have to be good programmers. They have to work in teams and be collaborative, be able to innovate, and solve the hardest problems I have seen in engineering and science. And they have to think outside the box.” A contest can bring out all these attributes, she said.

Further, Behjat noted, contest participants had access to benchmarks and to a placement tool. They didn’t have to write tools to find out if their results were good. Industry sponsors, meanwhile, got access to good students and new approaches for solving problems.

“You can see Cadence putting a big amount of time, effort and money to get students here and get them excited about doing contests,” she said. She advised students in the theater audience to “talk to people in the Cadence booth and see if you can have more ideas for collaboration.”

Richard Goering

Related Blog Posts

EDA Plus Academia: A Perfect Game, Set and Match

Cadence Aims to Strengthen Academic Partnerships

BSIM-CMG FinFET Model – How Academia and Industry Empowered the Next Transistor

It’s always good to hear what real users think of products. Here is a very detailed review (~4000 words) by an Anonymous user, nick named Ant-Man (from the movie). Overall it’s a very strong endorsement of Perspec, and summarize...(read more)

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Virtuoso Version -- IC6.1.7-64b.500.23

Cadence Spectre Version -- 17.10.515

I have a very simple circuit. Please find attached. It is basically a resistor across a port. I run a S-param simulation and can plot the S-params, but unfortunately not the Z-param or Y-param. 

/resized-image/__size/320x240/__key/communityserver-discussions-components-files/33/Capture_5F00_Sch.JPG

/resized-image/__size/320x240/__key/communityserver-discussions-components-files/33/Capture_5F00_Error.JPG

Can anyone point me in the correct direction to sort out this problem? The zpm does work in another design environment, but not in the new design environment (a new project). The virtuoso and the cadence-spectre versions match in both the project environments. I am at a loss at what to look for. 

Hi All,

I'm trying to understand checkpoint concept. When I found save and restart concept in cdnshelp, There is just describing about "$save" and "xrun -r "~~~".

and I found also the below link about save restart and it saves your time.

But I can't find any benefits from my experiment from save&restart article( I fully agree..the article)

Ok, So I'v got some experiment  Here.

1. I declared $save and got the below result as I expected within the simple UVM code.

In UVM code...

$display("TEST1");
$display("TEST2");
$save("SAVE_TEST");
$display("TEST3");
$display("TEST4");

And I restart at "SAVE_TEST" point by xrun -r "SAVE_TEST", I've got the below log

xcelium> run
TEST3
TEST4

Ok, It's Good what I expected.(The concept of Save and Restore is simple: instead of re-initializing your simulation every time you want to run a test, only initialize it once. Then you can save the simulation as a “snapshot” and re-run it from that point to avoid hours of initialization times. It used to be inconvenient. I agree..)

2. But The Problem is that I can't restart with modified code. Let's see the below example.

I just modified TEST5 instead of "TEST3"

$display("TEST1");
$display("TEST2");
$save("SAVE_TEST");
$display("TEST5"); //$display("TEST3");
$display("TEST4");

and I rerun with xrun -r "SAVE_TEST", then I've got the same log

xcelium> run
TEST3
TEST4

There is no "TEST5". Actually I expected "TEST5" in the log.From here We know $save can't support partially modified code after $save. 

Actually, through this, we can approach to our goal about saving developing time. 

So I want to know Is there any possible way that instead of re-initializing our simulation every time we want to run a test, only initialize it once and keep developing(debugging) our code ?

If we do, Could you let me know the simple example?

Hi all,

I need to develop a digital design/verification solution to compile,elaborate and simulate SV designs (basically a complex xrun wrapper). I am an experienced user of xrun and I have done a number of these wrappers over the years but this one is to be more of a tool, intented to be used Company-wise, so it needs to be very well thought and engineered.

It needs to be robust, simple and extensible. It needs to support multi-snapshot elaboration, run regressions on machine farms, collect coverage, create reports, etc.

I've been browsing the vast amount of documentation on XCELIUM and, although very good, I can't find any document which puts together all the pieces of what I am trying to achieve. I suppose I am more clear on the elaboration, compilation and simulation part but I am really lacking on the other areas like : LSF, regressions coverage, where does vManager fits in all this, etc.

I'd appreciate if someone can comment on whether there is a document which depicts how such a DV flow can be put together from scratch, or whether there is a kind of RAK with some example xrun wrapper.

Thanks

Just in time for the holidays, inside the posted tar ball is some code to solve 9x9 Sudoku puzzles with the Assertion-Driven Simulation (ADS) capability of Incisive Enterprise Verifier (IEV). Enjoy! Joerg Mueller Solutions Engineer for Team Verify

Since the release of the Automated Device Placement and Routing solution last year, we have continued to improve and build upon it. In this blog, I’ll talk about the latest addition—the Auto Device Array form—how this is an integral piece of the new Automated Device Placement and Routing solution.(read more)

In the macOS kernel, the XNU function wait_for_namespace_event() in bsd/vfs/vfs_syscalls.c releases a file descriptor for use by userspace but may then subsequently destroy that file descriptor using fp_free(), which unconditionally frees the fileproc and fileglob. This opens up a race window during which the process could manipulate those objects while they're being freed. Exploitation requires root privileges.

•An in silico clinical trial is underway with the 3DEXPERIENCE platform to evaluate the Living Heart simulated 3D heart for transforming how new devices can be tested •Five-year extension of their collaborative research agreement aims to spur medical device innovation by enabling innovative, new product designs •Both Dassault Systèmes and the FDA recognize the transformative impact of modeling and simulation on public health and patient safety

•Annual event in Shanghai gathers global decision-makers to discuss digital trends, insights and best practices for sustainable manufacturing in the Industry Renaissance •Speakers include thought leaders from ABB, Accenture, China Center for Information Industry Development, FAW Group Corporation, Huawei, IDC, SATS •Interactive workshops featuring the 3DEXPERIENCE platform highlight the transformative role of virtual worlds on the creation of new customer experiences

•Customers can seamlessly extend their design to manufacturing ecosystem to the cloud with the integrated 3DEXPERIENCE.WORKS portfolio, enabling new levels of functionality, collaboration, agility and operational efficiency •Latest release of 3D design and engineering portfolio features hundreds of enhancements, new capabilities and workflows to accelerate and improve product development •Over six million SOLIDWORKS users can innovate products faster with better performance and streamlined...

VÉLIZY-VILLACOUBLAY, France and NEW YORK — September 24, 2019 – Dassault Systèmes SE (Dassault Systèmes) (Euronext Paris: #13065, DSY. PA) and Medidata Solutions, Inc. ("Medidata") (NASDAQ: MDSO) announced that the Committee on Foreign Investment in the United States (CFIUS) will initiate an additional 45 calendar day examination for the proposed acquisition of Medidata by Dassault Systèmes. The parties continue to target the fourth quarter of 2019 for the closing of the...

VÉLIZY-VILLACOUBLAY, France — October 24, 2019 — Dassault Systèmes (Euronext Paris: #13065, DSY.PA) announces IFRS unaudited financial results for the third quarter and nine months ended September 30, 2019. These results were reviewed by the Group’s Board of Directors on October 23, 2019. This press release also includes financial information on a non-IFRS basis with reconciliations included in the Appendix to this communication. All IFRS and non-IFRS figures are presented in compliance...

●Electric air mobility pioneer used the 3DEXPERIENCE platform on the cloud to develop prototype in two years ●“Reinvent the Sky” industry solution experience provides full data security in a single, standards-based environment ●Dassault Systèmes enables companies of all sizes to create new categories of sustainable air mobility systems that will change how the world travels

•Fifteen new disruptive projects and startups from Belgium, China, France, India, South Africa and the U.S. join the 3DEXPERIENCE Lab accelerator program •New incubator and fab lab partners including Centech in Canada and OuiCrea in China will empower early stage projects from the outset •Since 2015, the 3DEXPERIENCE Lab has evaluated nearly 500 projects and grown its network of mentors to 1,200

ASP-DEv XM Forums RC 3 suffers from a remote SQL injection vulnerability. Note that this finding houses site-specific data.

DevExpress ASP.NET File Manager versions 10.2 through 13.2.8 suffer from a directory traversal vulnerability.