"Colorblind" teaching isn’t going to cut it, writes Vanderbilt University’s H. Richard Milner IV.

Spending more on public education—and less on law enforcement—is gaining traction as the Black Lives Matter movement fuels broader calls for racial justice and police reform.

Lara Fowler, chief sustainability officer at Penn State, director of Penn State Sustainability, and teaching professor of law, will give the talk, “Decarbonizing Penn State: How Does Law, Policy, and Financing Fit In?” at 4 p.m. on Monday, Nov. 18, in 112 Walker Building on the University Park campus, as well as via Zoom.

"Colorblind" teaching isn’t going to cut it, writes Vanderbilt University’s H. Richard Milner IV.

Palak Nagpal recommends using raw cacao powder to make this guilt-free delicious dessert.

The Jharkhand High Court on Tuesday issued a notice to cricket star Mahendra Singh Dhoni in a case filed by his former partners Mihir Diwakar and Soumya Das.

Gigabyte M27QA ICE monitor has been launched in India. It joins the Taiwanese manufacturer’s extensive lineup of gaming monitors and boasts features such as a 27-inch panel with QHD resolution, a refresh rate of 180Hz, and AMD FreeSync technology for improved visuals. Gigabyte says its monitor carries support for OSD Sidekick software which enables users to tweak various display settings and allows for further customisation through the keyboard and mouse.

Ahead of the film's release, Vikrant made a surprise visit to Godhra railway station on Monday, the site where the Sabarmati incident happened

The film was originally set for 2022, but was delayed multiple times by the pandemic and SAG-AFTRA actors strike. It's now scheduled to be released on May 23, 2025.

As the world leaders converge in the UAE for the COP28 this week to chalk out strategies for climate mitigation, Adani Power announced it has taken up a green ammonia combustion pilot project at its Mundra plant.

Whether you're a seasoned traveller or a first-time visitor, Bonita's exciting menu and welcoming vibe make it a must-visit for food lovers in South Goa!

If you love the show 'Friends' and adore your kitchen, dearest reader, you might be the real-life Monica Geller!

Delaware Day honors the anniversary of Delaware becoming the first state to ratify the U.S. Constitution on Dec. 7, 1787.

Delaware’s History stretches back almost four hundred years, with its first European settlers landing long before it became the First State. By the time the American Revolution ended, Delaware had been ruled by three different kingdoms and had endured several major conflicts. In “Colonial Delaware: A History”, John A. Munroe examines Delaware’s rich history, from […]

For Immediate Release | May 11, 2022 (Milford, DE) – Delaware Libraries invite local families to the Milford Public Library, 11 SE Front St, Milford, DE 19963, on Wednesday, May 11 at 11:00am to celebrate the arrival of a new interactive, literacy tool for children. The Toniebox, a reading device for preschoolers and elementary school […]

The Office of Veterans Services and the Delaware Commission of Veterans Affairs have scheduled two events in observance of Memorial Day. As in previous years, OVS and the Commission will host ceremonies on separate days. The first will take place on Saturday, May 28, 2022, at the Delaware Veterans Memorial Day Cemetery in Bear. The […]

The Office of Veterans Services (OVS) and the Delaware Commission of Veterans Affairs (DCVA) have scheduled two events in observance of Memorial Day. As in previous years, OVS and DCVA will host ceremonies on separate days. The first will take place on Saturday, May 27, 2023, at the Delaware Veterans Memorial Ceremony in Bear, Delaware. […]

Division of Civil Rights and Public Trust is prosecuting the case Following an investigation by the Division of Civil Rights and Public Trust, a New Castle County grand jury charged a Dover man with multiple felonies for removing and pointing a handgun toward others while he participated in a counter-protest on September 24, 2020.  Michael […]

Prosecutors with the Delaware Department of Justice have secured 56 new felony convictions—including two first-degree murders and a litany of gun offenses—in a trial against the last remaining defendant in the State’s yearslong case against the violent gang NorthPak, Attorney General Kathy Jennings announced Monday.  “I’m grateful for the police and prosecutors who answered the […]

Prosecutors have secured multiple felony convictions, including Delaware’s first-ever conviction for Deprivation of Civil Rights, against a Delaware State Trooper for the assault of two juvenile victims, Attorney General Kathy Jennings announced Friday. Dempsey Walters, 30, was indicted in September 2023 for assaulting two victims — a 17-year-old and a 15-year-old, whose orbital socket was […]

The Delaware Hospital for the Chronically Ill (DHCI) in Smyrna is asking members of the community to sponsor a resident for the holidays. Since many residents have little family involvement or support, the nursing home relies on the generosity of community members including neighbors, local businesses, community organizations, and volunteers to help fulfill resident wishes at the holidays through the Adopt-A-Resident Program.

The Delaware Division of Public Health (DPH), in collaboration with the Delaware Division of Professional Regulation (DPR), announces important updates to the Mental Health and Substance Use Disorder section of the My Healthy Community (MHC) Dashboard.  These updates are located within this section’s Prescription Monitoring Program (PMP) tab and present trends in prescription drug dispensing in Delaware. The […]

SMYRNA (October 16, 2023) – The Delaware Hospital for the Chronically Ill (DHCI) in Smyrna is asking members of the community to sponsor a resident for the holidays. DHCI is a licensed Skilled Nursing Facility, operated by the Delaware Division of Services for Aging and Adults with Physical Disabilities, dedicated to comprehensive nursing home services […]

NEW CASTLE – The Delaware Department of Health and Social Services’ Division of Substance Abuse and Mental Health (DSAMH) announces significant advancement in capabilities for the Delaware Treatment and Referral Network (DTRN) with the launch of DTRN360, a Behavioral Health Coordination platform. DTRN360 is designed to bridge the gaps experienced by providers in caring for […]

The Delaware Department of Transportation (DelDOT) in partnership with the Delaware State Police announce that beginning Monday, January 17, 2022, the pilot Electronic Speed Safety Program will be active only in the I-95 construction zone in Wilmington and will last until the end of the project. The goal of the pilot program is to reduce […]

The Delaware Department of Transportation (DelDOT) in partnership with the Delaware State Police announce the warning period for the Electronic Speed Safety Program in the I-95 construction zone in Wilmington ends on Sunday, April 17, 2022. Beginning Monday, April 18, 2022, first-time offenders will receive a warning and all subsequent violations will result in a […]

The Delaware Department of Transportation (DelDOT) in partnership with the Delaware State Police announce that beginning Monday, July 8, 2024, the Electronic Speed Safety Program (ESSP) will be active in the I-95/Route 896 construction zone in Newark and will last until the end of the project.

The Delaware Division of Public Health’s (DPH) Physical Activity, Nutrition, and Obesity Prevention (PANO) Program released The Burden of Chronic Disease in Delaware 2024 report on June 28, 2024. The report summarizes the current state of chronic diseases and related risk factors in Delaware. It is an update to, and expansion of, Chronic Disease in Delaware: Facts and Figures, published in 2019 by DPH’s […]

A high school social studies teacher from the Colonial School District is Delaware’s 2025 State Teacher of the Year.

WILMINGTON, Del. – Today, Delaware Governor John Carney, U.S. Senators Tom Carper and Chris Coons and U.S. Representative Lisa Blunt Rochester (all D-Del.) announced $127.5 million for Port Wilmington as part of the U.S. Environmental Protection Agency’s (EPA) Clean Ports Program, a $3 billion investment by the Biden-Harris Administration in zero-emission port equipment and infrastructure. The […]

Read the in depth Review of Onida 43 Inches Full HD Smart IPS LED TV(Fire TV Edition) TV. Know detailed info about Onida 43 Inches Full HD Smart IPS LED TV(Fire TV Edition) configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

Read the in depth Review of Redmi SonicBass Wireless Earphones Audio Video. Know detailed info about Redmi SonicBass Wireless Earphones configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

Read the in depth Review of Acer Iconia A1-811 Tablets. Know detailed info about Acer Iconia A1-811 configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

Read the in depth Review of Zebronics Juke bar 9700 Pro Dolby Atmos Audio Video. Know detailed info about Zebronics Juke bar 9700 Pro Dolby Atmos configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

Read the in depth Review of Shure AONIC 5 Audio Video. Know detailed info about Shure AONIC 5 configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

Read the in depth Review of BenQ MOBIUZ EX270QM 240 Hz 27-inch Gaming Monitor Audio Video. Know detailed info about BenQ MOBIUZ EX270QM 240 Hz 27-inch Gaming Monitor configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

Fight back against sophisticated money launderers with these 3 techniques.

The post 3 techniques to improve AML transaction monitoring strategies appeared first on The Data Roundtable.

Smart baby monitor company Nanit raised a $14M Series B round led by Jerusalem Venture Partners (JVP). Other investors that participated include existing investors Upfront Ventures, RRE Ventures, Vulcan Capital and Vaal Investment Partners. The latest investment brings total equity funding of Nanit to $30M.

Nanit announced it will use the funding proceeds to expand its team of computer vision and machine learning engineers and grow its sales in Europe and Canada.

Nanit’s baby monitor helps new parents oversee nursery conditions as it has built-in temperature and humidity sensors. The camera lets parents remotely monitor baby’s crib whereas sound and motion are detected via smart sensors.

The monitor’s insights can be accessed via an accompanying mobile app. Nanit charges $10 per month for its premium package.

The key use cases of Nanit’s baby monitoring technology include sleep insights, behavioral analysis, expert guidance, and nightly video summaries. The company currently sells its smart monitors via its website.

[SAnews.gov.za] Twenty-three people in Gauteng have died as a result of food borne-related poisoning after consuming food from spaza shops.

In the rapidly evolving landscape of automotive electronics, traditional monolithic design approaches are giving way to something more flexible and powerful—chiplets. These modular microchips, which are themselves parts of a whole silicon system, offer unparalleled potential for improving system performance, reducing manufacturing costs, and accelerating time-to-market in the automotive sector. However, the transition to working with chiplets in automotive electronics is not without its challenges.

Designers must now grapple with a new set of considerations, such as die-to-die interconnect standards, complex processes, and the integration of diverse IPs. Advanced toolsets and standardized design approaches are required to meet these challenges head-on and elevate the potential of chiplets in automotive innovation. In the following discourse, we will explore in detail the significance of chiplets in the context of automotive electronics, the obstacles designers face when working with this paradigm, and how Cadence comprehensive suite of IPs, tools, and flows is pioneering solutions to streamline the chiplet design process.

Unveiling Chiplets in Automotive Electronics

For automotive electronics, chiplets offer a methodology to modularize complex functionalities, integrate different chiplets into a package, and significantly enhance scalability and manufacturability. By breaking down semiconductor designs into a collection of chiplets, each fulfilling specific functions, automotive manufacturers can mix and match chiplets to rapidly prototype new designs, update existing ones, and specialize for the myriad of use cases found in vehicles today.

The increasing significance of chiplets in automotive electronics comes as a response to several industry-impacting phenomena. The most obvious among these is the physical restriction of Moore's Law, as large die sizes lead to poor yields and escalating production costs. Chiplets with localized process specialization can offer superior functionality at a more digestible cost, maintaining a growth trajectory where monolithic designs cannot. Furthermore, chiplets support the assembly of disparate technologies onto a single subsystem, providing a comprehensive yet adaptive solution to the diverse demands present in modern vehicles, such as central computing units, advanced driver-assistance systems (ADAS), infotainment units, and in-vehicle networks. This chiplet-based approach to functional integration in automotive electronics necessitates intricate design, optimization, and validation strategies across multiple domains.

The Complexity Within Chiplets

Yet, with the promise of chiplets comes a series of intricate design challenges. Chiplets necessitate working across multiple substrates and technologies, rendering the once-familiar 2-dimensional design space into the complex reality of multi-layered, sometimes even three-dimensional domains. The intricacies embedded within this design modality mandate devoting considerable attention to partitioning trade-offs, signal integrity across multiple substrates, thermal behavior of stacked dies, and the emergence of new assembly design kits to complement process design kits (PDKs).

To effectively address these complexities, designers must wield sophisticated tools that facilitate co-design, co-analysis, and the creation of a robust virtual platform for architectural exploration. Standardizations like the Universal Chip Interconnect Express (UCIe) have been influential, providing a die-to-die interconnect foundation for chiplets that is both standardized and automotive-ready. The availability of UCIe PHY and controller IP from Cadence and other leading developers further eases the integration of chiplets in automotive designs.

The Role of Foundries and Packaging in Chiplets

Foundries have also pivoted their services to become a vital part of the chiplet process, providing specialized design kits that cater to the unique requirements of chiplets. In tandem, packaging has morphed from being a mere logistical afterthought to a value-added aspect of chiplets. Organizations now look to packaging to deliver enhanced performance, reduced power consumption, and the integrity required by the diverse range of technologies encompassed in a single chip or package. This shift requires advanced multiscale design and analysis strategies that resonate across a spectrum of design domains.

Tooling Up for Chiplets with Cadence

Cadence exemplifies the rise of comprehensive tooling and workflows to facilitate chiplet-based automotive electronics design. Their integrations address the challenges that chiplet-based SoCs present, ensuring a seamless design process from the initial concept to production. The Cadence suite of tools is tailored to work across design domains, ensuring coherence and efficiency at every step of the chiplet integration process.

For instance, Cadence Virtuoso RF subflows have become critical in navigating radio frequency (RF) challenges within the chiplets, while tools such as the Integrity 3D-IC Platform and the Allegro Advanced Multi-Die Package Design Solution have surfaced to enable comprehensive multi-die package designs. The Integrity Signal Planner extends its capabilities into the chiplet ecosystem, providing a centralized platform where system-wide signal integrity can be proactively managed. Sigrity and Celsius, on the other hand, offer universally applicable solutions that take on the challenges of chiplets in signal integrity and thermal considerations, irrespective of the design domain. Each of these integrated analysis solutions underscores the intricate symphony between technology, design, and packaging essential in unlocking the potential of chiplets for automotive electronics.

Cadence portfolio includes solutions for system analysis, optimization, and signoff to complement these domain-specific tools, ensuring that the challenges of chiplet designs don't halt progress toward innovative automotive electronics. Cadence enables designers to engage in power- and thermal-aware design practices through their toolset, a necessity as automotive systems become increasingly sophisticated and power-efficient.

A Standardized Approach to Success with Chiplets

Cadence’s support for UCIe underscores the criticality of standardized approaches for heterogeneous integration by conforming to UCIe standards, which numerous industry stakeholders back. By co-chairing the UCIe Automotive working group, Cadence ensures that automotive designs have a universal and standardized Die-to-Die (D2D) high-speed interface through which chiplets can intercommunicate, unleashing the true potential of modular design.

Furthermore, Cadence champions the utilization of virtual platforms by providing transaction-level models (TLMs) for their UCIe D2D IP to simulate the interaction between chiplets at a higher level of abstraction. Moreover, individual chiplets can be simulated within a chiplet-based SoC context leveraging virtual platforms. Utilizing UVM or SCE-MI methodologies, TLMs, and virtual platforms serve as first lines of defense in identifying and addressing issues early in the design process before physical silicon even enters the picture.

Navigating With the Right Tools

The road to chiplet-driven automotive electronics is one paved with complexity, but with a commitment to standards, it is a path that promises significant rewards. By leveraging Cadence UCIe Design and Verification IP, tools, and methodologies, automotive designers are empowered to chart a course toward chiplets and help to establish a chiplet ecosystem. With challenges ranging from die-to-die interconnect to standardization, heterogeneous integration, and advanced packaging, the need for a seamless integrated flow and highly automated design approaches has never been more apparent. Companies like Cadence are tackling these challenges, providing the key technology for automotive designers seeking to utilize chiplets for the next-generation E/E architecture of vehicular technology.

In summary, chiplets have the potential to revolutionize the automotive electronics industry, breathing new life into the way vehicles are designed, manufactured, and operated. By understanding the significance of chiplets and addressing the challenges they present, automotive electronics is poised for a paradigm shift—one that combines the art of human ingenuity with the power of modular and scalable microchips to shape a future that is not only efficient but truly intelligent.

Learn more about how Cadence can help to enable automakers and OEMs with various aspects of automotive design.

The automotive industry is currently on the cusp of a radical evolution, steering towards a future where cars are not just vehicles but sophisticated, software-defined vehicles (SDV). This shift is marked by an increased reliance on automation and a significant increase in the use of sensors to improve safety and reliability. However, the increasing number of sensors has led to higher compute demands and poses challenges in managing a wide variety of data. The traditional method of using separate processors to manage each sensor's data is becoming obsolete. The current trends necessitate a unified processing system that can deal with multimodal sensor data, utilizing traditional Digital Signal Processing (DSP) and AI-driven algorithms. This approach allows for more efficient and reliable sensor fusion, significantly enhancing vehicle perception. Developers often face difficulties adhering to stringent power, performance, area, and cost (PPAC) and timing constraints while designing automotive SoCs.

Cadence, with its groundbreaking products and AI-powered processors, is enabling designers and automotive manufacturers to meet the future sensor fusion demands within the automotive sector. At the recent CadenceLive Silicon Valley 2024, Amol Borkar, product marketing director at Cadence, showcased the company's dedication and forward-thinking solutions in a captivating presentation titled "Addressing Tomorrow’s Sensor Fusion Needs in Automotive Computing with Cadence." This blog aims to encapsulate the pivotal takeaways from the presentation. If you missed the chance to watch this presentation live, please click here to watch it.

Significant Trends in the Automotive Market – Industry Landscape

We are witnessing a revolution in automotive technology. Innovations like occupant and driver monitoring systems (OMS, DMS), 4D radar imaging, LiDAR technology, and 360-degree view are pushing the boundaries of what's possible, leading us into an era of remarkable autonomy levels—ranging from no feet or hands required to eventually no eyes needed on the road.

Sensor Fusion and Increasing Processing Demands—Sensor fusion effectively integrates data from different sensors to help vehicles understand their surroundings better. Its main benefit is in overcoming the limitations of individual sensors. For example, cameras provide detailed visual information but struggle in low-light or lousy weather. On the other hand, radar is excellent at detecting objects in these conditions but lacks the detail that cameras provide. By combining the data from multiple sensors, automotive computing can take advantage of their strengths while compensating for their weaknesses, resulting in a more reliable and robust system overall.

One thing to note is that the increased number of sensors produces various data types, leading to more pre-processing.

On-Device Processing—As the industry moves towards autonomy, there is an increasing need for on-device data processing instead of cloud computing to enable vehicles to make informed decisions. Embracing on-device processing is a significant advancement for facilitating real-time decisions and avoiding round-trip latency.

AI Adoption—AI has become integral to automotive applications, driving safety, efficiency, and user experience advancements. AI models offer superior performance and adaptability, making future-proofing a crucial consideration for automotive manufacturers. AI significantly enhances sensor fusion algorithms, offering scalability and adaptability beyond traditional rule-based approaches. Neural networks enable various fusion techniques, such as early fusion, late fusion, and mid-fusion, to optimize the integration and processing of sensor data.

Future Sensor Fusion Needs

Automotive architectures are continually evolving. With current trends and AI integration into radar and sensor fusion applications, SoCs should be modular, flexible, and programmable to meet market demands.

Heterogeneous Architecture- Today's vehicles are loaded with various sensors, each with a unique processing requirement. Running the application on the most suitable processor is essential to achieve the best PPA. To meet such requirements, modern automotive solutions require a heterogeneous compute approach, integrating domain-specific digital signal processors (DSPs), neural processing units (NPUs), central processing unit (CPU) clusters, graphics processing unit (GPU) clusters, and hardware accelerator blocks. A balanced heterogeneous architecture gives the best PPA solution.

Flexibility and Programmability- The industry has come a long way from using computer vision algorithms such as HOG (Histogram Oriented Gradient) to detect people and objects, HAR classifier to detect faces, etc., to CNN and LSTM-based AI to Transformer models and graphical neural networks (GNN). AI has evolved tremendously over the last ten years and continues to evolve. To keep up with the evolving rate of AI, SoC design must be flexible and programmable for updates if needed in the future.

Addressing the Sensor Fusion Needs with Cadence

Cadence offers a complete suite of hardware and software products to address the increasing compute requirements in automotive. The comprehensive portfolio of Tensilica products built on the robust 32-bit RISC architecture caters to various automotive CPU and AI needs. What makes them particularly appealing is their scalability, flexibility, and configurability, offering many options to meet diverse needs.

The Xtensa family of products offers high-quality, power-efficient CPUs. Tensilica family also includes AI processors like Neo NPUs for the best power, performance, and area (PPA) for AI inference on devices or more extensive applications. Cadence also offers domain-specific products for DSPs such as HIFI DSPs, specialized DSPs and accelerators for radar and vision-based processing, and a general-purpose family of products for floating point applications.

The ConnX family offers a wide range of DSPs, from compact and low-power to high-performance, optimized for radar, lidar, and communications applications in ADAS, autonomous driving, V2X, 5G/LTE/4G, wireless communications, drones, and robotics. Tensilica's ISO26262 certification ensures compliance with automotive safety standards, making it a trusted partner for advanced automotive solutions. The Cadence NeuroWeave Software Development Kit (SDK) provides customers with a uniform, scalable, and configurable ML interface and tooling that significantly improves time to market and better prepares them for a continuously evolving AI market. Cadence Tensilica offers an entire ecosystem of software frameworks and compilers for all programming styles.

Tensilica's comprehensive software stack supports programming for DSPs, NPUs, and accelerators using C++, OpenCL, Halide, and various neural network approaches. Middleware libraries facilitate applications such as SLAM, radar processing, and Eigen libraries, providing robust support for automotive software development.

Conclusion

Cadence’s Tensilica products offer a development toolchain and various IPs tailored for the automotive industry, covering audio, vision, radar, unified DSPs, and NPUs. With ISO certification and a robust partner ecosystem, Tensilica solutions are designed to meet the future needs of automotive computing, ensuring safety, efficiency, and innovation.

Learn More

• Cadence Automotive Solutions
• Cadence Automotive IP
• Sensor Fusion and ADAS in TSMC Automotive Processes
• Revolution on the Road: How Cadence is Driving the Future of Automotive Design!
• Taming Design Complexity in Chiplet-Based Automotive Electronics
• UCIe and Automotive Electronics: Pioneering the Chiplet Revolution

In a network containing multiple nodes, the need for synchronization between the various nodes is not just instrumental but also a complicated and highly complex process. This process becomes even more tricky if we synchronize the clocks between the Manager and the Peripheral. As we know, in a real-time network, some of the nodes would behave like Managers while some would be a Peripheral. If we must make the communication process smooth, then the local clocks of these nodes must be synchronized. 

The problem with this synchronization is that we have the clock running in the Manager as well. If we send the value of the Manager clock to the Peripheral, the synchronization doesn’t happen as we have a propagation delay of the messages, along with the propagation delay of the electronic circuits of Manager and the Peripheral.  

The cherry on the cake is that these electronic circuit propagation delays are not random and remain constant, so we can add a time offset to it to match the clock. To tackle this challenge, IEEE has come up with a protocol named “Precision Timing Protocol.” 

Operation of PTP: 

To synchronize the clocks, a Sync message is sent by the Manager to the Peripheral, which then timestamps the receiving time of the same. Following this, a ‘Follow up’ message is issued by the Manager stating the timestamp at which the Sync message was sent. 

The Peripheral then finds the difference between the two values and adds this to its current time. After this, the time difference between the Manager and the Peripheral narrows down to only the propagation delay of the messages.  

To overcome this, the Peripheral issues a ‘Delay Request’ to the Manager, and the Manager, in turn, issues a ‘Delay Response.’ Both these messages have the timestamp of when they were issued. The time at which they are received is then noted. Since two messages are sent, one from the Peripheral and the other from the Manager, there are two propagation delays. Then half of this value is our propagation delay. 

The Peripheral then adds this propagation delay to its clock, and hence the clock gets synchronized. 

Advantages of PTP: 

1. It provides accurate time stamping. 
2. It is a well-known clock synchronization protocol. 
3. It provides intensified security inside the premises. 
4. It provides the possibility of setting coordinated actions and synchronized communication. 

There are various versions of PTP that have been developed over time, namely PTPv1, PTPv2, PTPv2_1, and the latest PTP-AS. 

Cadence Verification IP for Ethernet is available to support the newer version of PTP, allowing simulation of the device for efficient IP, SoC, and system-level design verification. Semiconductor companies can start using it to fully verify their controller design and achieve functional verification closure on it within no time. 

Melika Roshandell talks with David Malinak in a Microwaves & RF QuickChat video about the thermal challenges in today’s complex electronic designs and how the Celsius solver uniquely addresses them.(read more)

With the latest release (Sigrity and Systems Analysis 2022.1 HF2) of Clarity  3D Solver, support for encrypted component models is now available. With this functionality, vendors that supply 3D components, such as connectors, can now merge their...(read more)

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Dear all,

Hi!

I'm trying to do a Harmonic Balance (HB) Large-Signal S-Parameter (LSSP) simulation to figure out the input impedance of a nonlinear circuit.

Through this simulation, what I want to know is the large-signal S11 only (not S12, S21 and S22).

So, I have simulated with only single port (PORT0) at input, but LSSP simulation is terminated and output log shows following text.

" Analysis `hb' was terminated prematurely due to an error "

The LSSP simulation does not proceed without second port.

Should I use floating second port (which is not necessary for my circuit) to succeed the LSSP simulation?

Does the LSSP simulation really need two ports?

Below figure is my HB LSSP simulation setup.

Additionally, Periodic S-Parameter (PSP) simulation using HB is succeeded with only single port.

What is the difference between PSP and LSSP simulations?

Authorities in the US, the EU and across the developed world are stepping up efforts to scrutinise foreign investment on the grounds of both national security and tech sovereignty.

What kind of car is the 2025 Hyundai Ioniq 5? What does it compare to? Hyundai’s Ioniq 5 is a small hatchback EV with value baseline pricing. Rivals include the VW ID.4, Tesla Model Y, and Ford Mustang Mach-E. Is the 2025 Hyundai Ioniq 5 a good car? Yes. This Hyundai is one of the better options in its segment, with peppy performance...