A cutting head has a resilient male coupling member. The cutting head has a central resilience slit that extends between two major surfaces and opens out to the male coupling member and at least one lateral resilience slit that extends between the two major surfaces and opens out to a base surface. The central resilience slit and the at least one lateral resilience slit each have forwardmost points, located forward of the base surface. Also, a cutting tool that has a tool holder with the cutting head secured thereto. The tool holder has an insert pocket that includes a forward facing holder base abutment surface that has a female coupling member. In a locked position, the male coupling member is resiliently retained in the female coupling member. All points on the male coupling member are under deflection.

The present invention relates to a hole-saw assembly includes a hole-saw having at one end a plurality of cutting teeth and with a boss attached to the hole-saw at the other end two shafts. The assembly includes a mandrel coaxially aligned with said hole-saw and including a body having two bores there through coaxially aligned with said shafts. An annulus located on top of the body is coaxially aligned with said mandrel and hole saw and includes two holes, the annulus rotatable around its longitudinal axis from a first to a second position. In the first position the annulus holes are aligned with the bores and shafts allowing the shafts to be freely insertable and removable and in the second position the holes are misaligned to lock the shafts to the annulus. The mandrel further includes a pair of driving pins adapted to engage driving apertures found in hole-saws especially larger ones. Typically the driving pins may be biased to enable the assembly to be used even with those hole-saws that do not include driving apertures and that also enables easier assembly of the device. A compressible O-ring may further facilitate the operation of the assembly. This device avoids the problem of thread stripping. The invention further provides for a boss that can be used with larger hole-saws and includes notches that accommodate driving pains extending on the side of the boss and where appropriate into the driving apertures.

The invention relates to a main housing element for a multi-part housing of an electrical device. The main housing element consists of a frame element and at least one connector element integrated in the frame element and produced in one piece with the frame element. The connecting region between the at least one connector element and the frame element is configured as a predetermined breaking point. In the course of assembly of the main housing element a mechanical separation of the connector element from the frame element takes place, whereby the connector element and the frame element are uncoupled.

Provided is a resistive element which has excellent inrush current resistance, and can suppress heat generation in a steady state. The resistive element has an element main body of a semiconductor ceramic in which the main constituent has a structure of R11-xR2xBaMn2O6 in which 0.05≦x≦1.0 when R1 is Nd and R2 is at least one of Sm, Eu and Gd; 0.05≦x≦0.8 when R1 is Nd and R2 is at least one of Tb, Dy, Ho, Er, and Y; 0≦x≦0.4 when R1 is at least one of Sm, Eu, and Gd and R2 is at least one of Tb, Dy, Ho, and Y; and 0≦x≦1.0 when R1 is at least one of Sm, Eu, and Gd and R2 is at least one of Sm, Eu, and Gd, but the Sm, Eu, and/or Gd in R1 is different from that in R2.

A heater assembly includes one or more first heating elements, the one or more first heating elements being characterized by a positive temperature coefficient; and one or more second heating elements, the one or more second heating elements comprising resistance wire elements. The one or more second heating elements are positioned in proximity to the one or more first heating elements such that at least one of the one or more second heating elements is configured to, upon being powered on, pre-heat at least one of the one or more first heating elements before the at least one first heating element is powered on.

Provided is a resistive element which is excellent in inrush current resistance even in the case of having a surface-mountable small chip shape. The resistive element has an element main body composed of a semiconductor ceramic in which a main constituent thereof is composed of a Mn compound represented by the general formula (Nd1-xMx)yBazMn2O6 (M is at least one rare-earth element selected from Sm, Gd, Eu, Tb, Dy, Ho, Er, and Y), and x, y, and z respectively meet the conditions of: 0.05≦x≦0.4; 0.80≦y≦1.2; and 0.80≦z≦1.2 in the chemical formula.

A welding workbench assembly comprises a base. The welding workbench assembly further comprises a first wraparound barrier comprising at least three panels, including a first panel, a second panel, and a third panel. The second panel is adjacent to the first panel at a first end of the first panel and the third panel is adjacent to the first panel at a second end of the first panel. The welding workbench assembly further comprises a second wraparound barrier comprising at least three panels, including a fourth panel, a fifth panel, and a sixth panel. The fifth panel is adjacent to the fourth panel at a first end of the fourth panel and the sixth panel is adjacent to the fourth panel at a second end of the fourth panel.

A support disk fixing apparatus which includes an upper surface to which a wafer is bonded, a lower surface, a cylindrical side surface between the upper surface and the lower surface, and a chamfered portion between the upper surface and the side surface, includes a base upon which the support disk is placed; and a fixture that is provided on the base, and that has a first surface that abuts against the side surface of the support disk and covers the side surface of the support disk, and a second surface that abuts against the chamfered portion of the support disk and covers the chamfered portion of the support disk.

A retractable assembly for introducing an insertable device into a container through a container opening, comprising: a linear guide, which is releasably mountable on the container via a holder; and, guided along the linear guide, a slider, on which an articulated head is so seated, that it has at least two degrees of freedom perpendicular to the linear guide, wherein the insertable device is at least axially guided in the articulated head in the mounted state.

A support structure for supporting a semiconductor device during a bonding operation is provided. The support structure comprises a body portion defining an upper surface configured to support a semiconductor device during a bonding operation. The upper surface defines a constraining feature for constraining at least a portion of the semiconductor device during the bonding operation.

A digital camera includes an image capture assembly; a print media transport assembly; a pagewidth ink jet printhead; a roll of print media; an internal chassis serving as a frame on which the image capture assembly, the print media transport assembly, and the printhead are directly supported; and an external casing completely encasing therewithin the internal chassis. The external casing is openable, and the internal chassis together with the assemblies and printhead supported thereon are removable from the external casing. The internal chassis is provided as an integral frame configured with pre-molded fittings adapted to receive and support the assemblies and printhead.

An electric motor assembly includes a multi-phase electric motor, a battery of accumulators, an inverter configured to convert the direct current of the battery into multi-phase alternating current adapted to supply the motor, and a connection housing. The connection housing includes plugs allowing connection of motor phases, the battery terminals, and at least five connections to the inverter. The housing further includes a group of contacts allowing it to be connected to a single phase mains system, and a group of contacts allowing it to be connected a multi-phase mains system. The housing includes switches according to the position of which the system including the housing, the battery, the inverter, and the motor connected solely by its phases, alternatively allows the motor to be supplied from the battery, the battery to be recharged directly from a single-phase mains system, and the battery to be recharged from multi-phase mains system.

An insertion and removal assembly for installing and removing hard drives from an enclosure, such as a computer chassis, is provided. The insertion and removal assembly includes a sliding member configured to receive a hard drive, a lever handle rotatably connected to the sliding member and an attachment wall having a plurality of protrusions defining a plurality of slots, each slot configured to receive one sliding member. A user reveals a slot for accepting the installation of the hard drive in the enclosure by pushing a tab on the attachment wall near a distal portion of the lever handle to release the lever handle and then pulling the lever handle outward exposing the sliding member. A hard drive is inserted into the sliding member and pushed inwardly into the chassis. Conversely, the sliding member can contain a hard drive which is partially ejected by unlatching and subsequently pulling the lever.

A power semiconductor has power terminals arranged in a row at one side of the housing, with control terminals arranged in a row at the other side of the housing. The spacing between adjacent power terminals is greater than the spacing between adjacent control terminals.

An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.

A semiconductor device effectively suppress the problem of mutual interaction occurring between an inductor element and wires positioned above the inductor element formed over the same chip. A semiconductor device includes a semiconductor substrate and a multi-wiring layer formed overlying that semiconductor substrate, and in which the multi-wiring layer includes: the inductor element and three successive wires and a fourth wire formed above the inductor element; and two shielded conductors at a fixed voltage potential and covering the inductor element as seen from a flat view, and formed between the inductor element and three successive wires and a fourth wire formed above the inductor element.

An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.

A power inverter includes a power semiconductor module that includes a power semiconductor device, a control circuit board that outputs a control signal used for controlling the power semiconductor device, a driver circuit board that outputs a driving signal used for driving the power semiconductor device, a conductive metal base plate arranged in a space between the driver circuit board and the control circuit board in which a fine and long opening portion is formed, wiring that connects the driver circuit board and the control circuit board through the opening portion and delivers the control signal to the driver circuit board, and an AC busbar that is arranged on a side opposite to the metal base plate through the driver circuit board and delivers an AC current output from the power semiconductor module to a drive motor. At least a portion of the AC busbar that faces the opening portion extends in a direction directly running in a longitudinal direction of the fine and long opening portion.

In a pump housing of a motor-vehicle hydraulic assembly, on which at least two inlet-valve openings, at least two outlet-valve openings, at least one high-pressure control valve opening and at least one switchover-valve opening and a pressure-sensor connection are formed. The at least two inlet-valve openings are arranged in a first row, the at least two outlet-valve openings are arranged in a following second row, the pressure sensor connection is arranged in a further following third row, and the at least one high-pressure control valve opening and the at least one switchover valve opening are arranged in a further following fourth row. There are also five embodiments of arrangements of connecting lines and holes in a pump housing for the short connection of the valve openings and connections, and one embodiment with respect to the use of the pump housing according to one of the six embodiments.

The invention relates to an electric motor assembly, particularly for driving a fan for an engine cooling system and/or an air conditioner of a motor vehicle, comprising an electric motor and a motor control device for activating the electric motor. According to the invention, the motor control device can be adjusted according to a characteristic curve (1,2,3,4) of the electric motor and/or of the fan, and thereby the power and/or rotational speed of the electric motor can be adjusted.

Reduction in cooling rate of a substrate having a lower temperature is suppressed because the substrate having a lower temperature is not affected by radiant heat of a substrate having a higher temperature while cooling a plurality of substrates in a cooling chamber. The substrate processing apparatus includes a load lock chamber configured to accommodate stacked substrates; a first transfer mechanism having a first transfer arm provided with a first end effector, and configured to transfer the substrates into/from the load lock chamber at a first side of the load lock chamber; a second transfer mechanism having a second transfer arm provided with a second end effector, and configured to transfer the substrates into/from the load lock chamber at a second side of the load lock chamber; a barrier installed between the substrates to be spaced apart from the substrates supported by a substrate support provided in the load lock chamber; and an auxiliary barrier unit installed between the substrate support and the barrier, wherein the auxiliary barrier unit is installed at places other than standby spaces of the end effectors.

A lift apparatus includes an elongated spine having a top portion and a bottom portion, a traveler operatively connected along the elongated spine for traveling up and down the elongated spine, a single linear actuator operatively connected to the traveler configured to move the traveler up and down the spine, an arm, and a single hinge operatively connected between the traveler and the arm allowing the arm to hinge outwardly and upwardly to a dump position when the traveler is proximate the top portion of the elongated spine.

While a second component is brought into contact with a first component, the first component and the second component are rotated with respect to each other around a specific rotation axis, and rotation of the first component and the second component is stopped when a moment created around the rotation axis exceeds a predetermined threshold.

A crucible handling shuttle includes a pair of opposed dual crucible-gripping arms mounted on a rotatable head and moves between an induction furnace pedestal and a crucible loading station, such that one pair of arms pick up a crucible loaded with a preweighed sample, the shuttle moves to the induction furnace, where the other pair of arms grip and remove a spent crucible. The shutter head then rotates to deposit the new sample-holding crucible onto the pedestal and subsequently moves out of the furnace area to a sample disposal chute positioned between the crucible loading station and the furnace, whereupon the spent crucible is dropped for disposal. The shuttle head is then rotated and moved to the loading station to pick up a new crucible.

Reinforcement devices and systems for holding a traffic control assembly in compression are provided. The traffic control assembly includes a traffic signal disconnect hanger and/or a traffic signal and a first span wire positioned above the traffic control assembly. In some embodiments, the reinforcement device includes an upper support device connected to the first span wire where the upper support device has a length that is greater than a width of the traffic control assembly and the upper support device is configured to spread the load of the traffic signal assembly to the first span wire. The reinforcement device includes a lower support device operably connected to the traffic signal, a first vertical support member, and a second vertical support member where the first and second vertical members are tensioned when the upper support device, the lower support device and the first and second vertical support members are connected together.

An enhanced encryption keypad (100) capable of preventing illegal disassembly for an automated teller machine comprises a key panel (101) and a main control board (102). A removal detection protection circuit is disposed inside a main chip of the main control board (102), and at least one pin of the removal detection protection circuit is guided out from a surface (1021) of a side of the main control board (102) near the key panel to form a removal detection point (1022). The removal detection point (1022) has two opened signal contact points. The two opened signal contact points are conducted by a conductive adhesive (103) to activate the removal detection protection circuit. A conductive protection ring (1023) isolated from the removal detection point is disposed at the periphery of the removal detection point. The conductive protection ring (1023) is connected to the removal detection protection circuit inside the main control chip. A protection circle (1024) is disposed at the periphery of the conductive protection ring and the corresponding conductive adhesive. The present application effectively protects the encryption keypad from illegal attacks on the removal detection point from the side.

A hook assembly includes an end cap having an outer periphery. The end cap is configured to be connected to a power tool. A hook is rotatably coupled to the outer periphery of the end cap. An O-ring is positioned between the outer periphery of the end cap and the hook. A protrusion is included on one of the outer periphery of the end cap and the hook to frictionally engage the O-ring to secure the hook in at least one selected rotational position relative to the end cap.

According to one embodiment, a system for manufacturing a semiconductor device includes a spontaneous joining unit and a deformative joining unit. The spontaneous joining unit overlaps a first substrate and a second substrate and spontaneously joins mutual center portions of respective joint faces of the first substrate and the second substrate. The deformative joining unit deforms at least one peripheral portion of the respective joint faces of the first substrate and second substrate joined by the spontaneous joining unit toward the other peripheral portion and joins the mutual peripheral portions of the respective joint faces.

A D/A conversion circuit with a small area is provided. In the D/A conversion circuit, according to a digital signal transmitted from address lines of an address decoder, one of four gradation voltage lines is selected. A circuit including two N-channel TFTs is connected in series to a circuit including two P-channel TFT, and a circuit including the circuits connected in series to each other is connected in parallel to each of the gradation voltage lines. Further, an arrangement of the circuit including the two N-channel TFTs and the circuit including the two P-channel TFTs is reversed for every gradation voltage line. By this, the crossings of wiring lines in the D/A conversion circuit becomes small and the area can be made small.

An improved manufacturing method for the hole-punching assembly of a hole-punching unit is disclosed. The method of the present invention comprises the following steps: (1) forming a plurality of aluminum balancing pieces with a rectangular shape by extrusion, and forming an indentation area on one side of each balancing piece; (2) forming an elongated slot by an application of stamping on the indentation area of each balancing piece; (3) obtaining a plurality of rectangular pieces (the number of which equals that of the balancing pieces), made of iron, and forming a row of holes by a single application of stamping on each rectangular piece; and (4) fitting each of the rectangular pieces onto the indentation area of a balancing piece, and connecting the balancing pieces together by screws or bolts. The manufacturing method can lower the production cost and simplify the production process of the hole-punching assembly.

A multiple punch and multiple die assembly has a workpiece protector which is a punch lifter that is operatively associated with each punch for supporting each of the punches in an inactive position as an active punch is moved by the ram to the active, i.e. operating position to thereby eliminate scoring or marking of the sheet material or other workpiece that is being punched. To eliminate the need for hand tools and hand assembly or disassembly, a manually moveable retainer on the punch assembly is provided that can be moved by hand between a punch-releasing and punch-retaining position for holding the punches within the multi-punch assembly during operation. To prevent stress fractures that formerly occurred in die carriers, support of each die is distributed between two different die components thereby reducing impact stress on the carrier as the ram drives the punch through the workpiece.

A multiple punch and multiple die assembly has a workpiece protector as a punch lifter that is operatively associated with each punch for supporting each of the punches in an inactive position as an active punch is moved by the ram to the active, i.e. operating position to thereby eliminate scoring or marking of the sheet material or other workpiece that is being punched. To eliminate the need for hand tools and hand assembly or disassembly, a manually moveable retainer on the punch assembly is provided that can be moved by hand between a punch-releasing and punch-retaining position for holding the punches within the multi-punch assembly during operation. To prevent stress fractures that formerly occurred in die carriers, support of each die is distributed between two different die components thereby reducing impact stress on the carrier as the ram drives the punch through the workpiece.

A multiple punch and multiple die assembly has a workpiece protector which is a punch lifter that is operatively associated with each punch for supporting each of the punches in an inactive position as an active punch is moved by the ram to the active, i.e. operating position to thereby eliminate scoring or marking of the sheet material or other workpiece that is being punched. To eliminate the need for hand tools and hand assembly or disassembly, a manually moveable retainer on the punch assembly is provided that can be moved by hand between a punch-releasing and punch-retaining position for holding the punches within the multi-punch assembly during operation. To prevent stress fractures that formerly occurred in die carriers, support of each die is distributed between two different die components thereby reducing impact stress on the carrier as the ram drives the punch through the workpiece.

A multiple punch and multiple die assembly has a workpiece protector as a punch lifter that is operatively associated with each punch for supporting each of the punches in an inactive position as an active punch is moved by the ram to the active, i.e. operating position to thereby eliminate scoring or marking of the sheet material or other workpiece that is being punched. To eliminate the need for hand tools and hand assembly or disassembly, a manually moveable retainer on the punch assembly is provided that can be moved by hand between a punch-releasing and punch-retaining position for holding the punches within the multi-punch assembly during operation. To prevent stress fractures that formerly occurred in die carriers, support of each die is distributed between two different die components thereby reducing impact stress on the carrier as the ram drives the punch through the workpiece.

A punch assembly for a turret punch press having a two piece reciprocally movable punch member that has a punch point insert removably attached to a punch driver that allows replacement of the punch point insert without the need to extract the punch member from its punch guide. A locking assembly having four vertical guideways containing slider strips for coupling the punch point insert to the punch driver ensures precision registration of the punch point insert with its driver.

A blood circuit assembly for a dialysis unit may include an organizing tray, a pair of pneumatic pumps mounted to the organizing tray for circulating blood received from a patient through a circuit including a dialyzer unit and returned to the patient, an air trap mounted to the organizing tray arranged to remove air from blood circulating in the circuit, a pair of dialyzer connections arranged to connect to the inlet and outlet of a dialyzer unit, and a pair of blood line connectors, one inlet blood line connector for receiving blood from the patient and providing blood to the pneumatic pumps and the other outlet blood line connector for returning blood to the patient.

A system for an engine is provided herein. The system includes a primary passage, a suction passage, and an outer casing coupling the primary and suction passages such that a primary axis is orthogonal to a suction axis. The system further includes a jet pump assembly coupled to the primary passage forming an annular channel between the outer casing and the jet pump assembly. Further, the jet pump assembly includes a flow divider positioned opposite from the suction passage within the annular channel.

A compressor is provided and may include a shell, a motor assembly, a drive shaft, a first compression mechanism, and a second compression mechanism. The motor assembly may be disposed within the shell. The drive shaft may be powered by the motor assembly. The first compression mechanism may be disposed within the shell and may be driven by the motor assembly. The second compression mechanism may be driven by the motor assembly.

An image photographing apparatus capable of maintaining the size of a sensor plate even in a case when the size of a shutter assembly is increased, the image photographing apparatus including a shutter assembly configured to control an amount of light entered, an image sensor disposed at a rear of the shutter assembly to change the light to an electrical signal, a sensor plate configured to support the image sensor, and a main frame configured such that the shutter assembly and the sensor plate are be mounted thereon, wherein the main frame includes a frame base, and a shutter mounting portion protrudedly formed from the frame base such that the shutter assembly is mounted in a sliding manner on the shutter mounting portion.

Provided herein are devices and system to magnetically, rotably secure a lens filter to a camera. Generally the devices and systems comprise a magnet assembly and a lens filter assembly threadably engageable. Also provided are magnetic lens filter systems comprising the engaged magnet and lens filter assemblies and an attachment assembly securable around a camera lens and magnetically attachable to the magnet comprising the magnetic lens filter, magnetic adapter assembly or magnetic adapter. Further provided are camera systems comprising the magnetic lens filter systems rotatably affixed thereto.

An improved set of toy building or construction blocks, each block having a substantially square cross-section and a generally rectilinear configuration. Incorporated into the structure of the individual toy blocks are transversely oriented slots, grooves and protrusions of predetermined size and location. The slots, grooves and protrusions of pre-determined size and location are of either male or female configuration disposed medially along one or more plane of each block. When the male protrusion of one block is introduced perpendicular to the female slot of one end of another block, a frictional engagement is created resulting in a right angle. When the male protrusion of one block is introduced to the female slot in a linear fashion the result is a line segment. Joining a plurality of said toy building or construction blocks using various perpendicular connections in conjunction with linear connections results in the stable formation of construction or geometric structures without the use of fasteners or other connecting elements.

The present invention discloses an inflatable lamp assembly a bladder and a light emitting apparatus that assembled together. The bladder includes a first bag portion, a second bag portion connected with an opening of the first bag portion, an air nozzle disposed on the firs bag portion, and a flange disposed at the opening of the second bag portion. The first bag portion and the second bag portion are co-formed an inflatable cell which is capable of being inflated and deflated by the air nozzle. The light emitting apparatus is received in a recess defined between the second bag portion and flange. As such, the light emitting apparatus can be firmly clamped in the recess when the inflatable cell is filled with air.

A hanging lamp assembly provides visual stimulation and relaxation. The assembly includes a container having a transparent perimeter wall defining an interior space. A first fluid and a second fluid are positioned in the interior space defining a liquid mass. The second fluid has a density different than a density of the first fluid wherein the first fluid and the second fluid are layered within the interior space defining a fluid interface between the first liquid and the second liquid. The first fluid is a non-clear color and the second fluid is a different color than the first fluid. A plurality of items is positioned in the interior space such that the items are suspended in the liquid mass. A light source is coupled to the container directing light towards the liquid mass. A hanger is coupled to the container such that the container swings freely from a supporting structure.

A conduction cooled high power semiconductor laser and a method for fabricating the same are provided. The conduction cooled high power semiconductor laser comprises a heat sink (2) and one or more semiconductor laser units (1). The semiconductor laser unit consists of a laser chip (3), a substrate (4) bonded to the laser chip for heat dissipation and electrical connection, and an insulation plate (5) soldered to the substrate for insulation and heat dissipation. The semiconductor laser unit is soldered on the heat sink with the insulation plate therebetween. The semiconductor laser unit may be tested, aged, and screened in advance, and thereby the yield of the lasers can be improved and the manufacturing costs can be reduced. The laser has desirable heat dissipation performance, high reliability, and is applicable to high temperature and other complex and volatile environments.

A method of manufacturing an optical semiconductor device including: forming a mesa structure including a first conductivity type cladding layer, an active layer and a second conductivity type cladding layer in this order on a first conductivity type semiconductor substrate, an upper most surface of the mesa structure being constituted of an upper face of the second conductivity type cladding layer; growing a first burying layer burying both sides of the mesa structure at higher position than the active layer; forming an depressed face by etching both edges of the upper face of the second conductivity type cladding layer; and growing a second burying layer of the first conductivity type on the depressed face of the second conductivity type cladding layer and the first burying layer.

An intra-cavity frequency doubled OPS-laser includes a laser-resonator terminated by a plane mirror and a mirror-structure of an OPS-chip. The resonator is folded by three fold-mirrors. The fold-mirrors are supported on a vibration-isolation plate supported by isolation posts above a base-plate. The plane mirror and the mirror-structure of the OPS-chip are mounted back to back on opposite parallel surfaces of a mounting block. The mounting-block is supported on the base-plate and extends through an aperture in the vibration-isolation plate. Movement of the vibration-isolation plate with respect to the base-plate does not change the resonator length.

A method for quasi-synchronous tuning of wavelength or frequency of grating external-cavity semiconductor laser and a corresponding semiconductor laser are provided. A grating or mirror is rotated around a quasi-synchronous tuning point (Pq) as rotation center, so as to achieve the frequency selections by grating and resonance cavity in quasi-synchronous tuning, wherein the angle of the line between the quasi-synchronous tuning point (Pq) and a conventional synchronous tuning point (P0) with respect to the direction of light incident on the grating is determined according to the angle difference between the incidence angle and diffraction angle of light on the grating. According to present invention, approximately synchronous tuning of laser is achieved with a simple and flexible design.

A method for fabricating a group-III nitride semiconductor laser device stably supplies laser cavity mirrors having a low lasing threshold current through the use of a semi-polar plane. A blade 5g is forced down through a first region ER1 to keep the first region ER1 squeezed between a support member H2 and a movable member H1 together with a part of a protective sheet TF in contact with the first region ER1 while the tension generated in the area of the protective sheet TF in contact with the first region ER1 with the movable member H1 increases until the semi-polar principal surface SF at an end face EG1 of the first region ER1 tilts by a deflection angle THETA from the semi-polar principal surface SF of a second region ER2, and a force is thereby generated in the first region ER1 in a direction opposite to the direction of travel of the blade 5g toward the first region ER1. For example, an angle ALPHA is within the range of 71 degrees to 79 degrees, and the deflection angle THETA is within the range of 11 to 19.

Tensile strained germanium is provided that can be sufficiently strained to provide a nearly direct band gap material or a direct band gap material. Compressively stressed or tensile stressed stressor materials in contact with germanium regions induce uniaxial or biaxial tensile strain in the germanium regions. Stressor materials may include silicon nitride or silicon germanium. The resulting strained germanium structure can be used to emit or detect photons including, for example, generating photons within a resonant cavity to provide a laser.

A semiconductor laser includes a semiconductor nanowire of a first conductivity type provided over a substrate, a light emitting layer provided around the semiconductor nanowire and insulated at an upper end and a lower end thereof, a cladding layer of a second conductivity type different from the first conductivity type, the cladding layer being provided at an outer periphery of the light emitting layer, a first electrode electrically coupled to an end portion of the semiconductor nanowire, a second electrode electrically coupled to an outer periphery of the cladding layer, a first reflection mirror provided at a one-end portion side of the semiconductor nanowire, and a second reflection mirror provided at the other end portion side of the semiconductor nanowire.