The annual sign-up period for the Kent Conservation District’s popular Cover Crop Cost-Share Program – funded in part by DNREC – has opened and runs through Aug. 30. The program helps Kent County farmers offset seed, labor, and equipment costs when planting fall cover crops that help protect local water quality, build healthy soils, and capture carbon from the atmosphere.

DNREC will begin the annual treatment of downstate public ponds – Wagamons Pond in Milton and Concord Pond near Seaford – for the foreign invasive aquatic weed hydrilla on Thursday, June 13, weather permitting. Hydrilla is a non-native plant that likely entered the state through the aquarium trade. Uncontrolled hydrilla can choke ponds and other waterways, crowding out beneficial plant species and preventing fishing and boating access.

The Office of the Marijuana Commissioner (OMC) is pleased to announce the launch of the Social Equity Eligibility Validation Application and Disproportionately Impacted Areas (DIA) Map OMC is responsible for implementing the Marijuana Control Act in Delaware, which includes a Social Equity License program. Individuals interested in applying for a social equity license must first […]

The Delaware Department of Natural Resources and Environmental Control reminds those who plan to drive-on surf fish at one of the seven Delaware State Parks multi-use beaches that reservations are required during summer weekends and holidays. Drive-on surf fishing reservations for Thursday, July 4, open Thursday, June 27, at 11 a.m. Drive-on reservations for each weekend open weekly beginning Tuesdays for the upcoming Saturday and Wednesdays for the upcoming Sunday, and are available until sold out for that weekend.

With new Delaware hunting licenses going on sale this week, DNREC announced the 2024/25 Delaware Hunting and Trapping Guide is now available in hard copy from license agents throughout the state, at DNREC's recreational licensing office in the Richardson & Robbins Building at 89 Kings Highway in Dover and in a readily referenced online edition.

On July 1st, the Delaware Department of Justice’s Consumer Protection Unit launched a new personal data privacy portal, privacy.delaware.gov, as a navigational tool for parents, consumers and businesses that handle Delawareans’ personal data to help prepare for the upcoming implementation of the Delaware Personal Data Privacy Act (DPDPA), which goes into effect in January 2025. […]

The Smart Food Program, a first in the nation project, will save food waste and reach families in need by using an AI-driven app to match surplus food to SNAP demands    WILMINGTON, Del. — Delaware will be the first state to pilot an innovative app to help those hardest hit by economic challenges stretch […]

The Delaware Department of Natural Resources and Environmental Control unveiled its new Action Trackchair an all-terrain wheelchair donated from the Ford Bronco Wild Fund June 12 at the Deerfield Clubhouse at White Clay Creek State Park. The event highlighted accessibility improvements statewide and featured the first publicly accessible all-terrain wheelchair available for public use in the state of Delaware. Delaware was the recipient of a nationally competitive grant for one of seven AXIS model Trackchairs provided through the Bronco Wild Fund Access Grants and the National Association of State Park Directors (NASPD).

The United States Department of Agriculture’s Animal and Plant Health Inspection Service (USDA-APHIS) has confirmed a find of box tree moth (BTM; Cydalima perspectalis) at a private residence in Kent County, Delaware. The box tree moth is a federally regulated pest that primarily feeds on boxwood species (Buxus spp.). If left unchecked, it causes significant damage and can potentially kill the plants. Boxwoods are a popular ornamental evergreen shrub common to many landscape environments in the United States.

Department of Insurance staff trained to aid residents Insurance Commissioner Trinidad Navarro has announced the creation of an Office of Long-Term Care Insurance within the Department of Insurance. Comprised of existing staff, this team has received special training and engaged with industry experts regarding consumer advocacy and assistance in long-term care insurance matters. “Long-term care […]

The Delaware Department of Agriculture announced the 28th round of easement selections by the Delaware Agricultural Lands Preservation, preserving 40 farms and 2,262 acres of farmland. With this announcement, the Carney administration has preserved 403 farms, the highest number in the program’s history.

“Mercado Kitsch México” presents a vibrant and eclectic exhibition inspired by the rich visual and cultural heritage of kitsch art in Mexico City. Zavala celebrates the creativity and artistic expression of the working class, who, with ingenuity and passion, combine textures, colors, and shapes to reflect their unique essence. Her Mexican heritage “has been and will continue to be my strongest inspiration. Everything about our art, culture, and traditions inspires me.”

Insurers approved to offer plans with benefits equal to or greater than the forthcoming state plan Insurance Commissioner Trinidad Navarro announced today that the Department of Insurance has approved Delaware’s first private Paid Family Medical Leave plans. These filings, reviewed by independent actuaries and against state requirements, provide options for businesses who wish to purchase […]

On Saturday, October 5, 2024 at 10:30am, the Delaware Public Archives will present a new offering, “Tales from the Vaults,” that will present four unique spooky stories culled from the collections of the Delaware Public Archives. “We’re excited to share this special thematic Saturday event to the public,” said Stephen Marz, State Archivist and Delaware […]

As Delaware’s Secretary of Education, I’m pleased to share the progress that Delaware students have made in Advanced Placement (AP) programs. This year, our state has seen significant growth in both AP participation and performance, reflecting our commitment to providing every student with access to challenging academic opportunities.

The Delaware National Estuarine Research Reserve’s (DNERR) annual Blackbird Creek Fall Festival will be held Saturday, Oct. 19, from 10 a.m. to 4 p.m.

WILMINGTON, Del. — On Wednesday, October 9, Governor John Carney will activate 100 service members and more than 40 vehicles from the Delaware National Guard (DNG) to augment the Florida National Guard’s response to Hurricane Milton. The storm is expected to make landfall on Florida’s west coast on the evening of October 9 as a major […]

WILMINGTON, Del. – Governor John Carney has shared the following statement on the Honorable James T. Vaughn, Jr.’s passing:   “Tracey and I are saddened to hear of the passing of Former Supreme Court Justice James T. Vaughn Jr. Justice Vaughn worked hard to uphold the values of the Delaware Courts for more than 25 years as a […]

Additionally, Workplace Safety Program eligibility changes will help more companies stay safe and save money Insurance Commissioner Trinidad Navarro announced today that workers’ compensation insurance rates will decrease for the eighth year in a row, effective December 1. The voluntary market is expected to decrease average loss costs by 8.4%, and the residual market will […]

Delaware is experiencing dry conditions with an open burning ban in effect.

Governor John Carney and Delaware Secretary of Agriculture Michael T. Scuse, along with members of the General Assembly, the Aglands Preservation Board of Trustees, and other agricultural advocates, joined together at Shadybrook Farms, home of the Cartanza family, to unveil a new farm sign celebrating Delaware’s Agricultural Lands Preservation Program.

DEPARTMENT OF JUSTICE: Fraud and Consumer Protection Division

DEPARTMENT OF HEALTH AND SOCIAL SERVICES: Division of Medicaid and Medical Assistance

Higher Education has been slow to adopt analytics in comparison to the commercial sector, but those institutions that have embraced a culture of analytics have seen significant and tangible results. Higher Education analytics can help in nearly every corner of academia including enrollment and retention, student success, academic research and [...]

The post Innovative higher education analytics projects and influential tech leaders honored by EdScoop appeared first on Government Data Connection.

Read the in depth Review of Sony Ericsson Vivaz Pro: Loses 8MP camera, gets a keyboard - at Rs. 24,585 Mobile Phones. Know detailed info about Sony Ericsson Vivaz Pro: Loses 8MP camera, gets a keyboard - at Rs. 24,585 configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

Read the in depth Review of Micromax Canvas Nitro A310 Mobile Phones. Know detailed info about Micromax Canvas Nitro A310 configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

Read the in depth Review of Micromax Canvas Nitro 4G Mobile Phones. Know detailed info about Micromax Canvas Nitro 4G configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

Read the in depth Review of Carvaan Musicbar CBWY121 Audio Video. Know detailed info about Carvaan Musicbar CBWY121 configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

Read the in depth Review of Dyson V12 Detect Slim vacuum cleaner Vacuum Cleaner. Know detailed info about Dyson V12 Detect Slim vacuum cleaner configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

Any State Bank of India account holder in order to activate their ATM card or a debit card can go to the online portal of SBI and do so by clicking on the e-services tab.

I am gratified to see the continuing adoption of Forecast Value Added by organizations worldwide. FVA is an easy to understand and easy to apply approach for identifying bad practices in your forecasting process. And I'm particularly gratified to see coverage of FVA in two new books, which the authors [...]

The post Vandeput's Data Science for Supply Chain Forecasting (book excerpt) appeared first on The Business Forecasting Deal.

A previous article about how to display missing values in SAS prompted a comment about special missing values in ODS tables in SAS. Did you know that statistical tables in SAS include special missing values to represent certain situations in statistical analyses? This article explains how to interpret four special [...]

The post Special missing values in SAS statistical tables appeared first on The DO Loop.

In practice, there is no need to remember textbook formulas for the ANOVA test because all modern statistical software will perform the test for you. In SAS, the ANOVA procedure is designed to handle balanced designs (the same number of observations in each group) whereas the GLM procedure can handle [...]

The post Programming the formulas for an ANOVA in SAS appeared first on The DO Loop.

The INPUT function and PUT function in SAS are used to apply informats and formats (respectively) to data. For both functions, you must know in advance which informat or format you want to apply. For brevity, let's consider only applying a format. To use the PUT function, you must know [...]

The post Run-time variations of the INPUT and PUT functions in SAS appeared first on The DO Loop.

Rajya Sabha MP Raghav Chadha marked his 36th birthday in Varanasi.

A look at how American leadership has evolved through major historical events and societal changes over the past century

1. Vicky Kaushal looks unrecognisable as Parashurama in Mahavatar first look. Check first poster, release date  Hindustan Times
2. Mahavatar First Poster: Vicky Kaushal Takes On The Role Of "The Eternal Warrior Of Dharma"- Parashurama  NDTV Movies
3. Vicky Kaushal drops powerful FIRST LOOK as Lord Parashurama for ‘Mahavatar’  TOI Etimes
4. entertainment News Live Today November 13, 2024: Vicky Kaushal looks unrecognisable as Parashurama in Mahavatar first look. Check first poster, release date  Hindustan Times
5. Vicky Kaushal to play Chiranjeevi Parashurama in Amar Kaushik’s Mahavatar  India Today

Google has seemingly launched the Quick Share app for Windows on ARM PCs, something that was not previously available.

The post Google Quick Share now available for Windows on ARM appeared first on Phandroid.

Atlas Biomed's website is no longer active and the phone number listed is dead as well.

A man recently took to Reddit, seeking help identifying an unknown Devanagari text he found at a flea market in Germany.

The couple, together for nine years, had announced the wedding date in January and were eagerly looking forward to their long-awaited special day.

The market is trending towards integrating and stacking multiple chiplets into a single package to meet the growing demands of speed, connectivity, and intelligence.  However, designing and signing off chiplets and packages individually is time-...(read more)

In the rapidly evolving landscape of automotive electronics, traditional monolithic design approaches are giving way to something more flexible and powerful—chiplets. These modular microchips, which are themselves parts of a whole silicon system, offer unparalleled potential for improving system performance, reducing manufacturing costs, and accelerating time-to-market in the automotive sector. However, the transition to working with chiplets in automotive electronics is not without its challenges.

Designers must now grapple with a new set of considerations, such as die-to-die interconnect standards, complex processes, and the integration of diverse IPs. Advanced toolsets and standardized design approaches are required to meet these challenges head-on and elevate the potential of chiplets in automotive innovation. In the following discourse, we will explore in detail the significance of chiplets in the context of automotive electronics, the obstacles designers face when working with this paradigm, and how Cadence comprehensive suite of IPs, tools, and flows is pioneering solutions to streamline the chiplet design process.

Unveiling Chiplets in Automotive Electronics

For automotive electronics, chiplets offer a methodology to modularize complex functionalities, integrate different chiplets into a package, and significantly enhance scalability and manufacturability. By breaking down semiconductor designs into a collection of chiplets, each fulfilling specific functions, automotive manufacturers can mix and match chiplets to rapidly prototype new designs, update existing ones, and specialize for the myriad of use cases found in vehicles today.

The increasing significance of chiplets in automotive electronics comes as a response to several industry-impacting phenomena. The most obvious among these is the physical restriction of Moore's Law, as large die sizes lead to poor yields and escalating production costs. Chiplets with localized process specialization can offer superior functionality at a more digestible cost, maintaining a growth trajectory where monolithic designs cannot. Furthermore, chiplets support the assembly of disparate technologies onto a single subsystem, providing a comprehensive yet adaptive solution to the diverse demands present in modern vehicles, such as central computing units, advanced driver-assistance systems (ADAS), infotainment units, and in-vehicle networks. This chiplet-based approach to functional integration in automotive electronics necessitates intricate design, optimization, and validation strategies across multiple domains.

The Complexity Within Chiplets

Yet, with the promise of chiplets comes a series of intricate design challenges. Chiplets necessitate working across multiple substrates and technologies, rendering the once-familiar 2-dimensional design space into the complex reality of multi-layered, sometimes even three-dimensional domains. The intricacies embedded within this design modality mandate devoting considerable attention to partitioning trade-offs, signal integrity across multiple substrates, thermal behavior of stacked dies, and the emergence of new assembly design kits to complement process design kits (PDKs).

To effectively address these complexities, designers must wield sophisticated tools that facilitate co-design, co-analysis, and the creation of a robust virtual platform for architectural exploration. Standardizations like the Universal Chip Interconnect Express (UCIe) have been influential, providing a die-to-die interconnect foundation for chiplets that is both standardized and automotive-ready. The availability of UCIe PHY and controller IP from Cadence and other leading developers further eases the integration of chiplets in automotive designs.

The Role of Foundries and Packaging in Chiplets

Foundries have also pivoted their services to become a vital part of the chiplet process, providing specialized design kits that cater to the unique requirements of chiplets. In tandem, packaging has morphed from being a mere logistical afterthought to a value-added aspect of chiplets. Organizations now look to packaging to deliver enhanced performance, reduced power consumption, and the integrity required by the diverse range of technologies encompassed in a single chip or package. This shift requires advanced multiscale design and analysis strategies that resonate across a spectrum of design domains.

Tooling Up for Chiplets with Cadence

Cadence exemplifies the rise of comprehensive tooling and workflows to facilitate chiplet-based automotive electronics design. Their integrations address the challenges that chiplet-based SoCs present, ensuring a seamless design process from the initial concept to production. The Cadence suite of tools is tailored to work across design domains, ensuring coherence and efficiency at every step of the chiplet integration process.

For instance, Cadence Virtuoso RF subflows have become critical in navigating radio frequency (RF) challenges within the chiplets, while tools such as the Integrity 3D-IC Platform and the Allegro Advanced Multi-Die Package Design Solution have surfaced to enable comprehensive multi-die package designs. The Integrity Signal Planner extends its capabilities into the chiplet ecosystem, providing a centralized platform where system-wide signal integrity can be proactively managed. Sigrity and Celsius, on the other hand, offer universally applicable solutions that take on the challenges of chiplets in signal integrity and thermal considerations, irrespective of the design domain. Each of these integrated analysis solutions underscores the intricate symphony between technology, design, and packaging essential in unlocking the potential of chiplets for automotive electronics.

Cadence portfolio includes solutions for system analysis, optimization, and signoff to complement these domain-specific tools, ensuring that the challenges of chiplet designs don't halt progress toward innovative automotive electronics. Cadence enables designers to engage in power- and thermal-aware design practices through their toolset, a necessity as automotive systems become increasingly sophisticated and power-efficient.

A Standardized Approach to Success with Chiplets

Cadence’s support for UCIe underscores the criticality of standardized approaches for heterogeneous integration by conforming to UCIe standards, which numerous industry stakeholders back. By co-chairing the UCIe Automotive working group, Cadence ensures that automotive designs have a universal and standardized Die-to-Die (D2D) high-speed interface through which chiplets can intercommunicate, unleashing the true potential of modular design.

Furthermore, Cadence champions the utilization of virtual platforms by providing transaction-level models (TLMs) for their UCIe D2D IP to simulate the interaction between chiplets at a higher level of abstraction. Moreover, individual chiplets can be simulated within a chiplet-based SoC context leveraging virtual platforms. Utilizing UVM or SCE-MI methodologies, TLMs, and virtual platforms serve as first lines of defense in identifying and addressing issues early in the design process before physical silicon even enters the picture.

Navigating With the Right Tools

The road to chiplet-driven automotive electronics is one paved with complexity, but with a commitment to standards, it is a path that promises significant rewards. By leveraging Cadence UCIe Design and Verification IP, tools, and methodologies, automotive designers are empowered to chart a course toward chiplets and help to establish a chiplet ecosystem. With challenges ranging from die-to-die interconnect to standardization, heterogeneous integration, and advanced packaging, the need for a seamless integrated flow and highly automated design approaches has never been more apparent. Companies like Cadence are tackling these challenges, providing the key technology for automotive designers seeking to utilize chiplets for the next-generation E/E architecture of vehicular technology.

In summary, chiplets have the potential to revolutionize the automotive electronics industry, breathing new life into the way vehicles are designed, manufactured, and operated. By understanding the significance of chiplets and addressing the challenges they present, automotive electronics is poised for a paradigm shift—one that combines the art of human ingenuity with the power of modular and scalable microchips to shape a future that is not only efficient but truly intelligent.

Learn more about how Cadence can help to enable automakers and OEMs with various aspects of automotive design.

Cadence tapes out 32G UCIe interface IP for high speed, highly efficient chiplet designs and demonstrate high data rate performance in TSMC's 3nm technology(read more)

As vehicles transition into interconnected ecosystems, artificial intelligence and advanced technologies become increasingly crucial. Infotainment systems have evolved beyond mere music players to become central hubs for connectivity, entertainment, and navigation. With global demand for comfort, convenience, and safety rising, the automotive infotainment market is experiencing significant growth. Valued at USD14.99 billion in 2023, it is projected to grow at a compound annual growth rate (CAGR) of 9.9% from 2024 to 2030.

To keep pace with this evolution, infotainment systems must accommodate a range of workloads, including audio, voice, AI, and vision technologies. This requires a flexible, scalable Digital Signal Processor (DSP) solution that acts as an offload engine for the main application processor. Integrating a single DSP for varied functions offers a cost-effective solution for high-performance, low-power processing, which aligns well with the needs of Electric Vehicles (EVs).

If you missed the detailed presentation by Casey Ng, Product Marketing Director at Cadence at CadenceLIVE 2024, register at the CadenceLIVE On-Demand site to access it and other insightful presentations. Stay ahead of the curve and explore the future of innovative electronics with us.

Cadence Infotainment Solution: Leading the Charge

Cadence Tensilica HiFi DSPs play a crucial role in enhancing audio capabilities in vehicle infotainment systems. They support applications like voice recognition, hands-free calling, and deliver immersive audio experiences. This technology is also paramount for features such as active noise control, which reduces road and cabin noise, and acoustic event detection for identifying unusual sounds like broken glass. One notable innovation is the "audio bubble," enabling personalized audio zones within the vehicle, ensuring passengers enjoy distinct audio settings.

Cadence HiFi DSP technology enriches the driving experience for electric vehicles by mimicking traditional engine sounds, while its advanced audio processing ensures optimal performance across various digital radio standards. It significantly contributes to noise reduction, hence improving the cabin experience. Integrating a Double Precision Floating Point Unit (FPU) stands out, as it upgrades audio performance and Signal-to-Noise Ratio (SNR) through efficient 64-bit processing, allowing control over numerous speakers without hitches.

These advancements distinguish the DSP as an essential tool in evolving infotainment systems, offering unmatched performance and adaptability. Tensilica HiFi processors, crucial to advanced infotainment SoCs, serve as efficient offload processors, augmenting real-time execution and energy efficiency. Cadence’s ecosystem, with over 200 codecs and software partnerships, propels the evolution of innovative infotainment systems. Introducing the HiFi 5s DSP marks a new era in connected car experiences, setting the stage for groundbreaking advancements.

Exploring Tomorrow with HiFi 5s DSP Technology

The HiFi 5s represents the apex of audio and AI digital signal processing performance. Built on the Xtensa LX8 platform, it introduces capabilities like auto-vectorization, which allows standard C code to be automatically optimized for performance. This synergy of hardware and software co-design marks a significant step forward in DSP technology. By leveraging its extended Single Instruction, Multiple Data (SIMD) capabilities alongside features like a double-precision floating-point unit (DP_FPU), the HiFi 5s delivers unparalleled precision and speed improvements in signal and audio processing tasks. Equally notable are its branch prediction and L2 cache enhancements, which optimize system performance by refining the control code execution and recognizing codec efficiency. The application of such enhancements are particularly beneficial in real-world scenarios.

AI-Powered Audio

Cadence's focus on AI integration with the HiFi 5s demonstrates significant improvements in audio clarity through AI-powered solutions.

• AI models learn from real-world data and adapt dynamically, while classic DSP algorithms rely on fixed rules.
• AI can be fine-tuned for specific scenarios, whereas classic DSP lacks flexibility.
• AI handles extreme and marginal noise patterns better, generalizes well across different environments, and is robust against varying noise characteristics.

Cadence's dedication to artificial intelligence marks a pivotal shift in audio processing. Traditional DSP algorithms, bound by rigid rules, are eclipsed by AI's ability to learn dynamically from real-world data. This adaptability equips AI models to tackle challenging noise patterns and offer unmatched clarity even in noisy environments, making them ideal for automotive and consumer audio applications.

Realtime AI-Optimized Speech Enhancements by OmniSpeech and ai|coustics

OmniSpeech

Our partner, OmniSpeech, has advanced AI-based audio processing that enhances the performance of audio software, specifically for omnidirectional and dipole microphones. Impressively, their technology operates with less than 32MHz and requires only 418kB of memory.

Test results show that background noise is significantly reduced when AI employs a single omnidirectional microphone, outperforming non-AI solutions. Additionally, when using a dipole microphone with AI, there is a 3.5X improvement in the weighted Signal-to-Noise Ratio (SNR) and more than a 28% increase in the Global Mean Opinion Score (GMOS) across various background noise.

ai|coustics

ai|coustics, a Cadence partner specializing in advanced audio technologies, utilizes real-time AI-optimized speech enhancement algorithms. They leverage an extensive speech-quality dataset containing thousands of hours and 100 languages to transform low-quality audio into studio-grade audio. Their process includes:

• De-reverb, which eliminates room resonances, echoes, and reflections

• Removing artifacts from downsampling and codec compression

• Dynamic and adaptive background noise removal

• Reviving audio materials with analog and digital distortions

• Providing support for all languages, accents, and a variety of speakers

Applications include:

• Automotive: Enhances clarity of navigation commands and communication for driver safety

• Consumer audio: Improves voice clarity for better dialogue understanding in TV programs. Optimizes speech intelligibility in communication for both uplink and downlink audio streams

• Smart IoT: Boosts voice command detection and response quality

Performance Enhancements

The advancements in branch prediction and L2 cache integration have significantly boosted performance metrics across various systems. With HiFi 5s, branch prediction increases codec efficiency by an average of 5%, reaching up to 16% in optimal conditions. L2 cache improvements have drastically enhanced system-level performance, evidenced by a 2.3X boost in EVS decoder efficiency. Adding MACs and imaging ISA in imaging use cases has led to substantial advancements. When comparing HiFi 5s to HiFi 5, imaging ISA performance improvements range with >60% average performance improvements.

The Crescendo of the Future

As Cadence continues to blaze trails in DSP technology, the HiFi 5s emerges as the quintessential solution for consumer and automotive audio use cases. With a robust framework for auto-vectorization, an unmatched double-precision FPU, AI-driven audio solutions, and comprehensive system enhancements, Cadence is orchestrating the next era of audio processing, where every note is clearer, every sound richer, and every experience more engaging. It is not just the future of audio—it's the future of how we experience the world around us.

 Discover how Cadence Automotive Solutions can transform your business today!

Staying ahead of the curve is essential to meeting customer needs. Cadence has consistently demonstrated its commitment to innovation, and its latest IP portfolio available on TSMC's 3nm (N3) process is no exception. Today, rapid advancements in AI/ML, hyperscale computing (HPC), and the automotive industry are driving significant changes in technology. Let's explore the impressive array of IP that Cadence offers on this advanced node.

Memory Solutions: High-Speed and Power-Efficient

Cadence's DDR5 12.8G MRDIMM IP supports the highest speed grade Gen2 MRDIMMs and features a fully hardened PHY optimized to the customer's floorplan. The LPDDR5X IP is silicon-proven at 9.6Gbps and is ideal for power-sensitive applications, offering a fully integrated memory subsystem.

GDDR7: Leading the Way in Graphics Memory

Cadence has achieved a significant milestone with the world's first silicon-proven GDDR7 IP, supporting data rates up to 32Gbps. This IP offers the best price/performance ratio for AI interfaces, making it a game-changer in the graphics memory domain.

PCIe and CXL Solutions: Robust and Reliable

Cadence's PCIe 3.0 IP is a mature and production-proven solution available across a wide range of process nodes from 28nm to 3nm. It offers a versatile multi-link architecture for optimum SoC configurability and flexible use cases. The PCIe 6.0 and CXL 3.x solutions are silicon-proven, power-optimized, and highly robust, with jitter-tolerant capabilities. These IP are the only subsystem proven with eight lanes of controller and PHY in silicon, ensuring interoperability with leading test vendors and OEMs.

UCIe PHY: Setting New Standards

The UCIe PHY IP from Cadence are set to be generally available after successful silicon characterization in both standard and advanced package options on the TSMC N3 (3nm) process. These IP demonstrate significantly better power, performance, and area (PPA) metrics than the specifications, with a bit error rate (BER) better than 1E-27 compared to the spec of 1E-15. The power consumption is also notably lower than the spec limit, ensuring a simpler integration with a best-in-class power profile.

112G PHY IP: Pushing the Boundaries of Performance

Cadence's 112G PHY IP are designed to meet the demands of high-speed data transmission. The 112G-ULR PHY IP, characterized in the 3nm process, showcases exceptional performance with support for insertion loss over 45dB at data rates ranging from 1.25Gbps to 112.5Gbps. This IP is optimized for both power and area, making it a versatile choice for various applications. The 112G-VSR/MR PHY IP also stands out with its excellent power and performance metrics, making it ideal for short-reach applications and optical interconnects. Additionally, the 112G PAM4 PHY solutions cater to hyperscale, AI, HPC, and optics applications, featuring a mature DSP-based SerDes architecture with advanced techniques such as reflection cancellation.

Cadence's IP portfolio on TSMC N3 shows innovation and expertise to solve today's design challenges. From high-speed PHY IP to robust PCIe and CXL solutions and advanced memory IP, Cadence continues to lead the way in semiconductor IP development. These solutions not only meet but exceed industry standards, ensuring that customers can confidently achieve their design goals. Stay tuned for more updates on Cadence's groundbreaking advancements in semiconductor technology.

Learn more about Cadence IP and other silicon solutions.

Hi! I've made some 1-point waveform "markers" that I want to overlay in my plots to aid visualization (with the added advantage, w.r.t. normal Viva markers, that they update location automatically upon refreshing simulation data).

For example, the plot below shows an spectrum along with two of these markers, which I create with the function "singlePointWave", and the Assembler output definitions also as shown below.

The problem is: as currently created and defined, Assembler is unable to plot these elements. I can send their expressions to the calculator and plotting works from there, BUT ONLY after first enabling the "Allow Any Units" in the target Viva subwindow.

Thus, I suspect Assembler is failing to plot my markers because they "lack" other information like axes units and so on. How could I add whatever is missing, so that these markers can plot automatically from Assembler?

Thanks in advance for any help!

Jorge.

P.S. I also don't know why, but nothing works without those "ymax()" in the output definitions--I suspect they are somehow converting the arguments to the right data type expected by singlePointWave(). Ideas how to fix that are also welcome! ^^

procedure( singlePointWave(xVal yVal)
    let( (xVect yVect wave)
        xVect = drCreateVec('double list(xVal));
        yVect = drCreateVec('double list(yVal));
        wave = drCreateWaveform(xVect yVect);
    );
);

Hi,

I want to define a procedure that with @key, and I also want to restrict the variable's datatype, I tried with folloing but I received error in CIW

procedure(tt(handler @key str1 str2 "ssS")
  printf("handler: %L " handler)
)

tt('test)

The error is like: *Error* tt: argument for keyword ?str1 should be a symbol (type template = "ssS") at line 11 of file

Thanks,

James

i want to read from text file two values  on two ports , i wrote  that  code, and i have that error that shown in the image below . and also the data in text file is shown as screenshot

module read_file (a,b);

electrical a,b;
integer in_file_0,data_value, valid, count0,int_value;

analog begin
@(initial_step) begin
in_file_0 = $fopen("/home/hh1667/ee610/my_library/read_file/data2.txt","r");

valid = $fscanf (in_file_0, "%b,%b" ,int_value,count0);
end

V(a) <+ int_value;
V(b) <+ count0;

end

endmodule