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Differentiating good IP from mediocre or bad IP is getting more difficult, in part because it depends upon how and where it is used and in part, because even the best IP may work better in one system than another—even in chips developed by the same vendor.  

So, how do you measure IP quality and why it is so complicated?

The answer depends on who is asking. Most of the time, the definition of IP quality depends on your vantage point.  If you are an R&D manager, IP quality means something. If you are a global supply manager, IP quality means something else. If you are an SoC start-up, your measure of quality is quite different from that of an established fabless company. If you are designing IP in-house, then your considerations are very different than being a commercial IP vendor. If you are designing an automotive SoC, then we are in a totally different category. How about as an IP vendor? How do you articulate IP quality metrics to your customers?

This varies greatly by the type of IP, as well. When it comes to interface (hard) IP and controllers, if you are an R&D manager, your goal is to design IP that meets the IP specifications and PPA (power, performance, and area) targets. You need to validate your design via silicon test chips. This applies to all hard PHYs, which must be mapped to a particular foundry process. For controllers that are in RTL form—we called these soft IP—you have to synthesize them into a particular target library in a particular foundry process in order to realize them in a physical form suitable for SoC integration. Of course, your design will need to go through a series of design validation steps via simulation, design verification and passing the necessary DRC checks, etc. In addition, you want to see the test silicon in various process corners to ensure the IP is robust and will perform well under normal process variations in the production wafers.

For someone in IP procurement, the measure of quality will be based on the maturity of the IP. This involves the number of designs that have been taped out using this IP and the history of bug reports and subsequent fixes. You will be looking for quality of the documentation and the technical deliverables. You will also benchmark the supplier’s standard operating procedures for bug reporting and technical support, as well as meeting delivery performance in prior programs. This is in addition to the technical teams doing their technical diligence.

An in-house team that is likely to design IP for a particular SoC project will be using an established design flow and will have legacy knowledge of last generation’s IP. They may be required to design the IP with some reusability in mind for future programs. However, such reusability requirements will not need to be as stringent and as broad as those of commercial IP vendors because there are likely to be established metrics and procedures in place to follow as part of the design team’s standard operating procedures. Many times, new development based on a prior design that has been proven in use will be started, given this stable starting point. All of these criteria help the team achieve a quality outcome more easily.

Then, if designing for an automotive SoC, additional heavy lifting is required.  Aside from ensuring that the IP meets the specifications of the protocol standards and passes the compliance testing, you also must pay attention to meeting functional safety requirements. This means adherence to ISO 26262 requirements and subsequently achieving ASIL certification. Oftentimes, even for IP, you must perform some AEC-Q100-related tests that are relevant to IP, such as ESD, LU, and HTOL.

To read more, please visit: https://semiengineering.com/why-ip-quality-is-so-difficult-to-determine/

Test chips are becoming more widespread and more complex at advanced process nodes as design teams utilize early silicon to diagnose problems prior to production. But this approach also is spurring questions about whether this approach is viable at 7nm and 5nm, due to the rising cost of prototyping advanced technology, such as mask tooling and wafer costs.

Semiconductor designers have long been making test chips to validate test structures, memory bit cells, larger memory blocks, and precision analog circuits like current mirrors, PLLs, temperature sensors, and high-speed I/Os. This has been done at 90nm, 65nm, 40nm, 32nm, 28nm, etc., so having test chips at 16nm, 7nm, or finer geometries should not be a surprise. Still, as costs rise, there is debate about whether those chips are over-used given advancements in tooling, or whether they should be utilized even more, with more advanced diagnostics built into them.

Modern EDA tools are very good. You can simulate and validate almost anything with certain degree of accuracy and correctness. The key to having good and accurate tools and accurate results (for simulation) is the quality of the foundry data provided. The key to having good designs (layouts) is that the DRC deck must be of high quality and accurate and must catch all the things you are not supposed to do in the layout. Most of the challenges in advanced node is in the FEOL where semiconductor physics and lithography play outsize roles. Issues that were not an issue at more mature nodes can manifest themselves as big problems at 7nm or 5nm. Process variation across the wafer and variation across a large die also present problems that were of no consequence in more mature nodes.

The real questions to be asked are as follows:

What is the role of test chips in SoC designs?

1. Do all hard IP require test chips for validation?
2. Are test chips more important at advanced nodes compared to more mature nodes?
3. Is the importance of test chip validation relative to the type of IP protocols?
4. What are the risks if I do not validate in silicon?

In complex SoC designs, there are many high-performance protocols such as LPDDR4/4x PHY, PCIe4 PHY, USB3.0 PHY, 56G/112G SerDes, etc. Each one of these IP are very complex in and by itself. If there is any chance of failure that is not detected prior to SoC (tapeout) integration, the cost of retrofit is huge. This is why the common practice is to validate each one of these complex IP in silicon before committing to use such IP in chip integration. The test chips are used to validate that the IP are properly designed and meet the functional specifications of the protocols. They are also used to validate if sufficient margins are designed into the IP to mitigate variances due to process tolerances. All high-performance hard IP go through this test chip/silicon validation process. Oftentimes, marginality is detected at this stage. In advanced nodes, it is also important to have the test chips built under different process corners. This is intended to simulate process variations in production wafers so as to maximize yields. Advanced protocols such as 112G, GDDR6, HBM2, and PCIe4 are incredibly complex and sensitive to process variations. It is almost impossible to design these circuits and try to guarantee their performance without going through the test chip route.

Besides validating performance of the IP protocols, test silicon is also used to validate robustness of ESD structures, sensitivity to latch up, and performance degradation over wide temperature ranges. All these items are more critical in advanced nodes than more mature modes. Test chips are vehicles to guarantee design integrity in bite-size chunks. It is better to deal with any potential issues in smaller blocks than to try to fix them in the final integrated SoC.

Test chips will continue to play a vital role in helping IP and SoC teams lower the risk of their designs, and assuring optimal quality and performance in the foreseeable future. They are not going away!

To read more, please visit https://semiengineering.com/test-chips-play-larger-role-at-advanced-nodes/

Hi,

I am trying to use "sed -e 's " from SKILL code to edit unix file "FileA", to replace 3 words in the 2nd line.

How to run below multiple commands using  ipcBeginProcess, Should I use ipcWait or ipcCloseProcess ?

Using && to combine , will that work as I have to work serially on each command. ?

With below code only the first command gets executed. Please advise.

FileA="/user/tmp/text1.txt"

sprintf(Command1 "sed -e '2s/%s/%s/g' %s > %s" comment1 get(form concat("dComment" RDWn))->value FileA FileA)
cid = ipcBeginProcess(Command1)


sprintf(Command2 "sed -e '2s/%s/%s/g' %s > %s"  Time getCurrentTime() FileA FileA)
cid1 = ipcBeginProcess(Command2)


sprintf(Command3 "sed -e '2s/%s/%s/g' %s > %s"  comment2 get(form concat("Duser" RDWn))->value FileA FileA)
cid2 = ipcBeginProcess(Command3)

Thanks,

Ajay

As the stakes for winning server segment market share grow ever higher an increasing number of companies are seeking to grasp the latest Holy Grail of multi-chip coherence. The approach promises to better enable applications such as machine learning...(read more)

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hi everyone, 

i'm trying to create a netlist for aging simulation. i would like to simulate how power, Gain and PAE (efficiency) are inlfuenced after 3 hours

i would be grateful if someone can correct my syntax in the netlist since i'm trying to make a sweep HB  simulation where the input power is the parameter.

i did it without any error for the sp (S parameters)  simulation.

you can see the images for both sp and hb simulation netlists. (from left to right: sp aging netlist; hb aging netlist)

i will be grateful if someone can provide me some syntax advices.

thanks,

best regards

Hi All,

I'm trying to understand checkpoint concept. When I found save and restart concept in cdnshelp, There is just describing about "$save" and "xrun -r "~~~".

and I found also the below link about save restart and it saves your time.

But I can't find any benefits from my experiment from save&restart article( I fully agree..the article)

Ok, So I'v got some experiment  Here.

1. I declared $save and got the below result as I expected within the simple UVM code.

In UVM code...

$display("TEST1");
$display("TEST2");
$save("SAVE_TEST");
$display("TEST3");
$display("TEST4");

And I restart at "SAVE_TEST" point by xrun -r "SAVE_TEST", I've got the below log

xcelium> run
TEST3
TEST4

Ok, It's Good what I expected.(The concept of Save and Restore is simple: instead of re-initializing your simulation every time you want to run a test, only initialize it once. Then you can save the simulation as a “snapshot” and re-run it from that point to avoid hours of initialization times. It used to be inconvenient. I agree..)

2. But The Problem is that I can't restart with modified code. Let's see the below example.

I just modified TEST5 instead of "TEST3"

$display("TEST1");
$display("TEST2");
$save("SAVE_TEST");
$display("TEST5"); //$display("TEST3");
$display("TEST4");

and I rerun with xrun -r "SAVE_TEST", then I've got the same log

xcelium> run
TEST3
TEST4

There is no "TEST5". Actually I expected "TEST5" in the log.From here We know $save can't support partially modified code after $save. 

Actually, through this, we can approach to our goal about saving developing time. 

So I want to know Is there any possible way that instead of re-initializing our simulation every time we want to run a test, only initialize it once and keep developing(debugging) our code ?

If we do, Could you let me know the simple example?

Hi everyone! I'm working on a small battery powered PCB which will fit inside a small plastic "hockey puck" container. A number of these "pucks" will be sold together with a "charging doc" which will store and charge the pucks when not in use.

I'm trying to work out the best way to charge the battery. I'm thinking of having metal "pads" on the rr.com puck that pass through the puck's plastic shell and then make contact with the PCB on the inside, and having a similar system on the charging dock. I'm thinking of having SMD "contact sprints" mounted to the underside of the PCB and have these mate against metal pins that protrude through the puck, but it's the later of which I'm struggling to find. For a visual, think about "restaurant pagers" and how they charge.

Introduction to AMSD Flex mode and its benefits.(read more)

This blog talks about how to enable the AMS Designer flex mode.(read more)