Read the in depth Review of OnePlus Nord CE 3 5G Mobile Phones. Know detailed info about OnePlus Nord CE 3 5G configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

Mirroring your smartphone’s screen onto a Windows/Mac PC is fairly simple with these apps.

Learn why a data catalog is so valuable in helping you find and use big data at your business.

The post What is a data catalog – and why do you need one? appeared first on The Data Roundtable.

Liam Payne, who rose to fame as a member of the boy band One Direction has died at the age of 31. The British singer fell to his death from the third-floor balcony of Hotel CasaSur Palermo in Buenos Aires, Argentina.

1. 9 Surprising Facts About Voyager 2’s Uranus Flyby  Moneycontrol
2. Potential For Life Found On Uranus' Moons, Scientists Reveal  NDTV
3. The anomalous state of Uranus’s magnetosphere during the Voyager 2 flyby  Nature.com
4. Voyager-2 visited Uranus in 1986. Something more happened when it arrived  India Today
5. Uranus and its moons may have ideal conditions for life—but Voyager 2 missed it due to one bad day  The Economic Times

1. Best smartphones under ₹30,000 with good battery life and cameras | Mint  Mint
2. Best smartphones under 20,000 with good cameras: Redmi Note 13 Pro, Vivo T3 5G and others  Hindustan Times
3. 5 Affordable Camera Phones To Make Instagram Reels  Times Now
4. Best Smartphones Under Rs 20,000 With Excellent Cameras, Redmi Note 13 Pro, Vivo T3 5G & More  NewsX

1. Garena Free Fire MAX redeem codes for November 13, 2024: Win bundles, new outfits, and more rewards...  Moneycontrol
2. Garena Free Fire MAX redeem codes for November 12, 2024: Win free gifts, rewards, and know how to redeem...  Moneycontrol
3. Garena Free Fire MAX redeem codes for November 13: Win free in-game rewards daily  The Times of India
4. Garena Free Fire MAX Redeem Codes Today, November 13: Win Free Gifts, Skins And Much More  Jagran English
5. Garena Free Fire MAX November 13 redeem codes: All about Booyah Top-Up event  HT Tech

1. Google Chrome on iPhones gets new features with Drive, Maps integration  Business Standard
2. Stop Using Chrome On Your iPhone, Warns Apple—Millions Of Users Must Now Decide  Forbes
3. 4 new Chrome improvements for iOS  The Keyword
4. Chrome on iOS now lets you search using images and text at the same time  TechCrunch
5. Google rolls out new features in Chrome for iPhone users  Moneycontrol

1. Inflation in nearly half of major states outgrows India's Oct CPI; price pressure steepest in Chhattisgarh  Moneycontrol
2. Retail inflation surges to a 14-month high of 6.2% in October  The Times of India
3. If we exclude vegetable prices, CPI inflation remains in RBI's range: UBI research  The Economic Times
4. Rising food prices are likely to push back beginning of rate cutting cycle  The Indian Express
5. India confident of reaching USD 100 billion trade volume with Russia ahead of 2030 timeline: S Jaishankar  Telegraph India

The ASUS ROG Phone 9 has recently been spotted on Geekbench where it appears to be powered by the new Qualcomm chipset.

The post ASUS ROG Phone 9 spotted on Geekbench with Qualcomm’s latest chipset appeared first on Phandroid.

If you hate having your SIM locked to your carrier, then we’ll show you how to SIM unlock your iPhone 16 Pro for free!

The post How to SIM unlock the iPhone 16 Pro for FREE! appeared first on Phandroid.

Here are the best foldable smartphones you can buy in 2024.

The post Best Foldable Smartphones of 2024 appeared first on Phandroid.

The headphones come with a rather lightweight design, Sony's integrated V1 processor and noise-cancelling duties.

The post Save up to 40% with the Sony WH-CH720N Headphones! appeared first on Phandroid.

The couple, together for nine years, had announced the wedding date in January and were eagerly looking forward to their long-awaited special day.

Vesper, the maker of piezoelectric sensors used in microphone production and winner of CES Innovation Award 2018 raised a $23M Series B round. American Family Ventures led the investment with participation from Accomplice, Amazon Alexa Fund, Baidu, Bose Ventures, Hyperplane, Sands Capital, Shure, Synaptics, ZZ Capital and some undisclosed investors.

Vesper’s innovative sensors can be used in consumer electronics like TV remote controls, smart speakers, smartphones, intelligent sensor nodes, and hearables. The company will use the funding proceeds to scale-up its functions like mass production of its microphones and support expanded research and development, hiring, and establishing international sales offices.

The main product of Vesper is VM1000, a low noise, high range,single-ended analog output piezoelectric MEMS microphone. It consists of a piezoelectric sensor and circuitry to buffer and amplify the output.

The hot-selling product of Vesper is VM1010 with ZeroPower Listening which is the first MEMS microphone that enables voice activation to battery-powered consumer devices.

The unique selling point of Vesper’s products is they are built to operate in rugged environments that have dust and moisture.

"Vesper's ZeroPower Listening capabilities coupled with its ability to withstand water, dust, oil, and particulate contaminants enables users that have never before been possible," said Katelyn Johnson, principal of American Family Ventures. "We are excited about Vesper's quest to transform our connected world, including IoT devices."

Other recent funding news include $24 raised by sensor-based baby sock maker Owlet, IFTTT banks $24M from Salesforce to scale its IoT Enterprise offering, and Intel sells its Wind River Software to TPG.

[SAPS] - A former company Director (57) is expected to appear in the Thabamoopo Magistrates Court in Lebowakgomo on 11 November 2024 for allegedly defrauding a pensioner an amount of R378 000.00 in the name of business.

[GroundUp] Former Lavender Hill gangster died on 29 October

Hello,

I would like to create a button for my form that prompts the user to click on a cellview and draw a rectangle bounding box, exactly like the one used in the Area and Density Calculator. Can someone please help me with this?

Thanks!

Beto

When starting a new design, it's important to take the time to consider design recommendations that prevent problems that can arise later in the design cycle. This two-part compilation of guidelines for starting a new design is the result of years of Cadence AWR Design Environment platform Support experience with designs. Pre-design decisions for user interface, simulation, layout, and library configuration lay the groundwork for a successful and efficient AWR design. This blog, part 2, covers the layout and component library considerations designers should note prior to starting a design.(read more)

Hi, have two designs and would like to copy paste one area of circuit from the old design to the new design, best way/approach and guidance please..

Starting SPB 23.1, in Allegro X PCB Editor and Allegro X Advanced Package Designer, you can align components by using offset mode. Earlier only spacing mode was available.

Follow these steps to Align Components using Offset Mode:

1. Set Application Mode to Placement Edit.
2. Drag the components that need to be aligned and right-click and choose Align Components.
3. Now, in the Options tab, you will notice Spacing Section with Equal Offset. You can equally and individually offset the components by using the +/- buttons for increment or decrement.

Have you ever encountered ERROR(SPMHNI-67) while importing logic? If yes, you might already know that you had to export libraries of the design and make sure that paths (devpath, padpath, and psmpath) include the location of exported files.  

Starting in SPB23.1, if you go to File > Import > Logic/Netlist and click on the Other tab, you will see an option, Reuse device files for existing components. 

After selecting this option, ERROR(SPMHNI-67) will no longer be there in the log file, because the tool will automatically extract device files and seamlessly use them for newly imported data. In other words, SPB_23.1 lets you reuse the device / component definitions already in the design without first having to dump libraries manually. An excellent improvement, don’t you think?  

Starting SPB 23.1, Allegro X APD lets you import/export the symbol and component properties by using Die Text-In/Out wizards. 

Exporting the symbol 

You can export the symbol by using File > Export > Die Text-Out Wizard. 

In the Die Text-Out Wizard window, you can see the newly added options, that is, Component Properties and Symbol Properties. 

This entire information including the properties will be saved in a text file. 

Importing the symbol 

You can import the same text file in Allegro X APD by using Die Text-In Wizard. 

Choose the text file you want to import. 

Symbol properties added in the text file will be visible in the Die Text-In Wizard window. 

DDR5 DIMM Architectures The DDR5 generation of Double Data Rate DRAM memories has experienced rapid adoption in recent years. In particular, the JEDEC-defined DDR5 Dual Inline Memory Module (DIMM) cards have become a mainstay for systems looking for high-density, high-bandwidth, off-chip random access memory[1]. Within a short time, the DIMM architecture evolved from an interconnected hierarchy of only SDRAM memory devices (UDIMM[2]) to complex subsystems of interconnected components (RDIMM/LRDIMM/MRDIMM[3]). DIMM Designs and Popular Verification Use Cases The growing complexity of the DIMMs presented a challenge for pre-silicon verification engineers who could no longer simply validate against single DDR5 SDRAM memory models. They needed to consider how their designs would perform against DIMMs connected to each channel and operating at gigahertz clock speeds. To address this verification gap, Cadence developed DDR5 DIMM Memory Models that encapsulated all of the architectural complexities presented by real-world DIMMs based on a robust, easy-to-use, easy-to-debug, and easy-to-reconfigure methodology. This memory-subsystem-in-a-single-instance model has seen explosive adoption among the traditional IP Developer and SOC Integrator customers of Cadence Memory Models. The Cadence DIMM models act as a single unit with all of the relevant DIMM components instantiated and interconnected within, and with all AC/Timing parameters among the various components fully matched out-of-the-box, based on JEDEC specifications as well as datasheets of actual devices in the market. The typical use-case for the DIMM models has been where the DUT is a DDR5 Memory Controller + PHY IP stack, and the validation plan mandated compliance with the JEDEC standards and Memory Device vendor datasheets. Unique Use Case for the DIMM Discrete Component Models Although the Cadence DIMM models have enjoyed tremendous proliferation because of their cohesive implementation and unified user API, the actual DIMM Models are built on top of powerful, flexible discrete component models, each of which was designed to stand on its own as a complete SystemVerilog UVM-based VIP. All of these discrete component models exist in the Cadence VIP Catalog as standalone VIPs, complete with their own protocol compliance checking capabilities and their own configuration mappings comprehensively modeling individual AC/Timing parameters. Because of this deliberate design decision, the Cadence DIMM Discrete Component Models can support a unique use-case scenario. Some users seek to develop IC Designs for the various DIMM components. Such users need verification environments that can model the individual components of a DIMM and allow them the option to replace one or another component with their Component Design IP. They can then validate that their component design is fully compatible with the rest of the components on the DIMM and meets the integrity of the overall DIMM compliance with JEDEC standards or Memory Vendor datasheets. The Cadence Memory VIP portfolio today includes various examples that demonstrate how customers can create DIMM “wrappers” by selecting from among the available DIMM discrete component models and “stitching” them together to build their own custom testbench around their specific Component Design IP. A Solution for Unique Component Scenarios The Cadence DDR5 DIMM Memory Models and DIMM Discrete Component Models can provide users with a flexible approach to validating their specific component designs with a fully populated pre-silicon environment. Augmented Verification Capabilities When the DIMM “wrapper” model is augmented with the Cadence DFI VIP[4] that can simulate an MC+PHY stack and offers a SystemVerilog UVM test API to the verification engineer, the overall testbench transforms into a formidable pre-silicon validation vehicle. The DFI VIP is designed as a combination of an independent DFI MC VIP and a DFI PHY VIP connected to each other via the DFI Standard Interface and capable of operating seamlessly as a single unit. It presents a UVM Sequence API to the user into the DFI MC VIP with the Memory Interface of the PHY VIP connected to the DIMM “wrapper” model. With this testbench in hand, the user can then fully take advantage of the UVM Sequence Library that comes with the DFI VIP to enable deep validation of their Component Design inside the DIMM “wrapper” model. Verification Capabilities Further Enhanced A possible further enhancement comes with the potential addition of an instance of the Cadence DIMM Memory Model in a Passive Monitor mode at the DRAM Memory Interface. The DIMM Passive Monitor consumes the same configuration describing the DIMM “wrapper” in the testbench, and thus can act as a reference model for the DIMM wrapper. If the DIMM Passive Monitor responds successfully to accesses from the DFI VIP, but the DIMM wrapper does not, then it exposes potential bugs in the DUT Components or in the settings of their AC/Timing parameters inside the DIMM wrapper. Debuggability, Interface Visibility, and Protocol Compliance One of the key benefits of the DIMM Discrete Component Models that become manifest, whether in terms of the unique use-case scenario described here, or when working with the wholly unified DDR5 DIMM Memory Models, is the increased debuggability of the protocol functionality. The intentional separation of the discrete components of a DIMM allows the user to have full visibility of the memory traffic at every datapath landmark within a DIMM structure. For example, in modeling an LRDIMM or MRDIMM, the interface between the RCD component and the SDRAM components, the interface between the RCD component and the DB components, and the interface between the SDRAM components and the DB components—all are visible and accessible to the user. The user has full access to dump the values and states of the wire interconnects at these interfaces to the waveform viewer and thus can observe and correlate the activity against any protocol violations flagged in the trace logs by any one or more of the DIMM Discrete Component Models. Access to these interfaces is freely available when using the DIMM Discrete Component Models. On the unified DDR5 DIMM Memory Models, a feature called Debug Ports enables the same level of visibility into the individual interconnects amidst the SDRAM components, RCD components, and DB components. When combined with the Waveform Debugger[5] capability that comes built-in with the VIPs and Memory Models offered by Cadence and used with the Cadence Verisium Debug[6] tool, the enhanced debuggability becomes a powerful platform. With these debug accesses enabled, the user can pull out transaction streams, chip state and bank state streams, mode register streams, and error message streams all right next to their RTL signals in the same Verisium Debug waveform viewer window to debug failures all in one place. The Verisium Debug tool also parses all of the log files to probe and extract messages into a fully integrated Smart Log in a tabbed window fully hyperlinked to the waveform viewer, all at your fingertips. A Solution for Every Scenario Cadence's DDR5 DIMM Memory Models and DIMM Discrete Component Models , partnered with the Cadence DFI VIP, can provide users with a robust and flexible approach to validating their designs thoroughly and effectively in pre-silicon verification environments ahead of tapeout commitments. The solution offers unparalleled latitude in debuggability when the Debug Ports and Waveform Debugger functions of the Memory Models are switched on and boosted with the use of the Cadence Verisium Debug tool. [1] Shyam Sharma, DDR5 DIMM Design and Verification Considerations , 13 Jan 2023. [2] Shyam Sharma, DDR5 UDIMM Evolution to Clock Buffered DIMMs (CUDIMM) , 23 Sep 2024. [3] Kos Gitchev, DDR5 12.8Gbps MRDIMM IP: Powering the Future of AI, HPC, and Data Centers , 26 Aug 2024. [4] Chetan Shingala and Salehabibi Shaikh, How to Verify JEDEC DRAM Memory Controller, PHY, or Memory Device? , 29 Mar 2022. [5] Rahul Jha, Cadence Memory Models - The Gold Standard , 15 Apr 2024. [6] Manisha Pradhan, Accelerate Design Debugging Using Verisium Debug , 11 Jul 2023.

On November 5, 2024, the Cadence Bangalore Toastmasters Club celebrated a significant milestone by hosting its 50th meeting. Established in December 2020, the club was created to provide a supportive environment for individuals looking to improve their communication and leadership skills. Over the years, the club has evolved into a vibrant community filled with success stories of personal development and newfound confidence. A testament to the club's dedication is its achievement of the "Select Distinguished Club" status during the 2023-2024 program year. By fulfilling 7 out of 10 distinguished goals, the club highlighted its commitment to excellence—a success driven by its vibrant members' relentless focus and perseverance. The strategic insight gained from regular Toastmasters committee meetings and the influential "Moments of Truth" sessions held in 2023 and 2024 are key to this success. Our club members have consistently demonstrated strong performance in various speech contests, with notable achievements across multiple levels. In 2023, members excelled in Evaluation and Table Topics contests, reaching the district level while advancing to the Division Level in the International Speech Contest. Continuing their success into 2024, members again qualified for area-level contests, securing third-place positions in the Evaluation and Table Topics categories, highlighting the club's dedication and competitive spirit. The 50th meeting was based on the theme of serendipity. It was not only a milestone celebration but also a vibrant festival of achievements and growth. The day buzzed with energy as activities like a spirited Treasure Hunt injected enthusiasm and camaraderie among attendees. Distinguished guests, including Kripa Venkitachalam and Madhavi Rao, enriched the occasion with inspiring speeches. Madhavi reignited the club's spirit, while Kripa's discourse on the Growth Mindset and the "Power of Yet" encouraged members to pursue continuous self-improvement. The Cadence Bangalore Toastmasters Club is enthusiastic about its promising future and is committed to creating an environment that promotes personal and professional growth. Many members are close to completing their Toastmasters levels and pathways, and this term, a new group of approximately 30 individuals has joined, bringing the total membership to 52. This vibrant community is just beginning its journey and is eager to reach new milestones together through mutual support and a shared commitment to excellence. The transformations experienced by many club members are truly compelling. They often share how the club has significantly improved their communication skills and boosted their confidence. One member recalls, "Before joining, I found public speaking intimidating. Now, I embrace every opportunity to share my ideas." Another member highlights how the club's supportive environment helped him overcome his fear of public speaking, propelling his career to new heights. This culture of constructive feedback and continuous improvement has inspired countless members to pursue their dreams with renewed determination and optimism. The Cadence Bangalore Toastmasters Club's journey is a living testament to the power of community and the potential within each of us to grow and achieve greatness. As the club continues to evolve and inspire, it serves as a beacon for those aspiring to transform their skills and seize their moment in the spotlight. Learn more about life at Cadence.

I get multiple results at the same frequency in a 3-tone simulation.

I try to determine the IP3 of a mixer. I have 3 large signal tones: 0.75 GHz, 1.25 GHz and 1.26 GHz.

At the IM3 frequency of 490 MHz I observe 4 results, see also the screenshot of the table output. The frequencies are exactly the same (even when I subtract 490 MHz by using xval() ).

Which of the values do I have to use to determine the correct IP3?

Is there an option to merge these results?

Socionext, a leader in SoC design, recently made significant strides in enhancing its design efficiency for a complex billion-gate project. Faced with the initial challenges of lengthy eight-day iterations and a protracted two-month timing signoff process, the objective was to reduce the iteration cycle to just three days. By integrating Cadence's cutting-edge solutions—Certus Closure Solution, Tempus Timing Solution, and Quantus Extraction Solution—Socionext achieved remarkable improvements.

Notably, the Tempus DSTA tool dramatically cut timing closure time by 73%, outperforming conventional single-machine STA methods. This achievement, combined with the synergistic use of Cadence's Certus Closure and Tempus Timing solutions, allowed Socionext to meet their ambitious three-day iteration target and double productivity. Additionally, integrating these solutions significantly decreased both human and machine resource needs, slashing memory and disk costs by up to 90% and halving engineering resources during the optimization and signoff phases.

For more on this collaboration, check out the "Designed with Cadence" success story video on Cadence's website and YouTube channel.

Also, don't miss the on-demand webinar "Fast, Accurate STA for Large-Scale Design Challenges," which provides a deeper dive into Socionext's breakthroughs and the innovative solutions that powered their success.

Dr Samir Hamrouni, CEO of the World Free Zones Organization, outlines the attributes that are essential to flourishing free zones.

The UAE's DMCC takes home the top prize in fDi’s Global Free Zones of the Year for a fifth consecutive year. 

The chief executive of Ras Al Khaimah Economic Zone (RAKEZ), shares his views over the perks of free zones in emerging markets. 

Sub-Saharan Africa is the world’s fastest growing mobile phone market, but how can telecoms companies make the most of the huge opportunities the region provides?

Combining a strategic location with an investor-friendly environment, Egypt is ensuring its Suez Canal Economic Zone is primed for foreign investment. 

Sustainability is gaining traction in the creative industries, with the Italian region of Trentino designing a film production rating protocol that is being considered by the EU.

Serbia’s 15 free zones are driving forward an ongoing flurry of foreign investment in the country’s buoyant manufacturing scene, especially in automotives.

Having opened new production facilities in Rwanda and South Africa, Mara Phones is looking to alter Africa's mindset from being a 'consumer' to being a 'manufacturer'. 

Global free zones may be spurring development in less economically developed countries

Despite recurrent challenges, Afghanistan’s business environment is improving. Now the authorities are working to persuade investors the rewards are worth the risk through a series of economic and legal reforms. 

Mohammad Nafees Zakaria, Pakistan’s UK high commissioner, talks about his country’s potential for foreign investors.

A government bailout for the ailing subsidiary of the telecoms powerhouse has fallen through. 

Covid-19 crisis has laid bare the weaknesses of global value chains around the world

The 2025 Volkswagen Golf R's output increases to 328 hp A manual transmission remains off the table for all Golfs, including the R The Golf R gains a larger touchscreen and more LED lighting Volkswagen has an updated 2025 Golf R headed to showrooms early next year, and on Tuesday the automaker confirmed some of the specifications for the U.S...

Project numbers drop almost 40% between 2017 and 2018.