A method of increasing the solubility and/or dispersibility of a perylene dye in a liquid medium. The method comprises binding the perylene dye to a polymer which is soluble in the liquid medium. This abstract is neither intended to define the invention disclosed in this specification nor intended to limit the scope of the invention in any way.

One-part binder compositions are described that may include a protein and a crosslinking combination. The crosslinking combination may include at least a first crosslinking compound and a second crosslinking compound. The first and second crosslinking compounds are individually crosslinkable with each other and with the protein. Examples of the protein include soy protein. Fiber products and methods of making the fiber products are also described. The fiber products may include organic fibers, inorganic fibers, or both, in a cured thermoset binder based on solutions of the one-part binder compositions.

The invention relates to a bonding product suitable as a carrier for medicinal substances and to the compound derived therefrom that carries medicinal substances. The invention further relates to a process and device for preparing such bonding products and compounds. Further, the invention relates to a pharmaceutical composition containing such bonding products and compounds, and to the use thereof for preparing an infusible medicament for treating a disease.

The present disclosure generally relates to a HAMR head and a method for fabrication thereof. The HAMR head has a write head with a waveguide extending therethrough. A laser diode is coupled to a submount that is bonded to the write head using an adhesion layer, a solder structure, and a self-propagating multilayer alloying stack.

A method for making optical connections with optical waveguides includes mounting the optical waveguides or a device comprising the optical waveguides, on a component carrier. A partial region of the optical waveguides is embedded in a volume of resist material. Positions of the optical waveguides to be connected are detected with reference to a coordinate system using a measuring system. Favorable, three-dimensional geometries are determined for optical waveguide structures for connecting the optical waveguides to each other at predetermined connecting locations and the optical waveguide structure geometries are converted to a machine-readable dataset. The optical waveguide geometries in the volume of the resist material are three-dimensionally structured using a direct-writing lithography device operating on the basis of the machine-readable dataset. The structured resist material is treated using physical or chemical methods to form at least one optical waveguide structure having ends connected to predetermined connecting locations of the optical waveguides.

The bonding apparatus is capable of effectively increasing temperature of a substrate and reducing occurrence of position gaps and poor connection in a process of flip-chip-bonding semiconductor devices to the substrate. The bonding apparatus comprises: a supporting unit for supporting the substrate, on which the semiconductor devices have been adhered by a non-conductive; and a heating/pressing unit for heating and pressing the substrate, the heating/pressing unit having a built-in heat source and a clamping face, onto which the substrate supported by the supporting unit is pressed. The substrate supported by the supporting unit is moved toward the clamping face of the heating/pressing unit so as to preheat the substrate and the semiconductor devices by radiation heat. Then, the semiconductor devices are pressed onto the clamping face of the heating/pressing unit so as to cure the non-conductive adhesive and bond bumps of the semiconductor devices to terminal sections of the substrate.

A support structure for supporting a semiconductor device during a bonding operation is provided. The support structure comprises a body portion defining an upper surface configured to support a semiconductor device during a bonding operation. The upper surface defines a constraining feature for constraining at least a portion of the semiconductor device during the bonding operation.

Novel methods and systems for miniaturized lasers are described. A photonic crystal is bonded to a silicon-on-insulator wafer. The photonic crystal includes air-holes and can include a waveguide which couples the laser output to a silicon waveguide.

A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby.

The object of the invention is to provide a method for fabricating a semiconductor device having a peeled layer bonded to a base material with curvature. Particularly, the object is to provide a method for fabricating a display with curvature, more specifically, a light emitting device having an OLED bonded to a base material with curvature. An external force is applied to a support originally having curvature and elasticity, and the support is bonded to a peeled layer formed over a substrate. Then, when the substrate is peeled, the support returns into the original shape by the restoring force, and the peeled layer as well is curved along the shape of the support. Finally, a transfer object originally having curvature is bonded to the peeled layer, and then a device with a desired curvature is completed.

The present application discloses apparatus and methods for increasing channel utilization for a high-speed serial interface of an integrated circuit (IC). A new circuit architecture is disclosed which provides circuitry that may be programmed flexibly to support a multitude of different channel bonding schemes. In accordance with one aspect of the invention, the new architecture decouples the granularity of control-signal channel bonding from the granularity of data-aggregation channel bonding. This advantageously allows optimization of configurations for both types of channel bonding. In another aspect of the invention, the logical boundaries of bonded user channels are decoupled from the physical boundaries of the PCS modules. This decoupling advantageously eliminates a rigid constraint of previous architectures.

A rosin composition includes a gum rosin, an emulsifier, a randomizing additive and a bonding agent. This rosin composition may be used as a temporary or permanent adhesive for the soldering of components. The rosin composition may be temporary as it is easily removed from a surface without damaging the surface.

A bonded, direct fixation fastener as supportive structure for a rail on a railroad tie or bed comprising: a rail plate, wherein the rail plate has a generally horizontal center portion having a lower face and an upper face and defining a rail plate horizontal plane, and wherein the rail plate center portion extends at a first angle from opposing sides as rail plate tongues above the rail plate horizontal plane, the rail plate having a rail securing device; a bed plate comprising a generally horizontal center portion, an upper bed plate face defining a bed plate horizontal plane, and a pair of opposing bed plate tongues extending from opposing sides of the bed plate horizontal center portion disposed at a second angle above the bed plate horizontal plane; a horizontal elastomeric portion of relatively lower durometer hardness encapsulating at least a portion of the bed plate and at least a portion of the rail plate; and vertical elastomeric portions of relatively higher durometer hardness encapsulating at least a portion of each bed plate tongue and at least a portion of each rail plate tongue, and surrounding the upper face of the rail plate; and wherein each vertical elastomeric portion is physically continuous with the horizontal elastomeric portion.

Diamond bonded constructions comprise a diamond body attached to a substrate, wherein the body includes a first diamond bonded volume, and a second diamond bonded volume attached thereto. The second volume may be provided in the form of a powder or a presintered mass prior to attachment, and the first volume may be provided in the form of presintered pieces when combined with the second volume. The first volume diamond volume content is greater than about 94 percent, and is the same or greater than that of the second volume. The first volume is sintered during a first HPHT process, and the second volume is sintered and/or attached to the first volume during a second HPHT process. The first HPHT pressure is greater than the second HPHT pressure. The substrate is not an infiltration substrate used to form the first diamond volume. The diamond body may be thermally stable.

A light-emitting element which emits light with high luminance and can be driven at low voltage. The light-emitting element includes n (n is a natural number of 2 or more) EL layers between an anode and a cathode, and includes a first layer, a second layer, and a third layer between an m-th (m is a natural number, 1≦m≦n−1) EL layer from the anode and an (m+1)th EL layer. The first layer functions as a charge-generation region, has hole-transport properties, and contains an acceptor substance. The third layer has electron-transport properties and contains an alkali metal or the like. The second layer formed of a metal complex having a metal-oxygen bond and an aromatic ligand is provided between the first and third layers, whereby an injection barrier at the time of injecting electrons generated in the first layer into the m-th EL layer through the third layer can be lowered.

The present invention relates to an assembly structure of a diaphragm for a microspeaker. The present invention discloses a bonding structure of a diaphragm for a microspeaker, the boding structure comprising: a suspension including a central portion, an outer peripheral portion, and a connecting portion connecting the central portion and the outer peripheral portion; and a side diaphragm including an inner peripheral portion and an outer peripheral portion, which are attached to the central portion and outer peripheral portion of the suspension, respectively, and a dome portion, which projects between the inner peripheral portion and the outer peripheral portion, wherein the suspension and the side diaphragm are attached by thermal compression.

A device and a method for cutting through the adhesive bead of panes that have been fixed by bonding is specified, said device having a base body on which at least one suction plate for fixing on a pane to be separated out as well as one motor-drivable coil for winding-on a separating wire are accommodated, wherein at least two guide rollers are held on the base body by means of extension arms at a distance which is adjustable in respect to each other. The device is preferably positioned approximately diagonally on the pane in such a manner that the guide rollers are situated on the outer ends of the extension arms in the vicinity of the corner regions of the pane.

Provided is bond coating powder and method of making. The method includes providing a powder including a plurality of parent particles. The method includes providing a plurality of dispersoids. The method includes mechanically alloying the powder and the plurality of dispersoids at ambient temperature. The mechanical alloying operable to provide a selective occupation of the plurality of dispersoids in a grain boundary area of the plurality of parent particles providing the bond coating powder. The plurality of dispersoids occupy about 18 percent to about 30 percent of the grain boundary area of the bond coating powder.

A metal-bonded graphite foam composite includes a ductile metal continuous phase and a dispersed phase that includes graphite foam particles.

A wipe structure of stitch bonded construction incorporating one or more substrate layers of an absorbent material with a barrier layer across a face side of the absorbent material and a preformed lightweight loop fabric disposed across the underside of the absorbent layers with loops projecting away from the absorbent layers.

The present invention provides a method for bonding two substrates using a UV radiation curing-redox curing adhesive system having a shadow area and a transparent area, comprising: bonding the shadow area of the substrates using a redox curing adhesive system, and bonding the transparent area of the substrates using a liquid optically clear adhesive containing UV initiators.

The invention relates to the use of a hot-melt adhesive having high hardness for adhesive bonding of metal films or foils, paper films or foils, and/or plastic films or foils. The invention further relates to a method for adhesively bonding a metal film or foil, paper film or foil, and/or plastic film or foil onto a substrate.

A multi-layer bonding method of the present invention includes: forming a first bonded substrate by bonding a first substrate and an intermediate substrate in a bonding chamber; conveying a second substrate inside said bonding chamber when said first bonded substrate is arranged inside said bonding chamber; and forming a second bonded substrate by bonding said first bonded substrate and said second substrate in said bonding chamber. According to such a multi-layer bonding method, the upper-side substrate can be bonded with an intermediate substrate and then a first bonded substrate is bonded with a lower-side substrate without taking out the first bonded substrate from the bonding chamber. For this reason, a second bonded substrate can be produced at high speed and at a low cost.

Partially formed earth-boring rotary drill bits comprise a first less than fully sintered particle-matrix component having at least one recess, and at least a second less than fully sintered particle-matrix component disposed at least partially within the at least one recess. Each less than fully sintered particle-matrix component comprises a green or brown structure including compacted hard particles, particles comprising a metal alloy matrix material, and an organic binder material. The at least a second less than fully sintered particle-matrix component is configured to shrink at a slower rate than the first less than fully sintered particle-matrix component due to removal of organic binder material from the less than fully sintered particle-matrix components in a sintering process to be used to sinterbond the first less than fully sintered particle-matrix component to the first less than fully sintered particle-matrix component. Earth-boring rotary drill bits comprise such components sinterbonded together.

An adhesive may bond a plastic bonded explosive to a metal surface. The adhesive may include a mixture of hydroxyl-terminated polybutadiene (HTPB) and isophorone di-isocyanate (IPDI) in a weight ratio in the range of about 5 to 1 to about 10 to 1. The adhesive may include a solvent and/or a catalyst.

Bucket teeth having a metallurgically bonded wear-resistant coating and methods for forming the coated bucket teeth are disclosed. The bodies of the bucket teeth have a hard metal alloy slurry disposed on a surface and then are fused to form a metallurgical bond with the iron-based alloy. The wear-resistant coating can be formed of a fused, metal alloy comprising at least 60% iron, cobalt, nickel, or alloys thereof. The portion of the outer surface of the bucket teeth having the wear-resistant coating corresponds to a wear surface of the bucket teeth during operation.

To enable firm bonding to a member including a polyaryl ether ketone resin. A bonding method including: a bonding material applying step for applying, to the surface of a member including a polyaryl ether ketone resin, a bonding material including (A) a polymerizable monomer and (B) at least a portion of components for configuring a polymerization initiator, the content ratio of polymerizable monomers at least having two or more polymerizable functional groups in a (p2) molecule among all polymerizable monomers being 50% by mass or greater, and the content ratio of polymerizable monomers at least having one or more polymerizable functional groups and one or more functional groups capable of hydrogen bonding in a (p1h1) molecule being 5% by mass or greater; and a curing step for curing the bonding material. A bonding material and bonding kit using the bonding method.

A post for a dental crown is disclosed having improved structural features—including increased post strength and reduced likelihood of root fracture. In one embodiment, the post includes a quadrangle (4-way) split shank for increased compliance and root stress reduction while providing very high mechanical grip strength and pull-out resistance. In another embodiment, a shortened threaded section and a thread-free shank tip minimize the possibility of root fracture while still providing high grip strength and pull-out resistance. Embodiments also include a radiused transition from a primary thread to a secondary thread portion of the shank for stress reduction; and axial grooves, cross-axis through holes and other shape features of the post head for increased crown retention strength.

The present invention provides a modified cellulosic fiber having reduced hydrogen bonding capabilities. The modified fiber formed in accordance with the present invention may be useful in the production of tissue products having improved bulk and softness. More importantly, the modified fiber is adaptable to current tissue making processes and may be incorporated into a tissue product to improve bulk and softness without an unsatisfactory reduction in tensile.

The invention described relates to a polyolefin blend composition suitable for spunbond fiber or filament compositions, and to fabric compositions and composite constructions therefrom, said blend comprising a) from 60-98 wt % of at least one random propylene copolymer having a comonomer content of from 8 to 25 wt % and a crystalline melting point (Tm) as determined by differential scanning calorimetry (DSC) of from about 40° C. to about 110° C.; and b) from 2-40 wt % of at least one substantially isotactic polypropylene homopolymer or copolymer comprising one or more C2 and/or C4-C8 comonomer, having a crystalline melting point (Tm) as determined by DSC greater than or equal to 120° C. The blends of the present invention typically have a melt flow rate (MFR) of from 100 g/10 min to about 500 g/10 min.

An apparatus includes a slider of a recording head comprising a plurality of electrical bond pads coupled to bias sources and a ground pad. Each of a plurality of electrical components of the slider is coupled to at least one of the electrical bond pads. At least one of the electrical bond pads is a shared electrical bond pad coupled to at least two of the electrical components. At least one diode is coupled to at least one of the electrical bond pads and at least one of the electrical components.

A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element; (b) ultrasonically forming tack bonds between ones of the first conductive structures and respective ones of the second conductive structures; and (c) forming completed bonds between the first conductive structures and the second conductive structures.

A method of forming an abrasive article includes providing a green body having abrasive particles including microcrystalline alumina, and heating the green body via microwave radiation to form a bonded abrasive body including the abrasive particles and a bond material comprising a vitreous phase.

An abrasive article having an abrasive body including abrasive grains contained within a bond material, wherein the abrasive grains comprise microcrystalline alumina, and wherein the bond material includes less than about 1.0 mol % phosphorous oxide (P2O5), and a ratio measured in mol % between a total content of sodium oxide (Na2O) and a total content of potassium oxide (K2O) defined by [K2O/Na2O] having a value greater than about 0.5.

An abrasive article includes an elongated body, a bonding layer including a metal overlying a surface of the elongated body, and a coating layer including a polymer material overlying the boding layer. The abrasive article further includes abrasive grains contained within the bonding layer and coating layer, and wherein the bonding layer comprises an average thickness (tbl) at least about 40% of the average grit size of the abrasive grains.

Methods for preparing a silicon bonded PCD material involving a one step, double sweep process and drilling cutters made by such processes are disclosed. The PCD material includes thermally stable phases in the interstitial spaces between the sintered diamond grains. The method sweeps a diamond powder with a binder to form sintered PCD, reacts said molten binder with a temporary barrier separating said binder and said diamond from a silicon (Si) source, and sweeps said sintered PCD with said Si source to form SiC bonded PCD.

A package includes a conductive pad, with a plurality of openings penetrating through the conductive pad. A dielectric layer encircles the conductive pad. The dielectric layer has portions filling the plurality of openings. An Under-Bump Metallurgy (UBM) includes a via portion extending into the dielectric layer to contact the conductive pad. A solder region is overlying and contacting the UBM. An integrated passive device is bonded to the UBM through the solder region.

The adhesive system of the invention is especially useful in bonding replacement windows into vehicles. They allow for sufficient working time while still realizing a fast drive away time. The adhesive system is comprised of a moisture curable adhesive and a cure accelerator that may be applied using a simple single caulk gun and may be applied at ambient temperatures such as −10° C. and about 45° C. The cure accelerator is comprised of a polyol having a backbone that has at least one amine in the backbone. The moisture curable adhesive typically is comprised of an isocyanate terminated prepolymer.

Provided are a substrate chuck and a substrate bonding system including the substrate chuck. The substrate bonding system includes a lower substrate chuck and an upper substrate chuck disposed on the lower substrate chuck. The lower substrate chuck has a non-flat lower substrate contact surface, and the upper substrate chuck has a flat upper substrate contact surface.

A machine (1) and a method for thermobonding using an emission of electromagnetic waves (13), for example microwaves, to activate one or a plurality of adhesive layers located between a support and one or a plurality of layers of flexible covering, through a bed of particles (4) fluidized by a humidified gas. A multi-layer upholstery item including at least one non-permeable layer and produced in a single operation is also described.

The present invention relates to a process for detaching a component from an electronic assembly. In particular, the present invention relates to a process for detaching a component bonded with a liquid optically clear adhesive (LOCA) in a display module by using electromagnetic radiation (EMR).

The planemaker won't seek additional funding through the capital markets or U.S. government aid at this time, according to a company statement late Thursday after the debt sale.

Boeing has raised $25 billion in a massive debt sale, allowing it to avoid tapping a $17 billion coronavirus bailout fund meant to shore up businesses critical to national security.

The planemaker won't seek additional funding through the capital markets or U.S. government aid at this time, according to a company statement late Thursday after the debt sale.

Germany's top court on Tuesday ruled against the European Central Bank's bond purchases and gave the bank three months to explain how the scheme can be justified.

The New Orleans-born author spoke with Eleanor Wachtel about generational love and the power of place.

Western Australian Wheatbelt nickel producer Western Areas says it will make significant savings after raising the funds to pay off a $110 million bond.

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Aussies families identify how COVID-19 has created stress in their relationships. For some, more time under the same roof has brought them closer together.

Lorelei and Peter Murko, and other members of their family, have taken an incredible journey together because of problems they have faced with their kidneys.