1 Fiji Dollar = 1686.7521 Ugandan Shilling

1 Fiji Dollar = 2.9993 Trinidad and Tobago Dollar

1 Fiji Dollar = 0.3149 Jordanian Dinar

1 Fiji Dollar = 3.0541 Danish Krone

1 New Zealand Dollar = 2332.6295 Ugandan Shilling

1 New Zealand Dollar = 4.1478 Trinidad and Tobago Dollar

1 New Zealand Dollar = 0.4355 Jordanian Dinar

1 New Zealand Dollar = 4.2235 Danish Krone

1 Croatian Kuna = 547.7078 Ugandan Shilling

1 Croatian Kuna = 0.9739 Trinidad and Tobago Dollar

1 Croatian Kuna = 0.1023 Jordanian Dinar

1 Croatian Kuna = 0.9917 Danish Krone

1 Peruvian Nuevo Sol = 1118.0569 Ugandan Shilling

1 Peruvian Nuevo Sol = 1.9881 Trinidad and Tobago Dollar

1 Peruvian Nuevo Sol = 0.2087 Jordanian Dinar

1 Peruvian Nuevo Sol = 2.0244 Danish Krone

At 10:30 AM PST Dorian and Max will be off running!

1 Dominican Peso = 69.046 Ugandan Shilling

1 Dominican Peso = 0.1228 Trinidad and Tobago Dollar

1 Dominican Peso = 0.0129 Jordanian Dinar

1 Dominican Peso = 0.125 Danish Krone

Billy Mills (Track & Field) 1953-57
Mills grew up on the Pine Ridge Indian Reservation for the Oglala Lakota Tribe in Pine Ridge, S.D. Growing up Mills participated in boxing and running but did not hone his skills on the track until he came to Lawrence, Kan., and Haskell Institute. Following his time at Haskell, the South Dakota native went onto star at the University of Kansas, where he was a three-time All-American and a Big 8 champion. Aside from his collegiate prowess, Mills did exceptionally well on the international stage, winning Gold in the 10,000 meters during the 1964 Olympics in Tokyo, where he became only the second Native American to capture Gold. The heralded Olympian continued to run after his Tokyo experience, breaking U.S. records in two events (10,000 meters and three mile run), as well as a world record in the six mile. Mills currently lives in Sacramento, Calif., where he is a spokesperson for ‘Running Strong for American Indian Youth' organization. He is also a member of numerous Hall of Fames throughout the nation, including the U.S. Olympic Hall of Fame as well as the National Distance Running Hall of Fame.

Liberty, MO - The Haskell Indian Nations University Men's track and field teams competed at the Darrel Gourley Open on Saturday.

1 Papua New Guinean Kina = 1107.8423 Ugandan Shilling

1 Papua New Guinean Kina = 1.9699 Trinidad and Tobago Dollar

1 Papua New Guinean Kina = 0.2068 Jordanian Dinar

1 Papua New Guinean Kina = 2.0059 Danish Krone

1 Brunei Dollar = 2689.0452 Ugandan Shilling

1 Brunei Dollar = 4.7815 Trinidad and Tobago Dollar

1 Brunei Dollar = 0.502 Jordanian Dinar

1 Brunei Dollar = 4.8688 Danish Krone

Modern systems-on-a-chip (SoCs) continue to increase in complexity, adding more components and calculation power to accommodate new performance-hungry applications such as machine learning and autonomous driving.  With increased number of SoC components, such as CPUs, GPUs, accelerators and I/O devices, comes increased demand to correctly model interoperability of various components. Traditional simulation of complex systems requires accurate models of all components comprising the system and normally results in very long simulation times. A better way is to create a set of typical traffic profiles which describe behavior of system’s masters and slaves. Such profiles should be abstract to be applied to various protocols and interfaces and be portable to be applied throughout different SoC design and verification cycles.

To address the challenges outlined above, Arm has recently announced availability of the AMBA® Adaptive Traffic Profiles (AMBA ATP) specification which lays foundation of a new synthetic traffic framework. The AMBA ATP specification includes detailed information of various transaction types and timing characteristics of those transactions. The traffic profiles defined in the specification are abstract in nature and thus could be used to generate stimuli for various standard AMBA protocols and in various environments such as RTL-based simulation, FPGA prototyping and final SoC verification. The traffic profiles outlined in the specification include a set of parameters to define timing relationships between transactions as well as timing relationships within individual transactions. Even though the traffic profile represents the behavior of a single agent it could be applied either in a concurrent manner (e.g. write and read traffic profiles running in parallel) or in a sequential manner (e.g. when one traffic completes before the next one start). Moreover, when simulating a reasonably complex system, it is possible to coordinate traffic profiles generated by multiple components. While providing abstract definition of traffic profiles, the AMBA ATP specification focuses on the use of traffic profiles with an AMBA AXI interface, outlining signaling, timing relationships between different transaction phases and between different transactions. The same application principles could be used to map the abstract traffic profiles to other AMBA protocols such as AMBA5 CHI protocol.  

To facilitate adoption of the AMBA Adaptive Traffic Profiles, Cadence has recently announced availability of SystemVerilog UVM ATP Sequence Layer which automatically implements mapping of an abstract ATP traffic to AMBA protocol specific traffic, generated by Cadence AMBA Verification IP. The ATP layer is implemented as a SystemVerilog UVM virtual sequence with the sequence item including all ATP transaction parameters as defined in the specification.

Using the provided sequence infrastructure, users can write tests to define and coordinate traffic profiles for various components in the system. The ATP Layer automatically converts the abstract traffic profile into AMBA protocol-specific traffic, e.g., AMBA5 CHI protocol traffic.

 A sample code below, shows an example of a read profile translated by Cadence ACE Verification IP in ACE protocol traffic.

   `uvm_do_with(ace_atp_vseq,                                            

                       {ace_atp_vseq.agentId == agent_id;                                // ATP agent id

                        ace_atp_vseq.atpDirection == ATP_READ;                    // direction of bursts issued by virtual sequence

                        ace_atp_vseq.startAddress == start_address;                // start of address range being accessed

                        ace_atp_vseq.endAddress == end_address;                  // end of address range being accessed

                        ace_atp_vseq.atpDomain == atp_domain;                      // domain to use for transactions

                        ace_atp_vseq.addressPattern == ATP_SEQUENTIAL;  // address pattern

                        ace_atp_vseq.transactionSize == 64;                             // number of bytes in each burst

                        ace_atp_vseq.dataSize == 4;                                          // number of bytes in each transfer

                        ace_atp_vseq.rate == 150.0/(50.0);                                // requestedBandwidth / clkFrequency

                        ace_atp_vseq.start == ATP_EMPTY;                              // start condition of the ATP FIFO

                        ace_atp_vseq.full == 128;                                               // full level of the ATP FIFO

                        ace_atp_vseq.numOfTransactions == 500;                    // number of bursts issued by this sequence

                        ace_atp_vseq.ARTV == 2;                                              // sub-transaction delay

                        ace_atp_vseq.RBR == 3;                                                // sub-transaction delay

                       });

In addition to the ATP Layer for Cadence Simulation-Based AMBA Verification IP, Cadence supports the ATP functionality in Acceleration-Based AMBA Verification IP. For detailed information about ATP support in Cadence Simulation-Based and Acceleration-Based Verification IP, visit ip.cadence.com.

PCI-SIG DevCon 2019 APAC tour has come to Tokyo and Taipei this year. The focus is predominantly around the latest updates for PCIe Gen 5 which its version 1.0 specification was just released this year in May.  A series of presentations provided by PCI-SIG on the day 1 with comprehensive information covering all aspects of Gen 5 specification, including protocol, logical, electrical, compliance updates. On the day 2 (only in Taipei), several member companies shared their view on Testing, PCB analysis and Signal integrity. The exhibit is also another spotlight of this event where the member companies showcased their latest PCIe solutions.

Presentation Track (Taipei), Exhibit (Tokyo), Exhibit (Taipei) 

Cadence, as the market leading PCIe IP vendor, participated APAC tour this year with bringing in its latest PCIe IP solution offering (Gen 5/4) to the region as well as showcasing two live demo setups in the exhibit floor. One setup is the PCIe software development kit (SDK) while the other is the Interop/compliance/debug platform. Both come with the Cadence PCIe Gen 4 hardware setup and its corresponding software kit.

The SDK can be used for Device Driver Development, Firmware Development, and for pre-silicon emulation as well. It supports Xtensa and ARM processor with Linux OS and it also equip with Ethernet interface which can be used for remote debugging. It also supports PCIe stress tests for Speed change, link enable/disable, entry/exist for lower power states, …etc. 

Cadence PCIe 4.0 Software Development Kit

The “System Interop/Compliance/Debug platform” was set up to test with multiple endpoint and System platforms. This system come with integrated Cadence software for basic system debug without the need for analyzer to perform the analysis, such as LTSSM History, TS1/TS2 transmitted/received with time stamp, Link training phases, Capturing Packet errors details, Capturing PHY TX/RX internal state machine details, ...etc.

Cadence PCIe System Interop/Compliance/Debug Platform

The year 2019 is certainly a "fruitful year" for the PCIe as more Gen 4 products are now available in the market, Gen 5 v1.0 specification got officially ratified, and PCI-SIG's revealing of Gen 6 specification development. We were glad to be part of this APAC tour with the chance to further introduce Cadence’s complete and comprehensive PCIe IP solution.

See you all next year in APAC again!

More Information

For more information on Cadence's PCIe IP offerings, see our PCI Express page.

For more information on PCIe in general, and on the various PCI standards, see the PCI-SIG website.

Related Posts

• Blog: Did You “Stress Test” Yet? Essential Step to Ensure a Quality PCIe 4.0 Product
• Blog: PCIe Gen4: It’s Official, We’re Compliant
• Blog: PCIe 3.0 Still Shines While PCIe Keeps Evolving
• Blog: The PCIe 4.0 Era Continues at PCI-SIG Developers Conference 2016

Verifying lane adapter state machine in a router design is quite an involved task and needs verification from several aspects including that for its link training functionality.

The diagram below shows two lane adapters connected to each other and each going through the link training process. Each training sub-state transition is contingent on conditions for both transmission and reception of relevant ordered sets needed for a transition. Until conditions for both are satisfied an adapter cannot transition to the next training sub-state.

As deduced from the lane adapter state machine section of USB4 specification, the reception condition for the next training sub-state transition is less strict than that of the transmission condition. For ex., for LOCK1 to LOCK2 transition, the reception condition requires only two SLOS symbols in a row being detected, while the transmission condition requires at least four complete SLOS1 ordered sets to be sent.

From the above conditions in the specification, it is a possibility that a lane adapter A may detect the two SLOS or TS ordered sets, being sent by the lane adapter B on the other end, in the very beginning as soon as it starts transmitting its own SLOS or TS ordered sets. On the other hand, it is also a possibility that these SLOS or TS ordered sets are not yet detected by lane adapter A even when it has met the condition of sending minimum number of SLOS or TS ordered sets.

In such a case, lane adapter A, even though it has satisfied the transmission condition cannot transition to the next sub-state because the reception condition is not yet met. Hence lane adapter A must first wait for the required number of ordered sets to be detected by it before it can go to the next sub-state. But this wait cannot be endless as there are timeouts defined in the specification, after which the training process may be re-attempted.

This interlocked way of operation also ensures that state machine of a lane adapter does not go out of sync with that of the other lane adapter. Such type of scenarios can occur whenever lane adapter state machine transitions to the training state from other states.

Cadence has a mature Verification IP solution for the verification of various aspects of the logical layer of a USB4 router design, with verification capabilities provided to do a comprehensive verification of it.

I’m writing this on August 15. It is our Independence Day. A young Kashmiri Muslim told me in Srinagar a few months ago that this is the day on which everyone there tries to stay indoors. This is not because the people support Pakistan, but because they are most suspect on August 15. You are questioned, searched, and locked. If any of the readers have had a chance to view Sanjay Kak’s powerful documentary Jashn-e-Azadi (How We Celebrate Freedom) you’ll see how Sanjay, coming in to Srinagar for a visit around Independence Day, is struck by the fact that the only people present for the ceremony are the cops and members of the armed forces. (That’s Rave Out #1. For Jashn-e-Azadi.)

Last week’s announcement of the Indian Express-CNN/IBN poll, that an overwhelming majority of Kashmiris in the valley want azadi, also underlines the importance of a genuine rethinking on the question of independence rather than empty, nationalist sabre-rattling. (Anyway, that’s Rave Out #2. For Indian Express and CNN/IBN, as well as the good folk at CSDS who designed the poll.)

This is a good day for re-opening the pages of 13 December: A Reader, in which thirteen writers and journalists point out the injustice involved in the quick media-lynching of SAR Geelani and the denial of a fair trial to Afzal Guru. (This would be Rave Out #3, for the book, although wouldn’t it be great if the book weren’t needed?)

Rave Out © 2007 IndiaUncut.com. All rights reserved.
India Uncut * The IU Blog * Rave Out * Extrowords * Workoutable * Linkastic

One reason for attending the upcoming Design Automation Conference (DAC 2015) is to learn about challenges other engineers have faced, and hear about their solutions. And the best place to do that is the Cadence Theater, located at the Cadence booth (#3515). The Theater will host continuous half-hour customer and partner presentations from 10:00 am Monday, June 8, to 5:30 pm Wednesday June 4.

As of this writing, 43 presentations are scheduled. This includes 17 customer presentations, 23 partner presentations, and 3 Cadence presentations, The presentations are open to all DAC attendees and no reservations are required.

Cadence customers who will be speaking include engineers from AMD, ams, Allegro Micro, Broadcom, IBM, Netspeed, NVidia, Renesas, Socionet, and STMicroelectronics. Partner presentations will be provided by ARM, Cliosoft, Dini Group, GLOBALFOUNDRIES, Methodics, Methods2Business, National Instruments, Samsung, TowerJazz, TSMC, and X-Fab.

These informal presentations are given in an interactive setting with an opportunity for questions and answers. Audio recordings with slides will be available at the Cadence web site after DAC. To access recordings of the 2014 DAC Theater presentations, click here.

This Cadence DAC Theater presentation drew a large audience at DAC 2015

Here’s a listing of the currently scheduled Cadence DAC Theater presentations. The latest schedule is available at the Cadence DAC 2015 site.

Monday, June 8

Tuesday, June 9

Wednesday, June 10

In a Wednesday session (June 10, 10:00 am) at the theater, the Cadence Academic Network will sponsor three talks on academic/industry collaboration models. Speakers are Dr. Zhou Li, architect, Cadence; Prof. Xin Li, Carnegie-Mellon University; and Prof. Laleh Behjat, University of Calgary.

As shown above, there will be a giveaways for a set of Bose noise-cancelling headphones, an iPad Mini, and a GoPro Hero3 video camera.

See the Cadence Theater schedule for further details. And be sure to view our Multimedia Site for live blogging and photos and videos from DAC. For a complete overview of Cadence activities at DAC, see our DAC microsite.

Richard Goering

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Cadence DAC 2015 and Denali Party Update

DAC 2015: Tackling Tough Design Problems Head On

First, the good news. The EDA industry will grow from $6.2 billion in 2015 to $9.0 billion in 2019, according to Gary Smith, chief analyst at Gary Smith EDA. Year-to-year growth rates will range from +4% to +11.2%.

But in his annual presentation on the eve of the Design Automation Conference (DAC 2015), Smith noted that Wall Street is unimpressed. “The people I talk to want long-term steady growth, no sharp up-turns, no sharp downturns,” Smith said. “To the rest of Wall Street, we’re boring.”

Smith spent the rest of his talk noting how EDA can be a lot less boring and, potentially, a whole lot bigger. For starters, what if we add semiconductor IP to EDA revenues? Now we’re looking at $12.2 billion in revenue by 2019, Smith said. (He acknowledged, however, that the IP market itself is going to take a “dip” due to the move towards platform-based IP and away from conventional piecemeal IP).

This still is not enough to get Wall Street’s attention. Another possibility is to bring embedded software development into the EDA industry. This is not a huge market – about $2.6 billion today – but it is an “easy growth market for us,” according to Smith.

Chasing the Big Bucks

But the “big bucks” are in mechanical CAD (MCAD), Smith said. In the past the MCAD market has always been bigger than EDA, but now EDA is catching up. The MCAD market is about $6.6 billion now. Synopsys and Cadence are larger than PTC and Siemens, two of the main players in MCAD.

There may be some good acquisition possibilities coming up for EDA vendors, Smith said – and if we don’t buy MCAD companies, they might buy EDA companies. Consider, for example, that Ansoft bought Apache and Dassault bought Synchronicity. (Note: Siemens PLM Software is a first-time exhibitor at DAC 2015).

What about other domains? Smith said that EDA companies could conceivably move into optical design, applications development software, biomedical design, and chemical design. The last if these is probably the most tenuous; Smith noted that EDA vendors have yet to look into chemical design.

Applications development software is the biggest market on the above list, but that means competing with Microsoft, IBM, and Oracle. “You’re in with the big boys – is that a good idea?” Smith asked.

Perhaps there’s an opening for a “big play” for an MCAD provider. Smith noted that mechanical vendors are focusing on product data management (PDM). This “is really the IT of design,” Smith said. “They have a lot of hope that the IoT [Internet of things] market is going to give them an opportunity to capture the software that goes from the ground to the cloud. Maybe we can let them have PDM and see if we can take the tool market away from them, or acquire it away from them.”

In conclusion, Smith asked, should the EDA industry accelerate its growth? “The mechanical vendors have already shown interest in acquiring EDA vendors,” he said. “We may not have a choice.”

Richard Goering

NOTE: Catch our live blog from DAC 2015, beginning Monday morning, June 8! Click here

There has been so much hype about the “Internet of Things” (IoT) that it is refreshing to hear about a cutting-edge development project that can bring concrete benefits to millions of people. That project is the ongoing development of the Google Smart Contact Lens, and it was detailed in a keynote speech June 8 at the Design Automation Conference (DAC 2015).

The keynote speech was given by Brian Otis (right), a director at Google and a research associate professor at the University of Washington. The “smart lens” that the project envisions is essentially a disposable contact lens that fits on an eye and continuously monitors blood glucose levels. This is valuable information for anyone who has, or may someday have, diabetes.

Since he was speaking to an engineering audience, Otis focused on the challenges behind building such a device, and described some of the strategies taken by Google and its partner, Novartis. The project required new approaches to miniaturization, low-power design, and connectivity, as well as a comfortable and reliable silicon-to-human interface. Otis discussed the “why” as well and showed how the device could potentially save or improve millions of lives.

Millions of Users

First, a bit of background. Google announced the smart lens project in a blog post in January 2014. Since then it has been featured in news outlets including Forbes, Time, and the Wall Street Journal. In March 2015, Time reported that Google has been granted a patent for a smart contact lens.

The smart lens monitors the level of blood glucose by looking at its concentration in tears. The lens includes a wireless system on chip (SoC) and a miniaturized glucose sensor. A tiny pinhole in the lens allows tear fluid to seep into the sensor, and a wireless antenna handles communications to the wireless devices.

“We figure that if we can solve a huge problem, it is probably worth doing,” Otis said. “Diabetes is one example.” He noted 382 million people worldwide have diabetes today, and that 35% of the U.S. population may be pre-diabetic. Today, diabetics must *** their fingers to test blood glucose levels, a procedure that is invasive, painful, and subject to infrequent monitoring.

According to Otis, the smart contact lens represents a “new category of wearable devices that are comfortable, inexpensive, and empowering.” The lens does sensor data logging and uses a portable instrument to measure glucose levels. It is thin, cheap, and disposable, he said.

Moreover, the lens is not just for people already diagnosed with diabetes—it’s for anyone who is pre-diabetic, or may be at risk due to genetic predisposition. “If we are pro-active rather than re-active,” Otis said, “Instead of waiting until a person has full-fledged diabetes, we could make a huge difference in peoples’ lives and lower the costs of treating them.”

Technical Challenges

No one has built anything quite like the smart lens, so researchers at Google and Novartis are treading new ground. Otis identified three key challenges:

• Miniaturization: Everything must be really small—the SoC, the passive components, the power supply. Components must be flexible and cheap, and support thin-film integration.
• Platform: Google has developed a reusable platform that includes tiny, always-on wireless sensors, ultra low-power components, and standards-based interfaces.
• Data: Researchers are looking for the best ways to get the resulting data into a mobile device and onto the cloud.

Comfort is another concern. “This is not intended to be for the most severe cases,” Otis said. “This is intended to be for all of us as a pro-active way of improving our lifestyles.”

The platform provides a bidirectional encrypted wireless link, integrated power management, on-chip memory, standards-based RFID link, flexible sensor interface, high-resolution potentiostat sensor, and decoupling capacitors. Most of these capabilities are provided by the standard CMOS SoC, which is a couple hundred microns on a side and only “tens of microns” thick.

Otis noted that unpackaged ICs are typically 250 microns thick when they come back from the foundry. Thus, post-processing is needed so the IC will fit into a contact lens.

Furthermore, the design requires precision analog circuitry and additional environmental sensors. “Some of this stuff sounds mundane but it is really hard, especially when you find out you can’t throw large decoupling capacitors and bypass capacitors onto a board, and all that has to be re-integrated into the chip,” Otis said.

Sensor Challenges

Getting information from the human body is challenging. The smart lens sensor does a direct chemical measurement on the surface of the eye. The sensor is designed to work with very low glucose concentrations. This is because the concentration of glucose in tears is an order of magnitude lower than it is in blood.

In brief, the sensor has two parallel plates that are coated with an enzyme that converts glucose into hydrogen peroxide, which flows around the electrodes of the sensor. This is actually a fairly standard way of doing glucose monitoring. However, the smart lens sensor has two electrodes compared to the typical three.

In manufacturing, it is essential to keep costs low. Otis outlined a three-step manufacturing process:

• Start with the bottom layer, and mold a contact lens in the way you typically would.
• Add the electronics package on top of that layer.
• Build a second layer that encapsulates the electronics and provides the curvature needed for comfort and vision correction.

Beyond the technical challenges are the “clinical” challenges of working with human beings. The human body “is messy and very variable,” Otis said. This variability affects sensor performance and calibration, RF/electro-magnetic performance, system reliability, and comfort.

The final step is making use of the data. “We need to get the data from the device into a phone, and then display it so users can visualize the data,” Otis said. This provides “actionable feedback” to the person who needs it. Eventually, the data will need to be stored in the cloud.

As he concluded his talk, Otis noted that the platform his group developed may have many applications beyond glucose monitoring. “There is a lot you can do with a bunch of logic and sensing capability,” he said, “and there are hundreds of biomarkers beyond glucose.” Clearly this will be an interesting technology to watch.

Richard Goering

Related Blog Post

- Gary Smith at DAC 2015: How EDA Can Expand Into New Directions

As a leading venture capitalist in the electronics technology, as well as CEO of Cadence, Lip-Bu Tan has unique insights into ongoing changes that will impact EDA providers and users. Tan shared some of those insights in a “fireside chat” with Ed Sperling, editor in chief of Semiconductor Engineering, at the Design Automation Conference (DAC 2015) on June 9.

Topics of this discussion included industry consolidation, the need for more talent and more startups, Internet of Things (IoT) opportunities and challenges, the shift from ICs to full product development, and the challenges of advanced nodes. Following are some excerpts from this conversation, held at the DAC Pavilion theater on the exhibit floor.

Ed Sperling (left) and Lip-Bu Tan (right) discuss trends in semiconductors and EDA

Q: As you look out over the semiconductor and EDA industries these days, what worries you most?

Tan: At the top of my list is all the consolidation that is going on. Secondly, chip design complexity is increasing substantially. Time-to-market pressure is growing and advanced nodes have challenges.

The other thing I worry about is that we need to have more startups. There’s a lot of innovation that needs to happen. And this industry needs more top talent. At Cadence, we have a program to recruit over 10% of new hires every year from college graduates. We need new blood and new ideas.

Q: EDA vendors were acquiring companies for many years, but now the startups are pretty much gone. Where does the next wave of innovation come from?

Tan: I’ve been an EDA CEO for the last seven years and I really enjoy it because so much innovation is needed. System providers have very big challenges and very different needs. You have to find the opportunities and go out and provide the solutions.

The opportunities are not just in basic tools. Massive parallelism is critical, and the power challenge is huge. Time to market is critical, and for the IoT companies, cost is going to be critical. If you want to take on some good engineering challenges, this is the most exciting time.

Q: You live two lives—you’re a CEO but you’re also an investor. Where are the investments going these days and where are we likely to see new startups?

Tan: Clearly everybody is chasing the IoT. There is a lot of opportunity in the cloud, in the data center. Also, I’m a big believer in video, so I back companies that are video related. A big area is automotive. ADAS [Advanced Driver Assistance Systems] is a tremendous opportunity.

These companies can help us understand how the industry is transforming, and then we can provide solutions, either in terms of IP, tools, or the PCB. Then we need to connect from the system level down to semiconductors. I think it’s a different way to design.

Q: What happens as we start moving from companies looking to design a semiconductor to system companies who are doing things from the perspective that we have this purpose for our software?

Tan: We are extending from EDA to what we call system design enablement, and we are becoming more application driven. The application at the system level will drive the silicon design. We need to help companies look at the whole system including the power envelope and signal integrity. You don’t want to be in a position where you design a chip all the way to fabrication and then find the power is too high.

We help the customers with hardware/software co-design and co-verification. We have a design suite and a verification suite that can provide customers with high-level abstractions, as well as verify IP blocks at the system level. Then we can break things down to the component level with system constraints in mind, and drive power-aware, system-aware design.

We are starting to move into vertical markets. For example, medical is a tremendous opportunity.

Q: How does this approach change what you provide to customers?

Tan: Every year I spend time meeting with customers. I think it is very important to understand what they are trying to design, and it is also important to know the customer’s customer requirements. We might say, “Wait a minute, for this design you may want to think about power or the library you’re using.” We help them understand what foundry they should use and what process they should use. They don’t view me as a vendor—they view me as a partner.

We also work very closely with our IP and foundry partners. We work as one team—the ultimate goal is customer success.

Q: Is everybody going to say, FinFETs are beautiful, we’re going to go down to 10nm or 7nm—or is it a smaller number of companies who will continue down that path?

Tan: Some of the analog/mixed-signal companies don’t need to go that far. We love those customers—we have close to 50% of that business. But we also have customers in the graphics or processor area who are really pushing the envelope, and need to be in 16nm, 14nm, or 10nm. We work very closely with those guys to make sure they can go into FinFETs.

We always want to work with the customer to make sure they have a first-time silicon success. If you have to do a re-spin, you miss the opportunity and it’s very costly.

Q: There’s a new market that is starting to explode—IoT. How real is that world to you? Everyone talks about large numbers, but is it showing up in terms of tools?

Tan: Everybody is talking about huge profits, but a lot of the time I think it is just connecting old devices that you have. Billions of units, absolutely yes, but if you look close enough the silicon percentage of that revenue is very tiny. A lot of the profit is on the service side. So you really need to look at the service killer app you are trying to provide.

What’s most important to us in the IoT market is the IP business. That’s why we bought Tensilica—it’s programmable, so you can find the killer app more quickly. The other challenges are time to market, low power, and low cost.

Q: Where is system design enablement going? Does it expand outside the traditional market for EDA?

Tan: It’s not just about tools. IP is now 11% of our revenue. At the PCB level, we acquired a company called Sigrity, and through that we are able to drive system analysis for power, signal integrity, and thermal. And then we look at some of the verticals and provide modeling all the way from the system level to the component level. We make sure that we provide a solution to the end customer, rather than something piecemeal.

Q: What do you think DAC will look like in five years?

Tan: It’s getting smaller. We need to see more startups and innovative IP solutions. I saw a few here this year, and that’s good. We need to encourage small startups.

Q: Where do we get the people to pull this off? I don’t see too many people coming into EDA.

Tan: I talk to a lot of university students, and I tell them that this small industry is a gold mine. A lot of innovation is needed. We need them to come in [to EDA] rather than join Google or Facebook. Those are great companies, but there is a lot of fundamental physical innovation we need.

Richard Goering

Related Blog Posts

- Gary Smith at DAC 2015: How EDA Can Expand Into New Directions

- DAC 2015: Google Smart Contact Lens Project Stretches Limits of IC Design

- Q&A with Nimish Modi: Going Beyond Traditional EDA

Design and verification standards are critical if we want to get a new generation of Internet of Things (IoT) devices into the market, according to panelists at an Accellera Systems Initiative breakfast at the Design Automation Conference (DAC 2015) June 9. However, IoT devices for different vertical markets pose very different challenges and requirements, making the standards picture extremely complicated.

The panel was titled “Design and Verification Standards in the Era of IoT.” It was moderated by industry editor John Blyler, CEO of JB Systems Media and Technology. Panelists were as follows, shown left to right in the photo below:

• Lu Dai, director of engineering, Qualcomm
• Wael William Diab, senior director for strategy marketing, industry development and standardization, Huawei
• Chris Rowen, CTO, IP Group, Cadence Design Systems, Inc.

In opening remarks, Blyler recalled a conversation from the recent IEEE International Microwave Symposium in which a panelist pointed to the networking and application layers as the key problem areas for RF and wireless standardization. Similarly, in the IoT space, we need to look “higher up” at the systems level and consider both software and hardware development, Blyler said.

Rowen helped set some context for the discussion by noting three important points about IoT:

• IoT is not a product segment. Vertical product segments such as automotive, medical devices, and home automation all have very different characteristics.
• IoT “devices” are components within a hierarchy of systems that includes sensors, applications, user interface, gateway application (such as cell phone), and finally the cloud, where all data is aggregated.
• A bifurcation is taking place in design. We are going from extreme scale SoCs to “extreme fit” SoCs that are specialized, low energy, and very low cost.

Here are some of the questions and answers that were addressed during the panel discussion.

Q: The claim was recently made that given the level of interaction between sensors and gateways, 50X more verification nodes would have to be checked for IoT. What standards need to be enhanced or changed to accomplish that?

Rowen: That’s a huge number of design dimensions, and the way you attack a problem of that scale is by modularization. You define areas that are protected and encapsulated by standards, and you prove that individual elements will be compliant with that interface. We will see that many interesting problems will be in the software layers.

Q: Why is standardization so important for IoT?

Dai: A company that is trying to make a lot of chips has to deal with a variety of standards. If you have to deal with hundreds of standards, it’s a big bottleneck for bringing your products to market. If you have good standardization within the development process of the IC, that helps time to market.

When I first joined Qualcomm a few years ago, there was no internal verification methodology. When we had a new hire, it took months to ramp up on our internal methodology to become effective. Then came UVM [Universal Verification Methodology], and as UVM became standard, we reduced our ramp-up time tremendously. We’ve seen good engineers ramp up within days.

Diab: When we start to look at standards, we have to do a better job of understanding how they’re all going to play with each other. I don’t think one set of standards can solve the IoT problem. Some standards can grow vertically in markets like industrial, and other standards are getting more horizontal. Security is very important and is probably one thing that goes horizontally.

Requirements for verticals may be different, but processing capability, latency, bandwidth, and messaging capability are common [horizontal] concerns. I think a lot of standards organizations this year will work on horizontal slices [of IoT].

Q: IoT interoperability is important. Any suggestions for getting that done and moving forward?

Rowen: The interoperability problem is that many of these [IoT] devices are wireless. Wireless is interesting because it is really hard – it’s not like a USB plug. Wireless lacks the infrastructure that exists today around wired standards. If we do things in a heavily wireless way, there will be major barriers to overcome.

Dai: There are different standards for 4G LTE technology for different [geographical] markets. We have to make a chip that can work for 20 or 30 wireless technologies, and the cost for that is tremendous. The U.S., Europe, and China all have different tweaks. A good standard that works across the globe would reduce the cost a lot.

Q: If we’re talking about the need to define requirements, a good example to look at is power. Certainly you have UPF [Unified Power Format] for the chip, board, and module.

Rowen: There is certainly a big role for standards about power management. But there is also a domain in which we’re woefully under-equipped, and that is the ability to accurately model the different power usage scenarios at the applications level. Too often power devolves into something that runs over thousands of cycles to confirm that you can switch between power management levels successfully. That’s important, but it tells you very little about how much power your system is going to dissipate.

Dai: There are products that claim to be UPF compliant, but my biggest problem with my most recent chip was still with UPF. These tools are not necessarily 100% UPF compliant.

One other concern I have is that I cannot get one simulator to pass my Verilog code and then go to another that will pass. Even though we have a lot of tools, there is no certification process for a language standard.

Q: When we create a standard, does there need to be a companion compliance test?

Rowen: I think compliance is important. Compliance is being able to prove that you followed what you said you would follow. It also plays into functional safety requirements, where you need to prove you adhered to the flow.

Dai: When we [Qualcomm] sell our 4G chips, we have to go through a lot of certifications. It’s often a differentiating factor.

Q: For IoT you need power management and verification that includes analog. Comments?

Rowen: Small, cheap sensor nodes tend to be very analog-rich, lower scale in terms of digital content, and have lots of software. Part of understanding what’s different about standardization is built on understanding what’s different about the design process, and what does it mean to have a software-rich and analog-rich world.

Dai: Analog is important in this era of IoT. Analog needs to come into the standards community.

Richard Goering

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DAC 2015: Cadence Vision-Design Presentation Wins Best Paper Honors

Let’s face it – the EDA industry needs new people and new ideas. One of the best places to find both is academia, and a presentation at the Cadence Theater at the recent Design Automation Conference (DAC 2015) described collaboration models that are working today.

The presentation was titled “Industry/Academia Engagement Models – From PhD Contests to R&D Collaborations.” It included these speakers, shown from left to right in the photo below:

• Prof. Xin Li, Electrical and Computer Engineering, Carnegie-Mellon University (CMU)
• Chuck Alpert, Senior Software Architect, Cadence
• Prof. Laleh Behjat, Department of Electrical and Computer Engineering, University of Calgary

Alpert, who was filling in for Zhuo Li, Software Architect at Cadence, was the vice chair of DAC 2015 and will be the general chair of DAC 2016 in Austin, Texas. “My team at Cadence really likes to collaborate with universities,” he said. “We’re a big proponent of education because we really need the best and brightest students in our industry.”

Contests Boost EDA Research

One way that Cadence collaborates with academia is participation in contests. “It’s a great way to formulate problems to academia,” Alpert said. “We can have the universities work on these problems and get some strategic direction.”

For example, Cadence has been involved with the annual CAD contest at the International Conference on Computer-Aided Design (ICCAD) since the contest was launched in 2012. This is the largest worldwide EDA R&D contest, and it is sponsored by the IEEE Council on EDA (CEDA) and the Taiwan Ministry of Education. Its goals are to boost EDA research in advanced real-world problems and to foster industry-academia collaboration.

Contestants can participate in one of more problems in the three areas of system design, logic synthesis and verification, and physical design. The 2015 contest has attracted 112 teams from 12 regions. Cadence contributes one problem per year in the logic synthesis area. Zhuo Li was the 2012 co-chair and the 2013 chair. The awards will be given at ICCAD in November 2015.

Another step that Cadence has taken, Alpert said, is to “hire lots of interns.” His own team has four interns at the moment. One advantage to interning at Cadence, he said, is that students get to see real-world designs and understand how the tools work. “It helps you drive your research in a more practical and useful direction,” he said.

The Cadence Academic Network co-sponsors the ACM SIGDA PhD Forum at DAC, and Xin Li and Zhuo Li are on the organizing committee. This event is a poster session for PhD students to present and discuss their dissertation research with people in the EDA community. This year’s forum was “packed,” Alpert said, and it’s clear that the event needs a bigger room.

Finally, Alpert noted, Cadence researchers write and publish technical papers at DAC and other conferences, and Cadence people serve on the DAC technical program committee. “We try to be involved with the academic community on a regular basis,” Alpert said. “We want the best and the brightest people to go into EDA because there is still so much innovation that’s needed. It’s a really cool place to be.”

Research Collaboration Exposes Failure Rates

Xin Li presented an example of a successful research collaboration between CMU and Cadence. The challenge was to find a better way to estimate potential failure rates in memory. As noted in a previous blog post, PhD student Shupeng Sun met this challenge with a new statistical methodology that won a Best Poster award at the ACM SIGDA PhD Forum at DAC 2014.

The new methodology is called Scaled-Sigma Sampling (SSS). It calculates the failure rate and accounts for variability in the manufacturing process while only requiring a few hundred, or a few thousand, sample circuit blocks. Previously, millions of samples were required for an accurate validation of a new design, and each sample could take minutes or hours to simulate. It could take a few weeks or months to run one validation.

The SSS methodology requires greatly reduced simulation times. It makes it possible, Li noted, to run simulations overnight and see the results in the morning.

Li shared his secret for success in collaborations. “I want to emphasize that before the collaboration, you have to understand the goal. If you don’t have a clear goal, don’t collaborate. Once you define the goal, stick to it and make it happen.”

Contest Provides Learning Experience

Last year Laleh Behjat handed two of her new PhD students a challenge. “I told them there is an ISPD [International Symposium for Physical Design] contest on placement, and I expect you to participate and I expect you to win. Not knowing anything about placement, I don’t think they realized what I was asking them.”

The 2015 contest was called the Blockage-Aware Detailed Routing-Driven Placement Contest. Results were announced at the end of March at ISPD. And the University of Calgary team, despite its lack of placement experience, took second place.

Such contests provide a good learning tool, according to Behjat. Graduate students in EDA, she said, “have to be good programmers. They have to work in teams and be collaborative, be able to innovate, and solve the hardest problems I have seen in engineering and science. And they have to think outside the box.” A contest can bring out all these attributes, she said.

Further, Behjat noted, contest participants had access to benchmarks and to a placement tool. They didn’t have to write tools to find out if their results were good. Industry sponsors, meanwhile, got access to good students and new approaches for solving problems.

“You can see Cadence putting a big amount of time, effort and money to get students here and get them excited about doing contests,” she said. She advised students in the theater audience to “talk to people in the Cadence booth and see if you can have more ideas for collaboration.”

Richard Goering

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EDA investor and former executive Jim Hogan is optimistic about automotive electronics, but he has some concerns as well. At the recent Design Automation Conference (DAC 2015), he delivered a speech titled “The Looming Quality, Reliability, and Safety Crisis in Automotive Electronics...Why is it and what can we do to avoid it?"

Hogan gave the keynote speech for IP Talks!, a series of over 30 half-hour presentations located at the ChipEstimate.com booth. Presenters included ARM, Cadence, eSilicon, Kilopass, Sidense, SilabTech, Sonics, Synopsys, True Circuits, and TSMC. Held in an informal setting, the talks addressed the challenges faced by SoC design teams and showed how the latest developments in semiconductor IP can contribute to design success.

Jim Hogan delivers keynote speech at DAC 2015 IP Talks!

Hogan talked about several phases of automotive electronics. These include assisted driving to avoid collisions, controlled automation of isolated tasks such as parallel parking, and, finally, fully autonomous vehicles, which Hogan expects to see in 15 to 20 years. The top immediate priorities for automotive electronics designers, he said, will be government regulation, fuel economy, advanced safety, and infotainment.

More Code than a Boeing 777

According to Hogan, today’s automobiles use 50-100 microcontrollers per car, resulting in a worldwide automotive semiconductor market of around $40 billion. The global market for advanced automotive electronics is expected to reach $240 billion by 2020. Software is growing faster in the automotive market than it is in smartphones. Hogan quoted a Ford vice president who observed that there are more lines of code in a Ford Fusion car than a Boeing 777 airplane.

One unique challenge for automotive electronics designers is long-term reliability. This is because a typical U.S. car stays on the road for 15 years, Hogan said. Americans are holding onto new vehicles for a record 71.4 months.

Another challenge is regulatory compliance. Aeronautics is highly regulated from manufacturing to air traffic control, and the same will probably be true of automated cars. Hogan speculated that the Department of Transportation will be the regulatory authority for autonomous cars. Today, automotive electronics providers must comply with the ISO26262 automotive functional safety specification.

So where do we go from here? “We’ve got to change our mindset,” Hogan said. “We’ve got to focus on safety and reliability and demand a different kind of engineering discipline.” You can watch Hogan’s entire presentation by clicking on the video icon below, or clicking here. You can also watch other IP Talks! videos from DAC 2015 here.

https://youtu.be/qL4kAEu-PNw

Richard Goering

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Automotive Functional Safety Drives New Chapter in IC Verification

In 1985, as a relatively new editor at Computer Design magazine, I was asked to go forth and cover a new business called CAE (computer-aided engineering). I knew nothing about it, but I had been writing about design for test, so there seemed to be somewhat of a connection. Little did I know that “CAE” would turn into “EDA” and that I’d write about it for the next 30 years, for Computer Design, EE Times, Cadence, and a few others.

Now that I’m about to retire, I’m looking back over those 30 years. What a ride it has been! By the numbers I covered 31 Design Automation Conferences (DACs), hundreds of new products, dozens of acquisitions and startups, dozens of lawsuits, and some blind alleys that didn’t work out (like “silicon compilation”). Chip design went from gate arrays and PLDs with a few thousand gates to processors and SoCs with billions of transistors.

In 1985 there were three big CAE vendors – Daisy Systems, Mentor Graphics, and Valid Logic. All sold bundled packages that included workstations and CAE software; in fact, Daisy and Valid designed and manufactured their own workstations. In the early 1980s a workstation with schematic capture and gate-level logic simulation might have set you back $120,000. In 1985 OrCAD, now part of Cadence, came out with a $500 schematic capture package running on IBM PCs.

Cadence and Synopsys emerged in the late 1980s, and by the 1990s the EDA industry was pretty much a software-only business (apart from specialized machines like simulation accelerators). Since the early 1990s the “big three” EDA vendors have been Cadence, Synopsys, and Mentor, giving the industry stability but allowing for competition and innovation.

Here, in my view, are some of the highlights that occurred during the past 30 years of EDA.

EDA is a Highlight

The biggest highlight in EDA is the existence of a commercial EDA industry! Marching hand in hand with the fabless semiconductor revolution, commercial EDA made it possible for hundreds of companies to design semiconductors, as opposed to a small handful that could afford large internal CAD operations and fabs. With hundreds of semiconductor companies as opposed to a half-dozen, there’s a lot more creativity, and you get the level of sophistication and intelligence that you see in your smartphone, video camera, tablet, gaming console, and car today.

CAE + CAD = EDA. This is not just a terminology issue. By the mid-1980s it became clear that front-end design (CAE) and physical design (CAD) belonged together. The big CAE vendors got involved in IC and PCB CAD, and presented increasingly integrated solutions. People got tired of writing “CAE/CAD” and “EDA” was born.

The move from gate-level design to RTL. This move happened around 1990, and in my view this is EDA’s primary technology success story during the past 30 years. Moving up in abstraction made the design and verification of much larger chips possible. Going from gate-level schematics to a hardware description language (HDL) revolutionized logic design and verification. Which would you rather do – draw all the gates that form an adder, or write a few lines of code and let a synthesis tool find an adder in your chosen technology?

Two developments made this shift in design possible. One was the emergence of commercial RTL synthesis (or “logic synthesis”) tools from Synopsys and other companies, which happened around 1990. Another was the availability of Verilog, developed by Gateway Design Automation and purchased by Cadence in 1989, as a standard RTL HDL. Although most EDA vendors at the time were pushing VHDL, designers wanted Verilog and that’s what most still use (with SystemVerilog coming on strong in the verification space).

IC functional verification underwent huge changes in the late 1990s and early 2000s, largely due to new technology developed by Verisity, which was acquired by Cadence in 2005. Before Verisity, verification engineers were writing and running directed tests in an ad-hoc manner. Verisity introduced or improved technologies such as pseudo-random test generation, coverage metrics, reusable verification IP, and semi-automated verification planning. The Verisity “e” language became a widely used hardware verification language (HVL).

The biggest way that EDA has expanded its focus has been through semiconductor IP. Today Synopsys and Cadence are leading providers in this area. Thanks to the availability of design and verification IP, many SoC designs today reuse as much as 80% of previous content. This makes it much, much faster to design the remaining portion. While IP began with fairly simple elements, today commercially available IP can include whole subsystems along with the software that runs on them. With IP, EDA vendors are providing not only design tools but design content.

Finally, the EDA industry has done an amazing job of keeping up with SoC complexity and with advanced process nodes. Thanks to intense and early collaboration between foundries, IP, and EDA providers, tools and IP have been ready for process nodes going down to 10nm.

Where Does ESL Fit?

In some ways, electronic system level (ESL) design is both a lowlight and a highlight. It’s a lowlight because people have been talking about it for 30 years and the acceptance and adoption have come very slowly. ESL is a highlight because it’s finally starting to happen, and its impact on design and verification flows could be dramatic. Still, ESL is vaguely defined and can be used to describe almost anything that happens at a higher abstraction level than RTL.

High-level synthesis (HLS) is an ESL technology that is seeing increasing use in production environments. Current HLS tools are not restricted to datapaths, and they produce RTL code that gives better quality of results than hand-written RTL. Another ESL methodology that’s catching on is virtual prototyping, which lets software developers write software pre-silicon using SystemC models. Both HLS and virtual prototyping are made possible by the standardization of SystemC and transaction-level modeling (TLM). However, it’s still not easy to use the same SystemC code for HLS and virtual prototyping.

And Now, Some Lowlights

Every new industry has some twists and turns, and EDA is no exception. For example, the EDA industry in the 1980s and 1990s sparked a lot of lawsuits. At EE Times my colleagues and I wrote a number of articles about EDA legal disputes, mostly about intellectual property, trade secrets, or patent issues. Over the past decade, fortunately, there have been far fewer EDA lawsuits than we had before the turn of the century.

Another issue that was troublesome in the 1980s and 1990s was so-called “standards wars.” These would occur as EDA vendors picked one side or the other in a standards dispute. For example, power intent formats were a point of conflict in the early 2000s, but the Common Power Format (CPF) and the Unified Power Format (UPF) are on the road to convergence today with the IEEE 1801 effort. As mentioned previously, Verilog and VHDL were competing for adoption in the early 1990s. For the most part, Verilog won, showing that the designer community makes the final decision about which standards will be used.

How on earth did there get to be something like 30 DFM (design for manufacturability) companies 10-12 years ago? To my knowledge, none of these companies are around today. A few were acquired, but most simply faded away. A lot of investors lost money. Today, VCs and angel investors are funding very few EDA or IP startups. There are fewer EDA startups than there used to be, and that’s too bad, because that’s where a lot of the innovation comes from.

Here’s another current lowlight -- not enough bright engineering or computer science students are joining EDA companies. They’re going to Google, Apple, Facebook, and the like. EDA is perceived as a mature industry that is still technically very difficult. We need to bring some excitement back into EDA.

Where Is EDA Headed?

Now we come to what you might call “headlights” and look at what’s coming. My list includes:

• System Design Enablement. This term has been coined by Cadence to describe a focus on whole systems or end products including chips, packages, boards, embedded software, and mechanical components. There are far more systems companies than semiconductor companies, leaving a large untapped market that’s looking for solutions.
• New frontiers for EDA. At a 2015 Design Automation Conference speech, analyst Gary Smith suggested that EDA can move into markets such as embedded software, mechanical CAD, biomedical, optics, and more.
• Vertical markets. EDA has until now been “horizontal,” providing the same solution for all market segments. Going forward, markets like consumer, automotive, and industrial will have differing needs and will need optimized tools and IP.
• Internet of Things. This is a current buzzword, but the impact on EDA remains uncertain. Many IoT devices will be heavily analog, use mature process nodes, and be dirt cheap. Lip-Bu Tan, Cadence CEO, recently pointed out that the silicon percentage of IoT revenue will be small and that a lot of the profits will be on the service side.

Moving On

For the past six years I’ve been writing the Industry Insights blog at Cadence.com. All things change, and with this post comes a farewell – I am retiring in late June and will be pursuing a variety of interests other than EDA. I’ll be watching, though, to see what happens next in this small but vital industry. Thanks for reading!

Richard Goering

Hello,

I created a floorplan view in Virtuoso ( it contains pins and blockages). I am trying to run PnR in Innovus for floorplan created in Virtuoso. I used  set vars(oa_fp)    "Library_name cell_name view_name"   to read view from virtuoso. I am able to see pins in Innovus but not the blockages. Can i know how do i get the blockages created in virtuoso to Innovus.

Regards,
Amuu 

Hi,

I want to convert ircx file(which is from TSMC,inclued EM Information) to ict or emDataFile for Voltus-fi.

I tried many way, but I can not make it. Can anyone give me some advice?

and I  do not installed QRC.

below is some tools installed my server. 

IC617-64b.500.21 is used.

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