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[ J.288 (07/19) ] - Encapsulation of type length value (TLV) packet for cable transmission systems

Encapsulation of type length value (TLV) packet for cable transmission systems




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[ J.1107 (03/18) ] - Architecture and specification for radio over IP transmission systems

Architecture and specification for radio over IP transmission systems




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[ J.224 (07/19) ] - Fifth-generation transmission systems for interactive cable television services - IP cable modems

Fifth-generation transmission systems for interactive cable television services - IP cable modems




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[ F.746.13 (03/22) ] - Requirements for smart speaker-based intelligent multimedia communication systems

Requirements for smart speaker-based intelligent multimedia communication systems




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[ F.748.16 (05/22) ] - Requirements for applications and services in smart manufacturing based on machine vision

Requirements for applications and services in smart manufacturing based on machine vision




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[ F.742.1 (12/22) ] - Requirements for smart class based on artificial intelligence

Requirements for smart class based on artificial intelligence




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[ F.751.7 (12/22) ] - Functional assessment methods for distributed ledger technology platforms

Functional assessment methods for distributed ledger technology platforms




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[ F.747.12 (12/22) ] - Requirements for artificial intelligence based machine vision system in smart logistics warehouse

Requirements for artificial intelligence based machine vision system in smart logistics warehouse




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[ F.751.6 (12/22) ] - Performance assessment methods for distributed ledger technology platforms

Performance assessment methods for distributed ledger technology platforms




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[ F.746.15 (12/22) ] - Requirements for smart broadband network gateway in multimedia content transmission

Requirements for smart broadband network gateway in multimedia content transmission




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[ D.211 (1998) Supplement 1 (05/10) ] - Guidelines for international short message service (SMS) interconnection

Guidelines for international short message service (SMS) interconnection




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[ D.261 (10/16) ] - Regulatory principles for market definition and identification of operators with significant market power - SMP

Regulatory principles for market definition and identification of operators with significant market power - SMP




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[ D.Sup4 (04/20) ] - ITU-T D.263 - Supplement on Principles for increased adoption and use of mobile financial services (MFSs) through effective consumer protection mechanisms

ITU-T D.263 - Supplement on Principles for increased adoption and use of mobile financial services (MFSs) through effective consumer protection mechanisms




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[ D.1102 (12/21) ] - Customer redress and consumer protection mechanisms for OTTs

Customer redress and consumer protection mechanisms for OTTs




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[ L.1007 (12/16) ] - Test suites for assessment of the external universal power adapter solutions for portable information and communication technology devices

Test suites for assessment of the external universal power adapter solutions for portable information and communication technology devices




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[ L.1006 (12/16) ] - Test suites for assessment of the external universal power adapter solutions for stationary information and communication technology devices

Test suites for assessment of the external universal power adapter solutions for stationary information and communication technology devices




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[ L.1380 (11/19) ] - Smart energy solution for telecom sites

Smart energy solution for telecom sites




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[ TD 828-PLEN ] Revision 1 - English - Zip file - Multipurpose Smart ID Card with PKI (Bio Digital Signature with Smart Card + e-ID + Credit Card)

Multipurpose Smart ID Card with PKI (Bio Digital Signature with Smart Card + e-ID + Credit Card)
Source: SG 17 Chairman
Study Questions: Q9/17




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[ TD 927-PLEN ] Revision 1 - English - Zip file - UPU-ITU mini workshop: Multipurpose Smart ID Card with PKI (Bio Digital Signature with Smart Card + e-ID + Credit Card)"

UPU-ITU mini workshop: Multipurpose Smart ID Card with PKI (Bio Digital Signature with Smart Card + e-ID + Credit Card)"
Source: TSB
Study Questions: Q9/17




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[ X.1331 (03/18) ] - Security guidelines for home area network (HAN) devices in smart grid systems

Security guidelines for home area network (HAN) devices in smart grid systems




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[ X.1214 (03/18) ] - Security assessment techniques in telecommunication/information and communication technology networks

Security assessment techniques in telecommunication/information and communication technology networks




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[ X.1093 (11/18) ] - Telebiometric access control with smart ID cards

Telebiometric access control with smart ID cards




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[ X.1450 (10/18) ] - Guidelines on hybrid authentication and key management mechanisms in the client-server model

Guidelines on hybrid authentication and key management mechanisms in the client-server model




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[ X.Sup28 (09/16) ] - ITU-T X.1245 - Supplement on technical measures and mechanisms on countering spoofed calls in the terminating network of voice over long term evolution (VoLTE)

ITU-T X.1245 - Supplement on technical measures and mechanisms on countering spoofed calls in the terminating network of voice over long term evolution (VoLTE)




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[ X.Sup29 (09/17) ] - ITU-T X.1242 - Supplement on guidelines on countermeasures against short message service phishing and smishing attacks

ITU-T X.1242 - Supplement on guidelines on countermeasures against short message service phishing and smishing attacks




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[ Q.Sup70 (06/19) ] - Signalling requirements for IMS and GSM/UMTS network supporting multi-device emergency telecommunications service

Signalling requirements for IMS and GSM/UMTS network supporting multi-device emergency telecommunications service




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[ G.9979 (11/18) ] - Implementation of the generic mechanism in the IEEE 1905.1a-2014 standard to include applicable ITU-T Recommendations

Implementation of the generic mechanism in the IEEE 1905.1a-2014 standard to include applicable ITU-T Recommendations




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[ G.8121.1/Y.1381.1 (11/18) ] - Characteristics of MPLS-TP equipment functional blocks supporting ITU-T G.8113.1/Y.1372.1 OAM mechanisms

Characteristics of MPLS-TP equipment functional blocks supporting ITU-T G.8113.1/Y.1372.1 OAM mechanisms




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[ G.1028.2 (06/19) ] - Assessment of the LTE circuit switched fall back - Impact on voice quality of service

Assessment of the LTE circuit switched fall back - Impact on voice quality of service




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[ G.671 (08/19) ] - Transmission characteristics of optical components and subsystems

Transmission characteristics of optical components and subsystems




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[ V.14 (11/88) ] - Transmission of start-stop characters over synchronous bearer channels

Transmission of start-stop characters over synchronous bearer channels




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Most Popular Wireframe tools Small Business Should Consider in 2022

Wireframing is the first and the most crucial step in deciding the fate of an application. The right wireframe can make an excellent app – turning an idea perfectly into an app, while a wrong wireframe can break everything. And to make a wireframe perfect, you need a wireframing tool to solve your design purpose.  […]

The post Most Popular Wireframe tools Small Business Should Consider in 2022 appeared first on Usability Geek





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The Cassette-Inspired FiiO KA15 DAC Is Small Enough To Fit on Your Keys

Audiophiles have a new DAC for on-the-go use, in the form of the new cassette-inspired Fiio KA15 – which is small enough to be a keyring.





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Exposé Reveals Ongoing Smartphone Location Tracking Threats

404 Media, KrebsOnSecurity, and other outlets are covering the exposure of Locate X, a tool that grants extensive access to smartphone location data. In the absence of strong legislation, Apple and Google need to do more to protect users.

Read original article




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Smaller Mac mini Powered by M4 and M4 Pro Chips

Apple’s new Mac mini models pack more power than ever into a case that has a smaller footprint but a taller profile than previous versions. The M4 Pro Mac mini also introduces the first Thunderbolt 5 ports in the Mac world.




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Spin 3.0 – open-source tooling for building and running WASM apps

Comments




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EMEET SmartCam S800 Review

I’ve used plenty of webcams, mostly for work meetings and catching up with family. They usually get the job done, but finding one that really stands out is rare. That’s when I got my hands on the EMEET SmartCam S800-or as they call it, a “SmartCam.” I was given a unit to test, and while…

The post EMEET SmartCam S800 Review appeared first on Hongkiat.




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20 Accessories to Enhance Your Smartphone Experience

Looking to get the most out of your smartphone this year? From portable chargers and sleek stabilizers to smart locks and mini projectors, there’s a whole world of accessories designed to enhance your mobile experience. Whether you’re after better battery life, more creative photography options, or just want to keep your device running smoothly, these…

The post 20 Accessories to Enhance Your Smartphone Experience appeared first on Hongkiat.












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TSMC Halts Advanced Chip Shipments To Chinese AI Companies

Starting November 11, TSMC plans to stop supplying 7 nm and smaller chips to Chinese companies working on AI processors and GPUs. "The move is reportedly to ensure it remains compliant with US export restrictions," reports The Register. From the report: This will not affect Chinese customers wanting 7 nm chips from TSMC for other applications such as mobile and communications, according to Nikkei, which said the overall impact on the chipmaker's revenue is likely to be minimal. TrendForce further cites another China-based source who claims the move was at the behest of the US Department of Commerce, which informed TSMC that any such shipments should not proceed unless approved and licensed by its BIS (Bureau of Industry and Security). We asked the agency for confirmation. Any moves by the silicon supremo is likely to be out of caution to pre-empt accusations from Washington that it isn't doing enough to prevent advanced technology from getting into the hands of Chinese entities that have been sanctioned. As TrendForce notes, it "highlights the foundry giant's delicate position in the global semiconductor supply chain amid the heating chip war between the world's two superpowers."

Read more of this story at Slashdot.