A method and apparatus that controls the clock of a digital circuit, and therefore power consumption, without substantially comprising performance is provided. The apparatus may include monitoring the utilization of a First in First Out (FIFO) buffer. For example in a systems and methods according to the invention, clock speed may be reduced when the FIFO is relatively empty and increased when the FIFO is relatively full. The clock speed may be controlled by a phase locked loop, a clock divider, a clock masking device or a combination of more than one of these methods. Power reduction may also be obtained by controlling the clocking of different stages of a pipelined device. One or more aspects of the inventions may be implemented in combination with other aspects of the invention to further reduce power use.

Embodiments described herein provide approaches for improving a standard cell connection for circuit routing. Specifically, provided is an IC device having a plurality of cells, a first metal layer (M1) pin coupled to a contact bar extending from a first cell of the plurality of cells, and a second metal layer (M2) wire coupled to the contact bar, wherein the contact bar extends across at least one power rail. By extending the contact bar into an open area between the plurality of cells to couple the M1 pin and the M2 wire, routing efficiency and chip scaling are improved.

The present invention relates to a method for downloading a binary configuration file in a programmable circuit implemented in a device. The device comprises at least one central processing unit, a plurality of connectors, and a programmable circuit enabling all or a part of the signals received by said connectors to be processed and transmitted to at least one other circuit of the device. The device analyzes the signals present on the connectors in order to define what other devices are connected and whether the connections are operational. Then, a configuration file is selected from among a set of configuration files according to the operational connections and is downloaded from a memory of the device into the programmable circuit. The invention also relates to a device having a component programmed according to the method previously described.

A method for configuring the placement of a plurality of storage cells on an integrated circuit includes grouping the plurality of storage cells into a plurality of words, where each of the plurality of words is protected by an error control mechanism. The method also includes placing each of the storage cells on the integrated circuit such that a distance between any two of the storage cells belonging to one of the plurality of words is greater than a minimum distance. The minimum distance is configured such that a probability of any of the plurality of words experiencing multiple radiation induced errors is below a threshold value.

A semiconductor integrated circuit including: a circuit block having an internal voltage line; an annular rail line forming a closed annular line around the circuit block and supplied with one of a power supply voltage and a reference voltage; and a plurality of switch blocks arranged around the circuit block along the annular rail line, the plurality of switch blocks each including a voltage line segment forming a part of the annular rail line and a switch for controlling connection and disconnection between the voltage line segment and the internal voltage line.

According to one embodiment, a first oscillator has an oscillation frequency that is changed depending on a temperature. A second oscillator has different temperature characteristics from the first oscillator. An on-chip heater heats the first oscillator and the second oscillator. A counter counts a first oscillation signal of the first oscillator. An ADPLL generates a third oscillation signal on the basis of a second oscillation signal of the second oscillator and corrects the frequency of the third oscillation signal on the basis of a count value of the counter.

A method in a circuit comprises providing a first clock by a resistor-capacitor (RC) oscillator; demodulating a plurality of input signals to form a plurality of demodulated input signals; discriminating frequency ranges of the plurality of demodulated input signals according to the first clock; determining whether a first predetermined number of consecutive demodulated input signals among the plurality of demodulated input signals fall into a first predetermined frequency range; triggering a crystal oscillator to provide a second clock to calibrate the first clock if the first predetermined number of consecutive input signals fall into the first predetermined frequency range.

The present disclosure relates to nanoresonator oscillators or NEMS (nanoelectromechanical system) oscillators. A circuit for measuring the oscillation frequency of a resonator is provided, comprising a first phase-locked feedback loop locking the frequency of a controlled oscillator at the resonant frequency of the resonator, this first loop comprising a first phase comparator. Furthermore, a second feedback loop is provided which searches for and stores the loop phase shift introduced by the resonator and its amplification circuit when they are locked at resonance by the first loop. The first and the second loops operate during a calibration phase. A third self-oscillation loop is set up during an operation phase. It directly links the output of the controllable phase shifter to the input of the resonator. The phase shifter receives the phase-shift control stored by the second loop.

An integrated circuit (10) has an internal RC-oscillator (20) for providing an internal clock signal (CLI) having an adjustable oscillator frequency. The integrated circuit (10) further comprises terminals (101, 102) for connecting an external LC tank (30) having a resonance frequency and a calibration circuit (40) which is configured to adjust the oscillator frequency based on the resonance frequency of the LC tank (30) connected during operation of the integrated circuit (10). An internal auxiliary oscillator (46) is connected to the terminals (101, 102) in a switchable fashion and is configured to generate an auxiliary clock signal (CLA) based on the resonance frequency. The calibration circuit (40) comprises a frequency comparator (47) which is configured to determine a trimming word (TRW) based on a frequency comparison of the internal clock signal (CLI) and the auxiliary clock signal (CLA). The LC tank (30) to be connected is an antenna for receiving a radio signal.

An oscillator module includes a first MOS transistor and a capacitor. The capacitor is coupled between a gate and source of the first MOS transistor. The drain of the first MOS transistor receives a first bias current and generates an oscillating output signal. A switching circuit operates in response to the oscillating output signal to selective charge and discharge the capacitor. A current sourcing circuit is configured to generate the bias current. The current sourcing circuit includes a second MOS transistor which has an identical layout to the first MOS transistor and receives a second bias current. A resistor is coupled between a gate and source of the second MOS transistor. The current sourcing circuit further includes a current mirror having an input configured to receive a reference current passing through the resistor and generate the first and second bias currents.

The invention relates to a method for operating control equipment (1) of a resonance circuit (2), wherein the control equipment (1) comprises at least two circuit elements (8, 9) connected in series, in particular each comprising a recovery diode (13, 14) connected in parallel, between which a connection (6) of the resonance circuit (2) is connected. According to the invention, the circuit elements (8, 9) are actuated as a function of the voltage detected at the connection (6). The invention further relates to control equipment (1) of a resonance circuit (2).

A ring oscillator circuit causing a pulse signal to circulate around a circle to which an even number of inverting circuits are connected in a ring, wherein one of the inverting circuits is a first starting inverting circuit, which drives a first pulse signal according to a control signal, another of the inverting circuits is a second starting inverting circuit, which drives a second pulse signal based on a leading edge of the first pulse signal, still another is a third starting inverting circuit, which drives a third pulse signal based on the leading edge of the first pulse signal after the second pulse signal is driven, and the first to third starting inverting circuits are arranged within the circle of the inverting circuits in order of the third, second, and first pulse signals in traveling directions of the pulse signals.

A ring-oscillator-based on-chip sensor (OCS) includes a substrate having a semiconductor surface upon which the OCS is formed. The OCS includes an odd number of digital logic stages formed in and on the semiconductor surface including a first stage and a last stage each including at least one NOR gate including a first gate stack and/or a NAND gate including a second gate stack. A feedback connection is from an output of the last stage to an input of the first stage. At least one discharge path including at least a first p-channel metal-oxide semiconductor (PMOS) device is coupled between the first gate stack and a ground pad, and/or at least one charge path including at least a first n-channel metal-oxide semiconductor (NMOS) device is coupled between the second gate stack a power supply pad.

An electronic oscillator circuit has a first oscillator, for supplying a first oscillation signal, a second oscillator, for supplying a second oscillation signal, a first controller for delivering the first control signal as a function of a phase difference between a first controller input and a second controller input of the first controller; a second controller for delivering the second control signal as a function of a phase difference between a first controller input of the second controller and a second controller input of the second controller; a resonator; at least a second resonance frequency, with a first phase shift dependent on the difference between the frequency of a second exciting signal and the second resonance frequency and processing means, for receiving the first oscillator signal and the second oscillator signal, determining their mutual proportion, looking up a frequency compensation factor in a prestored table and outputting a compensated oscillation signal.

A circuit includes first and second transconductance stages that generate first and second currents, respectively, in response to an input signal. A current combiner circuit selectively couples the first current to a first output, selectively couples the second current to the first output, selectively couples the first current to a second output, and selectively couples the second current to the second output. In response to the first current being coupled to both the first and second outputs, the current combiner circuit couples the second current to both the first and second outputs. In response to the first current being decoupled from the second output, the current combiner circuit decouples the second current from both the first and second outputs. In response to the first current being decoupled from the first output, the current combiner circuit decouples the second current from both the first and second outputs.

An embodiment is an integrated circuit structure including a first die attached to a second die by a first connector. The first connector includes a solder joint portion between a first nickel-containing layer and a second nickel-containing layer, a first copper-containing layer between the first nickel-containing layer and the solder joint portion, and a second copper-containing layer between the second nickel-containing layer and the solder joint portion.

In manufacturing an LSI, or semiconductor integrated circuit device, the step of assembling device (such as resin sealing step) is normally followed by a voltage-application test in an environment of high temperature (e.g., from 85 to 130° C.) and high humidity (e.g., about 80% RH). It has been found that separation of a titanium nitride anti-reflection film from an upper film and generation of cracks in the titanium nitride film at an upper surface edge part of the aluminum-based bonding pad applied with a positive voltage in the test is caused by an electrochemical reaction due to moisture incoming through the sealing resin and the like to generate oxidation and bulging of the titanium nitride film. These problems are addressed by removing the titanium nitride film over the pad in a ring or slit shape at peripheral area of the aluminum-based bonding pad.

In a semiconductor device, where, with respect to a parasitic resistor in a current mirror circuit, a compensation resistor for compensating the parasitic resistor is provided in the current mirror circuit, the current mirror circuit includes at least two thin film transistors. The thin film transistors each have an island-shaped semiconductor film having a channel formation region and source or drain regions, a gate insulating film, a gate electrode, and source or drain electrodes, and the compensation resistor compensates the parasitic resistor of any one of the gate electrode, the source electrode, and the drain electrode. In addition, each compensation resistor has a conductive layer containing the same material as the gate electrode, the source or drain electrodes, or the source or drain regions.

A resistance having a high impedance is connected between anode terminals of two variable capacitance diodes sharing a cathode, and the components described above are sealed in one package. The resistance can be formed of a diffusion region between p-regions of the variable capacitance diodes or can be formed of polysilicon and disposed on a chip. Thus, the resistance can be mounted while a chip size of the variable capacitance diode is maintained. Accordingly, it is not required that a bias resistance having a high impedance is additionally provided, whereby achieving reduction in the substrate mounting area and reduction in costs of the set.

The present invention provides an apparatus for enhancing Q factor of an inductor. The apparatus includes a negative resistance generator coupled to the inductor for providing a negative resistance, and a bias circuit coupled to the negative resistance generator for biasing the negative resistance generator.

The invention provides a variable tuning circuit capable of extending a variable range in a high frequency band, ensuring the value of L of an inductor to increase the value of Q of a circuit in a low frequency band, and preventing a reduction in gain, an increase in noise, and unstable oscillation. A variable tuning circuit includes: a first parallel resonance circuit that includes a varactor diode, a capacitor connected in series to the varactor diode, and a first inductor connected in parallel to the varactor diode and the capacitor; and a second parallel resonance circuit that includes a second inductor connected in parallel to the varactor diode with a direct current cut-off capacitor interposed therebetween. When the varactor diode has a maximum capacitance, a resonant frequency of the second parallel resonance circuit is set about a lowest frequency in a variable frequency range.

In a double-tuning circuit including a primary tuning circuit having a first inductor and a first variable capacitive element connected in parallel and a secondary tuning circuit having a second inductor and a second variable capacitive element connected in parallel, a fixed part of a copper-foil pattern is connected to a connection point at which the double-tuning circuit is connected to an input terminal of a frequency mixing circuit, and a tip part of the copper-foil pattern extends to near the first inductor, whereby a trap circuit for attenuating an image frequency component is formed. A pattern is formed between a ground-side terminal of the first inductor and the ground, and a capacitor is connected between a connection point at which the first inductor is connected to one terminal of the pattern and a ground-side terminal of the second variable capacitive element.

A tuner and a transformer formed by printed circuit board thereof are provided. The transformer includes a first winding and a second winding. In which, the first winding forms a first inductor and the second winding forms a second inductor. The transformer is formed by the first and the second inductors, wherein the first winding and the second winding are formed by conducting wires of a printed circuit board.

A method applied in a tuning circuit comprising a plurality of turning cells is disclosed. the method comprises: laying out a array of tuning cells in a matrix configuration, the matrix comprising a first dimension and a second dimension; assigning a first index associated with the first dimension and a second index associated with the second dimension to each tuning cell; controlling each tuning cell using a word line and a bit line; and summing up outputs from all tuning cells to form a combined output. The tuning cell provides a first circuit value or a second circuit value according to the logical value of the bit line, and the difference between the first circuit value and the second circuit value is determined such that a turning resolution of the tuning circuit is determined.

The tuner circuit comprises a HF input and a HF output with a loop through function, wherein a variable capacitance diode is coupled with a first terminal to the HF input and with a second terminal to the HF output for providing a passive loop through function. The variable capacitance diode is in particular in a passing mode, when no DC reverse voltage is applied, for providing a passive loop through function. In a preferred embodiment, the tuner circuit is designed for reception of television channels, and for the variable capacitance diode one or two tuning variable capacitance diode is used being designed for satellite tuners with a frequency range of 1-2 GHz, or a specially designed variable capacitance diode with a capacitance ratio C1/C25>18 at a frequency of 1 MHz for DC reverse voltages of 1 and 25 Volts is used.

A circuit (C1-C4) is employed in a TWACS transponder (T) installed in an electric meter (M). The transponder generates inbound signals (IB) transmitted from the location of the electric meter to a central location (R). Firmware (F) within the transponder controls the flow of current for each pulse through the circuit by triggering a semi-conductor device such as a SCR (X1) or TRIAC (X2). The resulting current flow through the inductor for a subsequent pulse, regardless of the pulse's polarity, will be in the opposite direction to that of the previous pulse. The result is to maintain a constant level of magnetization of the inductor core which does not have to be overcome by energy in the subsequent pulse resulting in amplitude of all the pulses imposed on an AC waveform being substantially the same.

A semiconductor trimming circuit includes parallel coupled PMOS devices coupled in parallel with parallel coupled NMOS devices and an additional pair of dummy NMOS devices. The dummy NMOS devices are coupled in parallel with the NMOS devices. A trimming circuit for an internal clock source may be formed with an array of such switches for selecting one or more trimming capacitors of the trimming circuit. Such an array has a low leakage current and permits good trimming linearity.

A method and apparatus for use in a digitally tuning a capacitor in an integrated circuit device is described. A Digitally Tuned Capacitor DTC is described which facilitates digitally controlling capacitance applied between a first and second terminal. In some embodiments, the first terminal comprises an RF+ terminal and the second terminal comprises an RF− terminal. In accordance with some embodiments, the DTCs comprise a plurality of sub-circuits ordered in significance from least significant bit (LSB) to most significant bit (MSB) sub-circuits, wherein the plurality of significant bit sub-circuits are coupled together in parallel, and wherein each sub-circuit has a first node coupled to the first RF terminal, and a second node coupled to the second RF terminal. The DTCs further include an input means for receiving a digital control word, wherein the digital control word comprises bits that are similarly ordered in significance from an LSB to an MSB.

A booster circuit is configured, such that: in response to a reading request for reading data from a flash memory, when a voltage of an output terminal detected by a voltage detection circuit is not higher than a voltage, an oscillator outputs a control clock signal of predetermined on time and off time to a transistor of a boost converter to perform switching control of the transistor; and when the voltage detection circuit detects that the voltage of the output terminal reaches a voltage, an oscillator outputs a control clock signal of an on time and an off time input from a selection circuit to a transistor of a boost converter to perform switching control of the transistor.

A quantum information processing system includes a waveguide having an aperture, a non-linear quantum circuit disposed in the waveguide and an electromagnetic control signal source coupled to the aperture.

To reduce power supply noises occurring in a control circuit unit for controlling an output buffer. A semiconductor device includes unit buffers for driving a data output terminal, impedance control circuits for controlling the unit buffers, and a control circuit unit for controlling the impedance control circuits. The impedance control circuits and the control circuit unit operate by mutually-different power supplies, the control circuit unit supplies pull-up data and pull-down data in mutually reverse phase to the impedance control circuits, and the impedance control circuits convert the pull-up data and the pull-down data from reverse phase to in-phase and supply the same to the unit buffers. Thereby, a noise is difficult to occur in a power supply VDD used for the control circuit unit.

A sequence circuit includes first through third signal terminals, first through ninth resistors, and first through fifth electronic switches. The sequence circuit receives a first signal through the first signal terminal. The sequence circuit receives a second signal through the second signal terminal. The sequence circuit outputs a third signal through the third signal terminal. The sequence circuit is used to ensure the sequence of the first through third signals.

A receiver circuit includes a first amplification unit, a second amplification unit, a first equalizing unit, and a second equalizing unit. The first amplification unit is configured to differentially amplify an input signal and a reference signal and generate a first intermediate output signal and a second intermediate output signal. The second amplification unit is configured to differentially amplify the first and second intermediate output signals and generate an output signal. The first equalizing unit is configured to control the level of the second intermediate output signal in response to the output signal. And the second equalizing unit is configured to control the level of the first intermediate output signal in response to the output signal.

Flip-flops in a monolithic three-dimensional (3D) integrated circuit (IC)(3DIC) and related method are disclosed. In one embodiment, a single clock source is provided for the 3DIC and distributed to elements within the 3DIC. Delay is provided to clock paths by selectively controllable flip-flops to help provide synchronous operation. In certain embodiments, 3D flip-flop are provided that include a master latch disposed in a first tier of a 3DIC. The master latch is configured to receive a flip-flop input and a clock input, the master latch configured to provide a master latch output. The 3D flip-flop also includes at least one slave latch disposed in at least one additional tier of the 3DIC, the at least one slave latch configured to provide a 3DIC flip-flop output. The 3D flip-flop also includes at least one monolithic intertier via (MIV) coupling the master latch output to an input of the slave latch.

A storage cell having a pulse generator and a storage element is proposed. The storage element input is connected to receive a data input signal. The storage element output is connected to provide a data output signal. The storage element is operable in one of a data retention state and a data transfer state in response to a storage control signal received from the pulse generator. The pulse generator is connected to receive a clock signal with rising and falling clock signal edges and is adapted to provide control pulses in the storage control signal. Each control pulse has a leading edge and a trailing edge. The control pulses have a polarity suited to invoke the data transfer state on their leading edges. The novel feature is that the pulse generator is adapted to initiate a rising-edge control pulse when receiving a rising clock signal edge and to initiate a falling-edge control pulse when receiving a falling clock signal edge. In this way, a dual-edge-triggered flip-flop may be made using only combinatorial logic circuitry and one level- or single-edge-triggered storage element. The storage cell has low power consumption, facilitates scan testing and can be used by existing design tools and test equipment.

A circuit includes a power supply terminal and a clock parsing circuit configured to produce multiple clock signals having a common clock period and different phases. The circuit further includes a plurality of digital circuits coupled to the clock parsing circuit and the power supply terminal. Each digital circuit includes an input to receive data and logic to process the data. Each digital circuit is responsive to a phase associated with a respective clock signal of the multiple clock signals to draw current from the regulated power supply terminal to process the data to produce a data output. Additionally, the circuit includes an output timing management circuit coupled to each of the plurality of digital circuits and configured to control data outputs of each of plurality of digital circuits to prevent timing violations at one or more destination circuits.

Two gate drivers each comprising a shift register and a demultiplexer including single conductivity type transistors are provided on left and right sides of a pixel portion. Gate lines are alternately connected to the left-side and right-side gate drivers in every M rows. The shift register includes k first unit circuits connected in cascade. The demultiplexer includes k second unit circuits to each of which a signal is input from the first unit circuit and to each of which M gate lines are connected. The second unit circuit selects one or more wirings which output an input signal from the first unit circuit among M gate lines, and outputs the signal from the first unit circuit to the selected wiring(s). Since gate signals can be output from an output of a one-stage shift register to the M gate lines, the width of the shift register can be narrowed.

A noise resistant switch control circuit is provided. The circuit includes a low pass filter configured to couple to a first terminal of a switch and a first voltage clamp coupled to the low pass filter. The first voltage clamp is configured to couple to a control terminal of the switch and limit a voltage of the control terminal relative to the first terminal to within a first clamping range. The circuit includes a second voltage clamp coupled to an input terminal of the switch control circuit. The second voltage clamp is configured to couple to the control terminal of the switch. The second voltage clamp is further configured to reduce a level of a control voltage coupled to the second voltage clamp. The circuit includes a bias device configured to couple to the control terminal of the switch and to impress a biasing voltage to the control terminal.

A semiconductor device prevents recognition failure in mutual recognition between a host and a device compliant with USB Specifications. The semiconductor device includes: an interterminal opening/closing section having a plurality of first conductivity type MOS transistors, the respective sources or drains of which are cascaded, in which the source or drain of a first-stage MOS transistor among the cascaded MOS transistors is used as a first terminal, the source or drain of a final-stage MOS transistor among the cascaded MOS transistors is used as a second terminal, and the respective gates of the cascaded MOS transistors receive a control signal for controlling the opening or short-circuiting between the first and second terminals; and a current bypass section that reduces a current flowing into either one connection node coupling the respective sources or drains of the cascaded MOS transistors.

An electrical short circuit protection device for an electric trailer brake controller includes a fuse connected between the controller and the trailer brakes and an acoustic piezoelectric transducer connected across the fuse. Upon a short circuit fault developing in the trailer brakes, the fuse opens and the transducer generates an audio warning signal.

A receiving circuit, use, and method for receiving an encoded and modulated radio signal is provided. The circuit comprise a demodulator and a digital filter connected downstream of the demodulator for moving averaging. The filter has at least two FIFO registers and subtractors. Whereby for subtracting an output value of the FIFO register from an input value of the FIFO register a subtractor is connected to each FIFO register. Wherein the filter has a weighting unit, which is connected downstream of each FIFO register, and wherein the filter has an integrator, which is connected downstream of the subtractors for integration.

In a data recovery circuit, a sampling circuit is configured to sample data using a plurality of sampling clock signals having different phases relative to one another and to output a plurality of sampled data. A recovery data generation circuit is configured to perform a logic operation on the plurality of sampled data and to generate a plurality of intermediate recovery data according to a result of the logic operation. A recovery circuit is configured to check the plurality of intermediate recovery data for existence of an error and to output intermediate recovery data that is error-free, among the plurality of intermediate recovery data, as recovery data.

In this VSWR measurement circuit, a power measurement unit measures the power level of a reflected signal which is included in a feedback signal which has been extracted at a second CPL which has been deployed at a position connecting to an antenna end via a cable. To this end, the VSWR measurement circuit is provided with a main signal component removal circuit, wherein the main signal which has been extracted from the prestage of a digital pre-distortion circuit, and a signal in which the feedback signal that had been extracted at the second CPL has been converted to a digital signal at an A/D CONV, are provided as inputs, the main signal component included in the feedback signal is removed, and only the reflected signal is extracted so as to be output to the power measurement unit.

A 5-wire touch screen system includes a touch screen (10) including a wiper (11) and a resistive layer (16) aligned with the wiper and first (UL), second (UR), third (LR), and fourth (LL) resistive layer contacts, wherein a touch on the screen presses a small portion of the wiper against the resistive layer, producing a touch resistance (RZ) between them at a touch point on the resistive layer. The wiper and various contacts are selectively coupled to first (VDD) and second (GND) reference voltages, respectively, to generate an analog touch voltage (VZ) at the touch point. The wiper and various contacts are selectively coupled to an analog input (56) and a reference voltage input of an ADC (48) for converting the touch voltage (VZ) to a digital representation. Analog voltages (VX) and (VY) at the touch point are converted to corresponding digital representations by the ADC.

In a pulse output circuit in a shift register, a power source line which is connected to a transistor in an output portion connected to a pulse output circuit at the next stage is set to a low-potential drive voltage, and a power source line which is connected to a transistor in an output portion connected to a scan signal line is set to a variable potential drive voltage. The variable potential drive voltage is the low-potential drive voltage in a normal mode, and can be either a high-potential drive voltage or the low-potential drive voltage in a bath mode. In the batch mode, display scan signals can be output to a plurality of scan signal lines at the same timing in a batch.

A pixel circuit able to prevent a spread of the terminal voltages of drive transistors inside a panel and in turn able to reliably prevent deterioration of uniformity, wherein a source of a TFT serving as a drive transistor is connected to an anode of a light emitting element, a drain is connected to a power source potential, a capacitor is connected between a gate and source of the TFT, and a source potential of the TFT is connected to a fixed potential through a TFT serving as a switch transistor and wherein pixel circuit lines are connected by an upper line and bottom line and are arranged in parallel with pixel circuit power source voltage lines so as not to have intersecting parts.

Embodiments of the present disclosure are directed towards a circuit board having integrated passive devices such as inductors, capacitors, resistors and associated techniques and configurations. In one embodiment, an apparatus includes a circuit board having a first surface and a second surface opposite to the first surface and a passive device integral to the circuit board, the passive device having an input terminal configured to couple with electrical power of a die, an output terminal electrically coupled with the input terminal, and electrical routing features disposed between the first surface and the second surface of the circuit board and coupled with the input terminal and the output terminal to route the electrical power between the input terminal and the output terminal, wherein the input terminal includes a surface configured to receive a solder ball connection of a package assembly including the die. Other embodiments may be described and/or claimed.

A circuit card is provided that includes ground traces that extend from a resistor to a commoning bar, where a resultant electrical length between the resistor and the commoning bar and is configured to reduce energy carried on the ground terminals that could otherwise result in cross-talk. In an embodiment, the ground trace may be configured in a meandering manner. In another embodiment, the ground trace may be split and joined by an inductor.

A SAW filter circuit having improved ESD resistance is specified, in which a series interconnection composed of SAW resonators is interconnected between a first signal port and a dual-mode SAW filter port. The static capacitance of the series interconnection is at most four times the static capacitance of the dual-mode SAW filter transducers interconnected therewith.

An attenuation reduction control structure for high-frequency signal transmission lines of a flexible circuit board includes an impedance control layer formed on a surface of a substrate. The impedance control layer includes an attenuation reduction pattern that is arranged in an extension direction of the high-frequency signal transmission lines of the substrate and corresponds to bottom angle structures of the high-frequency signal transmission lines in order to improve attenuation of a high-frequency signal transmitted through the high-frequency signal transmission lines. An opposite surface of the substrate includes a conductive shielding layer formed thereon. The conductive shielding layer is formed with an attenuation reduction pattern corresponding to top angle structures of the high-frequency signal transmission lines.