In a letter to the Mayor, BJP leader Sanjay Waghule alleged that there was no transparency in the civic body's COVID-19 relief activities.

The baggage undergoes a 180-degree vertical orientation change between 2 separate UV chambers which help in ensuring uniform radiation exposure all throughout the surface.

The government had last week permitted the companies to restore their manufacturing operations in red, green and organ zones with certain riders.

Asia's factory activity was ravaged in April, business surveys showed Monday, and the outlook dimmed further as government restrictions on movement to contain the coronavirus outbreak froze global production and slashed demand.

A massive sandstorm swept over the capital of Niger, Niamey, on Monday.

While Devika Bhise had earlier delighted fans by sharing a few snaps from the wedding day and pre-wedding functions on Instagram, designer Anita Dongre took to Instagram this morning to give them...

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RBI extends window for External Commercial Borrowings (ECB) for Civil Aviation Sector

RBI permits Foreign investors and non-residents Indians to buy shares or debentures of Indian companies

Reserve Bank of India has appointed Three New Executive Directors

Indian Govt to inject 69.90 billion rupees ($1.13 billion) in Nine Public sector Banks

RBI revises Priority Sector Lending Guidelines for Banks

Govt starts selection of non-executive chairmen for public sector banks

Major Indian Public Sector Banks report decline in the profits

Hiring in banking sector is expected to go up to 25% this year

Craig Wright Says He Is Bitcoin Payment System's Creator. Watch his interview

US Senators lined up to meet PM Modi and gave him standing Ovation. Video- Speech to US Congress

Banknet Group will publish stories of achievers, entrepreneurs from BFSI, IT

Vesper, the maker of piezoelectric sensors used in microphone production and winner of CES Innovation Award 2018 raised a $23M Series B round. American Family Ventures led the investment with participation from Accomplice, Amazon Alexa Fund, Baidu, Bose Ventures, Hyperplane, Sands Capital, Shure, Synaptics, ZZ Capital and some undisclosed investors.

Vesper’s innovative sensors can be used in consumer electronics like TV remote controls, smart speakers, smartphones, intelligent sensor nodes, and hearables. The company will use the funding proceeds to scale-up its functions like mass production of its microphones and support expanded research and development, hiring, and establishing international sales offices.

The main product of Vesper is VM1000, a low noise, high range,single-ended analog output piezoelectric MEMS microphone. It consists of a piezoelectric sensor and circuitry to buffer and amplify the output.

The hot-selling product of Vesper is VM1010 with ZeroPower Listening which is the first MEMS microphone that enables voice activation to battery-powered consumer devices.

The unique selling point of Vesper’s products is they are built to operate in rugged environments that have dust and moisture.

"Vesper's ZeroPower Listening capabilities coupled with its ability to withstand water, dust, oil, and particulate contaminants enables users that have never before been possible," said Katelyn Johnson, principal of American Family Ventures. "We are excited about Vesper's quest to transform our connected world, including IoT devices."

Other recent funding news include $24 raised by sensor-based baby sock maker Owlet, IFTTT banks $24M from Salesforce to scale its IoT Enterprise offering, and Intel sells its Wind River Software to TPG.

Smart baby monitor company Nanit raised a $14M Series B round led by Jerusalem Venture Partners (JVP). Other investors that participated include existing investors Upfront Ventures, RRE Ventures, Vulcan Capital and Vaal Investment Partners. The latest investment brings total equity funding of Nanit to $30M.

Nanit announced it will use the funding proceeds to expand its team of computer vision and machine learning engineers and grow its sales in Europe and Canada.

Nanit’s baby monitor helps new parents oversee nursery conditions as it has built-in temperature and humidity sensors. The camera lets parents remotely monitor baby’s crib whereas sound and motion are detected via smart sensors.

The monitor’s insights can be accessed via an accompanying mobile app. Nanit charges $10 per month for its premium package.

The key use cases of Nanit’s baby monitoring technology include sleep insights, behavioral analysis, expert guidance, and nightly video summaries. The company currently sells its smart monitors via its website.

The president’s comments, coming just hours after advisers said the agreement was on track, indicate an increasingly unstable relationship.

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Mohar Singh was once one of the most feared men in the Chambal region

A notorious bandit who spent years rampaging across central India’s impoverished badlands before trying his luck as a Bollywood actor and politician has died aged 92, police have said.

Mohar Singh, once one of the most feared men in the Chambal region accused of hundreds of murders, kidnappings and other crimes, died on Tuesday, a senior police official in Bhind district told AFP.

Related: Masked assassins kill Bandit Queen

Decades after Bhopal, lack of law enforcement and political will plagues Indian industry

The gas leak at a chemical factory in Visakhapatnam will immediately remind many in India and beyond of the 1984 Bhopal disaster, widely considered the world’s worst industrial disaster.

So far, the scale of the tragedies are very different. Eleven people are confirmed to have died in Visakhapatnam – but with hundreds hospitalised and thousands affected, there are fears the toll will rise. In Bhopal, 4,000 people died within days of the toxic gas leak from a pesticide plant in the central Indian city, and thousands more in the following years.

Gas from LG Polymers plant in Andhra Pradesh leaked into nearby homes while families slept

• Analysis: 36 years after Bhopal, another case of history repeating

At least 11 people have been killed and hundreds more taken to hospital after a gas leak at a chemical factory in south-east India.

A plastics plant owned by South Korea’s LG Corp started leaking styrene into the surrounding residential area at about 3am on Thursday. Some people were enveloped as they slept, while others collapsed in the streets as they tried to flee the area on the outskirts of the coastal city of Visakhapatnam.

Related: 'Bhopal’s tragedy has not stopped': the urban disaster still claiming lives 35 years on

Ohio State will pay about $41 million to settle a dozen lawsuits by 162 men alleging decades-old sexual abuse and mistreatment by a team doctor, Richard Strauss.

From 2000 to 2001, Jordan was a part-owner of the Capitals. We recount those days with help from the folks who lived it.

He amassed a vast trove of art and artifacts and built a castle-like repository so the public could see it, partly because his family wasn’t happy with his collecting.

As a leading venture capitalist in the electronics technology, as well as CEO of Cadence, Lip-Bu Tan has unique insights into ongoing changes that will impact EDA providers and users. Tan shared some of those insights in a “fireside chat” with Ed Sperling, editor in chief of Semiconductor Engineering, at the Design Automation Conference (DAC 2015) on June 9.

Topics of this discussion included industry consolidation, the need for more talent and more startups, Internet of Things (IoT) opportunities and challenges, the shift from ICs to full product development, and the challenges of advanced nodes. Following are some excerpts from this conversation, held at the DAC Pavilion theater on the exhibit floor.

Ed Sperling (left) and Lip-Bu Tan (right) discuss trends in semiconductors and EDA

Q: As you look out over the semiconductor and EDA industries these days, what worries you most?

Tan: At the top of my list is all the consolidation that is going on. Secondly, chip design complexity is increasing substantially. Time-to-market pressure is growing and advanced nodes have challenges.

The other thing I worry about is that we need to have more startups. There’s a lot of innovation that needs to happen. And this industry needs more top talent. At Cadence, we have a program to recruit over 10% of new hires every year from college graduates. We need new blood and new ideas.

Q: EDA vendors were acquiring companies for many years, but now the startups are pretty much gone. Where does the next wave of innovation come from?

Tan: I’ve been an EDA CEO for the last seven years and I really enjoy it because so much innovation is needed. System providers have very big challenges and very different needs. You have to find the opportunities and go out and provide the solutions.

The opportunities are not just in basic tools. Massive parallelism is critical, and the power challenge is huge. Time to market is critical, and for the IoT companies, cost is going to be critical. If you want to take on some good engineering challenges, this is the most exciting time.

Q: You live two lives—you’re a CEO but you’re also an investor. Where are the investments going these days and where are we likely to see new startups?

Tan: Clearly everybody is chasing the IoT. There is a lot of opportunity in the cloud, in the data center. Also, I’m a big believer in video, so I back companies that are video related. A big area is automotive. ADAS [Advanced Driver Assistance Systems] is a tremendous opportunity.

These companies can help us understand how the industry is transforming, and then we can provide solutions, either in terms of IP, tools, or the PCB. Then we need to connect from the system level down to semiconductors. I think it’s a different way to design.

Q: What happens as we start moving from companies looking to design a semiconductor to system companies who are doing things from the perspective that we have this purpose for our software?

Tan: We are extending from EDA to what we call system design enablement, and we are becoming more application driven. The application at the system level will drive the silicon design. We need to help companies look at the whole system including the power envelope and signal integrity. You don’t want to be in a position where you design a chip all the way to fabrication and then find the power is too high.

We help the customers with hardware/software co-design and co-verification. We have a design suite and a verification suite that can provide customers with high-level abstractions, as well as verify IP blocks at the system level. Then we can break things down to the component level with system constraints in mind, and drive power-aware, system-aware design.

We are starting to move into vertical markets. For example, medical is a tremendous opportunity.

Q: How does this approach change what you provide to customers?

Tan: Every year I spend time meeting with customers. I think it is very important to understand what they are trying to design, and it is also important to know the customer’s customer requirements. We might say, “Wait a minute, for this design you may want to think about power or the library you’re using.” We help them understand what foundry they should use and what process they should use. They don’t view me as a vendor—they view me as a partner.

We also work very closely with our IP and foundry partners. We work as one team—the ultimate goal is customer success.

Q: Is everybody going to say, FinFETs are beautiful, we’re going to go down to 10nm or 7nm—or is it a smaller number of companies who will continue down that path?

Tan: Some of the analog/mixed-signal companies don’t need to go that far. We love those customers—we have close to 50% of that business. But we also have customers in the graphics or processor area who are really pushing the envelope, and need to be in 16nm, 14nm, or 10nm. We work very closely with those guys to make sure they can go into FinFETs.

We always want to work with the customer to make sure they have a first-time silicon success. If you have to do a re-spin, you miss the opportunity and it’s very costly.

Q: There’s a new market that is starting to explode—IoT. How real is that world to you? Everyone talks about large numbers, but is it showing up in terms of tools?

Tan: Everybody is talking about huge profits, but a lot of the time I think it is just connecting old devices that you have. Billions of units, absolutely yes, but if you look close enough the silicon percentage of that revenue is very tiny. A lot of the profit is on the service side. So you really need to look at the service killer app you are trying to provide.

What’s most important to us in the IoT market is the IP business. That’s why we bought Tensilica—it’s programmable, so you can find the killer app more quickly. The other challenges are time to market, low power, and low cost.

Q: Where is system design enablement going? Does it expand outside the traditional market for EDA?

Tan: It’s not just about tools. IP is now 11% of our revenue. At the PCB level, we acquired a company called Sigrity, and through that we are able to drive system analysis for power, signal integrity, and thermal. And then we look at some of the verticals and provide modeling all the way from the system level to the component level. We make sure that we provide a solution to the end customer, rather than something piecemeal.

Q: What do you think DAC will look like in five years?

Tan: It’s getting smaller. We need to see more startups and innovative IP solutions. I saw a few here this year, and that’s good. We need to encourage small startups.

Q: Where do we get the people to pull this off? I don’t see too many people coming into EDA.

Tan: I talk to a lot of university students, and I tell them that this small industry is a gold mine. A lot of innovation is needed. We need them to come in [to EDA] rather than join Google or Facebook. Those are great companies, but there is a lot of fundamental physical innovation we need.

Richard Goering

Related Blog Posts

- Gary Smith at DAC 2015: How EDA Can Expand Into New Directions

- DAC 2015: Google Smart Contact Lens Project Stretches Limits of IC Design

- Q&A with Nimish Modi: Going Beyond Traditional EDA

Are they basically the same thing? I am trying to get as much experience with Allegro since a lot of jobs I am looking at right now are asking for Cadence Allegro experience (I wish they asked for Altium experience...). I currently have access to PCB Editor, but I don't want to commit to learning Editor if Allegro is completely different. Also walmart one, are the Cadence Allegro courses worth it? I won't be paying for it and if it's worth it, I figure I might as well use the opportunity to say I know how to use two complex CAD tools.

It's been a while since you've heard from me...it has been a busy year for sure. One of the reasons I've been so quiet is that I was part of a team working diligently on our latest best kept secret: The MMSIM 12.1.1/MMSIM 13.1 Documentation has...(read more)

Hi Folks, A question that I've often received from designers, "Is there a method to determine the amount of memory required before I submit a job? I use distributed processing and need to provide an estimate before submitting jobs." The answer...(read more)

Hi Folks, Check out this great new video on YouTube: CDNLive SV 2014: PMC Improves Visibility and Performance with Spectre APS In this video from CDNLive Silicon Valley 2014, Jurgen Hissen, principal engineer, MSCAD, at PMC, discusses an aggressive...(read more)

Hello Spectre Users, Simulating S-parameters in a time domain (transient, periodic steady state) simulator has been and continues to be a challenge for many analog and RF designers. I'm often asked: What is required in order to achieve accurate...(read more)

Hi All, If you were unable to attend IMS 2017 in June 2017, the IMS MicroApp “7 Habits of Highly Successful S-Parameters” is on our Cadence website. On Cadence Online Support , the in-depth AppNote is here: 20466646 . Best regards, Tawna...(read more)

The other day, I happened to sneak out some time for myself after having sent the kids to play in the neighborhood park. I made myself a hot cup of coffee and settled on the couch hoping to enjoy the silence in the house. But was it really ...(read more)

Hi,

I am running simulation in ADEXL and need a custom function for VIVA to apply same procedure to all signals saved in output. For instance, I have clock nets and I want to get all of them and look at the duty-cycle, edge rate etc.

It is a little more involved than about part since I have some regex and setof to filter before processing but if I can get all signals for current history, I can postprocess them later.

In ocean, I am just doing outputs() and getting all saved signals but I was able to do this in VIVA calculator due to the difficulties in getting current history, test name and opening result directory

thanks

yayla

Version Info:

ICADV12.3 64b 500.21

spectre -W =>

Tool 'cadenceMMSIM' Current project version '16.10.479'
sub-version  16.1.0.479.isr9

I recently attended a webinar presented by Wally Rhines about his new book, Predicting Semiconductor Business Trends After Moore's Law . Wally was the CEO of Mentor, as you probably know. Now he...

[[ Click on the title to access the full blog on the Cadence Community site. ]]

Everyone keeps talking about “the cloud” this and “the cloud” that these days—but you’re a semiconductor designer. Everyone keeps saying “the cloud” is revolutionizing all aspects of electronics design—but what does it mean for you? Cadence's own Tom Hackett discussed this in a presentation at the Cadence Theater during DAC 2019.

What people refer to as “the cloud” is commonly divided into three categories: Infrastructure as a Service (IaaS), Platform as a Service (PaaS), and software as a Service (SaaS). With IaaS, you bring your own software—i.e. loading your owned or appropriately licensed tools onto cloud hardware that you rent by the minute. This service is available from providers like Google Cloud Platform, Amazon Web Service, and Microsoft Azure. In PaaS (also available from the major cloud providers), you create your own offering using capabilities and a software design environment provided by the cloud vendor that makes subsequent scaling and distribution really easy because the service was “born in the cloud”.  Lastly, there’s SaaS, where the cloud is used to access and manage functionality and data without requiring users to set up or manage any of the underlying infrastructure used to provide it.  SaaS companies like Workday and Salesforce deliver their value in this manner.  The Cadence Cloud portfolio makes use of both IaaS and SaaS, depending on the customers’ interest.  Cadence doesn’t have PaaS offerings because our customers don’t create their own EDA software from building blocks that Cadence provides.

All of these designations are great, but you’re a semiconductor designer. Presumably you use Workday or some similar software, or have in the past when you were an intern, but what about all of your tools? Those aren’t on the cloud.

Wait—actually, they are.

Using EDA tools in the cloud allows you to address complexity and data explosion issues you would have to simply struggle through before. Since you don’t have to worry about having the compute-power on-site, you can use way more power than you could before. You may be wary about this new generation of cloud-based tools, but don’t worry: the old rules of cloud computing no longer apply. Cloud capacity is far larger than it used to be, and it’s more secure. Updates to scheduling software means that resource competition isn’t as big of a deal anymore. Clouds today have nearly unlimited capacity—they’re so large that you don’t ever need to worry about running out of space.

The vast increase in raw compute available to designers through the cloud makes something like automotive functional safety verification, previously an extremely long verification task, doable in a reasonable time frame. With the cloud, it’s easy to scale the amount of compute you’re using to fit your task—whether it’s an automotive functional safety-related design or a small one.

Nowadays, the Cadence Cloud Portfolio brings you the best and brightest in cloud technology. No matter what your use case is, the Cadence Cloud Portfolio has a solution that works for you. You can even access the Palladium Cloud, allowing you to try out the benefits of an accelerator without having to buy one.

Cloud computing is the future of EDA. See the future here.

With ECAD-MCAD Library Creator, you can easily create footprints for your parts using thousands of ready-to-use templates that are provided with the tool.(read more)

In my previous blog, I talked about creating a footprint using an existing template in Allegro ECAD-MCAD Library Creator and explained how easily you can access an existing template and create a package from it by just clicking a button. In this blog...(read more)

The IEEE has announced the publication of the new 1801-2013 standard, also known as UPF 2.1, and immediate availability for free download through the IEEE 1801-2013 Get Program. Even though the standard is new to the whole world, for the people of the IEEE working group this standard is finally done and is in the past now.

There is a Chinese saying "好事多磨" which means "good things take time to happen." I forgot the exact time when I first joined the working group for the new standard -- about two and half years ago -- but I do remember long hours of meetings and many "lively" debates and discussions. Since the "hard time" has passed us, I would like to share some fun facts about the working group and the standard.

• The 1801 working group is the largest entity based ballot group in IEEE-SA history.
• The new standard was initially planned for 2012, but was delayed purely due to the large amount of work required.
• At one point, the group was debating on whether the new standard should be called UPF 2.1 or 3.0. It may sound weird now but we spent quite some time discussing this. Eventually we settled on 2.1 as it was the original plan.
• The 1801-2013 document has 358 pages which is 53% thicker than previous version (the sheer amount of changes in the new standard indicate that this is more than just a normal incremental update of the previous version as suggested by naming it 2.1)
• Around 300 real issues were reported over the previous version and a majority of them were fixed in the new release.
• This is the first release with constructs and semantics coming from Common Power Format (CPF), a sign of convergence of the two industry leading power formats.
• There are about 100 working group meetings in my Outlook calendar since 2011, with meeting times ranging from 2 hours to 8 hours.
• We extensively used Google Drive (which was called Google Docs when the working group started), a great tool for productivity. I cannot imagine how any standard could have been done before Google existed!

Personally, I had an enjoyable journey, especially from having the privilege to work with many industry experts who are all passionate about low power. I do have one more thing to share though. My older daughter went from middle school to high school during the period of the development of the new standard. Since most of the meetings took place in the early morning California time, she had to endure the pain of listening to all these discussions on power domain, power switches, etc. on her way to school.

I asked her if she learned anything. She told me that other than being able to recognize the voices of Erich, John and Joe on the line, she also learned that she would never want to become an electrical or computer engineer! She was so happy that the meetings stopped a couple of months ago. But what I did not tell her is that the meetings will resume after DAC! Well, I am sure this will be a big motivation for her to get her own driving license in the summer.

If you want to get some quick technical insights into the new standard, check out my recent EE Times article IEEE 1801-2013: A bold step towards power format convergence.

Qi Wang