The 2013 Hope of Israel team shows motivation and unity during a month of intense ministry.

In the 1980s, two babies were named after OM’s second ship. Both young men are now living out the ethos of the ministry, as servants of Christ.

A team in Hong Kong reach out to Indonesian domestic workers with Christ's love

An OM Arts student shares how picking up trash led to sharing the gospel in Israel.

A pair of multidisciplinary faculty members at Penn State Shenango received an Advancing Equity and Inclusion Grant from the Schreyer Institute for Teaching Excellence to help fund a series of four online workshops focused on project-based learning. 

The College Board's plan to score students' 'level of disadvantage' based on their schools and neighborhoods has some college counselors asking: Will wealthy parents try to game the system?

On Sept. 27-28, Penn State Schuylkill hosted the 84th annual Pennsylvania Communication Association (PCA) conference for the first time, welcoming over 80 participants from more than 40 colleges. Valerie Schrader, professor of communication arts and PCA president, organized the event, with Penn State Schuylkill faculty and students presenting 17 projects. Several students and faculty received top paper and presentation awards.

U.S. Rep. Glenn “GT” Thompson, chairman of the House Agriculture Committee, was honored with the 2024 Leadership Award presented by the Penn State Ag Council at its fall meeting in State College. Also recognized were members of the Pennsylvania in the Balance initiative and undergraduate student Jessica Herr.

Lindsay Mitchell, a Penn State World Campus graduate who earned a bachelor's degree in accounting in May, is one of Pennsylvania’s newest auditors after securing a position through an intern-to-hire program. World Campus offers the undergraduate accounting program in partnership with the Penn State Harrisburg School of Business Administration.

Penn State Lehigh Valley criminal justice program adjunct instructor Corallys Fernandez's work in the juvenile probation field was recently recognized on a state level.

Kuei-Nuan Lin, associate professor of mathematics at Penn State Greater Allegheny, has been awarded the 2025 Association for Women in Mathematics (AWM) Service Award for her exceptional leadership in advancing women in mathematics. Her contributions, including leading the AWM Mentor Network Program and serving in various committee roles, highlight her dedication to supporting women in the field.

As part of its steadfast commitment to delivering behavioral health services that are greatly needed in central Pennsylvania, Penn State Health will relocate Pennsylvania Psychiatric Institute’s inpatient services to Holy Spirit Medical Center at the end of its lease in September 2026.

A $6.5 million state grant has positioned Penn State Behrend to begin construction of the Center for Manufacturing Competitiveness, an industry-facing research facility and the centerpiece of the college's Project RESOLVE.

AP has managed to dodge the partisan pitfalls that have felled other ambitious curricular efforts—so far, write Chester E. Finn Jr. and Andrew E. Scanlan.

Penn State campuses across Pennsylvania were sites of celebration and recognition May 3-5 as the University awarded more than 14,000 degrees during 2024 spring commencement ceremonies held statewide. Revisit the excitement of commencement with this gallery of photos from Penn State's Commonwealth Campuses.

OM France marks OM’s 60th anniversary, inviting International Director, Lawrence Tong, to grace this special occasion.

The Department of Education has denied 99 percent of applications for public service loan forgiveness under a temporary expanded program funded by Congress, a report finds.

The Penn State Board of Trustees Committee on Finance and Investment advanced a proposal for the construction of an Academic Learning Center at Penn State Harrisburg.

The Penn State Board of Trustees Committee on Finance and Investment advanced a proposal on Nov. 7 for renovations and additions to Sackett Building, which borders the southwest edge of Pattee Mall on the University Park campus. 

The Penn State Board of Trustees’ Finance and Investment Committee advanced a plan on Nov. 7 to construct a new classroom building at the University Park campus.  

Leader of OM Germany serves in the kitchen during TeenStreet, OM’s annual week-long international youth congress that started on Saturday.

General Assembly sent key bill to the Governor The Delaware General Assembly passed legislation to increase Delawareans’ access to high quality, affordable health care through a series of reforms that will refocus Delaware’s healthcare system on primary care and improvements in value. Senate Substitute 1 for Senate Bill 120 requires commercial health insurance companies to […]

Free one-on-one counseling and information available to residents; Bureau earns federal grant The Delaware Medicare Assistance Bureau (DMAB), a division of the Delaware Department of Insurance, is encouraging residents to get ready for Medicare Open Enrollment. DMAB, which provides free, one-on-one Medicare counseling, offers a myriad of virtual appointment options for residents, as well as […]

As the October 15 to December 7 Medicare Open Enrollment quickly approaches, the Delaware Department of Insurance and its Medicare Assistance Bureau (DMAB) are sharing their annual consumer information announcement.

This article will discuss why B2B digital marketing is advantageous over traditional marketing and why it is becoming rapidly crucial for businesses to make the switch

The cast of The Fabulous Lives of Bollywood Wives recently had a mini-reunion at Gauri Khan's restaurant, Torii, in Mumbai.

Sitting at the dining table with a hearty plateful in front of her, Avantika looked blissful as Bhagyashree fed her dal chawal with her hands.

Moments into his victory speech on Tuesday, Trump lauded his running mate JD Vance and his Indian-American wife, Usha Chilukuri Vance.

In observance of Black History Month, The Delaware Heritage Commission is proud to present our Book of the Week: African American Education in Delaware: A History Through Photographs 1865-1930 – by Dr. Bradley Skelcher.   You can view a PDF version of this book here.   SYNOPSIS: At the beginning of the twentieth century, it […]

A Pennsylvania man has been sentenced to more than a decade in prison for violent assault and robbery. On August 25, 2023, Zykeem Fields, 23, was sentenced to 15 years in prison, followed by probation, by a Superior Court judge. Fields, who lived part-time in Wilmington, pleaded guilty to felony charges of Assault 1st Degree and Robbery 1st Degree following a brutal attack in 2022.   On September 28, 2022, Fields followed […]

PHILADEPHIA — The Attorneys General of Delaware, New Jersey, and Pennsylvania reiterated their support for common sense gun safety laws today as attorneys for the States of Delaware and New Jersey delivered oral arguments defending landmark gun safety legislation. In Delaware State Sportsmen’s Association v. Delaware Department of Safety & Homeland Security, currently before the […]

WILMINGTON, Del —The Office of Women’s Advancement & Advocacy, a Division of the Delaware Department of Human Resources, in partnership with the Delaware Departments of Labor and Education, released a new report titled- Delaware Women in the Construction Trades: A Path to Economic Security. The report examines the current state of women working in the […]

The Tree for Every Delawarean Initiative (TEDI) is making significant progress toward the goal of planting 1 million trees by 2030. The initiative has awarded funding to seven new projects, which will push the total count beyond 200,000 trees this year.

By a joint resolution approved by Congress on 12/18/2001, (Public Law 107-89) September 11th of each year has been designated as “Patriot Day”. This law also directs flags be lowered to half-staff on September 11th. In concurrence with this joint resolution, Governor Carney has ordered the U. S. and Delaware flags be flown at half-staff […]

By a joint resolution approved by Congress on 12/18/2001, (Public Law 107-89) September 11th of each year has been designated as “Patriot Day.” This law also directs flags be lowered to half-staff on September 11th. In concurrence with this joint resolution, Governor Carney has ordered the U. S. and Delaware flags be flown at half-staff […]

Delaware state agencies today officially moved to connect the Donovan Smith community in Lewes to municipal water and sewer, which is the pilot project of the Clean Water Initiative for Underserved Communities established by Gov. John Carney.

DOVER, DE (Aug. 8, 2022) — The Delaware Division of Public Health’s (DPH) Physical Activity, Nutrition, and Obesity Prevention Program (PANO) is seeking mini-grant applications as part of the Advancing Healthy Lifestyles (AHL) initiative to improve community health and reduce chronic health conditions.   PANO expects to award five to eight mini-grants ranging from $5,000 to $15,000 in September.  All applications are due no later than August 17. The project period will run from October 2022 to May […]

Focusing on the theme of ‘Improving Health Through Equity,’ this first-of-its-kind, in-person event offered participants opportunities to learn from national, regional and local leaders in achieving health equity. Participants also exchanged ideas and shared best practices to help end disparities throughout the state and empower healthier living for all Delawareans.

For beginners, how marketers can learn to create advanced data models from time series data

Division of Civil Rights and Public Trust worked with UD Police Department  A University of Delaware student, who has since been banned from campus, now faces three misdemeanor charges, including Hate Crime, after vandalizing a Holocaust memorial sponsored by a Jewish student group and going on an antisemitic tirade. On the evening of May 8, […]

WILMINGTON, Del. – Today, the Office of Women’s Advancement & Advocacy and the Delaware Women’s Commission announced four exceptional women that were selected as honorees for the 2024 She’s on Her Way Award. With over 40 applications received by the committee, four nominees were chosen for their incredible work in Delaware. This year’s inductees include: […]

Olympic athlete Jackie Joyner-Kersee delivered a motivational keynote address DOVER, Del. (June 6, 2024) – The Delaware Division of Public Health’s (DPH) Physical Activity, Nutrition, and Obesity Prevention (PANO) Program hosted its second annual Advancing Healthy Lifestyles Conference today. At Delaware State University’s (DSU) Martin Luther King Jr. Conference Center, approximately 300 participants came together […]

As Delaware’s Secretary of Education, I’m pleased to share the progress that Delaware students have made in Advanced Placement (AP) programs. This year, our state has seen significant growth in both AP participation and performance, reflecting our commitment to providing every student with access to challenging academic opportunities.

I am gratified to see the continuing adoption of Forecast Value Added by organizations worldwide. FVA is an easy to understand and easy to apply approach for identifying bad practices in your forecasting process. And I'm particularly gratified to see coverage of FVA in two new books, which the authors [...]

The post Vandeput's Data Science for Supply Chain Forecasting (book excerpt) appeared first on The Business Forecasting Deal.

Atlas Biomed's website is no longer active and the phone number listed is dead as well.

A man recently took to Reddit, seeking help identifying an unknown Devanagari text he found at a flea market in Germany.

In the rapidly evolving landscape of automotive electronics, traditional monolithic design approaches are giving way to something more flexible and powerful—chiplets. These modular microchips, which are themselves parts of a whole silicon system, offer unparalleled potential for improving system performance, reducing manufacturing costs, and accelerating time-to-market in the automotive sector. However, the transition to working with chiplets in automotive electronics is not without its challenges.

Designers must now grapple with a new set of considerations, such as die-to-die interconnect standards, complex processes, and the integration of diverse IPs. Advanced toolsets and standardized design approaches are required to meet these challenges head-on and elevate the potential of chiplets in automotive innovation. In the following discourse, we will explore in detail the significance of chiplets in the context of automotive electronics, the obstacles designers face when working with this paradigm, and how Cadence comprehensive suite of IPs, tools, and flows is pioneering solutions to streamline the chiplet design process.

Unveiling Chiplets in Automotive Electronics

For automotive electronics, chiplets offer a methodology to modularize complex functionalities, integrate different chiplets into a package, and significantly enhance scalability and manufacturability. By breaking down semiconductor designs into a collection of chiplets, each fulfilling specific functions, automotive manufacturers can mix and match chiplets to rapidly prototype new designs, update existing ones, and specialize for the myriad of use cases found in vehicles today.

The increasing significance of chiplets in automotive electronics comes as a response to several industry-impacting phenomena. The most obvious among these is the physical restriction of Moore's Law, as large die sizes lead to poor yields and escalating production costs. Chiplets with localized process specialization can offer superior functionality at a more digestible cost, maintaining a growth trajectory where monolithic designs cannot. Furthermore, chiplets support the assembly of disparate technologies onto a single subsystem, providing a comprehensive yet adaptive solution to the diverse demands present in modern vehicles, such as central computing units, advanced driver-assistance systems (ADAS), infotainment units, and in-vehicle networks. This chiplet-based approach to functional integration in automotive electronics necessitates intricate design, optimization, and validation strategies across multiple domains.

The Complexity Within Chiplets

Yet, with the promise of chiplets comes a series of intricate design challenges. Chiplets necessitate working across multiple substrates and technologies, rendering the once-familiar 2-dimensional design space into the complex reality of multi-layered, sometimes even three-dimensional domains. The intricacies embedded within this design modality mandate devoting considerable attention to partitioning trade-offs, signal integrity across multiple substrates, thermal behavior of stacked dies, and the emergence of new assembly design kits to complement process design kits (PDKs).

To effectively address these complexities, designers must wield sophisticated tools that facilitate co-design, co-analysis, and the creation of a robust virtual platform for architectural exploration. Standardizations like the Universal Chip Interconnect Express (UCIe) have been influential, providing a die-to-die interconnect foundation for chiplets that is both standardized and automotive-ready. The availability of UCIe PHY and controller IP from Cadence and other leading developers further eases the integration of chiplets in automotive designs.

The Role of Foundries and Packaging in Chiplets

Foundries have also pivoted their services to become a vital part of the chiplet process, providing specialized design kits that cater to the unique requirements of chiplets. In tandem, packaging has morphed from being a mere logistical afterthought to a value-added aspect of chiplets. Organizations now look to packaging to deliver enhanced performance, reduced power consumption, and the integrity required by the diverse range of technologies encompassed in a single chip or package. This shift requires advanced multiscale design and analysis strategies that resonate across a spectrum of design domains.

Tooling Up for Chiplets with Cadence

Cadence exemplifies the rise of comprehensive tooling and workflows to facilitate chiplet-based automotive electronics design. Their integrations address the challenges that chiplet-based SoCs present, ensuring a seamless design process from the initial concept to production. The Cadence suite of tools is tailored to work across design domains, ensuring coherence and efficiency at every step of the chiplet integration process.

For instance, Cadence Virtuoso RF subflows have become critical in navigating radio frequency (RF) challenges within the chiplets, while tools such as the Integrity 3D-IC Platform and the Allegro Advanced Multi-Die Package Design Solution have surfaced to enable comprehensive multi-die package designs. The Integrity Signal Planner extends its capabilities into the chiplet ecosystem, providing a centralized platform where system-wide signal integrity can be proactively managed. Sigrity and Celsius, on the other hand, offer universally applicable solutions that take on the challenges of chiplets in signal integrity and thermal considerations, irrespective of the design domain. Each of these integrated analysis solutions underscores the intricate symphony between technology, design, and packaging essential in unlocking the potential of chiplets for automotive electronics.

Cadence portfolio includes solutions for system analysis, optimization, and signoff to complement these domain-specific tools, ensuring that the challenges of chiplet designs don't halt progress toward innovative automotive electronics. Cadence enables designers to engage in power- and thermal-aware design practices through their toolset, a necessity as automotive systems become increasingly sophisticated and power-efficient.

A Standardized Approach to Success with Chiplets

Cadence’s support for UCIe underscores the criticality of standardized approaches for heterogeneous integration by conforming to UCIe standards, which numerous industry stakeholders back. By co-chairing the UCIe Automotive working group, Cadence ensures that automotive designs have a universal and standardized Die-to-Die (D2D) high-speed interface through which chiplets can intercommunicate, unleashing the true potential of modular design.

Furthermore, Cadence champions the utilization of virtual platforms by providing transaction-level models (TLMs) for their UCIe D2D IP to simulate the interaction between chiplets at a higher level of abstraction. Moreover, individual chiplets can be simulated within a chiplet-based SoC context leveraging virtual platforms. Utilizing UVM or SCE-MI methodologies, TLMs, and virtual platforms serve as first lines of defense in identifying and addressing issues early in the design process before physical silicon even enters the picture.

Navigating With the Right Tools

The road to chiplet-driven automotive electronics is one paved with complexity, but with a commitment to standards, it is a path that promises significant rewards. By leveraging Cadence UCIe Design and Verification IP, tools, and methodologies, automotive designers are empowered to chart a course toward chiplets and help to establish a chiplet ecosystem. With challenges ranging from die-to-die interconnect to standardization, heterogeneous integration, and advanced packaging, the need for a seamless integrated flow and highly automated design approaches has never been more apparent. Companies like Cadence are tackling these challenges, providing the key technology for automotive designers seeking to utilize chiplets for the next-generation E/E architecture of vehicular technology.

In summary, chiplets have the potential to revolutionize the automotive electronics industry, breathing new life into the way vehicles are designed, manufactured, and operated. By understanding the significance of chiplets and addressing the challenges they present, automotive electronics is poised for a paradigm shift—one that combines the art of human ingenuity with the power of modular and scalable microchips to shape a future that is not only efficient but truly intelligent.

Learn more about how Cadence can help to enable automakers and OEMs with various aspects of automotive design.

Cadence tapes out 32G UCIe interface IP for high speed, highly efficient chiplet designs and demonstrate high data rate performance in TSMC's 3nm technology(read more)

As vehicles transition into interconnected ecosystems, artificial intelligence and advanced technologies become increasingly crucial. Infotainment systems have evolved beyond mere music players to become central hubs for connectivity, entertainment, and navigation. With global demand for comfort, convenience, and safety rising, the automotive infotainment market is experiencing significant growth. Valued at USD14.99 billion in 2023, it is projected to grow at a compound annual growth rate (CAGR) of 9.9% from 2024 to 2030.

To keep pace with this evolution, infotainment systems must accommodate a range of workloads, including audio, voice, AI, and vision technologies. This requires a flexible, scalable Digital Signal Processor (DSP) solution that acts as an offload engine for the main application processor. Integrating a single DSP for varied functions offers a cost-effective solution for high-performance, low-power processing, which aligns well with the needs of Electric Vehicles (EVs).

If you missed the detailed presentation by Casey Ng, Product Marketing Director at Cadence at CadenceLIVE 2024, register at the CadenceLIVE On-Demand site to access it and other insightful presentations. Stay ahead of the curve and explore the future of innovative electronics with us.

Cadence Infotainment Solution: Leading the Charge

Cadence Tensilica HiFi DSPs play a crucial role in enhancing audio capabilities in vehicle infotainment systems. They support applications like voice recognition, hands-free calling, and deliver immersive audio experiences. This technology is also paramount for features such as active noise control, which reduces road and cabin noise, and acoustic event detection for identifying unusual sounds like broken glass. One notable innovation is the "audio bubble," enabling personalized audio zones within the vehicle, ensuring passengers enjoy distinct audio settings.

Cadence HiFi DSP technology enriches the driving experience for electric vehicles by mimicking traditional engine sounds, while its advanced audio processing ensures optimal performance across various digital radio standards. It significantly contributes to noise reduction, hence improving the cabin experience. Integrating a Double Precision Floating Point Unit (FPU) stands out, as it upgrades audio performance and Signal-to-Noise Ratio (SNR) through efficient 64-bit processing, allowing control over numerous speakers without hitches.

These advancements distinguish the DSP as an essential tool in evolving infotainment systems, offering unmatched performance and adaptability. Tensilica HiFi processors, crucial to advanced infotainment SoCs, serve as efficient offload processors, augmenting real-time execution and energy efficiency. Cadence’s ecosystem, with over 200 codecs and software partnerships, propels the evolution of innovative infotainment systems. Introducing the HiFi 5s DSP marks a new era in connected car experiences, setting the stage for groundbreaking advancements.

Exploring Tomorrow with HiFi 5s DSP Technology

The HiFi 5s represents the apex of audio and AI digital signal processing performance. Built on the Xtensa LX8 platform, it introduces capabilities like auto-vectorization, which allows standard C code to be automatically optimized for performance. This synergy of hardware and software co-design marks a significant step forward in DSP technology. By leveraging its extended Single Instruction, Multiple Data (SIMD) capabilities alongside features like a double-precision floating-point unit (DP_FPU), the HiFi 5s delivers unparalleled precision and speed improvements in signal and audio processing tasks. Equally notable are its branch prediction and L2 cache enhancements, which optimize system performance by refining the control code execution and recognizing codec efficiency. The application of such enhancements are particularly beneficial in real-world scenarios.

AI-Powered Audio

Cadence's focus on AI integration with the HiFi 5s demonstrates significant improvements in audio clarity through AI-powered solutions.

• AI models learn from real-world data and adapt dynamically, while classic DSP algorithms rely on fixed rules.
• AI can be fine-tuned for specific scenarios, whereas classic DSP lacks flexibility.
• AI handles extreme and marginal noise patterns better, generalizes well across different environments, and is robust against varying noise characteristics.

Cadence's dedication to artificial intelligence marks a pivotal shift in audio processing. Traditional DSP algorithms, bound by rigid rules, are eclipsed by AI's ability to learn dynamically from real-world data. This adaptability equips AI models to tackle challenging noise patterns and offer unmatched clarity even in noisy environments, making them ideal for automotive and consumer audio applications.

Realtime AI-Optimized Speech Enhancements by OmniSpeech and ai|coustics

OmniSpeech

Our partner, OmniSpeech, has advanced AI-based audio processing that enhances the performance of audio software, specifically for omnidirectional and dipole microphones. Impressively, their technology operates with less than 32MHz and requires only 418kB of memory.

Test results show that background noise is significantly reduced when AI employs a single omnidirectional microphone, outperforming non-AI solutions. Additionally, when using a dipole microphone with AI, there is a 3.5X improvement in the weighted Signal-to-Noise Ratio (SNR) and more than a 28% increase in the Global Mean Opinion Score (GMOS) across various background noise.

ai|coustics

ai|coustics, a Cadence partner specializing in advanced audio technologies, utilizes real-time AI-optimized speech enhancement algorithms. They leverage an extensive speech-quality dataset containing thousands of hours and 100 languages to transform low-quality audio into studio-grade audio. Their process includes:

• De-reverb, which eliminates room resonances, echoes, and reflections

• Removing artifacts from downsampling and codec compression

• Dynamic and adaptive background noise removal

• Reviving audio materials with analog and digital distortions

• Providing support for all languages, accents, and a variety of speakers

Applications include:

• Automotive: Enhances clarity of navigation commands and communication for driver safety

• Consumer audio: Improves voice clarity for better dialogue understanding in TV programs. Optimizes speech intelligibility in communication for both uplink and downlink audio streams

• Smart IoT: Boosts voice command detection and response quality

Performance Enhancements

The advancements in branch prediction and L2 cache integration have significantly boosted performance metrics across various systems. With HiFi 5s, branch prediction increases codec efficiency by an average of 5%, reaching up to 16% in optimal conditions. L2 cache improvements have drastically enhanced system-level performance, evidenced by a 2.3X boost in EVS decoder efficiency. Adding MACs and imaging ISA in imaging use cases has led to substantial advancements. When comparing HiFi 5s to HiFi 5, imaging ISA performance improvements range with >60% average performance improvements.

The Crescendo of the Future

As Cadence continues to blaze trails in DSP technology, the HiFi 5s emerges as the quintessential solution for consumer and automotive audio use cases. With a robust framework for auto-vectorization, an unmatched double-precision FPU, AI-driven audio solutions, and comprehensive system enhancements, Cadence is orchestrating the next era of audio processing, where every note is clearer, every sound richer, and every experience more engaging. It is not just the future of audio—it's the future of how we experience the world around us.

 Discover how Cadence Automotive Solutions can transform your business today!

Starting SPB 23.1, Allegro Package Designer Plus (APD+) has been rebranded as Allegro X Advanced Package Designer (Allegro X APD).

The splash screen for Allegro X APD will appear as shown below, instead of showing APD+ 2023:

For the Windows Start menu in 23.1, it will display as Allegro X APD 2023 instead of APD+ 2023, as shown below

23.1 Start menu 

In the Product Choices window for 23.1, you will see Allegro X Advanced Package Designer in the place of Allegro Package Designer +, as shown below: 

23.1 product title