Software's assembly features and interoperability with 2D files

Customized valve and cylinder maker sees 420 percent increase in online transactions in the first three months

Leading assembly automation and testing company to standardize on SolidWorks Office Professional, securely manage design data with PDMWorks

T-slotted frame manufacturer responds to market demand for downloadable 3D models

Cometal builds on successful investment in COSMOS design analysis software

Software will foster supply chain efficiency through better customer, partner, supplier communication

Long-established firm designs new processing systems four times faster, and with 70 percent less rework than with its previous software

SOLIDWORKS Solution Partner develops lifelike, detailed 3D models of human body used in biomedical research, entertainment

More than 4,600 of the world's engineering experts witness astonishing new products

New product for intensive care units automates costly and time-consuming nursing work

Medical industry manufacturer reducing R&D costs, time to market, and scrap by up to 50 percent

World-Class Sports Car Manufacturer Reduces Number of Prototypes by Half for Newly Redesigned, Hand-crafted D8 GTO

Interactive 3D manuals increase customer appreciation and satisfaction

People who experience depression and concussions simultaneously have significantly worse symptoms for both conditions and disruptions to brain connectivity, according to a study by researchers at Penn State.

A hidden feature in iOS 18.1 will automatically reboot a locked iPhone when it is asleep but hasn't been unlocked for a while, presumably as a security measure.

An Apple supplier may have been tapped to build an Apple-designed smart home camera and future health-focused AirPods, according to analyst Ming-Chi Kuo.

Caitlin, an intern with OM, participates in African and communications orientation in South Africa before flying to Madagascar.

A 1948 Tucker repaired by students at Pennsylvania College of Technology earned honors at the recent Antique Automobile Club of America’s Eastern Division National Fall Meet in Hershey. The vehicle won the First Junior Award, meaning it was ranked the best among all cars judged for the first time in its class: limited production and prototype vehicles through 1998.

This is the first time Biden and Harris appeared together since Election Day. 

The Penn State DuBois Office of Student Engagement will welcome students and members of the public to Hiller Auditorium on Thursday, Oct. 3, to hear from leadership speaker Tom Krieglstein.

This week, SA Money Report focuses on the controversy around the appointment of Arrie Rautenbach as Absa CEO.

The Supreme Court is scheduled to pronounce its verdict on Wednesday on pleas seeking framing of guidelines on the demolition of properties in the country.

The Supreme Court is scheduled to pronounce its verdict on Wednesday on pleas seeking framing of guidelines on the demolition of properties in the country.

Stellar Blade is getting a Nier: Automata DLC on November 20, developer Shift Up has announced. The game will get special items from the world of Nier Automata and an in-game shop as part of the collaboration. The update will also add a photo mode, new outfits and more features.

Vedang Raina attended Khushi Kapoor's birthday party last week

Avneet Kaur will also be seen in a groundbreaking India-Vietnam collaboration film Love in Vietnam

In early October, Deepinder Goyal shared a post showing various moments from their day as delivery agents

While people make conscious efforts to keep PCOS symptoms at bay, a study suggests weight loss may be the answer to the condition.

The Delaware Department of Justice Investor Protection Unit is closely monitoring the extreme price volatility of certain stocks and cautioned investors about the risks associated with investing in publicly traded companies that are experiencing volatility. “It can be risky investing in stocks with extreme changes in price over a short period of time. Investors should […]

Corporal faces four charges, including felonies, after DSP notified DCRPT Attorney General Kathy Jennings announced Tuesday that the Division of Civil Rights & Public Trust has indicted a suspended State Trooper for orchestrating a fraudulent warning scheme that has victimized dozens of motorists, though the full scale of his misconduct is yet to be determined. Delaware State […]

La División de Salud Pública (DPH) están alentando fuertemente a los que asistieron al evento del rodeo que no estaba permitido en el Rancho El en Bridgeville el 6 de septiembre 2020 a que se hagan la prueba del coronavirus lo más pronto posible en un lugar que le sea conveniente.

Kent/Sussex Counties, DE – 911 Services are fully restored for AT&T subscribers. If you have an emergency, you can now call or text 911. If you experience any problems, please call the following administrative lines: Kent County 911 (302) 734-6050 Dover PD (302) 736-7111 Sussex County 911 (302) 855-2970 Rehoboth Beach PD (302) 227-2577

The Delaware Department of Elections is informing voters that automatically registered voters may declare their party at the State Primary Election, September 10, 2024. Delaware is a Closed Primary State, meaning that only voters affiliated with the Democratic or Republican parties may vote in their party’s Primary Election. Eligible Voters must vote at their assigned Polling Place, and Polling Places are open from 7 a.m. – 8 p.m. on Primary Election Day.

The Fire Prevention Commission was honored by a visit from Senator Carper on September 13, 2024.  This was an opportunity for the Fire Commission to celebrate Senator Carper and the years of support and dedication that he’s shared with first responders both nationally and in Delaware. Representing the Delaware Fire Service Center was the Fire […]

In our fast changing, increasingly digital world, building a strong customer relationship is the lynchpin to building a great business. The stakes are even higher now as global disruptions occur with alarming regularity—be it political unrest, economic meltdowns or a pandemic. A new, global study called Experience 2030: The Future [...]

4 tips for evolving your customer experience measurement was published on Customer Intelligence Blog.

No matter what your brand's level of marketing maturity is, SAS can help you move from data to insight to action with rich functionality for adaptive planning, journey activation and an embedded real-time decision engine – all fueled by powerful analytics and artificial intelligence (AI) capabilities. Let's begin with a [...]

SAS Customer Intelligence 360: Introduction to marketing data management was published on Customer Intelligence Blog.

Customer data platforms (CDPs), data management platforms (DMPs), people-based marketing, identity graphs, and more overlapping topics represent an important ingredient of any martech brainstorming session in 2020. As your brand spreads out across touchpoints — from web to mobile applications, as well as call centers, email and direct mail — [...]

SAS Customer Intelligence 360: Identity management, profiling and unified data model for hybrid marketing was published on Customer Intelligence Blog.

There's no question that we're all increasingly, and often exclusively, interacting with brands digitally. Consumers are now online through countless mechanisms – from laptops and mobile apps to AI-enabled voice assistants and sensor-based wearables. Engagement is diversifying in fascinating new ways. And when organizations can't see their customers interacting in [...]

SAS Customer Intelligence 360: Behavioral event tracking, targeting & engagement analysis was published on Customer Intelligence Blog.

Over the last 20+ years, global society has adopted digital devices at scale, and consumer interaction behaviors continually evolve and mature. As analysts, we're uniquely positioned to notice worldwide trends, country-specific nuances and localized market behaviors that can have significant impact on our brand's business goals. This global scope is [...]

SAS Customer Intelligence 360: Enriching analysis with device usage data was published on Customer Intelligence Blog.

One of the wonderful aspects about my client-facing role at SAS is the breadth of audiences that I get to work with. No matter where you fall on this list: Data engineer. Business or marketing analyst. Citizen data scientist. Data scientist. Statistician. Executive. One topic is certain: We all love [...]

SAS Customer Intelligence 360: Automated explanation and supervised segmentation was published on Customer Intelligence Blog.

According to the SAS Experience 2030 global study, by the year 2030 67% of in-person customer engagements (think sales assistance and information queries) will be completed by smart machines rather than humans. And while it may seem a bit ironic, the most personalized customer experiences could involve no people at [...]

SAS Customer Intelligence 360: Make better decisions with analytically driven marketing was published on Customer Intelligence Blog.

We live in the age of data. From global warming stats to customer behavior patterns, new technologies have made it easier to collect, store, access and analyze information. But our use of these technologies has also eroded our attention spans and fueled post-truth misunderstandings. To combat these trends, the question [...]

SAS Customer Intelligence 360: Visual analytics, sankey diagrams and customer journeys was published on Customer Intelligence Blog.

Everything happens somewhere, and much of our customer data includes location information. Websites include x, y coordinates in semi-structured click streams, and the mobile apps your prospects depend on frequently support device location to provide a personalized, targeted experience. As my SAS peer Robby Powell said: "Human brains are hardwired [...]

SAS Customer Intelligence 360: Data visualization, location analytics and geospatial insights was published on Customer Intelligence Blog.

Read the in depth Review of MSI MAG Z690 TOMAHAWK WIFI Motherboard PC Components. Know detailed info about MSI MAG Z690 TOMAHAWK WIFI Motherboard configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

Read the in depth Review of Tecno Phantom V Fold Mobile Phones. Know detailed info about Tecno Phantom V Fold configuration, design and performance quality along with pros & cons, Digit rating, verdict based on user opinions/feedback.

In SAS, range attribute maps enable you to specify the range of values that determine the colors used for graphical elements. There are various examples that use the GTL to define a range attribute map, but fewer examples that show how to use a range attribute map with PROC SGPLOT. [...]

The post Automate the creation of a range attribute map in SAS appeared first on The DO Loop.

In the rapidly evolving landscape of automotive electronics, traditional monolithic design approaches are giving way to something more flexible and powerful—chiplets. These modular microchips, which are themselves parts of a whole silicon system, offer unparalleled potential for improving system performance, reducing manufacturing costs, and accelerating time-to-market in the automotive sector. However, the transition to working with chiplets in automotive electronics is not without its challenges.

Designers must now grapple with a new set of considerations, such as die-to-die interconnect standards, complex processes, and the integration of diverse IPs. Advanced toolsets and standardized design approaches are required to meet these challenges head-on and elevate the potential of chiplets in automotive innovation. In the following discourse, we will explore in detail the significance of chiplets in the context of automotive electronics, the obstacles designers face when working with this paradigm, and how Cadence comprehensive suite of IPs, tools, and flows is pioneering solutions to streamline the chiplet design process.

Unveiling Chiplets in Automotive Electronics

For automotive electronics, chiplets offer a methodology to modularize complex functionalities, integrate different chiplets into a package, and significantly enhance scalability and manufacturability. By breaking down semiconductor designs into a collection of chiplets, each fulfilling specific functions, automotive manufacturers can mix and match chiplets to rapidly prototype new designs, update existing ones, and specialize for the myriad of use cases found in vehicles today.

The increasing significance of chiplets in automotive electronics comes as a response to several industry-impacting phenomena. The most obvious among these is the physical restriction of Moore's Law, as large die sizes lead to poor yields and escalating production costs. Chiplets with localized process specialization can offer superior functionality at a more digestible cost, maintaining a growth trajectory where monolithic designs cannot. Furthermore, chiplets support the assembly of disparate technologies onto a single subsystem, providing a comprehensive yet adaptive solution to the diverse demands present in modern vehicles, such as central computing units, advanced driver-assistance systems (ADAS), infotainment units, and in-vehicle networks. This chiplet-based approach to functional integration in automotive electronics necessitates intricate design, optimization, and validation strategies across multiple domains.

The Complexity Within Chiplets

Yet, with the promise of chiplets comes a series of intricate design challenges. Chiplets necessitate working across multiple substrates and technologies, rendering the once-familiar 2-dimensional design space into the complex reality of multi-layered, sometimes even three-dimensional domains. The intricacies embedded within this design modality mandate devoting considerable attention to partitioning trade-offs, signal integrity across multiple substrates, thermal behavior of stacked dies, and the emergence of new assembly design kits to complement process design kits (PDKs).

To effectively address these complexities, designers must wield sophisticated tools that facilitate co-design, co-analysis, and the creation of a robust virtual platform for architectural exploration. Standardizations like the Universal Chip Interconnect Express (UCIe) have been influential, providing a die-to-die interconnect foundation for chiplets that is both standardized and automotive-ready. The availability of UCIe PHY and controller IP from Cadence and other leading developers further eases the integration of chiplets in automotive designs.

The Role of Foundries and Packaging in Chiplets

Foundries have also pivoted their services to become a vital part of the chiplet process, providing specialized design kits that cater to the unique requirements of chiplets. In tandem, packaging has morphed from being a mere logistical afterthought to a value-added aspect of chiplets. Organizations now look to packaging to deliver enhanced performance, reduced power consumption, and the integrity required by the diverse range of technologies encompassed in a single chip or package. This shift requires advanced multiscale design and analysis strategies that resonate across a spectrum of design domains.

Tooling Up for Chiplets with Cadence

Cadence exemplifies the rise of comprehensive tooling and workflows to facilitate chiplet-based automotive electronics design. Their integrations address the challenges that chiplet-based SoCs present, ensuring a seamless design process from the initial concept to production. The Cadence suite of tools is tailored to work across design domains, ensuring coherence and efficiency at every step of the chiplet integration process.

For instance, Cadence Virtuoso RF subflows have become critical in navigating radio frequency (RF) challenges within the chiplets, while tools such as the Integrity 3D-IC Platform and the Allegro Advanced Multi-Die Package Design Solution have surfaced to enable comprehensive multi-die package designs. The Integrity Signal Planner extends its capabilities into the chiplet ecosystem, providing a centralized platform where system-wide signal integrity can be proactively managed. Sigrity and Celsius, on the other hand, offer universally applicable solutions that take on the challenges of chiplets in signal integrity and thermal considerations, irrespective of the design domain. Each of these integrated analysis solutions underscores the intricate symphony between technology, design, and packaging essential in unlocking the potential of chiplets for automotive electronics.

Cadence portfolio includes solutions for system analysis, optimization, and signoff to complement these domain-specific tools, ensuring that the challenges of chiplet designs don't halt progress toward innovative automotive electronics. Cadence enables designers to engage in power- and thermal-aware design practices through their toolset, a necessity as automotive systems become increasingly sophisticated and power-efficient.

A Standardized Approach to Success with Chiplets

Cadence’s support for UCIe underscores the criticality of standardized approaches for heterogeneous integration by conforming to UCIe standards, which numerous industry stakeholders back. By co-chairing the UCIe Automotive working group, Cadence ensures that automotive designs have a universal and standardized Die-to-Die (D2D) high-speed interface through which chiplets can intercommunicate, unleashing the true potential of modular design.

Furthermore, Cadence champions the utilization of virtual platforms by providing transaction-level models (TLMs) for their UCIe D2D IP to simulate the interaction between chiplets at a higher level of abstraction. Moreover, individual chiplets can be simulated within a chiplet-based SoC context leveraging virtual platforms. Utilizing UVM or SCE-MI methodologies, TLMs, and virtual platforms serve as first lines of defense in identifying and addressing issues early in the design process before physical silicon even enters the picture.

Navigating With the Right Tools

The road to chiplet-driven automotive electronics is one paved with complexity, but with a commitment to standards, it is a path that promises significant rewards. By leveraging Cadence UCIe Design and Verification IP, tools, and methodologies, automotive designers are empowered to chart a course toward chiplets and help to establish a chiplet ecosystem. With challenges ranging from die-to-die interconnect to standardization, heterogeneous integration, and advanced packaging, the need for a seamless integrated flow and highly automated design approaches has never been more apparent. Companies like Cadence are tackling these challenges, providing the key technology for automotive designers seeking to utilize chiplets for the next-generation E/E architecture of vehicular technology.

In summary, chiplets have the potential to revolutionize the automotive electronics industry, breathing new life into the way vehicles are designed, manufactured, and operated. By understanding the significance of chiplets and addressing the challenges they present, automotive electronics is poised for a paradigm shift—one that combines the art of human ingenuity with the power of modular and scalable microchips to shape a future that is not only efficient but truly intelligent.

Learn more about how Cadence can help to enable automakers and OEMs with various aspects of automotive design.

The automotive industry is currently on the cusp of a radical evolution, steering towards a future where cars are not just vehicles but sophisticated, software-defined vehicles (SDV). This shift is marked by an increased reliance on automation and a significant increase in the use of sensors to improve safety and reliability. However, the increasing number of sensors has led to higher compute demands and poses challenges in managing a wide variety of data. The traditional method of using separate processors to manage each sensor's data is becoming obsolete. The current trends necessitate a unified processing system that can deal with multimodal sensor data, utilizing traditional Digital Signal Processing (DSP) and AI-driven algorithms. This approach allows for more efficient and reliable sensor fusion, significantly enhancing vehicle perception. Developers often face difficulties adhering to stringent power, performance, area, and cost (PPAC) and timing constraints while designing automotive SoCs.

Cadence, with its groundbreaking products and AI-powered processors, is enabling designers and automotive manufacturers to meet the future sensor fusion demands within the automotive sector. At the recent CadenceLive Silicon Valley 2024, Amol Borkar, product marketing director at Cadence, showcased the company's dedication and forward-thinking solutions in a captivating presentation titled "Addressing Tomorrow’s Sensor Fusion Needs in Automotive Computing with Cadence." This blog aims to encapsulate the pivotal takeaways from the presentation. If you missed the chance to watch this presentation live, please click here to watch it.

Significant Trends in the Automotive Market – Industry Landscape

We are witnessing a revolution in automotive technology. Innovations like occupant and driver monitoring systems (OMS, DMS), 4D radar imaging, LiDAR technology, and 360-degree view are pushing the boundaries of what's possible, leading us into an era of remarkable autonomy levels—ranging from no feet or hands required to eventually no eyes needed on the road.

Sensor Fusion and Increasing Processing Demands—Sensor fusion effectively integrates data from different sensors to help vehicles understand their surroundings better. Its main benefit is in overcoming the limitations of individual sensors. For example, cameras provide detailed visual information but struggle in low-light or lousy weather. On the other hand, radar is excellent at detecting objects in these conditions but lacks the detail that cameras provide. By combining the data from multiple sensors, automotive computing can take advantage of their strengths while compensating for their weaknesses, resulting in a more reliable and robust system overall.

One thing to note is that the increased number of sensors produces various data types, leading to more pre-processing.

On-Device Processing—As the industry moves towards autonomy, there is an increasing need for on-device data processing instead of cloud computing to enable vehicles to make informed decisions. Embracing on-device processing is a significant advancement for facilitating real-time decisions and avoiding round-trip latency.

AI Adoption—AI has become integral to automotive applications, driving safety, efficiency, and user experience advancements. AI models offer superior performance and adaptability, making future-proofing a crucial consideration for automotive manufacturers. AI significantly enhances sensor fusion algorithms, offering scalability and adaptability beyond traditional rule-based approaches. Neural networks enable various fusion techniques, such as early fusion, late fusion, and mid-fusion, to optimize the integration and processing of sensor data.

Future Sensor Fusion Needs

Automotive architectures are continually evolving. With current trends and AI integration into radar and sensor fusion applications, SoCs should be modular, flexible, and programmable to meet market demands.

Heterogeneous Architecture- Today's vehicles are loaded with various sensors, each with a unique processing requirement. Running the application on the most suitable processor is essential to achieve the best PPA. To meet such requirements, modern automotive solutions require a heterogeneous compute approach, integrating domain-specific digital signal processors (DSPs), neural processing units (NPUs), central processing unit (CPU) clusters, graphics processing unit (GPU) clusters, and hardware accelerator blocks. A balanced heterogeneous architecture gives the best PPA solution.

Flexibility and Programmability- The industry has come a long way from using computer vision algorithms such as HOG (Histogram Oriented Gradient) to detect people and objects, HAR classifier to detect faces, etc., to CNN and LSTM-based AI to Transformer models and graphical neural networks (GNN). AI has evolved tremendously over the last ten years and continues to evolve. To keep up with the evolving rate of AI, SoC design must be flexible and programmable for updates if needed in the future.

Addressing the Sensor Fusion Needs with Cadence

Cadence offers a complete suite of hardware and software products to address the increasing compute requirements in automotive. The comprehensive portfolio of Tensilica products built on the robust 32-bit RISC architecture caters to various automotive CPU and AI needs. What makes them particularly appealing is their scalability, flexibility, and configurability, offering many options to meet diverse needs.

The Xtensa family of products offers high-quality, power-efficient CPUs. Tensilica family also includes AI processors like Neo NPUs for the best power, performance, and area (PPA) for AI inference on devices or more extensive applications. Cadence also offers domain-specific products for DSPs such as HIFI DSPs, specialized DSPs and accelerators for radar and vision-based processing, and a general-purpose family of products for floating point applications.

The ConnX family offers a wide range of DSPs, from compact and low-power to high-performance, optimized for radar, lidar, and communications applications in ADAS, autonomous driving, V2X, 5G/LTE/4G, wireless communications, drones, and robotics. Tensilica's ISO26262 certification ensures compliance with automotive safety standards, making it a trusted partner for advanced automotive solutions. The Cadence NeuroWeave Software Development Kit (SDK) provides customers with a uniform, scalable, and configurable ML interface and tooling that significantly improves time to market and better prepares them for a continuously evolving AI market. Cadence Tensilica offers an entire ecosystem of software frameworks and compilers for all programming styles.

Tensilica's comprehensive software stack supports programming for DSPs, NPUs, and accelerators using C++, OpenCL, Halide, and various neural network approaches. Middleware libraries facilitate applications such as SLAM, radar processing, and Eigen libraries, providing robust support for automotive software development.

Conclusion

Cadence’s Tensilica products offer a development toolchain and various IPs tailored for the automotive industry, covering audio, vision, radar, unified DSPs, and NPUs. With ISO certification and a robust partner ecosystem, Tensilica solutions are designed to meet the future needs of automotive computing, ensuring safety, efficiency, and innovation.

Learn More

• Cadence Automotive Solutions
• Cadence Automotive IP
• Sensor Fusion and ADAS in TSMC Automotive Processes
• Revolution on the Road: How Cadence is Driving the Future of Automotive Design!
• Taming Design Complexity in Chiplet-Based Automotive Electronics
• UCIe and Automotive Electronics: Pioneering the Chiplet Revolution

I am attempting to use dbGetNeighbor() function inside the dynamic display HUD so that the distance to the next metal on that layer could be viewed. Think of another line in this dynamic table here... 

My SKILL code is essentially the following:

procedure(getNearestNeighborOnMetal(cv)
let((direction tmpBoundingBox)
direction = internal_function()
tmpBoundingBox = dbCreateRect(geGetEditCellView() "tmp" list(hiGetCommandPoint() hiGetCommandPoint()))
car(dbGetNeighbor(geGetEditCellView() tmpBoundingBox direction))
)
)

this returns the distance to the closest metal based on some tests.

Next, I try to register this function to work in the Dynamic Display / Info Balloon world by executing odcRegisterCustomFunc() for each and every object type (I know, absurd, but trying to debug)

In the dynamic display menu, I toggle the "Custom SKILL Function" check in layoutXL, then hit apply, then OK.

After this I find I am unable to view the changes reflected in any info balloons or in the drawing HUD (above) for this wire. I have tried replacing my function with the sample "customFunc" from the odcRegisterCustomFunc() documentation and was still unable to produce any new output.

Any help diagnosing the use of this feature would be very much appreciated