The disclosed embodiments provide a battery pack for use with a portable electronic device. The battery pack includes a first set of cells with different capacities electrically coupled in a parallel configuration. Cells within the first set of cells may also have different thicknesses and/or dimensions. The first set of cells is arranged within the battery pack to facilitate efficient use of space within a portable electronic device. For example, the first set of cells may be arranged to accommodate components in the portable electronic device.

A battery pack, which can secure the strength of an outer case, minimize the thickness over the whole outer case and ensure a battery capacity of the battery pack, by forming a portion of a main wall of the outer case with a metal plate. The battery pack includes a core pack, a first case, and a second case. The first case has a periphery including a first resin molding part, and is configured to cover a first surface of the core pack. The second case has a periphery including a second molding part, and is configured to cover a second surface of the core pack. The first and second cases are connected with each other by a weld of the first and second molding parts.

In the present invention, there is provided a battery pack including first to fifth terminal portions sequentially arrayed at one side surface of a housing, wherein the first terminal portion formed on one end side of the one side surface is a positive electrode terminal, the fifth terminal portion formed on the other end side is a negative electrode terminal, the fourth terminal portion formed adjacently to the fifth terminal portion is an ID terminal, and the fourth terminal portion and the fifth terminal portion are proximate to each other; and a guide portion for guiding the loading and unloading of the battery pack into and from a battery mounting portion is formed substantially in the center of the one side surface in array with the terminal portions, and the third terminal portion arranged centrally is formed at a position deviated toward the one end side or the other end side.

Provided is a packaging material for electrochemical cells which has an identification mark that can be recognized from the outside and that is difficult to forge. The packaging material comprises a multilayer film which has a structure formed by laminating a base layer (11), an adhesive layer (13), a metal foil layer (12), an acid-modified polyolefin layer (14), and a heat-sealable layer (15) in this order, wherein the base layer (11) comprises both a oriented polyester film (11b) and a oriented nylon film (11e) with a printed layer (11c) provided on the surface of the oriented polyester film (11b) that faces the oriented nylon film (11e).

An envelope has a top face, a bottom face and an open lower edge. A plurality of gift items are in a generally rectangular configuration. The gift items have a top surface, a bottom surface, a first end, and a second end. The gift items have a length and a width each less that the length and the width of the envelope. A plurality of adhesive stripes are adapted to attach the plurality of gift items end to end. In this manner the gift items are held end to end when the gift items are folded in a corrugated fashion and placed within the envelope. The gift items may be removed by pulling them out from the open lower edge of the envelope.

A business form is provided which is particularly useful in shipping products where certain preprinted information can be provided and then individualized information is printed before the form is applied to a substrate. The form includes a face ply which has a pattern of adhesive applied to at least a portion of the inner face, and a release liner which includes a pattern of adhesive which exposes a portion of the release liner to direct adhesive contact to the face ply without intervening release coating to permanently adhere a part of the release liner to the face ply. The release liner has a surrounding protective border provided with release coating on the release face thereof and which is removed prior to application to the substrate, and a slip which remains with the form as applied to the substrate. The face ply includes lines of perforation defining a central portion. At least a part of the central portion is directly adhered by the adhesive to the slip without intervening release coating between the adhesive and the slip or the central portion. Individualized indicia, such as an address, may be printed on a label area of the top face of the central portion, while other individualized indicia, such as the content of a package, may be printed on the back face of the slip. Masking indicia is preferably provided on one of the inner face of the top ply or the release face of the release liner to inhibit viewing of the content indicia until the slip is removed from the package.

A business form is provided which is particularly useful in shipping products where certain preprinted information can be provided and then individualized information is printed before the form is applied to a substrate. The form includes a face ply which has a pattern of adhesive applied to at least a portion of the inner face, and a release liner which includes a pattern of adhesive which exposes a portion of the release liner to direct adhesive contact to the face ply without intervening release coating to permanently adhere a part of the release liner to the face ply. The release liner has a surrounding protective border provided with release coating on the release face thereof and which is removed prior to application to the substrate, and a slip which remains with the form as applied to the substrate. The face ply includes lines of perforation defining a central portion. At least a part of the central portion is directly adhered by the adhesive to the slip without intervening release coating between the adhesive and the slip or the central portion. Individualized indicia, such as an address, may be printed on a label area of the top face of the central portion, while other individualized indicia, such as the content of a package, may be printed on the back face of the slip. Masking indicia is preferably provided on one of the inner face of the top ply or the release face of the release liner to inhibit viewing of the content indicia until the slip is removed from the package.

A system and method may provide sets or packets of playing cards for forming part or all of a hand of playing cards. Each set or packet may be formed before starting to form another set or packet. Sets or packets may be formed in respective playing card receiving compartments. The playing cards may be withdrawn from a plurality of playing card receiving compartments of an intermediary playing card receiver in random or pseudo-random fashion, which may, or may not, be based at least in part on the selected payout or house odds and/or house advantage.

An update platform is described that collectively handles driver and firmware updates for hardware resources of a computing device based on dependencies associated with the updates. The update platform may instantiate representations of each individual hardware resource as abstractions through which detection, analysis, acquisition, deployment, installation, and tracking of updates is managed. Using the representations, the update platform discovers available updates, matches configuration packages for the updates to appropriate resources, and initiates installation of the configuration packages. The update platform is further configured to recognize dependencies associated with the configuration packages. When dependencies are detected, corresponding configuration packages are marked to reflect the dependencies and activation is suspended until the dependencies are satisfied. Upon satisfaction of the dependencies, the dependencies are cleared and the configuration packages are activated. Configuration packages that are not associated with dependencies may be installed and activated “normally” at any time.

A packaging and applicator device for applying a composition on the eyelashes and/or the eyebrows, that includes a container defining an inside space containing the composition and including a wiper member; and an applicator having a longitudinal axis and having an applicator member with a twisted-core brush carrying bristles, there being 5 to 55 bristles per turn, the diameter of the brush lying in the range 6/100 mm to 40/100 mm along at least a fraction of the applicator member, a plurality of bristles carried by this portion coming to within a distance of less than 1.5 mm from the inside surface of the container under the wiper member in a storage position or while the applicator is being withdrawn along the longitudinal axis of the container.

A package for two liquid personal care compositions, including an applicator, a first reservoir, and a second reservoir. The applicator is non-removably connected at and extends away from the first cavity. The first and second reservoirs each hold a quantity of a liquid composition therein. The first reservoir includes an open end sized for independent insertion and removal of the applicator therethrough. The first reservoir is removable and protectively encases the applicator. The second reservoir includes a closed end an opposing open end, through which a liquid composition can be dispensed.

A cosmetic packaging and applicator device that includes a container having an inside space and a wiper member; an applicator having a core and projecting elements, a portion of the inside periphery of the container under the wiper member occupying a total angular extent of at least 90° at less than 1.5 mm from the applicator member when in its storage position or while being extracted from the container, the applicator member having at least two locations that are spaced apart along the core longitudinal axis by more than 3 mm and at each of which the difference between the greatest transverse dimension of the applicator member at the location and a smallest inside dimension of the container at the level of the location is less than 3 mm; and a preferential passage for flowing the composition along the applicator member while it is being extracted from the container.

A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.

Systems and methods to operate a power supply. A power supply has an inductor and a capacitor coupled in a substantially series connection. The power supply has a first selectably conductive path that selectably couples a first power pack to the series reactive circuit and a second selectably conductive path that selectably couples the series reactive circuit to a substantially series combination of the first power pack and a second power pack. When the first power pack output voltage is above the threshold, the first selectably conductive path couples electrical current between the first power pack to the series reactive circuit. Otherwise, the second selectably conductive path couples electrical current between the series combination and the series reactive circuit. The controller further transfers charge from the second power pack to the first power pack.

An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.

A method of preparing soybean mixed powder comprising a soybean powder having properties wherein formation of agglomerate is small when the powder is added to water and then heated with stirring to dissolve the powder.

Atmosphere control members (ACMs) are used in various ways. In one aspect, at least one of the atmospheres in contact with the ACM is cause to flow over the surface of the ACM. In another aspect, the ACM is an internal ACM which does not form part of the exterior surface of a container. In another aspect, the ACM forms part of a reusable module. In another aspect, a plurality of sealed containers, each including an ACM, are stored in an outer container also including an ACM. FIGS. 3-5 illustrate a shipping container (11) comprising an internal ACM (3) having one surface which is exposed to the packaging atmosphere within the shipping container and an opposite surface which is part of a closed chamber (2) to which gases can be supplied in a controlled fashion.

An apparatus and method are provided, for alternatively producing either small or bulk packs of napkins from a stack of folded napkins produced by one folding machine, through use of a pack dispatching arrangement having an inlet, a small pack transfer station and a bulk pack transfer station, and configured for operation in a small pack mode for dispatching a stream of spaced apart small packs of folded sheets separated from the stack of folded sheets, and received at an inlet of the pack dispatching arrangement, to the small pack transfer station, and alternatively operable in a bulk pack mode for dispatching a stream of spaced apart bulk packs of folded sheets separated from the stack of folded sheets, and received at an inlet of the pack dispatching arrangement, to the bulk pack transfer station.

The stack package includes a first semiconductor package and a second semiconductor package. The first semiconductor package includes a first substrate having a first modulus and at least one semiconductor chip mounted on the first substrate. The second semiconductor package stacked on the first semiconductor package and includes a second substrate having a second modulus and at least one semiconductor chip mounted on the second substrate. The second modulus is less than the first modulus. Even in the event that the first semiconductor package is under severe warpage due to a temperature change, the flexible second substrate, which includes e.g., polyimide or poly ethylene terephthalate, of the second semiconductor package may be less sensitive to the temperature change, thereby improving reliability of the stack package.

A land grid array (LGA) package including a substrate having a plurality of lands formed on a first surface of the substrate, a semiconductor chip mounted on a second surface of the substrate, a connection portion connecting the semiconductor chip and the substrate, and a support layer formed on part of a surface of a first land.

An apparatus including a die including a dielectric material on a device side, an insulating layer surrounding a die area and embedding a thickness dimension of the die; and a carrier including a plurality of layers of conductive material disposed on the device side of the die, a first one of the layers of conductive materials being formed on the insulating layer and patterned into traces at least a portion of which are connected to respective contact points on the die. A method including disposing a die on a sacrificial substrate with a device side of the die opposite the sacrificial substrate; disposing a mold on the sacrificial substrate around; introducing an insulating material into a chase of the mold; removing the mold; forming a carrier on the insulating material adjacent a device side of a die; and separating the die and the carrier from the sacrificial substrate.

Disclosed herein is a single mask package apparatus on a device comprising a first substrate having a land disposed on a first surface, a stud disposed on the land and a protective layer disposed over the first surface of the first substrate and around the stud. The protective layer may optionally have a thickness of at least 3 μm. A PPI may be disposed over the protective layer and in electrical contact with the stud, with a first portion of the PPI extending laterally from the stud. An interconnect may be disposed on and in electrical contact with the first portion of the PPI, and a second substrate mounted on the interconnect. A molding compound may be disposed over the PPI and around the interconnect. The stud may be a substantially solid material having a cylindrical cross section and may optionally be wirebonded to the land.

A multi-chip package is provided. The multi-chip package includes a plurality of chips including at least one bad chip and at least one good chip that are stacked and a plurality of through electrodes each penetrating the chips. A logic circuit included in the at least one bad chip is isolated from each of the plurality of through electrodes.

Systems, manufactures, methods and/or techniques for a merged fiducial for chip packages are described. According to some embodiments, an integrated circuit package may include a package substrate having a first side and a second side, a plurality of conductive traces coupled to the first side and a plurality of balls disposed on the second side. The balls may be adapted to electrically connect the laminate package to a circuit board. The integrated circuit package may include a plurality of ball pads disposed on the second side, the ball pads being adapted to electrically connect the plurality of balls to the plurality of conductive traces. One or more of the ball pads may be uniquely shaped when compared to the rest of the plurality of ball pads, optionally, to serve as a fiducial to designate an A1 pin or ball of the laminate package.

A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby.

Embodiments of a method for fabricating stacked microelectronic packages are provided, as are embodiments of a stacked microelectronic package. In one embodiment, the method includes arranging microelectronic device panels in a panel stack. Each microelectronic device panel includes a plurality of microelectronic devices and a plurality of package edge conductors extending therefrom. Trenches are formed in the panel stack exposing the plurality of package edge conductors. An electrically-conductive material is deposited into the trenches and contacts the plurality of package edge conductors exposed therethrough. The panel stack is then separated into partially-completed stacked microelectronic packages. For at least one of the partially-completed stacked microelectronic packages, selected portions of the electrically-conductive material are removed to define a plurality of patterned sidewall conductors interconnecting the microelectronic devices included within the stacked microelectronic package.

There are provided a single package television tuning apparatus and a television receiver including the apparatus. The apparatus includes: a printed circuit board; a switching part installed on the printed circuit board and selecting one of a first radio frequency signal and a second radio frequency signal inputted; a tuner part installed on the printed circuit board and down-converting one of the first radio frequency signal and the second radio frequency signal, the one selected by the switching part; first and second input connectors receiving the first radio frequency signal and the second radio frequency signal; and a chassis supporting the first and second input connectors, covering the printed circuit board, the switching part, and the tuner part, and electrically connected to grounds of the switching part and the tuner part.

Aspects of a method and system for configuring a transformer embedded in a multi-layer integrated circuit package are provided. In this regard, a windings ratio of a transformer embedded in a multi-layer IC package bonded to an IC may be configured, via logic, circuitry, and/or code in the IC, based on signal levels at one or more terminals of the transformer. The transformer may comprise a plurality of inductive loops fabricated in transmission line media. The integrated circuit may be flip-chip bonded to the multi-layer package. The IC may comprise a signal strength indicator enabled to measure signal levels input to or output by the transformer. The windings ratio may be configured via one or more switches in the IC and/or in the multi-layer package. The IC and/or the multi-layer package may comprise ferromagnetic material which may improve magnetic coupling of the transformer.

In a reflow process, a plurality of solder bumps between a first workpiece and a second workpiece is melted. During a solidification stage of the plurality of solder bumps, the plurality of solder bumps is cooled at a first cooling rate. After the solidification stage is finished, the plurality of solder bumps is cooled at a second cooling rate lower than the first cooling rate.

A power package is provided comprising a packaged transistor and a driving unit connected to the transistor and adapted to drive the transistor. A control terminal of the transistor is connected to a middle terminal pin of the housing of the transistor and outer terminal pins of the housing are connected to the driving unit and to a voltage level, respectively, wherein the connections are crossing free.

An easy-open and reclosable package includes a pouch including a discrete laminate including a base strip, a panel section, and a die cut defining a die cut segment; a first and second anchor seal; the base strip including a sealing segment, backing segment, and intermediate layer including a pressure sensitive adhesive; and a product disposed in the pouch. The die cut segment is so arranged that when the package is opened, the sealing segment is partially removed from the base strip, the pressure sensitive adhesive is partially exposed, and the package can thereafter be reclosed by adhering any of the first side panel, second side panel, and panel section to the pressure sensitive adhesive. Methods of making the package, and a pouch, are also disclosed.

A sorbent container includes a plurality of sealed pockets connected in a strip. At least one of the pockets is a filled pocket containing a quantity of sorbent material. A pocket adjacent to the filled pocket is empty.

The present invention relates to the description of machine-assisted production assemblies and to the optimization thereof, said assemblies having, built therein, a patented device for folding into deep coated folds, thus making it possible to create paper packaging for fast food, said assemblies all comprising a folded element from a folded paper strip 31. Said machines are modular and all comprise, upstream, an assembly of modules 5, 6, and 7 that supply a folded paper strip 31 that is then converted in a specific finishing module 8 for making, from said lidded paper strip, a packaging for a sandwich or loose product such as fries or chicken pieces.

In the case of a package (1) for single-dose films (2) containing active substances, comprising an upper packaging material element (3) and a lower packaging material element (4) which are connected together by a peripheral seal area or respectively sealing seam (5) such that a cavity (6) for holding the film (2) is formed, said cavity being enclosed on all sides, wherein the upper packaging material element (3) and the lower packaging material element (4) each have at least one cut (7, 8) in the region of the seal area or respectively, the sealing seam (5), said cuts being congruent, andat least one cut (7, 8) is crossed by a folding or bending line (10), the folding or bending line (10) is formed in a weakened manner.

An inflatable structure may be formed from a single piece of flexible film using a provided method of manufacturing. The inflatable structure may include quilting seals which divide the inflatable chamber. The inflatable structure may also include an external valve opening extending through multiple layers of the flexible film. The external valve opening may further be partially defined by edge portions of the flexible film formed by folding the flexible film. The external valve opening may be configured to align with an opening in a container or an inflation aperture in a pouch so that the inflatable structure can be inflated while inside the container/pouch. A corresponding inflation device fills the inflatable structure with air and may do so without requiring heat sealing or contact between the inflatable structure and outlet of the inflation device. A hinged plate apparatus may assist in directing air into the external valve opening.

The present invention regards a package (1) for food products comprising a flexible container (2) having a first wall (5) and a second wall (6) opposite each other and peripherally sealed along at least the respective side edges (5a, 6a, 5b, 6b), a space (8) inside said walls containing, optionally in sterile conditions, a food product (73), and a gusset element (10) extended between the upper edges (5c, 6c) of said first wall (5) and of said second wall (6), said gusset element (10) defining a pocket (14) turned towards the interior of said flexible container (2), characterized in that it comprises an opening and closing device (3) housed in said pocket (14) and constrained to said flexible container (2), said opening and closing device (3) comprising a pourer body (15) associated with an opening and closing cap (16), and cutting means (42) suitable to perforate said flexible container (2) at the time of the first opening of said packaging (1). The invention also regards a method for packaging a food product, in particular in sterile conditions, in a package of the aforesaid type, a flexible container for a package of the aforesaid type as well as a method for producing such container.

A packaging device allowing for the distribution, storage and cooking of various food products, such as perishable or frozen food product(s). The packaging device includes a plurality of micro-perforations that may promote the extended shelf-life of the perishable food product and the maintenance of the quality of the perishable food product or be configured to maintain the integrity of a frozen food product. The packaging device also includes a venting system that allows the cooking of the perishable or frozen food products within the packaging device.

A method, network device and system for remote direct memory access (RDMA) over Converged Ethernet (RoCE) packet sequence acceleration are disclosed. The network device comprises one or more functionality components for communicating with a host system. The host system is configured for implementing a first set of functionalities of a network communication protocol, such as RoCE. The one or more functionality components are also operable to implement a second set of functionalities of the network communication protocol.

Systems and methods for controlling the output of a battery pack are disclosed. In one example, a battery pack contactor is opened in response to battery pack current. The system and method may reduce battery pack degradation and increase system flexibility.

A battery pack, and a method of controlling the battery pack are disclosed. The battery pack detects consumption current when a load is not turned on, and shuts off power when a load is turned off or in stand-by mode, thereby preventing consumption current of the load from flowing.

A disclosed battery protecting circuit includes a battery protecting IC powered by a voltage of a secondary battery; another battery protecting IC powered by a voltage of another secondary battery connected to the secondary battery in series; and a constant voltage output unit which receives a maximum voltage obtained by adding voltages of the secondary battery and the other secondary battery in series and outputs a constant voltage upon receipt of a control signal from an output terminal of the battery protecting IC or the other battery protecting IC.

Disclosed herein is a battery pack including a battery cell array including two or more battery cells, each of which has an electrode assembly of a cathode/separator/anode structure disposed in a battery case together with an electrolyte in a sealed state, arranged in a lateral direction, a protection circuit module (PCM) connected to an upper end of the battery cell array to control an operation of the battery pack, a pack case in which the battery cell array and the protection circuit module are disposed, and a plate-shaped reinforcing member mounted between the pack case and the battery cell array to increase mechanical strength of the pack case.

An apparatus for minimizing self-discharge of a smart battery pack is provided. During initial storage of the smart battery pack (100), prior to be being charged, a self-discharge protection circuit (110) disables smart battery circuitry (130). A minimal current drain is maintained while the smart battery circuitry (130) is disabled. Upon coupling of the smart battery pack (100) to a charger, the protections circuit (110) enables the smart battery circuitry (130). Battery packs having to be shipped with partially drained cells as part of shipping precaution requirements are no longer faced with the additional drainage problem previously caused by the smart battery circuitry (130) during storage.

A semiconductor device for battery control includes a CPU, a first bus coupled to the CPU, a second bus not coupled to the CPU, and a protective function circuit for protecting a battery from stress applied thereto. The semiconductor device also includes a non-volatile memory storing trimming data, a trimming circuit to perform trimming required to allow the protective function circuit to exert a protective function, and a bus control circuit capable of selectively coupling the first bus and the second bus to the non-volatile memory. The semiconductor device further includes a transfer logic circuit which causes, by making the bus control circuit select the second bus, a trimming data transfer path leading from the non-volatile memory to the trimming circuit to be formed and the trimming data stored in the non-volatile memory to be transferred to the trimming circuit without involving the CPU.

A battery pack and an electronic device are disclosed. The battery pack includes a battery for storing electric energy, and a non-contacting discharging unit for receiving the stored electric energy from the battery and for transferring the stored electric energy to a power receiving unit in a non-electrically contacting manner. The electronic device includes a main body and the battery pack. The main body includes a power receiving unit. The battery pack is for mounting to and supplying power to the main body.

A mobile power pack includes a cover over a guide track which includes first, second, third, and fourth turning points. A sliding block defines a sliding groove to receive a ball, and the slotted ball interacts with the guide track. An elastic element is connected to the sliding block. When a cable is pulled out, the sliding block slides from the first turning point to the second turning point. When the pull on the cable is released, the elastic element restores to cause the sliding block to move until the ball reaches the third turning point, to lock the cable in position. When the cable is pulled and released, the sliding block slides until the ball reaches the fourth turning point, allowing the cable to be retracted into the body of the power pack.

Disclosed is a packaging system (10) for containing and dispensing loose filled product units. An inverted tray (20) is sealed to a backer board (40) with a guide insert disposed there between defining an interior chamber that is also filled with product units. The guide insert may include a base flange (38), a pair of side flanges for funneling product units into the truncated area that defines a next dispensing position. A flexible bridge (34) includes at least one high point and a fence portion that can descend into the base flange upon application of sufficient pressure to the at least one high point. This allows a product unit to advance to a dispensing position such that product units can be dispensed one at a time through user manipulation of the flexible bridge.

An apparatus is provided for delivering single-dose packages sequentially from a substantially continuous strip having a first dispensing end and a second end. The strip includes a cover layer attached to a base layer to define a plurality of blisters therebetween that have one or more medications therein. The blisters are aligned in single file generally along the longitudinal axis between the first and second ends and/or otherwise arranged in single-dose packages adjacent one another, e.g., at least some of the single-dose packages including a plurality of blisters having different types of medications therein. A first single-dose package at the first dispensing end may be separable from a second adjacent single-dose package such that individual single-dose packages may be removed successively from the first dispensing end.

A double shoot coulter assembly for an agricultural implement includes a packer wheel. The packer wheel is disposed behind a soil engaging blade. The packer wheel is configured to press soil displaced by the soil engaging blade into trenches formed by the soil engaging blade and a disc blade. A centerline of the packer wheel extends adjacent to a soil displacing side of the soil engaging blade.

A light emitting device package is provided comprising a light emitting device including at least one light emitting diode and a body including a first lead frame on which the light emitting device is mounted and a second lead frame spaced apart from the first lead frame, wherein at least one of the first and second lead frames is extending to a bending region in a first direction by a predetermined length on the basis of an outer surface of the body and is bent in a second direction intersecting the first direction.